Laminate Patents (Class 451/533)
  • Patent number: 6953388
    Abstract: A polishing pad characterized by having a mechanism for supplying water to the plane of the polishing pad in contact with the article to be polished, in particular, in case the mechanism comprises a domain structure having an area of 1×10?6 m2 or smaller, reduces the generation of scratches and the dust adhesion on the surface of the article to be polished, while increasing polishing rate at low dishing and erosion; hence, the product is applicable to the field of surface polishing of semiconductor thin films.
    Type: Grant
    Filed: December 18, 2000
    Date of Patent: October 11, 2005
    Assignee: Toray Industries, Inc.
    Inventors: Masaaki Shimagaki, Hisashi Minamiguchi, Masami Ohta
  • Patent number: 6951829
    Abstract: A nonwoven scouring fabric, including a fabric made of coarse fibers interconnected to one another to form a three-dimensional network; a continuous or a discontinuous layer of synthetic resin, or the like, adhering to the fibers, which has a content of abrasive grains; reflectors being additionally bonded at the surface of the layer, which are incorporated in the network by a scattering procedure via at least one side of the nonwoven scouring fabric.
    Type: Grant
    Filed: April 9, 2002
    Date of Patent: October 4, 2005
    Assignee: Carl Freudenberg KG
    Inventors: Thomas Schindler, Vanessa Lutzmann
  • Patent number: 6949020
    Abstract: As one of many embodiments of the present invention, a seamless polishing apparatus for utilization in chemical mechanical polishing is provided. The seamless polishing apparatus includes a polishing pad where the polishing pad is shaped like a belt and has no seams. The seamless polishing apparatus also includes a base belt where the base belt includes a reinforcement layer where the reinforcement layer is a fibrous-type material. In addition, the polishing pad is located over the base belt.
    Type: Grant
    Filed: May 13, 2003
    Date of Patent: September 27, 2005
    Assignee: Lam Research Corporation
    Inventors: Cangshan Xu, Eugene Y. Zhao, Fen Dai
  • Patent number: 6921566
    Abstract: A multi-layer flexible non-skid cushioning tape having a top layer of plastic material having a frictional surface thereon, an elastomeric cushioning layer comprising a neoprene/EPDM/SBR blend, and an adhesion layer of a plastic sheet with a pressure sensitive adhesive thereon. The layers are laminated together for application to a platform. The cushioning tape provides a vibration-absorbing, non-skid surface with an improved coefficient of friction-resisting slippage.
    Type: Grant
    Filed: May 6, 2004
    Date of Patent: July 26, 2005
    Inventor: Evan Lipstein
  • Patent number: 6913527
    Abstract: The present invention discloses a polishing pad that can facilitate process stability, extend length of use, and mitigate process non-uniformity and process induced defects for chemical mechanical planarization processes. The polishing pad of the present invention is a composite of a top pad and a sealed sub-pad. The sealed sub-pad has a sealing mechanism that mitigates liquid penetration into the sub-pad thereby maintaining a substantially uniform compressibility of the sub-pad and the polishing pad and extending a useable life of the polishing pad.
    Type: Grant
    Filed: July 15, 2004
    Date of Patent: July 5, 2005
    Assignee: Texas Instruments Incorporated
    Inventor: Yanghua He
  • Patent number: 6913514
    Abstract: The system includes a polishing pad, a pad height sensor; a window; and a window raising mechanism. The polishing pad has an aperture with the window vertically moveable therein. The pad height sensor is positioned above the polishing pad and measures the vertical position of the pad before polishing. The window raising mechanism adjusts the vertical position of the window based on information from the pad height sensor. An endpoint measurement sensor can be disposed beneath the window for in-situ measurement of the polishing process.
    Type: Grant
    Filed: June 23, 2003
    Date of Patent: July 5, 2005
    Assignee: Ebara Technologies, Inc.
    Inventors: Norio Kimura, Huey-Ming Wang, Masayuki Kumekawa
  • Patent number: 6908364
    Abstract: A method and apparatus is provided for cleaning and shaping a probe tip using a multi-layer adhesive and abrasive pad. The multi-layer adhesive and abrasive pad is constructed on the surface of a support structure, such as a silicon wafer, and is made of an adhesive in contact with abrasive particles. Adhesive is applied in layers with abrasive particles in-between each layer of adhesive. Abrasive particles may vary in size and material from layer to layer to achieve cleaning, shaping and polishing objectives.
    Type: Grant
    Filed: August 2, 2001
    Date of Patent: June 21, 2005
    Assignee: Kulicke & Soffa Industries, Inc.
    Inventors: Gerald W. Back, Son Dang, Bahadir Tunaboylu
  • Patent number: 6905402
    Abstract: The present invention relates to a polishing pad. In particular, the polishing pad of the present invention comprises a sublayer, a middle layer, and a top layer which can function as a polishing layer. The polishing pad of the present invention is useful for polishing articles and particularly useful for chemical mechanical polishing or planarization of a microelectronic device, such as a semiconductor wafer.
    Type: Grant
    Filed: September 22, 2003
    Date of Patent: June 14, 2005
    Assignee: PPG Industries Ohio, Inc.
    Inventors: William C. Allison, Robert G. Swisher, Alan E. Wang
  • Patent number: 6905526
    Abstract: Embodiments of the invention include an ion exchange polish pad for polishing a semiconductor substrate, on which various conductive, semiconductive, and/or insulative layers are formed, for example a conductive copper layer. Embodiments also include the method for the manufacture of an ion exchange polish pad. In certain embodiments an ion exchange polish pad includes a base material and a ion exchange layer including, which further includes an ion exchange material. Cations in the ion exchange material may be exchanged with other cations, such as copper, under the proper process conditions for the planarization of a processed semiconductor substrate.
    Type: Grant
    Filed: November 6, 2001
    Date of Patent: June 14, 2005
    Assignee: Planar Labs Corporation
    Inventors: Sanjay Dabral, Anil K. Pant
  • Patent number: 6884156
    Abstract: The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a polishing layer and a bottom layer, wherein the polishing layer and bottom layer are joined together without the use of an adhesive. The invention is also directed to a polishing pad comprising an optically transmissive multi-layer polishing pad material, wherein the layers of the polishing pad material are joined together without the use of an adhesive.
    Type: Grant
    Filed: June 17, 2003
    Date of Patent: April 26, 2005
    Assignee: Cabot Microelectronics Corporation
    Inventors: Abaneshwar Prasad, Roland K. Sevilla, Michael S. Lacy
  • Patent number: 6884157
    Abstract: An abrasive sheet member is disclosed, including a substrate having first and second major surfaces, an abrasive on the first major surface, and a plurality of hooking stems on the second major surface. The hooking stems are adapted to hook engaging structures on an opposed surface to releasably affix the abrasive sheet member to the surface.
    Type: Grant
    Filed: March 25, 2003
    Date of Patent: April 26, 2005
    Assignee: 3M Innovative Properties Company
    Inventors: Jason A. Chesley, Donald R. Bell, Harold E. Rude, William F. Sheffield, David F. Slama, Alan N. Stephens
  • Patent number: 6881483
    Abstract: Ceramic aggregate particles comprising a plurality of solid particulates bonded together by ceramic binding material and methods of providing a plurality of such particles having substantially uniform cross-sectional shape are provided. The ceramic aggregate particles may incorporate a high percentage of solid particulates. The ceramic binding material may closely conform to the outermost surfaces of the solid particulates contained within the ceramic aggregate particle. When abrasive particulates are employed as the solid particulates, abrasive articles can be made which provide consistent high cut rates and consistent surface finish over relatively long periods of time.
    Type: Grant
    Filed: February 11, 2004
    Date of Patent: April 19, 2005
    Assignee: 3M Innovative Properties Company
    Inventors: James L. McArdle, Scott R. Culler, William P. Wood
  • Patent number: 6875097
    Abstract: This invention discloses fixed abrasive chemical mechanical polishing pads, wherein the pad itself comprises at least one material selected from the group consisting of oxidants, wetting agents and other additives normally delivered via a polishing slurry, which assist in the polishing effectiveness of the pad. The improved polishing pad provides both the benefit of a fixed abrasive and the benefits of slurry based polishing systems.
    Type: Grant
    Filed: October 3, 2003
    Date of Patent: April 5, 2005
    Assignee: J. G. Systems, Inc.
    Inventor: John Grunwald
  • Patent number: 6860791
    Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.
    Type: Grant
    Filed: November 25, 2003
    Date of Patent: March 1, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Manoocher Birang, Allan Gleason
  • Patent number: 6860802
    Abstract: An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron particles and providing a means for relative motion of wafer and polishing pad under pressure so that the moving pressurized contact results in planar removal of the surface of said wafer, wherein the polishing pad has a low elastic recovery when said load is removed, so that the mechanical response of the sheet is largely anelastic. The improved pad is characterized by a high energy dissipation coupled with a high pad stiffness. The pad exhibits a stable morphology that can be reproduced easily and consistently. The pad surface resists glazing, thereby requiring less frequent and less aggressive conditioning.
    Type: Grant
    Filed: June 30, 2000
    Date of Patent: March 1, 2005
    Assignee: Rohm and Haas Electric Materials CMP Holdings, Inc.
    Inventors: Arun Vishwanathan, David B. James, Lee Melbourne Cook, Peter A. Burke, David Shidner
  • Patent number: 6852021
    Abstract: A method of making an abrading implement includes the steps of disposing a porous member for aiding in abrasion adjacent a first surface within a mold and supplying two reactive liquid components into the mold in a manner in which the two materials enter onto a second surface of the mold opposing the first surface, whereupon a reaction between the components form a raw implement of structural foam which is bonded to the porous member. Subsequent the reaction, the raw implement is removed from the mold and cut, preferably sawn, in a manner to provide an abrasive implement having a surface portion the foam exposed from the cut to aid in gripping the same by one's hand. An abrading implement is also provided by the method.
    Type: Grant
    Filed: February 21, 2003
    Date of Patent: February 8, 2005
    Assignee: ALI Industries, Inc.
    Inventors: Terry Ali, Christopher Ali, Phillip Glenn Ali
  • Patent number: 6848974
    Abstract: An object of the present invention is to provide a polishing pad for a semiconductor wafer which can perform a stable polishing while preventing a polishing layer from floating up from a supporting layer and a surface of a polishing pad from bending during polishing using a polishing pad having a multi-layered structure of a polishing layer and a supporting layer, and a polishing process using thereof. The polishing pad of the present invention is characterized in that it is comprising a supporting layer which is a non-porous elastic body and a polishing layer which is laminated on one surface of the supporting layer, and a polishing process using thereof. Shore D hardness of the polishing layer is preferably 35 or more, and hardness of the supporting layer is preferably lower than that of the polishing layer.
    Type: Grant
    Filed: September 24, 2002
    Date of Patent: February 1, 2005
    Assignee: JSR Corporation
    Inventors: Kou Hasegawa, Yukio Hosaka
  • Patent number: 6848986
    Abstract: The present invention is directed to a method of making a three-dimensional fixed abrasive article, and a three dimensional fixed abrasive made thereby. The method comprises providing an abrasive composition comprising a plurality of abrasive particles and a binder precursor. The binder precursor comprises a polymerizable material consisting essentially of an ethylenically unsaturated material having one or more terminal functional groups of the same type of reactive functionality, a photoinitiator, and a thermal initiator. The abrasive composition is then applied onto a backing. The method then comprises at least partially curing the binder precursor by activating the photoinitiator, and further curing the binder precursor by activating the thermal initiator to provide a three-dimensional fixed abrasive.
    Type: Grant
    Filed: April 30, 2003
    Date of Patent: February 1, 2005
    Assignee: 3M Innovative Properties Company
    Inventors: Philip E. Kendall, Soon C. Park, Wesley J. Bruxvoort, Scott R. Culler, Jerry W. Williams
  • Patent number: 6843711
    Abstract: A polishing body, e.g., pad (200, 230, 260, 300) or belt (400, 500) having a polishing layer (214, 404) that includes a backmixing region (202, 232, 262, 308, 416, 508) wherein backmixing can occur within a slurry (116) between a wafer (204, 234, 264, 304, 408), or other article, and the polishing layer under certain conditions. The polishing layer includes a first groove configuration (206, 236, 266, 312, 428, 504) within the backmixing region and a second grove configuration (208, 238, 268, 320, 432, 520) outside of the backmixing region that is different from the first groove configuration. The first groove configuration is designed based upon whether or not the presence of spent slurry within the backmixing region is detrimental or beneficial to polishing the wafer.
    Type: Grant
    Filed: December 11, 2003
    Date of Patent: January 18, 2005
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc
    Inventor: Gregory P. Muldowney
  • Patent number: 6843712
    Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.
    Type: Grant
    Filed: September 11, 2003
    Date of Patent: January 18, 2005
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventors: John H. V. Roberts, David B. James, Lee Melbourne Cook
  • Patent number: 6840843
    Abstract: A method for producing a polishing pad comprising (a) providing a porous polymer structure, (b) compressing at least a region of the porous polymer structure to provide a translucent region, and (c) forming a polishing pad comprising the porous polymer structure, whereby a polishing pad is produced comprising the translucent region. Also provided is a polishing pad produced according to this method, and a polishing pad comprising a region that is at least translucent, wherein the translucent region is porous, as well as a method of polishing a substrate using a pad of the invention.
    Type: Grant
    Filed: February 27, 2002
    Date of Patent: January 11, 2005
    Assignee: Cabot Microelectronics Corporation
    Inventors: Jeremy Jones, Roland K. Sevilla
  • Patent number: 6837780
    Abstract: The invention concerns a polishing or lapping device comprising a surface whereon parts to be polished are to be applied, with an interposed abrasive suspension, and with a certain pressure. The invention is characterized in that said surface comprises a plurality of recessed parts (1, 16, 17) forming reservoirs for the abrasive suspension independent of one another and said recessed parts (1, 6, 17) are defined by partitions (2, 26, 27) whereof the top walls (20), co-operating with said abrasive suspension, form active zones for lapping or polishing, said partitions (2, 26, 27) having a substantially constant height over the whole surface of the device, before it is used. The invention is useful for polishing or lapping metal parts.
    Type: Grant
    Filed: November 17, 1999
    Date of Patent: January 4, 2005
    Assignee: Lam-Plan S.A.
    Inventor: Georges Henri Guy Broido
  • Patent number: 6830506
    Abstract: Abrasive body (1) capable of being used in surface processing devices that has an active face (2a) provided with appropriate means of abrasion (3) intended to perform finishing operations on the surface of an object when the said body is set in motion. The abrasive body has a predetermined number of substantially passing cuts (6) defined by the respective flaps (7, 8) lying side by side. When the abrasive body is set in motion on an object to be processed, flaps (7, 8) deform in such a manner as to create appropriate opening that will permit the abraded dust particles to be removed solely and exclusively from that part of the abrasive body actually in contact with the object (FIG. 2).
    Type: Grant
    Filed: March 21, 2002
    Date of Patent: December 14, 2004
    Inventor: Giuseppe Catalfamo
  • Patent number: 6824455
    Abstract: A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.
    Type: Grant
    Filed: September 19, 2003
    Date of Patent: November 30, 2004
    Assignee: Applied Materials, Inc.
    Inventors: Thomas H. Osterheld, Sen-Hou Ko
  • Patent number: 6824447
    Abstract: The method forms a transparent polishing pad by first step forming a plurality of openings through a disk-shaped pad body. The plurality of openings is distributed about the disk-shaped pad body and a transparent window within a portion of the pad body and the transparent window. Then sealing the openings in the transparent window with a transparent material allows transport of polishing fluids through the openings in the disk-shaped pad body and prevents transport of the polishing fluids through the transparent window.
    Type: Grant
    Filed: December 27, 2002
    Date of Patent: November 30, 2004
    Assignee: Rodel Nitta Corporation
    Inventors: Shogo Takahashi, Hajime Shimizu
  • Publication number: 20040235400
    Abstract: An intermediate lens pad having a side secured to curved surface of a lens tool when the pad is in use. The pad has a surface on its other side which is substantially smooth, but which is formed with a multiplicity of substantially uniformly distributed holes or recesses which are at least of an order of magnitude smaller than the pad itself, or the surface is defined by the outer surfaces of a multiplicity of protuberances uniformly distributed over the pad such that the minimum space between adjacent protuberances is of an order of magnitude smaller than the pad itself. A lens surfacing pad having a peel-off adhesive on one side and a working surface on its other side, can be secured by its adhesive side to the intermediate pad so that it inhibits movement between the pads during surfacing, whilst allowing manual removal of the surfacing pad for replacement.
    Type: Application
    Filed: June 30, 2004
    Publication date: November 25, 2004
    Inventors: Clive L. Sangster, Clifford M. Giles, Timothy Noakes
  • Publication number: 20040235407
    Abstract: This invention discloses fixed abrasive chemical mechanical polishing pads, wherein the pad itself comprises at least one material selected from the group consisting of oxidants, wetting agents and other additives normally delivered via a polishing slurry, which assist in the polishing effectiveness of the pad. The improved polishing pad provides both the benefit of a fixed abrasive and the benefits of slurry based polishing systems.
    Type: Application
    Filed: October 3, 2003
    Publication date: November 25, 2004
    Inventor: John Grunwald
  • Publication number: 20040224623
    Abstract: In CMP technology for planarizing an interlayer insulation film, a BPSG film, an insulation film for shallow trench isolation, or the like, in the production process of a semiconductor element, irregularities of a matter being polished, e.g. a silicon oxide film, are planarized efficiently at a high speed while suppressing the occurrence of polishing flaws on the substrate by employing a polishing pad having organic fibers exposed on the surface thereof abutting against the matter being polished.
    Type: Application
    Filed: March 30, 2004
    Publication date: November 11, 2004
    Inventors: Masaya Nishiyama, Masanobu Habiro, Yasuhito Iwatsuki, Hirokazu Hiraoka
  • Patent number: 6813974
    Abstract: A filter grip includes a sheet with a first surface and a second surface, both surfaces having a grit texture. The sheet defines a radius of curvature. The filter grip is configured to provide a non-slip engagement between a user's hand or tool and an oil filter.
    Type: Grant
    Filed: June 12, 2002
    Date of Patent: November 9, 2004
    Inventors: Benjamin McCabe, Joseph Roach
  • Patent number: 6808446
    Abstract: The invention relates to abrasive flap discs which are used for a variety of finishing, grinding and polishing operations, particularly on welded fabrications. The present invention provides an abrasive flap disc (20) comprising a backing plate (11), an annular array of flaps (12) of abrasive material arranged on the backing plate (11) and bonded thereto along the lower most edge of each flap (12), wherein each flap (12), at least in a radially outer region is substantially spaced from each adjacent flap (12) such that the flaps (12) have freedom to flex and conform to an underlying surface in use.
    Type: Grant
    Filed: October 23, 2001
    Date of Patent: October 26, 2004
    Assignee: Elliott Industries Limited
    Inventor: Paul Mosier
  • Patent number: 6790126
    Abstract: Agglomerate abrasive grain is disclosed. The agglomerate abrasive grain can be incorporated into abrasive products such as coated abrasives, bonded abrasives, nonwoven abrasives, and abrasive brushes. A method of making agglomerate abrasive grain is also disclosed.
    Type: Grant
    Filed: October 5, 2001
    Date of Patent: September 14, 2004
    Assignee: 3M Innovative Properties Company
    Inventors: William P. Wood, James L. McArdle
  • Patent number: 6783437
    Abstract: The present invention discloses a polishing pad that can facilitate process stability, extend length of use, and mitigate process non-uniformity and process induced defects for chemical mechanical planarization processes. The polishing pad of the present invention is a composite of a top pad and a sealed sub-pad. The sealed sub-pad has a sealing mechanism that mitigates liquid penetration into the sub-pad thereby maintaining a substantially uniform compressibility of the sub-pad and the polishing pad and extending a useable life of the polishing pad.
    Type: Grant
    Filed: May 8, 2003
    Date of Patent: August 31, 2004
    Assignee: Texas Instruments Incorporated
    Inventor: Yanghua He
  • Publication number: 20040166790
    Abstract: Provided is a method for manufacturing a fixed abrasive material suitable for use in CMP planarization pads from an aqueous polymer dispersion that also includes abrasive particles that involves frothing the polymer dispersion, applying the froth to a substrate, mold or carrier and curing the froth to form a fixed abrasive material having an open cell structure containing between about 5 and 85 wt % abrasive particles and a dry density of about 350 kg/m3 to 1200 kg/m3.
    Type: Application
    Filed: February 21, 2003
    Publication date: August 26, 2004
    Inventors: Sudhakar Balijepalli, Dale J. Aldrich, Laura A. Grier
  • Patent number: 6773339
    Abstract: An abrasive tool for abrasive treatment of curved surfaces, has a base; abrasive elements arranged on the base; and a connecting layer connecting the abrasive elements to the base, the connecting element being composed of an elastic material selected so that when a central area of the abrasive tool is displaced to impart to the abrasive tool a curved shape in correspondence with a curved shape of the object to be abrasively treated, a central area of the connecting layer stretches and the abrasive elements do not peel off from the base.
    Type: Grant
    Filed: December 10, 2002
    Date of Patent: August 10, 2004
    Assignee: Universal Photonics, Inc.
    Inventors: Alex Cooper, Yevgeny Bederak, Sergey Vladimirtsev, Victor Liotta
  • Publication number: 20040121708
    Abstract: Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom side opposite the top side. A first set of holes is formed through the upper layer for exposing the electrode to the processing surface. At least one aperture is formed through the upper layer and the electrode.
    Type: Application
    Filed: December 3, 2003
    Publication date: June 24, 2004
    Applicant: Applied Materials, Inc.
    Inventors: Yongqi Hu, Stan D. Tsai, Yan Wang, Feng Q. Liu, Shou-Sung Chang, Liang-Yuh Chen
  • Publication number: 20040118051
    Abstract: A polishing pad of the present invention contains a water-insoluble matrix material comprising a crosslinked polymer such as a crosslinked 1,2-polybutadiene and water-soluble particles dispersed in the material, such as saccharides. The solubility of the water-soluble particles in water is 0.1 to 10 wt % at 25° C., and the amount of water-soluble particles eluted from the pad when the pad is immersed in water is 0.05 to 50 wt % at 25° C. Further, in the polishing pad of the present invention, the solubility of the water-soluble particles in water is 0.1 to 10 wt % at 25° C. at a pH of 3 to 11, and solubility thereof in water at 25° C. at a pH of 3 to 11 is within ±50% of solubility thereof in water at 25° C. at a pH of 7. In addition, the water-soluble particles contain an amino group, an epoxy group, an isocyanurate group, and the like.
    Type: Application
    Filed: November 5, 2003
    Publication date: June 24, 2004
    Applicant: JSR Corporation
    Inventors: Hiroshi Shiho, Hiromi Aoi, Kou Hasegawa, Nobuo Kawahashi
  • Patent number: 6749486
    Abstract: In a chemical mechanical polishing apparatus in accordance with the present invention, a material having a hardness defined by JIS standard K6301 (A type) of 10-40 and a thickness of 5-30 mm is used as an elastic member (16) arranged between a polishing pad (12) and a platen (36). Therefore, both flatness and uniformity of a wafer can be sufficiently improved.
    Type: Grant
    Filed: December 30, 2002
    Date of Patent: June 15, 2004
    Assignee: Tokyo Electron Limited
    Inventor: Shunichi Shibuki
  • Patent number: 6746311
    Abstract: A multi-layered polishing pad for modifying a surface of a workpiece, such as a semiconductor wafer, that reduces the effort, time and cost involved with pad replacement. The polishing pad includes a polishing layer, at least one sub-pad layer adjacent the polishing layer, and an attachment layer interposed between and releasably joining the polishing layer and at least a portion of the at least one sub-pad layer. The at least one sub-pad layer may include a plurality of layers, such as at least one resilient layer, at least one rigid layer, and/or at least one layer that has both rigid and resilient characteristics. The release layer may be interposed between the polishing layer and the sub-pad or between adjacent layers of the sub-pad. Multiple release layers may be included that are interposed between the polishing layer and layers of the sub-pad, as desired.
    Type: Grant
    Filed: January 24, 2000
    Date of Patent: June 8, 2004
    Assignee: 3M Innovative Properties Company
    Inventor: Carl R. Kessel
  • Publication number: 20040092219
    Abstract: In a sanding block having two expansive sides and two adjacent sides, each adjacent side adjoins each expansive side at a given one of two opposite edges of that expansive side. The expansive and adjacent sides are abrasive. When viewed macroscopically before the sanding block becomes worn, the expansive sides between their opposite edges are planar and are parallel, a given one of the opposite edges of each expansive side is a curved edge, which defines a radius not less than about ⅛ inch at any location on the curved edge, and the other one of the opposite edges of each expansive side is a sharp edge, which defines an acute angle in a range from about 55° to about 70°. The curved edges are intended to minimize gouging or scuffing due to uneven pressure being applied by a user holding the sanding block in one hand and to minimize damage when gouging or scuffing due thereto occurs.
    Type: Application
    Filed: October 24, 2003
    Publication date: May 13, 2004
    Applicant: Trim-Tex, Inc.
    Inventor: Joseph M. Koenig
  • Patent number: 6726528
    Abstract: A polishing pad having an optical assembly that does not cause excess wear on a wafer workpiece. The optical assembly is disposed within the pad such that it may move in response to forces applied to the optical assembly.
    Type: Grant
    Filed: May 14, 2002
    Date of Patent: April 27, 2004
    Assignee: Strasbaugh
    Inventor: Greg Barbour
  • Publication number: 20040072522
    Abstract: A composite polishing pad for use in chemical-mechanical planarization (CMP) processes, which polishing pad of the invention is made of a paper-making-process produced fibrous-matrix of paper-making fibers bound with resin material, and consists of a top section with one or more lower sections, where each layer has unique material properties. Polishing performance can be substantially improved by modifying the individual characteristics of each layer. Typically, the top layer or working surface will be of a higher modulus material than the lower layers. Therefore, the sub-layers may consist of lower density regions or a modified surface structure, such as grooving, to effectively modify the bulk modulus.
    Type: Application
    Filed: June 18, 2003
    Publication date: April 15, 2004
    Inventors: Angela Petroski, Richard D. Cooper, Paul Fathauer, David Perry
  • Patent number: 6716092
    Abstract: A method for selectively altering a polishing pad adhesive layer includes providing a mask having transparent regions and opaque regions and directing radiation toward the mask so that the radiation passes through the transparent regions and impinges onto the adhesive layer on the polishing pad. The area of the adhesive layer corresponding to the transparent regions of the mask is cured to be less adhesive. The area of the adhesive layer corresponding to the opaque regions remain adhesive.
    Type: Grant
    Filed: August 14, 2001
    Date of Patent: April 6, 2004
    Assignee: Applied Materials, Inc.
    Inventor: Robert D. Tolles
  • Patent number: 6702650
    Abstract: An abrasive article made from a plurality of abrasive composites bonded to form a three dimensional abrasive article. Each abrasive composite includes a plurality of primary abrasive particles bonded together by a first binder matrix to form a shaped or irregular abrasive composite. Present within the abrasive composite is an intra-composite porosity between and among the primary abrasive particles. Inter-composite porosity is present within the abrasive article between and among the abrasive composites. The abrasive article is used to grind glass and other workpiece surfaces to a mirror finish.
    Type: Grant
    Filed: April 12, 2001
    Date of Patent: March 9, 2004
    Assignee: 3M Innovative Properties Company
    Inventor: Negus B. Adefris
  • Patent number: 6702654
    Abstract: The present invention provides an improved conditioning wheel for conditioning polishing pads used to polish semiconductor wafers. In one embodiment, the conditioning wheel includes a planar body having a metal surface located thereon. The metal surface has abrasive particles embedded therein and a retainer coating deposited over the metal surface and the abrasive particles. The retainer coating inhibits the abrasive particles from dislodging during a conditioning process.
    Type: Grant
    Filed: February 7, 2001
    Date of Patent: March 9, 2004
    Assignee: Agere Systems Inc.
    Inventors: Arun K. Nanda, Jose Omar Rodriguez, Laurence D. Schultz, Charles A. Storey
  • Patent number: 6699920
    Abstract: A method of manufacturing a polishing substrate is disclosed. The method includes disposing into a mold a reaction mixture of dibasic acid and a hydroxylated polymer, and applying a pressure and a temperature to the reaction mixture that are sufficient to cause polymerization and substrate formation in the mold. The dibasic acid is preferably adipic acid. Before pressure and temperature are applied to the reaction mixture, the reaction mixture is capable of being fortified with a polishing agent and/or a filler for controlling modulus and/or the coefficient of expansion.
    Type: Grant
    Filed: February 13, 2002
    Date of Patent: March 2, 2004
    Inventor: Nicholas Andros
  • Patent number: 6682402
    Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrofoil polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.
    Type: Grant
    Filed: November 10, 2000
    Date of Patent: January 27, 2004
    Assignee: Rodel Holdings, Inc.
    Inventors: John H. V Roberts, David B. James, Lee Melbourne Cook
  • Patent number: 6679243
    Abstract: The present invention provides a superabrasive tools and methods for making the same. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy that contains Cr, Mn, Si, or Al or mixtures thereof.
    Type: Grant
    Filed: August 22, 2001
    Date of Patent: January 20, 2004
    Inventor: Chien-Min Sung
  • Patent number: 6676501
    Abstract: A laminated pad and method of manufacturing such pad wherein the laminated pad includes a grip portion and a work surface. The work surface may be comprised of any of a variety of substances including absorbent material, abrasive material, or polishing material. The grip portion may be upstanding for facile gripping with one's fingers.
    Type: Grant
    Filed: March 13, 2002
    Date of Patent: January 13, 2004
    Inventor: Wallace J. Beaudry
  • Patent number: 6672951
    Abstract: Apparatuses and methods are disclosed using a fixed abrasive polishing pad to perform mechanical polishing of a surface. The apparatus includes a polishing pad positioned opposing a wafer support to provide for polishing of a surface of a wafer placed on the support. The polishing pad includes a first member having a first polishing surface formed from an abrasive first material that is structurally degradable during polishing. The polishing pad also includes a second member having a second polishing surface formed from a second material that is less degradable and less abrasive relative to said first material. The first and second polishing surfaces define a polishing face that is brought into contact with the surface to be polished.
    Type: Grant
    Filed: January 28, 2003
    Date of Patent: January 6, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Michael A. Walker, Karl M. Robinson
  • Patent number: 6666755
    Abstract: A belt wiper that can be used in a linear belt-type chemical mechanical planarization (CMP) system to maintain a belt pad is provided. The belt wiper mitigates disturbances within a detection region important to a belt pad steering system. Also, the belt wiper mitigates the obscuring of optical components important to operation of an endpoint detection system. Thus, the belt wiper, by wiping the underside of the belt pad will preserve the functionality of both the belt pad steering system and the endpoint detection system.
    Type: Grant
    Filed: June 26, 2002
    Date of Patent: December 23, 2003
    Assignee: Lam Research Corporation
    Inventors: Travis R. Taylor, Christian DiPietro, Stephen Jew, Philip Ngoon, Katgenahalli Y. Ramanujam, Tony Luong