Abstract: A honing head for microburnishing surface of a recording/reproducing disc to a smoothness at which asperities are limited to submicron heights including a hardened contact bearing surface having an array of depressions with abrupt trailing edges interconnected by recessed channels leading outwardly from the honing head. The array of channels span a band in which an asperity may be present, and the sharp edges shear off the asperities within the band which extend above the chosen submicroinch height, with the separated particulates being passed through the recesses and channel system to the outer edge of the honing head. The trailing edges act to shear off the unwanted heights of the asperities, while the recesses enable pressure differentials and air flows to direct the separated particulates outwardly relative to the disc, centripetal forces of rotation bearing the particulates from the disc.

Abstract: In the wafer chamfering method, there is used a disk-shaped grindstone 8 which includes: a peripheral edge portion serving as a grinding surface 1; a flat portion formed in the central portion of the grinding surface 1 in the width direction thereof; and, two edge portions 5 respectively formed on the two sides of the flat portion 2 in the width direction thereof and made in the form of the shape of the valley portion of the notch portion 4 of a disk-shaped wafer 3 to be chamfered. In operation, in the wafer chamfering method, while rotating the above grindstone 8, the grindstone 8 is revolved in the thickness direction of the wafer 3 to thereby chamfer the wafer 3.

Abstract: A burnishing head configured to provide extremely close control of the burnishing height, to minimize stiction between the burnishing head and a disc being burnished, and to optimize the tribological relationship between the burnishing head and a disc being burnished. The burnishing head includes one or more spacer pads, associated with selected ones of the burnishing pads on the burnishing head, which remain in contact with the surface of a disc being burnished. The height from the contact surface of the spacer pad to the contact surface of the burnishing pad determines the effective burnishing height. The burnishing head also includes moats, or recessed areas, surrounding the burnishing pads to minimize the stiction caused by generation of a liquid meniscus between the disc and contacting elements of the burnishing head, and which act as collection points for particulates generated by the burnishing process.

Abstract: Apparatuses and methods are disclosed using a fixed abrasive polishing pad to perform mechanical polishing of a surface. The apparatus includes a polishing pad positioned opposing a wafer support to provide for polishing of a surface of a wafer placed on the support. The polishing pad includes a first member having a first polishing surface formed from an abrasive first material that is structurally degradable during polishing. The polishing pad also includes a second member having a second polishing surface formed from a second material that is less degradable and less abrasive relative to said first material. The first and second polishing surfaces define a polishing face that is brought into contact with the surface to be polished.

Abstract: A method and an apparatus for manufacturing a semiconductor integrated circuit in which semiconductor elements (2) and a wiring structure connecting the semiconductor elements (2) one another are located on a semiconductor substrate (1). In the method or apparatus, a series of wiring elements (4,6,7,9,10), each of which constructs the wiring structure is formed sequentially, then the semiconductor integrated circuit under manufacturing process is washed by neutral solution containing oxidant during the process of forming of the wiring elements (4,6,7,9,10).

Abstract: A burnishing tape apparatus includes pads that press the burnishing tape against the surfaces of the disk to be burnished. The pads are mounted on pad holders that are biased to press the pads against both sides of the disk. Tape guides are used to apply tension to the burnishing pad when the pads are moved away from the disk. When the pads are away from the disk tape guides hold the burnishing tape away from the pads so that the burnishing tape may be indexed without damaging or dislodging the pads. As the pads are moved into contact with the disk, the tape guides release the tension on the burnishing tape while the centering guides ensure that the burnishing tape is centered on the pads. By releasing tension on the burnishing tape, the pads are permitted to press the approximate center of the burnishing tape against the surfaces of the disk without deforming in an uncontrolled manner.

Abstract: Surface polishing system adapted to polish, lap or grind a surface of a workpiece in a plane such that the workpiece is held in sliding contact with a polishing face of a rotating polishing plate, wherein the workpiece is rotated by a work rotating device about an autorotation axis thereof which is parallel to an axis of rotation of the polishing plate and which lies within the surface of the workpiece, and the autorotation axis of the workpiece is revolved by a work revolving device about a revolving axis which is parallel to the axis of rotation of the polishing plate and which lies within a circumscribed circle of the surface of the workpiece.

Abstract: A method of controlling surface non-uniformity of a process layer includes receiving a first lot of wafers, and polishing a process layer of the first lot of wafers. A control variable of the polishing operations is measured after the polishing is performed on the process layer. A first adjustment input for an arm oscillation length of a polishing tool is determined based on the measurement of the control variable. A process layer of a second lot of wafers is polished using the adjustment input for the arm oscillation length. A controller for controlling surface non-uniformity of a process layer includes an optimizer and an interface. The optimizer is adapted to determine a first adjustment input for arm oscillation length of a polishing tool based on a measurement of a control variable from a first lot of wafers. The interface is adapted to provide the first adjustment input to the polishing tool for polishing a second lot of wafers.

Abstract: Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks are described. In one aspect a polishing chuck includes a body dimensioned to hold a work piece, and a multi-positionable, force-bearing surface is positioned on the body. The surface has an undeflected position, and is bi-directionally deflectable away from the undeflected position. A deformable work piece-engaging member is disposed adjacent the force-bearing surface for receiving a work piece thereagainst. The work piece-engaging member is positioned for movement with the force-bearing surface. In another aspect, a yieldable surface is provided on the body and has a central area and a peripheral area outward of the central area. One of the central and peripheral areas is movable, relative to the other of is the areas to provide both inwardly and outwardly flexed surface configurations.

Abstract: Apparatus for removing random scratches formed during the polishing of magnetic recording media, and for disposing on the surface of the media a near-circumferential texture which increases the recording reliability of the media while simultaneously reducing its failure rate. The present invention teaches the application of a low unit load force to a pad and polishing tape combination in contact with a rotating and oscillating disk surface to completely remove the random scratches previously formed by a polishing step. The apparatus facilitates the application of a specially designed, extremely fine alumina slurry composition without producing similar size circumferential scratches at the high surface speeds.

Abstract: A honing head for microburnishing surface of a recording/reproducing disc to a smoothness at which asperities are limited to submicron heights including a hardened contact bearing surface having an array of depressions with abrupt trailing edges interconnected by recessed channels leading outwardly from the honing head. The array of channels span a band in which an asperity may be present, and the sharp edges shear off the asperities within the band which extend above the chosen submicroinch height, with the separated particulates being passed through the recesses and channel system to the outer edge of the honing head. The trailing edges act to shear off the unwanted heights of the asperities, while the recesses enable pressure differentials and air flows to direct the separated particulates outwardly relative to the disc, centripetal forces of rotation bearing the particulates from the disc.

Abstract: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

Abstract: A polishing machine comprise a support unit for horizontally supporting a work piece at an outer peripheral edge thereof, to be freely rotatable with a central axis thereof serving as a center of the rotation, a rotation driving unit for driving rotation of the work piece with the central axis thereof serving as a center of the rotation, a polishing plate provided to be opposite to a surface of the work piece and reciprocate along a direction of a diameter of the work piece, and pressed onto the surface of the work piece at a predetermined force and polishing cloth provided between the polishing plate and the surface of the work piece.

Abstract: A chemical mechanical polishing apparatus polishes the surface of a substrate to remove material therefrom. The apparatus includes a carrier, which positions the substrate against the rotating polishing pad. The carrier includes an integral loading member therein, which controls the load force of the substrate against the polishing pad. Multiple substrates may be simultaneously polished on a single rotating polishing pad, and the polishing pad may be rotationally oscillated to reduce the likelihood that any contaminants are transferred from one substrate to another along the polishing pad. A multi-lobed groove in the polishing pad may be used, in conjunction with a moving substrate, to polish the surface of the substrate.

Abstract: A restoration apparatus and method for removing scratches, defects and related imperfections that exist within the surface of an optical storage medium, such as audio, video and/or computer compact discs. The illustrated restoration apparatus includes a support carriage, having an interior portion containing fluids used in the restoration process. The apparatus further includes a retention disk for securing the CD to be restored. The retention disk is supported within a recess formed in the top surface of the support carriage. The recess is fluid tight so that the CD can be placed, and maintained, in fluid contact with various restoration liquids. Also, the retention disk is supported on a bearing surface so that the retention disk and the CD contained therein can freely rotate. The restoration apparatus also includes an arm, attached to the top surface of the support carriage with a hinge, within which is positioned a motor and a polishing head.

Abstract: A multi-step CMP system is used to polish a wafer to form metal interconnects in a dielectric layer upon which barrier and metal layers have been formed. A first polish removes an upper portion of the metal layer using a first slurry and a first set of polishing parameters, leaving residual metal within the dielectric layer to serve as the metal interconnects. A second polish of the wafer on the same platen and polishing pad removes portions of the barrier layer using a second slurry under a second set of polishing parameters. The second polish clears the barrier layer from the upper surface of the dielectric layer, thereby forming the metal interconnect. To reduce dishing and dielectric erosion, the second slurry is selected so that the barrier layer is removed at a faster rate than the residual metal within the dielectric layer. A cleaning step may be optionally performed between the first and second polishes.

Abstract: A molded abrasive brush having a backing with a plurality of bristles extending therefrom. The backing and bristles are preferably integrally molded. The brush is molded from a moldable polymer such a thermoset polymer, thermoplastic polymer, or thermoplastic elastomer. The moldable polymer includes a plurality of organic or inorganic abrasive particles interspersed throughout at least the bristles, and can be interspersed throughout the brush. The moldable brush can include an attaching means molded integrally with the backing. Also disclosed is a method of making a molded abrasive brush and a method of refining a workpiece surface with a molded abrasive brush.

Abstract: An abrasive shaped article composed of at least 90% by weight, based on the weight of the abrasive shaped article, of silica and having a bulk density of 0.2 g/cm3 to 1.5 g/cm3, a BET specific surface area of 10 m2/g to 400 m2/g and an average particle diameter of 0.001 &mgr;m to 0.5 &mgr;m. An abrasive disc having fitted thereto at least one of the abrasive shaped article is advantageously used for polishing a material such as substrate. Preferably at least two kinds of abrasive shaped articles are fitted to the supporting auxiliary, at least one kind of which has a bulk density of 0.7 g/cm3 to 1.5 g/cm3 and at least one kind of which has a bulk density of at least 0.2 g/cm3 but smaller than 0.7 g/cm3.

Abstract: A dresser is used which makes it possible to simultaneously dress and condition the surface of a polishing pad deteriorated by polishing a semiconductor wafer in the CMP process. The dresser is a dresser comprised of a ceramic such as dressing SiC, SiN, alumina or silica. Use of this dresser enables to shorten the time of dressing/conditioning the deteriorated polishing pad.

Abstract: A sizing lapping apparatus includes a rotatably provided disk-shaped lap plate for supplying a lapping liquid thereto; at least one holding portion for holding a workpiece, the at least one holding portion being used to press the workpiece against the lap plate; a support shaft, provided in an erected state with respect to the lap plate, for supporting the at least one holding portion; an oscillating mechanism for causing the support shaft to undergo oscillatory rotational motion around an axis thereof; a base for supporting the support shaft so that the support shaft freely rotates around the axis thereof; and a base rocking mechanism for reciprocating the base in a diametrical direction of the lap plate or in a direction substantially parallel to the diametrical direction. The sizing lapping apparatus can carry out lapping operations with very high precision. This is made possible by partly adjusting the amount by which the workpiece is lapped, in accordance with the lapping state of the workpiece.

Abstract: The present invention provides a method and apparatus for delivering one or more rinse agents to a surface, such as a polishing pad surface and preferably one or more polishing fluids. The invention also provides a method of cleaning one or more surfaces, such as a polishing pad surface and a substrate surface, by delivering a spray of one or more rinse agents to the surface and, preferably, causing the rinse agent to flow across the surface from a central region to an outer region where unwanted debris and material is collected.

Abstract: A metal bond grinding wheel 12 having a horizontal working surface 12a, a holding and rotating means 14 for a workpiece having a horizontal supporting surface 14a opposite to said working surface 12a, a voltage applying means 16 having the metal bond grinding wheels and an electrode 16a installed oppositely to the working surfaces in an uncontacted state and applying a pulsed voltage between them, a grinding fluid feeding means 18 for feeding an electroconductive grinding fluid to the working surfaces are installed.

Abstract: A brake pad operates to both resurface the braking surface of a rotor, and then automatically continue functioning as a normal brake pad. The rotor resurfacing is accomplished on the vehicle, employing all the components of a vehicle brake assembly, creating a perfect fit of the rotor and brake pad surfaces. In one embodiment, the brake pad includes a backing plate, a first plane of frictional material on the backing plate, and a second plane of frictional material mounted over the first plane of frictional material. The second plane of frictional material includes abrasive strips, each of the strips being separated from an adjacent one of the strips by a region of the first plane of frictional material. Preferably, the second plane of frictional material removes material from a rotor, when the brake pad is in frictional engagement with the rotor.

Abstract: The present invention is directed to the field of semiconductor processing and, more particularly, to a method of planarizing or polishing process layers formed above a surface of a semiconducting substrate. In one illustrative embodiment, the method comprises determining the thickness of a process layer formed above a semiconducting substrate and determining a polishing recipe for said process layer based upon the measured thickness of said process layer.

Abstract: A pair of ring-shaped lapping plates 13, 23 are faced to both surfaces of a wafer 1. Each lapping plate 13, 23 has an outer diameter approximately equal to a radius of the wafer 1 and a lapping surface 14, 24 sliding in contact with the wafer 1. Each lapping plate 13, 23 is rotated along a direction reverse from the other, while an abrasion slurry A is fed into cavities 15, 25 of the lapping plates 13, 23 and discharged together with dusts separated from the wafer 1 through grooves engraved in the lapping surfaces 14, 24 and gaps between the wafer 1 and the lapping surfaces 14, 24. The lapping plate 23 is carried toward the stationary lapping plate 13 at a rate corresponding to abrasion of the lapping surfaces 14, 24. During lapping, the wafer 1 is rotated by drive rollers 31 and supported by guide rollers 32. In this way, both surfaces of the wafer 1 are simultaneously lapped.

Abstract: An abrasive polishing pad for planarizing a substrate. In one embodiment, the abrasive polishing pad has a planarizing surface with a first planarizing region and a second planarizing region. The first planarizing region has a first abrasiveness and the second planarizing region has a second abrasiveness different than the first abrasiveness of the first region. The polishing pad preferably has a plurality of abrasive elements at the planarizing surface in at least one of the first or second planarizing regions. The abrasive elements may be abrasive particles fixedly suspended in a suspension medium, contact/non-contact regions on the pad, or other elements that mechanically remove material from the wafer.

Abstract: The polishing apparatus can control the attitude of the top ring with respect to a surface of a turntable of a polishing apparatus is controlled so as to provide a uniform polish surface pressure across the entire polish surface. The polishing apparatus includes the turntable having an abrading surface, a top ring for holding an object to be polished to keep the object surface in moving contact with the abrading surface while rotating the turntable and the top ring, a magnetic bearing assembly for supporting a rotation shaft of the top ring by means of a thrust bearing device and at least one radial bearing device, and an attitude controller for controlling an orientation of the top ring with respect to the turntable through the magnetic bearing assembly.

Abstract: The method for producing a magnetic recording medium, includes the steps of (a) subjecting surfaces of a substrate to grinding by a ductile-mode grinding with a grinding wheel having a setting depth of cut of from 0.05 to 20 .mu.m, to give a surface-worked substrate having grinding marks of arc patterns; and (b) forming recording medium-constituting layers at least comprising an under layer, a magnetic layer, and a protective layer on the surface-worked substrate, or on a mirror-polished substrate obtained by further subjecting the surface-worked substrate to a finish polishing. The resulting magnetic recording medium is constituted by (a) the surface-worked substrate or the mirror-polished substrate; and (b) recording medium-constituting layers at least comprising an under layer, a magnetic layer, and a protective layer, wherein the recording medium-constituting layers are formed on the surface-worked substrate, or on a mirror-polished substrate.

Abstract: A brake disc assembly including an inner hub (14) extending between a drive end (16) and a wheel end (18) and a disc flange (20) extending radially about the circumference of the inner hub (14) at the wheel end (18) with the inner hub (14) having a bore (22) extending between the ends for receiving a drive shaft. A brake disc has a base (26) attached to the disc flange (20) about the circumference of the inner hub (14) and a rotor (28) extends radially from the base (26) and presents parallel braking surfaces (30). A bearing assembly surrounds the hub (14) between the drive end (16) and the disc flange (20) for supporting the hub (14) with an outer race (32) presents a support flange (34) for attachment to a support structure (36) and an inner race member (58) is disposed about the drive end (16).

Abstract: Double or multiple unit polishing heads are used thereby negating the negative effects that irregularities in the surface of the polishing pad have on the polishing results obtained. Adjacent double or multiple unit polishing heads rotate in opposite directions thereby eliminating the effects of microscopic directions in the surface of the polishing pads.

Abstract: Apparatus for removing random scratches formed during the polishing of magnetic recording media, and for disposing on the surface of the media a near-circumferential texture which increases the recording reliability of the media while simultaneously reducing its failure rate. The present invention teaches the application of a low unit load force to a pad and polishing tape combination in contact with a rotating and oscillating disk surface to completely remove the random scratches previously formed by a polishing step. The apparatus facilitates the application of a specially designed, extremely fine alumina slurry composition without producing similar size circumferential scratches at the high surface speeds.

Abstract: A method and apparatus for preventing lateral movement of a movable brake member of a brake assembly when in engagement with a rotatable brake member having a braking surface. The method includes creating a plurality of grooves in the braking surface. Each groove is parallel to adjacent grooves so that peaks are formed on a movable brake member which mirror the plurality of grooves. The peaks track within the grooves to prevent lateral movement of the movable brake member with respect to the braking surface. The apparatus includes a brake resurfacer for resurfacing a braking surface of a vehicle brake assembly while the braking surface is mounted to a vehicle. The resurfacer includes a substrate figured for mounting in the brake assembly in place of a movable brake member. The substrate supports cutting teeth, tines or an abrasive for removing braking surface material to resurface the braking surface.

Abstract: A brake disk is machined the by first fitting to a wheel hub centered on a hub axis and having a radially projecting flange a wheel bearing having an outer bearing race formed with an axially directed mounting surface for attachment to a motor vehicle. Then the mounting surface of the outer bearing race is clamped axially to a stationary workpiece carrier so as to mount the wheel hub on the workpiece carrier. A brake disk having a pair of opposite faces extending substantially perpendicular to the axis is then secured to the flange and the wheel hub and the brake disk are rotated about the axis. Then the faces of the rotating brake disk are engaged with machining tools to surface machine the faces.

Abstract: Method for removing random scratches formed during the polishing of magnetic recording media, and for disposing on the surface of the media a near-circumferential texture which increases the recording reliability of the media while simultaneously reducing its failure rate. The present invention teaches the application of a low unit load force to a large surface pad and polishing tape combination while in contact with a rotating disk surface that is also moving in a circumferential direction to completely remove the random scratches previously formed by a polishing step. The scratches are removed with the aid of a specially designed, extremely fine alumina slurry composition which prevent producing similar size circumferential scratches at the high surface speeds. The methodology provides for a smoother disk surface than prior known super-polish/texture methodologies.

Abstract: A chemical-mechanical planarization (CMP) process is provided whereby cyclical pressure means varies the force against the wafer and polishing pad during the planarizing operation with the planarizing pad specially defined to have a relaxation time which is correlated with the force cycle so that the planarizing is enhanced. The relaxation time of the pad is greater than the downward an/or upward force cycle time on the wafer or pad and provides a planarizing process wherein the height of the pad during planarization is intermediate between a decompressed pad position and a compressed pad position typically encountered in a conventional CMP process.

Abstract: In a polishing machine so configured that a surface to be polished of a wafer is brought into a sliding contact with a polishing pad spread over a rotating surface plate, while supplying a polishing liquid onto the polishing pad, for the purpose of polishing the surface to be polished of the wafer, the polishing pad includes a lower polishing web formed of a relatively soft material and spread on a surface of the rotating surface plate, and an upper polishing web formed of a relatively hard material and larger than the lower polishing web. The upper polishing web is laid on the lower polishing web with a double-adhesive-coated waterproof tape being interposed between the upper polishing web and the lower polishing web, so that a peripheral portion of the upper polishing web is bonded to a peripheral portion of the rotating surface plate with only the waterproof tape being interposed between the rotating surface plate and the peripheral portion of the upper polishing web.

Abstract: Systems and methods of thermal control in the carbon dioxide cleaning of data storage disks to reduce or prevent condensation on the surface of the media during cleaning with frozen carbon dioxide are disclosed. A hub recess receives at least a portion of the outer flange of the hub to improve contact between the data storage media and a media platform supporting the media. Contact between the media and the media platform may be further improved by drawing a vacuum through openings in the media platform. In addition, drawing a vacuum through a vacuum channel with an annular ring opening about the media platform and a tangential vacuum port may reduce fluttering of the media on the media platform.

Abstract: A polishing method characterized by measuring the thickness of a film of a monitoring piece to be polished which is to be used exclusively for monitoring polishing amount, and obtaining polishing amount on the basis of the results of measurement, and judging, on the basis of the resulting polishing amount, setting/change of polishing condition of a polishing object, whether it is necessary or not to replace a polishing pad, and/or completion of run-in polishing after replacement of the polishing pad, and an apparatus to be used for practicing same.

Abstract: A method and apparatus for polishing hard discs uniformly while minimizing frictional electricity between the discs and polishing materials as well as preventing from frictionally heated deformation. A turntable for placing a disc thereon is freely rotatable without being connected to any motor or other driving force. A polishing material rotates horizontally and polishes the surface of the disc by contacting with the surface. The turntable relatively slides against the surface of the polishing material. A spindle of the polishing material is slightly inclined toward the center of the turntable from a vertical axis of the disc. The turntable is rotated in a direction opposite to the rotating direction of the disc. The rotation of the turntable is induced by the rotation of the polishing material transmitted by the friction between disc and turntable. The disc is substantially electrically connected to the ground during the polishing.

Abstract: A wafer processing apparatus and method of processing a wafer utilizing a processing slurry are provided. The wafer processing disk comprises a processing disk body and a plurality of processing teeth secured to the processing disk body. The plurality of processing teeth project from the disk body to define respective processing surfaces. The plurality of processing teeth include at least one pair of spaced adjacent teeth defining a processing channel there between. The processing channel is shaped such that the cross sectional area of the processing channel decreases as a function of its distance from the processing disk body.

Abstract: A method and to an apparatus for polishing a gravure roller, and for removing the chromium plating thereof, wherein the roller has a metallic shell galvanically covered by a copper layer having a pattern and a protective chromium plating. The method includes the steps of hitting the chromium plating with blunt bodies associated with a first rotating disk, thereby removing the chromium plating, which is broken and removed through the elastic collapsing of the underlying copper layer when the blunt bodies hit the chromium plating; and smoothing the copper layer by means of a second rotating disk provided with abrasive members. The apparatus includes an ammeter circuit for controlling the pressure exerted by the disk on the roller surface.

Abstract: A method is provided for processing a metal foil sheet to produce magnetic recording media. The method comprises providing an elongate metal foil sheet having a first side and a second side. The sheet is advanced through a plurality of processing stations in equal unit length segments such that each segment receives the same treatment to form a magnetic recording medium from each segment. Method are also provided to prepare the foil surfaces by polishing, texturing, cleaning, and stress relieving, to coat the prepared surfaces with at least one metal layer, to finish the coated layers by buffing, burnishing, and lubricating, and to form disk units from the prepared, coated and finished surfaces.

Abstract: A method of polishing the end face of a ferrule on an optical connector comprises providing a polishing sheet containing abrasive grains and providing a polishing fluid containing abrasive grains having a hardness greater than that of the abrasive grains of the polishing sheet. The end face of the ferrule including an optical fiber is pressed against a surface of the polishing sheet while effecting relative movement between the ferrule and the polishing sheet and while supplying the polishing fluid onto the surface of the polishing sheet.

Abstract: In semiconductor wafer polishing, a backing pad is sized smaller than the wafer being polished so as to produce a desired backset, allowing the wafer to bend, thereby reducing over-polish at the wafer edge.

Abstract: A method for repairing a compact disc (1) damaged by a circumferential scratch (2) comprises subjecting a localized area (21) around the scratch (2) to a treatment regime comprising fifty rubbing cycles with a first abrasive sheet (10) of abrasive particle size of 1 micron. Each rubbing cycle comprises one manual radial stroke in the radial direction A and a return radial stroke in the radial direction B. After the first treatment regime if the scratch (2) has not been sufficiently removed the localized area (21) is then subjected to a similar treatment regime with a second abrasive sheet of abrasive particle size 3 microns. A further similar treatment regime is carried out using a third abrasive sheet of abrasive particle size 5 microns in the event that the second abrasive sheet did not sufficiently remove the scratch (2).

Abstract: A spindle assembly for force controlled operation in applications such as the chemical mechanical planarization of semiconductor wafers includes an axially and rotatably movable spindle driven by a force producing device. The force producing device is controlled by a position feedback loop in a first mode of operation and a spindle force control feedback loop in a second mode of operation so that the same force producing device controls spindle movement in the first mode of operation and maintains a constant pressure on a workpiece based on the detected applied pressure in the second mode of operation.

Abstract: A wafer processing apparatus and method of processing a wafer utilizing a processing slurry are provided. The wafer processing disk comprises a processing disk body and a plurality of processing teeth secured to the processing disk body. The plurality of processing teeth project from the disk body to define respective processing surfaces. The plurality of processing teeth include at least one pair of spaced adjacent teeth defining a processing channel there between. The processing channel is shaped such that the cross sectional area of the processing channel decreases as a function of its distance from the processing disk body.

Abstract: A process for surface grinding of a flange surface of a wheel hub onto which a brake disk can be mounted for a motor vehicle includes the mounting of the wheel bearing on the wheel hub before the grinding operation. An outer bearing ring is then clamped on a stationary support and, as the wheel hub is rotated, the surfaces ground by a cup-shaped grinding disk rotated about an axis parallel to that of the axis of rotation of the hub.

Abstract: A polishing pad is provided comprising an upper surface and a lower surface, substantially parallel to one another, wherein the pad has enhanced flexibility produced by scoring of either or both surfaces. The pad thickness is generally greater than 500.mu.. The scoring creates slits having a depth of less than 90% of the thickness.

Abstract: The invention presents a method for conditioning and texturing of lapping plate surfaces used in high precision lapping, the conditioning and texturing is achieved without the use of free abrasive particles and slurries through use of a conditioning ring having a hard bound abrasive particle layer. The conditioning ring is contacted with the lapping plate surface, both rotating in the same direction but at different RPMs resulting in grooved microprofiles of the lapping plate surface. The invention provides a lapping process using the conditioned and textured lapping plate surface along with free abrasive particles carried in the grooves in combination with glycols and citrates for ABS generation.