Abstract: An inexpensive rotary grinding tool with reduced noise level of the grinding is provided. The rotary grinding tool comprises a metal disk having a grinding surface on at least a part of its surface and a holder for supporting the metal disk. The grinding surface has hard grains having a Mohs hardness in excess of 9 brazed thereon at a surface density of at least 20 grains/cm2. The holder has at its center a securing means for securing the holder on rotary shaft of a rotary drive unit. The holder and the metal disk are joined together to constitute the rotary grinding tool.

Abstract: A composite abrasive wheel comprises primary and secondary abrasive portions. The primary abrasive portion comprises shaped ceramic abrasive particles retained in a first organic binder. The secondary abrasive portion is bonded to the primary abrasive portion, and comprises secondary crushed abrasive particles retained in a second organic binder. The primary abrasive portion comprises a larger volume percentage of the shaped ceramic abrasive particles than the secondary abrasive portion. A central aperture extends through the composite abrasive wheel.

Abstract: Provided are: a polishing pad which is capable of alleviating a scratch problem that occurs when a conventional hard (dry) polishing pad is used, and which is excellent in polishing rate and polishing uniformity and is usable not only for primary polishing but also for finish polishing; and a method for producing the polishing pad. The polishing pad is for polishing a semiconductor device and includes a polishing layer having a polyurethane-polyurea resin molded body containing cells of a substantially spherical shape. The polyurethane-polyurea resin molded body has a ratio of closed cells of 60 to 98%. The polyurethane-polyurea resin molded body has a ratio tan ? of a loss modulus E? to a storage modulus E? (loss modulus/storage modulus) of 0.15 to 0.30. The storage modulus E? is 1 to 100 MPa. The polyurethane-polyurea resin molded body has a density D of 0.4 to 0.8 g/cm3.

Abstract: Polycrystalline diamond includes cubic diamond and hexagonal diamond, and a ratio of X-ray diffraction peak intensity of a (100) plane of the hexagonal diamond to X-ray diffraction peak intensity for a (111) plane of cubic diamond is not lower than 0.01%. In addition, a present method of manufacturing polycrystalline diamond includes the steps of preparing a non-diamond carbon material having a degree of graphitization not higher than 0.58 and directly converting the non-diamond carbon material to cubic diamond and hexagonal diamond and sintering the non-diamond carbon material, without adding any of a sintering agent and a binder, under pressure and temperature conditions at which diamond is thermodynamically stable.

Abstract: Superabrasive tools and methods for making and using the same are provided. In one aspect, for example, a CMP pad dresser includes a first monolayer of superabrasive particles disposed on and coupled to one side of a metal support layer and a second monolayer of superabrasive particles disposed on and coupled to the metal support layer on an opposite side from the first monolayer. The superabrasive particles of the second monolayer are positioned to have substantially the same distribution as the superabrasive particles of the first monolayer.

Abstract: Polycrystalline diamond includes cubic diamond and hexagonal diamond, and a ratio of X-ray diffraction peak intensity of a (100) plane of the hexagonal diamond to X-ray diffraction peak intensity for a (111) plane of cubic diamond is not lower than 0.01%. In addition, a present method of manufacturing polycrystalline diamond includes the steps of preparing a non-diamond carbon material having a degree of graphitization not higher than 0.58 and directly converting the non-diamond carbon material to cubic diamond and hexagonal diamond and sintering the non-diamond carbon material, without adding any of a sintering agent and a binder, under pressure and temperature conditions at which diamond is thermodynamically stable.

Abstract: A multi-abrasive tool is constituted by a support on which abrasive elements are present. Such abrasive elements are arranged in a manner so as to form one or more paths along which the successive abrasive elements have grain size sequentially increasing or decreasing by an arbitrary quantity when passing from on element to the next. Such principle gives rise to abrasive tools with different conformation both for polishing machines and for grindstones. For roto-orbital and planetary polishing machines, and optionally orbital, such support is circular and the grain sequence is circumferential, or radial, or in both directions. A first tool is constituted by contiguous (or non-contiguous) circular rings, that are differently abrasive. A second tool comprises differently abrasive elements arranged along the circular peripheral edge. A third tool comprises differently abrasive elements arranged along a spiral path of 360° starting from the edge.

Abstract: The invention relates to a method of making a grinding disk, comprising the steps of: providing a cap; providing an abrasive part; placing the cap on the abrasive part to form an assembly; holding the assembly and injecting a molding material into a space between the cap and the abrasive part and into the abrasive part to bond the cap and the abrasive part. A grinding disk made by the method is also disclosed.

Abstract: A superhard construction comprises a substrate and an ultra hard material layer formed over the substrate. One of the interface surface of the substrate or the interface surface of the ultra hard material layer comprises a plurality of spaced-apart projections arranged to project from the interface surface, the interface surface between the spaced-apart projections being uneven. A further superhard construction comprises a plurality of projections arranged to project from the interface surface which abut one or more adjacent projections along an edge thereof on the surface from which the projections project, and extend over all or a majority of the interface surface.

Abstract: A grinding wheel for wafer edge trimming includes a head having an open side and an abrasive end bonded around an edge of the open side of the head. The abrasive end is arranged to have multiple simultaneous contacts around a wafer edge during the wafer edge trimming.

Abstract: An abrasive article including a base having an annular shape defining a central opening; and a mounting assembly coupled to the base, wherein a portion of the mounting assembly is under a compressive force, and a grinding segment coupled to the mounting member.

Abstract: A grinding tool with an eccentric rotation shaft of a grinding disc with attached grinding material installed via a hearing at a position that is shifted from the central drive shaft line of a rotating disc fixed on a drive shaft, comprises a clutch in which a grinding disc-side clutch component member installed on the grinding disc or on the eccentric rotation shaft that is fixed to the grinding disc and a rotating disc-side clutch component member installed on the rotating disc are linked via a sliding surface capable of sliding and of transmitting the drive force. The rotation rate of the grinding disc is limited to a stable range of rotation rates, preventing extreme elevation in the rotation rate and extreme reduction in the rotation rate; the workpiece is ground efficiently; and the tool does riot generate marks or patterns on the ground surface.

Abstract: Cup type grinding wheel to be attached to a rotary tool includes a plastic base plate made of a glass fiber-reinforced plastic, a metal annular plate with pieces of grindstone on a fixing surface of the metal annular plate, and fasteners for integrating the plastic base plate with the metal annular plate. Heads of fasteners are positioned at the same level as the fixing surface or at a lower level than the fixing surface toward the plastic base plate.

Abstract: Cup type grinding wheel to be attached to a rotary tool includes a plastic base plate made of a glass fiber-reinforced plastic, a metal annular plate with pieces of grindstone or a ring-shaped grindstone on a fixing surface of the metal annular plate, and fasteners for integrating the plastic base plate with the metal annular plate. Heads of fasteners are positioned at the same level as the fixing surface or at a lower level than the fixing surface toward the plastic base plate.

Abstract: A pad conditioning disk, a pre-conditioning unit, and a CMP apparatus having the same are provided. The pad conditioning disk includes a base in which mountain-type tips and valley-type grooves are repeatedly connected to each other, and a cutting layer formed on the base layer. The cutting layer including conditioning particles deposited on surfaces of the tips and grooves. A surfaces roughness of conditioning particles deposited on the surfaces of the tips is less than a surface roughness of conditioning particles deposited on the surfaces of the grooves.

Abstract: The invention relates to a grinding head for a grinding machine. The grinding head comprises a tool holder, which in use is moved in a plane, in particular rotated or translated back and forth, by the grinding machine. The grinding head furthermore comprises at least two tools which are connectable to the tool holder by a releasable sticking connection. One of the tools or the tool holder is provided with at least one protrusion and the other one is provided with an associated cavity to lock which extend transverse to said plane of movement of the tool with respect to the tool holder in a direction parallel to said plane when the tool is connected to the tool holder.

Abstract: A disc-shaped, rotary dressing tool has a rigid core and an abrasive rim around at least one surface of the periphery of the rigid core. The rigid core and the abrasive rim are oriented in a direction orthogonal to the axis of rotation of the tool. In an embodiment, the abrasive rim comprises an abrasive component bonded to the rigid core by means of an active braze. The abrasive component can be diamond grains arranged in a single layer or diamond film inserts. In a particular embodiment, the abrasive component can comprise a plurality of abrasive inserts mechanically fastened to the rigid core. In another embodiment, the abrasive rim can comprise strips of an abrasive component with each strip being filled into slots machined into and through the perimeter of the core.

Abstract: An abrasive article for use with a grinding wheel including an abrasive body having abrasive grains contained within a matrix of bond material, the abrasive body having a plurality of arm portions defining a twisted path having a plurality of linear portions joined by a plurality of turns.

Abstract: A grinding or polishing disc which in addition to having improved viewing areas so that the object can be appropriately and clearly viewed as it is being ground or polished, also has vertical fins which create an airflow vortex similar to a turbine that go into the viewing locations to provide a cooling airflow to the workpiece so that in addition to being able to see the workpiece, the airflow cools the workpiece as the disc is being rotated.

Abstract: A grinding lamella 1 for being arranged on a grinding wheel 19 which is rotatingly drivable around an axis of rotation, comprising an outer edge 2 which is at least partially convex, an inner edge 3 which is at least partially concave, a front edge 4 which connects together the outer edge 2 and the inner edge 3 on the front side of the grinding lamella 1, and a rear edge 5 which connects together the outer edge 2 and the inner edge 3 on a rear side of the grinding lamella 1, wherein the front edge 4 is longer than the rear edge 5 and wherein the outer edge 2 is longer than the inner edge 3.

Abstract: The present disclosure is directed to an apparatus for the singulation of a semiconductor substrate or wafer. In some embodiments the singulation apparatus comprises a plurality of cutting devices. The cutting devices are configured to form multiple concurrent cutting lines in parallel on a surface of the semiconductor wafer. In some embodiments, the singulation apparatus comprises at least two dicing saws or laser modules. The disclosed singulation apparatus can dice the semiconductor wafer into individual chips by dicing in a direction across a complete circumferential edge of the wafer, thereby decreasing process time and increasing throughput.

Abstract: The grinding machine (1), in particular for grinding and/or sharpening of knives, comprises a grinding disc (2), mounted rotatably around a turning axis (D1) and turnable in direction of rotation (D), with a cylindrically-shaped grinding surface (2a) comprising abrasive means, as well as comprising a guiding part (3), which is arranged immediately next to the grinding surface (2a) of the grinding disc (2), wherein the guiding part (3) has a guiding surface (3a) which extends in such a way that the guiding surface (3a), together with the grinding surface (2a), forms a gap (S), which progressively tapers in the direction opposite to the direction of rotation (D) and which runs parallel to the direction of the turning axis (D1), and that an overlay part (4) with an overlay surface (4a) running towards the gap (S) is arranged immediately next to the grinding surface (2a) of the grinding disc (2).

Abstract: The disclosed cemented carbide base outer blade cutting wheel comprises a base in the form of an annular thin disc of cemented carbide, and a blade section on the outer periphery of the base. The blade section contains: diamond and/or CBN abrasive grains pre-coated with a magnetic material; a metal or alloy bond formed by electroplating or electroless plating for bonding abrasive grains together and to the base; and a metal or alloy binder having a melting point of up to 350° C. infiltrated between abrasive grains and between abrasive grains and the base. The method for manufacturing said outer blade cutting wheel is also disclosed.

Abstract: The disclosed cemented carbide base outer blade cutting wheel comprises a base in the form of an annular thin disc of cemented carbide, and a blade section on the outer periphery of the base. The blade section contains: diamond and/or CBN abrasive grains pre-coated with a magnetic material; a metal or alloy bond formed by electroplating or electroless plating for bonding abrasive grains together and to the base; a resin infiltrated between abrasive grains and between abrasive grains and the base, said resin being a thermoplastic resin having a melting point of up to 350° C. or a thermoset resin obtained by curing a liquid thermosetting resin composition having a curing temperature of up to 350° C. The method for manufacturing said outer blade cutting wheel is also disclosed.

Abstract: Embodiments of the present invention resolve the safety and product management issues associated with conventional abrasive wheel bushings by, for example, reducing the opportunity for improperly mounting an abrasive wheel without the appropriate reducing bushing, simplifying the purchasing process, and/or reserving valuable SKU space for primary products. The abrasive wheel itself can be tailored to any number of purposes, such as grinding, cutting, and polishing. The bushing described herein can be used with any such abrasive wheels. The techniques could readily be extended to any arbor-based products that use reduction bushings or similar schemes.

Abstract: A tool for in-situ airfoil contouring is provided. The tool has a pathway for an airfoil edge wherein the edge movement is limited and further wherein the edge is exposed to a grinding structure having a preselected profile shape therein. The tool makes this contouring process available for airfoils without the necessity of removing the airfoils from, for example, an aircraft engine.

Abstract: Proposed is a method for producing a rotating disc for machining material surfaces, said disc comprising a disc-shaped main body (10), which has a central receptacle (14) for direct or indirect connection to a drive shaft, and a material machining coating (18), which is applied to a ring zone (12) of the main body (10) that is arranged on an end face, comprising the following steps: placing glass fabric mats in a mold cavity of a production tool; compressing the glass fabric mats in the production tool to form the main body (10) having a lip (16) which is configured in a section at least close to the edge; demolding the main body (10); applying the material machining coating (18) to the end face of the main body that faces away from the lip (16); stacking main bodies (10) of the same kind, each having a material machining coating (18) applied thereto, so that the lip (16) of one main body (10) is directly supported on the material machining coating (18) of a next main body (10); exerting a pressure on the

Abstract: A bonded abrasive wheel comprises ceramic shaped abrasive particles retained in a binder. The ceramic shaped abrasive particles are bounded by a respective base, top and plurality of sides connecting the base and the top. Adjacent sides meet at respective side edges having an average radius of curvature of less than 50 micrometers.

Abstract: A polishing pad, a polishing method and a method of forming a polishing pad are provided. The polishing pad includes a polishing layer and a plurality of arc grooves. The arc grooves are disposed in the polishing layer. Each of the arc grooves has two ends, and at least one end thereof has an inclined wall. The angle between the inclined wall of each groove and the surface plane of the polishing layer is less than 90 degree.

Abstract: A grinding disk in particular for rotary fine machining of surfaces has a support plate and a drive connector connecting the grinding disk to a rotary drive machine. The drive connector is provided at a top side of the support plate. An elastically deformable cushion is disposed at a bottom side of the support plate. The cushion is covered with a working medium or with an adhesive coating for detachable attachment of a working medium disk. A cover is disposed on the support plate so as to define an axial intermediate spacing, wherein the cover is embodied as a mechanically loadable structural part and is connected fixedly at least to an outer rim of the support plate. Primarily radially extending ribs are disposed between the support plate and the cover and connected at least at some locations with the support plate and the cover.

Abstract: A semiconductor wafer is polished, wherein in a first step, the rear side of the wafer is polished by a polishing pad comprising fixedly bonded abrasives having a grain size of 0.1-1.0 ?m, while supplying a polishing agent free of solid materials having a pH of at least 11.8, and, in a second step, the front side of the semiconductor wafer is polished, wherein a polishing agent having a pH of less than 11.8 is supplied. A polishing pad for use in apparatuses for polishing semiconductor wafers, has a layer containing abrasives, a layer composed of a stiff plastic and also a compliant, non-woven layer, wherein the layers are bonded to one another by means of pressure-sensitive adhesive layers.

Abstract: The invention discloses a metal-bonded diamond grinding wheel prepared by self-propagating pressure-less sintering and a preparation method thereof. The metal bonded diamond grinding wheel mainly comprises a working layer and a non-working layer, wherein the working layer comprises metal bond and grinded diamond, the non-working layer is metal bond, and the metal bond in the working layer and non-working layer have the same components that comprise metal powders of Cu, Al, Ni, Ti, Sn, and Co. To prepare the metal-bonded diamond grinding wheel prepared by self-propagating pressure-less sintering solves the problems of high energy consumption and low manufacture efficiency in the current sintering processes of the metal bonded diamond grinding wheel, and improves the binding force of the metal bond to the grinded diamond by forming carbides between the bond and the grinded diamond.

Abstract: With a method for the production of a precise prefabricated concrete part, especially in the form of a sleeper or a plate for a fixed track for rail-guided vehicles, the prefabricated concrete part is ground at the functionally relevant points to the predetermined size by means of a grooved roller. The device for this is a grinding machine with a grooved roller to grind the prefabricated concrete part at functionally relevant points to a predetermined size. The grooved roller is made of a wear resistant material, especially silicon carbide.

Abstract: Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method of improving retention of superabrasive particles held in a solidified organic material layer of an abrading tool, a portion of each of said superabrasive particles protruding out of the solidified organic material layer is provided. The method may include securing a plurality of superabrasive particles in the solidified organic material layer in an arrangement that minimizes mechanical stress impinging on the protruding portion of any individual superabrasive particle when used to abrade a work piece. As an example, the arrangement of the plurality of superabrasive particles may be configured to uniformly distribute frictional forces across substantially each superabrasive particle.

Abstract: The present invention relates to an abrasive tool, of the type suitable to be mounted on a machine tool, comprising at least a bearing structure with abrasive material, the said bearing structure being provided with at least a grid (6) with abrasive material, the grid (6) partially protruding or emerging from a body (7) without abrasive material.

Abstract: A polishing pad includes a polishing layer having a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The solid light-transmitting window has an upper portion with a first lateral dimension and a lower portion with a second lateral dimension that is smaller than the first lateral dimension. A top surface of the solid light-transmitting window coplanar with the polishing surface and a bottom surface of the solid light-transmitting window coplanar with a lower surface of the adhesive layer.

Abstract: A hard-faced cutting blade and hard-facing method is provided. A hard-facing material is applied to a cutting edge of a cutting blade such that a heat-affected transition zone may be created between the base metal and the hard-facing material. The heat-affected transition zone may create a sufficient bond to help resist delamination and flaking of the hard-facing material from the base metal.

Abstract: Disclosed therein is a diamond tool fabricated by combining a mesh net with a synthetic resin material, which includes a diamond sintered body integrally coupled with the outer surface of the mesh net and a synthetic resin material impregnated into the inner surface of the mesh net, thereby maximizing a bonding strength and minimizing weight. The diamond tool includes: a diamond sintered body having a diamond tip; a mesh net integrally coupled with the sintered body in such a way that a portion of the sintered body is impregnated therewith; and a synthetic resin material for forming a body in such a way as to couple the mesh net with the circumference of the sintered body to thereby expose the sintered body to the outside.

Abstract: A device for processing welding electrodes with a grinding wheel having a selected grain size driven by a driving motor with a shaft, which runs in a housing, wherein at least one opening is provided in the housing for guiding a welding electrode for processing in a defined position relative to the grinding wheel is characterized in that a recess adapted to the grain size of the grinding material is provided in the range provided for grinding on the surface of the grinding wheel which is coated with grinding material.

Abstract: The invention concerns a carrier plate holding an abrading element, for detachable mounting on a rotatably mounted abrading plate driven during use, for abrading stone or concrete floors, which carrier plate has sides which form an acute angle with each other. The sides have flanges which are formed for surrounding engagement with a shoulder arranged on the abrading plate so that the carrier plate can be fixed on the abrading plate with an engagement based on form and friction.

Abstract: An inexpensive rotary grinding tool with reduced noise level of the grinding is provided. The rotary grinding tool comprises a metal disk having a grinding surface on at least a part of its surface and a holder for supporting the metal disk. The grinding surface has hard grains having a Mohs hardness in excess of 9 brazed thereon at a surface density of at least 20 grains/cm2. The holder has at its center a securing means for securing the holder on rotary shaft of a rotary drive unit. The holder and the metal disk are joined together to constitute the rotary grinding tool.

Abstract: A two piece eraser assembly , including an eraser disk and an eraser hub for mounting and holding the eraser disk. The eraser hub includes upper and lower surfaces a flange at the peripheral edge of the hub and a stub shaft on the lower surface positioned axially with a throughbore. The eraser hub includes a plurality of spaced apertures for engaging with and detachably locking eraser disk extensions on the backside. The upper surface of the eraser disk includes a central recess and an aperture in the recess. The eraser disk includes a plurality of abrading teeth running radially from the central recess. The lower surface of the eraser disk further comprises a plurality of mounting elevations keyed for engaging with the spaced apertures or slots in the eraser hub for securely locking the eraser disk to the eraser hub.

Abstract: Polycrystalline diamond includes cubic diamond and hexagonal diamond, and a ratio of X-ray diffraction peak intensity of a (100) plane of the hexagonal diamond to X-ray diffraction peak intensity for a (111) plane of cubic diamond is not lower than 0.01%. In addition, a present method of manufacturing polycrystalline diamond includes the steps of preparing a non-diamond carbon material having a degree of graphitization not higher than 0.58 and directly converting the non-diamond carbon material to cubic diamond and hexagonal diamond and sintering the non-diamond carbon material, without adding any of a sintering agent and a binder, under pressure and temperature conditions at which diamond is thermodynamically stable.

Abstract: In an outer blade cutting wheel comprising an annular thin disc base of cemented carbide having an outer diameter of 80-200 mm, an inner diameter of 30-80 mm, and a thickness of 0.1-1.0 mm, and a blade section disposed on an outer periphery of the base, the blade section comprises diamond grains and/or CBN grains bound with a metal bond having a Young's modulus of 0.7-4.0×1011 Pa and has a thickness which is greater than the thickness of the base by at least 0.01 mm. The outer blade cutting wheel is capable of cutting a workpiece at a high accuracy and a reduced allowance, improves machining yields, and reduces machining costs.

Abstract: The invention relates to a grinding head for a grinding machine. The grinding head comprises a tool holder, which in use is moved in a plane, in particular rotated or translated back and forth, by the grinding machine. The grinding head furthermore comprises at least two tools which are connectable to the tool holder by a releasable sticking connection. One of the tools or the tool holder is provided with at least one protrusion and the other one is provided with an associated cavity to lock which extend transverse to said plane of movement of the tool with respect to the tool holder in a direction parallel to said plane when the tool is connected to the tool holder.

Abstract: An optical-grade surfacing tool (101) is provided with a resilient return element (115) including a plurality of resiliently flexible strips (118) that transversely project from a rigid central mounting (104), each strip (118) having a distal portion (144) that engages by bearing directly upon a petal (134) of a flexible flange (131) that surrounds the rigid mounting (104). The distal portion is curved along a round loop such that the end (145) of each the strip (118) is rotated toward the rigid mounting (104).

Abstract: The invention relates to a method of making a grinding disk, comprising the steps of: providing a cap; providing an abrasive part; placing the cap on the abrasive part to form an assembly; holding the assembly and injecting a molding material into a space between the cap and the abrasive part and into the abrasive part to bond the cap and the abrasive part. A grinding disk made by the method is also disclosed.

Abstract: An abrasive article includes a polymer binder, an infrared radiation absorbing dye, and abrasive grains. In particular embodiments, the abrasive articles have been at least partially cured using infrared radiation. The abrasive articles of the present invention can include, for example, coated abrasives, structured abrasives, and bonded abrasives. Methods for manufacturing abrasive articles include at least partially curing an article that includes a polymer binder precursor, an infrared radiation absorbing dye, and abrasive grains using infrared radiation.

Abstract: A chemical mechanical polishing pad having a polishing layer with an integral window and a polishing surface adapted for polishing a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate, wherein the formulation of the integral window provides improved defectivity performance during polishing. Also provided is a method of polishing a substrate using the chemical mechanical polishing pad.

Abstract: A system for sharpening circular, knife edged blades operates to bias an infeed grinding wheel into contact with the first edge of the blade and an outfeed grinding wheel into contact with the second edge of the blade. The grinding wheels are spaced so that they contact the respective edges of the blade at a point which is spaced by no more than 1 inch from the center line of the blade. Contact between the grinding wheels and the blade is accomplished solely by pushing the wheels from their sides which are opposite the blade contacting surface. The system includes provisions for adjusting the position of the wheels relative to the blade so as to accommodate blade wear.