Laminate Patents (Class 451/533)
  • Patent number: 6241580
    Abstract: A disposable polish applying and buffing mitt comprising a multilayered mitt with a polish impervious layer removably attached to a material pervious to polish such that the material pervious to polish would stain the hand of the user if used to apply the polish but is suitable for buffing the object to which the polish has been applied. A disposable polish applying and buffing kit comprising a multilayered mitt with a first layer of polish impervious material removably secured to a second layer of polish impervious material forming a compartment therebetween which can hold a polish. The first layer of polish impervious material is removed from the second layer of polish impervious material to expose the polish for application. After the polish is applied to the object, the second layer of polish impervious material is removed to expose the buffing mitt.
    Type: Grant
    Filed: October 20, 1999
    Date of Patent: June 5, 2001
    Inventor: Kurt W. Fisher
  • Patent number: 6231427
    Abstract: A wafer polisher and method for the chemical mechanical planarization of semiconductor wafers. The polisher includes a wafer holder for supporting the semiconductor wafer and a linear polishing assembly having a polishing member positioned to engage the surface of the wafer. The polishing member is movable in a linear direction relative to the wafer surface to uniformly polish the surface of the wafer. A pivotal alignment device may be used to pivotally support one of the wafer holder and the polishing member relative to the other of the wafer holder and the polishing member with the surface of the wafer and the polishing member retained in parallel alignment during operation of the polisher. The polisher optionally includes a conditioning station for conditioning the polishing member.
    Type: Grant
    Filed: May 8, 1997
    Date of Patent: May 15, 2001
    Assignee: Lam Research Corporation
    Inventors: Homayoun Talieh, David Edwin Weldon
  • Patent number: 6220942
    Abstract: A chemical mechanical polishing system is provided having one more polishing stations. The polishing stations include a platen and pad mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area and a recessed area. The raised area provides a rigid mounting surface for the pad and the recessed area provides the pad a desired degree of flexibility and compliance of the pad when brought into contact with a substrate.
    Type: Grant
    Filed: April 2, 1999
    Date of Patent: April 24, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Sidney Huey, Fred C. Redeker
  • Patent number: 6217124
    Abstract: A method for manufacturing a sweeper or abrasive element is disclosed. The abrasive element is manufactured from a U-shaped plastic profile having an aperture in which are placed abrasive lamellae, supporting bristles and heat-dissoluble plastic threads. By heating above the plasticization temperature of the plastic, total embedding of the bristles and abrasive lamellae occurs thereby forming an integral unit. This ensures that the bristles and/or abrasive lamellae will not separate during use of rotating abrasive or polishing tools in which the abrasive elements are included. As the abrasive elements are of plastic material they are flexible and able to adapt to different diameters of abrasive or polishing tools. The user, therefore, only needs to have a supply of abrasive elements, cut into suitable lengths depending on the diameter of the tool in which the abrasive elements are to be replaced.
    Type: Grant
    Filed: September 24, 1998
    Date of Patent: April 17, 2001
    Inventor: Poul Erik Jespersen
  • Patent number: 6213858
    Abstract: A seamless, composite belt that is designed to maintain a substantially flat surface in the span between two rollers. The belts typically have one or more polymer layers, including the polishing layer, and one or more supporting woven or non-woven layers. The belts have the necessary balance between down-cupping and up-cupping forces achieved by: 1) varying the relative thickness of the different polymer and supporting layers in the belt, 2) varying the relative hardness or rigidity of the different layers in the belt, 3) varying the temperatures at which the different layers are formed, 4) varying the compositions of supporting layers, and 5) prestressing one or more of the composite layers. The belts are particularly useful in chemical mechanical polishing of semiconductor wafers.
    Type: Grant
    Filed: October 26, 1999
    Date of Patent: April 10, 2001
    Assignee: Scapa Group PLC
    Inventor: Brian Lombardo
  • Patent number: 6190746
    Abstract: A polishing cloth according to the present invention includes: a polishing cloth substrate; a pressure-sensitive adhesive layer laminated on one face of the polishing cloth substrate; and a release sheet attached to the pressure-sensitive adhesive layer in a releasable manner. The pressure-sensitive adhesive layer includes an adhesive composition containing a polymer, the polymer having a first-order melt transition in a temperature range narrower than 15° C. Thus, the present invention provides a polishing cloth and a method for attaching/detaching the polishing cloth to/from a base plate of a polishing machine such that the polishing cloth can be peeled off the base by simply cooling the base plate and the adhesive layer of the polishing cloth.
    Type: Grant
    Filed: January 20, 1998
    Date of Patent: February 20, 2001
    Inventors: Hideyuki Ishii, Yoshitane Shigeta
  • Patent number: 6179887
    Abstract: Reaction injection molding is utilized as a method for making an abrasive article that includes supplying an effective amount of abrasive particles to at least a portion of an abrasive article mold and supplying a binder precursor matrix that includes at least two interactive components to the abrasive article mold. When the binder precursor matrix is cured, the abrasive particles are secured within a binder formed from the binder precursor matrix. An abrasive article includes a plurality of bristles including an increased amount of abrasive particles, wherein a ratio of binder to abrasive particles is at least about 1:3 by weight.
    Type: Grant
    Filed: February 17, 1999
    Date of Patent: January 30, 2001
    Assignee: 3M Innovative Properties Company
    Inventor: Loren L. Barber, Jr.
  • Patent number: 6174227
    Abstract: A polishing pad for CMP (chemical mechanical planarization) process which contains epoxy resin (component A) and a curing agent (component B) as the major components and has a surface hardness of 2.5 to 40 in Vickers hardness. Component A is selected from the group consisting of bisphenol A epoxy resin, novolac epoxy resin, bisphenol F epoxy resin, polymers of these resins, and denatured epoxy resins. Component B is selected from the group consisting of aromatic amine, aromatic acid anhydride, imidazole, polymers of these substances, and curing agent obtained by denaturing these substances. With this arrangement, the polishing pad can have both alkali-resistant and acid-resistant properties, and is suitably used in a CMP process. Preferably, one or more kinds of inorganic or macromolecular particulates having diameters of 0.01 to 300 &mgr;m are dispersed in the major components (i.e., the epoxy resin and the curing agent). The dispersion ratio is 0.
    Type: Grant
    Filed: November 6, 1998
    Date of Patent: January 16, 2001
    Assignee: Nikon Corporation
    Inventor: Akira Ishikawa
  • Patent number: 6165061
    Abstract: Provided are an abrasive tape suitable for finishing of surfaces or the like of precision components such as optical connector ferrules and semiconductor wafers, and a process for producing it. A coating agent in which abrasive particles having an average particle size in the range of 1 to 200 m.mu. are dispersed in a binder resin solution. The coating agent is applied, with intervention of a primer layer if necessary, onto a base for abrasive tape to form an abrasive layer, thus obtaining an abrasive tape.
    Type: Grant
    Filed: January 7, 1999
    Date of Patent: December 26, 2000
    Assignee: Dai Nippon Printing Co.
    Inventors: Kazuhito Fujii, Masahisa Yamaguchi, Takaki Miyachi, Kojiro Okawa, Yasuki Suzuura
  • Patent number: 6135856
    Abstract: The disclosed polishing apparatus includes a lower pad and an upper pad. The upper pad is disposed over the lower pad and has an upper abrasive surface. The lower pad has an upper surface defining one or more grooves. When the upper pad is placed over the lower pad, channels may form in the upper pad abrasive surface over the grooves. These channels improve the distribution of slurry in the polishing apparatus. The upper pad may define a first polishing region and a second polishing region, the total area of channels in the first polishing region being greater than the total area of the channels in the second polishing region.
    Type: Grant
    Filed: December 17, 1997
    Date of Patent: October 24, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Kevin Tjaden, G. Hugo Urbina
  • Patent number: 6130104
    Abstract: A cleaner of this invention is a cleaner for inspecting projections and removes any substance, e.g., aluminum oxide, which attaches to needle points of probe needles, when the probe needles pierce into the cleaner. The cleaner has a cleaner layer and a substrate. The cleaner layer is constituted by an elastic material layer, and a filler having a surface state improving function of the inspecting projections and dispersed in the elastic material layer. As the filler having a surface state improving function, a powder including at least one of ceramic materials, e.g., sand, glass, alumina, Carborundum (trade name), and the like, or a fiber layer made of an inorganic fiber or organic fiber can be employed.
    Type: Grant
    Filed: April 6, 1998
    Date of Patent: October 10, 2000
    Assignee: Tokyo Electron Limited
    Inventor: Rikihito Yamasaka
  • Patent number: 6126533
    Abstract: A molded abrasive brush having a backing with a plurality of bristles extending therefrom. The backing and bristles are preferably integrally molded. The brush is molded from a moldable polymer such a thermoset polymer, thermoplastic polymer, or thermoplastic elastomer. The moldable polymer includes a plurality of organic or inorganic abrasive particles interspersed throughout at least the bristles, and can be interspersed throughout the brush. The moldable brush can include an attaching means molded integrally with the backing. Also disclosed is a method of making a molded abrasive brush and a method of refining a workpiece surface with a molded abrasive brush.
    Type: Grant
    Filed: October 17, 1997
    Date of Patent: October 3, 2000
    Assignee: 3M Innovative Properties Company
    Inventors: David E. Johnson, Lawrence J. Mann, Scott M. Mevissen, Richard M. Pihl, David C. Roeker
  • Patent number: 6120353
    Abstract: In a polishing method for a semiconductor wafer in which polishing slurry is interposed between the semiconductor wafer and a polishing pad and the semiconductor wafer is mirror-polished by a polishing step for planarization, when polishing is conducted using a suede-like foam urethane resin polishing pad having physical properties of low compressibility lower than 9 % and high pore density equal to or higher than about 150 pores/cm.sup.2 as the polishing pad used in the polishing step, a mirror silicon wafer with good surface roughness of 50 bits in haze can be manufactured.
    Type: Grant
    Filed: February 12, 1999
    Date of Patent: September 19, 2000
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Kiyoshi Suzuki, Hisashi Masumura, Teruaki Fukami
  • Patent number: 6120359
    Abstract: The invention provides an apparatus and a method for forming the end surface of a coaxial composite member consisting of a cylindrical member and an axial member, in which the axial member is ground more readily than the cylindrical member, being capable of forming the end surface of the coaxial member into a convexed spherical mirror surface with high precision, without recession of the axial member from the formed spherical surface.
    Type: Grant
    Filed: November 12, 1998
    Date of Patent: September 19, 2000
    Assignee: NEC Corporation
    Inventors: Kenichi Ohno, Masashige Mitsuhashi
  • Patent number: 6099390
    Abstract: A polishing pad used for polishing a film on a semiconductor wafer and made of a plastic includes a polishing pad body, and a large number of convex portions, which are provided on the surface of the polishing pad body just like so many islands and each have a flat top surface. An average length L of respective sides or diameters of the convex portions on the top surface thereof is in the range from 0.1 mm to 5.0 mm, both inclusive; an average height H of the convex portions is in the range from 0.1 mm to 0.5 mm, both inclusive; and H.ltoreq.L.ltoreq.2S is met, where S is an average space between the convex portions.
    Type: Grant
    Filed: April 5, 1999
    Date of Patent: August 8, 2000
    Assignee: Matsushita Electronics Corporation
    Inventors: Mikio Nishio, Tomoyasu Murakami
  • Patent number: 6095902
    Abstract: The present invention provides a polishing pad fabricated from both polyester and polyether polyurethanes. Methods for manufacturing the pads and methods for use of the pads for polishing are also provided.
    Type: Grant
    Filed: September 23, 1998
    Date of Patent: August 1, 2000
    Assignee: Rodel Holdings, Inc.
    Inventor: Heinz F. Reinhardt
  • Patent number: 6090475
    Abstract: The present invention is directed to polishing pads useful in determining an end to the useful wear life thereof. In a simple embodiment of the present invention, a polishing pad that is used with slurries is dyed on one side in a manner that causes the dye to permeate the pad to a limited depth that does not cause total coloring. Another embodiment of the present invention involves a fixed abrasive pad that has fixed abrasives embedded into the pad to a selected depth where at least one color level is within the portion of the pad that contains the fixed abrasives. After dyeing the pad, the pad is attached to the polishing platen. During the polishing operation, a color change signals a time to stop the polishing operation and change the pad. With multiple colors in the pad, limited only by the ability to dye the pad with uniform depth levels, characteristic wear patterns can be observed and adjustments made accordingly to prolong and optimize pad life.
    Type: Grant
    Filed: April 4, 1997
    Date of Patent: July 18, 2000
    Assignee: Micron Technology Inc.
    Inventors: Karl M. Robinson, Michael A. Walker, John K. Skrovan
  • Patent number: 6089966
    Abstract: The present invention provides a polishing pad having a double-layer structure that allows a polishing liquid to permeate evenly throughout the pad while enabling a wafer to be evenly polished up to the neighborhood of its outer circumference.
    Type: Grant
    Filed: November 18, 1998
    Date of Patent: July 18, 2000
    Inventors: Hatsuyuki Arai, Xu Jin Wang
  • Patent number: 6077153
    Abstract: An apparatus for polishing a semiconductor wafer includes a polishing pad to be in contact with the semiconductor wafer; a turn table which rotates the polishing pad; and an elastic member which is arranged between the turn table and the polishing pad. The polishing pad includes a polishing layer which is made of a material having a good characteristic of slurry holding; and a support layer which is made of a rigid material having an optimum thickness to prevent the polishing layer from loosening. The polishing pad is attached to the turn table by a stretch-holding technique without adhesive bonding.
    Type: Grant
    Filed: November 26, 1997
    Date of Patent: June 20, 2000
    Assignee: Sumitomo Metal Industries, Limited
    Inventors: Takashi Fujita, Yuzo Kozai, Motoyuki Ohara
  • Patent number: 6074287
    Abstract: Polishing laps and apparatus incorporating such polishing laps for polishing workpieces such as semiconductor wafers are disclosed. The polishing laps are made from a cured mixture of an epoxy resin and a filler material, and preferably have at least a portion that is transparent to light. The polishing lap is preferably mounted on rigid polishing wheel or the like with or without an intervening layer such as an elastic layer. Polishing apparatus incorporating the polishing lap preferably include a light source for directing a beam of light toward the transparent portion of the polishing lap to enable the light beam to reflect from the working surface of the workpiece as the workpiece is being polished by the polishing lap. The apparatus also preferably includes a light detector for detecting light reflected from the surface of the workpiece.
    Type: Grant
    Filed: April 11, 1997
    Date of Patent: June 13, 2000
    Assignee: Nikon Corporation
    Inventors: Akira Miyaji, Takashi Arai, Takeshi Yagi
  • Patent number: 6074292
    Abstract: A pad for applying compounds or glazes to painted surfaces, as well as other surfaces, comprised of a layer of polymeric reticulated open cell flexible polyester urethane foam wherein a centrally located cut out is made in this layer of foam; a layer of non-porous, heat activated polyester film adhesive; and a layer of looped fabric backing material for means of attachment to a back up pad which is rotated by a drive motor, at a speed in the range of 1,000-3,000 R.P.M., as well as to facilitate the ease in changing of such pads. The pad design, when combined with the rotation of such pad, provides for a vacuum action which draws the debris created by the polishing process, as well as air to the centrally located cut out area. The air is then drawn through the open cells of the reticulated polyester urethane foam and disbursed out the side of such pad, thus alleviating some of the heat build up associated with the polishing process.
    Type: Grant
    Filed: June 5, 1998
    Date of Patent: June 13, 2000
    Inventor: Mark Byron Gilday
  • Patent number: 6062967
    Abstract: A slightly bendable nail file which reveals indicia in the form of a pictorial image. The file comprises a flexible foamed synthetic resin core sandwiched by paperboard panels. Each paperboard panel has a layer of transparent grit bonded thereto. At least one paperboard panel has a photograph formed thereon, the photograph being outwardly visible through the transparent grit.
    Type: Grant
    Filed: March 23, 1998
    Date of Patent: May 16, 2000
    Inventors: Edward J. Calafut, Jeffrey L. Johnson
  • Patent number: 6056627
    Abstract: A probe cleaning tool including an abrading member for scraping foreign material adhering to an end portion of a probe, made of a mixture of an elastic base material and abrasive particles, and a dust removing film attached to a surface of the abrading member. The dust removing film removes foreign material adhering to the end portion of the probe when the end portion is stuck into and extracted from the probe cleaning tool. The foreign material scraped off the end portion of the probe are confined in the probe cleaning tool and the end portion of the probe can be completely cleaned.
    Type: Grant
    Filed: March 13, 1998
    Date of Patent: May 2, 2000
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Masaharu Mizuta
  • Patent number: 6042462
    Abstract: A flexible backing for abrasive material in sheets, constituted by a body which is composed of at least three materials which are stably coupled in layers, an intermediate layer being constituted by a steel core, and the outer layers being constituted by laminae made of elastic material which have different moduli of elasticity.
    Type: Grant
    Filed: April 29, 1998
    Date of Patent: March 28, 2000
    Inventor: Paolo Baratti
  • Patent number: 6027402
    Abstract: A fingernail and toenail file/buffer adapted to perform an operative function on a target surface, the file/buffer including a base structure and a substrate layer disposed on the base structure. The file/buffer further comprising an abrasive material, and a multiplicity of microcapsules each enclosing at least one treatment substance. These substances may include, for example, a fragrance, a conditioner, an antibacterial agent, an aroma therapy agent or an appearance enhancer. The microcapsules are adapted to release the enclosed substance when the file/buffer is placed in frictional engagement with the target surface.
    Type: Grant
    Filed: February 13, 1998
    Date of Patent: February 22, 2000
    Assignee: SunFiles, LLC
    Inventor: G. Brian Oliver
  • Patent number: 5989113
    Abstract: A tool for a mechanical surface treatment of an object by friction is disclosed. The tool is cut to a desired shape and size from a processed fleece of fibers. The fleece is produced by exclusively mechanical processes as a flexible random-fiber fleece which permits, during the treatment of the object at a particular treatment pressure, immersion and at least partial envelopment of the object within the fleece. The fleece has a mechanical strength of 150-500 N/50 mm, preferably at least 300 N/50 mm, and a mean elongation at rupture of 50-150%, preferably 80-100%, according to DIN 53 857/2.
    Type: Grant
    Filed: March 18, 1997
    Date of Patent: November 23, 1999
    Assignee: Heinrich Lippert GMBH
    Inventor: Theo Arnold
  • Patent number: 5975999
    Abstract: A hand tool which includes a cushion member of a construction which is capable of preventing the separation of a cushion member due to frictional heat and force generated during the grinding operation. The abrasive hand tool includes a tool body having a generally flat bearing surface and a thin sheet-like cushion member fixedly secured to the bearing surface of the tool body. The cushion member includes an inner layer fixedly bonded to the bearing surface of the tool body via an adhesive and an outer layer layered and bonded with the inner layer. The outer layer defines on the outer surface thereof a generally flat attachment surface for detachably holding an attachment means-backed abrasive sheet. The inner layer is made of a soft resinous foam, such as polyvinyl chloride resin, polyurethane resin or others.
    Type: Grant
    Filed: January 5, 1998
    Date of Patent: November 2, 1999
    Assignee: 3M Innovative Properties Company
    Inventor: Yoshiki Nitta
  • Patent number: 5967887
    Abstract: A new polishing and buffing attachment for applying polish and buffing of objects, especially wheel rims. The inventive device includes a head member having a outer padded layer. The first end of an elongate shank is extended into the interior of the head member from the second end of the head member such that the second end of the shank is outwardly extended from the second end of the head member. A cover member has an interior space and opposite first and second ends. The second end of the cover member has an opening into the interior space of the cover member. The head member is insertable through the opening of the second end of the cover member into the interior space of the cover member such that the second end of the shank member extends outwards from the opening of the second end of the cover member.
    Type: Grant
    Filed: March 26, 1998
    Date of Patent: October 19, 1999
    Inventor: Randy R. Synowski
  • Patent number: 5947807
    Abstract: A cleaning and polishing assembly having a compressible main body with a releasable attachment material on one face and a fibrous working surface on its other face. The fibrous working surface is composed of fibers having a trilobal cross-section. The cleaning and polishing pad can be mounted on a power drive tool, or in a hand-actuated embodiment, can be mounted to a gripping pad specially adapted for hand use.
    Type: Grant
    Filed: June 1, 1998
    Date of Patent: September 7, 1999
    Inventor: Elmo R. Overseth
  • Patent number: 5921853
    Abstract: An elastic polishing pad is adhered to the top face of a rotatable table. Above the table is provided a substrate holding apparatus for holding a substrate. The substrate holding apparatus comprises a rotary shaft, a substrate holding head in the form of a disc which is provided integrally with the lower edge of the rotary shaft, a sealing member in the form of a ring which is made of an elastic material and fastened to the peripheral portion of the lower face of the substrate holding head, and a guiding member in the form of a ring which is fastened to the back face of the substrate holding head to be located outside the sealing member. A fluid under pressure is introduced into a fluid flow path formed in the rotary shaft from one end thereof and supplied to a space from the other end of the fluid flow path so as to press the substrate against the polishing pad.
    Type: Grant
    Filed: March 4, 1997
    Date of Patent: July 13, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Mikio Nishio
  • Patent number: 5882251
    Abstract: Provided is a chemical mechanical polishing pad having grooves in its polishing surface which have a sub-surface cross-sectional span greater than the grooves' surface opening span. In this way, the edges of the groove are undercut. This provides both increased groove volume for a given pad surface area and groove depth, and variable flexibility in the polishing pad's surface. Grooves in pads of the invention also typically include a neck region at the top of the groove, where the groove side walls are substantially parallel. This provides a margin for the pad to wear during polishing without affecting the pad's surface area. The invention also provides a method and apparatus for cutting grooves in a chemical mechanical polishing pad.
    Type: Grant
    Filed: August 19, 1997
    Date of Patent: March 16, 1999
    Assignee: LSI Logic Corporation
    Inventors: Michael J. Berman, Jayashree Kalpathy-Cramer
  • Patent number: 5876269
    Abstract: The apparatus (method) for polishing semiconductor device is equipped with a polish pad which comprises an upper layer material and a lower layer material of differing degrees of hardness overlying one another, whereby a semiconductor wafer is polished while being pressed against the polish pad, the degree of hardness of the upper layer material of the polish pad being set at Shore spring A hardness 92-98.5, and the degree of hardness of the lower layer material of the polish pad at Shore spring A hardness 78-87.5.
    Type: Grant
    Filed: November 5, 1997
    Date of Patent: March 2, 1999
    Assignee: NEC Corporation
    Inventor: Kouji Torii
  • Patent number: 5868806
    Abstract: For producing an abrasive tape (11) including a film substrate (2) and a polishing abrasive layer (10) laminated on one surface of the film substrate (2) and having on the outer surface thereof a plurality of recessed parts (9), the film substrate (2) is wrapped partially around the outer peripheral surface of a roll formplate (1) having on the surface thereof a plurality of concavities (5), and, as the roll formplate (1) is rotated, the film substrate (2) is fed thereto. On one hand, an ionizing radiation curing type resin (3) is supplied into the interface between the roll formplate (1) and the film substrate (2) therearound to be formed by the concavities (5), and the recessed parts (9) are formed on the resin surface. During this forming, radiation rays (R) are projected from an ionizing radiation ray source (8) toward the resin (3) thereby to cure the resin (3) and, at the same time, to render the resin (3) and the film substrate (2) into an integral structure.
    Type: Grant
    Filed: August 14, 1997
    Date of Patent: February 9, 1999
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Toshikazu Nishio, Hiroyuki Amemiya, Yasuo Nakai, Taiji Ishii, Masahisa Yamaguchi
  • Patent number: 5853317
    Abstract: A polishing pad made of a flexible material includes a first major surface, a second major surface, and a large number of holes. The first major surface is urged by a rotatable polishing target member to polish a polishing target surface of the urged polishing target member by using a slurry. The second major surface is adhered to a rotatable platen. The large number of holes extend between the first and second major surfaces and serve as slurry reservoirs. The holes have a larger opening area on the second major surface than that on the first major surface. A polishing apparatus is also disclosed.
    Type: Grant
    Filed: June 25, 1997
    Date of Patent: December 29, 1998
    Assignee: NEC Corporation
    Inventor: Yoshiaki Yamamoto
  • Patent number: 5795218
    Abstract: A polishing pad for use in chemical-mechanical planarization (CMP) of semiconductor wafers includes a multiplicity of elongated microcolumns embedded in a matrix material body. The elongated microcolumns are oriented parallel to each other and extend from a planarizing surface used to planarize the semiconductor wafers. The elongated microcolumns are uniformly distributed throughout the polishing pad in order to impart uniform properties throughout the polishing pad. The polishing pad can also include elongated pores either coaxial width or interspersed between the elongated microcolumns to provide uniform porosity throughout the polishing pad.
    Type: Grant
    Filed: September 30, 1996
    Date of Patent: August 18, 1998
    Assignee: Micron Technology, Inc.
    Inventors: Trung Tri Doan, Scott G. Meikle
  • Patent number: 5779519
    Abstract: A scented fingernail file and buffer for contacting and filing a target surface includes a base structure and a substrate layer disposed on the base structure. The scented fingernail file and buffer further includes an abrasive material and fragrance capsules. Both the abrasive material and the fragrance-filled capsules are disposed within the substrate layer. This substrate layer may comprise two coats of resin, for example. The abrasive material includes abrasive particles, and the fragrance-filled capsules are adapted for being ruptured by the abrasive particles, when the scented fingernail file and buffer is frictionally placed into contact with the target surface. The fragrance-filled capsules may also be ruptured by the target surface, or a combination of both the abrasive particles and the target surface, upon such contact.
    Type: Grant
    Filed: November 18, 1996
    Date of Patent: July 14, 1998
    Assignee: SunFiles, LLC
    Inventor: G. Brian Oliver
  • Patent number: 5775984
    Abstract: The fibrous scrubbing pad is proposed for use in wet orbital power scuffing of a damaged portion of a painted surface for enhancing paint color blending and adhesion during repair. It is particularly suited for use in auto collision repair. The pad most preferably incorporates three layers, a top layer comprising a sheet of loops mechanically engaged by a hooked surface of a power device disc pad used for driving the fibrous scrubbing pad, and a wet acid based scuffing medium impermeable layer of material engaging the sheet of loops to one surface of a fibrous pad layer used to scrub a wet acid based scuffing medium against the painted surface, to cause scuffing thereof.
    Type: Grant
    Filed: August 12, 1996
    Date of Patent: July 7, 1998
    Inventors: Jim C. Olson, Leroy H. Rogers
  • Patent number: 5769691
    Abstract: A non-cellular lapping pad is employed in a chemical mechanical planarization machine in conjunction with a polishing slurry to planarize the surface of a silicon workpiece. Planarization is effected by pressing the workpiece against the pad and moving the pad relative to the workpiece in at least one direction. The pad may be constructed of a porous material capable of adsorbing and entraining the slurry, such as fused polyethylene or non-cellular urethane. The pad may also be constructed may be made of a soft material to avoid damage to integrated circuit devices present on the surface of the silicon workpiece, such as a flexibilized epoxy. The slurry is a chemically and mechanically active solution comprising abrasive particles coupled with chemically reactive agents. The abrasive particles have a size of 10-200 nanometers, and suitable particle materials include colloidal silica, cerium oxide and alumina.
    Type: Grant
    Filed: June 14, 1996
    Date of Patent: June 23, 1998
    Inventor: Clinton O. Fruitman
  • Patent number: 5765256
    Abstract: A brush made from a nonwoven, thermally bonded bicomponent fiber web is described. The nonwoven brush of the invention includes a plurality of compressed annular sections assembled about a central carrier with each section made of a mat of bicomponent fibers which have been crimped and melt bonded. In a preferred embodiment, the brush will have a compacted density of between about 50 and about 250 kilograms per cubic meter. The fibers making up the compressed annular sections are preferably a combination of polyolefins (e.g. polypropylene and polyethylene) but may also include polyesters and other materials.
    Type: Grant
    Filed: February 9, 1996
    Date of Patent: June 16, 1998
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: James M. Allan, Barry A. Brandley
  • Patent number: 5752876
    Abstract: A flap disc for use with a rotary surface finishing tool, the flap disc includes a backing plate which attaches to and is rotated by the finishing tool. The backing plate has a mounting flange on which a plurality of abrasive flaps are radially disposed. The abrasive flaps are each adhesively attached to the mounting flange and positioned so as to overlap an adjacent flap. Each abrasive flap has a finishing layer which comprises abrasive particles intermixed in a resin binder. Attached to the finishing layer is a substrate which includes a resin binder. In one embodiment of the invention, the substrate is made from fiber material onto which the abrasive particle/resin mixture is adhesively attached. Alternately, the substrate may comprise a non-woven fibrous material onto which the abrasive particle/resin mixture is adhesively bonded. The mounting flange may comprise a plurality of fiberglass plies intermixed in a resin matrix.
    Type: Grant
    Filed: October 23, 1995
    Date of Patent: May 19, 1998
    Assignee: Weiler Brush Company, Inc.
    Inventor: Frank J. Hettes
  • Patent number: 5738576
    Abstract: A method and an apparatus for providing an optical fiber connector or similar workpiece formed of, e.g., glass, ceramic or plastic with a mirror-finished convex tip efficiently is disclosed. While a film-like abrasive tool is conveyed in contact with the wall of a groove formed in a stage, the workpiece is caused to rotate about its axis (and to move in a reciprocating motion). By the resulting grinding operation, the sectional shape (arcuate) of the abrasive tool contacting the wall of the groove is transferred to the end of the workpiece. As a result, the end of the workpiece is provided with a convex tip. The abrasive tool is replaced with an abrasive tool for finishing, as needed.
    Type: Grant
    Filed: January 28, 1997
    Date of Patent: April 14, 1998
    Assignee: NEC Corporation
    Inventors: Kenichi Ohno, Torahiko Kanda, Masashige Mitsuhashi
  • Patent number: 5733178
    Abstract: A method for texturing magnetic recording media substrates using a structured abrasive article including a flexible backing having a major surface and an abrasive coating, the abrasive coating attached to and at least substantially covering the entire total surface area of the major surface, where the abrasive coating includes a plurality of precisely-shaped three-dimensional abrasive composites, and the composites comprise a plurality of abrasive particles dispersed in a binder, which binder provides the means of attachment of the composites to the backing.
    Type: Grant
    Filed: October 17, 1996
    Date of Patent: March 31, 1998
    Assignee: Minnesota Mining and Manfacturing Co.
    Inventor: Michihiro Ohishi
  • Patent number: 5709598
    Abstract: For producing an abrasive tape (11) including a film substrate (2) and a polishing abrasive layer (10) laminated on one surface of the film substrate (2) and having on the outer surface thereof a plurality of recessed parts (9), the film substrate (2) is wrapped partially around the outer peripheral surface of a roll formplate (1) having on the surface thereof a plurality of concavities (5), and, as the roll formplate (1) is rotated, the film substrate (2) is fed thereto. On one hand, an ionizing radiation curing type resin (3) is supplied into the interface between the roll formplate (1) and the film substrate (2) therearound to be formed by the said concavities (5), and the recessed parts (9) are formed on the resin surface. During this forming, radiation rays (R) are projected from an ionizing radiation ray source (8) toward the resin (3) thereby to cure the resin (3) and, at the same time, to render the resin (3) and the film substrate (2) into an integral structure.
    Type: Grant
    Filed: March 22, 1995
    Date of Patent: January 20, 1998
    Assignee: DAI Nippon Printing Co., Ltd.
    Inventors: Toshikazu Nishio, Hiroyuki Amemiya, Yasuo Nakai, Taiji Ishii, Masahisa Yamaguchi
  • Patent number: 5700188
    Abstract: A coated abrasive belt with an abrasive grain layer on one side of a flexible substrate. The substrate comprises a longitudinal strength layer (4, 5) and a transverse strength layer (6, 7). The edges of successive coated abrasive belt portions are adhesively bonded directly to one another by the use of a recess formed at least in the transverse strength layer. Adhesive bonding takes places one a connecting face (10) which runs approximately in the longitudinal direction and which reaches at least near to the longitudinal strength layer (4, 5). One of the two portions (2) carries the grain layer (14) on its longitudinal strength layer (4) and the other carries it on its transverse strength layer (7).
    Type: Grant
    Filed: November 26, 1996
    Date of Patent: December 23, 1997
    Assignee: Hermes Schleifmittel GmbH
    Inventors: Eckart Uhlmann, Gerhard Struth
  • Patent number: 5692950
    Abstract: An abrasive construction for modifying a surface of a workpiece, such as a semiconductor wafer. The abrasive construction comprises: a three-dimensional, textured, fixed abrasive element; at least one resilient element generally coextensive with the fixed abrasive element; and at least one rigid element generally coextensive with and interposed between the resilient element and the fixed abrasive element, wherein the rigid element has a Young's Modulus greater than that of the resilient element.
    Type: Grant
    Filed: August 8, 1996
    Date of Patent: December 2, 1997
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Denise R. Rutherford, Douglas P. Goetz, Cristina U. Thomas, Richard J. Webb, Wesley J. Bruxvoort, James D. Buhler, William J. Hollywood
  • Patent number: 5679067
    Abstract: A molded abrasive brush having a backing with a plurality of bristles extending therefrom. The backing and bristles are preferably integrally molded. The brush is molded from a moldable polymer such a thermoset polymer, thermoplastic polymer, or thermoplastic elastomer. The moldable polymer includes a plurality of organic or inorganic abrasive particles interspersed throughout at least the bristles, and can be interspersed throughout the brush. The moldable brush can include an attaching means molded integrally with the backing. Also disclosed is a method of making a molded abrasive brush and a method of refining a workpiece surface with a molded abrasive brush.
    Type: Grant
    Filed: April 28, 1995
    Date of Patent: October 21, 1997
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: David E. Johnson, Lawrence J. Mann, Scott M. Mevissen, Richard M. Pihl, David C. Roeker
  • Patent number: 5677039
    Abstract: According to the invention, it includes conductive pigments constituted by a substrate (chosen from the group including micas, talcum, kaolin, bentonites, montmorillionites or glass particles) which has a basic lamellar-type structure coated with an electroconductive layer of tin oxide doped with antimony. On at least one face, the sheet has a layer containing at least the conductive pigments having a basic lamellar-type structure and at least one hydrosoluble binder.Application as decorative paper for laminates.
    Type: Grant
    Filed: October 4, 1994
    Date of Patent: October 14, 1997
    Assignee: Arjo Wiggins S.A.
    Inventors: Claude Perrin, Christophe Simon
  • Patent number: 5664989
    Abstract: A polishing pad comprises at least a first layer having a first main surface serving to polish a substrate to be polished and a second main surface, and a second layer positioned to face the second main surface of the first layer and having fine bags arranged therein, fluid being hermetically sealed in the fine bag.
    Type: Grant
    Filed: July 18, 1996
    Date of Patent: September 9, 1997
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Rempei Nakata, Hisashi Kaneko, Nobuo Hayasaka, Takeshi Nishioka, Yoshikuni Tateyama, Yutaka Nakano, Yasutaka Sasaki
  • Patent number: 5628679
    Abstract: An improved abrading disk tool for holding a multi-layer brush of stacked non-woven fibrous webs to be mounted on a rotation driving spindle in use, which tool can be easily assembled without using any adhesive, but using tool members which, preferably, may be injection-molded with a plastic material. The members of the tool include a pair of compatible holder halves (1), each having a base (10) and a central hollow pole (20) and/or a plurality of eccentrically arranged hollow and/or solid poles (30) axially extending from the base. The holder halves have corresponding configurations, preferably geometrically dimensionally equal ones. Each pole has snap detent means comprising a male element (40) and/or a female element (50), provided at its free end, which element is engageable with that of a corresponding pole in the counterpart holder half to axially inter-lock both the holder halves.
    Type: Grant
    Filed: June 27, 1995
    Date of Patent: May 13, 1997
    Assignee: Minnesota Mining and Manufacturing Company
    Inventor: Chujiro Shiga
  • Patent number: 5605760
    Abstract: A pad is provided for use on a machine for the polishing of silicon wafers which allows the use of optical detection of the wafer surface condition as the wafer is being polished. This accomplished by constructing the entire pad or a portion thereof out of a solid uniform polymer sheet with no intrinsic ability to absorb or transport slurry particles and which is transparent to the light beam being used to detect the wafer surface condition by optical methods. Polymers which are transparent to light having a wavelength within the range of 190 to 3500 nanometers are suitable for the construction of these pads.
    Type: Grant
    Filed: August 21, 1995
    Date of Patent: February 25, 1997
    Assignee: Rodel, Inc.
    Inventor: John V. H. Roberts