Endless Band Tool Patents (Class 451/296)
  • Patent number: 6736710
    Abstract: A polishing head for polishing the end surface of a semiconductor wafer has a driver roller, a driving motor for rotating it, a pair of upper and lower follower rollers one above the other parallel to and horizontally separated from the driver roller and an endless polishing belt around these rollers. As the driving motor causes the polishing belt to run around the rollers, the semiconductor wafer is pushed against the polishing belt between the upper and lower follower rollers. A pair of upper and lower tension-controlling rollers are provided for controlling the tension in the polishing belt between the two follower rollers. At least one of these tension-controlling rollers is movable vertically. A polisher is formed with such a polishing head, a holder for holding and rotating the wafer and an attaching device for attaching the polishing head to the polisher.
    Type: Grant
    Filed: March 26, 2003
    Date of Patent: May 18, 2004
    Assignee: Nihon Microcoating Co., Ltd.
    Inventors: Kazunari Osawa, Izuru Morioka, Naotoshi Hosoya
  • Patent number: 6733373
    Abstract: A polishing assembly for use in a linear chemical mechanical polishing apparatus and a method for forming such assembly are described. In the polishing assembly, a plurality of polishing pads are adhesively joined to a top surface of a continuous belt. Each of the plurality of polishing pads is provided with a leading edge which has a lower lip and a trailing edge which has an upper lip. The upper lip of the trailing edge of a first polishing pad covers the lower lip of the leading edge of a second polishing pad when the pads are adhesively bonded to the continuous belt such that the first pad leads the second pad in the direction of rotation for the continuous belt such that the upper lip protects the lower lip to prevent delamination of the pads. The tight seam made possible by the present invention novel tapered joint further prevents water absorption or penetration and therefore prolongs the lifetime of the polishing pads.
    Type: Grant
    Filed: March 31, 2000
    Date of Patent: May 11, 2004
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chia-Ming Yang, Chin-Hsin Peng, Jian-Lin Hwang, Ying-Ho Chen
  • Publication number: 20040087261
    Abstract: A sand-belt finishing machine having a sand-belt replacement mechanism includes a support rack, a first roller, a second roller, an upright rod, an elastic member, a sand belt, and a pull lever. When the upright rod is moved by the pull lever to compress the elastic member, the distance between the first roller and the second roller is shortened. When the upright rod is released by the pull lever, the upright rod is returned to its original position by the elastic member, so that the distance between the first roller and the second roller is increased.
    Type: Application
    Filed: November 1, 2002
    Publication date: May 6, 2004
    Inventor: Wang Tien Wang
  • Publication number: 20040087260
    Abstract: A sand-belt finishing machine having a reciprocal movement mechanism includes a main body, a swingable support rack, a finishing device, and an eccentric device. Thus, the eccentric unit of the eccentric device produces a driving force to pull and push the first roller of the finishing device, so that the first roller is oscillated successively and produces a vibration or shock force on the sand belt of the finishing device, so as to remove and clear the powder chips attached on the surface of the sand belt.
    Type: Application
    Filed: November 1, 2002
    Publication date: May 6, 2004
    Inventor: Wang Tien Wang
  • Publication number: 20040087262
    Abstract: An endless belt for a belt type polishing machine comprises a support fabric and a polymer layer of relatively low hardness. The polymer layer is formed with drainage grooves. The support fabric may comprise a non woven or woven material, or a membrane with oriented reinforcing yarns. A further version comprises a spiral-link fabric supporting a woven or non woven layer carrying the polymer layer. The polymer layer may be a double layer, the upper of which is either harder or softer than the lower layer.
    Type: Application
    Filed: October 22, 2003
    Publication date: May 6, 2004
    Inventor: Walter Dudovicz
  • Patent number: 6729944
    Abstract: A chemical mechanical polishing apparatus has a rotatable platen, a polishing sheet that is wider than the substrate extending between two reels, a drive mechanism to advance the polishing sheet, and a chucking mechanism to intermittently secure the polishing sheet to the platen. The platen can have a platen base that is adaptable to receive either a circular platen top or a rectangular platen top.
    Type: Grant
    Filed: June 17, 2002
    Date of Patent: May 4, 2004
    Assignee: Applied Materials Inc.
    Inventors: Manoocher Birang, Lawrence M Rosenberg, Sasson R Somekh, John M White
  • Patent number: 6726545
    Abstract: A linear polishing apparatus for polishing a semiconductor substrate including a novel polishing belt arrangement with at least two polishing belts forming a continuous loop. Each belt having an outside polishing surface and an inside smooth surface. The belts are spaced alongside each other sharing a common axis at each end. The belts are looped around a pair of rollers making up a driver roller at one end and a driven roller at the other end. A platen member interposes each belt and is placed between the pairs of rollers. The platen provides a polishing plane and supporting surface for the polishing belts. The polishing plane includes a plurality of holes communicating with an elongated plenum chamber underlying the plane. The chamber supplies a compressed gas to impart an upward pressure against the polishing belts. The driver rollers are coupled to separate motors to independently drive and control at least said two of the polishing belts.
    Type: Grant
    Filed: April 26, 2002
    Date of Patent: April 27, 2004
    Assignee: Chartered Semiconductor Manufacturing Ltd.
    Inventors: Subramanian Balakumar, Chen Feng, Victor Lim, Paul Proctor, Mukhopadhyay Madhusudan, Chivukula Subrahmanyam, Yelehanka Ramachandramurthy Pradeep
  • Patent number: 6722957
    Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the microelectronic substrate to flow off the polishing pad under the force of gravity. Two such polishing pads can be positioned opposite each other in a vertical orientation and can share either a common platen or a common substrate carrier. The polishing pads can be pre-attached to both a supply roll and a take-up roll to form a cartridge which can be easily removed from the apparatus and replaced with another cartridge.
    Type: Grant
    Filed: April 5, 2002
    Date of Patent: April 20, 2004
    Assignee: Micron Technology, Inc.
    Inventor: Scott E. Moore
  • Patent number: 6722946
    Abstract: The methods and systems described provide for an in-situ endpoint detection for material removal processes such as chemical mechanical polishing (CMP) performed on a workpiece. In a preferred embodiment, an optical detection system is used to detect endpoint during the removal of planar conductive layers using CMP. An optically transparent polishing belt provides endpoint detection through any spot on the polishing belt. Once endpoint is detected, a signal can be used to terminate or alter a CMP process that has been previously initiated.
    Type: Grant
    Filed: July 15, 2002
    Date of Patent: April 20, 2004
    Assignee: NuTool, Inc.
    Inventors: Homayoun Talieh, Bulent M. Basol
  • Patent number: 6688951
    Abstract: A thermal head lapping apparatus includes a pallet for holding at least one thermal head, a transport device for transporting the thermal head held on the pallet successively to a specified processing position, and a lapping device for forcing a lapping material being moved onto the thermal head that has been transported to said processing position. As a result, the apparatus is capable of advantageously performing lapping treatment with a good efficiency on surfaces to be coated with protective layers or the formed protective layers in a process of fabricating a thermal head, thereby improving the production efficiency of the thermal head and fabricating with a good productivity the suitably lapped thermal head of high quality that ensures high quality image recording.
    Type: Grant
    Filed: March 27, 2000
    Date of Patent: February 10, 2004
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Makoto Kashiwaya, Junji Nakada
  • Publication number: 20040023606
    Abstract: An apparatus for polishing a workpiece includes a workpiece holder configured to hold the workpiece, a polishing member configured to be positioned adjacent to a face of the workpiece in order to polish the workpiece face with a front side of the polishing member, and a platen having a plurality of pressure zones configured to selectively apply pressure to the polishing member thereby causing the polishing member to contact the workpiece face with selective pressure. In another embodiment, the apparatus includes a pressure controller coupled to the platen and configured to selectively adjust the pressure zones.
    Type: Application
    Filed: January 17, 2003
    Publication date: February 5, 2004
    Inventors: Yuchun Wang, Bernard M. Frey, Bulent M. Basol, Homayoun Talieh, Douglas W. Young, Brett E. McGrath, Mukesh Desai, Efrain Velazquez, Tuan Truong
  • Publication number: 20040023607
    Abstract: A method of polishing a plurality of layers on a surface of a semiconductor wafer includes polishing a first layer using a polishing solution on a first portion of polishing pad and polishing another layer using a polishing solution on another portion of polishing pad. The polishing solution used for each layer is preferably suited to polish its respective layer. The different portions of polishing pad, likewise, are preferably suited to polish a corresponding wafer layer. The different portions of polishing pad may be located on the same pad or on different pads.
    Type: Application
    Filed: March 13, 2003
    Publication date: February 5, 2004
    Inventors: Homayoun Talieh, Bulent M. Basol, Douglas W. Young, Yuchun Wang, Tuan Truong
  • Patent number: 6685539
    Abstract: A processing tool is used to carry out a fixed-abrasive grinding process on a surface of a silicon work-piece. The processing tool includes abrasive grains made up silica grains. A primary average grain size of the silica grains is desirably 0.8 nm to 10 &mgr;m.
    Type: Grant
    Filed: August 16, 2000
    Date of Patent: February 3, 2004
    Assignee: Ricoh Company, Ltd.
    Inventors: Toshiyuki Enomoto, Yasuhiro Tani, Shigeru Inoue
  • Publication number: 20040005846
    Abstract: Chamfer processing is carried out by making plate material W end faces come in contact with rotating grinding belts. The grinding surfaces of the opposing side by side grinding belts are on the centerline in the thickness direction of the plate material. The center point is considered the pivot point as seen from the plate material end faces and in distance is smaller than the thickness of the plate material. Pivot motion of the plate material is carried out in the rotating direction of grinding belts. This chamfer processing method and device enables chamfer in a small curvature radius without applying a heavy tension load on grinding belts, and performs uniform deep chamfer processing of multiple plate material simultaneously.
    Type: Application
    Filed: May 28, 2003
    Publication date: January 8, 2004
    Applicant: JATCO Ltd.
    Inventors: Kazuyuki Hosoe, Takefumi Suzuki
  • Patent number: 6666755
    Abstract: A belt wiper that can be used in a linear belt-type chemical mechanical planarization (CMP) system to maintain a belt pad is provided. The belt wiper mitigates disturbances within a detection region important to a belt pad steering system. Also, the belt wiper mitigates the obscuring of optical components important to operation of an endpoint detection system. Thus, the belt wiper, by wiping the underside of the belt pad will preserve the functionality of both the belt pad steering system and the endpoint detection system.
    Type: Grant
    Filed: June 26, 2002
    Date of Patent: December 23, 2003
    Assignee: Lam Research Corporation
    Inventors: Travis R. Taylor, Christian DiPietro, Stephen Jew, Philip Ngoon, Katgenahalli Y. Ramanujam, Tony Luong
  • Patent number: 6659849
    Abstract: Generally, a method and apparatus for cleaning a backside of a web of polishing material. In one embodiment, the apparatus includes a platen having a support surface adapted to support the backside the web and a web cleaner disposed on the platen and adjacent the backside of the web. A method for cleaning a web of polishing material is also provided. In one embodiment, the method includes the steps of supporting a portion of the web of polishing media on a platen, advancing a portion of the web onto the platen, and cleaning the unrolled portion of the web.
    Type: Grant
    Filed: November 3, 2000
    Date of Patent: December 9, 2003
    Assignee: Applied Materials Inc.
    Inventors: Shijian Li, Jayakumar Gurusamy, Manoocher Birang, Fred C. Redeker
  • Patent number: 6656030
    Abstract: A belt for polishing a workpiece such as a semiconductor wafer in a chemical mechanical polishing system includes a polymeric layer forming an endless loop and having a polishing surface on one side of the endless loop. The belt is manufactured by molding a polymeric material such as urethane in a cylindrical mold. The belt is thus made from a single layer, reducing weight, size, cost and maintenance requirements.
    Type: Grant
    Filed: November 9, 2001
    Date of Patent: December 2, 2003
    Assignee: Lam Research Corporation
    Inventors: Cangshan Xu, Brian S. Lombardo
  • Publication number: 20030211818
    Abstract: A novel system of removing scratches and damages from the saddle shaped outer surface of an inner race for a constant velocity axle joint of a car is comprised of an “O”-ring shaped sandpaper comprised of a flexible ring and an abrasive surface developed by adhering powders of abrasive materials such as aluminum oxide, ceramic aluminum oxide, aluminum zirconia, zirconia and silicon carbide to the outer surface of the flexible ring. The “O”-ring shaped surface of the sand paper of this invention fits the saddle shape of the outer surface of the inner race for constant velocity axle joint of a car. The sandpaper of this invention is mounted on a conventional belt sander equipped with three concave grooved belt wheels. The method of this invention enables even grinding and polishing of the saddle shaped outer surface of the inner race, which was impossible by the prior arts.
    Type: Application
    Filed: May 13, 2002
    Publication date: November 13, 2003
    Inventor: Jongkeun Kim
  • Patent number: 6641470
    Abstract: An optical window structure is disclosed. The optical window structure includes a support layer that has a reinforcement layer and a cushioning layer. In addition, the optical windows structure has a polishing pad which is attached to a top surface of the support layer. Furthermore, the optical window structure has an optical window opening and a shaped optical window. The shaped optical window at least partially protrudes into the optical window opening in the support layer and the polishing pad during operation.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: November 4, 2003
    Assignee: Lam Research Corporation
    Inventors: Eugene Y. Zhao, Kang Jia, Michael David Steiman, Herbert Elliot Litvak, Christian David Frederickson
  • Patent number: 6641464
    Abstract: A polishing bar is provided with a plurality of backings that are carried via blocks of impact absorbent material on a bar of greater stiffness. Each backing is shaped with two surfaces at an angle to each other. A polishing tape is disposed over the angled surfaces of each backing. The portion of the polishing tape over the forward surface of the backing is employed to polish the angled edge of the top wafer of a rotating bonded wafer pair.
    Type: Grant
    Filed: February 21, 2003
    Date of Patent: November 4, 2003
    Assignee: Accretech USA, Inc.
    Inventor: Robert E. Steere, III
  • Patent number: 6634935
    Abstract: Described is a method and apparatus for producing bi-directional linear polishing that uses a flexible pad. In one aspect, a horizontal drive assembly moves a horizontal slide member that is horizontally moveable over rails attached to a single casting. Openings within the casting exist for the inclusion of the supply spool, the receive spool and the pad path rollers. A drive assembly translates the rotational movement of a motor into the horizontal bi-directional linear movement of the horizontal slide member. With the polishing pad properly locked in position, preferably being attached between a supply spool and the receive spool, horizontal bi-directional linear movement of the horizontal slide member creates a corresponding horizontal bi-directional linear movement of a portion of the polishing pad.
    Type: Grant
    Filed: April 18, 2002
    Date of Patent: October 21, 2003
    Assignee: Nutool, Inc.
    Inventors: Douglas W. Young, Mark Henderson, Bernard M. Frey
  • Patent number: 6634936
    Abstract: A CMP polishing pad improves overall material removal rate uniformity by combining multiple polishing pad sections in a serially linked manner, where the polishing pad sections are characterized by at least two different material removal rate profiles. The polishing pad is designed by determining a wafer polishing profile for each of a group of polishing pads where each polishing pad has a unique groove configuration, determining a combination of polishing pad segments, each of the segments constructed with one of the unique groove configurations, that will combine to achieve an improved uniformity in the polishing profile, and manufacturing a polishing pad having pad sections corresponding to the analytically determined pad sections.
    Type: Grant
    Filed: May 30, 2001
    Date of Patent: October 21, 2003
    Assignee: Lam Research Corporation
    Inventors: Alan J. Jensen, Brian S. Thornton
  • Publication number: 20030194960
    Abstract: A support belt to be used with a polishing belt. The support belt includes an interior layer made of a polymer, wherein said interior layer has a first free end and a second free end that abut one another but are not attached to one another so as to form a first seam and an adhesive placed on an exterior surface of the interior layer. An exterior layer made of a polymer and attached to the adhesive, wherein the exterior layer has a first free end and a second free end that abut one another but are not attached to one another so as to form a second seam.
    Type: Application
    Filed: April 10, 2002
    Publication date: October 16, 2003
    Inventors: Eric Staudt, Chau H. Duong, John V. H. Roberts, Richard M. Levering
  • Patent number: 6620032
    Abstract: Polishing pads, planarizing machines and methods for mechanical and/or chemical-mechanical planarization of semiconductor wafers, field emission displays or other microelectronic substrate assemblies. One planarizing machine of the invention is a web-format machine having a planarizing table to support a portion of the polishing pad in a planarizing zone, at least one roller to hold another portion of the polishing pad, and a carrier assembly for handling a microelectronic substrate assembly. A web-format polishing pad used with this machine can include a body having a planarizing medium, an elongated first side edge, and an elongated second side edge opposite the first side edge. The body has a length sufficient to extend across the planarizing zone and wrap around the roller.
    Type: Grant
    Filed: May 8, 2001
    Date of Patent: September 16, 2003
    Assignee: Micron Technology, Inc.
    Inventor: Dinesh Chopra
  • Patent number: 6609961
    Abstract: A method of producing a chemical mechanical planarization (CMP) polishing belt structure is disclosed that includes forming a strip of substantially rigid material into a support belt having an interior surface and an exterior surface. At least a portion of the exterior surface of the support belt is altered to form a plurality of gripping members integral with the exterior surface of the support belt. An interior surface of a seamless CMP belt is applied to the exterior surface of the support belt such that the plurality of gripping members engage the interior surface of the seamless CMP belt in a non-slip grip.
    Type: Grant
    Filed: January 9, 2001
    Date of Patent: August 26, 2003
    Assignee: Lam Research Corporation
    Inventors: Michael S. Lacy, John M. Boyd
  • Patent number: 6609952
    Abstract: In a method for determining an endpoint in a chemical mechanical planarization (CMP) operation, the concentration of an oxidizing agent in the slurry byproduct generated during the CMP operation is monitored. The endpoint of the CMP operation is determined based on the concentration of the oxidizing agent in the slurry byproduct. The concentration of the oxidizing agent in the slurry byproduct may be monitored by diverting the slurry byproduct from a surface of a polishing pad, and measuring an optical property of the slurry byproduct diverted from the surface of the polishing pad. A CMP system configured to implement the method for determining an endpoint also is described.
    Type: Grant
    Filed: March 29, 2002
    Date of Patent: August 26, 2003
    Assignee: Lam Research Corporation
    Inventor: Joseph P. Simon
  • Publication number: 20030153253
    Abstract: A polishing cloth is adhered to a polishing belt including a window opening for end-point detection. A transparent film, including a liner, that transmits end-point detection light is adhered to a portion of the polishing cloth corresponding to the window opening of the polishing belt. Another liner is adhered via an adhesion layer to the adhesion surface of the polishing cloth at area other than the portion corresponding to the window opening. The polishing cloth includes the transparent film that transmits the end-point detection light at the portion corresponding to the window opening of the polishing belt so that an end point of the surface of the object to be polished can be detected through the transparent film. This prevents slurry to leak inside the belt compared to the conventional technology.
    Type: Application
    Filed: December 13, 2002
    Publication date: August 14, 2003
    Applicant: Rodel Nitta Company
    Inventors: Takashi Hanamoto, Mineo Hattori, Yasuji Yokomichi
  • Patent number: 6604988
    Abstract: The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.
    Type: Grant
    Filed: September 20, 2002
    Date of Patent: August 12, 2003
    Assignee: NuTool, Inc.
    Inventors: Homayoun Talieh, Konstantin Volodarsky, Jalal Ashjaee, Douglas W. Young
  • Patent number: 6602123
    Abstract: A polishing pad (for example, polishing pad 305) for use in polarization of a semiconductor wafer (for example, semiconductor wafer 420), the polishing pad 305 featuring a plurality of different polishing surfaces, depending upon the direction of the movement of the polishing pad 305. The polishing pad 305 may take the form of a polishing disc or a polishing belt. The polarization of the semiconductor wafer 420 can then take place at a fewer number of polishing stations, thereby reducing the amount of time needed and reducing the probability of damage to the semiconductor wafer 420.
    Type: Grant
    Filed: September 13, 2002
    Date of Patent: August 5, 2003
    Assignee: Infineon Technologies AG
    Inventor: Markus Naujok
  • Publication number: 20030134582
    Abstract: A chemical mechanical polishing (CMP) apparatus is provided. The CMP apparatus includes a first roller situated at a first point and a second roller situated at a second point. The first point is separate from the second point. Also included in the apparatus is a polishing pad strip having a first end secured to the first roller and a second end secured to the second roller. The first roller and the second roller are configured to reciprocate so that the polishing pad strip oscillates at least partially between the first point and the second point.
    Type: Application
    Filed: February 18, 2003
    Publication date: July 17, 2003
    Applicant: LAM RESEARCH CORP.
    Inventors: Miguel A. Saldana, Aleksander A. Owczarz
  • Patent number: 6592439
    Abstract: Generally, a method and apparatus for retaining polishing material is provided. In one embodiment, the apparatus includes a platen having a top surface, a plurality of channels and one or more vacuum ports. The top surface is adapted to support the polishing material. The plurality of channels are formed in a polishing area of the top surface. The vacuum ports are disposed in the platen and at least one port is in communication with at least one of the channels. Upon application of a vacuum to the ports, the channels remove fluids under the polishing material while securing the polishing material to the top surface.
    Type: Grant
    Filed: November 10, 2000
    Date of Patent: July 15, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Shijian Li, Manoocher Birang, Ramin Emami, Andrew Nagengast, Douglas Orcutt Brown, Shi-Ping Wang, Martin Scales, John White
  • Patent number: 6589102
    Abstract: A lens (L) with an aspheric surface (10) is held by a vacuum lens holder (12). A lap wall (42) is moved towards the lens surface (10) while in a plastic state. A polishing fabric (PF) is positioned between the lens surface (10) and the lap wall (42) before they are moved together. Fluid pressure in a chamber (44) behind the lap wall (42) is used to move the lap wall (42) and the polishing fabric (PF) against the lens surface (10). This causes the lap wall (42) to take a shape corresponding to the shape of the lens surface (10). Then, the lap wall material (42) is caused or allowed to become a solid. When the lap wall (42) is solid, the polishing fabric (PF) is caused to move relative to the lens (L) and the lap (32). The lap wall (42) holds the polishing fabric (PF) against the lens surface (10) while the polishing fabric (PF) moves across the lens surface (10) and polishes it.
    Type: Grant
    Filed: January 30, 2001
    Date of Patent: July 8, 2003
    Assignee: Larsen Equipment Design, Inc.
    Inventors: Colin H. Wess, Erik A. Larsen
  • Patent number: 6589105
    Abstract: The present invention describes a chemical mechanical polishing apparatus and method that uses a portion of a polishing pad that is disposed under tension between a supply spool and a receive spool, with a motor providing the tension to either the supply spool or the receive spool and the other spool being locked during processing. If a new section of the polishing pad is needed, the same motor that provided the tension is used to advance the polishing pad a determined amount. Further, during processing, a feedback mechanism is used to ensure that the tension of the polishing pad is consistently maintained.
    Type: Grant
    Filed: April 18, 2002
    Date of Patent: July 8, 2003
    Assignee: Nutool, Inc.
    Inventors: Douglas W. Young, Vulf Perlov, Efrain Velazquez
  • Patent number: 6585563
    Abstract: A substrate polishing scheme (apparatus and method) is described according to which a polishing surface of a polishing sheet is driven in a generally linear direction by a drive mechanism, a surface of a substrate is held against the polishing surface of the polishing sheet by a polishing head, and the substrate is probed through the polishing sheet by a monitoring system.
    Type: Grant
    Filed: November 28, 2000
    Date of Patent: July 1, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Fred C. Redeker, Manoocher Birang, Shijian Li, Sasson Somekh
  • Patent number: 6585576
    Abstract: A rollers' position moving device for a sand belt machine includes a conveyor in the machine, a sand belt, and plural rollers moving the sand belt. The rollers are deposited across on the conveyor. Further, a first wheel and a second wheel are pivotally connected with one side of each roller, and the first and the second wheel have different diameters so as to rotate with different speeds. The rotating speed disparity of the two wheels can make the two wheels move laterally right and left within a preset distance because of an inner projection surface of the two wheels. Then the rollers are rotated and moved laterally right and left by one of the wheels so that sand grinding of the rollers rotating and moving laterally right and left at the same time can grind a work being ground smooth and glossy.
    Type: Grant
    Filed: April 6, 2001
    Date of Patent: July 1, 2003
    Inventor: Bor Yann Chuang
  • Publication number: 20030119432
    Abstract: An material having a polyester fabric base layer, at least one metal layer coated on at least one of two opposite sides of the polyester fabric base layer by chemical plating, and at least one outer abrasive layer of diamond powder or cubic boron nitride bonded to the at least one metal layer by electroplating.
    Type: Application
    Filed: December 20, 2001
    Publication date: June 26, 2003
    Inventor: Fang-Chun Yu
  • Publication number: 20030092366
    Abstract: A tubular workpiece notching machine usable for general grinding operations has a worktable (1) whose base plate (10) is pivotally mounted to the frame (6) of the notching machine around a pivotal orthogonal axis (Y-Y) in such a manner that the worktable (1) is movable from a first working position in which the machine vice (2) co-operates with the shaping pulley (3) in recessing ends of tubular workpiece by grinding, to a second working position in which the shaping pulley (3) is used for generally grinding a workpiece. Connecting means are provided for removably anchoring the base plate (10) of the worktable (1) to the frame (6) in the first working position.
    Type: Application
    Filed: November 14, 2002
    Publication date: May 15, 2003
    Applicant: NEW TECH S.R.L.
    Inventor: Alessandro Caporusso
  • Patent number: 6558234
    Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated polishing pad that is moved over a platen either between or during the planarization cycles, and a support pad that is moved along with the polishing pad. The support pad can be an elongated member that extends between a supply roller and a take-up roller, or can include a continuous member that extends around the spaced apart rollers. The platen can also be movable along with the support pad and can be supported by fluid jets, rollers, or a rotating bladder. Cleaning devices and/or milling devices can treat the surfaces of the polishing pad, the support pad and/or the platen to reduce the likelihood for contaminants to become caught between these components as they engage with each other.
    Type: Grant
    Filed: February 27, 2001
    Date of Patent: May 6, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Michael A. Walker, Karl M. Robinson
  • Publication number: 20030083004
    Abstract: Worktable for an apparatus for grinding recesses A worktable for an apparatus for grinding recesses, having on a frame (3) a pair of pulleys carrying a grinding belt (2), is provided with a sole control member (19) to approach and move apart said workpiece vice (20) with respect to said shaping pulley (1) of said pair of pulleys.
    Type: Application
    Filed: September 11, 2002
    Publication date: May 1, 2003
    Inventor: Alessandro Caporusso
  • Patent number: 6537136
    Abstract: A web-format polishing pad for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies, and methods for making and using such a web-format pad. In one aspect of the invention, a web-format polishing pad for planarizing a microelectronic substrate is made by slicing a cylindrical body of pad material along a cutting line that is at least substantially parallel to a longitudinal centerline of the body and at a radial depth inward from an exterior surface of the body. For example, a web of pad material can be sliced from the body by rotating the cylindrical body about the longitudinal centerline and pressing a cutting element against the rotating cylindrical body along the cutting line. The cutting element can be a knife with a sharp edge positioned at the cutting line and a face extending along a tangent of the cylindrical body.
    Type: Grant
    Filed: August 22, 2000
    Date of Patent: March 25, 2003
    Assignee: Micron Technology, Inc.
    Inventor: David W. Carlson
  • Patent number: 6527629
    Abstract: An apparatus for rounding off edges of openings in a work piece, such as internal openings or cut outs in steel plates. The apparatus includes a belt grinding machine having a continuous grinding belt running over several belt guiding rollers which are provided on a support frame. Two of the rollers are provided on a cradle, that is pivotally supported in the support frame. The grinding belt is, between the rollers on the cradle, disposed for rectilinear working of the work piece, and a device is arranged for operating the cradle in a pendulum like movement about the pivotal support during a grinding operation.
    Type: Grant
    Filed: October 12, 2000
    Date of Patent: March 4, 2003
    Assignee: Grobi AS
    Inventor: Arne Sandvold
  • Patent number: 6520841
    Abstract: A chemical mechanical polishing apparatus has a rotatable platen, a generally linear polishing sheet having an exposed portion extending over a top surface of the platen for polishing the substrate, and a drive mechanism to incrementally advance the polishing sheet in a linear direction across a top surface of the platen by a fixed distance each time the polishing sheet is incremented. The polishing sheet is releasably secured to the platen to rotate with the platen, and it has a width greater than a diameter of the substrate.
    Type: Grant
    Filed: July 6, 2001
    Date of Patent: February 18, 2003
    Assignees: Applied Materials, Inc., Micron Technology, Inc.
    Inventors: Manoocher Birang, Martin Scales, Karl M. Robinson
  • Patent number: 6514130
    Abstract: A method and apparatus for mechanically and/or chemical-mechanically planarizing microelectronic substrates. In one embodiment in accordance with the principles of the present invention, a microelectronic substrate is planarized or polished on a planarizing medium having a thin film and a plurality of micro-features on the film. The film may be an incompressible sheet or web substantially impervious to a planarizing solution, and the micro-features may be configured in a selected pattern on the film to restrain fluid flow of the planarizing solution across the surface of the film under the substrate. The micro-features, for example, may be configured in a selected pattern that has a plurality of support points and at least one cavity to entrap a substantially contiguous, uniform distribution of the solution under the substrate during planarization.
    Type: Grant
    Filed: March 12, 2002
    Date of Patent: February 4, 2003
    Assignee: Micron Technology, Inc.
    Inventor: Scott E. Moore
  • Patent number: 6503131
    Abstract: Generally, a method and apparatus for supporting a web of polishing material. In one embodiment, the apparatus includes a platen and a blocker valve. The platen includes a support surface adapted to support the polishing material and a port fluidly coupled to the support surface. A housing that includes a supply port and an exit port has a venturi body disposed therein. The blocker valve has a first state whereby a flow through the housing and blocker valve causes vacuum to be drawn through the port disposed in the platen by the venturi body. In another embodiment, the flow through the venturi may be reversed by changing the state of the blocker valve to blow air through the port disposed in the platen, thereby placing the polishing material and the support surface of the platen in a spaced-apart relation.
    Type: Grant
    Filed: August 16, 2001
    Date of Patent: January 7, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Timothy J. Franklin, Dan A. Marohl
  • Patent number: 6475075
    Abstract: A hand band sander (10) with a housing (11) that contains a drive (15) for the sanding band (18) comprising a motor (16) with gear (17), which sanding band (18) can be driven in circulating fashion by way of a drive pulley (19) that can be driven in rotary fashion, and preferably by way of a return pulley (20), is smaller, easier to handle, and more reasonably priced due to the fact that the drive pulley (19) is arranged and supported coaxially to the drive (15) and is driven directly by the output of the gear (17).
    Type: Grant
    Filed: September 4, 2001
    Date of Patent: November 5, 2002
    Assignee: Robert Bosch GmbH
    Inventor: Steffen Wuensch
  • Patent number: 6468139
    Abstract: The present invention is directed to methods and apparatus for polishing a surface of a semiconductor wafer using a pad or belt moveable in both forward and reverse directions. In both VLSI and ULSI applications, polishing the wafer surface to complete flatness is highly desirable. The forward and reverse movement of the polishing pad or belt provides superior planarity and uniformity to the surface of the wafer. The wafer surface is pressed against the polishing pad or belt as the pad or belt moves in both forward and reverse directions while polishing the wafer surface. During polishing, the wafer is supported by a wafer housing having novel wafer loading and unloading methods.
    Type: Grant
    Filed: October 6, 2000
    Date of Patent: October 22, 2002
    Assignee: Nutool, Inc.
    Inventors: Homayoun Talieh, Konstantin Volodarsky, Jalal Ashjaee, Douglas W. Young
  • Patent number: 6464571
    Abstract: The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.
    Type: Grant
    Filed: June 12, 2001
    Date of Patent: October 15, 2002
    Assignee: Nutool, Inc.
    Inventors: Homayoun Talieh, Konstantin Volodarsky, Jalal Ashjaee, Douglas W. Young
  • Publication number: 20020146966
    Abstract: A method for optimizing the planarizing length of a polishing pad is disclosed that includes forming a substantially constant network of islands and trenches into a first side of a polishing pad. The trenches are formed to a pre-determined distance apart. The polishing pad is fit to a chemical-mechanical polishing system. A surface layer of a semiconductor wafer is planarized with the first side of the polishing pad. Upon completion of the polishing process, the planarized wafer surface layer is observed. If the wafer surface layer is planarized to an amount outside of a set target polishing range, the distance between the trenches on the first side of the polishing pad is uniformly decreased. The above steps are repeated until the wafer surface layer is planarized to an amount within the set target polishing range.
    Type: Application
    Filed: April 4, 2001
    Publication date: October 10, 2002
    Applicant: Lam Research Corporation
    Inventor: Peter Renteln
  • Publication number: 20020137437
    Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the microelectronic substrate to flow off the polishing pad under the force of gravity. Two such polishing pads can be positioned opposite each other in a vertical orientation and can share either a common platen or a common substrate carrier. The polishing pads can be pre-attached to both a supply roll and a take-up roll to form a cartridge which can be easily removed from the apparatus and replaced with another cartridge.
    Type: Application
    Filed: April 5, 2002
    Publication date: September 26, 2002
    Inventor: Scott E. Moore
  • Publication number: 20020137438
    Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the microelectronic substrate to flow off the polishing pad under the force of gravity. Two such polishing pads can be positioned opposite each other in a vertical orientation and can share either a common platen or a common substrate carrier. The polishing pads can be pre-attached to both a supply roll and a take-up roll to form a cartridge which can be easily removed from the apparatus and replaced with another cartridge.
    Type: Application
    Filed: April 5, 2002
    Publication date: September 26, 2002
    Inventor: Scott E. Moore