Presser Or Former Patents (Class 451/303)
  • Patent number: 6988934
    Abstract: An apparatus for use in a chemical mechanical planarization (CMP) system is provided. The apparatus includes a platen capable of introducing fluid beneath a polishing pad and a platen support cover configured to surround the platen. The platen is disposed at a first level and the platen support cover is disposed at a second level, the first level being lower relative to the second level. Both the platen and the platen support cover are configured to be disposed below the polishing pad such that the polishing pad is closer to the second level than the first level. The platen support cover has a width at the second level that is substantially equal around the platen. An apparatus and method for controlling pressure beneath a polishing pad is also provided.
    Type: Grant
    Filed: September 29, 2003
    Date of Patent: January 24, 2006
    Assignee: Lam Research Corporation
    Inventors: Gregory C. Lee, Simon McClatchie, John M. Boyd
  • Patent number: 6976906
    Abstract: A chemical mechanical planarization (CMP) system is provided. The system includes a polishing surface and a platen disposed along an underside of the polishing surface. A retaining ring surrounds the platen. The retaining ring includes a lower annular sleeve and an upper annular sleeve moveably disposed over the lower annular sleeve. A method for reducing a consumption of compressed dry air (CDA) during a chemical mechanical planarization (CMP) operation is also described.
    Type: Grant
    Filed: October 7, 2003
    Date of Patent: December 20, 2005
    Assignee: Lam Research Corporation
    Inventors: John M. Boyd, David Wei, Yehiel Gotkis
  • Patent number: 6951511
    Abstract: Generally, a method and apparatus for supporting a web of polishing material. In one embodiment, the apparatus includes a platen adapted to support the web, a frame assembly, and one or more flexures coupled between the platen and the frame assembly. The flexure allows the frame assembly to be moved in relation to the platen. When the frame assembly is in an extended position relative to the platen, the web is placed in a spaced-apart relation to the platen.
    Type: Grant
    Filed: October 17, 2002
    Date of Patent: October 4, 2005
    Assignee: Applied Materials Inc.
    Inventors: Jayakumar Gurusamy, Gee Sun Hoey, Lawrence M. Rosenberg
  • Patent number: 6926589
    Abstract: The present invention relates to methods and apparatus that allow for chemical mechanical polishing using a flexible pad and variable fluid flow for variable polishing.
    Type: Grant
    Filed: March 22, 2002
    Date of Patent: August 9, 2005
    Assignee: ASM Nutool, Inc.
    Inventors: Douglas W. Young, Brett E. McGrath, Yuchun Wang
  • Patent number: 6913521
    Abstract: An invention improves edge performance in chemical mechanical polishing processes. A method operation provides a wafer head above a wafer. The wafer head includes a first active retaining ring capable of extension and retraction. Another operation provides a polishing belt below the wafer head, and provides below the polishing belt a platen having a second active retaining ring capable of extension and retraction. Another operation controls positions of the first active retaining ring and the second active retaining ring to provide positional control for the polishing belt, thus adjusting and controlling the removal rate at the edge of the wafer.
    Type: Grant
    Filed: June 22, 2004
    Date of Patent: July 5, 2005
    Assignee: Lam Research Corporation
    Inventors: Alek Owczarz, John Boyd, Rod Kistler
  • Patent number: 6908369
    Abstract: An apparatus for smoothing a surface of a rotatably supported substrate includes a base plate, a block having an extending arm structure and being attached to the base plate so as to be movable along the surface of the base plate, a roller attached to a tip portion of the arm structure in a direction perpendicular to the base plate, a mobile member attached to the arm structure so as to be movable perpendicularly to the axial direction of the roller, a tape-running device attached to the base plate for feeding and taking up a polishing tape through the roller so as to advance the tape around the mobile member, and a moving device attached to the arm structure of the block for moving the mobile member.
    Type: Grant
    Filed: July 9, 2003
    Date of Patent: June 21, 2005
    Assignee: NIHON Microcoating Co., Ltd.
    Inventor: Tetsujiro Tada
  • Patent number: 6893329
    Abstract: An abrasive tape is supplied to a tape head by a tape supply unit and taken up from the tape head by a tape take-up unit. The tape head presses the abrasive tape against a surface of an object under polish, which is rotated by a rotating unit. A tape head pressuring unit utilizes a voice coil motor, for example. Since the tape head pressuring unit generates a pressuring force for pressuring the tape head using the electromagnetic force, it is able to set a minute pressuring force by controlling a drive signal, and to obtain the fine adjustment of the pressuring force easily by controlling the electric signal. Therefore, it becomes possible to press the abrasive tape against the surface of the object under polish with a desired low pressure.
    Type: Grant
    Filed: September 5, 2003
    Date of Patent: May 17, 2005
    Assignee: Hitachi High-Tech Electronics Engineering Co., Ltd.
    Inventors: Fujio Tajima, Hideaki Amano, Teruaki Tokutomi, Takahisa Ishida, Kazuyuki Sonobe, Yasunori Fukuyama, Tsutomu Nagakura, Noritake Shizawa, Takeshi Sato
  • Patent number: 6869341
    Abstract: A single-sided finishing apparatus is provided having a plurality of finishing stations with rotating transfer stations positioned therebetween. A hold down system presents the edge of the workpiece to the finishing head. The rotating transfer station includes a clamp for grasping a leading corner of a workpiece while rollers continue to drive the workpiece forward, thereby rotating the workpiece 90°.
    Type: Grant
    Filed: June 19, 2002
    Date of Patent: March 22, 2005
    Assignee: Glassline Corporation
    Inventors: Mark Opfer, Brad Borkosky, John Harkness
  • Patent number: 6863601
    Abstract: A sand-belt finishing machine includes a main frame, at least one grinding device, a conveyor platform mounted between the grinding device and the main frame, and a lift device mounted between the conveyor platform and the main frame for adjusting the position of the conveyor platform. The lift device includes a propeller shaft, a shaft, a support plate, a driving rod, and a slide rod. Thus, the distance between the grinding devices and the conveyor platform can be adjusted arbitrarily by the lift device, so that the grinding devices can be used to grind workpieces of different thickness.
    Type: Grant
    Filed: October 6, 2003
    Date of Patent: March 8, 2005
    Inventor: Wang Tien Wang
  • Patent number: 6837779
    Abstract: A chemical mechanical polishing apparatus has a substrate holder, a polishing belt, and a backing member positioned on a side of the polishing belt opposite the substrate holder. The polishing belt has a polishing surface to contact at least a portion of the substrate held by the substrate holder. The polishing belt is movable in a first direction in a generally linear path relative to the substrate. The polishing belt has a plurality of grooves formed therein.
    Type: Grant
    Filed: May 7, 2001
    Date of Patent: January 4, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Christopher W. Smith, John M. White
  • Patent number: 6837774
    Abstract: A linear chemical mechanical polishing apparatus that is equipped with a programmable pneumatic support platen and a method for controlling the polishing profile on a wafer surface during a linear CMP process are disclosed. The programmable pneumatic support platen is positioned juxtaposed to a bottom surface of a continuous belt for the linear CMP apparatus and positioned corresponding to a position of the wafer carrier so as to force the polishing pad against the wafer surface to be polished. The support platen has a predetermined thickness, a plurality of apertures through the thickness and a plurality of openings in a top surface in fluid communication with a gas source through the plurality of apertures.
    Type: Grant
    Filed: March 28, 2001
    Date of Patent: January 4, 2005
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Tien-Chen Hu, Jih-Churng Twu
  • Publication number: 20040242136
    Abstract: An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt. At least one of the rings extends beyond an outer edge of a wafer to be planarized by the CMP belt. A support is attached with the platen and has a plurality of air ports for pressurized air to pass to the rings of the platen. A gasket is positioned between the support and the platen and has a plurality of cutouts that align with the openings and the air ports. A base is also included and supports the support.
    Type: Application
    Filed: June 25, 2004
    Publication date: December 2, 2004
    Applicant: Lam Research Corporation
    Inventors: Anthony de la Llera, Xuyen Pham, Cangshan Xu, David Wei, Tony Luong
  • Patent number: 6808442
    Abstract: An invention is provided for removal rate profile manipulation during a CMP process. An apparatus of the embodiments of the present invention includes an actuator capable of vertical movement perpendicular to a polishing surface of a polishing pad. The actuator is further capable of flexing the polishing pad independently of a pad support device. Also included in the apparatus is an actuator control mechanism that is in communication with the actuator. The actuator control mechanism is capable of controlling an amount of vertical movement of the actuator, allowing the actuator to provide local flexing of the polishing pad to achieve a particular removal rate profile. The actuator can also be capable of horizontal movement parallel to the polishing surface of the polishing pad.
    Type: Grant
    Filed: December 20, 2001
    Date of Patent: October 26, 2004
    Assignee: Lam Research Corporation
    Inventors: David Wei, Yehiel Gotkis, Aleksander Owczarz, John M. Boyd, Rod Kistler
  • Patent number: 6786805
    Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the microelectronic substrate to flow off the polishing pad under the force of gravity. Two such polishing pads can be positioned opposite each other in a vertical orientation and can share either a common platen or a common substrate carrier. The polishing pads can be pre-attached to both a supply roll and a take-up roll to form a cartridge which can be easily removed from the apparatus and replaced with another cartridge.
    Type: Grant
    Filed: August 14, 2001
    Date of Patent: September 7, 2004
    Assignee: Micron Technology, Inc.
    Inventor: Scott E. Moore
  • Patent number: 6776695
    Abstract: An invention is disclosed for improving edge performance in a chemical mechanical polishing process is disclosed. The system includes a wafer head disposed above a wafer, where the wafer head includes a first active retaining ring capable of extension and retraction. Below the wafer head is a polishing belt, and disposed below the polishing belt is a platen having a second active retaining ring capable of extension and retraction. During operation the first active retaining ring and the second active retaining ring can be controlled to provide positional control for the polishing belt, thus adjusting and controlling the removal rate at the edge of the wafer.
    Type: Grant
    Filed: December 21, 2000
    Date of Patent: August 17, 2004
    Assignee: Lam Research Corporation
    Inventors: Alek Owczarz, John Boyd, Rod Kistler
  • Patent number: 6769974
    Abstract: A sand-belt finishing machine having a sand-belt replacement mechanism includes a support rack, a first roller, a second roller, an upright rod, an elastic member, a sand belt, and a pull lever. When the upright rod is moved by the pull lever to compress the elastic member, the distance between the first roller and the second roller is shortened. When the upright rod is released by the pull lever, the upright rod is returned to its original position by the elastic member, so that the distance between the first roller and the second roller is increased. Thus, the sand belt can be mounted on and detached from the first roller and the second roller rapidly, easily and conveniently, thereby facilitating the user replacing the sand belt.
    Type: Grant
    Filed: November 1, 2002
    Date of Patent: August 3, 2004
    Inventor: Wang Tien Wang
  • Publication number: 20040147207
    Abstract: The invention relates to a method for improving wear and tear on support bodies (54) for plates or grinding belts in large-scale grinders (1). The support body (54) has a base body (18), onto which an abrasion-resistant primary layer of at least 0.3 mm thickness is applied using a thermal spraying process. This is configured as an inhomogeneous layer with an oxide entrapment of a specific porosity. If the support body (54) is a roll for the forward feed unit (20, 28), the roll body is roughened and a primer and the primary layer are applied using a thermal spraying process. Approximately 50% of the primary layer consists of chromium steel, in particular 13% chromium steel and an abrasion-resistant hard material and said primary layer provides a coarse surface with good grip that is resistant to wear and tear. If the support body (54) is a grinding-belt contact roll (9, 9′), the latter is polished after the thermal spraying process.
    Type: Application
    Filed: March 19, 2004
    Publication date: July 29, 2004
    Inventors: Helga Muller, Thomas Raber
  • Patent number: 6761626
    Abstract: An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt. At least one of the rings extends beyond an outer edge of a wafer to be planarized by the CMP belt. A support is attached with the platen and has a plurality of air ports for pressurized air to pass to the rings of the platen. A gasket is positioned between the support and the platen and has a plurality of cutouts that align with the openings and the air ports. A base is also included and supports the support.
    Type: Grant
    Filed: December 20, 2001
    Date of Patent: July 13, 2004
    Assignee: Lam Research Corporation
    Inventors: Anthony de la Llera, Xuyen Pham, Cangshan Xu, David Wei, Tony Luong
  • Patent number: 6746315
    Abstract: An apparatus is provided for polishing balls that comprises a cradle that is supported for rotation about a first axis. The cradle is shaped to support a spherical object and includes a ball spinner positioned and adapted to spin the spherical object in the cradle about a second axis that is oriented at an angle to the first axis. The apparatus also comprises a first drive operably connected to the cradle for rotating the cradle about the first axis at a first speed of rotation, and a second drive connected to the ball spinner to spin the spherical object about the second axis at a second speed of rotation.
    Type: Grant
    Filed: July 2, 2002
    Date of Patent: June 8, 2004
    Inventor: Edward O. Klukos
  • Patent number: 6739952
    Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated, non-continuous polishing pad oriented at an angle relative to the horizontal to allow planarizing liquids and materials removed from the microelectronic substrate to flow off the polishing pad under the force of gravity. Two such polishing pads can be positioned opposite each other in a vertical orientation and can share either a common platen or a common substrate carrier. The polishing pads can be pre-attached to both a supply roll and a take-up roll to form a cartridge which can be easily removed from the apparatus and replaced with another cartridge.
    Type: Grant
    Filed: April 5, 2002
    Date of Patent: May 25, 2004
    Assignee: Micron Technology, Inc.
    Inventor: Scott E. Moore
  • Patent number: 6729945
    Abstract: A platen for use in chemical mechanical planarization (CMP) systems is disclosed. The platen is arranged below a linear polishing pad and designed to apply a controlled fluid flow to the underside of the linear polishing pad. The platen includes a leading zone containing a first plurality of output holes. The leading zone is oriented more proximate to an upstream region of the linear polishing pad. The platen also includes a trailing zone containing a second plurality of output holes. The trailing zone is oriented more proximate to a downstream region of the linear polishing pad. The leading zone and the trailing zone are independently controlled and designed to output the controlled fluid flow independently from each of the first plurality of output holes and the second plurality of output holes.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: May 4, 2004
    Assignee: Lam Research Corporation
    Inventors: Cangshan Xu, Jeff Gasparitsch, Robert Taff, Kenneth J. Bahng, Paul Stasiewicz, Erik H. Engdahl
  • Patent number: 6726545
    Abstract: A linear polishing apparatus for polishing a semiconductor substrate including a novel polishing belt arrangement with at least two polishing belts forming a continuous loop. Each belt having an outside polishing surface and an inside smooth surface. The belts are spaced alongside each other sharing a common axis at each end. The belts are looped around a pair of rollers making up a driver roller at one end and a driven roller at the other end. A platen member interposes each belt and is placed between the pairs of rollers. The platen provides a polishing plane and supporting surface for the polishing belts. The polishing plane includes a plurality of holes communicating with an elongated plenum chamber underlying the plane. The chamber supplies a compressed gas to impart an upward pressure against the polishing belts. The driver rollers are coupled to separate motors to independently drive and control at least said two of the polishing belts.
    Type: Grant
    Filed: April 26, 2002
    Date of Patent: April 27, 2004
    Assignee: Chartered Semiconductor Manufacturing Ltd.
    Inventors: Subramanian Balakumar, Chen Feng, Victor Lim, Paul Proctor, Mukhopadhyay Madhusudan, Chivukula Subrahmanyam, Yelehanka Ramachandramurthy Pradeep
  • Patent number: 6712679
    Abstract: An apparatus for improving performance of a wafer polishing apparatus is described. The apparatus includes a platen in a support assembly having a plurality of fluid channels and at least one region of altered topography positioned on a portion of the platen surface.
    Type: Grant
    Filed: August 8, 2001
    Date of Patent: March 30, 2004
    Assignee: Lam Research Corporation
    Inventors: Travis R. Taylor, Cangshan Xu, Kevin T. Crofton, Eugene Yuexing Zhao
  • Publication number: 20040023603
    Abstract: An inline-ready method of finishing the surface of a long material (W) capable of preventing any environmental problem from occurring and the mechanical properties of the long material from deteriorating, comprising the steps of holding the long material (W) by two or more elastic endless belts (1) with a specified force, rotating the elastic endless belts (1) in the same direction as or in the reverse direction to the moving direction of the long material by moving the long material (W) and increasing or decreasing the rotating speed of the elastic endless belts (1) more than or less than the moving speed of the long material, and loading powder and granular grinding material (S) between the elastic endless belts (1), characterized in that the grinding material (S) is moved relative to the long material (W) to rub the grinding material (S) against the long material (W) so as to finish the surface of the long material (W).
    Type: Application
    Filed: June 30, 2003
    Publication date: February 5, 2004
    Inventors: Mitsugi Umemura, Takayuki Nakada
  • Patent number: 6656024
    Abstract: A retaining ring is provided. The retaining ring includes a lower annular sleeve having a base. The base has an inner sidewall and an outer sidewall extending therefrom. The lower annular sleeve has at least one hole defined therein. An upper annular sleeve is moveably disposed over the lower annular sleeve. The upper annular sleeve has a top, that has at least one hole defined therein. The top has an inner sidewall and an outer sidewall extending therefrom. A method for reducing a consumption of compressed dry air (CDA) during a chemical mechanical planarization (CMP) operation is also described.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: December 2, 2003
    Assignee: Lam Research Corporation
    Inventors: John M. Boyd, David Wei, Yehiel Gotkis
  • Patent number: 6641464
    Abstract: A polishing bar is provided with a plurality of backings that are carried via blocks of impact absorbent material on a bar of greater stiffness. Each backing is shaped with two surfaces at an angle to each other. A polishing tape is disposed over the angled surfaces of each backing. The portion of the polishing tape over the forward surface of the backing is employed to polish the angled edge of the top wafer of a rotating bonded wafer pair.
    Type: Grant
    Filed: February 21, 2003
    Date of Patent: November 4, 2003
    Assignee: Accretech USA, Inc.
    Inventor: Robert E. Steere, III
  • Patent number: 6629875
    Abstract: The wafer edge processing unit may be a stand alone unit or may be incorporated in existing grinding machines. The processing unit employs a plurality of tapes which are coated with differing grades of grit to sequentially polish the edge of a rotating wafer or to remove an edge bead from a processed wafer or the other substrate. The tapes are mounted on a backing block which is rotated to move the tapes from a line contact with the top bevel of the wafer to a line contact with the bottom bevel of the wafer. Fresh surfaces of the tapes are presented to successive wafers by rotating the spools on which the tapes are mounted. The wafer may be moved in small increments along a Y-axis and/or an X-axis relative to a tape during polishing to improve the polishing operation.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: October 7, 2003
    Assignee: Accretech USA, Inc.
    Inventor: Robert E. Steere, III
  • Patent number: 6621584
    Abstract: An apparatus and method for in-situ monitoring of thickness during chemical-mechanical polishing (CMP) of a substrate using a polishing tool and a film thickness monitor. The tool has an opening placed in it. The opening contains a monitoring window secured in it to create a monitoring channel. A film thickness monitor (comprising an ellipsometer, a beam profile reflectometer, or a stress pulse analyzer) views the substrate through the monitoring channel to provide an indication of the thickness of a film carried by the substrate. This information can be used to determine the end point of the CMP process, determine removal rate at any given circumference of a substrate, determine average removal rate across a substrate surface, determine removal rate variation across a substrate surface, and optimize removal rate and uniformity.
    Type: Grant
    Filed: April 26, 2000
    Date of Patent: September 16, 2003
    Assignee: Lam Research Corporation
    Inventors: Jiri Pecen, Saket Chadda, Rahul Jairath, Wilbur C. Krusell
  • Patent number: 6612904
    Abstract: A polishing tool includes a polish pad, a bladder, a fluid, and a flux guide. A bladder containing fluid supports the polishing pad that is positioned adjacent to a surface to be polished. Flux guides positioned along a portion of the bladder direct a field or a magnetic flux to selected locations of the bladder. The method of polishing a surface adjusts the field or the magnetic flux emanating from the flux guides which changes the mechanical properties of the fluid. By adjusting the magnitude of the field or level of magnetic flux flowing from the flux guides independent pressure adjustments occur at selected locations of the bladder that control the polishing profile of the surface.
    Type: Grant
    Filed: December 27, 2001
    Date of Patent: September 2, 2003
    Assignee: Lam Research Corporation
    Inventors: Robert G. Boehm, John M. Boyd
  • Patent number: 6607425
    Abstract: An invention is disclosed for improved performance in a CMP process using a pressurized membrane as a replacement for a platen air bearing. In one embodiment, a platen for improving performance in CMP applications is disclosed. The platen includes a membrane disposed above the platen, and a plurality of annular bladders disposed below the membrane, wherein the annular bladders are capable of exerting force on the membrane. In this manner, zonal control is provided during the CMP process.
    Type: Grant
    Filed: December 21, 2000
    Date of Patent: August 19, 2003
    Assignee: Lam Research Corporation
    Inventors: Rod Kistler, John Boyd, Alek Owczarz
  • Patent number: 6592435
    Abstract: In a recording medium manufacturing method for obtaining a recording medium by effecting a surface smoothing treatment on a surface smoothing treatment surface of a surface of a medium, the surface smoothing treatment surface of the medium is locally pressed by a polishing work tape having a pressure area less than 1 mm, more preferably, less than 0.5 mm with respect to both radial direction and tangential direction relative to rotation of the medium. In a polishing work of recording medium manufacturing process, a problem of occurrence of defects such as scratches on the surface layer can be improved, whereby yield can be increased and mass-productivity can be improved.
    Type: Grant
    Filed: July 13, 2001
    Date of Patent: July 15, 2003
    Assignee: Sony Corporation
    Inventor: Koichiro Kishima
  • Publication number: 20030119433
    Abstract: An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt. At least one of the rings extends beyond an outer edge of a wafer to be planarized by the CMP belt. A support is attached with the platen and has a plurality of air ports for pressurized air to pass to the rings of the platen. A gasket is positioned between the support and the platen and has a plurality of cutouts that align with the openings and the air ports. A base is also included and supports the support.
    Type: Application
    Filed: December 20, 2001
    Publication date: June 26, 2003
    Inventors: Anthony de la Llera, Xuyen Pham, Cangshan Xu, David Wei, Tony Luong
  • Patent number: 6567718
    Abstract: A method for monitoring consumable performance in a processing tool comprises storing a performance model of the processing tool; receiving a consumable item characteristic of a consumable item in the processing tool; determining a predicted processing rate for the processing tool based on the consumable item characteristic and the performance model; determining an actual processing rate of the processing tool; and determining a replacement interval for the consumable item based on at least the actual processing rate. A processing system includes a processing tool and an automatic process controller. The processing tool is adapted to process wafers and includes a consumable item.
    Type: Grant
    Filed: July 28, 2000
    Date of Patent: May 20, 2003
    Assignee: Advanced Micro Devices, Inc.
    Inventors: William J. Campbell, Jeremy Lansford, Michael R. Conboy
  • Patent number: 6558239
    Abstract: A polishing apparatus has a feed reel for feeding a polishing tape wound thereon and having a polishing surface, a take-up reel for reeling up the polishing tape from the feed reel, a presser for pressing the polishing tape between the feed reel and the take-up reel against a surface, to be polished, of a workpiece, and a motor for rotating the take-up reel. The feed reel, the take-up reel, and the presser are housed in a cartridge, which is detachably held by a cartridge holder.
    Type: Grant
    Filed: January 7, 2002
    Date of Patent: May 6, 2003
    Assignee: Ebara Corporation
    Inventors: Junji Kunisawa, Norio Kimura
  • Patent number: 6558234
    Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated polishing pad that is moved over a platen either between or during the planarization cycles, and a support pad that is moved along with the polishing pad. The support pad can be an elongated member that extends between a supply roller and a take-up roller, or can include a continuous member that extends around the spaced apart rollers. The platen can also be movable along with the support pad and can be supported by fluid jets, rollers, or a rotating bladder. Cleaning devices and/or milling devices can treat the surfaces of the polishing pad, the support pad and/or the platen to reduce the likelihood for contaminants to become caught between these components as they engage with each other.
    Type: Grant
    Filed: February 27, 2001
    Date of Patent: May 6, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Michael A. Walker, Karl M. Robinson
  • Publication number: 20020173248
    Abstract: A method and apparatus for releasably attaching a planarizing medium, such as a polishing pad, to the platen of a chemical-mechanical planarization machine. In one embodiment, the apparatus can include several apertures in the upper surface of the platen that are coupled to a vacuum source. When a vacuum is drawn through the apertures in the platen, the polishing pad is drawn tightly against the platen and may therefore be less likely to wrinkle when a semiconductor substrate is engaged with the polishing pad during planarization. When the vacuum is released, the polishing pad can be easily separated from the platen. The apparatus can further include a liquid trap to separate liquid from the fluid drawn by the vacuum source through the apertures, and can also include a releasable stop to prevent the polishing pad from separating from the platen should the vacuum source be deactivated while the platen is in motion.
    Type: Application
    Filed: April 10, 2002
    Publication date: November 21, 2002
    Inventors: Trung Tri Doan, Scott E. Moore
  • Publication number: 20020146972
    Abstract: A platen for use in chemical mechanical planarization (CMP) systems is disclosed. The platen is arranged below a linear polishing pad and designed to apply a controlled fluid flow to the underside of the linear polishing pad. The platen includes a leading zone containing a first plurality of output holes. The leading zone is oriented more proximate to an upstream region of the linear polishing pad. The platen also includes a trailing zone containing a second plurality of output holes. The trailing zone is oriented more proximate to a downstream region of the linear polishing pad. The leading zone and the trailing zone are independently controlled and designed to output the controlled fluid flow independently from each of the first plurality of output holes and the second plurality of output holes.
    Type: Application
    Filed: March 30, 2001
    Publication date: October 10, 2002
    Inventors: Cangshan Xu, Jeff Gasparitsch, Robert Taff, Kenneth J. Bahng, Paul Stasiewicz, Erik H. Engdahl
  • Patent number: 6458021
    Abstract: A polishing apparatus includes a lapping tape for polishing a surface of a magnetic disc, a tape supply unit for supplying the lapping tape, a varnisher roller for pressing the lapping tape onto the surface of the magnetic disc, and a pressing unit for pressing the lapping tape to the surface of the magnetic disc by way of the varnisher roller. The pressing unit is constituted by a swing lever having the varnisher roller at one end portion, and a balance adjusting unit. The balance adjusting unit sets the pressing force to zero by establishing the balance of the swing lever, and then breaks the balance so as to press the lapping tape to the surface of the magnetic disc by way of the varnisher roller with a desired pressing force.
    Type: Grant
    Filed: August 31, 2000
    Date of Patent: October 1, 2002
    Assignee: Sony Corporation
    Inventors: Katsumi Takeyama, Kenichi Kano
  • Patent number: 6454638
    Abstract: A machine for grinding cylindrical bearing surfaces on parts, in particular journals and/or crank pins on crankshafts, using an abrasive belt, includes a support on which three abrasive belt clamping members are mounted in a triangle and mobile in directions that converge toward the axis of the bearing surface to be ground. Each clamping member carries at least one applicator shoe conformed to press the abrasive belt against the bearing surface along a surface essentially limited to a generatrix parallel to the axis of the bearing surface. The shoe is preferably made from an elastomer having a Shore hardness at most equal to 100 and has a cylindrically curved applicator surface with a radius of curvature less than the radius of curvature of the bearing surface.
    Type: Grant
    Filed: May 4, 2001
    Date of Patent: September 24, 2002
    Assignee: Societe des Procedes et Machines Speciales
    Inventors: Richard Bonachera, Raymond Millot
  • Patent number: 6454641
    Abstract: A polishing system such as a chemical mechanical belt polisher includes a hydrostatic fluid bearing that supports polishing pads and incorporates one or more of the following novel aspects. One aspect uses compliant surfaces surrounding fluid inlets in an array of inlets to extend areas of elevated support pressure around the inlets. Another aspect modulates or reverses fluid flow in the bearing to reduce deviations in the time averaged support pressure and to induce vibrations in the polishing pads to improve polishing performance. Another aspect provides a hydrostatic bearing with a cavity having a lateral extent greater than that of an object being polished. The depth and bottom contour of cavity can be adjusted to provide nearly uniform support pressure across an area that is surrounded by a retaining ring support. Changing fluid pressure to the retaining ring support adjusts the fluid film thickness of the bearing.
    Type: Grant
    Filed: November 7, 2000
    Date of Patent: September 24, 2002
    Inventors: David E. Weldon, Shu-Hsin Kao, Tim H. Huynh
  • Patent number: 6428404
    Abstract: Methods and machines for planarizing microelectronic substrate assemblies using mechanical and/or chemical-mechanical planarizing processes. One machine in accordance with an embodiment of the invention includes a table having a support surface with a planarizing zone, an elongated polishing pad configured to move across the support surface of the table along a pad travel path, and a pad advancing mechanism coupled to the pad. The elongated pad can have a length along an elongated dimension extending along the pad travel path, an elongated first edge, an elongated second edge opposite the first edge, an elongated first side region extending along the first edge, an elongated second side region extending along the second edge, and an elongated medial region having a width between the first and second side regions. The pad advancing mechanism can include a first roller about which an unused portion of the pad is wrapped and a second roller about which a used portion of the pad is wrapped.
    Type: Grant
    Filed: September 19, 2001
    Date of Patent: August 6, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Michael A. Walker, Scott E. Moore
  • Patent number: 6425811
    Abstract: A sander for smoothing curvilinear surfaces includes a horizontal support surface having top and bottom sides. The support surface has two sets of inner and outer arcuate slots thereon. The inner arcuate slots each have idler rollers thereabove secured to a pivoting, spring biased circular plate therebelow. A continuous sanding belt encompasses the idler rollers and a drive roller and is moved along a substantially triangular path with a motor means. A section of the path defines a sanding portion immediately adjacent to which is a flexible plate. An adjustment mechanism is provided to bend the plate to a desired configuration to form a curved sanding portion. The plate has an anchoring post on each side that is received within an outer arcuate slot and is secured to the circular plate therebelow. The plates, idler rollers and anchoring posts maintain tension on the belt regardless of the orientation of the sanding surface.
    Type: Grant
    Filed: June 14, 2000
    Date of Patent: July 30, 2002
    Inventor: George E. Marks, Jr.
  • Patent number: 6419569
    Abstract: A hand-held belt sander has a housing, an on-off switch and a power supply conductor supported by the housing, a motor and a transmission received in the housing, a sanding belt, a driving roller driven by the motor and driving the sanding belt, a sliding shoe provided with a base, a deviating roller arranged so that said sanding belt is guidable over the deviating roller and the base of the sliding shoe, a unit for centering the sanding belt, a unit for clamping the sanding belt, the deviating roller and the driving roller have different diameters so that the sanding belt is guided inclinedly, the housing being elongated and the sanding belt being guided on guiding parts which are introduced in a rear region of the elongated housing so that with together with the sanding belt in a front region of the elongated housing a centrally forwardly extending, freely projecting, wedge tip-shaped contour is formed so that the hand-held belt sander as a whole has a lance-like contour.
    Type: Grant
    Filed: September 27, 2000
    Date of Patent: July 16, 2002
    Assignee: Robert Bosch GmbH
    Inventors: Alfred Frech, Gerd Berner, Reiner Silberer, Michael Behrendes, Michael A Gabold, Joachim Schadow, Rudolf Fuchs, Sinisa Andrasic, Thomas Palaver, Juergen Koellner
  • Publication number: 20020081947
    Abstract: An invention is disclosed for improving edge performance in a chemical mechanical polishing process is disclosed. The system includes a wafer head disposed above a wafer, where the wafer head includes a first active retaining ring capable of extension and retraction. Below the wafer head is a polishing belt, and disposed below the polishing belt is a platen having a second active retaining ring capable of extension and retraction. During operation the first active retaining ring and the second active retaining ring can be controlled to provide positional control for the polishing belt, thus adjusting and controlling the removal rate at the edge of the wafer.
    Type: Application
    Filed: December 21, 2000
    Publication date: June 27, 2002
    Inventors: Alek Owczarz, John Boyd, Rod Kistler
  • Patent number: 6402601
    Abstract: Methods and machines for planarizing microelectronic substrate assemblies using mechanical and/or chemical-mechanical planarizing processes. One machine in accordance with an embodiment of the invention includes a table having a support surface with a planarizing zone, an elongated polishing pad configured to move across the support surface of the table along a pad travel path, and a pad advancing mechanism coupled to the pad. The elongated pad can have a length along an elongated dimension extending along the pad travel path, an elongated first edge, an elongated second edge opposite the first edge, an elongated first side region extending along the first edge, an elongated second side region extending along the second edge, and an elongated medial region having a width between the first and second side regions. The pad advancing mechanism can include a first roller about which an unused portion of the pad is wrapped and a second roller about which a used portion of the pad is wrapped.
    Type: Grant
    Filed: July 17, 2001
    Date of Patent: June 11, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Michael A. Walker, Scott E. Moore
  • Patent number: 6383063
    Abstract: In an apparatus for polishing a workpiece, by rotating the workpiece while pressing a press member against a back surface of a polishing tape and thereby pressing the polishing tape against the workpiece, a cartridge 72 which holds the press member 96 is provided, for improving the ability of the press member to follow the workpiece, with a rollable-type holding device 260 which holds the press member 96 such that the press member 96 is rollable about a rolling axis line LS which perpendicularly crosses, in a three-dimensional space, over a rotational axis line about which the workpiece 10 is rotated. During the polishing of the workpiece, the press member 96 is rolled relative to the cartridge 72, so that the press member 96 follows the workpiece 10.
    Type: Grant
    Filed: May 31, 2000
    Date of Patent: May 7, 2002
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Yuji Ohashi, Kazuo Kiriyama
  • Patent number: 6379232
    Abstract: My invention is a device to facilitate sanding concave and convex shapes more evenly on a belt sander. My invention raises the center of the sanding belt and provides a section of belt that has no backing support. The unbacked area of belt forms a variable concave sanding surface when the workpiece is held against it with varying degrees of pressure. The arched top of my invention provides a wide radius sanding surface for concave workpieces. The curvature of the arched top of my invention reduces the area of contact with the inner surface of the belt when in an unloaded or idling state and helps the belt and the belt lift accessory operate at lower temperatures. The dimensions of my invention may vary depending upon the particular host machine it is designed to fit. My invention is simple to mount and remove without the use of tools. My invention can be used in a variety of shop applications on wood, metal and plastics.
    Type: Grant
    Filed: March 16, 2001
    Date of Patent: April 30, 2002
    Inventor: Salvatore Louis D'Aquila
  • Publication number: 20020045411
    Abstract: In a recording medium manufacturing method for obtaining a recording medium by effecting a surface smoothing treatment on a surface smoothing treatment surface of a surface of a medium, the surface smoothing treatment surface of the medium is locally pressed by a polishing work tape having a pressure area less than 1 mm, more preferably, less than 0.5 mm with respect to both radial direction and tangential direction relative to rotation of the medium. In a polishing work of recording medium manufacturing process, a problem of occurrence of defects such as scratches on the surface layer can be improved, whereby yield can be increased and mass-productivity can be improved.
    Type: Application
    Filed: July 13, 2001
    Publication date: April 18, 2002
    Inventor: Koichiro Kishima
  • Patent number: 6361400
    Abstract: Methods for predicting polishing characteristics of polishing pads in mechanical or chemical-mechanical planarization of microelectronic substrate assemblies, and methods and machines for planarizing microelectronic substrate assemblies. One embodiment of a method in accordance with the invention includes ascertaining a surface parameter of a bearing surface of at least one raised feature projecting from a base portion of a raised feature polishing pad. The raised feature, for example, can be a pyramidal structure having a first cross-sectional area at the base portion of the pad and a second cross-sectional area at the bearing surface. The first cross-sectional area is generally greater than the second cross-sectional area. To ascertain the surface parameter of the bearing surface, one particular embodiment of the invention involves determining an indication of the surface area of the bearing surface.
    Type: Grant
    Filed: May 15, 2001
    Date of Patent: March 26, 2002
    Assignee: Micron Technology, Inc.
    Inventor: Scott A. Southwick
  • Patent number: 6361417
    Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated polishing pad that is moved over a platen either between or during the planarization cycles, and a support pad that is moved along with the polishing pad. The support pad can be an elongated member that extends between a supply roller and a take-up roller, or can include a continuous member that extends around the spaced apart rollers. The platen can also be movable along with the support pad and can be supported by fluid jets, rollers, or a rotating bladder. Cleaning devices and/or milling devices can treat the surfaces of the polishing pad, the support pad and/or the platen to reduce the likelihood for contaminants to become caught between these components as they engage with each other.
    Type: Grant
    Filed: February 27, 2001
    Date of Patent: March 26, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Michael A. Walker, Karl M. Robinson