Utilizing Mounted Rigid Abrading Tool Only Patents (Class 451/58)
  • Patent number: 7264538
    Abstract: A method of removing at least a part of a thermal sprayed wear resistant coating on a gas turbine engine part includes grinding the thermal sprayed wear resistant coating with a superabrasive grinding wheel.
    Type: Grant
    Filed: August 12, 2005
    Date of Patent: September 4, 2007
    Assignee: United Technologies Corporation
    Inventors: Paul L. Hood, Kyle Gordon Gardiner, Brian Keyes, Keith Lockyer, Edward Marchitto, Thomas Robert Nadeau, Daniel W. St. Onge, Bernard D. Vaillette
  • Patent number: 7244314
    Abstract: A system for recycling reusable resin mold products recovered from discarded apparatuses is disclosed. This recycling system includes a crushing system for crushing resin mold products one kind by one kind into crushed resinous pieces and packing the same in a bag, a classification system for irradiating a light beam to the resin in the bag and classifying the bags into respective kinds of resins based on a reflected beam therefrom, a cleaning system for separately cleaning the respective kind of crushed resinous pieces taken out of the bag to remove foreign matters adhered onto the surfaces of the crushed resinous pieces therefrom, and a recovery system for recovering the cleaned crushed resinous pieces.
    Type: Grant
    Filed: April 22, 2004
    Date of Patent: July 17, 2007
    Assignee: Techno Polymer Co., Ltd.
    Inventors: Takateru Imai, Kenichi Urabe, Kouji Ishikawa
  • Patent number: 7147547
    Abstract: A method and a device for grinding a machine part that has two shaft elements, a machine part axis and a large diameter central element having a side surface which is embodied in the form of a flat truncated cone. The machine part is clamped between centers and is movable in a direction of the machine part axis. The side surface is ground by a cylindrical outer contour of a first grinding wheel such that the cutting speed is constant across the entire axial dimension of the first grinding wheel which is mounted on a grinding spindle along with a second, narrower grinding. The second grinding wheel is positioned to grind the shaft element by swiveling the spindle using two pivots that are located perpendicular to each other and by displacing the grinding spindle perpendicular to the machine part axis with the machine part remaining in the same clamped position.
    Type: Grant
    Filed: July 29, 2003
    Date of Patent: December 12, 2006
    Assignee: Erwin Junker Maschinenfabrik GmbH
    Inventor: Erwin Junker
  • Patent number: 7144307
    Abstract: A process for point superabrasive machining of a nickel based material comprising the steps of providing a tool having a grinding surface coated with a superabrasive material, orienting the tool relative to a surface of the nickel based material to be machined so that there is point contact between the surface to be machined and the grinding surface, and forming a part by removing material at the point contract by rotating the tool. The tool comprises an enlarged portion, a tip portion, and a first shaft portion extending from the enlarged portion to the tip portion, the first shaft portion and the tip portion being coated with an abrasive material, and the first shaft portion having a constant diameter.
    Type: Grant
    Filed: March 27, 2003
    Date of Patent: December 5, 2006
    Assignee: United Technologies Corporation
    Inventors: Brian J. Schwartz, Daniel F. Grady, Daniel J. Wright
  • Patent number: 7125312
    Abstract: The invention relates to a machine (1) for grinding the blades of a turbine rotor (2) or a compressor. The inventive machine consists of a rotary head (6) which is provided with two different grinding wheels (7, 7?) for grinding the rotors (2), three carriages (8, 9, 10) of the head which are used for the linear and angular movement thereof, a machine control unit (16) comprising a numerical control (CNC) which is used to calculate the grinding position of each grinding wheel, an optical sensor (19) which is used to measure the radius R of the blades and a device (12, 13) for the individual shaping of each grinding wheel which is supported on a carriage (14, 15) with means for the linear movement thereof (U, C) and which operates automatically during the grinding process without altering the position of the grinding wheel.
    Type: Grant
    Filed: March 14, 2003
    Date of Patent: October 24, 2006
    Assignee: Danabat, S. Coop
    Inventors: Olatz Astigarraga Castañares, Singh Harvinder Chana
  • Patent number: 7083503
    Abstract: A rotary trimmer includes a first trimming element having a first knife and a second trimming element having a second knife that operates jointly with the first knife. In order to sharpen one knife, the other knife is removed and is replaced with a sharpening disk. The sharpening disk or the knife to be sharpened is advanced during a sharpening operation.
    Type: Grant
    Filed: August 27, 2004
    Date of Patent: August 1, 2006
    Assignee: Muller Martini Holding AG
    Inventor: Remo Sommer
  • Patent number: 7001249
    Abstract: Methods and systems are disclosed whereby the edges of a glass sheet may be beveled with minimal equipment down time. Preferably such methods and systems bevel the upper and lower edges along lateral sides of a glass sheet. In especially preferred embodiments, laterally separated pairs of upper and lower edge grinding assemblies are provided having respective upper and lower oppositely oriented tapered grinding wheels. A glass sheet may thus be moved in a generally horizontal conveyance direction between one of these pairs of upper and lower edge grinding assemblies so that respective upper or lower lateral edges of the glass sheet are brought into grinding contact therewith. Continually moving the glass sheet in the horizontal conveyance direction will therefore present the other lateral edge to the other pair of upper or lower edge grinding assemblies positioned downstream. As such, the other edge will then be beveled.
    Type: Grant
    Filed: January 11, 2005
    Date of Patent: February 21, 2006
    Assignees: Guardian Industries, Inc., deMegBriErin, Inc.
    Inventors: Thomas E. Pride, Charles J. Beatty
  • Patent number: 6991524
    Abstract: Apparatus and method for reconditioning the protective coating of a digital disc. The damaged digital disc is automatically moved between workstations by a suction member which grasps the disc at the first workstation and releases the disc at the second workstation. Each of the workstations is defined by worktools which operate on the digital disc. A feed cartridge member stores the damaged discs prior to movement of the discs into the first workstation and a receiving cartridge member stores the reconditioned discs following the final reconditioning operations at the last workstation.
    Type: Grant
    Filed: July 7, 2000
    Date of Patent: January 31, 2006
    Assignee: Disc Go Technologies Inc.
    Inventors: Ivan George Cooper, Mark Charles Chaplin
  • Patent number: 6988938
    Abstract: The present invention relates to methods and apparatus for removing coatings from generally opposed first and second major surfaces of a substrate. The method includes providing a table having a surface for slidable receipt of the substrate. First and second grinding apparatuses are provided at a mounting portion of the table, opposite one another. As the substrate moves over the table surface, it contacts the first and second grinding apparatuses. The coatings are simultaneously removed from the first major surface with the first grinding apparatus from the second major surface with the second grinding apparatus.
    Type: Grant
    Filed: October 7, 2004
    Date of Patent: January 24, 2006
    Assignee: Cardinal CG Company
    Inventors: Timothy J. Valek, Roger D. O'Shaughnessy
  • Patent number: 6981907
    Abstract: One or more high angle grinding units are supported by a carriage mountable on the underside of a rail grinding vehicle. Each grinding unit is attached to the carriage in a manner enabling controllable movement of the grinding units laterally, vertically, and angularly, with respect to the rails, so that a grinding stone rotated by the grinding unit can be operated to grind between a railhead and a closely adjacent rail structure to reform the gauge side of the railhead and the field side of the closely adjacent structure.
    Type: Grant
    Filed: November 3, 2004
    Date of Patent: January 3, 2006
    Assignee: RailWorks Corporation
    Inventors: Richard Korinek, Victor Jaugilas, William G. Walls
  • Patent number: 6971946
    Abstract: A lot of concave portions and convex portions are formed on a circumferential face of base metal cylinder or roller. Summits of the convex positions are ground and removed or erased. The base metal cylinder or roller is plated and coated to harden the circumferential face. The concave portions and the convex portions leave their shapes after the plating and coating process. Additionally, the plated and coated ends of the convex portions are ground in order to form flat faces or curved faces of ends, on which flat faces or curved faces a film web or tape web slides. The metal roller is used in a machine handling film or tape or any web material.
    Type: Grant
    Filed: September 2, 2004
    Date of Patent: December 6, 2005
    Assignee: Chiyoda Daiichikogyo Kabushikikaisha
    Inventor: Tatsuo Suzuki
  • Patent number: 6949004
    Abstract: A manufacturing process for reducing magnetic spacing loss in a magnetic recording head. The recession of the transducer relative to the substrate at the air bearing surface is decreased by applying a coating of sacrificial material such as diamond-like carbon to the upper surfaces of the substrate, the transducer, and the encapsulation material such as alumina prior to final kiss lapping. The recession due to the alumina being softer than the substrate is greatly reduced since the DLC is kiss-lapped.
    Type: Grant
    Filed: May 6, 2003
    Date of Patent: September 27, 2005
    Assignee: Maxtor Corporation
    Inventors: Chris Broussalian, Kim Brandt
  • Patent number: 6945846
    Abstract: A porous polishing pad for use chemical/mechanical planarization of semiconductor wafers is provided with a transparent section formed in a section of the porous polishing pad by direct injection of a polymeric material into a modified portion of the pad. The modified section may be either a low density area, or may be created by removing a complete vertical section of the pad. The injected polymer forms an integral window with the pad by flowing into the matrix of the pad at the pad/window interface. No additional reinforcement is required to hold the window in place; however, adhesive and/or another impervious layer may be attached behind the window for additional support. In an alternative embodiment, a separate and distinct window-plug is inserted into a cutout section of the pad, and bonded to the pad by one or more binding film layers on the back, non-working surface of the pad.
    Type: Grant
    Filed: March 28, 2005
    Date of Patent: September 20, 2005
    Assignee: Raytech Innovative Solutions LLC
    Inventors: Angela Petroski, Richard D. Copper, Paul Fathauer, David Perry
  • Patent number: 6926588
    Abstract: The invention relates to a method of manufacturing a band coil by means of a material-removing process performed on the coils so as to obtain a band coil which has a profile in the direction of the coil axis. Such a process may be a discharge process, an etching process or a mechanical grinding process. The obtained band coils may have such a shape that certain coil sides are effective whereas other coil sides are interfering as little as possible. Such band coils can be very successful in planar motors.
    Type: Grant
    Filed: December 6, 2001
    Date of Patent: August 9, 2005
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Henricus Wilhelmus Aloysius Janssen, Johannes Petrus Martinus Bernardus Vermeulen, Fransiscus Marinus Andrea Maria Van Gaal, Petrus Carolus Maria Frissen
  • Patent number: 6921319
    Abstract: The invention relates to a method for grinding at least the running surface of a rail (1), especially of a railway rail, by producing a relative movement between a grinding wheel (12) having a profile that mates the profile of the running surface, and a rail (1) in the longitudinal direction thereof. The aim of the invention is to avoid an overheating when large amounts of material are removed. To this end, the axis (21) of the grinding wheel (12) includes, with a plane (22) that is perpendicular to the longitudinal direction of the rail (1), an angle ? that deviates from 0°.
    Type: Grant
    Filed: January 17, 2003
    Date of Patent: July 26, 2005
    Assignee: Linsinger Maschinenbau Gesellschaft m.b.H.
    Inventors: Johann Knoll, Walter Neubauer
  • Patent number: 6916229
    Abstract: A machine-implemented method is provided for forming a release surface of a mold. The mold has a mold cavity confined by an inner peripheral surface defining a mold cavity axis. The method includes the steps of: (a) bringing a grinding surface of a rotary grinding portion of a jig grinder into contact with a part of the inner peripheral surface such that the grinding surface is inclined at a predetermined angle relative to the mold cavity axis, and rotating the grinding portion such that the grinding surface grinds the part of the inner peripheral surface; (b) separating the grinding surface from the inner peripheral surface; (c) changing relative positions of the grinding portion and the inner peripheral surface in preparation for grinding another part of the inner peripheral surface; and (d) repeating the steps (a) to (c) until the release surface is formed.
    Type: Grant
    Filed: December 18, 2003
    Date of Patent: July 12, 2005
    Assignee: Asia Optical Co., Inc.
    Inventors: Po-Sung Kao, Sheng-Jui Chao
  • Patent number: 6913522
    Abstract: An apparatus for grinding center bearings of crankshafts includes a clamping unit for clamping and driving a crankshaft; a grinding spindle, positionable perpendicular to the crankshaft; a plurality of grinding wheels on the grinding spindle, corresponding to the number of center bearings to be ground; a plurality of steadies, for supporting the crankshaft, opposite the grinding spindle; and an additional processing unit for performing preliminary grinding on the center bearing, by forming an elevated bearing seat for the steadies, opposite the bearing, such that the steadies are continuously guidable during grinding of the center bearings. In a method for grinding center bearings of a crankshaft using the apparatus, the center bearings are simultaneously ground using a multilayer grinding wheel set, and prior to a final grinding of the center bearings to their final dimensions, a bearing seat for a steady is ground on at least one center bearing.
    Type: Grant
    Filed: September 10, 2002
    Date of Patent: July 5, 2005
    Assignee: Erwin Junker Maschinenfabrik GmbH
    Inventor: Erwin Junker
  • Patent number: 6899595
    Abstract: Finishing a seal assembly as a unit is proposed, which prevents alignment of the end gaps of the annular body and the annular ring of the seal assembly, provides the ability to manufacture the seal assembly to very low tolerances, and establishes virtually perfect parallelism between the upper and lower surfaces of the seal assembly. A finishing process is characterized by lapping a seal assembly as an assembled unit with a lapper using gritted oil as a polishing medium.
    Type: Grant
    Filed: March 28, 2003
    Date of Patent: May 31, 2005
    Inventors: Maurice J. Moriarty, Matthew V. Hartford, Joseph D. Moriarty
  • Patent number: 6899602
    Abstract: A porous polishing pad is useful for polishing semiconductor substrates. The porous polishing pad has a porous matrix formed from a coagulated polyurethane and a non-fibrous polishing layer. The non-fibrous polishing layer has a polishing surface with a pore count of at least 500 pores per mm2 that decreases with removal of the polishing layer; and the polishing surface has a surface roughness Ra between 0.01 and 3 ?m.
    Type: Grant
    Filed: July 30, 2003
    Date of Patent: May 31, 2005
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, NC
    Inventors: Clyde A. Fawcett, T. Todd Crkvenac, Kenneth A. Prygon, Bernard Foster
  • Patent number: 6899599
    Abstract: A manufacturing process to make a ball valve of the present invention includes the following steps: a) prepare flat circular metallic plates each of which has a rectangular indentation in a circumference; b) mold those plates into bowl shape; c) remove the circular bottom of the bowl shapes to reform a hemi-spherical shape by another mold; d) weld each pair of the hemi-spherical shapes into a spherical shape each of which has a pair of aligned openings and a lateral rectangular through hole; e) trim and grind the uneven connection seam; and f) polish and smooth the outer surface to finished a qualified ball valve which has uniform arc and thickness.
    Type: Grant
    Filed: May 25, 2004
    Date of Patent: May 31, 2005
    Inventor: Chiang Hsiang-Hui
  • Patent number: 6896598
    Abstract: In a vertical type of double disc surface grinding machine, an object of this invention is to enable simple adjustment of a parallelism between a grinding surface of a lower grinding wheel and a work end face clamped by a clamping jig of a rotary table, even when a grinding wheel spindle axis is disordered. The vertical type of double disc surface grinding machine is equipped with a pair of grinding wheels 2 & 3 opposing each other in vertical direction and fixed to a pair of vertical grinding wheels 4 & 5 and a rotary table 15 holding a work W and supplying it to a grinding position A1 located between the grinding wheels 2 & 3, and provided on the rotary table 15 with a work clamping jig 17 including a rotary shaft 63 which clamps the work W at a specified position and makes it spin itself.
    Type: Grant
    Filed: October 8, 2002
    Date of Patent: May 24, 2005
    Assignee: Daisho Seiki Corporation
    Inventor: Akiyoshi Saitoh
  • Patent number: 6881124
    Abstract: An L-shaped slide plate mounted with a workpiece holding device on a slide guide is firmly attached to an angle adjustment mechanism, and a reciprocating motion drive unit mounted with the angle adjustment mechanism on a slider table is firmly attached to a bridge so that an angle between a surface of a workpiece to be lapped and a surface of a lapping plate is kept substantially constant, and also the bridge is disposed so as to stride the lapping plate. Thereby, in a state of row bar in which a plurality of magnetic head sliders run in a line, an air bearing surface of magnetic head can be lapped with high accuracy with an element recession being decreased and an occurrence of a scratch being restrained.
    Type: Grant
    Filed: December 18, 2001
    Date of Patent: April 19, 2005
    Assignee: Hitachi Global Storage Technologies Japan, Ltd.
    Inventors: Toshio Takahashi, Hiromu Chiba, Takateru Seki, Hideaki Tanaka, Toshio Tamura, Minoru Yamasaka, Akio Takakura
  • Patent number: 6875077
    Abstract: A porous polishing pad for use chemical/mechanical planarization of semiconductor wafers is provided with a transparent section formed in a section of the porous polishing pad by direct injection of a polymeric material into a modified portion of the pad. The modified section may be either a low density area, or may be created by removing a complete vertical section of the pad. The injected polymer forms an integral window with the pad by flowing into the matrix of the pad at the pad/window interface. No additional reinforcement is required to hold the window in place; however, adhesive and/or another impervious layer may be attached behind the window for additional support. In an alternative embodiment, a separate and distinct window-plug is inserted into a cutout section of the pad, and bonded to the pad by one or more binding film layers on the back, non-working surface of the pad.
    Type: Grant
    Filed: March 17, 2003
    Date of Patent: April 5, 2005
    Assignee: Raytech Innovative Solutions, Inc.
    Inventors: Angela Petroski, Richard D. Copper, Paul Fathauer, David Perry
  • Patent number: 6872120
    Abstract: A lens surface shape is created by a near-finish surface forming rough-cutting step of creating a near-finish surface shape analogous to a lens surface shape based on a prescription of a spectacle lens from a spectacle lens base material 11 by numerically controlled cutting, and a finish-cutting step of creating the lens surface shape based on the prescription of the spectacle lens from the near-finish surface shape by numerically controlled cutting. According to this method of producing a spectacle lens, all kinds of spectacle lenses including an inner surface progressive power lens can be produced with high productivity. A complex curved surface can be mirror-polished by a polishing tool, which includes an elastic sheet 41 having a curved surface, wherein a workpiece is polished by applying a pressure to the inner surface side of the elastic sheet 41, to stretch the elastic sheet 41 and bring the outer surface side of the elastic sheet 41 into contact with the workpiece.
    Type: Grant
    Filed: February 16, 2001
    Date of Patent: March 29, 2005
    Assignee: Seiko Epson Corporation
    Inventors: Makoto Miyazawa, Yoshinori Tabata, Takahiro Uchidani
  • Patent number: 6860794
    Abstract: A method of applying a protective gloss coating to a concrete floor includes applying a low viscosity organic coating to the concrete floor, removing the excess organic coating that lies above the peaks of concrete and curing the coating in place.
    Type: Grant
    Filed: January 16, 2003
    Date of Patent: March 1, 2005
    Assignee: Epoxi-Tech Inc.
    Inventors: Simon Palushi, Horst J. Finkenauer
  • Patent number: 6852020
    Abstract: A polishing pad for use in chemical mechanical polishing of substrates that being made of a porous structure comprising a matrix consisting of fibers, such as cotton linter cellulose bound with a thermoset resin, such as phenolic resin. The polishing pad surface has voids in which polishing slurry flows during chemical mechanical polishing of substrates, and in which debris formed during the chemical-mechanical polishing of substrates is temporarily stored for subsequent rinsing away. The polishing surface of the pad is ground to form asperities that aid in slurry transport and polishing, as well as opening the porous structure of the pad. The porous pad contains nanometer-sized filler-particles that reinforce the structure, imparting an increased resistance to wear as compared to prior-art pads. Also disclosed is a method of making the polishing pad.
    Type: Grant
    Filed: January 22, 2003
    Date of Patent: February 8, 2005
    Assignee: Raytech Innovative Solutions, Inc.
    Inventors: Angela Petroski, Richard D. Cooper, Paul Fathauer, Marc Andrew Yesnik
  • Publication number: 20040198196
    Abstract: A grinding assembly for shaping work pieces that includes one or more grind spindles. Each of the grind spindles include two independent grinding wheels driven by a single spindle drive. The grind spindles translate horizontally to perform both edge and face grinding with a single grind spindle. A non-contact position sensor in a work spindle measures work spindle displacement during grinding and provides feedback to the grind spindle to regulate the force imparted on the work piece by the grind spindle. In variations, an abrasive wheel disposed radially with respect to an axis of spindle rotation is utilized to perform edge grinding of the work piece. In other variations cleaning, polishing and grinding are carried out in a single grinding assembly. In yet other variations, a wheel dressing apparatus is utilized to dress the wheel when one or more forces to maintain productivity of the grind wheel exceed a threhold.
    Type: Application
    Filed: April 4, 2003
    Publication date: October 7, 2004
    Applicant: Strasbaugh
    Inventors: Thomas A. Walsh, Salman Moudrek Kassir
  • Patent number: 6796884
    Abstract: In one embodiment, the invention is directed to techniques for controlling the abrasivity of magnetic tape without modifying the coating formulas used to create the magnetic tape. For example, the invention may involve controlling or adjusting the abrasivity of magnetic tape using one or more burnishing techniques such as lapping, vaming or scraping. In this manner, the abrasivity of magnetic tape can be controlled or adjusted to ensure that the tape meets the necessary tape specifications without modifying the coating formulas applied during the coating process.
    Type: Grant
    Filed: May 23, 2003
    Date of Patent: September 28, 2004
    Assignee: Imation Corp.
    Inventors: Nang T. Tran, William R. Qualls
  • Publication number: 20040180613
    Abstract: An abrading machine is disclosed for abrasion of substantially plane items by use of rotating abrading discs, which are moved simultaneously forwards and backwards transverse to the item and which preferably has downward extending abrasive lamellae. The machine also preferably includes one, typically two, opposite rotating abrading cylinders fitted with elongated abrasive elements radially mounted on the abrading cylinder and has abrasive lamellae extending outwards from the cylinder. By moving the abrading discs in a reciprocatory movement transverse to the direction of feed of the items it is achieved that traces etc. from the different abrasive properties of the abrading discs are eliminated as well as all parts of milled out areas etc. are evenly abraded, particularly if the abrading device is designed for using abrading discs with abrasive means comprising abrasive lamellae made of abrasive cloth and which extend downwards from the face of the abrading disc.
    Type: Application
    Filed: March 24, 2004
    Publication date: September 16, 2004
    Inventor: Poul Lundum
  • Patent number: 6783439
    Abstract: A method for manufacturing a mirror surface tube for a photosensitive drum of a copying machine or the like, by which an external surface of an aluminium or aluminium alloy tube can be mirror-processed with high accuracy without surface defects, and in such a way that good quality required for a photosensitive drum is ensured and dimension accuracy, such as roundness, and production yield is improved involves a first step in which an aluminium or aluminium alloy tube, finished in a predetermined shape and dimension with surface roughness of 10 microns or less, is processed by a centerless grinding process. Then, in a second step, a grinding process is performed using an electrolytic integrated polishing apparatus including a tool electrode mechanism having an elastic grindstone so as to make a mirror surface tube having the surface roughness of 2.0 microns or less. Further, preferably, in a third stage, a roller burnishing process is performed to finish the tube to a surface roughness of 0.5 microns or less.
    Type: Grant
    Filed: October 14, 1999
    Date of Patent: August 31, 2004
    Assignee: Nissin Unyu Kogyo Co., Ltd.
    Inventors: Kazuo Akagi, Akira Hashimoto, Yoshimitu Nakashima
  • Patent number: 6764382
    Abstract: Both types of short aramid fibers and non-aramid synthetic fibers are extruded from a side face of each rib in a V-ribbed belt. The extruded section of the short aramid fiber is formed in curled shape. The extruded section of the synthetic fiber is formed in a sector gradually broadened toward its distal end with its non-melting condition maintained. The root portions of the extruded sections of both types of short fibers are raised from the side face of the rib. The extruded sections of the short aramid fibers are extruded in multiple directions, whereas the extruded sections of the synthetic fibers are extruded in a given direction. The extruded section of the short aramid fiber is formed longer than the extruded section of the synthetic fibers.
    Type: Grant
    Filed: August 21, 2001
    Date of Patent: July 20, 2004
    Assignee: Bando Chemical Industries, LTD
    Inventors: Koji Watanabe, Kazuyoshi Tani, Yoshitaka Kurose
  • Patent number: 6758733
    Abstract: A bevel edging wheel is described which has differing hardness abrasive matrices on the bevel cutting surfaces. The bevel edging wheel, which is suitable for edge finishing of an optical lens, includes: (1) a hub portion for attachment to a rotary power source: and (2) an outer circumferential cutting surface having a width, the surface including a bevel edging portion including a first abrasive surface and a second abrasive surface adapted for forming a bevel edge on a lens. The first abrasive surface comprises a first abrasive matrix, and the second abrasive surface comprises a second abrasive matrix wherein one of the first abrasive matrix or the second abrasive matrix has an effective hardness greater than the other.
    Type: Grant
    Filed: March 13, 2002
    Date of Patent: July 6, 2004
    Inventor: Ronald C. Wiand
  • Patent number: 6748836
    Abstract: A sheet material cutting apparatus includes a cutting head and a knife frame rotatably coupled to the cutting head. A blade defining a cutting edge is coupled for reciprocation to the knife frame, as is a primary sharpener for sharpening substantially the entire cutting edge of the blade after it becomes dull from operation. A presser foot having a secondary sharpener mounted thereon, is also coupled to the knife frame for movement between a raised non-working and a lowered working position. The secondary sharpener includes a sharpening member engageable with the cutting edge of the blade via the action of an actuator, for sharpening a portion of the blade's cutting edge between primary sharpening operations.
    Type: Grant
    Filed: January 8, 1999
    Date of Patent: June 15, 2004
    Assignee: Gerber Technology, Inc.
    Inventors: Joseph R. Vivirito, Richard Kuchta
  • Publication number: 20040102143
    Abstract: A method and apparatus for creating a groove in the surface of a collector ring for use in an electrical device. The method and apparatus can be used to create a new groove in the surface of a collector ring having none, or can be used to enhance or re-form an existing groove in the surface of a collector ring. In some embodiments, the groove in the surface of the collector ring is created using a cutting tool that has a cutting action that functions independently from the motion of the collector ring. In other embodiments, a masking material is positioned over a portion of the surface of the collector ring to create a masked portion and an exposed portion of the surface of the collector ring. A groove is then created in the exposed portion of the surface of the collector ring. The masking material is then removed from the surface of the collector ring.
    Type: Application
    Filed: September 8, 2003
    Publication date: May 27, 2004
    Applicant: Cutsforth Products, Inc.
    Inventor: David L. Cutsforth
  • Patent number: 6722959
    Abstract: A glass plate tooling apparatus has independently driven loading and unloading tools which presents raw workpieces to, and removes finished workpieces from a centrally located machining station. The machining station holds the workpiece in a fixed orientation on first and second planes. Machine tools, such as a grinder apparatus and a drill apparatus are independently movable on the first plane to engage with and tool the workpiece. The machining station rotates to provide tool accessibility on a third plane.
    Type: Grant
    Filed: March 22, 2002
    Date of Patent: April 20, 2004
    Assignee: Glassline Corporation
    Inventor: Mark Opfer
  • Patent number: 6722956
    Abstract: A finishing grindstone member (20) is fixed to a spindle (10) by a bolt. In the spindle (10), there is formed a tool mounting portion (25) into which a rough grindstone member can be mounted. Into the tool mounting portion (25), there can be mounted not only the rough grindstone member but also a cover member (36). After a silicone wafer is roughly ground using the rough grindstone member, when finish grinding the silicone wafer using the finishing grindstone member (20), the cover member (36) is mounted onto the tool mounting portion (25) to thereby prevent the tool mounting portion (25) from being soiled.
    Type: Grant
    Filed: December 27, 2000
    Date of Patent: April 20, 2004
    Assignee: Nippei Toyama Corporation
    Inventors: Tetsuo Okuyama, Shirou Murai, Kunihiro Saita, Toyotaka Wada, Tomoyuki Kawatsu
  • Patent number: 6719616
    Abstract: A rail grinding apparatus for use in grinding rails. The rail grinding apparatus includes a transport vehicle and a rail grinding unit. The transport vehicle is capable of moving along the rails or a conventional road. The rail grinding unit is capable of grinding at least one of the rails. The rail grinding unit is movable between a stored position on the transport vehicle and a deployed position on the rails.
    Type: Grant
    Filed: September 10, 2001
    Date of Patent: April 13, 2004
    Assignee: Loram Maintenance of Way, Inc.
    Inventors: Dennis R. Mathison, Donald L. Minge
  • Patent number: 6716088
    Abstract: A processing apparatus capable of grinding an arcuate groove (a groove having an arcuate shape in section) of various shapes defined in a work with a good accuracy. A pseudo-elliptic arcuate groove defined in a work is ground by a forming grindstone. The work is moved in a Y-axis direction (vertically on a paper sheet) in a state in which the forming grindstone is supported on a tool table for rotation and is moved in a X-axis direction (a direction perpendicular to the paper sheet) to abut against the arcuate groove, while rotating the work in a direction of an arrow with its axis L matched with an axis C of an indexer. Thus, it is possible to relatively move the forming grindstone to trace the arcuate groove, thereby accurately grinding the arcuate groove.
    Type: Grant
    Filed: January 9, 2002
    Date of Patent: April 6, 2004
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Yasuhiko Jinbu, Koichi Oku, Takeshi Morioka
  • Publication number: 20040038630
    Abstract: To provide a method of and an apparatus for grinding a brake pad in which inclined faces at both ends of the brake pad can be ground along a single route and no grinding limit quantity is generated whether the boundary lines are parallel with each other or not. The apparatus according to the present invention comprises: a fixing portion 11 for fixing a brake pad 3; a rotary whetstone 21 having a rotation axis parallel to a friction face 3a of the brake pad 3, a grinding face of which distance to the rotation axis increases gradually or in plurality of steps in one direction of the rotation axis, and another grinding face of which distance to the rotation axis decreases gradually or in plurality of steps in the one direction of the rotation axis; and a transporter 10 for moving one of the brake pad and the rotary whetstone in relation to each other in a intersecting direction to the rotation axis.
    Type: Application
    Filed: June 2, 2003
    Publication date: February 26, 2004
    Inventors: Kozo Yokoyama, Ryoichi Sakaguchi
  • Patent number: 6659847
    Abstract: A method of cleaning a probe card with probe pins contaminated by testing residue. A cleaning wafer is provided and the uneven surface and the grooves thereon are used to polish surfaces of the probe pins. Two kinds of cleaning operations, which utilize smaller and larger accelerations driving the cleaning wafer, are performed. The cleaning operations utilizing the smaller acceleration are used to polish the surfaces of the probe pins and the cleaning operations utilizing the larger acceleration are used to smooth the uneven surfaces of the probe pins after the former polishing operations. In addition, the cleaning wafer is rotated by various rotation angles to obtain superior cleaning.
    Type: Grant
    Filed: August 28, 2002
    Date of Patent: December 9, 2003
    Assignee: Powerchip Semiconductor Corp.
    Inventors: Yu-Hsin Liu, Kuang-Ping Tang
  • Patent number: 6595831
    Abstract: A polishing method and apparatus can concurrently establish a stable removal rate, a small step height reduction rate, and reduction of detects on the polished surface for various kinds of polished subjects, while providing less environmental problems and requiring less processing costs. The method for polishing a surface of a semiconductor device wafer comprises first polishing a surface of the semiconductor wafer by a first fixed abrasive polishing method; and finish polishing the polished surface of the semiconductor wafer by a second fixed abrasive polishing method different from the first fixed abrasive polishing method.
    Type: Grant
    Filed: April 28, 2000
    Date of Patent: July 22, 2003
    Assignee: Ebara Corporation
    Inventors: Kazuto Hirokawa, Hirokuni Hiyama, Yutaka Wada, Hisanori Matsuo, Noburu Shimizu
  • Patent number: 6579604
    Abstract: The present invention is directed, in general, to an improved material and method of planarizing a surface on a semiconductor wafer and, more specifically, to a method of altering the properties of polymers, preferably thermoplastic foam polymers, used in polishing applications. The chemical and mechanical properties thermoplastic foam substrates can be transformed by inorganic, inorganic-organic, and or organic—organic grafting techniques, such that the polymer foam is endowed with new set of properties that more desirable and suitable for polishing.
    Type: Grant
    Filed: November 27, 2001
    Date of Patent: June 17, 2003
    Assignee: PsiloQuest Inc.
    Inventors: Yaw S. Obeng, Edward M. Yokley
  • Patent number: 6572454
    Abstract: An apparatus for conditioning the polishing pads of a chemical-mechanical polishing system includes a tool having a cutting tip and positioned almost perpendicular to the surface of the polishing pad arranged on a rotary surface table of the system. The apparatus also has a horizontal moving unit for moving the tool in a direction almost parallel to the surface of the polishing pad, a base unit positioned at a side of the rotary surface table and supporting the horizontal moving unit, and a vertical moving unit for adjusting a vertical position of the tool relative to the surface of the polishing pad. The conditioning apparatus precisely determines a target depth of cut in a polishing pad by moving the tool in a vertical direction, thus allowing the tool to precisely flatten the surface of the polishing pad during a conditioning process.
    Type: Grant
    Filed: December 11, 2001
    Date of Patent: June 3, 2003
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jeong-Goo Yoon, Ju-Young Park
  • Patent number: 6565421
    Abstract: The present invention discloses an apparatus for grinding a liquid crystal cell including a power unit; a first axis receiving a rotational motion from the power unit; a second axis extending from the first axis and rotating along with the first axis; a first grinding wheel having a first grinding surface and being arranged between the first and second axes, the first grinding surface having a first inclined angle; and a second grinding wheel having second and third grinding surfaces and being arranged at a terminal portion of the second axis, the second grinding surface having a second inclined angle, and the third grinding surface having a third inclined angle.
    Type: Grant
    Filed: September 1, 2000
    Date of Patent: May 20, 2003
    Assignee: LG Philips LCD Co., Ltd.
    Inventor: Hun-Jun Choo
  • Patent number: 6561882
    Abstract: A circular or non-circular workpiece is ground in a plurality of grinding steps, including a final finish grinding step. A grinding wheel is caused to effect profile generation movement in synchronism with rotation of the workpiece and in accordance with profile data derived from the target shape of the workpiece. In each grinding step, the grinding wheel is advanced in such a manner that the grinding wheel causes cut-in movement within a predetermined cut-in angle defined on the workpiece. After completion of the final finish grinding step, the grinding wheel is retracted over a predetermined back-off angle defined on the workpiece. The retraction is effected in accordance with composite data obtained through combining the profile data and back-off data. The back-off angle is greater than the cut-in angle employed during the final finish grinding step.
    Type: Grant
    Filed: March 19, 2002
    Date of Patent: May 13, 2003
    Assignee: Toyoda Koki Kabushiki Kaisha
    Inventors: Yoshihiro Mizutani, Masashi Yoritsune, Ryohei Mukai
  • Patent number: 6511365
    Abstract: An object of the present invention is to provide a lapping machine in which abrasive grains can be efficiently and completely removed from a lapping plate. In the lapping machine of the present invention, a lapping plate has a lapping face and rotates about a rotary shaft. A moving member has a wiping face extended in a longitudinal and moves, in a plane parallel to the lapping face of the lapping plate, in the direction perpendicular to the wiping face. A driving mechanism moves the moving member. With this structure, the moving member securely catches and removes foreign substances from the lapping plate. The foreign substances left can be completely removed in a short time and the working efficiency of the lapping steps can be highly improved.
    Type: Grant
    Filed: December 10, 1999
    Date of Patent: January 28, 2003
    Assignee: Fujitsu Limited
    Inventors: Shigeo Terashima, Hiroyuki Miyazawa
  • Publication number: 20030017790
    Abstract: A circular or non-circular workpiece is ground in a plurality of grinding steps, including a final finish grinding step. A grinding wheel is caused to effect profile generation movement in synchronism with rotation of the workpiece and in accordance with profile data derived from the target shape of the workpiece. In each grinding step, the grinding wheel is advanced in such a manner that the grinding wheel causes cut-in movement within a predetermined cut-in angle defined on the workpiece. After completion of the final finish grinding step, the grinding wheel is retracted over a predetermined back-off angle defined on the workpiece. The retraction is effected in accordance with composite data obtained through combining the profile data and back-off data. The back-off angle is greater than the cut-in angle employed during the final finish grinding step.
    Type: Application
    Filed: March 19, 2002
    Publication date: January 23, 2003
    Applicant: TOYODA KOKI KABUSHIKI KAISHA
    Inventors: Yoshihiro Mizutani, Masashi Yoritsune, Ryohei Mukai
  • Patent number: 6500052
    Abstract: The circumferential edge portion of a ductile rotating body containing abrasive grains is used to polish the surface of a ceramic substrate. The angle &thgr; formed between the polishing direction D0 of the ceramic substrate and the rotating direction D1, of the rotating body is set in the range from 10° to 80° for the polishing step. Alternatively, the polishing process is divided into at least two steps. and the average grain size of abrasive grains is reduced stepwise in the successive steps of the polishing process. According to this method, the surface of a large-area and thin ceramic substrate can be polished without damage, and a smooth polished ceramic surface can be provided. This method is particularly suitable for polishing a ceramic substrate having a thickness of at most 2.0 mm, and the resulting polished ceramic substrate is suitable for a ceramic heater in a thermal fixation device for fixing a toner image.
    Type: Grant
    Filed: September 26, 2001
    Date of Patent: December 31, 2002
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Masuhiro Natsuhara, Hirohiko Nakata, Motoyuki Tanaka, Yasuhisa Yushio
  • Patent number: 6485357
    Abstract: An adjustable grinding machine for grinding a plurality of first articles, wherein each first article has two substantially opposite surfaces, and a plurality of second articles, wherein each second article has two substantially opposite surfaces. The adjustable grinding machine includes a structural support member, and a first grinder assembly supported from the structural support member, wherein the first grinder is adapted to grind the two surfaces of the first article simultaneously. The adjustable grinding machine further including a second grinder assembly supported from the structural support member, wherein the second grinder is adapted to grind the two surfaces of the second article simultaneously.
    Type: Grant
    Filed: August 30, 2000
    Date of Patent: November 26, 2002
    Assignee: Divine Machinery Sales, Inc.
    Inventor: David L. Divine
  • Patent number: RE38364
    Abstract: A method of both hardening and polishing a concrete surface includes the steps of first applying to the concrete surface a hardening/densifying silicate compound, allowing the compound to remain in contact with the surface for a period of time sufficient to allow it to soak into the surface of the concrete, cleaning the surface and allowing it to dry, and polishing the surface with a diluted silicate polishing compound. The polishing step includes the steps of applying to the concrete surface a diluted silicate polishing compound, mechanically polishing the concrete surface with a rotary polishing machine, using pads or disks or drums, cleaning the concrete surface, and repeating said steps with polishing pads or disks of increasingly finer grit until the surface obtains an aesthetically desirable level of shine.
    Type: Grant
    Filed: October 1, 2002
    Date of Patent: December 23, 2003
    Assignee: Curecrete Chemical Company, Inc.
    Inventors: Mark Wetherell, Jerald W. Jones