Abstract: The present invention comprises a method of chemical-mechanical polishing of a surface on a semiconductor substrate by providing a fixed-abrasive polishing pad; providing a surface to be polished; and providing a chemical polishing solution containing a surface tension-lowering agent that lowers the surface tension of the solution from the nominal surface tension of water to a surface tension that sufficiently wets a hydrophobic surface to be polished such that chemical-mechanical polishing is accomplished. The present invention also comprises pad improvements that mechanically sweep the polishing solution under the pad or that receive polishing solution from the back of the pad such that a tangential and radial shear is placed on the polishing solution as it flows away from the pad.

Abstract: Apparatus for removing random scratches formed during the polishing of magnetic recording media, and for disposing on the surface of the media a near-circumferential texture which increases the recording reliability of the media while simultaneously reducing its failure rate. The present invention teaches the application of a low unit load force to a pad and polishing tape combination in contact with a rotating and oscillating disk surface to completely remove the random scratches previously formed by a polishing step. The apparatus facilitates the application of a specially designed, extremely fine alumina slurry composition without producing similar size circumferential scratches at the high surface speeds.

Abstract: A sheet-shaped grindstone for grinding a workpiece includes a plurality of segments arranged in an appropriate pattern with sufficient spaces therebetween such that the grindstone becomes flexible. The segments are formed in a manner in which metal powder including diamond grinding grains is sintered to form granular chips, the chips are disposed in a die in such a density that the chips come into mutual contact, and gaps around the granular chips are filled with a resin through application of pressure. The grindstone is more flexible at contact points with a workpiece than are conventional vitrified grinding tools. The grindstone can evade collision of the segments with the workpiece and can grind a curved surface of the workpiece through smooth contact therewith.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated polishing pad that is moved over a platen either between or during the planarization cycles, and a support pad that is moved along with the polishing pad. The support pad can be an elongated member that extends between a supply roller and a take-up roller, or can include a continuous member that extends around the spaced apart rollers. The platen can also be movable along with the support pad and can be supported by fluid jets, rollers, or a rotating bladder. Cleaning devices and/or milling devices can treat the surfaces of the polishing pad, the support pad and/or the platen to reduce the likelihood for contaminants to become caught between these components as they engage with each other.

Abstract: The wafer edge processing unit may be a stand alone unit or may be incorporated in existing grinding machines. The processing unit employs a plurality of tapes which are coated with differing grades of grit to sequentially polish the edge of a rotating wafer or to remove an edge bead from a processed wafer or the other substrate. The tapes are mounted on a backing block which is rotated to move the tapes from a line contact with the top bevel of the wafer to a line contact with the bottom bevel of the wafer. Fresh surfaces of the tapes are presented to successive wafers by rotating the spools on which the tapes are mounted. The wafer may be moved in small increments along a Y-axis and/or an X-axis relative to a tape during polishing to improve the polishing operation.

Abstract: An apparatus and method for abrasively processing an article involves the use of an abrasive product provided with a machine discernable pattern representative of information of varying types. The pattern is read while the abrasive product moves relative to the article, and is used to control the movement of the abrasive product relative to the article. The pattern may include one or more of a machine discernable electrical characteristic, optical characteristic, topographic characteristic or magnetic characteristic. Reading the pattern may involve one or more of electrically, optically, mechanically or magnetically reading the machine discernable pattern provided on the abrasive product. The pattern may include one or more of indicia, protrusions, depressions, holes, voids, color or pigment variations, bar codes, magnetic transitions or periodic markings. The pattern may include one or more of indexing information, servo information, alignment information or abrasive product identification information.

Abstract: A method and apparatus for supporting, cleaning and/or drying a polishing pad used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a cleaning head positioned adjacent a post-operative portion of the polishing pad to clean and/or dry the rear surface of the polishing pad. The cleaning head can include a heat source, a mechanical contact element, and/or orifices that direct fluid and/or gas toward the rear surface. The apparatus can further include a vessel through which the rear surface of the polishing pad passes to clean the rear surface. The apparatus can also include a flow passage in fluid communication with a region between the polishing pad and a support pad upon which the polishing pad rests during planarization. Gas moves through the flow passage toward or away from an interface region between the polishing pad and the support pad to draw the polishing pad toward or away from the support pad.

Abstract: A polishing belt is made from a woven base layer with a matte affixed thereon. The matte includes a plurality of batting fibers with abrasives. These abrasives are permanently mounted on the batting fibers. The abrasives can include abrasive particles impregnated or securely bonded to the shafts of the fibers. Alternatively, wool fibers can be used. These wool fibers can have spaced ridges along the shafts of the fibers. Otherwise, edges of the fibers themselves can be used as an abrasive. The fibers with such edges can have a triangular or star shape in cross section whereby the edges are formed. These edges will act as the abrasive. With this belt, it is possible to polish paper. The paper is passed by the polishing belt. The paper will move at a first speed and the polishing belt will move at a different second speed. The abrasives on the fibers of the polishing belt will abrade the surface of the paper.

Abstract: A chemical mechanical polishing apparatus has a first polishing sheet movable in a first linear direction, and a second polishing sheet movable in a second linear direction. The first and second polishing sheets are positioned in a parallel and coplanar arrangement to contact a surface of a substrate during polishing.

Abstract: Methods for predicting polishing characteristics of polishing pads in mechanical or chemical-mechanical planarization of microelectronic substrate assemblies, and methods and machines for planarizing microelectronic substrate assemblies. One embodiment of a method in accordance with the invention includes ascertaining a surface parameter of a bearing surface of at least one raised feature projecting from a base portion of a raised feature polishing pad. The raised feature, for example, can be a pyramidal structure having a first cross-sectional area at the base portion of the pad and a second cross-sectional area at the bearing surface. The first cross-sectional area is generally greater than the second cross-sectional area. To ascertain the surface parameter of the bearing surface, one particular embodiment of the invention involves determining an indication of the surface area of the bearing surface.

Abstract: A tool for the linear polishing of substrates includes an endless belt of continuous strength wrapped substantially as a helix of predetermined length and width with a 180 degree twist along the length to increase by a factor of 2× the time interval between which belt changes need to be made because of wear-and-tear, significantly reducing the costs associated with the polishing because of reduced down time. In a preferred embodiment for the chemical-mechanical polishing of silicon wafer substrates used in fabricating integrated circuits, the endless belt is constructed as a Mobius strip of a rubberized, urethane composition to be flexible, but yet strong enough to withstand the applied pressure between the polishing belt and the substrate.

Abstract: An apparatus for repositioning and forming a power transmission belt. The apparatus has first and second hangers for supporting a plurality of power transmission belts and movable selectively between active and inactive positions. Each of the first and second hangers has a storage portion and a standby portion. At least one shifting mechanism is operable to move a power transmission belt from the storage portion to the standby portion on each of the first and second hangers. A first belt running unit has a first pulley around which a power transmission belt can be placed. The first belt running unit is movable selectively between a processing position and an attaching/detaching position. A second belt running unit has a second pulley around which a power transmission belt can be placed. The second belt running unit is movable selectively between a processing position and an attaching/detaching position.

Abstract: A continuous pad feeding method for chemical-mechanical polishing (CMP) is described, which method is suitable for use in a CMP apparatus. The CMP apparatus includes a first polishing belt having two terminals, which first polishing belt serves as a plurality of polishing pads. A second polishing belt having two terminals is provided on the first polishing belt. One of the terminals of the second polishing belt is adhered to one of the terminals of the first polishing belt.

Abstract: Endpointing devices, planarizing machines with endpointing devices, and methods for endpointing mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies. One endpointing apparatus in accordance with the invention includes a primary support member for supporting either a polishing pad or a substrate assembly, and a secondary support member coupled to the primary support member. The primary support member is movable with respect to the secondary support member in a lateral motion at least generally parallel to the planarizing plane in correspondence to the drag forces between the substrate assembly and the polishing pad. The endpointing apparatus also includes a force detector attached to at least one of the primary and secondary support members at a force detector site that can have a contact surface transverse to the planarizing plane.

Abstract: The invention relates to a lubrication device in a vertically functioning bread slicer having several blade bands (3), next to each other and a predetermined width of bread slice apart, continuously circulating crosswise around blade band rollers (2). Both sides of the blade bands (3) have a horizontal lubricating roller (6, 7) with an oil-impregnated felt envelope (63, 73) which lubricates the cutting surfaces (30) of the blade bands (3). At least one of the two lubricating rollers (6, 7) can pivot around a horizontal pivoting axis (6S) to a position (P1) a distance apart from the blade bands (3), the two lubrication rollers (6, 7) can each be displaced by a given length (A) lengthwise along the rollers (L) in relation to the band blades (3).

Abstract: A substrate polishing scheme (apparatus and method) is described according to which a polishing surface of a polishing sheet is driven in a generally linear direction by a drive mechanism, a surface of a substrate is held against the polishing surface of the polishing sheet by a polishing head, and the substrate is probed through the polishing sheet by a monitoring system.

Abstract: There is provided a method and an apparatus for improving surface roughness of tooth surfaces of an external-tooth gear (W), and thereby reducing the occurrence of noises associated with the meshing between teeth. In accordance with the method, teeth of the external-tooth gear (W) are polished by rotating teeth of the external-tooth gear (W) relative to a film polishing member (110) in the tooth profile direction, and simultaneously by oscillating the external-tooth gear (W) in the tooth trace direction, while pressing the film polishing member (110) against tooth surfaces of the external-tooth gear W by backing up with a shoe (120).

Abstract: An apparatus and a method for shaping a rotationally-symmetrical surface in a material, where the material is rotated about an axis and a rotating element is placed in contact with the rotating material. The rotating element is provided with a symmetrical, coherent shaping edge, or is provided with such an edge at one end, or as an alternative, is a shaping head which travels around a symmetrical, coherent contour. The axis of rotation of the rotating element is then placed at an angle to the axis of rotation of the material and, during shaping, a force is exerted on the rotating element such that the shaping edge or the shaping head is held in contact with the material and such that the lateral position of the shaping edge or the contour around which the rotating element travels in operation remains approximately constant with respect to the material. The shaping edge/contour has an acircular shape and the orientation thereof is kept approximately constant with respect to the material during shaping.

Abstract: Apparatus for removing random scratches formed during the polishing of magnetic recording media, and for disposing on the surface of the media a near-circumferential texture which increases the recording reliability of the media while simultaneously reducing its failure rate. The present invention teaches the application of a low unit load force to a pad and polishing tape combination in contact with a rotating and oscillating disk surface to completely remove the random scratches previously formed by a polishing step. The apparatus facilitates the application of a specially designed, extremely fine alumina slurry composition without producing similar size circumferential scratches at the high surface speeds.

Abstract: The present invention relates to an apparatus and method of Chemical Mechanical Planarization ("CMP") for wafer, flat panel display (FPD), and hard drive disk (HDD). The preferred apparatus comprises a looped belt spatially oriented in a vertical direction with respect to a ground floor. A polishing pad is glued to an outer surface of the belt. At an inner surface of the belt, there are a plurality of wafer supports to support the wafers while they are in polishing process. Wafers are loaded from a wafer station to a wafer head using a handling structure before polishing and are unloaded from the wafer head to the wafer station after polishing. An electric motor or equivalent is used to drive the looped belt running over two pulleys. An adjustment means is used to adjust the tension and position of the belt for smooth running. This new CMP machine can be mounted in multiple orientations to save manufacturing space.

Abstract: A grinding device includes a grinding member disposed on a base, and a board rotatably supported in the base at a shaft. An axle is rotatably secured in the board for supporting the tools. A spring is coupled between the base and the board for moving the axle and thus the tools toward the grinding member and for allowing the tools to be ground by the grinding member. The grinding member is rotated to grind the tools. A rack is coupled to the axle to rotate the tools for allowing the peripheral portion of the tools to be ground by the grinding member.

Abstract: For conveying in single file and in a lying position substantially cylindrical objects such as nuclear fuel pellets (P) in a substantially horizontal, non-linear path, a conveying system (20) is proposed, which comprises an endless belt (26) running over pulleys having substantially vertical axes. Regulatable guides (44) maintain the objects laterally on the upper edge (30) of the endless belt (26).

Abstract: A deburring machine having a work table with a side guide mounted thereto so as to define a first work zone for the lower peripheral edge of the cylindrical workpiece. A continuous elongated belt having an abrasive surface is mounted to the work table so as to engage the lower edge of the workpiece in the first work zone. A second side guide is spaced vertically from the work table in parallel alignment with the first side guide in conjunction with an overhead guide that engages the upper circular surface of the workpiece. The overhead guide and second side guide define a second work zone substantially in alignment with the first work zone, and a second continuous elongated abrasive belt engages the upper peripheral edge of the workpiece in the second work zone.

Abstract: Method for removing random scratches formed during the polishing of magnetic recording media, and for disposing on the surface of the media a near-circumferential texture which increases the recording reliability of the media while simultaneously reducing its failure rate. The present invention teaches the application of a low unit load force to a large surface pad and polishing tape combination while in contact with a rotating disk surface that is also moving in a circumferential direction to completely remove the random scratches previously formed by a polishing step. The scratches are removed with the aid of a specially designed, extremely fine alumina slurry composition which prevent producing similar size circumferential scratches at the high surface speeds. The methodology provides for a smoother disk surface than prior known super-polish/texture methodologies.

Abstract: An improved method and device for performing setup and adjustment of pressure shoes used in an abrasive finishing machine. The setup of the pressure shoe stop limit device is performed automatically and remotely. The stop limit is hydraulically locked in place and limits subsequent shoe rotation. This automatically positionable travel limit stop takes into account the natural spring of the various machine components, including the innate springiness of the surfacing head elastic covering which wears and deforms over time. The pressure shoe is adjusted relative to the surfacing head, and accounts for the undefinable characteristics of the overall machine.

Abstract: A machine for polishing railway vehicle wheel axles comprising a U-shaped basic structure with a cradle form, on the vertical double walls of which are arranged a pair of support rollers for the respective wheels of a railway axle. A driving assembly having a pair of support arms for abrasive belts is disposed on the intermediate horizontal wall of said cradle and said arms being selective and intermittently displaced from one side to the other between the gap defined by the vertical double walls and selective and vertically displaced upwards between the intermediate horizontal wall of the cradle. The axle to be milled is kept on a horizontal plan in view of the action of the wheels.

Abstract: A sheet-shaped grindstone for grinding a workpiece includes a plurality of segments arranged in an appropriate pattern with sufficient spaces therebetween such that the grindstone becomes flexible. The segments are formed in a manner in which metal powder including diamond grinding grains is sintered to form granular chips, the chips are disposed in a die in such a density that the chips come into mutual contact, and gaps around the granular chips are filled with a resin through application of pressure. The grindstone is more flexible at contact points with a workpiece than are conventional vitrified grinding tools. The grindstone can evade collision of the segments with the workpiece and can grind a curved surface of the workpiece through smooth contact therewith.

Abstract: An abrading machine has an indexing tool carrier for indexing a plurality of tools such as abrading belts, through plural stations including a single power station and other, unpowered idle stations. Hence the abrading machine provides the user with the option of sharpening a workpiece such as a wood chisel, knife or gouge and the like, on any of the given belts according to the user's selection. The abrading machine provides the economy of a single motor to power any of the given belts which at the time are indexed in the power station position. The other belts which are not indexed in the power station position sit idle. However, these other belts remain available for indexing into the power station position whenever the user wishes to work the workpiece on those belts.

Abstract: A chemical-mechanical polishing station having a belt-operated conditioner. The belt-operated conditioner comprises a longitudinal main body, a belt sprinkled with hard particles, and a plurality of rollers. The belt wraps around the external edge of the longitudinal main body and is capable of rotating at a constant speed. The axles of the roller are parallel to each other. Furthermore, all the rollers are positioned within but touching the belt. Consequently, the rollers can rotate when they are driven by the belt. The hard particles sprinkled along the belt are used for scouring the polishing pad so that polishing pad surface can be reconditioned and any residual impurity particles can be removed. The belt-operated conditioner further includes a cleaning device. The cleaning device is used for removing any impurity particles clinging onto the belt when the conditioner is in operation.

Abstract: The present invention relates to an apparatus and method of Chemical Mechanical Planarization ("CMP") for wafer, flat panel display (FPD), and hard drive disk (HDD). The preferred apparatus comprises a looped belt spatially oriented in a vertical direction with respect to a ground floor. A polishing pad is glued to an outer surface of the belt. At an inner surface of the belt, there are a plurality of wafer supports to support the wafers while they are in polishing process. Wafers are loaded from a wafer station to a wafer head using a handling structure before polishing and are unloaded from the wafer head to the wafer station after polishing. An electric motor or equivalent is used to drive the looped belt running over two pulleys. An adjustment means is used to adjust the tension and position of the belt for smooth running. This new CMP machine can be mounted in multiple orientations to save manufacturing space.

Abstract: A panel sanding machine comprises an abrasive belt and a pad mounted by the machine in such a way that it rotates in orbital fashion around an axis transverse to the plane in which the panels lie and presses the abrasive belt against the panel being machined. The abrasive belt is supported by the pad in such a way that it can slide on the latter in a direction parallel to the panel being machined. The machine also includes a feature for alternately allowing and preventing the sliding of the abrasive belt relative to the pad in two working conditions, of which the first allows the belt to slide so as to change the part of it that is in contact with the panel being worked, and the second locks the belt to the pad so that the panels can be sanded.

Abstract: An apparatus for abrading or deburring a workpiece is provided and includes in combination a conveyor for moving the workpiece from a first position to a second position and at least two assemblies intermediate the first and second positions and opposite the conveyor for abrading one side of the workpiece in a plurality of directions. In an alternate embodiment of the invention, a third assembly may be provided which deburrs an opposite side of the workpiece as it is passed through the deburring assembly. The conveyor for moving the workpiece positively fixes the location of the workpiece with respect to the conveyor and translates the workpiece through the deburring assembly.

Abstract: The present invention includes a multiple abrasive belt apparatus in which endless abrasive belts are movable in a circuitous manner. Discrete belt assemblies each including an abrasive belt are mounted on a support structure and a single motor is used to run all of the discrete belt assemblies. A jack shaft is operatively connected to the motor by a first drive belt, and then in turn is operatively connected to first and second drive shafts by second and third drive belts. The first and second drive shafts are operatively connected, each to two discrete belt assemblies such that motive force is transferred from a single motor to four discrete belt assemblies.

Abstract: A wafer polishing apparatus includes a module frame; a continuous belt rotatable with respect to the frame, the belt having at least one vertically-oriented belt transverse portion including a polishing pad assembly; and at least one pivotable wafer-holding head drive within the frame and having a distal end portion movable to a vertical first position parallel and juxtaposed to the belt transverse portion. The head drive includes a wafer carrier for holding a wafer on the distal end portion of the head drive, while a drive moves the distal end portion and a held wafer into a vertical polishing position abutting the belt transverse portion and pressure is applied to the held-wafer against the polishing pad assembly while the wafer-holding distal end portion is rotated and swept side-by-side. After polishing the drive is reversed and the head drive is pivoted away from the belt transverse portion to a horizontal or other orientation and the then polished wafer removed.

Abstract: The invention relates to grinding belts and polishing belts, which are particularly suitable for processing enclosed constructions, since they can be re-sealed by simple means and manner after severing to form a ring-shaped endless belt.

Abstract: A pressure bar for a belt grinding machine includes an elongated carrier (10) with a base plate (12) facing the grinding belt (20) and having a plurality of bores arranged in a matrix pattern, in which bores axially freely movable bolt-shaped pressure members (16) are held. The pressure members have free ends for engagement with the grinding belt (20). A plurality of positioning devices (26) are arranged next to one another in the longitudinal direction of the carrier (10) with each having a ram adjustable perpendicularly to the base plate (12) to groupwise position the pressure members (16) in their bores. Between the ends of the pressure members (16) remote from the grinding belt (20) and the rams (28) of the positioning devices (26) is arranged an elastic lamina (22) common to all of the pressure members and extending parallel to the longitudinal direction of the carrier.

Abstract: An adjustment plate (10) is used for holding a fixture plate (12) adjustably on a grinder table (14). The adjustment plate (10) includes a shoulder bolt (30) that passes through the fixture plate (12) and threadably engages the adjustment plate (10). The adjustment plate (10) further includes a toggle bolt assembly (50) attached to the base of the adjustment plate to engage the fixture plate (12). The shoulder bolt (30) and the toggle bolt (50) allow the fixture plate (12) to be adjusted about the vertical axis of the adjustment plate (10). The adjustment plate (10) further includes a clamp (32) that is used to clamp the fixture plate (12) to the adjustment plate (10) when the fixture plate (12) is properly positioned. The adjustment plate (10) is attached to the grinder table (14) by a plurality of T-bolts (64) slidably received in T-bolt holes (70) in adjustment plate (10). A plurality of set screws (80) are threadably received in adjustment plate (10) and each engage the grinder table (14).

Abstract: A superfinishing apparatus has an abrasive film feed mechanism for feeding out and winding up an abrasive film (4). The apparatus includes a backup roll (2) for pressing and vibrating the film against a workpiece. A guide member (3) is provided for the film feed mechanism immediately before the backup roll (2). The guide member has two pairs of helical grooves (11, 12) and (13, 14) arranged opposite in turning direction to each other. The helical grooves are different in radius from the center from each other and are provided on both side faces of the guide member. Also, when the film has passed through the helical grooves (11 and 13 or 12 and 14), its traveling path is translated transversely of the guide member.

Abstract: A technique for controlling a polishing rate across a substrate surface when performing CMP, in order to obtain uniform polishing of the substrate surface. A support housing which underlies a polishing pad includes a plurality of openings for dispensing a pressurized fluid. The openings are arranged into a pre-configured pattern for dispensing the fluid to the underside of the pad opposite the substrate surface being polished. The openings are configured into a number of groupings, in which a separate channel is used for each grouping so that fluid pressure for each group of openings can be separately and independently controlled.

Abstract: The surface of a fingernail is efficiently and uniformly ground by a grinder having an endless grinding belt that is adjustably supported between a rotating wheel mounted on a follower axle and a connecting portion of a driving axle carried by a connecting seat. The driving axle is rotated by a round axle disposed within a hollow pipe and rotated by a driving unit.

Abstract: A cob cutter blade honing device which hones the convex and concave sides of a cob cutter blade in a single process is provided. A cob cutter blade to be sharpened is placed into a mounting bracket found at the top of a vertical spindle. Manipulation of an operator control means causes a vertical shaft to engage the hole of the cob cutter blade, aligning it against a locator surface. A locking mechanism then locks the blade into position. Further manipulation of the operator control means rotates the spindle from the alignment and locking position into the honing position. Once in this position, further manipulation of the operator control means causes a movement of the spindle about its vertical axis. As the spindle rotates, a grinding belt engages the convex surface of the cob cutter blade thereby sharpening it and cutting an appropriate toe-to-heel angle. Further rotation of the spindle moves the blade into position in front of a honing stone.

Abstract: A method of automatically polishing a semiconductor wafer having a substrate and a surface film. A wafer mounting device, which may include a vacuum chuck, holds the semiconductor wafer without requiring that the wafer have a central aperture. The mounting device and wafer are moved with an orbit-within-an-orbit motion while a tape transport mechanism applies an abrasive polishing tape to the surface film of the moving wafer to polish one surface of the wafer to a flatness of less than two microns. The polishing tape passes arcuately around a roller and passes between the roller and the surface film and contacts the surface film in a line running across the width of the tape. The system determines the thickness of the wafer surface film during the polishing process with a real time measurement device such as an effipsometer, or by determining a work-performed factor and calculating an estimated film thickness from the work-performed factor.

Abstract: A metal abrasive belt is used to grind, debur, sand, cut, finish or otherwise abrade a workpiece. The metal abrasive belt includes a continuous metal belt and abrasive particles electroplated onto at least a portion of an outer surface of the continuous metal belt. The abrasive particles are electroplated by electrochemically depositing an electroplating matrix, such as a Nickel matrix, in the presence of abrasive particles, such as diamond or Cubic Boron Nitride particles. The abrasive particles can be electroplated to form selected abrasive and non-abrasive regions on the continuous metal member, for example, by masking selected regions of the continuous metal belt. One embodiment of the metal abrasive belt includes one or more perforations extending through the continuous metal belt. The perforations facilitate cooling and allow swarf to pass through the continuous metal belt while abrading a workpiece.

Abstract: A moveable device for finishing surfaces, in particular curved vertical surfaces. The device includes a moveable support structure for supporting a finishing apparatus, rollers and a motor for moving the device, and a finishing apparatus.

Abstract: The invention relates to a diamond belt for cutting stones, like marble, granite, and others, generally used as an endless, that is continuous, belt, and characterized in that it has a flexible core, consisting of one or more cables (1), there being provided, slipped thereon through bores (2), rigid segments (3), generally made of metal, which are spaced and connected both to each other and to the flexible core (1), by incorporation in a flexible material, such as rubber or plastic, which forms the body (4) of the belt, filling the bores (2) of the rigid segments (3) and the intervals between them, and eventually covering the segments at least partially, the said segments (3) being provided with diamond surfaces, which project slightly above the body (4) of the belt, at least on its active front surface, facing the stone to be cut. Preferably, the diamond surface of each rigid segment (3) of the belt consists of a corresponding sintered diamond element, applied on the body of the rigid segment (3).

Abstract: The cutting wire consists of a wire rope (4) with cutting beads (6) affixed thereto that contain bonded superabrasives such as diamond and a cutting wire connector which connects the cutting wire to produce an endless wire loop for use in a wire sawing machine. The cutting wire connector consists of a double joint which has two joint axes intersecting each other at an angle of 90.degree.. The cutting wire connector consists of two forks (1) at the wire ends (4), an intermediate part (2) and two joint pins (3) which connect each form (1) with the intermediate part (2) in such a way that the connection can be opened easily. The cutting wire connected by means of the joint connector has a long service life while exhibiting increased cutting performance and increased utilization of the operating time of the facilities.

Abstract: An abrasive tape having an abrasive layer primarily containing abrasive grains and a binder and formed on a flexible substrate and a member to be cleaned are fed in substantially opposite directions with the abrasive layer and a surface of the member kept in contact with each other with the ratio of the feed rate of the member to the feed rate of the abrasive tape kept not higher than 1/1.

Abstract: A pulley block is provided for rope storage to receive reserve cable or rope in a rope saw machine (3). The saw rope (1) is slung around the deflecting rollers of a stationary roller carrier and of a movable roller carrier (5,6) mounted on a frame (4). Two hydraulic motors drive the saw rope (1). A chain hoist (9) driven by a motor (10) moves the vertically ajustable roller carrier (6). By winding the saw rope (1) in different ways over additional rollers (22, 24, 26) various rope storage capacities are obtained. This design allows the free rope loop to be stored in a particularly space-saving manner.

Abstract: A system and method for chemically and mechanically polishing a semiconductor wafer having a substrate and a surface film. A wafer mounting device, which may include a vacuum chuck, holds the semiconductor wafer without requiring that the wafer have a central aperture. The mounting device and wafer are moved with an orbit-within-an-orbit motion while a tape transport mechanism applies an abrasive polishing tape to the surface film of the moving wafer to polish one surface of the wafer to a flatness of less than two microns. The system determines the thickness of the wafer surface film during the polishing process with a real time measurement device such as an ellipsometer, or by determining a work-performed factor and calculating an estimated film thickness from the work-performed factor. Finally, the system automatically controls the polishing process to stop polishing the semiconductor wafer when the wafer surface film achieves a predefined planarization.

Abstract: A manicure device which is well suited for filing or buffing the convex top surfaces and the outer convex edges of fingernails and toenails includes a flexible, textured belt disposed in a cartridge which is detachably secured to a housing containing a high speed electric motor. The casing includes bearings over which the belt passes when the device is being used, and a belt opening which exposes a portion of the textured surface of the belt so that a fingernail can be pressed thereto. The machine allows the belt to be pressed against a convex surface or edge of a fingernail or toenail, so that the belt will conform to the convex shape thereof and provide uniformly smooth filing or buffing. The cartridges are relatively inexpensive and easily replaced, which facilitates and promotes replacement of the cartridge whenever the machine is being used to file or buff the fingernails or toenails of a different person, whereby better hygiene is achieved.