Abstract: A circular or non-circular workpiece is ground in a plurality of grinding steps, including a final finish grinding step. A grinding wheel is caused to effect profile generation movement in synchronism with rotation of the workpiece and in accordance with profile data derived from the target shape of the workpiece. In each grinding step, the grinding wheel is advanced in such a manner that the grinding wheel causes cut-in movement within a predetermined cut-in angle defined on the workpiece. After completion of the final finish grinding step, the grinding wheel is retracted over a predetermined back-off angle defined on the workpiece. The retraction is effected in accordance with composite data obtained through combining the profile data and back-off data. The back-off angle is greater than the cut-in angle employed during the final finish grinding step.

Abstract: The circumferential edge portion of a ductile rotating body containing abrasive grains is used to polish the surface of a ceramic substrate. The angle &thgr; formed between the polishing direction D0 of the ceramic substrate and the rotating direction D1, of the rotating body is set in the range from 10° to 80° for the polishing step. Alternatively, the polishing process is divided into at least two steps. and the average grain size of abrasive grains is reduced stepwise in the successive steps of the polishing process. According to this method, the surface of a large-area and thin ceramic substrate can be polished without damage, and a smooth polished ceramic surface can be provided. This method is particularly suitable for polishing a ceramic substrate having a thickness of at most 2.0 mm, and the resulting polished ceramic substrate is suitable for a ceramic heater in a thermal fixation device for fixing a toner image.

Abstract: An adjustable grinding machine for grinding a plurality of first articles, wherein each first article has two substantially opposite surfaces, and a plurality of second articles, wherein each second article has two substantially opposite surfaces. The adjustable grinding machine includes a structural support member, and a first grinder assembly supported from the structural support member, wherein the first grinder is adapted to grind the two surfaces of the first article simultaneously. The adjustable grinding machine further including a second grinder assembly supported from the structural support member, wherein the second grinder is adapted to grind the two surfaces of the second article simultaneously.

Abstract: A fixed abrasive chemical polishing method uses an aqueous solution that has a variable pH. During polishing the pH of the aqueous solution is changed so that the polishing process can be more precisely controlled. The removal rate and removal selectivity between oxide and nitride can be controlled by varying the pH of the aqueous solution.

Abstract: A dry method of concrete floor or concrete surface restoration uses the process of grinding a concrete surface to be resurfaced while extracting and retaining dust during the grinding process. The grinding process is repeated each time using finer grinding grit until a preselected degree of smoothness of the concrete surface is achieved. A sealer is applied to the concrete surface which has been ground to the predetermined degree of smoothness. In a preferred embodiment, two coats of sealer are applied and the sealer is preferably a water-based, odorless, penetrating alkaline siliconate solution. The method of the present invention limits down time to aisles and main areas during the restoration process, as well as limiting the dust and odor during the process to provide a lustrous smooth surface on the concrete.

Abstract: A method of grinding the edge of a disc uses a grinding machine having mounted thereon a grooved grinding wheel, in which the groove is formed in situ using a forming wheel also mounted on the grinding machine. After a workpiece has been ground or after a succession of workpieces have been ground, re-engaging the grinding wheel and the forming wheel with the grinding wheel remaining in situ, to re-form the groove in the grinding wheel to correct for wear.

Abstract: A surface of a work piece, in which a plurality of magnetic head elements are formed on a substrate, is linearly ground. The surface is linearly ground by an outer circumferential face of a disk-shaped rotary grind stone. By the linear grind, linear grind traces are formed in the work piece. By selecting the direction of the grind traces, amount and direction of warping the work piece can be controlled. By making the direction of the grind traces parallel to a direction of cutting of the work piece to form a plurality of blocks, in each of which a plurality of magnetic head elements are arranged, stress in the blocks are released and the amount of warping of the blocks can be reduced.

Abstract: A method of both hardening/densifying and polishing a concrete surface includes the steps of first applying to the concrete surface a silicate, siliconate, fluorosilicate, siloxane, silazane, silicon ester, and/or silane hardening/densifying compound, allowing the compound to remain in contact with the surface for a period of time sufficient to allow it to soak into the surface of the concrete, optionally allowing the surface to thoroughly dry, and polishing the surface with water or a diluted silicate, siliconate, fluorosilicate, siloxane, silazane, silicon ester, and/or silane polishing compound. The polishing step includes the steps of applying to the concrete surface water or the diluted polishing compound, mechanically polishing the concrete surface, cleaning the concrete surface, and repeating these steps with polishing pads or discs of increasingly finer grit until the surface obtains the desired level of shine.

Abstract: Grinding wheels are fabricated with outwardly extending circular peripheral rims having a continuous rim surface to which separate abrasive pieces, preferably of a superabrasive such as CBN, are secured by suitable adhesive. The superabrasive pieces are preferably circular and of a diameter corresponding to the width of the rim and are secured to the rim surface so as to either be adjacent and touch one another or to be spaced one from the other around the circle of the rim surface so that a predetermined amount but not all of the rim surface is covered with abrasive pieces. That rim surface coverage optimize grinding efficiency while providing space for fluid flow for purposes of cooling and carrying away particles from the grinding process.

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

Abstract: A backup pad for engaging and supporting abrasive sheets, the backup pad being mounted securely to a drive shaft to prevent relative rotation thereto, and to allow easy mounting and dismounting of the backup pad to the mounting shaft without the use of tools. The backup pad includes a body comprising a front surface and a back surface, releasable engagement means provided on the front surface for releasably engaging an abrasive article, and a mounting boss provided on said rear surface. The mounting boss includes a first end facing away from the body, and an opening in the first end of the boss, the opening being formed by an inner surface generally perpendicular to said body and defining a non-circular cross-section. The opening includes elastic means such as an o-ring for releasably engaging a drive shaft mounted in said opening. Also disclosed is a method of using such a backup pad.

Abstract: A surface grinding method is provided by which grinding striations are produced so that the striations can fully be removed by a polish-off amount less than required in a conventional way in mirror polishing following surface grinding using an infeed type surface grinder, in which two circular tables, opposite to each other, which are driven and rotate independently from each other, are arranged so that the peripheral end portion of one table coincides with an axial center of a rotary shaft of the other table all time, the two circular tables being located so as to be shifted sideways from each other; not only is a grinding stone held fixedly on an opposite surface of the one table, but the wafer is fixed on an opposite surface of the other table; the two tables are rotated relatively to each other; and at least one table is pressed on the other while at least one table is relatively moved in a direction, so that a surface of the wafer is ground, wherein the surface of the wafer is ground while controlling a

Abstract: A cutting method of cutting a workpiece by moving the workpiece relatively to a cutting blade that has an annular cutting edge and rotates in a predetermined direction, the workpiece being moved in a direction at right angles to the rotary shaft of the cutting blade, wherein the cutting method comprises a cutting step of cutting the workpiece by moving the workpiece in a forward direction in respect to the rotational direction of the cutting blade at a position where the blade and the workpiece face each other, and a burr-trimming step for tracing the groove cut by the cutting step by moving the workpiece in a direction against the rotational direction of the cutting blade at a position where the blade and the workpiece face each other.

Abstract: A working apparatus of a magnet member comprises: a transfer path for guiding magnet members to be ground in one direction; transfer means for pushing the plurality of magnet members in a transfer direction to continuously send out the magnet members to the transfer path; a pair of grinding means disposed such as to sandwich the transfer path for grinding opposite surfaces of the transferred magnet member; and pushing means disposed downstream from the grinding means for pushing the magnet member in a direction opposite from the transfer direction. With this structure, it is possible to work the magnet member into a predetermined shape with excellent productivity.

Abstract: A method for mirror processing of an external surface of a long-sized metal piece, by which the external surface is mirror-polished with precision and high efficiency without a surface defect or so that stable dimensional accuracy, such as a roundness and improvement of yield in production, can be obtained. The method comprises the steps of clamping both ends of a long-sized metal piece, applying a positive electrical charge and rotating the metal piece, and moving the long-sized metal in the axial direction through an electrolytic integrated polishing apparatus for processing the external surface of a long-sized metal piece into a mirror surface.

Abstract: A processing system for increasing the quality of a gear having a shot peening apparatus for subjecting, to shot peening, a gear after tooth-forming and surface hardening; a barreling apparatus positioned adjacently to the shot peening apparatus, for subjecting, to barreling, the gear which has been subject to shot peening by the shot peening apparatus; and a gear feeding apparatus positioned adjacently to the shot peening apparatus and the barreling apparatus, for feeding, to the barreling apparatus, the gear which has been subjected to the shot peening by the shot peening apparatus. Thus, a gear of high quality can be efficiently produced, and the working environment can be cleaned at low cost by a dust collecting apparatus.

Abstract: A honing head for microburnishing surface of a recording/reproducing disc to a smoothness at which asperities are limited to submicron heights including a hardened contact bearing surface having an array of depressions with abrupt trailing edges interconnected by recessed channels leading outwardly from the honing head. The array of channels span a band in which an asperity may be present, and the sharp edges shear off the asperities within the band which extend above the chosen submicroinch height, with the separated particulates being passed through the recesses and channel system to the outer edge of the honing head. The trailing edges act to shear off the unwanted heights of the asperities, while the recesses enable pressure differentials and air flows to direct the separated particulates outwardly relative to the disc, centripetal forces of rotation bearing the particulates from the disc.

Abstract: A grinding machine has a swivel head (1) with at least one plunge-grinding wheel (2), a cup wheel (3) and a measuring gauge (7) for measuring the diameter and the length of the workpiece.

Abstract: A method of grinding the edge of a disc uses a grinding machine having mounted thereon a grooved grinding wheel, in which the groove is formed in situ using a forming wheel also mounted on the grinding machine. After a workpiece has been ground or after a succession of workpieces have been ground, re-engaging the grinding wheel and the forming wheel with the grinding wheel remaining in situ, to re-form the groove in the grinding wheel to correct for wear.

Abstract: A system and method for cleaning probe pins on a probe card used in testing a semiconductor device during fabrication thereof. A ceramic cleaning wafer is utilized to clean the probe pins without having to remove the probe card from a production line. The same apparatus used to test production wafers also handles the cleaning wafer during a probe cleaning cycle. During operation of the cleaning cycle, the cleaning wafer is placed in a manual load tray, which inserts the cleaning wafer into a prober machine. The cleaning wafer is transported by a robotic trolley to a prealign stage area where the cleaning wafer is aligned and centered. The cleaning wafer is then placed on a support device. The support device and cleaning wafer are positioned under a pneumatic sensor and profiled to determine wafer planarity. The support device and cleaning wafer are then positioned underneath the probe pins on the probe card to be cleaned.

Abstract: A method and an apparatus are proposed for grinding cams having concave flanks on a camshaft, using a grinding wheel of relatively small diameter, which is used at least for finish-grinding. The axis of the grinding wheel runs at an angle to the camshaft longitudinal axis, and the grinding wheel is aligned at the same angle. In order to achieve a satisfactory running surface, the grinding wheel is tracked along an advance axis running perpendicular to the infeed axis, specifically as a function of the rotational position of the camshaft and of the positioning on the infeed axis.

Abstract: The present invention is directed to polishing the surface of an airplane part to an improved specularity by adding the additional step of sanding prior to the polishing step.

Abstract: A method of both hardening and polishing a concrete surface includes the steps of first applying to the concrete surface a hardening/densifying silicate compound, allowing the compound to remain in contact with the surface for a period of time sufficient to allow it to soak into the surface of the concrete, cleaning the surface and allowing it to dry, and polishing the surface with a diluted silicate polishing compound. The polishing step includes the steps of applying to the concrete surface a diluted silicate polishing compound, mechanically polishing the concrete surface with a rotary polishing machine, using pads or disks or drums, cleaning the concrete surface, and repeating said steps with polishing pads or disks of increasingly finer grit until the surface obtains an aesthetically desirable level of shine.

Abstract: A process and a device for polishing both sides of an optical lens, in which the lens is mounted in a first workpiece holder and is polished on a first side and a second workpiece holder is then positioned opposite the first work piece holder. The lens, without being turned around, is transferred to the second workpiece holder, where its other side is polished by treatment coming from the side of the first workpiece holder.

Abstract: A method and device which is provided for thinning flip chip bonded integrated circuit (IC) devices with better accuracy. The method and device permit a successful approach to one portion of the circuit while leaving other portions of the circuit intact. Thus, other portions of the circuit can be the subject of later analysis or can be modified as debugging may require. The method and device provide the above stated capability in an effective and efficient manner.

Abstract: An apparatus for automating the machining operations required to form a teardrop shaped recess in a cylindrical member, such as provided for punches. The apparatus includes a four station turntable assembly, the four stations include a loading/retrieving station and three work stations approximately spaced 90.degree. from adjacent stations. The three work stations each include a grinding tool movable in a horizontal and vertical direction to control the machining of the cylindrical member. The turntable rotates the workpiece from one station to another station.

Abstract: A creping doctor blade and method of forming such blade including a thin flexible generally planar creping member having an elongated flexible, substantially prismatic body having a relieved substantially planar engagement surface adapted to bear against the drying cylinder. A rake face of the creping doctor blade extends generally outwardly relative to a surface of the rotatable drying cylinder when the creping blade engages the cylinder and the length of the substantially planar engagement surface is generally equivalent to the width of the drying cylinder with the width of the substantially planar engagement surface being selected so as to correspond to the wear pad dimension of a conventional blade used in the same processes and is generally in a range from about 0.005 inches to about 0.020 inches with the relief face of the blade adjacent to the rotatable drying cylinder having an elongated depression having a depth of at least about 0.

Abstract: A method and to an apparatus for polishing a gravure roller, and for removing the chromium plating thereof, wherein the roller has a metallic shell galvanically covered by a copper layer having a pattern and a protective chromium plating. The method includes the steps of hitting the chromium plating with blunt bodies associated with a first rotating disk, thereby removing the chromium plating, which is broken and removed through the elastic collapsing of the underlying copper layer when the blunt bodies hit the chromium plating; and smoothing the copper layer by means of a second rotating disk provided with abrasive members. The apparatus includes an ammeter circuit for controlling the pressure exerted by the disk on the roller surface.

Abstract: In a process for the material-abrading machining of the edge of a semiconductor wafer, the semiconductor wafer is resting on a rotationally movable table, is rotated about a central axis and is machined by a plurality of rotating machining tools. It is intended for each of the machining tools to abrade a specific quantity of material from the edge of the semiconductor wafer. The process is one in which the machining tools, during the course of a 360.degree.-rotation of the semiconductor wafer, are successively advanced toward the edge of the semiconductor wafer and ultimately simultaneously machine the edge of the semiconductor wafer. A machining tool which has just been advanced is intended to abrade a smaller quantity from the edge of the semiconductor wafer than a previously advanced machining tool. The machining of the edge of the semiconductor wafer with one machining tool is terminated at the earliest once the semiconductor wafer has rotated through 360.degree.

Abstract: A process finishes the surface of rotationally symmetrical workpieces. The workpiece is pre-machined and hardened with a stock allowance and is then finished in two steps in a device in which it is clamped only once. The largest part of the stock allowance is first cut by a hard turning process and the residue is then ground down to the actual size of the workpiece to be manufactured. The device for performing this process includes a motor-driven workpiece spindle for receiving the workpiece having a spindle head. The workpiece spindle has at least one motor-driven grinding spindle adapted to accept a grinding tool. The grinding spindle generally is axially aligned with the workpiece spindle or the workpiece thereon. The workpiece spindle can be fitted with a lathe tool having a cutting edge for hard turning.

Abstract: A grinding stone for grinding a railhead surface of a rail includes abrasive material. The abrasive material has a first side surface and an opposed second side surface. The first and second sides surfaces are joined by a circumferential surface. The circumferential surface is transversely disposed with respect to at least the first side surface. The abrasive material presents a bevelled grinding surface extending from a substantially circular locus of points on the second side surface to a substantially circumferential locus of points on the circumferential surface. A method of re-profiling the railhead surface of a rail includes the steps of:rotating at least one grinding stone;bringing the bevelled grinding surface of the grinding stone into contact with the railhead surface; andadvancing the grinding stone along the rail.

Abstract: A chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices or the like. The invention is directed to a self-dressing, hydrophilic polishing pad capable of releasing particles during polishing. Such a pad design is very efficient in providing polishing particles over the entire polishing surface interface. Since the polishing pad produces polishing particles, the polishing fluid can comprise very low loadings of polishing particles, if any.

Abstract: Proposed is a cutting wheel bladed on the outer periphery of a base wheel with abrasive particles, e.g., particles of diamond and cubic boron nitride, suitable for cutting of a hard and brittle material such as a sintered block of a rare earth-based magnet alloy with good cutting accuracy and low material loss by cutting. The cutting wheel is an integral disk body consisting of a base wheel of a relatively small thickness made from a cemented metal carbide, e.g., tungsten carbide particles cemented with metallic cobalt, instead of conventional steel materials and a cutting blade formed on the outer periphery of the base wheel which contains from 10 to 80% by volume of the abrasive particles having a specified average particle diameter.

Abstract: A process and apparatus for polishing an optical surface of an ophthalmic lens is provided. The process of the invention comprises the steps of roughing an optical surface of a polycarbonate lens substantially without coolant and passing a polishing wheel of the present invention over the surface of the lens with the use of coolant and then passing the polishing wheel over the surface of the lens substantially without coolant for at least one pass over the portion of the lens edge to be polished. A single abrasive wheel is used for machine polishing of the optical surface of the lens. The wheel is an impregnated wheel of from about 2 to about 60 micron diamond hardness abrasive particles in a concentration of from about 10 to about 200 concentration.

Abstract: A method is provided for machining the fire deck of an engine block. The method includes providing a grinding wheel having an outer annular grinding element disposed concentrically or the wheel may be provided with an inner annular grinding element disposed concentrically inward of an outer element. The outer element comprises a single layer of relatively coarse diamond abrasive brazed on a metallic substrate, while the inner element comprises a single layer of relatively fine diamond abrasive brazed on a similar substrate. The outer grinding element and the inner element if utilized, is formed as a discrete unit individually fastened to a backing plate to facilitate independent height adjustment of the elements relative the backing plate. The method further comprises orienting the grinding wheel with its axis of rotation at a predetermined oblique angle a relative the fire deck.

Abstract: A method of polishing semiconductor wafers includes a double side primary polishing step and a single side secondary polishing step using a single side polishing machine with a wafer holder including a template so bonded on a carrier plate as having one or more wafer receiving holes in which backing pads are disposed respectively for holding the back sides of the respective wafers fittingly received therein. This method makes it to possible to hold a plurality of wafers at one time due to batch processing to thereby improve the productivity, and decrease extremely the generation of the defective dimples in the front side of the wafer. Compared with conventional single side polishing, the flatness level of the wafer polished with the double side polishing machine in this method is improved.

Abstract: An abrasive material grinding wheel for grinding the plate front face of an as-cast railroad wheel to remove sprues and riser pads has a projecting and leading edge to extend the ground surface into close proximity to a hub and fillet section of the railroad wheel, which grinding wheel has a reduced wall thickness, a recess for receiving a retaining flange to reduce the elements extending from the outer face of the grinding wheel, and a sloped outer grinding surface projecting the leading edge and providing a grinding-wheel surface adequate to grind the entire riser pad from the plate front surface between the wheel rim and the front hub fillet, and to generally retain the grinding wheel outer surface contour during multiple grinding operations.

Abstract: This invention provides a clean and inexpensive apparatus and method of rapidly grinding an edge of a sheet of glass. The method involves: locating a sheet of glass on a support surface, lifting a sheet by a rotatable support which is movable through two axes, lifting the sheet by a rotatable support, moving the sheet along the first axis to a predetermined height, moving the sheet along the second axis until the sheet makes contact with the grinding wheel, translating the sheet to maintain contact with the grinding wheel while the glass is rotated, and replacing the glass on a support surface after the entire periphery of the glass is ground. Also disclosed is an apparatus for performing this method.

Abstract: An electrolytic in-process dressing method, an electrolytic in-process dressing grinding apparatus, and an electrolytic in-process dressing grindstone, for grinding workpiece as the grindstone is being subjected to electrolytic in-process dressing, are provided, in which the grindstone is made of abrasive grains and a binding material which is capable of forming a uniform and fine passive layer at the grinding surface thereof and also capable of preventing excessive elusion of the binding material, thereby preventing the formation of chips at the ground surface in the course of grinding operation.

Abstract: This invention relates to a shaper head or rotating matrix which can be used in a process for manufacturing decorative mouldings by contacting a stock material to the rotating shaper head or matrix, such that the shaper head or matrix removes stock material. The resulting moulding is a relief of or has a negative surface in relation to the shaper head. The shaper head is a rotatable matrix comprising an axis and an exterior surface wherein the plane through the exterior surface and normal to the axis is circular and wherein at least two or more of said planes are characterized by different radii and an attaching mechanism for attaching the matrix to a source of rotary motion through the axis of the matrix. The invention also includes a process for manufacturing the mouldings and the mouldings produced by the process.

Abstract: Method of making pistons and piston rods as well as cylinders for hydraulic and pneumatic apparatus, whereby a precision-finished cylindrical semi-finished article made of an aluminum alloy is hard-anodized at its sliding surface and whereby the hard-anodized article is rotated about its axis and the formed ceramic sliding surface layer thereof is treated by a plurality of successive grinding operations with two-dimensional grinding media of differing reducing grain size.

Abstract: A polishing apparatus for polishing a workpiece such as a semiconductor wafer to a flat mirror finish includes a rotary drum provided on a surface thereof with a polishing pad. A stand supports the workpiece to be polished. A controlling device controls reciprocation of the drum and rotation of the workpiece to obtain a relationship:V/.omega.>Lin which V represents velocity of reciprocation of the drum reciprocating on the workpiece to polish an entire surface of the workpiece, .omega. represents rotational angular velocity of the workpiece, and L represents a distance from the rotational center of the workpiece to a radially outermost point on the workpiece.

Abstract: A process for manufacturing a field replaceable laser writer spindle assembly having a shaft with two ball bearings and a spindle head, comprises the steps of preloading both ball bearings to a predetermined level. The spindle head is rotated about a longitudinal axis of the spindle assembly, and a reference surface of the spindle head is ground to a predetermined tolerance for minimizing runout of the reference surface for producing the field replaceable spindle assembly.

Abstract: A process and apparatus for edging and polishing an ophthalmic lens is provided whereby an edge of a polycarbonate ophthalmic lens is polished to a high luster finish substantially equal to the finish on the optical surface of the lens. The process allows the use of one machine for processing of all common ophthalmic lens materials such as polycarbonate, CR 39 or glass, whereby the lens may be edged and polished with one machine. The process of the invention comprises the steps of roughing a polycarbonate lens substantially without coolant and passing a polishing wheel of the present invention over the surface of the lens substantially without coolant and then passing the polishing wheel over the surface of the lens with the use of coolant for at least one pass over the portion of the lens edge to be polished. A single abrasive wheel is used for machine polishing of the lens edge.

Abstract: A method and an apparatus for forming a hemispherical convex mirror surface on the end of a ferrule or optical fiber connector efficiently and accurately. The apparatus has a grinding wheel having a concave work surface, a tool for correcting the shape of the work surface, a stage for bringing the tool into contact with the wheel, a mechanism for causing the end of the ferrule to contact the work surface, and a mechanism for displacing the axis of the ferrule from the center of the curvature of the arcuate section of the work surface. After the axis of the ferrule has been displaced from the center of the curvature, the ferrule is caused to contact the work surface and roughly ground thereby. Subsequently, after the ferrule axis has been brought into alignment with the center of curvature, the ferrule is sequentially finished from the tip to a preselected point thereof.

Abstract: A buffing apparatus which can buff a thin plate work without causing buckling. The buffing apparatus comprises a plurality of buffing rolls removably secured in a predetermined spaced relationship from each other to a shaft which is driven to rotate, a backup roll disposed in parallel to the buffing rolls and extending over the overall length of all of the buffing rolls, and a holding roll disposed at least between each adjacent ones of the buffing rolls. The holding roll is positioned such that the axis thereof is positioned on a straight line inter-connecting the center of transverse section of one of the buffing rolls and the center of a transverse section of the backup roll and an outer periphery thereof substantially contacts with a contacting plane of the buffing rolls.

Abstract: A disk drive unit includes a housing enclosing a spindle and motor assembly, a number of magnetic data storage disks and a number of transducer heads. Each magnetic data storage disk includes a surface with a coarsely textured head landing zone and a finely textured data storage area. The coarse texture is applied over the fine texture in the landing zone without forming a step in elevation at the boundary. A method for texturing the magnetic disk includes first applying a fine texture to both the data storage area and the landing zone, and then applying a coarse texture to the landing zone only. Texturing apparatus includes peripheral disk clamps permitting axial compliant movement when the opposed disk surfaces are engaged by balanced, pneumatically biased abrading tools. A free abrasive slurry is introduced to pads carried by the tools.

Abstract: A machine tool is equipped with a feed screw unit for relatively moving a tool and a work to be worked and a contact detection means for detecting contact between the tool and the work, which is provided for a feed screw unit. With the feed screw unit is engaged a nut member and the nut member is provided with a minutely expandable member capable of being minutely or finely expanded or contracted in an axial direction of the nut member. The minutely expandable member is provided with a minutely expandable means, and the contact detection means is provided for the minutely expandable member. The contact detection means and the minutely expandable means are disposed in parallel or in series, or in combination, to each other with respect to an axial direction of a feed shaft.

Abstract: An apparatus for sharpening the edge of an elongated object includes a housing having an exposed sharpening section with a sharpening element in the sharpening section. The sharpening element is formed from a single abrasive coated sharpening element having a pair of abrasive coated planar comb-like structures formed along opposing sides of the sharpening element. The sharpening element is bent into an X configuration wherein the alternating teeth and slots interdigitate to form the X-shaped configuration and form a sharpening angle between the interdigitating teeth. The sharpening angle has a bisection line with an elongated interrupted sharpening surface.

Abstract: A belt grinding machine for forming cutting edges of complex geometry on surgical instruments includes a fixture for holding an instrument with a site thereon in a position for grinding a surface at the site on the instrument, a grinding assembly having a grinding belt with a planar span for grinding the surface at the site on the instrument, an oscillation producing mechanism for oscillating the instrument relative to the grinding belt so as to reciprocally translate the site on the instrument parallel and relative to the planar span of the grinding belt concurrently with grinding the surface at the site on the instrument, a translation producing mechanism for selectively translating the grinding assembly and thus the planar span of the grinding belt toward and away from the site on the instrument to permit receiving and setting up of the instrument in the instrument holding fixture and to place the instrument in a position for the planar span of the grinding belt to grind the surface at the site on the inst