Laminate Patents (Class 451/533)
  • Patent number: 8431489
    Abstract: A chemical mechanical polishing pad having a polishing layer with an integral window and a polishing surface adapted for polishing a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate, wherein the formulation of the integral window provides improved defectivity performance during polishing. Also provided is a method of polishing a substrate using the chemical mechanical polishing pad.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: April 30, 2013
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Mary Jo Kulp, Shannon H Williams
  • Patent number: 8425278
    Abstract: A structured abrasive article comprises a backing, and an abrasive layer disposed on and secured to the backing. The abrasive layer comprises shaped abrasive composites, each comprising abrasive particles dispersed in a binder. Each the shaped abrasive composites independently comprises: a base disposed on the backing; a plurality of walls extending away from the base, and a grinding surface not contacting the base. Adjacent walls share a common edge. Each wall independently forms a dihedral angle with the base of less than or equal to 90 degrees. The grinding surface has a plurality of: cusps, and facets that contact a recessed feature. At least a portion of the recessed feature is disposed closer to the base than each of the cusps. Each cusp is formed by an intersection of two of the walls and at least one of the facets. Use of the structured abrasive article to abrade a workpiece is also disclosed.
    Type: Grant
    Filed: August 26, 2009
    Date of Patent: April 23, 2013
    Assignee: 3M Innovative Properties Company
    Inventors: Scott R Culler, John D. Haas, Chaodi Li
  • Patent number: 8414669
    Abstract: The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a first membrane with low permeability; a two-component paste formed on the upper surface of the first membrane with low permeability for adhering the base material to the first membrane with low permeability; and a polyurethane paste formed on the lower surface of the first membrane with low permeability. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided. The polishing pad as mentioned above prevents the polishing pad from detaching from the polishing platen or head. The polishing pad is easy to be replaced without leaving residues on the polishing platen or head.
    Type: Grant
    Filed: September 16, 2010
    Date of Patent: April 9, 2013
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung
  • Patent number: 8398794
    Abstract: A method for manufacturing a polishing pad, which may be laminated, with a small number of manufacturing steps, high productivity and no peeling between a polishing layer and a cushion layer includes preparing a cell-dispersed urethane composition by a mechanical foaming method; continuously discharging the cell-dispersed urethane composition onto a face material, while feeding the face material; laminating another face material on the cell-dispersed urethane composition; curing the cell-dispersed urethane composition, while controlling its thickness to be uniform, so that a polishing layer including a polyurethane foam is formed; cutting the polishing layer parallel to the face into two pieces so that two long polishing layers each including the polishing layer and the face material are simultaneously formed; and cutting the long polishing layers to produce the polishing pad.
    Type: Grant
    Filed: November 11, 2011
    Date of Patent: March 19, 2013
    Assignee: Toyo Tire & Rubber Co., Ltd.
    Inventors: Takeshi Fukuda, Tsuguo Watanabe, Junji Hirose, Kenji Nakamura, Masato Doura
  • Publication number: 20130017769
    Abstract: An object of the present invention is to provide a polishing pad which enables high accuracy optical end-point detection in a state where polishing is carrying out, and which can prevent slurry leakage from a polishing layer to a cushion layer even in the case of being used for a long period. Another object is to provide a method for producing a semiconductor device using the polishing pad. The present invention relates to a polishing pad in which a polishing layer having a polishing region and a light-transmitting region, and a cushion layer having a through hole are laminated via a double-sided adhesive sheet such that the light-transmitting region and the through hole are laid one upon another, wherein a transparent member is stuck on an adhesive layer of the double-sided adhesive sheet in the through hole.
    Type: Application
    Filed: April 7, 2011
    Publication date: January 17, 2013
    Applicant: TOYO TIRE & RUBBER CO., LTD.
    Inventor: Tsuyoshi Kimura
  • Patent number: 8348723
    Abstract: A structured abrasive article includes a backing having a structured abrasive layer disposed on and secured thereto. The structured abrasive layer includes shaped abrasive composites that comprise abrasive particles and nonionic polyether surfactant dispersed in a crosslinked polymeric binder. The abrasive particles have a mean particle size of less than 10 micrometers. The nonionic polyether surfactant is not covalently bound to the crosslinked polymeric binder and is present in an amount of from 2.5 to 3.2 percent by weight based on a total weight of the shaped abrasive composites. The structured abrasive articles are useful for abrading a workpiece.
    Type: Grant
    Filed: September 16, 2009
    Date of Patent: January 8, 2013
    Assignee: 3M Innovative Properties Company
    Inventors: Edward J. Woo, Jimmie R. Baran, Jr., Scott R. Culler, Paul D. Graham
  • Patent number: 8349041
    Abstract: An abrasive article includes an abrasive layer having an array of protrusions. The abrasive layer has a thickness not greater than about 500 mils. The abrasive article is free of a backing layer.
    Type: Grant
    Filed: June 7, 2011
    Date of Patent: January 8, 2013
    Assignees: Saint-Gobain Abrasives, Inc., Saint-Gobain Abrasifs
    Inventor: Ramaswamy Sankaranarayanan
  • Patent number: 8337282
    Abstract: The present invention provides a polishing pad which can improve qualities of an object to be polished by improving the flatness of the object. A polishing surface 1a of a polishing pad 1 is subjected to a mechanical process, such as buffing, so that the flatness of the surface is improved, and corrugations on the polishing surface have a cycle of 5 mm-200 mm and a largest amplitude of 40 ?m or less. As a result, the flatness of the object polished by the polishing pad 1, such as a silicon wafer, is improved.
    Type: Grant
    Filed: August 31, 2007
    Date of Patent: December 25, 2012
    Assignee: Nitta Haas Incorporated
    Inventors: Jaehong Park, Shinichi Matsumura, Kouichi Yoshida, Yoshitane Shigeta, Masaharu Kinoshita
  • Publication number: 20120311935
    Abstract: Abrasive articles containing solid abrasive particles (A) selected from the group consisting of inorganic particles, organic particles and inorganic-organic hybrid particles (a1) having an average primary particle size of from 1 to 500 nm as determined by laser light diffraction and having electron donor groups (a2) chemically bonded to their surface are provided. The said solid abrasive particles (A) are distributed throughout or on top of or throughout and on top of a solid matrix (B). A method for manufacturing abrasive articles and a method for processing substrates useful for fabricating electrical and optical devices are provided. The said methods make use of the said abrasive articles.
    Type: Application
    Filed: January 19, 2011
    Publication date: December 13, 2012
    Applicant: BASF SE
    Inventors: Christof Kujat, Yuzhuo Li, Kenneth Rushing
  • Patent number: 8318298
    Abstract: Provided herein is a process for producing a layered sheet. The process involves preparing a cell dispersed urethane composition by a mechanical foaming method. The cell dispersed urethane composition is applied to a base material sheet and cured to produce a polyurethane foam layer of uniform thickness. A releasing sheet may be utilized to make the thickness of the polyurethane foamed layer uniform. Also, provided herein is a layered sheet produced by the above process. The polyurethane foamed layer may have spherical fine cells having an average cell diameter of 20 to 300 ?m. The polyurethane foamed layer may have a specific gravity of 0.2 to 0.5. The polyurethane foamed layer may also have a Asker C hardness of 10 to 50 degrees.
    Type: Grant
    Filed: March 2, 2011
    Date of Patent: November 27, 2012
    Assignee: Toyo Tire & Rubber Co., Ltd.
    Inventors: Junji Hirose, Takeshi Fukuda
  • Patent number: 8314029
    Abstract: A method for manufacturing a polishing pad containing substantially spherical cells and having high thickness accuracy includes preparing a cell-dispersed urethane composition by a mechanical foaming method; continuously discharging the cell-dispersed urethane composition from a single discharge port to a substantially central portion in the width direction of a face material A, while feeding the face material A; laminating a face material B on the cell-dispersed urethane composition; then uniformly adjusting the thickness of the cell-dispersed urethane composition by thickness adjusting means; curing the cell-dispersed urethane composition with the thickness adjusted in the preceding step without applying any additional load to the composition so that a polishing sheet including a polyurethane foam is formed; and cutting the polishing sheet.
    Type: Grant
    Filed: February 29, 2008
    Date of Patent: November 20, 2012
    Assignee: Toyo Tire & Rubber Co., Ltd.
    Inventors: Junji Hirose, Takeshi Fukuda, Masato Doura, Akinori Sato, Kenji Nakamura
  • Patent number: 8308532
    Abstract: Provided is a durable abrasive article which can conform even to a surface of a complicated shape and has an excellent abrasive power and which does not give any deep flaw to become a problem at a subsequent step and is not broken even when used in sanding the surface of the complicated shape. The abrasive article comprises a flexible resin film, an abrasive grain layer formed on the surface of the resin film, and an extremely flexible resin layer formed on the abrasive grain layer, wherein the flexible resin film has a thickness of 10 to 200 ?m, a tensile strength of 30 to 130 MPa and an elongation of 3 to 250%, wherein the abrasive grains of the abrasive grain layer are of P280 to P12, and wherein the extremely flexible resin layer has a 100% M of 1 to 20 MPa, a tensile strength of 20 to 90 MPa and an elongation of 250 to 1000%.
    Type: Grant
    Filed: January 13, 2010
    Date of Patent: November 13, 2012
    Assignee: Kovax Corporation
    Inventors: Akira Usui, Yukio Yoshida
  • Patent number: 8303382
    Abstract: A polishing pad, comprising a mounting surface and an opposing polishing surface with a polishing pattern having at least one aperture thereon, is formed with an adhesive layer adhered to the mounting surface with uniform adhesive strength therebetween. Embodiments include applying an adhesive layer to the mounting surface with uniform pressure prior to forming the polishing pattern on the polishing surface. Embodiments also include forming the polishing pattern having at least one aperture, forming a fitter having a surface pattern opposite to the polishing pattern and having a projection, positioning the fitter on the polishing pattern so that the projection fills the aperture in the polishing pattern forming a composite having substantially parallel opposing surfaces, applying pressure to bond the adhesive layer to the mounting surface with substantially uniform adhesive strength therebetween, and removing the fitter.
    Type: Grant
    Filed: October 4, 2006
    Date of Patent: November 6, 2012
    Assignee: IV Technologies Co., Ltd.
    Inventors: Yu-Piao Wang, Yun-Liang Ouyang
  • Patent number: 8277290
    Abstract: A polishing pad used in semiconductor polishing process is provided in the present invention and a pressure sensitive adhesive is used to couple the polishing pad. The polishing pad includes a substrate, and the substrate includes a polishing surface and a reverse surface corresponding to the polishing surface. The polishing pad is characterized by: a pressure sensitive adhesive formed on the reverse surface of the substrate and used to couple with a bottom layer, and the horizontal adhesion of the pressure sensitive adhesive is higher than the vertical adhesion of the pressure sensitive adhesive.
    Type: Grant
    Filed: August 31, 2009
    Date of Patent: October 2, 2012
    Assignee: Bestac Advanced Material Co., Ltd.
    Inventors: Allen Chiu, Yu-Lung Jeng
  • Patent number: 8257153
    Abstract: A polishing pad of excellent durability and adhesion between the polishing layer and the base material layer includes a polishing layer arranged on a base material layer, wherein the polishing layer includes a thermosetting polyurethane foam having roughly spherical interconnected cells having an average cell diameter of 20 to 300 ?m The polyurethane foam includes an isocyanate component and an active hydrogen-containing compound as starting material components, and the active hydrogen-containing compound includes 30 to 85% by weight of a high-molecular-weight polyol having 2 to 4 functional groups and a hydroxyl value of 20 to 100 mg KOH/g.
    Type: Grant
    Filed: November 27, 2007
    Date of Patent: September 4, 2012
    Assignee: Toyo Tire & Rubber Co., Ltd.
    Inventors: Takeshi Fukuda, Junji Hirose, Kenji Nakamura, Masato Doura, Akinori Sato
  • Patent number: 8251774
    Abstract: A structured abrasive article comprises an at least translucent film backing and an abrasive layer disposed on the backing. The abrasive layer comprises a plurality of shaped abrasive composites. The shaped abrasive composites comprise abrasive particles dispersed in a binder. The abrasive particles consist essentially of ceria particles having an average primary particle size of less than 100 nanometers. The binder comprises a polyether acid and a reaction product of components comprising a carboxylic(meth)acrylate and a poly(meth)acrylate, and, based on a total weight of the abrasive layer, the abrasive particles are present in an amount of at least 70 percent by weight. Methods of making and using the structured abrasive article are also disclosed.
    Type: Grant
    Filed: August 12, 2009
    Date of Patent: August 28, 2012
    Assignee: 3M Innovative Properties Company
    Inventors: William D. Joseph, Julie Y. Qian, Jimmie R. Baran, Jr., John J. Gagliardi
  • Patent number: 8246424
    Abstract: A polishing disc for a tool for the fine machining of optically active surfaces, particularly on spectacle lenses as workpieces, comprises a main body which has a center axis and on which there is fixed an intermediate layer which is softer than the main body and on which a polishing agent carrier rests. The intermediate layer has, with respect to the center axis, a radial inner region of substantially constant axial thickness and an adjoining radial outer region. The latter is formed or is fixed to the main body in a particular way so as to prevent the edge of the polishing disc from being imprinted on the machined surface of the workpiece in the form of very fine, scratch-like microstructures. Also proposed is a simple method which can be used to produce such a polishing disc.
    Type: Grant
    Filed: June 3, 2008
    Date of Patent: August 21, 2012
    Assignee: Satisloh AG
    Inventors: Peter Philipps, Lothar Urban
  • Patent number: 8221196
    Abstract: Shape memory chemical mechanical polishing pads are provided, wherein the shape memory chemical mechanical polishing pads comprise a polishing layer in a densified state. Also provided are methods of making the shape memory chemical mechanical polishing pads and for using them to polish substrates.
    Type: Grant
    Filed: April 15, 2008
    Date of Patent: July 17, 2012
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Richard D. Hreha, Ravichandra V. Palaparthi, Benjamin John Vining
  • Patent number: 8216030
    Abstract: The present invention relates to a flexible grinding product and a method of producing the same. Such a grinding product comprises a flexible underlay (1) which consists of two layers laminated to each other. These comprise a lower base layer (2) and an upper layer (3), a cavity layer. The underlay includes a top surface (5) having at least one adhesive layer (6) arranged thereto after lamination and a layer of grinding agent (7) applied by means of the adhesive layer. The grinding product is characterized in that the layer that is coated with grinding agent includes holes which form cavities (4), whereby the cavities provide space for grinding dust and grinding residues and facilitate their removal from the surface being ground.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: July 10, 2012
    Assignee: Oy KWH Mirka AB
    Inventor: Goran Hoglund
  • Patent number: 8206202
    Abstract: The present invention relates to a flexible grinding product and a method of producing the same. Such a grinding product comprises a flexible underlay (1) which consists of two layers laminated to each other. These comprise a lower base layer (2) and an upper layer (3), a cavity layer. The underlay includes a top surface (5) having at least one adhesive layer (6) arranged thereto after lamination and a layer of grinding agent (7) applied by means of the adhesive layer. The grinding product is characterized in that the layer that is coated with grinding agent includes holes which form cavities (4), whereby the cavities provide space for grinding dust and grinding residues and facilitate their removal from the surface being ground.
    Type: Grant
    Filed: October 27, 2011
    Date of Patent: June 26, 2012
    Assignee: Oy KWH Mirka AB
    Inventor: Goran Hoglund
  • Patent number: 8176909
    Abstract: A grinding tool for natural stone floors, artificial stone floors and industrial floors allows a greatest possible adaptation to the unevennesses of worn natural and artificial stone floors to be restored by using diamond tools that are flexibly attached. The diamond tools are fixed on a mat so that each individual diamond tool can adapt individually to the grooves and unevennesses of an animated natural stone and stone floor. The grinding pattern of a surface machined with said grinding tool corresponds to a newly produced natural stone or artificial stone floor.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: May 15, 2012
    Assignee: Ilgner-Schleif-Innovationen GmbH
    Inventor: Thomas Ilgner
  • Publication number: 20120115405
    Abstract: A double-sided pressure-sensitive adhesive tape 10 according to an embodiment of the present invention includes: a first pressure-sensitive layer 30 that serves as a pressure-sensitive adhesive surface to a surface plate; a second pressure-sensitive adhesive layer 40 that serves as a pressure-sensitive adhesive surface to a polishing member; and a substrate 20 between the first pressure-sensitive adhesive layer 30 and the second pressure-sensitive adhesive layer 40. In the double-sided pressure-sensitive adhesive layer 10 having such a layer structure, the loop tack adhesive strength of the first pressure-sensitive adhesive layer 30 is 16 N/50 mm or less.
    Type: Application
    Filed: November 3, 2011
    Publication date: May 10, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shuuhei Yamamoto, Koichi Ikeda, Kazuyuki Yagura
  • Publication number: 20120108065
    Abstract: A method for manufacturing a polishing pad, which may be laminated, with a small number of manufacturing steps, high productivity and no peeling between a polishing layer and a cushion layer includes preparing a cell-dispersed urethane composition by a mechanical foaming method; continuously discharging the cell-dispersed urethane composition onto a face material, while feeding the face material; laminating another face material on the cell-dispersed urethane composition; curing the cell-dispersed urethane composition, while controlling its thickness to be uniform, so that a polishing layer including a polyurethane foam is formed; cutting the polishing layer parallel to the face into two pieces so that two long polishing layers each including the polishing layer and the face material are simultaneously formed; and cutting the long polishing layers to produce the polishing pad.
    Type: Application
    Filed: November 11, 2011
    Publication date: May 3, 2012
    Applicant: Toyo Tire & Rubber Co., Ltd.
    Inventors: Takeshi FUKUDA, Tsuguo Watanabe, Junji Hirose, Kenji Nakamura, Masato Doura
  • Patent number: 8167690
    Abstract: A polishing pad of excellent durability has a polishing layer is arranged on a base material layer, and the polishing layer comprises a thermosetting polyurethane foam having roughly spherical interconnected cells with an average cell diameter of 35 to 300 ?m.
    Type: Grant
    Filed: April 23, 2007
    Date of Patent: May 1, 2012
    Assignee: Toyo Tire & Rubber Co., Ltd.
    Inventors: Takeshi Fukuda, Satoshi Maruyama, Junji Hirose, Kenji Nakamura, Masato Doura
  • Patent number: 8104464
    Abstract: Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be provided as a powder, thin sheet, or sheet of amorphous alloy. A template having a plurality of apertures arranged in a predetermined pattern may be used to place the superabrasive particles on a given substrate or matrix support material.
    Type: Grant
    Filed: May 11, 2009
    Date of Patent: January 31, 2012
    Inventor: Chien-Min Sung
  • Patent number: 8096859
    Abstract: A honing tool for honing holes in workpieces, having an abrasive portion including a first abrasive layer therearound of abrasive particles of a first size, including a region having a second abrasive layer of abrasive layers of a second size sufficiently smaller than the first size, so as to be disposed in interstices between abrasive particles of the first abrasive layer without altering the diametrical size of the first layer, and so as to provide enhanced wear resistance.
    Type: Grant
    Filed: December 18, 2008
    Date of Patent: January 17, 2012
    Assignee: Sunnen Products Company
    Inventor: John J. Schimweg
  • Patent number: 8092280
    Abstract: The present invention relates to a method for producing a glass substrate for a magnetic disk, the method including a step of polishing a main surface of a circular glass plate while supplying a polishing slurry containing a polishing material, in which polishing is performed, after a polishing surface is subjected to dressing treatment, by using a polishing pad having: a first resin foam layer which forms the polishing surface, includes a resin foam having pores with a pore diameter of more than 20 ?m and has a thickness of 400 ?m or less; and a second resin foam layer which is provided between a platen for fixing the polishing pad and the first resin foam layer, includes a resin foam having pores with a pore diameter of 20 ?m or less and has a thickness of 50 to 250 ?m, and in which a total thickness of the first resin foam layer and the second resin foam layer is 550 ?m or less, and a international rubber hardness degree of the polishing pad measured by the M method according to JIS K6253 is 40 IRHD or mor
    Type: Grant
    Filed: December 1, 2009
    Date of Patent: January 10, 2012
    Assignee: Asahi Glass Company, Limited
    Inventors: Mizuho Ishida, Norihito Shida, Katsuhiro Matsumoto, Kazuo Mannami
  • Patent number: 8087975
    Abstract: The present invention relates to a composite sheet for mounting a workpiece and a method for making the same. The composite sheet includes a buffer layer and an adsorption layer. The buffer layer has a plurality of continuous pores. The adsorption layer is located on the buffer layer for adsorbing a workpiece, and the compression ratio of the buffer layer is higher than that of the adsorption layer. Thereby, due to low hardness, good adsorption effect, and high compression ratio, the composite sheet of the present invention has good buffer effect.
    Type: Grant
    Filed: June 4, 2009
    Date of Patent: January 3, 2012
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Zong-Yao Ku
  • Patent number: 8083570
    Abstract: A multilayer chemical mechanical polishing pad is provided, having a polishing layer with a polishing surface, a polishing layer interfacial region parallel to the polishing surface and an outer perimeter; a porous subpad layer with a bottom surface, a porous subpad layer interfacial region parallel to the bottom surface and an outer perimeter; a pressure sensitive adhesive layer; and, a light transmissive window element; wherein the polishing layer interfacial region and the porous subpad layer interfacial region form a coextensive region; wherein the coextensive region secures the polishing layer to the porous subpad layer without the use of a laminating adhesive; wherein the pressure sensitive adhesive layer is applied to the bottom surface of the porous subpad layer; wherein an internal opening extends through the multilayer chemical mechanical polishing pad from the bottom surface to the polishing surface and is bounded by an internal peripheral edge of the porous subpad layer.
    Type: Grant
    Filed: October 17, 2008
    Date of Patent: December 27, 2011
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Darrell String, Jon William Turley
  • Patent number: 8066555
    Abstract: A polishing pad includes polishing elements interdigitated with one another over a surface of the polishing pad. Each of the polishing elements is secured so as to restrict lateral movement thereof with respect to others of the polishing elements, but remains moveable in an axis normal to a polishing surface of the polishing elements. Different densities of the polishing elements may be positioned within different areas of the surface of the polishing pad.
    Type: Grant
    Filed: August 28, 2008
    Date of Patent: November 29, 2011
    Assignee: SemiQuest inc.
    Inventor: Rajeev Bajaj
  • Patent number: 8066552
    Abstract: A polishing pad has a polishing layer and a backing layer secured to the polishing layer. The polishing layer has a polishing surface, a first thickness, a first compressibility, and a hardness between about 40 to 80 Shore D. The backing layer has a second thickness and has a second compressibility greater than the first compressibility. The first thickness, first compressibility, second thickness and second compressibility are such that the polishing surface deflects more than the thickness non-uniformity of the polishing layer under an applied pressure of 1.5 psi or less.
    Type: Grant
    Filed: January 26, 2005
    Date of Patent: November 29, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Alain Duboust, Shou-Sung Chang, Wei Lu, Siew Neo, Yan Wang, Antoine P. Manens, Yongsik Moon
  • Patent number: 8062102
    Abstract: Polishing pads are provided that include a substrate for a polishing pad and a plurality of spaced apart members on the substrate and protruding from the substrate. The plurality of members include at least one abrasive layer and at least one chemical additive layer. Related methods of fabricating polishing pads are also provided herein.
    Type: Grant
    Filed: August 20, 2004
    Date of Patent: November 22, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Moo-Yong Park, Jong-Won Lee, Sang-Rok Ha, Hong-Seong Son
  • Publication number: 20110269380
    Abstract: A polishing pad including a polishing layer and a base layer is provided. Disposed under the polishing layer, the base layer includes a porous inner layer and at least one surface layer. The porous inner layer has an upper surface and a lower surface. The surface layer is disposed on at least one of the upper surface and the lower surface of the porous inner layer. The surface layer has a pore ratio no larger than 0.3%, or is completely non-porous.
    Type: Application
    Filed: August 13, 2010
    Publication date: November 3, 2011
    Applicant: IV Technologies CO., Ltd.
    Inventors: Chao-Chin Wang, Chih-Cheng Chuang
  • Publication number: 20110244768
    Abstract: A polishing pad has one or more polishing elements made from a hydrogel material having an intrinsic ability to absorb water. The hydrogel material may or may not have micropores, but has a water absorption capability of 4%-60% by weight, a wet tensile strength greater than 1000 psi, a flexural modulus greater than 2000 psi, and a wet Shore D hardness between 25-80, inclusive. The hydrogel material may be made from one or a combination of the following moieties: urethane, alkylene oxides, esters, ethers, acrylic acids, acrylamides, amides, imides, vinylalcohols, vinylacetates, acrylates, methacrylates, sulfones, urethanes, vinylchlorides, etheretherketones, and/or carbonates.
    Type: Application
    Filed: June 16, 2011
    Publication date: October 6, 2011
    Inventor: Rajeev Bajaj
  • Patent number: 8012000
    Abstract: A method and apparatus for extending a polishing article lifetime on a polishing tool with multiple platens is described. The apparatus includes an advanceable roll to roll platen with multiple embodiments of a polishing article to be used thereon. The polishing article is adapted to perform a polishing process by removing conductive and dielectric material from a substrate while minimizing downtime of the polishing tool. In some embodiments, the polishing article may be a dielectric material or a conductive material and is configured to include a longer usable lifetime to minimize replacement and downtime of the tool.
    Type: Grant
    Filed: April 2, 2007
    Date of Patent: September 6, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Yuchun Wang, Robert A. Ewald, Wei-Yung Hsu, Liang-Yuh Chen
  • Publication number: 20110212673
    Abstract: A polishing pad has an opaque polishing layer with an aperture therethrough and a polishing surface, and a solid light-transmissive window in the aperture. The solid light-transmissive window includes an outer portion secured to the polishing layer and an inner portion secured to the outer portion. The outer portion has a upper surface recessed relative to the polishing surface, whereas the inner portion has an upper surface that is substantially co-planar with the polishing surface.
    Type: Application
    Filed: May 12, 2011
    Publication date: September 1, 2011
    Inventors: Dominic J. Benvegnu, Boguslaw A. Swedek, Jimin Zhang
  • Patent number: 8002607
    Abstract: A polishing apparatus is provided for polishing wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer by applying a pressure between a polishing member (polishing pad) 201 and the wafer held by a holding member (top ring) 52 and moving the polishing member relative to the wafer. The polishing apparatus includes a top ring 52 for holding the wafer, a pressure adjusting mechanism for adjusting a supporting pressure with which the wafer is supported on a supporting surface by a retainer ring, and a control unit for controlling the pressure adjusting mechanism to bring the supporting pressure to a desired pressure based on a roll off quantity of the wafer. The top ring comprises an air bag 202 for pressing the wafer against the polishing pad, a retainer ring which surrounds the wafer, and an air bag for pressing the retainer ring.
    Type: Grant
    Filed: August 30, 2005
    Date of Patent: August 23, 2011
    Assignee: Ebara Corporation
    Inventors: Akira Fukuda, Yoshihiro Mochizuki, Kazuto Hirokawa
  • Publication number: 20110171891
    Abstract: A sanding implement for filing nails or for general sanding purposes includes a readily compressible elongated body having contoured sides, with a sheet of sand paper bonded to at least one of a pair of planar surfaces defined between the sides, the sides of a substantial thickness to provide smooth side surfaces able to be comfortably gripped by a user during use.
    Type: Application
    Filed: January 11, 2011
    Publication date: July 14, 2011
    Inventor: Emiddio Zarro
  • Patent number: 7963827
    Abstract: An abrasive article includes an abrasive layer having an array of protrusions. The abrasive layer has a thickness not greater than about 500 mils. The abrasive article is free of a backing layer.
    Type: Grant
    Filed: July 13, 2007
    Date of Patent: June 21, 2011
    Assignees: Saint-Gobain Abrastives, Inc., Saint-Gobain Abrasifs
    Inventor: Ramaswamy Sankaranarayanan
  • Publication number: 20110130077
    Abstract: A polyurethane layer for forming a polishing pad for a semiconductor wafer is described, wherein the polyurethane layer comprises: a foamed polyurethane, wherein the polyurethane foam has a density of about 640 to about 960 kg/m3, and a plurality of cells having an average diameter of about 20 to about 200 micrometers; and particles of a hydrophobic polymer having a critical surface energy of less than 35 mN/m and having a median particle size of 3 to 100 micrometers. Polishing pads as well as methods for polishing are also described.
    Type: Application
    Filed: May 27, 2010
    Publication date: June 2, 2011
    Inventors: Brian Litke, Michele K. Koss
  • Patent number: 7938717
    Abstract: A flexible, hand-held sanding pad comprises a conformable, multi layered, semicircle pad having a surface capable of providing temporary adhesive attachment for a sheet of pressure-sensitive adhesive-coated abrasive material.
    Type: Grant
    Filed: July 27, 2007
    Date of Patent: May 10, 2011
    Inventor: Glen Stuhlmacher
  • Publication number: 20110070814
    Abstract: The present invention relates to a method for manufacturing a polishing pad. The method of the invention includes the steps of forming a polishing layer from a polyurethane solution has a solid content more than about 90 wt % and drying the polyurethane solution at a temperature from about 130° C. to about 170° C. The invention also provides a polishing pad manufactured by the method mentioned above. The defect of scraping the surface of the substrate to be polished due to polishing particles remaining is avoided when applying the polishing pad according to the invention, and the flatness of the substrate to be polished is raised and the defective rate is eliminated also.
    Type: Application
    Filed: September 21, 2010
    Publication date: March 24, 2011
    Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung, Lyang-Gung Wang
  • Publication number: 20110045744
    Abstract: The present invention relates to a polishing pad that comprises a polishing sheet for polishing a substrate, a buffer sheet comprising a plurality of holes, and adhesive for adhering the buffer sheet to the polishing sheet; wherein the adhesive is formed by polymerizing macromolecules with fluidity. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.
    Type: Application
    Filed: August 24, 2010
    Publication date: February 24, 2011
    Applicant: BESTAC ADVANCED MATERIAL CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung, Lyang-Gung Wang, Wen-Chieh Wu
  • Patent number: 7874894
    Abstract: A polishing pad provides excellent optical detection accuracy properties over a broad wavelength range (particularly at the short-wavelength side) and is capable of preventing a slurry from leaking from the boundary between a polishing region and a light-transmitting region. The polishing pad includes at least a transparent support film laminated on one side of a polishing layer including a polishing region and a light-transmitting region; the light transmittance of an optical detection region containing at least the light-transmitting region and the transparent support film is 40% or more in the overall range of wavelengths of 300 to 400 nm.
    Type: Grant
    Filed: May 15, 2007
    Date of Patent: January 25, 2011
    Assignee: Toyo Tire & Rubber Co., Ltd.
    Inventors: Takeshi Fukuda, Junji Hirose, Yoshiyuki Nakai, Tsuyoshi Kimura
  • Patent number: 7875335
    Abstract: The present invention provides a polishing pad. The polishing pad comprises a transparent part and a high molecular weight layer. The transparent part has an uneven side surface and the profile of the uneven side surface is selected from a group consisting of a serrated shape, a wavy shape and a toothed shape. The high molecular weight layer encircles the transparent part.
    Type: Grant
    Filed: April 24, 2006
    Date of Patent: January 25, 2011
    Assignee: IV Technologies Co., Ltd.
    Inventors: Wen-Chang Shih, Yung-Chung Chang, Min-Kuei Chu, Lung-Chen Wei
  • Patent number: 7871309
    Abstract: It is an object of the invention to provide a polishing pad capable of high precision optical detection of an endpoint during polishing in progress and prevention of slurry leakage from between a polishing region and a light-transmitting region during the use thereof even after the polishing pad has been used for a long period. It is a second object of the invention to provide a polishing pad capable of suppression of deterioration of polishing characteristics (such as in-plane uniformity) and generation of scratches due to a difference in behavior of a polishing region and a light-transmitting region during polishing. It is a third object of the invention to provide a polishing pad having a polishing region and a light-transmitting region with a concentration of a specific metal equal to or lower than a specific value (threshold value).
    Type: Grant
    Filed: December 8, 2005
    Date of Patent: January 18, 2011
    Assignee: Toyo Tire & Rubber Co., Ltd.
    Inventors: Kazuyuki Ogawa, Tetsuo Shimomura, Atsushi Kazuno, Yoshiyuki Nakai, Masahiro Watanabe, Takatoshi Yamada, Masahiko Nakamori
  • Publication number: 20110009039
    Abstract: A method and apparatus for an abrasive laden wire is described. In one embodiment, an abrasive coated wire is described. The wire includes a core wire having a symmetrical pattern of abrasive particles coupled to an outer surface of the core wire, and a dielectric film covering portions of the core wire between the abrasive particles.
    Type: Application
    Filed: June 4, 2010
    Publication date: January 13, 2011
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Venkata R. Balagani, Mathijs Pieter Van Der Meer
  • Patent number: 7841925
    Abstract: A polishing article includes a polishing layer having a polishing surface and a solid light-transmissive window in the polishing layer, the window having a first non-linear edge that extends along a first axis parallel to the polishing surface, the first non-linear edge including a plurality of projections and a plurality of recesses extending parallel to the polishing surface and disposed in an alternating pattern along the first axis.
    Type: Grant
    Filed: June 19, 2009
    Date of Patent: November 30, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Gregory E. Menk, Peter McReynolds, Erik S. Rondum, Anand N. Iyer, Gopalakrishna B. Prabhu, Garlen C. Leung
  • Patent number: 7828634
    Abstract: The polishing pad (104) is useful for polishing at least one of magnetic, optical and semiconductor substrates (112) in the presence of a polishing medium (120). The polishing pad (104) includes a plurality of polishing elements (402, 502, 602, 702). The polishing elements (402, 502, 602, 702) are aligned in a vertical direction and having a first and a second end. A plurality of junctions (404, 510, 610, 710) connects the first and second ends of the polishing elements (402, 502, 602, 702) with at least three polishing elements at each of the plurality of junctions (404, 510, 610, 710) for forming a tier. Each tier representing a thickness in the vertical direction between the first and second ends of the polishing elements (402, 502, 602, 702). And an interconnected lattice structure (400, 600) forms from connecting sequential tiers of the plurality of junctions (404, 504) that connect the polishing elements (402, 502, 602, 702).
    Type: Grant
    Filed: August 16, 2007
    Date of Patent: November 9, 2010
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Bo Jiang, Gregory P. Muldowney
  • Patent number: 7828633
    Abstract: The invention concerns a sanding element with a succession of overlapping lamellas (3, 4) comprising sanding grains (9), characterized in that these lamellas (3, 4) are alternately formed of sanding lamellas (3) and compressible lamellas (4), whereby each sanding lamella (3) rests on a compressible lamella (4).
    Type: Grant
    Filed: August 23, 2010
    Date of Patent: November 9, 2010
    Assignee: Cibo N.V.
    Inventor: Dominique Gilles