Laminate Patents (Class 451/533)
  • Patent number: 7820005
    Abstract: A method for making a multilayer chemical mechanical polishing pad comprising: providing a polishing layer, providing a subpad layer, optionally providing additional layers, providing an unset reactive hot melt adhesive, applying the unset reactive hot melt adhesive in a pattern on a surface of at least one of the layers, applying one of the other layers over the pattern of unset reactive hot melt adhesive, pressing the two layers together with the unset reactive hot melt adhesive interposed therebetween, allowing the unset reactive hot melt adhesive to set forming a reactive hot melt adhesive bond between the two layers.
    Type: Grant
    Filed: July 18, 2008
    Date of Patent: October 26, 2010
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: Michelle Jensen, John Gifford Nowland, Brenda Harding, Carol Corder
  • Publication number: 20100267318
    Abstract: A polishing pad include a polishing layer having a polishing surface and a backing layer on a side of the polishing layer opposite the polishing surface. An outer edge of the polishing layer overhangs an outer edge of the backing layer.
    Type: Application
    Filed: June 25, 2010
    Publication date: October 21, 2010
    Inventors: Alain Duboust, Shou-Sung Chang, Wei Lu, Siew Neo, Yan Wang, Antoine P. Manens, Yongsik Moon
  • Patent number: 7815491
    Abstract: The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a membrane with low permeability; a two-component paste formed on the upper surface of the membrane with low permeability for adhering the base material to the membrane with low permeability; and a polyurethane paste formed on the lower surface of the membrane with low permeability. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided. The polishing pad as mentioned above prevents the polishing pad from detaching from the polishing platen or head. The polishing pad is easy to be replaced without leaving residues on the polishing platen or head.
    Type: Grant
    Filed: May 29, 2007
    Date of Patent: October 19, 2010
    Assignee: San Feng Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung
  • Patent number: 7794562
    Abstract: A method of manufacturing a chemical mechanical polishing pad is provided, comprising: providing a polishing layer; providing a chemical mechanical polishing pad manufacturing assembly, comprising: a subpad layer having a top surface, a bottom surface and at least two wrap around tabs; a backing plate having a top side and a bottom side; a sacrificial layer having at least two recessed areas designed to facilitate attachment of the subpad layer to the backing plate; an unset reactive hot melt adhesive applied to the top surface of the subpad layer, wherein the unset reactive hot melt adhesive is applied in a pattern of parallel lines; wherein the subpad layer is disposed on the top side of the backing plate and the sacrificial layer is disposed on the bottom side of the backing plate, and wherein the at least two wrap around tabs extend to the bottom side of the backing plate; stacking the polishing layer and the chemical mechanical polishing pad manufacturing assembly with the unset reactive hot melt adhesiv
    Type: Grant
    Filed: November 9, 2009
    Date of Patent: September 14, 2010
    Assignee: rohm and Hass Electronic Materials CMP Holdings, Inc.
    Inventors: Michelle Jensen, John Gifford Nowland, Brenda Harding, Carol Corder
  • Patent number: 7775852
    Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.
    Type: Grant
    Filed: April 5, 2005
    Date of Patent: August 17, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Manoocher Birang, Nils Johansson, Allan Gleason
  • Patent number: 7771251
    Abstract: The polishing pad (104) is useful for polishing at least one of magnetic, optical and semiconductor substrates (112) in the presence of a polishing medium (120). The polishing pad (104) includes a three-dimensional network of interconnected unit cells (225). The interconnected unit cells (225) are reticulated for allowing fluid flow and removal of polishing debris. A plurality of polishing elements (208, 308 and 408) form the three-dimensional network of interconnected unit cells (225). The polishing elements (208, 308 and 408) have a first end connected to a first adjacent polishing element at a first junction (209, 309 and 409) and a second end connected to a second adjacent polishing element at a second junction (209, 309 and 409) and having a cross-sectional area (222, 322 and 422) that remains within 30% between the first and the second junctions (209, 309 and 409).
    Type: Grant
    Filed: October 10, 2008
    Date of Patent: August 10, 2010
    Assignees: Rohm and Haas Electronic, Electronic Materials CMP Holding, Inc.
    Inventor: Gregory P. Muldowney
  • Patent number: 7762873
    Abstract: A polishing pad includes a body having a polymer layer and a polishing layer. The polymer layer has opposite first and second faces. The polymer layer includes a plurality of first ultrafine fibers and a polymer bonding the first ultrafine fibers together. The polishing layer is formed on the first face of the polymer layer. The polishing layer includes a plurality of second ultrafine fibers and is free of the polymer. The first and second ultrafine fibers are identical to each other. The second ultrafine fibers have a first concentration of ultrafine fibers by volume higher than 80% a total volume of the polishing layer. The first ultrafine fibers of the polymer layer have a second concentration of ultrafine fibers by volume to a total volume of the polymer layer. The first concentration is higher than the second concentration.
    Type: Grant
    Filed: May 13, 2008
    Date of Patent: July 27, 2010
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, Chen-Hsiang Chao, I-Peng Yao
  • Patent number: 7744447
    Abstract: An abrasive disc comprises a disc substrate having a peripheral portion, plural abrasive chips each having an abrasive layer on a metal piece and being arranged in the peripheral portion of the disc substrate with a predetermined space, a suspension plate placed between the disc substrate and abrasive chips, and an elastic sheet placed between the disc substrate and the suspension plate so as to isolate the disc substrate from the suspension plate in order to absorb mechanical shock generated in operation of the abrasive disc. The abrasive chips are fastened to the suspension plate. Each of the abrasive chips has abrasive surfaces including a top abrasive surface and peripheral surfaces and the outer peripheral portion and the inner peripheral portion are declined to the top surface.
    Type: Grant
    Filed: March 16, 2005
    Date of Patent: June 29, 2010
    Assignee: Goei, Co., Ltd.
    Inventors: Noriomi Kodani, Akihiko Nagaya, Katsuhiro Kawasaki
  • Patent number: 7727056
    Abstract: The invention concerns a sanding element with a succession of overlapping lamellas (3, 4) containing sanding grains (9), characterized in that these lamellas (3, 4) are alternately formed of sanding lamellas (3) and compressible lamellas (4), whereby each sanding lamella (3) rests on a compressible lamella (4).
    Type: Grant
    Filed: March 3, 2005
    Date of Patent: June 1, 2010
    Assignee: CIBO N.V.
    Inventor: Dominique Gilles
  • Publication number: 20100130112
    Abstract: A polishing pad includes a guide plate, a compressible foam under layer disposed adjacent to a lower surface of the guide plate, and a plurality of polishing elements that extend in a first direction substantially normal to a plane defined by the guide plate and through the guide plate. The pad further includes an optical path along the first direction and which is defined by an aperture in the compressible foam under layer and the guide plate. The optical path includes a transparent window that extends above an upper surface of the guide plate but below tips of the polishing elements, the upper surface of the guide plate being opposite the lower surface thereof. An optional slurry distribution layer may be disposed on the upper surface of the guide plate, in which case the polishing elements extend through the slurry distribution layer and the transparent window extends beyond a top surface thereof.
    Type: Application
    Filed: November 11, 2009
    Publication date: May 27, 2010
    Inventor: Rajeev Bajaj
  • Publication number: 20100120343
    Abstract: The invention provides a cushion for a polishing pad, wherein, when a dynamic compression viscoelasticity measurement is performed under conditions of 23° C., a static load of 27.6 kPa, a frequency of 11 Hz and an amplitude of 1 ?m, (1) a phase difference between dynamic stress and deformation is 4° or less, and (2) a ratio of the maximum value of the deformation amount to the maximum value of the dynamic stress ([maximum value of deformation amount]/[maximum value of dynamic stress]) is 0.5 ?m/kPa or more. The invention also provides a polishing pad having a layer of the cushion for a polishing pad and a polishing layer.
    Type: Application
    Filed: March 19, 2008
    Publication date: May 13, 2010
    Applicant: KURARAY CO., LTD.
    Inventors: Mitsuru Kato, Hirofumi Kikuchi, Shinya Kato
  • Publication number: 20100099344
    Abstract: A multilayer chemical mechanical polishing pad is provided, having a polishing layer with a polishing surface, a polishing layer interfacial region parallel to the polishing surface and an outer perimeter; a porous subpad layer with a bottom surface, a porous subpad layer interfacial region parallel to the bottom surface and an outer perimeter; a pressure sensitive adhesive layer; and, a light transmissive window element; wherein the polishing layer interfacial region and the porous subpad layer interfacial region form a coextensive region; wherein the coextensive region secures the polishing layer to the porous subpad layer without the use of a laminating adhesive; wherein the pressure sensitive adhesive layer is applied to the bottom surface of the porous subpad layer; wherein an internal opening extends through the multilayer chemical mechanical polishing pad from the bottom surface to the polishing surface and is bounded by an internal peripheral edge of the porous subpad layer and a corresponding interna
    Type: Application
    Filed: October 17, 2008
    Publication date: April 22, 2010
    Inventors: Darrell String, Jon William Turley
  • Patent number: 7690971
    Abstract: Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method of improving retention of superabrasive particles held in a solidified organic material layer of an abrading tool, a portion of each of said superabrasive particles protruding out of the solidified organic material layer is provided. The method may include securing a plurality of superabrasive particles in the solidified organic material layer in an arrangement that minimizes mechanical stress impinging on the protruding portion of any individual superabrasive particle when used to abrade a work piece. As an example, the arrangement of the plurality of superabrasive particles may be configured to uniformly distribute frictional forces across substantially each superabrasive particle.
    Type: Grant
    Filed: March 14, 2007
    Date of Patent: April 6, 2010
    Inventor: Chien-Min Sung
  • Patent number: 7662028
    Abstract: A groove structure for avoiding stripping of a polishing surface of a polishing pad, the polishing pad including a base material and a grinding layer. The base material has a surface. The grinding layer is disposed on the surface, and part of the surface around the edge of the base material is exposed. The grinding layer has a plurality of first grooves and second grooves, and the first grooves cross the second grooves to define a plurality of grinding areas. The exposed part of the surface around the edge of the base material is located between the first grooves, the second grooves and the edge of the polishing pad. The polishing pad contains more grinding liquid, to clean the small grinded pieces. The grinding layer does not have an acute structure and is not easily peeled to form the small grinded pieces. Therefore, grinding quality and grinding effect are improved.
    Type: Grant
    Filed: June 16, 2008
    Date of Patent: February 16, 2010
    Assignee: Bestac Advanced Material Co., Ltd.
    Inventors: Chung-Chih Feng, Wei-Te Liu, Yung-Chang Hung, Chun-Ta Wang, I-Peng Yao
  • Publication number: 20100029182
    Abstract: A polishing pad of excellent durability has a polishing layer is arranged on a base material layer, and the polishing layer comprises a thermosetting polyurethane foam having roughly spherical interconnected cells with an average cell diameter of 35 to 300 ?m.
    Type: Application
    Filed: April 23, 2007
    Publication date: February 4, 2010
    Applicant: TOYO TIRE & RUBBER CO., LTD.
    Inventors: Takeshi Fukuda, Satoshi Maruyama, Junji Hirose, Kenji Nakamura, Masato Doura
  • Patent number: 7654885
    Abstract: A polishing pad has a polishing layer and a backing layer secured to the polishing layer. The polishing layer has a polishing surface, a first thickness, a first compressibility, and a hardness between about 40 to 80 Shore D. The backing layer has a second thickness greater than the first thickness and a second compressibility greater than the first compressibility. The first thickness, first compressibility, second thickness and second compressibility are such that the polishing surface deflects at least 2 mil under an applied pressure of 1 psi or less.
    Type: Grant
    Filed: October 1, 2004
    Date of Patent: February 2, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Stan D. Tsai, Shou-Sung Chang, Liang-Yuh Chen
  • Publication number: 20100015902
    Abstract: A chemical mechanical polishing pad manufacturing assembly is provided having a subpad layer having a top surface and a bottom surface; a backing plate having a top side and a bottom side; a sacrificial layer having at least two recessed areas designed to facilitate attachment of a subpad layer to the backing plate; wherein the subpad layer is disposed on the top side of the backing plate and the sacrificial layer is disposed on the bottom side of the backing plate, and wherein the at least two wrap around tabs extend to the bottom side of the backing plate. Also provide is a method of manufacturing a chemical mechanical polishing pad using the chemical mechanical polishing pad manufacturing assembly.
    Type: Application
    Filed: July 18, 2008
    Publication date: January 21, 2010
    Inventors: Michelle Jensen, John Gifford Nowland, Brenda Harding, Carol Corder
  • Publication number: 20100009611
    Abstract: A method for inexpensively and easily manufacturing a polishing pad of excellent durability and polishing speed stability includes preparing a cell dispersed urethane composition by mechanical foaming, applying the cell dispersed urethane composition onto a base material layer, forming a polyurethane foamed layer having roughly spherical interconnected cells by curing the cell dispersed urethane composition, and regulating the thickness of the polyurethane foamed layer uniformly.
    Type: Application
    Filed: April 23, 2007
    Publication date: January 14, 2010
    Applicant: TOYO TIRE & RUBBER Co., LTD.
    Inventors: Takeshi Fukuda, Satoshi Maruyama, Junji Hirose, Kenji Nakamura, Masato Doura
  • Publication number: 20100009612
    Abstract: The present invention provides a polishing pad which can improve qualities of an object to be polished by improving the flatness of the object. A polishing surface 1a of a polishing pad 1 is subjected to a mechanical process, such as buffing, so that the flatness of the surface is improved, and corrugations on the polishing surface have a cycle of 5 mm-200 mm and a largest amplitude of 40 ?m or less. As a result, the flatness of the object polished by the polishing pad 1, such as a silicon wafer, is improved.
    Type: Application
    Filed: August 31, 2007
    Publication date: January 14, 2010
    Inventors: Jaehong Park, Shinichi Matsumura, Kouichi Yoshida, Yoshitane Shigeta, Masaharu Kinoshita
  • Patent number: 7632170
    Abstract: Chemical mechanical planarization apparatuses with polishing assemblies that provide for the passive removal of slurry are provided. In accordance with an embodiment, a work piece polishing assembly comprises a polishing pad comprising a polishing surface and an exhaust aperture that extends through the polishing pad from the polishing surface and is configured to receive a slurry from the polishing surface. An underlying member is disposed underlying the polishing pad and comprises a peripheral surface. The underlying member comprises a channel that is in fluid communication with the aperture and that opens at the peripheral surface of the underlying member.
    Type: Grant
    Filed: June 25, 2007
    Date of Patent: December 15, 2009
    Assignee: Novellus Systems, Inc.
    Inventors: Fergal O'Moore, Steve Schultz, Brian Severson
  • Publication number: 20090305609
    Abstract: The present invention relates to methods and apparatus for improving productivity of chemical mechanical polishing (CMP) processes and lowering operating costs of CMP systems. Embodiments of the present invention provide a method for improving the ratio of the layer thickness of composite polishing pads for improved removal rates. Embodiments of the present also provide specific polishing pad identification for monitoring and controlling processes developed for the specific pad to improve overall productivity and reduce downtime of the CMP system.
    Type: Application
    Filed: June 3, 2009
    Publication date: December 10, 2009
    Applicant: APPLIED MATERIALS, INC.
    Inventors: MICHAEL E. KHAU, Nishal Shah, Ashish Bhatnagar
  • Patent number: 7628829
    Abstract: An abrasive article comprises a porous abrasive member, a nonwoven filter medium, and a porous attachment fabric. A plurality of openings in the porous abrasive member cooperates with the nonwoven filter medium to allow the flow of particles from an outer abrasive surface of the porous abrasive member to the porous attachment fabric. Methods of making and using the abrasive articles are included.
    Type: Grant
    Filed: March 20, 2007
    Date of Patent: December 8, 2009
    Assignee: 3M Innovative Properties Company
    Inventors: Edward J. Woo, Thomas W. Rambosek, Seyed A. Angadjivand, Mary B. Donovan, Rufus C. Sanders, Jr., Yeun-Jong Chou
  • Patent number: 7621802
    Abstract: A hand held corner sanding sponge includes a backing layer of an open-celled foam material having first and second major surfaces that meet at a right angle and third and fourth major surfaces that meet at a right angle. The cross-sectional dimension between the intersection of the first and second major surfaces from the intersection of the third and fourth major surfaces is about 4 inches to about 6 inches. First and second side surfaces are located between the first and second major surface and the third and fourth major surfaces forming a generally hexagonal shape. The cross-sectional dimension between the first and second side surfaces is about 3 inches to about 4 inches. A layer of flexible adhesive is adhered to at least the first and second major surfaces of the backing layer. A layer of abrasive particles is adhered to the major surfaces by the flexible adhesive.
    Type: Grant
    Filed: August 26, 2002
    Date of Patent: November 24, 2009
    Assignee: 3M Innovative Properties Company
    Inventor: Kevin J. McCarthy
  • Patent number: 7618306
    Abstract: Conformable abrasive article comprising: a backing having a first major surface; a deformable material contacting a central portion of the first major surface; an elastic member affixed to the first major surface of the backing and together with the backing enclosing the deformable material; and an abrasive member affixed to the elastic member, wherein the abrasive member comprises abrasive particles and a binder; and methods of making and using the same.
    Type: Grant
    Filed: September 22, 2005
    Date of Patent: November 17, 2009
    Assignee: 3M Innovative Properties Company
    Inventors: Peter A. Felipe, Sr., James W. Schutz, Gregory A. Koehnle, Michael J. Annen, Albert I. Everaerts
  • Patent number: 7604530
    Abstract: A surface treatment or a two-step injection molding is used to make an inlaid polishing pad. A surface of the inlaid polishing pad has areas of different rigidity to control the rigidity and compressibility of the inlaid polishing pad. Furthermore, methods of making such an inlaid polishing pads are also disclosed.
    Type: Grant
    Filed: February 15, 2007
    Date of Patent: October 20, 2009
    Assignee: IV Technologies Co., Ltd.
    Inventor: Wen-Chang Shih
  • Patent number: 7601050
    Abstract: A polishing apparatus is described. The polishing apparatus includes a rotatable platen, a drive mechanism to incrementally advance a polishing sheet having a polishing surface in a linear direction across the platen, a subpad on the platen to support the polishing sheet, the subpad having a groove formed therein, and a vacuum source connected to the groove of the subpad and configured to apply a vacuum sufficient to pull portions of the polishing sheet into the groove of the subpad to induce a groove in the polishing surface.
    Type: Grant
    Filed: February 15, 2007
    Date of Patent: October 13, 2009
    Assignee: Applied Materials, Inc.
    Inventors: Steven M. Zuniga, Peter McReynolds, Erik S. Rondum, Benjamin A. Bonner, Henry H. Au, Gregory E. Menk, Gopalakrishna B. Prabhu, Anand N. Iyer, Garlen C. Leung
  • Patent number: 7594845
    Abstract: Provided is an abrasive article for lapping or polishing a workpiece comprising a three-dimensional, textured, flexible, fixed abrasive construction having a first surface and a working surface, the working surface comprising a plurality of precisely shaped abrasive composites, wherein the precisely shaped abrasive composite comprises a resin phase and a metal phase, wherein the metal phase further comprises superabrasive material. Also provided are a method of polishing or lapping a workpiece and a kit comprising a three-dimensional, textured, flexible, fixed abrasive construction and instructions for carrying out the method of polishing or lapping a workpiece.
    Type: Grant
    Filed: October 20, 2005
    Date of Patent: September 29, 2009
    Assignee: 3M Innovative Properties Company
    Inventors: Paul S. Lugg, Timothy D. Fletcher
  • Patent number: 7579071
    Abstract: A polishing pad is provided. The polishing pad includes a polishing layer composed of a polymeric matrix and liquid microelements embedded in the polymeric matrix. Open pores defined by the embedded liquid microelements are distributed across a surface of the polishing layer. Due to the microstructural open pores uniformly distributed across a surface of the polishing pad, a polishing operation can be performed at high precision. The polishing pad shows constant polishing performance during the polishing operation, can be stably used, and does not cause a wafer to be scratched. In addition, a method of manufacturing the polishing pad is provided. Since all components used to manufacture the polishing pad are in a liquid phase, manufacturing can be easily performed.
    Type: Grant
    Filed: August 26, 2003
    Date of Patent: August 25, 2009
    Assignee: Korea Polyol Co., Ltd.
    Inventors: Hyun Huh, Sang-Mok Lee, Kee-Cheon Song, Seung-geun Kim, Do-Kwon Son
  • Patent number: 7568970
    Abstract: The present invention provides a deformable pad useful for chemical mechanical polishing (“CMP”), a CMP apparatus incorporating the deformable pad of the present invention, and methods for using the deformable pad and CMP apparatus of the present invention. The deformable pad of the present invention includes a plurality of solid supports which substantially eliminate the nonuniform polishing rates in known CMP processes and may be tailored to optimize a wide array of CMP processes. The CMP apparatus of the present invention incorporates a deformable pad of the present invention and may include several other known features, such as a polishing pad, a substrate carrier, mechanical assemblies for agitating the polishing pad or substrate carrier, etc.
    Type: Grant
    Filed: June 5, 2006
    Date of Patent: August 4, 2009
    Assignee: Micron Technology, Inc.
    Inventor: Dapeng Wang
  • Patent number: 7556555
    Abstract: The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a membrane with low permeability; and a buffer layer formed between the base material and an upper surface of the membrane with low permeability and embedded into the fibers of the base material. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided.
    Type: Grant
    Filed: February 15, 2007
    Date of Patent: July 7, 2009
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung
  • Publication number: 20090170413
    Abstract: The present disclosure relates to a polishing pad. The polishing pad may include a polymer layer having a three-dimensional network therein and a composite layer having the ability to equalize pressure across the pad surface, including a first adhesive wherein the composite exhibits a hydrostatic modulus of 1 to 500 psi when compressed at a pressure of 1 to 50 psi.
    Type: Application
    Filed: December 31, 2008
    Publication date: July 2, 2009
    Applicant: innoPad, Inc.
    Inventors: Oscar K. Hsu, Paul Lefevre, Marc C. Jin, John Erik Aldeborgh, David Adam Wells
  • Patent number: 7553221
    Abstract: An abrasive tool comprising of a base portion (2), having a foam layer (3) affixed to the abrasive tool base portion, and a plastic film layer (4) affixed, bonded or glued to the foam layer. This tool is adapted to receive an abrasive material layer (5) or sand paper or other abrasive material having a pressure sensitive adhesive applied to one side of the abrasive material, to allow said abrasive material to be stuck and affixed to the abrasive tool. The abrasive tool may be hand operated, or operated by electric power, air power, or other motive power.
    Type: Grant
    Filed: October 3, 2006
    Date of Patent: June 30, 2009
    Inventors: Stephen Ross Hope, Robert John Welcome, Jason Robert Jones
  • Patent number: 7553214
    Abstract: A method is described. The method includes contacting a non-solid material to a non-linear edge of a sheet of polishing material, and causing the non-solid material to solidify to form a window that contacts the non-linear edge of the polishing material.
    Type: Grant
    Filed: February 15, 2007
    Date of Patent: June 30, 2009
    Assignee: Applied Materials, Inc.
    Inventors: Gregory E. Menk, Peter McReynolds, Erik S. Rondum, Anand N. Iyer, Gopalakrishna B. Prabhu, Garlen C. Leung
  • Patent number: 7549914
    Abstract: The disclosed invention is directed to an improved polishing system that can attain improved values in surface topography, and in particular, improved surface planarity of a polished substrate. The system can prevent the formation of deformities at the polishing surface of the system. The system includes openings that are adjacent certain layers of the system. In particular, the system includes openings, such as channels, for example, formed adjacent to an adhesive layer in the system. Thus, as gases, e.g., air, are released from the semi-solid adhesive during operation of the system, the gases can be trapped, dissipated, or vented by the openings rather than form pressure points in the system that can lead to surface deformations on the polishing surface.
    Type: Grant
    Filed: September 28, 2005
    Date of Patent: June 23, 2009
    Inventor: Andreas C. Ladjias
  • Publication number: 20090156100
    Abstract: A grinding wheel comprising a cylindrical hub of a desired material having a first band of yieldable material on its outer circumferential surface, and a second band of abrasive material on the outer circumferential surface of the first band. The first band of yieldable material can be flexible or semi-flexible and provides support for the second band. An adhesive can be used to avoid relative motion between the hub and the first belt, and between the first and second belts.
    Type: Application
    Filed: December 18, 2008
    Publication date: June 18, 2009
    Applicant: Alcoa Inc.
    Inventors: Eduardo Blanes Garcia, Salvador A. Marcilla Gomis, Thomas J. Kasun, Troy G. Smith, Neville C. Whittle, Richard D. Mckinney, Douglas N. Reesor, Glenn H. Myer, Jose S. Benito Sanchez
  • Patent number: 7547243
    Abstract: A polishing layer of a polishing has a window member with a top surface positioned a predetermined distance below the polishing surface. A transparent layer can be positioned below the polishing layer and supporting the window member.
    Type: Grant
    Filed: August 17, 2007
    Date of Patent: June 16, 2009
    Assignee: Applied Materials, Inc.
    Inventors: Andreas Norbert Wiswesser, Ramiel Oshana, Kerry F. Hughes, Jay Rohde, David Datong Huo, Dominic J. Benvegnu
  • Patent number: 7527050
    Abstract: An abrasive cutting blade is provided to achieve high-quality surface finishes at high feed rates. The blade is fabricated by electroplating fine abrasive onto a steel cathode disc to form a first layer, followed by electroplating a second layer of coarser abrasive onto the first layer. A third layer of fine abrasive is then electroplated onto the second layer. The resulting composite is then removed from the cathode disc to form a multi-grit, multi-layer, hub-less blade.
    Type: Grant
    Filed: May 18, 2006
    Date of Patent: May 5, 2009
    Assignee: Saint-Gobain Abrasives Technology Company
    Inventor: Robert F. Corcoran, Jr.
  • Patent number: 7520968
    Abstract: An apparatus and method for manufacturing and refurbishing a conductive polishing pad assembly for performing an electrochemical process on a substrate is disclosed. The conductive polishing pad assembly is formed using a contact surface as a foundation that is coated with a metallic coating to create a conductive contact surface. In one embodiment, the metallic coating is a high purity tin/zinc alloy that is sprayed on the contact surface. The contact surface contains abrasive particles while the metallic coating provides at least conductive qualities to the contact surface.
    Type: Grant
    Filed: October 4, 2005
    Date of Patent: April 21, 2009
    Assignee: Applied Materials, Inc.
    Inventors: Rashid A. Mavliev, Lakshmanan Karuppiah
  • Publication number: 20090093201
    Abstract: An object of the invention is to provide a polishing pad which hardly generates a scratch on a surface of a polishing object, and is excellent in planarization property. In addition, an object of the invention is to provide a polishing pad which has a high polishing rate and is excellent in planarization property. In addition, an object of the invention is to provide a polishing pad in which a groove is scarcely clogged with abrasive grains or polishing swarf during polishing and, even when continuously used for a long period of time, a polishing rate is scarcely reduced.
    Type: Application
    Filed: May 10, 2006
    Publication date: April 9, 2009
    Inventors: Atsushi Kazuno, Kazuyuki Ogawa, Masahiko Nakamori, Takatoshi Yamada, Tetsuo Shimomura
  • Publication number: 20090093202
    Abstract: A method for manufacturing a polishing pad, which may be laminated, with a small number of manufacturing steps, high productivity and no peeling between a polishing layer and a cushion layer includes preparing a cell-dispersed urethane composition by a mechanical foaming method; continuously discharging the cell-dispersed urethane composition onto a face material, while feeding the face material; laminating another face material on the cell-dispersed urethane composition; curing the cell-dispersed urethane composition, while controlling its thickness to be uniform, so that a polishing layer including a polyurethane foam is formed; cutting the polishing layer parallel to the face into two pieces so that two long polishing layers each including the polishing layer and the face material are simultaneously formed; and cutting the long polishing layers to produce the polishing pad.
    Type: Application
    Filed: April 19, 2007
    Publication date: April 9, 2009
    Applicant: Toyo Tire & Rubber Co., Ltd.
    Inventors: Takeshi Fukuda, Tsuguo Watanabe, Junji Hirose, Kenji Nakamura, Masato Doura
  • Publication number: 20090088054
    Abstract: The invention concerns a sanding element with a succession of overlapping lamellas (3, 4) containing sanding grains (9), characterised in that these lamellas (3, 4) are alternately formed of sanding lamellas (3) and compressible lamellas (4), whereby each sanding lamella (3) rests on a compressible lamella (4).
    Type: Application
    Filed: March 3, 2005
    Publication date: April 2, 2009
    Inventor: Dominique Gilles
  • Patent number: 7497768
    Abstract: A flexible hand-held abrasive article includes a conformable backup pad having opposed major surfaces, a backing layer affixed to one surface of the backup pad, the backing layer containing a plurality of biaxially oriented openings, and abrasive particles arranged on the backing layer, thereby defining an abrasive surface. A method of making such an abrasive article is also disclosed. The abrasive article may also comprise a backing layer containing a plurality of biaxially oriented slits with abrasive particles arranged at least one surface of the backing layer.
    Type: Grant
    Filed: August 11, 2005
    Date of Patent: March 3, 2009
    Assignee: 3M innovative Properties Company
    Inventors: Chris A. Minick, Ian R. Owen, Steven J. Tarnowski
  • Patent number: 7494519
    Abstract: Provided is a method of polishing comprising providing a workpiece, providing a fixed abrasive article, providing conditioning particles, and relatively moving the workpiece and the fixed abrasive article in the presence of the conditioning particles to modify the surface of the workpiece and to condition the fixed abrasive. The fixed abrasive article comprises a substrate having a first surface and a region of abrasive composites distributed on the first surface of the substrate. The abrasive composites include a composite binder and abrasive particles, which may be in abrasive agglomerates together with a matrix material. The abrasive particles are harder than the workpiece. The conditioning particles are sufficient to condition one or more of the composite binder, matrix material, and abrasive agglomerates. The hardness of the conditioning particles is less than the hardness of the workpiece and they do not substantially polish the workpiece.
    Type: Grant
    Filed: July 28, 2005
    Date of Patent: February 24, 2009
    Assignee: 3M Innovative Properties Company
    Inventors: Timothy D. Fletcher, Paul S. Lugg, Vincent D. Romero
  • Publication number: 20090047884
    Abstract: A polishing pad is attachable to a platen to minimize trapped air and polishing fluid intrusion. The pad comprises a polishing layer having a polishing surface on a first end of the pad and a polishing layer peripheral edge extending away from the polishing surface; a gas impermeable attaching layer defines an attachment surface for securing the pad to the platen at an opposed second end of the pad, the attaching layer having an attaching layer peripheral edge extending away from the attachment surface, wherein a peripheral edge of the pad extends from the polishing surface to the attaching surface formed of the peripheral edges of each pad layer; and a plurality of openings extending through the attaching layer. During pad attachment, trapped air flows through the attaching layer openings and out of the peripheral edge of the pad at a position spaced from the attaching layer peripheral edge.
    Type: Application
    Filed: August 15, 2007
    Publication date: February 19, 2009
    Applicant: PPG INDUSTRIES OHIO, INC.
    Inventors: Robert G. Swisher, William C. Allison
  • Publication number: 20090047877
    Abstract: The polishing pad (104) is useful for polishing at least one of a magnetic, optical and semiconductor substrate (112) in the presence of a polishing medium (120). The polishing pad 104 includes multiple layers of polishing filaments (200, 300, 400, 500) stacked on a base layer (204, 404, 504) of polishing filaments, the multiple layers of polishing filaments (200, 300, 400, 500) having a sequential stacked formation with each layer of the polishing filaments being above and attached to a lower polishing filament, the multiple layers of polishing filaments (200, 300, 400, 500) being parallel to a polishing surface of the polishing pad (104) and wherein individual polishing filaments (202, 302, 402) of the multiple layers of polishing filaments (200, 300, 400, 500) are above an average of at least three polishing filaments (202, 302, 402), to form the polishing pad having an open lattice structure of interconnected polishing filaments (210, 310, 410, 510, 610).
    Type: Application
    Filed: August 16, 2007
    Publication date: February 19, 2009
    Inventor: Gregory P. Muldowney
  • Publication number: 20090047871
    Abstract: Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer comprising an interpenetrating network including a continous non-fugitive phase and a substaintially co-continuous fugitive phase. Also provided are methods of making the chemical mechanical polishing pads and for using them to polish substrates.
    Type: Application
    Filed: August 15, 2007
    Publication date: February 19, 2009
    Inventor: Gregory P. Muldowney
  • Patent number: 7488236
    Abstract: The invention provides a polishing pad by which optical materials such as lenses, reflecting mirrors etc., or materials requiring a high degree of surface planarity, as in the polishing of silicone wafers, glass substrates or aluminum substrates for hard disks, or general metal polishing, can be flattened with stability and high polishing efficiency. The invention also provides a polishing pad for semiconductor wafers, which is superior in planarizing characteristic, is free from scratches and can be produced at low cost. There is provided a polishing pad which is free from dechucking error so that neither damage to wafers nor decrease in operating efficiency occurs. There is provided a polishing pad which is satisfactory in planarity, within wafer uniformity, and polishing rate and produces less change in polishing rate. There is provided a polishing pad which can make planarity improvement and scratch decrease compatible.
    Type: Grant
    Filed: August 24, 2006
    Date of Patent: February 10, 2009
    Assignee: Toyo Tire & Rubber Co., Ltd.
    Inventors: Tetsuo Shimomura, Masahiko Nakamori, Takatoshi Yamada, Shigeru Komai, Koichi Ono, Kazuyuki Ogawa, Atsushi Kazuno, Tsuyoshi Kimura
  • Patent number: 7470170
    Abstract: The present invention provides a polishing pad which imparts excellent planarity and uniformity thereof to a material to be polished, such as a semiconductor wafer, without forming scratches. The present invention relates to a semiconductor wafer polishing pad comprising a polishing layer and a cushion layer, wherein the polishing layer is formed from foamed polyurethane, has a flexural modulus of 250 to 350 MPa, the cushion layer is formed from closed-cell foam and has a thickness of 0.5 to 1.0 mm and a strain constant of 0.01 to 0.08 ?m/(gf/cm2).
    Type: Grant
    Filed: February 22, 2005
    Date of Patent: December 30, 2008
    Assignee: Toyo Tire & Rubber Co., Ltd.
    Inventors: Tetsuo Shimomura, Atsushi Kazuno, Kazuyuki Ogawa, Yoshiyuki Nakai, Masahiko Nakamori, Takatoshi Yamada
  • Publication number: 20080305720
    Abstract: Disclosed is a method for production of a laminate polishing pad which comprises a reduced number of steps and is excellent in productivity rate, and which causes no detachment between a polishing layer and a cushion layer and can prevent the groove clogging caused by a slurry or the like. Also disclosed is a laminate polishing pad produced by the method. A method for production of a laminate polishing pad, comprising the steps of: preparing a cell-dispersed urethane composition by a mechanical frothing process; ejecting the cell-dispersed urethane composition onto a cushion layer continuously while feeding the cushion layer; curing the cell-dispersed urethane composition while controlling the thickness of the composition evenly to form a polishing layer made of a polyurethane foam, thereby producing a long laminate sheet; and cutting the long laminate sheet.
    Type: Application
    Filed: August 25, 2006
    Publication date: December 11, 2008
    Applicant: Toyo Tire & Rubber Co., Ltd.
    Inventors: Junji Hirose, Masato Doura
  • Publication number: 20080299879
    Abstract: The present invention mainly relates to a polishing pad comprising a base material comprising fibers; a membrane with low permeability; a two-component paste formed on the upper surface of the membrane with low permeability for adhering the base material to the membrane with low permeability; and a polyurethane paste formed on the lower surface of the membrane with low permeability. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad as described above are also provided. The polishing pad as mentioned above prevents the polishing pad from detaching from the polishing platen or head. The polishing pad is easy to be replaced without leaving residues on the polishing platen or head.
    Type: Application
    Filed: May 29, 2007
    Publication date: December 4, 2008
    Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Yung-Chang Hung, Kun-Cheng Sung