Abstract: A semiconductor device manufacturing apparatus according to the present invention comprises a head for holding a semiconductor wafer, a retainer ring for surrounding the outer periphery of the semiconductor wafer held by the head, and a polishing pad for polishing a polished surface of the semiconductor wafer. This apparatus presses the polished surface of the semiconductor wafer against the polishing pad together with the retainer ring to polish the semiconductor wafer. The retainer ring used in the present invention has a surface that is in contact with the polishing pad, which increases a contact area of the retainer ring against the polishing pad in accordance with wear of the retainer ring.

Abstract: A finishing machine with at least two finishing stones and a stone turning unit is proposed, in which the stone turning unit may be coupled to a rotary drive of the workpiece holder. A separate drive for the stone turning unit may thus be omitted, which results in a reduced weight of the stone turning unit and therefore lower drive power requirement of the stone turning unit and an improved processing quality.

Abstract: A lens holder (16) is attached to a processing target lens (2) such that a holder center (O) coincides with a processing center position (21) of the lens. An axial deviation measuring mark (81a, 81b) is displayed on the processing target lens (2) to coincide with a reference position mark (80a, 80b) of the lens holder (16), and the circumferential surface of the processing target lens (2) undergoes primary processing. After primary processing, the axial deviation of the processing target lens (2) is measured from the reference position mark (80a, 80b) and axial deviation measuring mark (81a, 81b). When axial deviation exists, the lens holder (16) is removed from the processing target lens (2) and the processing target lens (2) is held again, so that the axial deviation is corrected. After that, the processing target lens (2) undergoes secondary processing.

Abstract: A carrier head that has a base assembly, a retaining ring assembly, a carrier ring, and a flexible membrane is described. A carrier ring has an annular upper portion and an annular lower portion having a lower surface with a smaller inner diameter than the upper surface of the annular upper portion, wherein the carrier ring circumferentially surrounds a retaining ring and has a lower surface to contact a polishing pad.

Abstract: A retaining ring has a generally annular body with a top surface, a bottom surface, an inner diameter surface, and an outer diameter surface. The outer diameter surface includes an outwardly projecting flange having a lower surface, and the bottom surface includes a plurality of channels.

Abstract: One embodiment provides a retaining ring assembly. The retaining ring assembly comprises a retaining ring configured to circumferentially surround and retain the substrate within an inner surface of the retaining ring, and a flexure coupled to the retaining ring. The flexure is configured to maintain a gap between an inner surface of a carrier ring and an outer surface of the retaining ring, and the carrier ring is circumferentially surrounding the retaining ring.

Abstract: The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.

Abstract: Provided is a double-sided lapping carrier comprising a base carrier having a first major surface, a second major surface and at least one aperture for holding a workpiece, said aperture extending from the first major surface through the base carrier to the second major surface, wherein the base carrier comprises a first metal, the circumference of said aperture is defined by a third surface of the base carrier consisting of the first metal and, at least a portion of the first major surface or at least a portion of each of the first and the second major surfaces comprises a polymeric region, said polymeric region comprising a polymer having a work to failure of at least 10 Joules. Also provide are methods of lapping.

Abstract: A retainer ring and a method of using the retainer ring are provided. The retainer ring has openings along a bottom surface. Grooves encompass the openings and extend to an interior portion of the retainer ring wherein a semiconductor wafer may be held. In operation, a semiconductor wafer is placed inside the retainer ring. As the retainer ring and the semiconductor wafer are moved relative to an underlying polishing pad, slurry is dispensed through the openings in the retainer ring. The grooves in the retainer ring allow the slurry to flow from the openings to the interior portion of the retainer ring and the semiconductor wafer.

Abstract: An improved chemical mechanical polishing retaining ring. A representative embodiment comprises a base portion made from a wear-resistant plastic material, and an upper portion, or backbone portion, made from a stiffer and more wear resistant material. One of the base or backbone portion is preferably overmolded onto the other. The base portion can be generally defined by a flat pad-contacting surface, an outer surface, and an inner surface. The base portion can additionally include channels extending from the outer surface to the inner surface to facilitate transfer of slurry to and from the substrate to be polished during the process. One or both of the base portion or backbone portion further includes a plurality of circular ribs that serve to create additional bonding surface with the overmolded material. The retaining ring may additionally includes a plurality of bosses with threaded insert holes by which the retaining ring is attached to a chemical mechanical polishing system.

Abstract: A polishing apparatus includes a polishing pad for polishing a wafer and a polishing head for holding the wafer. The polishing head includes a retainer ring, a membrane sheet, and a head body. The retainer ring retains the wafer in a horizontal direction. The membrane sheet depresses the wafer to the polishing pad. The head body supports the retainer ring and the membrane sheet. The retainer ring includes a fixed retainer ring and a released retainer ring. The released retainer ring is interposed between the inner periphery of the fixed retainer ring and the periphery of the wafer to retain the wafer in the horizontal direction.

Abstract: A chemical-mechanical polishing apparatus including a table top, a transfer station mounted on the table top, a plurality of polishing stations mounted on the table top, a plurality of washing stations, and a plurality of carrier heads supported by a support member rotatable about an axis. Each washing station is located between a first polishing station and either a second polishing station or the transfer station, and the transfer station and the plurality of polishing stations are arranged at approximately equal angular intervals about the axis.

Abstract: The vacuum chuck according to the present invention is provided with a sucking plate for sucking and holding an object to be sucked, in which a sucking layer made of a porous ceramic and a dense material layer are integrated, the sucking layer being located on the side for sucking the object to be sucked, wherein the dense material layer is formed by impregnating the porous ceramic with a metal.

Abstract: A carrier head that has a housing, a base assembly, a retaining ring, a carrier ring, and a flexible membrane is described. The base assembly is vertically movable relative to the housing. The retaining ring is connected to and vertically movable relative to the base assembly and has a lower surface configured to contact a polishing pad and an inner surface configured to circumferentially surround the edge of a substrate to retain the substrate. The carrier ring is connected to and vertically fixed relative to the base assembly, circumferentially surrounds the retaining ring to prevent lateral motion of the retaining ring, and has a bottom surface configured to contact a polishing pad.

Abstract: To facilitate with high accuracy adjustment of a minute angle degree and also to sufficiently secure the rigidity of a whole device after the adjustment.

Abstract: The present invention facilitates with high accuracy the adjustment of a minute angle degree, and also is capable of sufficiently securing the rigidity of the whole device after the adjustment and provides good operability, accuracy, and rigidity. Provided are a workpiece attaching body having a workpiece attaching surface and a rotating body rotatably supporting the workpiece attaching body.

Abstract: Provided are a substrate supporting unit and a single type substrate polishing apparatus using the substrate supporting unit. During a polishing process, the bottom surface of a substrate is attached to the substrate supporting unit by vacuum suction, and during a post-cleaning process, the substrate is supported by the substrate supporting unit at a position spaced apart from the substrate supporting unit for cleaning the bottom surface of the substrate. Therefore, according to the substrate supporting unit and the substrate polishing apparatus using the substrate supporting unit, in a state where the substrate is supported by the single type substrate supporting unit, a process for polishing the top surface of the substrate and a post-process for cleaning the top and bottom surfaces of the substrate can be sequentially performed.

Abstract: A substrate holding device according to the present invention includes an elastic membrane to be brought into contact with a rear surface of a substrate, an attachment member for securing at least a portion of the elastic membrane, and a retainer ring for holding a peripheral portion of the substrate while in contact with the elastic membrane. The elastic membrane comprises at least one projecting portion, and the attachment member comprises at least one engagement portion engaging side surfaces of the at least one projecting portion of the elastic membrane. The elastic membrane further comprises bellows portions expandable in a pressing direction so as to allow the elastic membrane to press the substrate, and contractible along the pressing direction.

Abstract: The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.

Abstract: The present invention provides a carrier for double-side polishing apparatus which is set between upper and lower turn tables having polishing pads attached thereto and has a holding hole in which a semiconductor wafer sandwiched between the upper and lower turn tables is held at the time of polishing in a double-side polishing apparatus, wherein a material of the carrier is titanium, and surface roughness of the titanium carrier is 0.14 ?m or above in terms of Ra. As a result, there can be provided the carrier for double-side polishing apparatus, a double-side polishing apparatus, and a double-side polishing method that can stably and efficiently produce a high-quality wafer having reduced wafer peripheral sag and a high flatness at the time of double-side polishing of a semiconductor wafer.

Abstract: A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.

Abstract: The present invention is a polishing head provided with an annular rigid ring, a rubber film bonded to the rigid ring with a uniform tension, a mid plate joined to the rigid ring and forming a space portion together with the rubber film and the rigid ring, and an annular template provided concentrically with the rigid ring in a peripheral portion on a lower face part of the rubber film and having an outer diameter larger than an inner diameter of the rigid ring, in which a pressure of the space portion can be changed by a pressure adjustment mechanism, a back face of a work is held on the lower face part of the rubber film, and a surface of the work is brought into sliding contact with the polishing pad attached onto a turn table for performing polishing, and an inner diameter of the template is smaller than an inner diameter of the rigid ring, and a ratio between an inner diameter difference between the rigid ring and the template and a difference between the inner diameter and an outer diameter of the templ

Abstract: A holding mode is selectively switched, in accordance with the content of processing of a substrate, among three holding modes: (a) a first holding mode in which while first support pins F1 through F12 abut on the back surface of a substrate W and support the substrate W, the substrate W is held because of nitrogen gas which is supplied to the front surface of the substrate W; (b) a second holding mode in which while second support pins S1 through S12 abut on the edge surface of the substrate W as the substrate W moves along the horizontal direction, thereby restricting horizontal movement of the substrate W, and abut on the back surface of the substrate W, thereby supporting the substrate W, the substrate W is held because of nitrogen gas which is supplied to the back surface of the substrate W; and (c) a third holding mode in which while the first and the second support pins F1 through F12 and support pins S1 through S12 abut on the back surface of the substrate W, the substrate W is held because of nitroge

Abstract: The edge effect or variation in polishing edge profile on a substrate undergoing CMP is reduced by structuring a retaining ring, housed in a carrier head for retaining the substrate, such that the polishing edge profile shifts back and forth with respect to the center of the substrate. Embodiments include structuring the retaining ring such that the width between inner and outer surfaces varies by an amount sufficient to compensate for polishing edge profile variation. Embodiments also include structuring the retaining ring such that the distance from the outer surface to the geometric inner surface varies. Embodiments further include structuring the retaining ring such that the distance between the outer surface to the perimeter of the substrate retained by the inner surface of the retaining ring varies.

Abstract: A wafer grinding and tape attaching apparatus and method, the method includes providing a wafer to a chuck table, grinding a back side of the wafer, providing a wafer ring having dicing tape and attaching the dicing tape to the back side of the ground wafer.

Abstract: A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically.

Abstract: A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.

Abstract: A carrier head for a chemical mechanical polishing apparatus includes a retaining ring having a flexible lower portion and a rigid upper portion.

Abstract: A carrier head that has a base assembly, a retaining ring assembly, a carrier ring, and a flexible membrane is described. A retaining ring assembly has a flexible membrane shaped to provide an annular chamber and an annular retaining ring, wherein annular concentric projections of the flexible membrane are sized to fit into annular concentric recesses of the annular retaining ring.

Abstract: The present invention provides a diamond-like carbon coated carrier for holding an object to be polished used for double-sided polishing, and a manufacturing method therefor. The carrier for holding a workpiece according to the present invention has a substrate whose entire surface is coated with diamond-like carbon. The method of the present invention includes coating the entire carrier surface with diamond-like carbon using a surface coating apparatus using plasma CVD.

Abstract: A carrier head (100) for a CMP tool, wherein the membrane (108) defining a chamber with a contact surface (102) of the carrier head (100) has a number of integral tubes (110) termining in openings coupled directly to the substrate (106), in addition to a main fluid flow passage (104) coupled to the chamber defined by the membrane (108). In use, during loading and polishing, a vacuum is applied to the main fluid flow passage (104) and the tubes (110) to hold the substrate (106) in flat engagement with the membrane (108) and contact surface (102). In order to unload the substrate (106), fluid pressure is applied to the substrate (106) via the tubes (110), whilst maintaining the application of the vacuum via the main fluid flow passage (104) so as to minimise bending and breakage of the substrate (106).

Abstract: A silicon wafer grinding apparatus, a retaining assembly used for the same, and a silicon wafer flatness correcting method are provided. More particularly, a silicon wafer grinding apparatus, a retaining assembly used for the same, and a silicon wafer flatness correcting method for correcting a wafer flatness in a final grinding process are provided. The silicon wafer grinding apparatus includes a grinding surface plate having a grinding pad attached thereon; a grinding head arranged opposite to the grinding surface plate and rotated in the same direction as that of the grinding surface plate; a backing film attached at a lower portion of the grinding head for supporting a wafer; and a retainer ring having an inner diameter (a wafer diameter+?) greater than a diameter of the wafer by as much as ? and disposed on the backing film. By forming a diameter or physical properties of a part of the backing film of the wafer retaining assembly, the wafer flatness of the final grinding may be corrected.

Abstract: The present invention provides a polishing apparatus for polishing a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

Abstract: The present invention related to a multiple fluid supplying apparatus for carrier of semiconductor wafer polishing system which comprises a rotary union at a driving side and a rotary union at a following side. The rotary union at a driving side comprises a central rotation axle; a fluid supplying tube body being disposed coaxially with the central rotation axle, being fixedly supported, and being formed with a plurality of fluid paths at an inside thereof; a sealing housing being disposed coaxially on an outer circumference of the fluid supplying tube body so as to be rotatably supported; and a sealing unit for maintaining air-tightness between the fluid supplying tube body and the sealing housing.

Abstract: A retaining ring for chemical mechanical polishing is described. The ring has a bottom surface with non-intersecting grooves. Alternating grooves are at opposing angles to one another.

Abstract: A polishing apparatus comprises a polishing plate (24), an abrasive cloth (25) attached to the surface of the polishing plate (24), a chuck (19) for holding and pressing one surface of a wafer (39) against the abrasive cloth (25), and a circular retaining ring (23) concentrically arranged on the periphery of the chuck (19). The retaining ring (23) is rotatable and vertically movable with respect to the chuck (19), and is pressed against the abrasive cloth (25) during the lapping step. The retaining ring (23) is lifted upward during the final polishing step, thereby preventing lapping grains from being brought into the final polishing stage. Accordingly, lapping and final polishing can be successively conducted using the same polishing head. With this structure, cost cutting of the apparatus can be realized, since lapping and final polishing are successively conducted using the same polishing head without bringing the lapping grains used for lapping into the final polishing stage.

Abstract: A two part retaining ring is described that has a lower ring and an upper ring. The lower ring contacts a polishing surface during chemical mechanical polishing. The upper surface and the lower surface of the lower ring have thick and thin subportions to increase the flexibility of the lower ring.

Abstract: The pneumatic blocking support which is used to block an optical lens (200) on a machine or device has means (3) for fixing it on a corresponding element of the machine or device. The blocking means comprise a central cavity (8) and a joint (9) having at least one annular part (9) against which the lens rests in order to define a depression chamber (11) with said cavity and joint. The blocking elements include stop members (10) which are created in order to provide the optical lens with a rigid seat after the elastic compression of the joint.

Abstract: A carrier head for chemical mechanical polishing is described. The carrier head includes a backing assembly, a housing and a damping material. The backing assembly includes a substrate support surface. The housing is connectable to a drive shaft to rotate with the drive shaft about a rotation axis. In one implementation, the damping material is in a load path between the backing assembly and the housing to reduce transmission of vibrations from the backing assembly to the housing.

Abstract: The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further includes a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for contacting the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus also includes a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

Abstract: A polishing device includes a polishing pad for polishing a wafer and a polishing head for holding the wafer. The polishing head has a retainer ring for retaining the wafer in the in-plane direction of the wafer, a membrane sheet for pressing the wafer against the polishing pad, and a head body for supporting the retainer ring and the membrane sheet. The retainer ring has a subordinate retainer member having a ring portion and a plurality of fins extending from the ring portion to retain the peripheral surface of the wafer. The subordinate retainer member has a thickness equal to the thickness of the wafer. The membrane sheet has a diameter larger than the wafer, and presses the wafer and the vicinity of the inner edge of the subordinate retainer member.

Abstract: Methods, systems and apparatus are provided for polishing an edge of a substrate. The invention includes an apparatus adapted to apply a preset pressure to a polishing film in contact with an edge of a substrate. The apparatus includes an actuator adapted to apply a preset pressure to the polishing film; and a controller coupled to the actuator and adapted to receive a signal indicative of a condition of the edge of the substrate, and to adjust a pressure applied by the actuator to the polishing film so as to maintain the preset pressure based on the received signal. Numerous other aspects are provided.

Abstract: A retaining ring for CMP is disclosed. The retaining ring has a plurality of grooves. The grooves have rounded sidewalls. Because the sidewalls of the grooves of the retaining ring are rounded, the slurry is not apt to accumulate around them and the pad is less scratched. Accordingly, the micro-scratches on the wafer surface are reduced and the yield of the CMP step is increased. Its operational method and application system are also disclosed in this invention.

Abstract: A polishing head used for CMP is described, including a retaining ring that is for engaging with a wafer, a membrane and an edge control ring. The membrane includes a bottom part for engaging with the wafer, and a lip part contiguous with the bottom part. The edge control ring is disposed between the retaining ring and the membrane, including a bottom part that has an abutting surface. The abutting surface of the edge control ring contacts with the external surface of the lip part of the membrane when the membrane is not inflated.

Abstract: A polishing apparatus comprises a first polishing table having a first polishing surface, a substrate carrier for holding a substrate and positioning the substrate so as to bring a surface of the substrate into contact with the first polishing surface, a pressing mechanism for pressing, against the first polishing surface, the surface of the substrate which has been brought into contact with the first polishing surface by the substrate carrier, a retainer ring mounted on the substrate carrier so as to surround the substrate which has been pressed against the first polishing surface by the pressing mechanism, and a retainer-ring-position-adjustment mechanism for adjustably positioning the retainer ring relative to the substrate, which has been pressed against the first polishing surface, in directions toward and away from the first polishing surface.

Abstract: A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

Abstract: A wafer carrier with a back pressure applicator system adapted to provide high resolution back pressure control. A plurality of millimeter scale distensible elements are disposed between the wafer carrier pressure plate and a process wafer, and selectively distended to provide excess backpressure to select small areas of a wafer known to exhibit resistance to removal vis-à-vis the surrounding wafer surface. Distensible elements may be in the form of expandable pneumatic chambers or electro-mechanical elements such as solenoids, shape memory elements, electrostatic plates, etc.

Abstract: A retainer ring is provided which may restrain the time taken for a break-in polish to a minimum. This retainer ring may be disposed inside of a holding head in a CMP apparatus which polishes a wafer chemically and mechanically; may have a ring shape so as to surround the periphery of the wafer; may press a polish surface of a polish pad; may be made of an engineering plastic material such as PPS; and may have a pressure surface for pressing the polish surface of the polish pad whose surface roughness is a center-line average roughness (Ra) of 0.2 ?m or below.

Abstract: A substrate holding apparatus has a substrate holder body with a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.

Abstract: A polishing apparatus has a top ring configured to hold a semiconductor wafer on a substrate holding surface, and a pushser configured to deliver the semiconductor wafer to the top ring and receive the semiconductor wafer from the top ring. The pushser includes a push stage having a substrate placement surface on which the semiconductor wafer is placed and an air cylinder configured to vertically move the push stage. The pushser also includes a high-pressure fluid port configured to eject a high-pressure fluid toward the semiconductor wafer.