Endless Band Tool Patents (Class 451/296)
  • Patent number: 7025666
    Abstract: A belt sander includes a main frame, a drive roller, a driven roller, a sand belt, and a sand belt replacement apparatus. Thus, the user only needs to rotate the control handle to move the driven roller relative to the drive roller so as to change the distance between the drive roller and the driven roller so that the user can adjust the tension of the sand belt easily and rapidly, thereby facilitating the user adjusting the tension of the sand belt, and thereby facilitating the user mounting and replacing the sand belt.
    Type: Grant
    Filed: April 22, 2005
    Date of Patent: April 11, 2006
    Inventor: Tien-Wang Wang
  • Patent number: 7025660
    Abstract: A method and assembly for generating a hydrodynamic air bearing is described, wherein at least one rotor is rotated to force air through channels defined in a platen located adjacent to a linear belt and the forced air is directed to the linear belt. The method includes rotating at least one rotor with a motor such that the rotor forces air through channels defined in a platen, and the air is directed toward a linear belt. The assembly includes a housing in which a platen, rotors, and a bearing plate are located.
    Type: Grant
    Filed: August 15, 2003
    Date of Patent: April 11, 2006
    Assignee: Lam Research Corporation
    Inventors: Travis R. Taylor, Carsten Mehring
  • Patent number: 7025665
    Abstract: A wire saw and wafer stabilizing system are provided for holding wafer sections invariantly against vibration and unwanted movement during the sawing process. A stabilizing means is applied to the ends of partially defined wafer sections at an early stage when the wafer sections are partially cut through a silicon ingot or block of silicon material. The stabilizing means serves to stabilize the wafer sections immovably against vibration, oscillation, or unwanted contact during the subsequent sawing process. The stabilizing system also accelerates handling of the wafers after slicing is completed, facilitates the cleaning process, and allows for more rapid or automated placement of the wafers in cassettes. Wafers produced by the stabilizing system are characterized by a minimized total thickness variation, substantially uniform planarity, and substantially without bow or warp.
    Type: Grant
    Filed: March 24, 2005
    Date of Patent: April 11, 2006
    Assignee: Solaicx, Inc.
    Inventor: David L. Bender
  • Patent number: 6997790
    Abstract: An improved method of manufacturing automotive accessory drive belts or other workpieces of pliant material which have a grooved operative face, a tool having an abrasive ramp configuration for performing said improved method and a method of manufacturing said tool with the abrasive ramp configuration.
    Type: Grant
    Filed: August 6, 2003
    Date of Patent: February 14, 2006
    Inventor: Charles E. Neff
  • Patent number: 6991517
    Abstract: A polishing article for chemical mechanical polishing. The polishing article includes a generally elongated polishing sheet with a polishing surface. The polishing article is formed from a material that is substantially opaque, and has a discrete region extending substantially the length of the polishing sheet that is at least semi-transparent.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: January 31, 2006
    Assignee: Applied Materials Inc.
    Inventors: Fred C. Redeker, Manoocher Birang, Shijian Li, Sasson Somekh
  • Patent number: 6988934
    Abstract: An apparatus for use in a chemical mechanical planarization (CMP) system is provided. The apparatus includes a platen capable of introducing fluid beneath a polishing pad and a platen support cover configured to surround the platen. The platen is disposed at a first level and the platen support cover is disposed at a second level, the first level being lower relative to the second level. Both the platen and the platen support cover are configured to be disposed below the polishing pad such that the polishing pad is closer to the second level than the first level. The platen support cover has a width at the second level that is substantially equal around the platen. An apparatus and method for controlling pressure beneath a polishing pad is also provided.
    Type: Grant
    Filed: September 29, 2003
    Date of Patent: January 24, 2006
    Assignee: Lam Research Corporation
    Inventors: Gregory C. Lee, Simon McClatchie, John M. Boyd
  • Patent number: 6986700
    Abstract: Planarizing machines, planarizing pads, and methods for planarizing or endpointing mechanical and/or chemical-mechanical planarization of microelectronic substrates. One particular embodiment is a planarizing machine that controls the movement of a planarizing pad along a pad travel path to provide optical analysis of a substrate assembly during a planarizing cycle. The planarizing machine can include a table having an optical opening at an illumination site in a planarizing zone and a light source aligned with the illumination site to direct a light beam through the optical opening in the table. The planarizing machine can further include a planarizing pad and a pad advancing mechanism. The planarizing pad has a planarizing medium and at least one optically transmissive window along the pad travel path. The pad advancing mechanism has an actuator system coupled to the pad and a position monitor coupled to the actuator system.
    Type: Grant
    Filed: July 21, 2003
    Date of Patent: January 17, 2006
    Assignee: Micron Technology, Inc.
    Inventor: Vishnu K. Agarwal
  • Patent number: 6969299
    Abstract: An automatic razor blade sharpener simultaneously sharpens multiple edges of a spring-loaded disposable razor blade cartridge by gently contacting the blade edges with a moving rubber or polymeric compliant belt that is motor driven. The disposable razor blade handle is set in a cradle aperture, which is spring loaded against the moving belt. A timer terminates the blade sharpening operation, indicated by a green LED. A liquid is dispersed on the moving belt forming a thin liquid layer on the belt surface, illuminated by transversely located light illumination and the reflected light is received by a transversely located sensor. When the blade contacts the thin liquid layer, deep grooves in the blade cutting edge reduce this reflection indicating that the blade is too worn to be sharpened and a red LED light is indicated. Absence of reflection indicates that the thin liquid film has evaporated or spilled out.
    Type: Grant
    Filed: November 10, 2004
    Date of Patent: November 29, 2005
    Inventor: Julia Grace Papetti
  • Patent number: 6955588
    Abstract: Methods and a platen control parameters of a removal rate characteristic in chemical mechanical planarization, while allowing a low-cost polishing pad to be used especially in fast edge operations, and while reducing the amount of fluid used to support the polishing pad. Platen configuration provides fluid pressure control to reduce leakage of fluid from beneath the polishing pad, and contributes to control of a location of an inflection point of the removal rate characteristic. Another configuration controls a shape of a section of the removal rate characteristic between the inflection point and a leading wafer edge.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: October 18, 2005
    Assignee: Lam Research Corporation
    Inventors: Robert L. Anderson, II, Robert Charatan
  • Patent number: 6949006
    Abstract: A speed adjuster is provided in a belt-disc sander for controlling the rotating speed of a motor of the belt-disc sander. A speed adjust knob is disposed outside the belt-disc sander. The speed adjuster has a control circuit, a current sensor, a drive circuit, and a converter. The current sensor detects the motor current and feeds back to the control circuit, which controls the frequency variation of a SPWM signal of the drive circuit in response to the input of the speed adjust knob. The converter transforms the square wave voltage into an AC voltage for driving the motor. The desired rotating speed can be adjusted through the speed adjust knob. The control circuit will compare the present rotating speed of the motor with the set rotating speed to determine whether the present rotating speed conforms to the set one for correcting the rotating speed of the motor.
    Type: Grant
    Filed: August 11, 2004
    Date of Patent: September 27, 2005
    Assignee: Fego Precision Industrial Co., Ltd.
    Inventors: Yu-Kai Chen, Tsai-Fu Wu, Yung-Chun Wu, Wen-Yang Wang, Chin-Hsiung Chang
  • Patent number: 6949011
    Abstract: A method and apparatus for cleaning a web-based chemical-mechanical planarization (CMP) system. Specifically, a fluid spray bar is coupled to a frame assembly which may be mounted on a CMP system. The fluid spray bar will move along the frame assembly. As the fluid spray bar traverses the length of the frame assembly, a cleaning fluid is sprayed onto the web in order to clean the web between planarization cycles.
    Type: Grant
    Filed: August 28, 2002
    Date of Patent: September 27, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Scott E. Moore, Dinesh Chopra
  • Patent number: 6942546
    Abstract: A sensing apparatus for detecting a processing endpoint of a multi-layer semiconductor wafer includes a light source to emit light against a surface of the semiconductor wafer, a color sensor to sense a reflection color from the surface of the semiconductor wafer in response to the incident light and to generate a sensor signal, and a decision circuit coupled to the color sensor and configured to decide whether the wafer processing endpoint has been reached based at least in part on the sensor signal. In another embodiment, a sensing apparatus is coupled to a movable structure to position the sensing apparatus to sense the surface of the semiconductor wafer.
    Type: Grant
    Filed: December 17, 2002
    Date of Patent: September 13, 2005
    Assignee: ASM Nutool, Inc.
    Inventors: Mukesh Desai, Yuchun Wang, Efrain Velazquez
  • Patent number: 6932674
    Abstract: A method of determining the endpoint of a planarizing process is disclosed. An endpoint detection signal is selectively sampled from at least one predetermined location within a planarizing region defined on a planarizing web. Planarization is stopped when the endpoint criterion based on the endpoint detection signal is detected.
    Type: Grant
    Filed: March 5, 2003
    Date of Patent: August 23, 2005
    Assignee: Infineon Technologies Aktientgesellschaft
    Inventors: Peter Lahnor, Olaf Kuehn, Andreas Roemer, Alexander Simpson
  • Patent number: 6929530
    Abstract: Polishing pads, planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies. The polishing pads, for example, can be web-format pads, and the planarizing machines can be web-format machines. In a typical application, the web-format machines have a pad advancing mechanism and stationary table with a first dimension extending along a pad travel path, a second dimension transverse to the first dimension, and an illumination site from which a laser beam can emanate from the table. The pad advancing mechanism moves the pad along the pad travel path to replace worn portions of the pad with fresh portions. In one embodiment of the invention, a web-format polishing pad includes a planarizing medium and an optical pass-through system having a plurality of view sites through which a light beam can pass through the pad.
    Type: Grant
    Filed: July 14, 2000
    Date of Patent: August 16, 2005
    Assignee: Micron Technology, Inc.
    Inventor: Jason B. Elledge
  • Patent number: 6926589
    Abstract: The present invention relates to methods and apparatus that allow for chemical mechanical polishing using a flexible pad and variable fluid flow for variable polishing.
    Type: Grant
    Filed: March 22, 2002
    Date of Patent: August 9, 2005
    Assignee: ASM Nutool, Inc.
    Inventors: Douglas W. Young, Brett E. McGrath, Yuchun Wang
  • Patent number: 6926585
    Abstract: A pressure control system is used for eliminating individual differences of a plurality of pressure controllers used for controlling pressures of a plurality of pressure-controlled sections. The pressure control system includes a plurality of pressure controllers for supplying a pressurized fluid to a plurality of pressure-controlled sections, a master pressure controller for supplying a pressurized fluid having a reference pressure, a plurality of calibration chambers corresponding to the pressure controllers.
    Type: Grant
    Filed: September 8, 2004
    Date of Patent: August 9, 2005
    Assignee: Ebara Corporation
    Inventor: Tetsuji Togawa
  • Patent number: 6916235
    Abstract: A hand-held endless belt abrading machine comprises a base portion and a main portion, which portion is rotatable relative to the base portion around an axis extending in a forward and rearward direction of the abrading machine. The main portion comprises an air motor having a rotational shaft extending in a direction transverse to the abrading machine and projecting from the left end of the air motor, so that an abrading endless belt assembly drivingly connected to the output shaft is positioned to the left relative to the motor and the base portion which is held by a hand of an operator. When a left-handed person uses the abrading machine, the main portion is turned 180° relative to the base portion to shift the abrading endless belt assembly to the right relative to the base portion, thereby enabling the operator to readily observe the abrading belt assembly in operation.
    Type: Grant
    Filed: July 7, 2004
    Date of Patent: July 12, 2005
    Assignee: Nitto Kohki Co., Ltd.
    Inventors: Toshio Mikiya, Takashi Chiba, Atsushi Miura, Keiichi Murakami
  • Patent number: 6915796
    Abstract: A superabrasive wire saw having a plurality of individual coated superabrasive particles attached to a wire with an organic binder is disclosed and described. The superabrasive particle can be coated with a solidified coating of a molten braze alloy that is chemically bonded to the superabrasive particle. The organic binder can optionally contain filler materials and/or an organometallic coupling agent to improve the retention of coated superabrasive particles. The resulting superabrasive wire saws can be produced having diameters of less than 0.5 mm which significantly reduce kerf loss. Various methods for making and using such a superabrasive wire saw are additionally disclosed and described.
    Type: Grant
    Filed: July 25, 2003
    Date of Patent: July 12, 2005
    Inventor: Chien-Min Sung
  • Patent number: 6913512
    Abstract: A material removal optimizing system for a wood surface treating apparatus with a plurality of individual work stations arranged serially along an endless conveyor. Each station includes a working abrasive head along with an elevation adjustment mechanism for adjustably positioning the contact surface of each abrasive head at a desired working distance from the opposed surface of the workpiece traveling along the endless conveyor. An incoming workpiece dimension indicator is positioned at the infeed end, and additional workpiece dimension indicators are positioned downstream from each work station, with each dimension indicator being positioned to measure the dimensional deviation of the workpiece from a datum plane after it has passed through its preceding individual work station.
    Type: Grant
    Filed: June 7, 2004
    Date of Patent: July 5, 2005
    Inventor: Howard W. Grivna
  • Patent number: 6913521
    Abstract: An invention improves edge performance in chemical mechanical polishing processes. A method operation provides a wafer head above a wafer. The wafer head includes a first active retaining ring capable of extension and retraction. Another operation provides a polishing belt below the wafer head, and provides below the polishing belt a platen having a second active retaining ring capable of extension and retraction. Another operation controls positions of the first active retaining ring and the second active retaining ring to provide positional control for the polishing belt, thus adjusting and controlling the removal rate at the edge of the wafer.
    Type: Grant
    Filed: June 22, 2004
    Date of Patent: July 5, 2005
    Assignee: Lam Research Corporation
    Inventors: Alek Owczarz, John Boyd, Rod Kistler
  • Patent number: 6910953
    Abstract: A rotating belt (10) is used to finish the edges (23) of glass sheets (11), such as, the thin sheets (e.g., 0.7 mm) used as substrates for liquid crystal displays (LCDs). The edge (23) of the sheet (11) engages the working zone (15) of the belt (10) along a line segment (17) whose included angle with the direction of motion (19) of the belt (10) is less than 10°. The working zone (15) is brought into contact with the edge (23) by a pressure sensitive platen (13) which can accommodate errors in the positioning of the sheet (11) at the finishing station (12).
    Type: Grant
    Filed: July 24, 2003
    Date of Patent: June 28, 2005
    Assignee: Corning Incorporated
    Inventors: Roger A. Allaire, James W. Brown, Clive D. Gierbolini, Robert G. Schaeffler
  • Patent number: 6908368
    Abstract: The present invention describes a chemical mechanical polishing apparatus and method that uses a portion of a polishing pad that is disposed under tension between a supply spool and a receive spool, with a motor providing the tension to either the supply spool or the receive spool and the other spool being locked during processing. If a new section of the polishing pad is needed, the same motor that provided the tension is used to advance the polishing pad a determined amount. Further, during processing, a feedback mechanism is used to ensure that the tension of the polishing pad is consistently maintained.
    Type: Grant
    Filed: July 7, 2003
    Date of Patent: June 21, 2005
    Assignee: ASM Nutool, Inc.
    Inventors: Douglas W. Young, Vulf Perlov, Efrain Velazquez
  • Patent number: 6908374
    Abstract: The methods and systems described provide for an in-situ endpoint detection for material removal processes such as chemical mechanical processing (CMP) performed on a workpiece. In a preferred embodiment, an optical detection system is used to detect endpoint during the removal of planar conductive layers using CMP. An optically transparent polishing belt provides endpoint detection through any spot on the polishing belt. Once endpoint is detected, a signal can be used to terminate or alter a CMP process that has been previously initiated.
    Type: Grant
    Filed: January 17, 2002
    Date of Patent: June 21, 2005
    Assignee: Nutool, Inc.
    Inventors: Yuchun Wang, Bernard M. Frey, Bulent M. Basol, Douglas W. Young, Homayoun Talieh, Efrain Velazquez
  • Patent number: 6899606
    Abstract: A rotary grinding machine includes a rotary grinding member for grinding a workpiece on a workpiece feeding member. The grinding member is coupled with an output shaft of a motor through a drive transmission mechanism. The feeding member is coupled with the output shaft of the motor through a reduction gear mechanism, a transmission shaft and an endless tensible transmission member. To maintain an operating tension of the tensible transmission member when the feeding member is moved relative to the grinding member, a tensioning mechanism is disposed to enable effective transmission of a drive force from the reduction gear mechanism to the feeding member.
    Type: Grant
    Filed: March 5, 2004
    Date of Patent: May 31, 2005
    Inventors: Juei-Seng Liao, Pei-Lieh Chiang
  • Patent number: 6893337
    Abstract: A web-format polishing pad for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies, and methods for making and using such a web-format pad. In one aspect of the invention, a web-format polishing pad for planarizing a microelectronic substrate is made by slicing a cylindrical body of pad material along a cutting line that is at least substantially parallel to a longitudinal centerline of the body and at a radial depth inward from an exterior surface of the body. For example, a web of pad material can be sliced from the body by rotating the cylindrical body about the longitudinal centerline and pressing a cutting element against the rotating cylindrical body along the cutting line. The cutting element can be a knife with a sharp edge positioned at the cutting line and a face extending along a tangent of the cylindrical body.
    Type: Grant
    Filed: January 3, 2003
    Date of Patent: May 17, 2005
    Assignee: Micron Technology, Inc.
    Inventor: David W. Carlson
  • Patent number: 6893329
    Abstract: An abrasive tape is supplied to a tape head by a tape supply unit and taken up from the tape head by a tape take-up unit. The tape head presses the abrasive tape against a surface of an object under polish, which is rotated by a rotating unit. A tape head pressuring unit utilizes a voice coil motor, for example. Since the tape head pressuring unit generates a pressuring force for pressuring the tape head using the electromagnetic force, it is able to set a minute pressuring force by controlling a drive signal, and to obtain the fine adjustment of the pressuring force easily by controlling the electric signal. Therefore, it becomes possible to press the abrasive tape against the surface of the object under polish with a desired low pressure.
    Type: Grant
    Filed: September 5, 2003
    Date of Patent: May 17, 2005
    Assignee: Hitachi High-Tech Electronics Engineering Co., Ltd.
    Inventors: Fujio Tajima, Hideaki Amano, Teruaki Tokutomi, Takahisa Ishida, Kazuyuki Sonobe, Yasunori Fukuyama, Tsutomu Nagakura, Noritake Shizawa, Takeshi Sato
  • Patent number: 6890244
    Abstract: A polishing pad for polishing semiconductors and other planar substrates in the presence of a slurry comprising abrasive particles and a dispersive agent is disclosed. The polishing pad includes a soluble component within a polymer matrix component. The soluble component includes particles soluble in the slurry sufficiently to provide a void structure in the polishing surface of the pad. The void structure enhances the polishing rate and uniformity by increasing the mobility of the abrasive particles while reducing scratching of the polished surface. Additives that further enhance polishing and/or assist in the removal of residues generated during polishing, such as surfactants and removers, are optionally incorporated in the soluble particles or topographically coated on the soluble particles.
    Type: Grant
    Filed: September 18, 2003
    Date of Patent: May 10, 2005
    Assignee: Freudenberg Nonwovens Limited Partnership
    Inventors: Oscar K. Hsu, Jean K. Vangsness, Scott C. Billings, David S. Gilbride
  • Patent number: 6878048
    Abstract: An apparatus for reducing non-uniform stretch of a belt used in the CMP system is disclosed. The belt that may be used with the apparatus extends between a first roller and a second roller to define a belt loop with an inner surface and an outer surface to be used for CMP. The apparatus includes a compensating roller that has a first end and a second end where the first end and second end extends a width of the belt. The first end and the second end have a first diameter. The center of the roller has a second diameter that is less than the first diameter. The compensating roller has a symmetrically tapered shape that extends between each of the first end and second end to the center. The compensating roller is positioned inside of the belt loop, and is applied to the inner surface of the belt loop to reduce non-uniform stretch of the belt.
    Type: Grant
    Filed: June 8, 2004
    Date of Patent: April 12, 2005
    Assignee: Lam Research Corporation
    Inventors: Yehiel Gotkis, David Wei, Aleksander Owzarz
  • Patent number: 6875094
    Abstract: A worktable for an apparatus for grinding recesses, having on a frame (3) a pair of pulleys carrying a grinding belt (2), is provided with a sole control member (19) to approach and move apart said workpiece vice (20) with respect to said shaping pulley (1) of said pair of pulleys.
    Type: Grant
    Filed: September 11, 2002
    Date of Patent: April 5, 2005
    Assignee: New Tech S.r.l.
    Inventor: Alessandro Caporusso
  • Patent number: 6869341
    Abstract: A single-sided finishing apparatus is provided having a plurality of finishing stations with rotating transfer stations positioned therebetween. A hold down system presents the edge of the workpiece to the finishing head. The rotating transfer station includes a clamp for grasping a leading corner of a workpiece while rollers continue to drive the workpiece forward, thereby rotating the workpiece 90°.
    Type: Grant
    Filed: June 19, 2002
    Date of Patent: March 22, 2005
    Assignee: Glassline Corporation
    Inventors: Mark Opfer, Brad Borkosky, John Harkness
  • Patent number: 6857947
    Abstract: An apparatus for polishing a workpiece includes a workpiece holder configured to hold the workpiece, a polishing member configured to be positioned adjacent to a face of the workpiece in order to polish the workpiece face with a front side of the polishing member, and a platen having a plurality of pressure zones configured to selectively apply pressure to the polishing member thereby causing the polishing member to contact the workpiece face with selective pressure. In another embodiment, the apparatus includes a pressure controller coupled to the platen and configured to selectively adjust the pressure zones.
    Type: Grant
    Filed: January 17, 2003
    Date of Patent: February 22, 2005
    Assignee: ASM NuTool, Inc
    Inventors: Yuchun Wang, Bernard M. Frey, Bulent M. Basol, Homayoun Talieh, Douglas W. Young, Brett E. McGrath, Mukesh Desai, Efrain Velazquez, Tuan Truong
  • Patent number: 6848982
    Abstract: A tubular workpiece notching machine usable for general grinding operations has a worktable (1) whose base plate (10) is pivotally mounted to the frame (6) of the notching machine around a pivotal orthogonal axis (Y—Y) in such a manner that the worktable (1) is movable from a first working position in which the machine vice (2) co-operates with the shaping pulley (3) in recessing ends of tubular workpiece by grinding, to a second working position in which the shaping pulley (3) is used for generally grinding a workpiece. Connecting elements are provided for removably anchoring the base plate (10) of the worktable (1) to the frame (6) in the first working position.
    Type: Grant
    Filed: November 14, 2002
    Date of Patent: February 1, 2005
    Assignee: New Tech S.r.l.
    Inventor: Alessandro Caporusso
  • Patent number: 6848978
    Abstract: An imageable belt includes a seam that is finished using an abrasive finishing machine. The seam comprises a seam width with adhesive material disposed thereon. The finishing process includes an abrasive finishing media with a finishing surface and a backer bar. The backer bar comprises a backer bar radius. The backer bar surface is positioned against the belt inner surface so that the belt outer surface contacts the finishing surface to define a finishing contact arc with respect to the backer bar radius. A tension, feed rate and pressure are applied to the finishing media. Using the finishing machine, the seam is then finished to remove the adhesive material. The finishing process results in a seam that is imageable. In one embodiment, the backer bar radius is adjusted so that the finishing contact arc covers the seam width.
    Type: Grant
    Filed: May 1, 2003
    Date of Patent: February 1, 2005
    Assignee: Xerox Corporation
    Inventors: Paul F. Mastro, Daniel L. Coughlin, Jr., Thomas L. DiGravio
  • Patent number: 6837774
    Abstract: A linear chemical mechanical polishing apparatus that is equipped with a programmable pneumatic support platen and a method for controlling the polishing profile on a wafer surface during a linear CMP process are disclosed. The programmable pneumatic support platen is positioned juxtaposed to a bottom surface of a continuous belt for the linear CMP apparatus and positioned corresponding to a position of the wafer carrier so as to force the polishing pad against the wafer surface to be polished. The support platen has a predetermined thickness, a plurality of apertures through the thickness and a plurality of openings in a top surface in fluid communication with a gas source through the plurality of apertures.
    Type: Grant
    Filed: March 28, 2001
    Date of Patent: January 4, 2005
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Tien-Chen Hu, Jih-Churng Twu
  • Patent number: 6837779
    Abstract: A chemical mechanical polishing apparatus has a substrate holder, a polishing belt, and a backing member positioned on a side of the polishing belt opposite the substrate holder. The polishing belt has a polishing surface to contact at least a portion of the substrate held by the substrate holder. The polishing belt is movable in a first direction in a generally linear path relative to the substrate. The polishing belt has a plurality of grooves formed therein.
    Type: Grant
    Filed: May 7, 2001
    Date of Patent: January 4, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Christopher W. Smith, John M. White
  • Patent number: 6817925
    Abstract: A multistage fine-hole machining device has lap stations for lapping an inner surface defining a through-hole of a workpiece. Each of the lap stations has a passing unit for passing wire through the through-hole of the workpiece, a supply unit for supplying a polishing material to the wire, and a sliding unit for effecting relative sliding movement between the workpiece and the wire while the wire is passed through the through-hole of the workpiece and is supplied with the polishing material to thereby lap the inner surface of the workpiece with the polishing material and enlarge the diameter of the through-hole. A transfer device successively transfers the workpiece to each of the lap stations to lap the inner surface of the workpiece at each of the lap stations during the lapping operation for successively enlarging the diameter of the through-hole to a preselected diameter.
    Type: Grant
    Filed: August 26, 2002
    Date of Patent: November 16, 2004
    Assignee: Seiko Instruments Inc.
    Inventors: Tatsuji Saigo, Masaharu Sugiyama, Hideo Iwadate, Hiroyuki Kihara
  • Patent number: 6796880
    Abstract: A polishing article for chemical mechanical polishing. The polishing article includes a generally elongated polishing sheet with a polishing surface. The polishing article is formed from a material that is substantially opaque, and has a discrete region extending substantially the length of the polishing sheet that is at least semi-transparent.
    Type: Grant
    Filed: March 21, 2003
    Date of Patent: September 28, 2004
    Assignee: Applied Materials, Inc.
    Inventors: Fred C. Redeker, Manoocher Birang, Shijian Li, Sasson Somekh
  • Patent number: 6786810
    Abstract: A process for planarizing, polishing, or providing other modification of a wafer surface or other workpiece. The process includes using an abrasive article having a textured abrasive coating affixed to a backing. The abrasive article includes a monitoring element, such as a window, to allow transmission of radiation therethrough. The radiation level is monitored throughout the planarization process to determine the approach of the desired endpoint. The window in the abrasive coating can be an area devoid of abrasive coating or having minimal or a thinned abrasive coating.
    Type: Grant
    Filed: September 24, 2002
    Date of Patent: September 7, 2004
    Assignee: 3M Innovative Properties Company
    Inventors: Michael J. Muilenburg, Chong-Yong J. Kim, Jerry J. Fizel, Richard J. Webb, John J. Gagliardi, Daniel B. Pendergrass, Jr., Robert J. Streifel, Wesley J. Bruxvoort
  • Patent number: 6786805
    Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the microelectronic substrate to flow off the polishing pad under the force of gravity. Two such polishing pads can be positioned opposite each other in a vertical orientation and can share either a common platen or a common substrate carrier. The polishing pads can be pre-attached to both a supply roll and a take-up roll to form a cartridge which can be easily removed from the apparatus and replaced with another cartridge.
    Type: Grant
    Filed: August 14, 2001
    Date of Patent: September 7, 2004
    Assignee: Micron Technology, Inc.
    Inventor: Scott E. Moore
  • Patent number: 6782717
    Abstract: A method for manufacturing a disk-like glass substrate that is used as an information recording medium. The glass substrate is acid resistant. When an index of acid resistance is the maximum depth at which components other than silica dissolve from the glass substrate during immersion of the glass substrate in 1 percentage of weight of sulfuric acid, the acid resistance of the glass substrate is represented by the maximum depth of 0.5 nm to 10 nm. A linear texture is formed by pressing a tape against the glass substrate in a circumferential direction of the glass substrate while feeding abrasion slurry to the surface of the glass substrate. Acid treatment is performed on the glass substrate on which the texture is formed.
    Type: Grant
    Filed: January 16, 2003
    Date of Patent: August 31, 2004
    Assignee: Hoya Corporation
    Inventors: Yasuhiro Saito, Kazuishi Mitani, Tatsuro Umeyama, Koji Okuhata, Toshiaki Hashimoto
  • Patent number: 6776695
    Abstract: An invention is disclosed for improving edge performance in a chemical mechanical polishing process is disclosed. The system includes a wafer head disposed above a wafer, where the wafer head includes a first active retaining ring capable of extension and retraction. Below the wafer head is a polishing belt, and disposed below the polishing belt is a platen having a second active retaining ring capable of extension and retraction. During operation the first active retaining ring and the second active retaining ring can be controlled to provide positional control for the polishing belt, thus adjusting and controlling the removal rate at the edge of the wafer.
    Type: Grant
    Filed: December 21, 2000
    Date of Patent: August 17, 2004
    Assignee: Lam Research Corporation
    Inventors: Alek Owczarz, John Boyd, Rod Kistler
  • Patent number: 6769958
    Abstract: A belt wear optimizing system for a wood surface treating apparatus with a plurality of individual work stations arranged serially along an endless conveyor. Each station includes a working abrasive head along with an elevation control for adjustably positioning the contact surface of each abrasive head at a desired working distance from the opposed surface of the workpiece traveling along the endless conveyor. An incoming workpiece thickness detector is positioned at the infeed end, and additional workpiece thickness detectors are positioned downstream from each work station, with each being positioned to measure the thickness of the workpiece after it has passed through its preceding individual work station.
    Type: Grant
    Filed: August 21, 2002
    Date of Patent: August 3, 2004
    Inventor: Howard W. Grivna
  • Patent number: 6769974
    Abstract: A sand-belt finishing machine having a sand-belt replacement mechanism includes a support rack, a first roller, a second roller, an upright rod, an elastic member, a sand belt, and a pull lever. When the upright rod is moved by the pull lever to compress the elastic member, the distance between the first roller and the second roller is shortened. When the upright rod is released by the pull lever, the upright rod is returned to its original position by the elastic member, so that the distance between the first roller and the second roller is increased. Thus, the sand belt can be mounted on and detached from the first roller and the second roller rapidly, easily and conveniently, thereby facilitating the user replacing the sand belt.
    Type: Grant
    Filed: November 1, 2002
    Date of Patent: August 3, 2004
    Inventor: Wang Tien Wang
  • Publication number: 20040137833
    Abstract: A method for cleaning a magnetic head using a cleaning tape comprising a substrate and a cleaning layer, wherein the cleaning tape has a stiffness of 2 or less in a width direction, and the magnetic head has trenches substantially parallel to a sliding direction of the cleaning tape.
    Type: Application
    Filed: October 28, 2003
    Publication date: July 15, 2004
    Applicant: FUJI PHOTO FILM CO., LTD.
    Inventors: Naoto Murao, Hiroyuki Tahara
  • Patent number: 6761618
    Abstract: A method of manufacturing a magnetic stamper/imprinter for use in patterning of magnetic recording media by means of a contact printing process, comprising sequential steps of: (a) providing a stamper/imprinter comprising a body of a magnetic material having an imprinting surface including a topographical pattern corresponding to a pattern to be formed in the surface of a magnetic or magneto-optical (MO) recording medium and comprising a patterned plurality of spaced-apart recesses with a plurality of non-recessed areas therebetween, said imprinting surface including a plurality of defects comprising surface blemishes and stains, magnetic particles, and non-magnetic particles; (b) initially removing the surface blemishes, stains, and magnetic particles; and (c) then removing or rendering the non-magnetic particles benign to the contact printing process.
    Type: Grant
    Filed: March 13, 2003
    Date of Patent: July 13, 2004
    Assignee: Seagate Technology LLC
    Inventors: Joseph Leigh, Nobuo Kurataka
  • Patent number: 6755723
    Abstract: A polishing head assembly for retaining an object that is subject to polishing with a polishing pad is disclosed. The polishing head assembly comprises a head retainer assembly movably coupled to a wafer carrier head. The head retainer assembly includes a gimbal post and a load suspension plate. The gimbal post and the load suspension plate are operable to transfer a loading force to the wafer carrier head during polishing. The gimbal post also provides gimballing to optimize the position of the object in parallel with the polishing pad. In addition, the load suspension plate provides distribution of the loading force to optimize the flatness of the object during polishing.
    Type: Grant
    Filed: September 29, 2000
    Date of Patent: June 29, 2004
    Assignee: LAM Research Corporation
    Inventor: Xuyen N. Pham
  • Patent number: 6752706
    Abstract: An adjusting device for the sanding drum of a double-drum sander is installed between the opposite ends of the rear grinding drum and the machine frame of a sander for adjusting a rear sanding drum to a most suitable height to match with the size number of the emery of the front sanding drum of the sander so as to carry out abrading with excellent effect.
    Type: Grant
    Filed: June 4, 2003
    Date of Patent: June 22, 2004
    Inventor: Po Chang Chuang
  • Patent number: 6749492
    Abstract: A rotary sanding machine includes a driven wheel coupled to a transmission shaft which is driven by a motor so as to actuate an emery coated belt for sanding. A barrier wall is disposed to hold back dust flying during sanding action to permit the dust to fall into a dust passageway in a dust collecting member. An impeller is mounted in a blower casing, and is coupled to an impeller driving shaft which is rotated with the transmission shaft by means of an endless drive transmission member such that the dust falling in the dust passageway can be drawn into the blower casing for discharge through a discharge port.
    Type: Grant
    Filed: February 21, 2003
    Date of Patent: June 15, 2004
    Inventor: Pei-Lieh Chiang
  • Patent number: 6749491
    Abstract: An apparatus for reducing non-uniform stretch of a belt used in the CMP system is disclosed. The belt that may be used with the apparatus extends between a first roller and a second roller to define a belt loop with an inner surface and an outer surface to be used for CMP. The apparatus includes a compensating roller that has a first end and a second end where the first end and second end extends a width of the belt. The first end and the second end have a first diameter. The center of the roller has a second diameter that is less than the first diameter. The compensating roller has a symmetrically tapered shape that extends between each of the first end and second end to the center. The compensating roller is positioned inside of the belt loop, and is applied to the inner surface of the belt loop to reduce non-uniform stretch of the belt.
    Type: Grant
    Filed: December 26, 2001
    Date of Patent: June 15, 2004
    Assignee: Lam Research Corporation
    Inventors: Yehiel Gotkis, David Wei, Aleksander Owzarz
  • Patent number: 6736714
    Abstract: An endless belt for a belt type polishing machine comprises a support fabric and a polymer layer of relatively low hardness. The polymer layer is formed with drainage grooves. The support fabric may comprise a non woven or woven material, or a membrane with oriented reinforcing yarns. A further version comprises a spiral-link fabric supporting a woven or non woven layer carrying the polymer layer. The polymer layer may be a double layer, the upper of which is either harder or softer than the lower layer.
    Type: Grant
    Filed: September 30, 1997
    Date of Patent: May 18, 2004
    Assignee: Praxair S.T. Technology, Inc.
    Inventor: Walter Dudovicz