Abstract: An invention is disclosed for improving edge performance in a chemical mechanical polishing process is disclosed. The system includes a wafer head disposed above a wafer, where the wafer head includes a first active retaining ring capable of extension and retraction. Below the wafer head is a polishing belt, and disposed below the polishing belt is a platen having a second active retaining ring capable of extension and retraction. During operation the first active retaining ring and the second active retaining ring can be controlled to provide positional control for the polishing belt, thus adjusting and controlling the removal rate at the edge of the wafer.

Abstract: Methods and machines for planarizing microelectronic substrate assemblies using mechanical and/or chemical-mechanical planarizing processes. One machine in accordance with an embodiment of the invention includes a table having a support surface with a planarizing zone, an elongated polishing pad configured to move across the support surface of the table along a pad travel path, and a pad advancing mechanism coupled to the pad. The elongated pad can have a length along an elongated dimension extending along the pad travel path, an elongated first edge, an elongated second edge opposite the first edge, an elongated first side region extending along the first edge, an elongated second side region extending along the second edge, and an elongated medial region having a width between the first and second side regions. The pad advancing mechanism can include a first roller about which an unused portion of the pad is wrapped and a second roller about which a used portion of the pad is wrapped.

Abstract: In an apparatus for polishing a workpiece, by rotating the workpiece while pressing a press member against a back surface of a polishing tape and thereby pressing the polishing tape against the workpiece, a cartridge 72 which holds the press member 96 is provided, for improving the ability of the press member to follow the workpiece, with a rollable-type holding device 260 which holds the press member 96 such that the press member 96 is rollable about a rolling axis line LS which perpendicularly crosses, in a three-dimensional space, over a rotational axis line about which the workpiece 10 is rotated. During the polishing of the workpiece, the press member 96 is rolled relative to the cartridge 72, so that the press member 96 follows the workpiece 10.

Abstract: My invention is a device to facilitate sanding concave and convex shapes more evenly on a belt sander. My invention raises the center of the sanding belt and provides a section of belt that has no backing support. The unbacked area of belt forms a variable concave sanding surface when the workpiece is held against it with varying degrees of pressure. The arched top of my invention provides a wide radius sanding surface for concave workpieces. The curvature of the arched top of my invention reduces the area of contact with the inner surface of the belt when in an unloaded or idling state and helps the belt and the belt lift accessory operate at lower temperatures. The dimensions of my invention may vary depending upon the particular host machine it is designed to fit. My invention is simple to mount and remove without the use of tools. My invention can be used in a variety of shop applications on wood, metal and plastics.

Abstract: In a recording medium manufacturing method for obtaining a recording medium by effecting a surface smoothing treatment on a surface smoothing treatment surface of a surface of a medium, the surface smoothing treatment surface of the medium is locally pressed by a polishing work tape having a pressure area less than 1 mm, more preferably, less than 0.5 mm with respect to both radial direction and tangential direction relative to rotation of the medium. In a polishing work of recording medium manufacturing process, a problem of occurrence of defects such as scratches on the surface layer can be improved, whereby yield can be increased and mass-productivity can be improved.

Abstract: Methods for predicting polishing characteristics of polishing pads in mechanical or chemical-mechanical planarization of microelectronic substrate assemblies, and methods and machines for planarizing microelectronic substrate assemblies. One embodiment of a method in accordance with the invention includes ascertaining a surface parameter of a bearing surface of at least one raised feature projecting from a base portion of a raised feature polishing pad. The raised feature, for example, can be a pyramidal structure having a first cross-sectional area at the base portion of the pad and a second cross-sectional area at the bearing surface. The first cross-sectional area is generally greater than the second cross-sectional area. To ascertain the surface parameter of the bearing surface, one particular embodiment of the invention involves determining an indication of the surface area of the bearing surface.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated polishing pad that is moved over a platen either between or during the planarization cycles, and a support pad that is moved along with the polishing pad. The support pad can be an elongated member that extends between a supply roller and a take-up roller, or can include a continuous member that extends around the spaced apart rollers. The platen can also be movable along with the support pad and can be supported by fluid jets, rollers, or a rotating bladder. Cleaning devices and/or milling devices can treat the surfaces of the polishing pad, the support pad and/or the platen to reduce the likelihood for contaminants to become caught between these components as they engage with each other.

Abstract: A polishing tool includes a polish pad, a bladder, a fluid, and a flux guide. A bladder containing fluid supports the polishing pad that is positioned adjacent to a surface to be polished. Flux guides positioned along a portion of the bladder direct a field or a magnetic flux to selected locations of the bladder. The method of polishing a surface adjusts the field or the magnetic flux emanating from the flux guides which changes the mechanical properties of the fluid. By adjusting the magnitude of the field or level of magnetic flux flowing from the flux guides independent pressure adjustments occur at selected locations of the bladder that control the polishing profile of the surface.

Abstract: A centerless microfinishing machine especially adapted for machining camshaft workpieces. The microfinishing machine causes the camshaft workpiece to rotate through the use of a centerless drive system including spaced rollers which frictionally engage the workpiece. A tooling head assembly strokes between engage and disengage positions and includes individual shoes which simultaneously engage the camshaft lobe and camshaft bearing journal surfaces. Through the use of separate compliant elements, these tools are caused to follow the contours of the surfaces being machined. The tooling head assembly allows these surfaces to be machined simultaneously; therefore, multiple machine functions can be accomplished in a single manufacturing step, which reduces the number of individual pieces of equipment which are required in accordance with typical machining approaches.

Abstract: Methods for predicting polishing characteristics of polishing pads in mechanical or chemical-mechanical planarization of microelectronic substrate assemblies, and methods and machines for planarizing microelectronic substrate assemblies. One embodiment of a method in accordance with the invention includes ascertaining a surface parameter of a bearing surface of at least one raised feature projecting from a base portion of a raised feature polishing pad. The raised feature, for example, can be a pyramidal structure having a first cross-sectional area at the base portion of the pad and a second cross-sectional area at the bearing surface. The first cross-sectional area is generally greater than the second cross-sectional area. To ascertain the surface parameter of the bearing surface, one particular embodiment of the invention involves determining an indication of the surface area of the bearing surface.

Abstract: This invention relates to a flexible membrane polishing belt against which a substrate, for example a semiconductor wafer, is polished using chemical mechanical polishing principles. A fluidized layer is provided on a surface of a polishing member backing assembly which urges the moving polishing membrane toward the substrate held in a polishing head to be polished. The linear motion of the belt provides uniform polishing across the full width of the belt and provides the opportunity for a chemical mechanical polishing to take place. Several configurations are disclosed. They include belts which are wider than the substrate being polished, belts which cross the substrate being polished, but which provide relative motion between the substrate and the polishing belt, and polishing belt carriers having localized polishing areas which are smaller than the total area of the substrate to be polished.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated polishing pad that is moved over a platen either between or during the planarization cycles, and a support pad that is moved along with the polishing pad. The support pad can be an elongated member that extends between a supply roller and a take-up roller, or can include a continuous member that extends around the spaced apart rollers. The platen can also be movable along with the support pad and can be supported by fluid jets, rollers, or a rotating bladder. Cleaning devices and/or milling devices can treat the surfaces of the polishing pad, the support pad and/or the platen to reduce the likelihood for contaminants to become caught between these components as they engage with each other.

Abstract: A shoe assembly for a micro-finishing machine for finishing a workpiece includes a C-frame structure adapted for nonrotatable mounting to the micro-finishing machine. The C-frame assembly includes a pair of slats and a replaceable insert secured nonrotatably to the C-frame assembly.

Abstract: A chemical mechanical polishing apparatus has a platen, a polishing sheet extending between a first roller and a second roller, and a support sheet extending between a third roller and a fourth roller. A portion of the polishing sheet extends over a surface of the platen to polish a substrate, and a portion of the support sheet extends between the platen and the polishing sheet. The polishing sheet may be a continuous belt or a reel-to-reel tape, and the support sheet may be a continuous belt or reel-to-reel tape.

Abstract: In a band grinding machine, especially well adapted for grinding wooden frames having transverse and longitudinal wooden pieces, a support table in the form of an endless belt transports the frames in an advancement direction, a transverse grinding assembly with a transversely moving grinding band extending over the width of the support table grinds the entire tops of frames, and two longitudinal grinding assemblies, located behind the transverse grinding assembly in the advancement direction, respectively grind the two longitudinal wooden pieces of each frame, with each longitudinal grinding assembly having a longitudinally moving grinding band with a width very small in comparison to the width of the table, and with at least one of the longitudinal grinding assemblies being adjustable transversely of the advancement direction to allow the spacing of the longitudinal grinding assemblies to be set to match the spacing of the longitudinal frame pieces.

Abstract: A belt grinding machine has a grinding belt continuously guided about at least two deflection rollers 2, a pressure shoe 3 that presses the grinding belt 1 against a workpiece 8 by a contact pressure apparatus. The belt grinding machine also has a contact pressure control that allows a contact pressure force to be set. The uniformity and reproducibility of the grinding results are improved by a detector arrangement 6, 7 that senses the adjustment of the pressure shoe 3 and an evaluation device that influences the contact pressure control as a function of the sensed adjustment of the pressure shoe 3.

Abstract: A method and apparatus for supporting, cleaning and/or drying a polishing pad used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a cleaning head positioned adjacent a post-operative portion of the polishing pad to clean and/or dry the rear surface of the polishing pad. The cleaning head can include a heat source, a mechanical contact element, and/or orifices that direct fluid and/or gas toward the rear surface. The apparatus can further include a vessel through which the rear surface of the polishing pad passes to clean the rear surface. The apparatus can also include a flow passage in fluid communication with a region between the polishing pad and a support pad upon which the polishing pad rests during planarization. Gas moves through the flow passage toward or away from an interface region between the polishing pad and the support pad to draw the polishing pad toward or away from the support pad.

Abstract: Apparatus for removing random scratches formed during the polishing of magnetic recording media, and for disposing on the surface of the media a near-circumferential texture which increases the recording reliability of the media while simultaneously reducing its failure rate. The present invention teaches the application of a low unit load force to a pad and polishing tape combination in contact with a rotating and oscillating disk surface to completely remove the random scratches previously formed by a polishing step. The apparatus facilitates the application of a specially designed, extremely fine alumina slurry composition without producing similar size circumferential scratches at the high surface speeds.

Abstract: A hand-held belt sander has a housing, an on-off switch and a power supply conductor supported by the housing, a motor and a transmission received in the housing, a sanding belt, a driving roller driven by the motor and driving the sanding belt, a sliding shoe provided with a base, a deviating roller arranged so that said sanding belt is guidable over the deviating roller and the base of the sliding shoe, a unit for centering the sanding belt, a unit for clamping the sanding belt, the deviating roller and the driving roller have different diameters so that the sanding belt is guided inclinedly, the housing being elongated and the sanding belt being guided on guiding parts which are introduced in a rear region of the elongated housing so that with together with the sanding belt in a front region of the elongated housing a centrally forwardly extending, freely projecting, wedge tip-shaped contour is formed so that the hand-held belt sander as a whole has a lance-like contour.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated polishing pad that is moved over a platen either between or during the planarization cycles, and a support pad that is moved along with the polishing pad. The support pad can be an elongated member that extends between a supply roller and a take-up roller, or can include a continuous member that extends around the spaced apart rollers. The platen can also be movable along with the support pad and can be supported by fluid jets, rollers, or a rotating bladder. Cleaning devices and/or milling devices can treat the surfaces of the polishing pad, the support pad and/or the platen to reduce the likelihood for contaminants to become caught between these components as they engage with each other.

Abstract: The wafer edge processing unit may be a stand alone unit or may be incorporated in existing grinding machines. The processing unit employs a plurality of tapes which are coated with differing grades of grit to sequentially polish the edge of a rotating wafer or to remove an edge bead from a processed wafer or the other substrate. The tapes are mounted on a backing block which is rotated to move the tapes from a line contact with the top bevel of the wafer to a line contact with the bottom bevel of the wafer. Fresh surfaces of the tapes are presented to successive wafers by rotating the spools on which the tapes are mounted. The wafer may be moved in small increments along a Y-axis and/or an X-axis relative to a tape during polishing to improve the polishing operation.

Abstract: A system is provided for chemical mechanical polishing (CMP) of a semiconductor wafer by periodically relatively moving a polishing pad on a rotating platen, and the wafer, retained in the aperture of a rotating and oscillating ring having a wear surface surrounding the aperture and wafer, with respect to each other while the wafer and wear surface frictionally contact the pad. A CMP slurry is dispensed to the wafer periphery in the vicinity of the pad at a plurality of perimetrically spaced apart channels in the wear surface maintained in fixed relation to the wafer during the relative movement. The ring is fixed to the underside of a carrier in turn fixed at its upper portion to the bottom end of a spindle which is rotatably mounted at its top end on an oscillating support beam, such that the wafer, ring, carrier and spindle rotate and oscillate in common. The carrier has a heat exchanger to heat or cool the slurry.

Abstract: Methods and machines for planarizing microelectronic substrate assemblies using mechanical and/or chemical-mechanical planarizing processes. One machine in accordance with an embodiment of the invention includes a table having a support surface with a planarizing zone, an elongated polishing pad configured to move across the support surface of the table along a pad travel path, and a pad advancing mechanism coupled to the pad. The elongated pad can have a length along an elongated dimension extending along the pad travel path, an elongated first edge, an elongated second edge opposite the first edge, an elongated first side region extending along the first edge, an elongated second side region extending along the second edge, and an elongated medial region having a width between the first and second side regions. The pad advancing mechanism can include a first roller about which an unused portion of the pad is wrapped and a second roller about which a used portion of the pad is wrapped.

Abstract: A shoe assembly for a micro-finishing machine for finishing a workpiece includes a C-frame structure adapted for nonrotatable mounting to the micro-finishing machine. The C-frame assembly includes a pair of slats and a replaceable insert secured nonrotatably to the C-frame assembly.

Abstract: A polishing system such as a chemical mechanical belt polisher includes a hydrostatic fluid bearing that supports polishing pads and incorporates one or more of the following novel aspects. One aspect uses compliant surfaces surrounding fluid inlets in an array of inlets to extend areas of elevated support pressure around the inlets. Another aspect of the invention provides a hydrostatic bearing with spiral or partial cardiod drain grooves. This bearing has a non-uniform support pressure profile but provides a uniform average pressure to a wafer that is rotated relative to the center of the bearing.

Abstract: Methods for predicting polishing characteristics of polishing pads in mechanical or chemical-mechanical planarization of microelectronic substrate assemblies, and methods and machines for planarizing microelectronic substrate assemblies. One embodiment of a method in accordance with the invention includes ascertaining a surface parameter of a bearing surface of at least one raised feature projecting from a base portion of a raised feature polishing pad. The raised feature, for example, can be a pyramidal structure having a first cross-sectional area at the base portion of the pad and a second cross-sectional area at the bearing surface. The first cross-sectional area is generally greater than the second cross-sectional area. To ascertain the surface parameter of the bearing surface, one particular embodiment of the invention involves determining an indication of the surface area of the bearing surface.

Abstract: Magnetic recording media are provided having separately textured data and read/write head landing zones. Separating these zones on the recording surface allows independent optimization of the topology to maximize both recording characteristics and mechanical durability. The landing or contact start stop zone has an average surface roughness greater than that of the data zone. Preferably, a transition zone extends between the contact start stop zone and the data zone, the transition zone varying between the two in average surface roughness. Preferably, the contact start stop zone is textured first, followed by the data zone, thereby ensuring uniform stiction performance. Texture machines for producing such zone texturing and texturing methods are also provided.

Abstract: A temperature compensating unit is coupled to a linearly moving belt of a polisher for adjusting the temperature of the belt, which temperature is measured by a sensor situated proximal to the belt.

Abstract: The invention concerns a device for belt-grinding curved material surfaces, wherein the abrasive belt is pressed onto the surface of the work piece by means of two processing shoes and at the same time, the surface of the work piece to be processed is measured by an in-processing means.

Abstract: Magnetic recording media are provided having separately textured data and read/write head landing zones. Separating these zones on the recording surface allows independent optimization of the topology to maximize both recording characteristics and mechanical durability. The landing or contact start stop zone has an average surface roughness greater than that of the data zone. Preferably, a transition zone extends between the contact start stop zone and the data zone, the transition zone varying between the two in average surface roughness. Preferably, the contact start stop zone is textured first, followed by the data zone, thereby ensuring uniform stiction performance. Texture machines for producing such zone texturing and texturing methods are also provided.

Abstract: There is provided a method and an apparatus for improving surface roughness of tooth surfaces of an external-tooth gear (W), and thereby reducing the occurrence of noises associated with the meshing between teeth. In accordance with the method, teeth of the external-tooth gear (W) are polished by rotating teeth of the external-tooth gear (W) relative to a film polishing member (110) in the tooth profile direction, and simultaneously by oscillating the external-tooth gear (W) in the tooth trace direction, while pressing the film polishing member (110) against tooth surfaces of the external-tooth gear W by backing up with a shoe (120).

Abstract: A hand-held belt sander has a housing, an on-off switch and a power supply conductor supported by the housing, a motor and a transmission received in the housing, a sanding belt, a driving roller driven by the motor and driving the sanding belt, a sliding shoe provided with a base, a deviating roller arranged so that said sanding belt is guidable over the deviating roller and the base of the sliding shoe, a unit for centering the sanding belt, a unit for clamping the sanding belt, the deviating roller and the driving roller have different diameters so that the sanding belt is guided inclinedly, the housing being elongated and the sanding belt being guided on guiding parts which are introduced in a rear region of the elongated housing so that with together with the sanding belt in a front region of the elongated housing a centrally forwardly extending, freely projecting, wedge tip-shaped contour is formed so that the hand-held belt sander as a whole has a lance-like contour.

Abstract: Apparatus for removing random scratches formed during the polishing of magnetic recording media, and for disposing on the surface of the media a near-circumferential texture which increases the recording reliability of the media while simultaneously reducing its failure rate. The present invention teaches the application of a low unit load force to a pad and polishing tape combination in contact with a rotating and oscillating disk surface to completely remove the random scratches previously formed by a polishing step. The apparatus facilitates the application of a specially designed, extremely fine alumina slurry composition without producing similar size circumferential scratches at the high surface speeds.

Abstract: A chemical mechanical polishing apparatus has a platen, a polishing sheet extending between a first roller and a second roller, and a support sheet extending between a third roller and a fourth roller. A portion of the polishing sheet extends over a surface of the platen to polish a substrate, and a portion of the support sheet extends between the platen and the polishing sheet. The polishing sheet may be a continuous belt or a reel-to-reel tape, and the support sheet may be a continuous belt or reel-to-reel tape.

Abstract: A polishing tool uses a seal cavity containing a fluid that supports polishing pads against an object being polished. The boundaries of the cavity include a support structure, a portion of a polishing material, and a seal between the support structure and the polishing material. The polishing material moves relative to the support structure and seal. A variety of seal configurations can maintain the fluid within the cavity. In one embodiment the seal mechanism is a labyrinth seal including multiple ridges. In one embodiment, the seal mechanism is a face-sealing seal which includes a jacket with a u-shaped cross section with a compressible element positioned within it. The face-sealing seal is in a groove positioned outside of the cavity. Alternatively, the face-sealing seal forms the outer edge of the cavity. In a further embodiment, the seal is an o-ring seal positioned within a double dove-tailed groove.

Abstract: An apparatus and method for in-situ monitoring of thickness during chemical-mechanical polishing (CMP) of a substrate using a polishing tool and a film thickness monitor. The tool has an opening placed in it. The opening contains a monitoring window secured in it to create a monitoring channel. A film thickness monitor (comprising an ellipsometer, a beam profile reflectometer, or a stress pulse analyzer) views the substrate through the monitoring channel to provide an indication of the thickness of a film carried by the substrate. This information can be used to determine the end point of the CMP process, determine removal rate at any given circumference of a substrate, determine average removal rate across a substrate surface, determine removal rate variation across a substrate surface, and optimize removal rate and uniformity.

Abstract: An improved method and device for performing setup and adjustment of pressure shoes used in an abrasive finishing machine. The setup of the pressure shoe stop limit device is performed automatically and remotely. The stop limit is hydraulically locked in place and limits subsequent shoe rotation. This automatically positionable travel limit stop takes into account the natural spring of the various machine components, including the innate springiness of the surfacing head elastic covering which wears and deforms over time. The pressure shoe is adjusted relative to the surfacing head, and accounts for the undefinable characteristics of the overall machine.

Abstract: An apparatus for finishing a surface of a camshaft extending along an axis with the surface offset from the axis has a drive for rotating the camshaft about the axis, a support displaceable radially of the axis, and a plurality of pusher heads on the support. The heads are movable independently of each other toward and away from the camshaft relative to the support along respective angularly offset pusher axes extending radially of the camshaft. All the pusher heads are biased along the respective pusher axes toward the camshaft axis with substantially the same force.

Abstract: Abrasive belt machine tool for machining cylindrical bearing surface on shafts, in particular journals on camshafts or journals and/or crank pins on crankshafts, comprising for machining each bearing surface two opposed jaws 5 mounted on two arms 1 and each having first and second concave application surfaces 6a, 6b having different diameter in at least two different positions. The abrasive belt 9 passes in front of the concave surfaces 6a and 6b of the two jaws 5. The support 2 of the arms is mobile between at least two positions such that in one of said positions the first concave surface 6a can apply the abrasive belt 9 to a bearing surface 8a having a corresponding diameter on a first shaft and in the other of said positions the concave surfaces 6b can apply the abrasive belt 9 to a bearing surface having a corresponding diameter on a second shaft.

Abstract: A machine for polishing railway vehicle wheel axles comprising a U-shaped basic structure with a cradle form, on the vertical double walls of which are arranged a pair of support rollers for the respective wheels of a railway axle. A driving assembly having a pair of support arms for abrasive belts is disposed on the intermediate horizontal wall of said cradle and said arms being selective and intermittently displaced from one side to the other between the gap defined by the vertical double walls and selective and vertically displaced upwards between the intermediate horizontal wall of the cradle. The axle to be milled is kept on a horizontal plan in view of the action of the wheels.

Abstract: A polishing system such as a chemical mechanical belt polisher includes a hydrostatic fluid bearing that supports polishing pads and incorporates one or more of the following novel aspects. One aspect uses compliant surfaces surrounding fluid inlets in an array of inlets to extend areas of elevated support pressure around the inlets. Another aspect modulates or reverses fluid flow in the bearing to reduce deviations in the time averaged support pressure and to induce vibrations in the polishing pads to improve polishing performance. Another aspect provides a hydrostatic bearing with a cavity having a lateral extent greater than that of an object being polished. The depth and bottom contour of cavity can be adjusted to provide nearly uniform support pressure across an area that is surrounded by a retaining ring support. Changing fluid pressure to the retaining ring support adjusts the fluid film thickness of the bearing.

Abstract: A device for finishing cylindrical workpieces is described, having an arrangement for rotating the workpiece, two retaining arms, each having a support and a pressure cheek received in it, wherein at least one pressure cheek is floatingly seated on the associated support, and the pressure cheeks at least partially envelop the workpiece, a grinding belt, and belt guidance means guiding the grinding belt in such a way that it at least partially envelops the workpiece and is pressed against the workpiece by the pressure cheeks, as well as an arrangement which puts the retaining arms into a back-and-forth movement parallel with the axis of rotation (A) of the workpiece. Here, either the support or the pressure cheek have a lining of a plastic material, which slightly extends in a T-shape past the lateral walls of the quick-change adapter, and which can at least slightly be compressed elastically.

Abstract: A polishing system such as a chemical mechanical belt polisher includes a hydrostatic fluid bearing that supports polishing pads and incorporates one or more of the following novel aspects. One aspect uses compliant surfaces surrounding fluid inlets in an array of inlets to extend areas of elevated support pressure around the inlets. Another aspect modulates or reverses fluid flow in the bearing to reduce deviations in the time averaged support pressure and to induce vibrations in the polishing pads to improve polishing performance. Another aspect provides a hydrostatic bearing with a cavity having a lateral extent greater than that of an object being polished. The depth and bottom contour of cavity can be adjusted to provide nearly uniform support pressure across an area that is surrounded by a retaining ring support. Changing fluid pressure to the retaining ring support adjusts the fluid film thickness of the bearing.

Abstract: A chemical-mechanical polishing station having a belt-operated conditioner. The belt-operated conditioner comprises a longitudinal main body, a belt sprinkled with hard particles, and a plurality of rollers. The belt wraps around the external edge of the longitudinal main body and is capable of rotating at a constant speed. The axles of the roller are parallel to each other. Furthermore, all the rollers are positioned within but touching the belt. Consequently, the rollers can rotate when they are driven by the belt. The hard particles sprinkled along the belt are used for scouring the polishing pad so that polishing pad surface can be reconditioned and any residual impurity particles can be removed. The belt-operated conditioner further includes a cleaning device. The cleaning device is used for removing any impurity particles clinging onto the belt when the conditioner is in operation.

Abstract: A machine for machining internal surfaces of axisymmetric workpieces with an abrasive strip. The machine includes a roller for pressing the abrasive strip against a surface of the workpiece that is to be machined. The workpiece rotates about an axis, and the roller rotates about an axis parallel to the axis of the workpiece. The machine also includes a pulley positioned on either side of the roller, for guiding the abrasive strip to the roller and holding the abrasive strip in position relative to the roller. The abrasive is driven continuously over the roller during machining, to renew the abrasive where the roller presses the abrasive strip against the surface of the workpiece. The roller and pulleys can be moved oointo, out of, and within a workpiece.

Abstract: A machining assembly consisting of first and second pivotal jaws opposing each other. A clamping arrangement is provided for clamping the jaws and to apply a flexible strip of abrasive material against the machined surface. The first jaw containing a shoe element having a rigid pressure surface. The second jaw carries two reaction members. The second jaw presses the strip of abrasive material against the bearing surface. The second jaw carries two measuring tips movably mounted thereon for measuring the bearing surface. A displacement arrangement for separating the measuring tips apart when said jaws are unclamped and bringing these tips together when said jaws are clamped.

Abstract: A polishing tool uses a seal cavity containing a fluid that supports polishing pads against an object being polished. In one embodiment, the boundaries of the cavity include a support structure, a portion of a polishing material, and a seal between the support structure and the polishing material. The polishing material moves relative to the support structure and seal. A variety of seal configuration can maintain the fluid within the cavity. One seal includes an o-ring that the force of a spring, a magnet, or air pressure presses against the polishing material. A gas flow from outside the cavity or from an inlet inside the cavity can form a gas pocket in the cavity, adjacent the o-ring, to prevent leakage of the fluid past the o-ring. Another seal is formed by an aerostatic bearing. The fluid pressure in the cavity can be varied temporally to create vibrations in the polishing material to enhance polishing performance or can be varied spatially to change the pressure profile.

Abstract: The present invention includes a multiple abrasive belt apparatus in which endless abrasive belts are movable in a circuitous manner. Discrete belt assemblies each including an abrasive belt are mounted on a support structure and a single motor is used to run all of the discrete belt assemblies. A jack shaft is operatively connected to the motor by a first drive belt, and then in turn is operatively connected to first and second drive shafts by second and third drive belts. The first and second drive shafts are operatively connected, each to two discrete belt assemblies such that motive force is transferred from a single motor to four discrete belt assemblies.

Abstract: This invention relates to a flexible membrane polishing belt against which a substrate, for example a semiconductor wafer, is polished using chemical mechanical polishing principles. A fluidized layer is provided on a surface of a polishing member backing assembly which urges the moving polishing membrane toward the substrate held in a polishing head to be polished. The linear motion of the belt provides uniform polishing across the full width of the belt and provides the opportunity for a chemical mechanical polishing to take place. Several configurations are disclosed. They include belts which are wider than the substrate being polished, belts which cross the substrate being polished, but which provide relative motion between the substrate and the polishing belt, and polishing belt carriers having localized polishing areas which are smaller than the total area of the substrate to be polished.

Abstract: A wafer polishing apparatus includes a module frame; a continuous belt rotatable with respect to the frame, the belt having at least one vertically-oriented belt transverse portion including a polishing pad assembly; and at least one pivotable wafer-holding head drive within the frame and having a distal end portion movable to a vertical first position parallel and juxtaposed to the belt transverse portion. The head drive includes a wafer carrier for holding a wafer on the distal end portion of the head drive, while a drive moves the distal end portion and a held wafer into a vertical polishing position abutting the belt transverse portion and pressure is applied to the held-wafer against the polishing pad assembly while the wafer-holding distal end portion is rotated and swept side-by-side. After polishing the drive is reversed and the head drive is pivoted away from the belt transverse portion to a horizontal or other orientation and the then polished wafer removed.