By Optical Sensor Patents (Class 451/6)
  • Patent number: 8834229
    Abstract: A method of controlling polishing includes polishing a substrate and receiving an identification of a selected spectral feature, a wavelength range having a width, and a characteristic of the selected spectral feature to monitor during polishing. A sequence of spectra of light from the substrate is measured while the substrate is being polished. A sequence of values of the characteristic of the selected spectral feature is generated from the sequence of spectra. For at least some spectra from the sequence of spectra, a modified wavelength range is generated based on a position of the spectral feature within a previous wavelength range used for a previous spectrum in the sequence of spectra, the modified wavelength range is searched for the selected spectral feature, and a value of a characteristic of the selected spectral feature is determined.
    Type: Grant
    Filed: April 20, 2011
    Date of Patent: September 16, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Jeffrey Drue David, Harry Q. Lee
  • Patent number: 8834234
    Abstract: A double-side polishing apparatus including at least: upper and lower turn tables each having a polishing pad attached thereto; a carrier having a holding hole formed therein for holding a wafer between the upper and lower turn tables; a sensor for detecting a thickness of the wafer during polishing, the sensor being disposed in a through-hole provided at the upper turn table in a direction of an upper-turn-table rotation axis; and a sensor holder for holding the sensor, wherein a material of the sensor holder is quartz. As a result, there is provided a double-side polishing apparatus that can polish a wafer while the difference from the target wafer thickness is reduced by surely inhibiting deformation of the sensor holder due to the influence of heat generated during the polishing of the wafer.
    Type: Grant
    Filed: November 16, 2010
    Date of Patent: September 16, 2014
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Junichi Ueno, Kazuya Sato, Syuichi Kobayashi
  • Publication number: 20140256226
    Abstract: A chemical mechanical polishing pad is provided, comprising: a polishing layer having a polishing surface; and, a broad spectrum, endpoint detection window block having a thickness along an axis perpendicular to a plane of the polishing surface; wherein the broad spectrum, endpoint detection window block, comprises an olefin copolymer; wherein the olefin copolymer, comprises, as initial components: ethylene, a branched or straight chain C3-30 ?-olefin; a silane; and, optionally, a polyolefin; wherein the broad spectrum, endpoint detection window block exhibits a uniform chemical composition across its thickness; wherein the broad spectrum, endpoint detection window block exhibits a spectrum loss ?60%; and, wherein the polishing surface is adapted for polishing a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate.
    Type: Application
    Filed: March 7, 2013
    Publication date: September 11, 2014
    Inventors: Angus Repper, Mary A. Leugers, David B. James
  • Publication number: 20140256225
    Abstract: A chemical mechanical polishing pad is provided, comprising: a polishing layer having a polishing surface; and, a broad spectrum, endpoint detection window block having a thickness along an axis perpendicular to a plane of the polishing surface; wherein the broad spectrum, endpoint detection window block, comprises a cyclic olefin addition polymer; wherein the broad spectrum, endpoint detection window block exhibits a uniform chemical composition across its thickness; wherein the broad spectrum, endpoint detection window block exhibits a spectrum loss ?40%; and, wherein the polishing surface is adapted for polishing a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate.
    Type: Application
    Filed: March 7, 2013
    Publication date: September 11, 2014
    Applicants: DOW GLOBAL TECHNOLOGIES LLC, Roham and Haas Electronic Materials CMP Holdings Inc
    Inventors: Angus Repper, David B. James, Mary A. Leugers
  • Publication number: 20140242878
    Abstract: A method of controlling a polishing operation includes measuring a plurality of spectra at a plurality of different positions on a substrate to provide a plurality of measured spectra. For each measured spectrum of the plurality of measured spectra, a characterizing value is generated based on the measured spectrum. For each characterizing value, a goodness of fit of the measured spectrum to another spectrum used in generating the characterizing value is determined. A wafer-level characterizing value map is generated by applying a regression to the plurality of characterizing values with the plurality of goodnesses of fit used as weighting factors in the regression. A polishing endpoint or a polishing parameter of the polishing apparatus is adjusted based on the wafer-level characterizing map, and the substrate or a subsequent substrate is polished in the polishing apparatus with the adjusted polishing endpoint or polishing parameter.
    Type: Application
    Filed: February 26, 2013
    Publication date: August 28, 2014
    Applicant: Applied Materials, Inc.
    Inventors: Benjamin Cherian, Jeffrey Drue David, Boguslaw A. Swedek, Dominic J. Benvegnu, Jun Qian, Thomas H. Osterheld
  • Publication number: 20140242883
    Abstract: A polishing apparatus includes a carrier head configured to hold a wafer in a first plane, the wafer having a perimeter and a fiducial, a drive shaft having an axis perpendicular to the first plane and configured to rotate the carrier head about the axis, a light source configured to direct light onto an outer face of the wafer at a position adjacent the perimeter of the wafer; a detector configured to detect the light collected from the wafer while the drive shaft rotates the carrier head and the wafer; and a controller configured to receive a first signal indicating an angular position of the drive shaft and receive a second signal from the detector, the controller configured to determine based on the first signal and the second signal an angular position of the fiducial with respect the carrier head.
    Type: Application
    Filed: February 27, 2013
    Publication date: August 28, 2014
    Applicant: Applied Materials, Inc.
    Inventors: Benjamin Cherian, Jeffrey Drue David, Boguslaw A. Swedek, Thomas H. Osterheld, Jun Qian, Thomas Li, Doyle E. Bennett, David J. Lischka, Steven M. Zuniga
  • Publication number: 20140242880
    Abstract: A method of controlling a polishing operation includes storing an optical model for a layer stack having a plurality of layers. The optical model has a plurality of input parameters, the plurality of input parameters including a first parameter and a second parameter. The second parameter is a polarization angle or a relative contribution between two orthogonal polarizations. A spectrum reflected from the substrate is measured with an in-sequence or in-situ monitoring system to provide a measured spectrum. The optical model is fit to the measured spectrum, or a plurality of reference spectra are calculated using the optical model and a best matching reference spectrum from the plurality of reference spectra is determined.
    Type: Application
    Filed: February 26, 2013
    Publication date: August 28, 2014
    Applicant: Applied Materials, Inc.
    Inventor: Jeffrey Drue David
  • Patent number: 8808059
    Abstract: An optical model for a layer stack has a plurality of input parameters, the plurality of input parameters defining a parameter space. A plurality of model spectra are generated by calculating a model spectrum using the optical model for each of a first plurality of different points in the parameter space. A test spectrum of a test substrate is measured. For each model spectrum of the plurality of model spectra, the test spectrum is compared to the model spectrum to determine a difference value, thereby generating a plurality of difference values. A plurality of minima in the plurality of difference values are determined. Reference spectra can be generated clustered around points in the parameter space corresponding to a local minimum from the plurality of minima, or the local minimum can be used as a seed value in fitting the optical model to a measured spectrum.
    Type: Grant
    Filed: February 27, 2013
    Date of Patent: August 19, 2014
    Assignee: Applied Materials, Inc.
    Inventor: Jeffrey Drue David
  • Patent number: 8795029
    Abstract: An endpoint detection method includes processing an outer surface of a substrate, directing an incident light beam through a window in an opaque metal body onto the surface being processed, receiving at a detector a reflected light beam from the substrate and generating a signal from the detector, and generating a signal based on the reflected light beam received at the detector, and detecting a processing endpoint. The signal is a time-varying cyclic signal that varies as the thickness of the layer varies over time, and detecting the processing endpoint includes detecting that a portion of a cycle of the cyclic signal has passed, the portion being less than a full cycle of the cyclic signal.
    Type: Grant
    Filed: January 18, 2013
    Date of Patent: August 5, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Manoocher Birang, Nils Johansson, Allan Gleason
  • Patent number: 8790157
    Abstract: A method for grinding the surface of non-round workpieces. The method includes the steps of clamping a workpiece within a machining unit; machining the workpiece; without unclamping the workpiece, contactlessly measuring the workpiece using an optical measuring device having a conoscopic holography sensor with a characteristic measuring range; and machining and measuring the workpiece in an alternating manner to iteratively approach the desired measurements of a specified form by adjusting the distance between the optical measuring device and the surface of the workpiece depending on there being a deviation of the surface from the specified form so that a respectively measured area of the surface of the workpiece remains within the measuring range of the optical sensor.
    Type: Grant
    Filed: February 18, 2013
    Date of Patent: July 29, 2014
    Assignee: L. Kellenberger & Co.
    Inventors: Daniel Honegger, Hugo Thurnherr, Claus P. Keferstein, Bernard Gschwend, Markus Ritter
  • Patent number: 8790155
    Abstract: The present invention relates to a grinding machine for grinding a workpiece, in particular cams, with a grinding wheel having a profile with a grinding region running substantially parallel to the axis of rotation of the grinding wheel and at least one profile section which does not run parallel to the axis of rotation of the grinding wheel, a control unit for controlling the grinding process, wherein the control unit is configured in such a manner that, with reference to position information on positions of edges of the workpiece in the direction of the longitudinal axis of the workpiece, the edges of the workpiece are successively deburred or chamfered by the at least one profile section of the grinding wheel during or after the grinding of the workpiece.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: July 29, 2014
    Assignee: Schaudt Mikrosa GmbH
    Inventor: Berthold Stroppel
  • Patent number: 8790158
    Abstract: A chemical mechanical polishing apparatus includes a platen having a first region configured to support a wafer, and a second region disposed outside the first region. The chemical mechanical polishing apparatus further includes a polishing pad disposed on the platen, a pad head to which the polishing pad is attached, a slurry supply configured to supply a slurry onto the wafer, and an injection port disposing on the second region of the platen. The injection port is configured to inject a predetermined gas to an edge of a bottom surface of the wafer and toward the outside of the wafer.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: July 29, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: One-Moon Chang, Jae-Phil Boo, Jong-Bok Kim, Soo-Young Tak, Jong-Sun Ahn, Shin Kim
  • Publication number: 20140206259
    Abstract: A substrate polishing system includes a platen to support a polishing surface, a carrier head configured to hold a substrate against the polishing surface during polishing, a light source configured to direct a light beam onto a surface of the substrate, a detector including an array of detection elements, and a controller. The detector is configured to detect reflections of the light beam from an area of the surface, and is configured to generate an image having pixels representing regions on the substrate having a length less than 0.1 mm. The controller is configured to receive the image and to detect clearance of a metal layer from an underlying layer on the substrate based on the image.
    Type: Application
    Filed: March 11, 2013
    Publication date: July 24, 2014
    Applicant: Applied Materials, Inc.
    Inventors: Dominic J. Benvegnu, Boguslaw A. Swedek
  • Patent number: 8784158
    Abstract: In a continuous grinding machine for grinding the surface of flat workpieces (20) with at least one grinding station and a transport device (10) for moving the workpieces (20) relative to the grinding station, the grinding station having at least one grinding assembly (22) with a grinding belt (26) and a pressure device (34) for pressing the grinding belt (26) against the workpiece surface, and with a control device (38) for controlling the pressure device (34) depending on the workpiece contour, the transport device (10) is reversible with respect to its feed direction and the control device (38) has means (36) for detecting the workpiece contour depending on the feed direction.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: July 22, 2014
    Assignee: Hans Weber Maschinenfabrik GmbH
    Inventor: Georg Weber
  • Patent number: 8781787
    Abstract: A substrate carrying mechanism includes: a base; a substrate holding member placed on the base and capable of holding a substrate and of being advanced and retracted relative to the base; four or more detecting units respectively for detecting different parts of the edge of a substrate held by the substrate holding member when the substrate holding member holding a substrate is retracted; and a controller that determines whether or not a notch formed in the edge of the substrate has been detected by one of the detecting units, on the basis of measurements measured by the four or more detecting units and corrects an error in a transfer position where the substrate is to be transferred to the succeeding processing unit on the basis of measurements measured by the detecting units excluding the one detecting unit that has detected the notch of the substrate.
    Type: Grant
    Filed: August 19, 2011
    Date of Patent: July 15, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Tokutarou Hayashi, Kiminari Sakaguchi
  • Patent number: 8777694
    Abstract: Method and apparatus for detecting an accurate polishing endpoint of a substrate based on a change in polishing rate are provided. The method includes: applying a light to the surface of the substrate and receiving a reflected light from the substrate; obtaining a plurality of spectral profiles at predetermined time intervals, each spectral profile indicating reflection intensity at each wavelength of the reflected light; selecting at least one pair of spectral profiles, including a latest spectral profile, from the plurality of spectral profiles obtained; calculating a difference in the reflection intensity at a predetermined wavelength between the spectral profiles selected; determining an amount of change in the reflection intensity from the difference; and determining a polishing endpoint based on the amount of change.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: July 15, 2014
    Assignees: Ebara Corporation, Kabushiki Kaisha Toshiba
    Inventors: Shinrou Ohta, Atsushi Shigeta
  • Patent number: 8771038
    Abstract: A polishing apparatus includes a stage configured to hold a substrate, a stage-rotating mechanism configured to rotate the stage, and a polishing head configured to polish a periphery of the substrate held by the stage. The polishing apparatus also includes a controller configured to control operations of the stage, the stage-rotating mechanism, and the polishing head, an image-capturing device configured to capture an image of the periphery of the substrate through at least one terminal imaging element arranged so as to face the periphery of the substrate, an image processor configured to process the image captured by the image-capturing device, and a liquid ejector configured to eject a light-transmissive liquid toward the periphery of the substrate to fill a space between the periphery of the substrate and the terminal imaging element with the liquid.
    Type: Grant
    Filed: June 24, 2008
    Date of Patent: July 8, 2014
    Assignee: Ebara Corporation
    Inventors: Toshifumi Kimba, Hiroaki Kusa, Masaki Fujii
  • Patent number: 8773670
    Abstract: A method accurately monitors the progress of polishing and accurately detects the polishing end point. The method includes directing light to the substrate during polishing of the substrate, receiving reflected light from the substrate, measuring an intensity of the reflected light at each wavelength, and producing a spectrum indicating a relationship between intensity and wavelength from measured values of the intensity. The method also includes calculating an amount of change in the spectrum per predetermined time, integrating the amount of change in the spectrum with respect to polishing time to obtain an amount of cumulative change in the spectrum, and monitoring the progress of polishing of the substrate based on the amount of cumulative change in the spectrum.
    Type: Grant
    Filed: October 9, 2013
    Date of Patent: July 8, 2014
    Assignee: Ebara Corporation
    Inventor: Yoichi Kobayashi
  • Patent number: 8715035
    Abstract: The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density and pattern density, equipment platform and type of slurry used. These pads can be designed with a specialized polymeric nano-structure with a long or short range order which allows for molecular level tuning achieving superior thermo-mechanical characteristics. More particularly, the pads can be designed and fabricated so that there is both uniform and nonuniform spatial distribution of chemical and physical properties within the pads.
    Type: Grant
    Filed: February 21, 2006
    Date of Patent: May 6, 2014
    Assignee: NexPlanar Corporation
    Inventors: Pradip K. Roy, Manish Deopura, Sudhanshu Misra
  • Publication number: 20140120802
    Abstract: Flat-surfaced workpieces such as semiconductor wafers are held in flat-surfaced abrading contact with the abrasive surface of a flexible raised-island disk that is attached to a flat-surfaced rotating platen. There are recessed areas between the abrasive-coated raised islands where light can transmitted through the transparent backings. Platens are constructed with open passageways that extend radially from the outer periphery of the platen to the area that is under the abraded wafer. Stationary light sources are directed radially to the platen edge where they enter the open passageways to impinge on mirrors that direct the light to contact the surface of the wafer. The light beams reflected from the wafer surface are directed with mirrors back to a stationary light-receiver positioned at the outer periphery of the platen. The light-receiver device allows abraded condition of the flat surface of the wafer to be monitored during the abrasive lapping or polishing procedure.
    Type: Application
    Filed: October 31, 2012
    Publication date: May 1, 2014
    Inventor: Wayne O. Duescher
  • Patent number: 8708774
    Abstract: An automatic grinding machine for end mills for wood, programmable with optical reading of geometric features and for computerized sharpening, has a compact structure, which includes a computerized control panel actuating various assemblies adapted for automated sharpening. A first optical reading assembly has an arm for automatic movement from an inactive position to a position suited for detecting the geometric features of the end mill. A second assembly for holding the end mill is configured to move on command forward and backward and/or simultaneously rotate the mill about its own axis. A third assembly for supporting a cup grinding wheel is mounted on the vertical frame, which rests on a rotatable circular and horizontal base. The grinding wheel can move above and below, longitudinally along the mill and/or in front of it, on the right and left side to sharpen end mills for wood with a left-handed or right-handed helix.
    Type: Grant
    Filed: May 31, 2012
    Date of Patent: April 29, 2014
    Assignee: Nordutensili S.R.L.
    Inventor: Nereo Diplotti
  • Publication number: 20140113528
    Abstract: Method for manufacturing an optical component, including a substrate made of a fusible material, includes the following steps a) and b) of steps a), b) and c), or steps a), b), c) and d): a) roughing; b) fine grinding; c) polishing; and d) finishing. The method includes steps, subsequent to any one of steps b), c) and/or d): e) inspecting the optical surface of the optical component; f) detecting and locating at least one surface defect to be eliminated; g) for each surface defect, applying a laser beam to an area emcompassing the defect, so as to produce a local remelting of the fusible material, and to form, at the location of the defect, an area of material remelted; h) polishing the optical surface including at least one area of remelted material, to produce a polished optical surface free of surface defects, and continuing with steps c) and d).
    Type: Application
    Filed: June 29, 2012
    Publication date: April 24, 2014
    Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Philippe Cormont, Jean-Luc Rullier
  • Publication number: 20140113526
    Abstract: A system for controlling a manufacturing process of a substrate, the system may include an illumination module that is arranged to illuminate multiple regions of a substrate with electromagnetic radiation; a detection module that is arranged to detect electromagnetic signals resulting from the illumination of the multiple regions; and a processor that is arranged to: determine dimensions of multiple vias that are deposited within a substrate of the substrate to provide first via measurement results; determine substrate thickness at multiple locations to provide first substrate thickness results; and provide information related to at least one out of (a) the first substrate thickness results and (b) the first via measurement results to at least one out of (i) a thinning device arranged to thin the substrate and (ii) a manufacturing device that differs from the thinning device and is arranged to participate in a manufacturing of the substrate.
    Type: Application
    Filed: October 16, 2013
    Publication date: April 24, 2014
    Inventors: Ran Kipper, Tommy Weiss
  • Patent number: 8696924
    Abstract: A polishing apparatus is used for polishing and planarizing a substrate such as a semiconductor wafer on which a conductive film such as a copper (Cu) layer or a tungsten (W) layer is formed. The polishing apparatus includes a polishing table having a polishing surface, a motor for rotating the polishing table, a top ring for holding a substrate and pressing the substrate against the polishing surface, a film thickness measuring sensor disposed in the polishing table for scanning a surface of the substrate, and a computing device for processing signals of the film thickness measuring sensor to compute a film thickness of the substrate.
    Type: Grant
    Filed: April 4, 2007
    Date of Patent: April 15, 2014
    Assignees: Ebara Corporation, Kabushiki Kaisha Toshiba
    Inventors: Mitsuo Tada, Taro Takahashi, Motohiro Niijima, Shinro Ohta, Atsushi Shigeta
  • Patent number: 8697217
    Abstract: The polishing pad is useful for polishing at least one of magnetic, optical and semiconductor substrates. The polishing pad includes a polishing layer having a polyurethane window. The polyurethane window has a cross-linked structure formed with an aliphatic or cycloaliphatic isocyanate and a polyol in a prepolymer mixture. The prepolymer mixture is reacted with a chain extender having OH or NH2 groups and having an OH or NH2 to unreacted NCO stoichiometry less than 95%. The polyurethane window has a time dependent strain less than or equal to 0.02% when measured with a constant axial tensile load of 1 kPa at a constant temperature of 60° C. at 140 minutes, a Shore D hardness of 45 to 90 and an optical double pass transmission of at least 15% at a wavelength of 400 nm for a sample thickness of 1.3 mm.
    Type: Grant
    Filed: January 15, 2010
    Date of Patent: April 15, 2014
    Assignee: Rohm and Haas Electronics Materials CMP Holdings, Inc.
    Inventors: Adam Loyack, Alan Nakatani, Mary Jo Kulp, David G. Kelly
  • Patent number: 8687197
    Abstract: A method of monitoring progress of polishing of a substrate having at least two regions including a first region and a second region with different structures is provided. The method includes: applying light to plural measurement points on the substrate during polishing of the substrate; receiving reflected light from each measurement point; measuring intensity of the reflected light; producing a spectrum of the reflected light from the intensity; classifying the spectrum as spectrum of the reflected light from the first region or as spectrum of the reflected light from the second region based on a shape of the spectrum or the intensity of the reflected light; and monitoring progress of polishing of the substrate based on a temporal change in the spectrum of the reflected light from the first region.
    Type: Grant
    Filed: July 15, 2011
    Date of Patent: April 1, 2014
    Assignee: Ebara Corporation
    Inventor: Toshifumi Kimba
  • Publication number: 20140087628
    Abstract: The described embodiment relates generally to the development of a finishing process for a device housing. The device housing can be formed of a thermoplastic, or a metal such as aluminum or stainless steel. A method and an apparatus are described for accurately measuring the amount of material removed during a finishing process. More particularly embodiments described within this application disclose a method of accurately measuring material removal during a finishing process across a curved or spline shaped surface by drilling an array of pockets along a surface of the device housing, where the drilled pockets can be used to measure material removal rates with a high degree of accuracy.
    Type: Application
    Filed: September 26, 2012
    Publication date: March 27, 2014
    Applicant: Apple Inc.
    Inventor: Shravan BHARADWAJ
  • Publication number: 20140080232
    Abstract: A polishing system receives one or more target parameters for a selected peak in a spectrum of light, polishes a substrate, measures a current spectrum of light reflected from the substrate while the substrate is being polished, identifies the selected peak in the current spectrum, measures one or more current parameters of the selected peak in the current spectrum, compares the current parameters of the selected peak to the target parameters, and ceases to polish the substrate when the current parameters and the target parameters have a pre defined relationship.
    Type: Application
    Filed: November 25, 2013
    Publication date: March 20, 2014
    Applicant: Applied Materials, Inc.
    Inventors: Dominic J. Benvegnu, Boguslaw A. Swedek, David J. Lischka
  • Publication number: 20140065928
    Abstract: An edge grinding apparatus and method for grinding a glass substrate, with which a glass substrate can be ground by a fixed amount and the occurrence of defects can be minimized. The edge grinding apparatus includes an edge grinding unit which grinds a cut edge of a glass substrate while following the cut edge; a measuring unit which obtains positional information of the cut edge; and a control unit which receives the positional information of the cut edge from the measuring unit and controls a position of the edge grinding unit based on the positional information of the cut edge.
    Type: Application
    Filed: October 9, 2012
    Publication date: March 6, 2014
    Applicant: Samsung Corning Precision Materials, Co., Ltd.
    Inventors: Young Chae Ko, Se-Yeon Kim, Yeonhoon Kim, Jun-Seok Kim
  • Patent number: 8662957
    Abstract: In one aspect, a polishing pad includes a homogeneous unitary polishing layer having a polishing surface, an opposed bottom surface, a recess in the polishing surface extending partially but not entirely through the polishing layer, and a solid light-transmissive window is secured in the recess. In another aspect, a polishing pad includes a polishing layer having a polishing surface, and the polishing surface includes a first region having a first plurality of grooves with a first depth extending partially but not entirely through the polishing layer and a second region surrounded by the first region and having a second plurality of grooves with a second depth extending partially but not entirely through the polishing layer, the second depth greater than the first depth.
    Type: Grant
    Filed: June 28, 2010
    Date of Patent: March 4, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Young J. Paik, Christopher R. Mahon, Ashish Bhatnagar, Kadthala Ramaya Narendrnath
  • Patent number: 8657645
    Abstract: A method and apparatus for measuring the polishability of a solid material such as a dental restorative material includes using a series of apparatus to perform the steps of forming the material into a desired specimen with a generally planar surface, conditioning the surface by abrasion, measuring the abraded surface with a profile determination device, optionally measuring the amount of material abraded from the surface and the gloss of the abraded surface, polishing a portion of the abraded surface with a polishing device at a controlled load for a pre-determined time and measuring the roughness and/or gloss of the polished surface followed by comparison thereof to the corresponding measurements of the unpolished, conditioned portion of the specimen surface. Polishing materials and devices may also be tested using the apparatus and method for polishing a standardized material.
    Type: Grant
    Filed: March 4, 2013
    Date of Patent: February 25, 2014
    Assignee: American Dental Association
    Inventors: Nikola Njegovan, Spiro Megremis, Olga Sirovskaya, Hank Shepelak
  • Patent number: 8657646
    Abstract: A method of polishing includes polishing a substrate, making a sequence of measurements of light reflected from the substrate while the substrate is being polished, at least some of the measurements of the sequence of measurements differing due to material being removed during polishing, for each measurement in the sequence, determining a first value of a first characteristic and a second value of a different second characteristic of the light to generate a sequence of first values and second values, storing a predetermined path in a coordinate space of the first characteristic and the second characteristic, for each measurement in the sequence, determining a position on the path based on the first value and the second value, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the position on the path.
    Type: Grant
    Filed: May 9, 2011
    Date of Patent: February 25, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Dominic J. Benvegnu, Boguslaw A. Swedek
  • Patent number: 8647170
    Abstract: There are three flat-surfaced rotary workpiece abrasive lapping spindles that are spaced apart from each other in a circle and are attached to the flat surface of a granite lapping machine base. Flat-surfaced workpieces are attached to the flat rotary surfaces of the workpiece spindles. Flexible abrasive disks are attached to the annular abrading surface of a rotary platen that is positioned to be concentric with the three spaced workpiece spindles. The platen is moved where the disk abrasive surface contacts the workpieces that are attached to the workpiece spindles. Both the platen and the workpieces spindles are rotated at high speeds to flat lap the exposed surfaces of the workpieces. Laser alignment devices are attached to an alignment rotary spindle that is positioned at the center of the workpiece spindle circle. These laser alignment distance sensors are used to co-planar align the top flat surfaces of the workpiece spindles.
    Type: Grant
    Filed: January 17, 2012
    Date of Patent: February 11, 2014
    Inventor: Wayne O. Duescher
  • Patent number: 8641476
    Abstract: There are three flat-surfaced rotary workpiece abrasive lapping spindles that are spaced apart from each other in a circle and are attached to the flat surface of a granite lapping machine base. Flat-surfaced workpieces are attached to the flat rotary surfaces of the workpiece spindles. Flexible abrasive disks are attached to the annular abrading surface of a rotary platen that is positioned to be concentric with the three spaced workpiece spindles. The platen is moved where the disk abrasive surface contacts the workpieces that are attached to the workpiece spindles. Both the platen and the workpieces spindles are rotated at high speeds to flat lap the exposed surfaces of the workpieces. A laser alignment device having laser distance sensors is attached to one of the rotary workpiece spindles. These laser alignment distance sensors are used to co-planar align the top flat surfaces of all of the workpiece spindles.
    Type: Grant
    Filed: February 9, 2012
    Date of Patent: February 4, 2014
    Inventor: Wayne O. Duescher
  • Publication number: 20140024294
    Abstract: Method and apparatus for detecting an accurate polishing endpoint of a substrate based on a change in polishing rate are provided. The method includes: applying a light to the surface of the substrate and receiving a reflected light from the substrate; obtaining a plurality of spectral profiles at predetermined time intervals, each spectral profile indicating reflection intensity at each wavelength of the reflected light; selecting at least one pair of spectral profiles, including a latest spectral profile, from the plurality of spectral profiles obtained; calculating a difference in the reflection intensity at a predetermined wavelength between the spectral profiles selected; determining an amount of change in the reflection intensity from the difference; and determining a polishing endpoint based on the amount of change.
    Type: Application
    Filed: September 25, 2013
    Publication date: January 23, 2014
    Applicants: KABUSHIKI KAISHA TOSHIBA, EBARA CORPORATION
    Inventors: Shinrou OHTA, Atsushi SHIGETA
  • Publication number: 20140024291
    Abstract: A method of controlling a polishing operation includes polishing a substrate, during polishing obtaining a sequence over time of measured spectra from the substrate with an in-situ optical monitoring system, for each measured spectrum from the sequence of measured spectra determining a difference between the measured spectrum and an immediate previous spectrum from the sequence, accumulating the difference for each measured spectrum to generate a total difference, comparing the total difference to a threshold, and detecting a polishing endpoint based on the comparison of the total difference to the threshold.
    Type: Application
    Filed: July 18, 2012
    Publication date: January 23, 2014
    Inventors: Jimin Zhang, Harry Q. Lee, Zhihong Wang, Wen-Chiang Tu
  • Patent number: 8628384
    Abstract: Polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: January 14, 2014
    Assignee: NexPlanar Corporation
    Inventors: William C. Allison, Diane Scott, Ping Huang, Richard Frentzel, Alexander William Simpson
  • Publication number: 20130337723
    Abstract: In a polishing method of the present invention, the temperature of a carrier plate is measured, and the amount of polishing removal of a workpiece (workpiece) is accurately controlled based on change in the measured temperature of the carrier plate.
    Type: Application
    Filed: October 19, 2011
    Publication date: December 19, 2013
    Applicant: Sumco Corporation
    Inventors: Ryuichi Tanimoto, Shinichi Ogata, Keiichi Takanashi
  • Patent number: 8602840
    Abstract: The invention relates to a grinding machine for grinding workpieces, in particular for the simultaneous grinding of two workpieces which are arranged in a tightly adjacent manner. The grinding machine comprises at least two first grinding spindles and at least two second grinding spindles which in each case have a grinding disk receptacle and are mounted pivotably via a support on the spindle block of one of the first grinding spindles, with the result that they can be pivoted about the rotational axis of the respective first grinding spindle.
    Type: Grant
    Filed: April 20, 2012
    Date of Patent: December 10, 2013
    Assignee: Schaudt Mikrosa GmbH
    Inventor: Berthold Stroppel
  • Patent number: 8597073
    Abstract: A method and a device for machining the leading edge of a turbine engine blade by a machining center for which parameters are set is disclosed. The method includes: acquiring a 3D profile of the leading edge of the blade; calculating at least one characteristic of the leading edge from the 3D profile; comparing the value of the calculated characteristic with a known theoretical value of the characteristic to obtain an elementary difference for the characteristic; calculating at least one undulation of the leading edge between at least two consecutive elementary sections from the 3D profile; optimizing the elementary differences obtained as a function of the undulation; setting the parameters of the machining center as a function of the optimized elementary differences for the elementary sections to define machining passes over the leading edge; and machining the leading edge of the blade with the machining center with parameters set.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: December 3, 2013
    Assignee: SNECMA
    Inventors: Gerard Derrien, Claude Leonetti
  • Patent number: 8597074
    Abstract: Methods and systems for imaging and cutting semiconductor wafers and other microelectronic device substrates are disclosed herein. In one embodiment, a system for singulating microelectronic devices from a substrate includes an X-ray imaging system having an X-ray source spaced apart from an X-ray detector. The X-ray source can emit a beam of X-rays through the substrate and onto the X-ray detector, and X-ray detector can generate an X-ray image of at least a portion of the substrate. A method in accordance with another embodiment includes detecting spacing information for irregularly spaced dies of a semiconductor workpiece. The method can further include automatically controlling a process for singulating the dies of the semiconductor workpiece, based at least in part on the spacing information. For example, individual dies can be singulated from a workpiece via non-straight line cuts and/or multiple cutter passes.
    Type: Grant
    Filed: November 3, 2011
    Date of Patent: December 3, 2013
    Assignee: Micron Technology, Inc.
    Inventors: Warren M. Farnworth, Tom A. Muntifering, Paul J. Clawson
  • Patent number: 8585460
    Abstract: A method of polishing end point detection includes polishing a surface of a substrate; applying light to the surface of the substrate and receiving reflected light from the substrate during the polishing of the substrate; measuring reflection intensities of the reflected light at respective wavelengths; creating a spectral profile indicating a relationship between reflection intensity and wavelength from the reflection intensities measured; extracting at least one extremal point indicating extremum of the reflection intensities from the spectral profile; during polishing of the substrate, repeating the creating of the spectral profile and the extracting of the at least one extremal point to obtain plural spectral profiles and plural extremal points; and detecting the polishing end point based on an amount of relative change in the extremal point between the plural spectral profiles.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: November 19, 2013
    Assignee: Ebara Corporation
    Inventors: Yoichi Kobayashi, Shinrou Ohta, Toshifumi Kimba, Masaki Kinoshita
  • Patent number: 8582122
    Abstract: A method accurately monitors the progress of polishing and accurately detects the polishing end point. The method includes directing light to the substrate during polishing of the substrate, receiving reflected light from the substrate, measuring an intensity of the reflected light at each wavelength, and producing a spectrum indicating a relationship between intensity and wavelength from measured values of the intensity. The method also includes calculating an amount of change in the spectrum per predetermined time, integrating the amount of change in the spectrum with respect to polishing time to obtain an amount of cumulative change in the spectrum, and monitoring the progress of polishing of the substrate based on the amount of cumulative change in the spectrum.
    Type: Grant
    Filed: February 25, 2011
    Date of Patent: November 12, 2013
    Assignee: Ebara Corporation
    Inventor: Yoichi Kobayashi
  • Patent number: 8579675
    Abstract: A method includes polishing a substrate on a first platen using a first set of parameters, obtaining a plurality of measured spectra from at least two zones, comparing the plurality of measured spectra with a reference spectrum to evaluate the thickness of each of the at least two zones of the substrate, comparing a thickness of a first zone with a thickness of a second zone, determining whether the thickness of the first zone falls within a predetermined range of the thickness of the second zone, and if the thickness does not fall within the predetermined range, at least one of a) adjusting at least one parameter of the first set and polishing a second substrate on the first platen using the adjusted parameters, or b) adjusting at least one parameter of a second set and polishing the substrate on a second platen using the adjusted parameters.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: November 12, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Jeffrey Drue David, Harry Q. Lee, Boguslaw A. Swedek, Dominic J. Benvegnu, Zhize Zhu, Wen-Chiang Tu
  • Patent number: 8568199
    Abstract: Method and apparatus for detecting an accurate polishing endpoint of a substrate based on a change in polishing rate are provided. The method includes: applying a light to the surface of the substrate and receiving a reflected light from the substrate; obtaining a plurality of spectral profiles at predetermined time intervals, each spectral profile indicating reflection intensity at each wavelength of the reflected light; selecting at least one pair of spectral profiles, including a latest spectral profile, from the plurality of spectral profiles obtained; calculating a difference in the reflection intensity at a predetermined wavelength between the spectral profiles selected; determining an amount of change in the reflection intensity from the difference; and determining a polishing endpoint based on the amount of change.
    Type: Grant
    Filed: October 5, 2010
    Date of Patent: October 29, 2013
    Assignees: Ebara Corporation, Kabushiki Kaisha Toshiba
    Inventors: Shinrou Ohta, Atsushi Shigeta
  • Patent number: 8562389
    Abstract: A polishing pad is described that has a polishing layer with a polishing surface, an adhesive layer on a side of the polishing layer opposite the polishing layer, and a solid light-transmitting window extending through and molded to the polishing layer. The window has a top surface coplanar with the polishing surface and a bottom surface coplanar with a lower surface of the adhesive layer. A method of making a polishing pad includes forming an aperture through a polishing layer and an adhesive layer, securing a backing piece to the adhesive layer on a side opposite a polishing surface of the polishing layer, dispensing a liquid polymer into the aperture, and curing the liquid polymer to form a window.
    Type: Grant
    Filed: May 30, 2008
    Date of Patent: October 22, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Dominic J. Benvegnu, Jimin Zhang, Thomas H. Osterheld, Boguslaw A. Swedek
  • Publication number: 20130273814
    Abstract: A polishing apparatus polishes a substrate having a film formed thereon. A sensor is disposed in a polishing table that supports a polishing pad thereon. The polishing apparatus is configured to perform an idling process in which polishing of the substrate on the polishing pad does not progress substantially, while rotating the polishing table and the substrate. The sensor obtains the film thickness data, which varies in accordance with a thickness of the film, while the idling process is performed. A processor calculates, from the film thickness data, a polishing index value indicating the progress of polishing of the film.
    Type: Application
    Filed: April 16, 2013
    Publication date: October 17, 2013
    Applicant: Ebara Corporation
    Inventors: Yoichi Kobayashi, Katsutoshi Ono
  • Publication number: 20130273813
    Abstract: The invention provides a polishing pad that contains at least one light-transmitting region and optionally a polishing pad body. The light-transmitting region is composed of a material comprising (a) a polymeric resin and (b) at least one light-absorbing compound, and the light-transmitting region has a total light transmittance of about 25% or more at one or more wavelengths in a range of 250 nm to 395 nm.
    Type: Application
    Filed: April 11, 2012
    Publication date: October 17, 2013
    Applicant: CABOT MICROELECTRONICS CORPORATION
    Inventor: Abaneshwar Prasad
  • Patent number: 8556679
    Abstract: A polishing pad assembly for a chemical mechanical polishing apparatus includes a polishing pad having a polishing surface and a surface opposite the polishing surface for attachment to a platen, and a solid light-transmissive window formed in the polishing pad. The light-transmissive window is more transmissive to light than the polishing pad. The light-transmissive window has a light-diffusing bottom surface.
    Type: Grant
    Filed: January 6, 2012
    Date of Patent: October 15, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Manoocher Birang, Grigory Pyatigorsky
  • Patent number: RE45075
    Abstract: The profile grinding machine includes: a base; a work unit disposed on one side on the base and including a work table for gripping a work; and a stone unit disposed on the other side on the base and including a stone rotating mechanism for holding and rotating a grinding stone on its axis. The work unit includes first to third moving device for supporting and moving the work table in an X-direction and a Y-direction perpendicular to each other in a horizontal plane, and in a Z-direction normal to the horizontal plane, respectively. The stone unit includes turning mechanism for turning the grinding stone about a vertical axis substantially coinciding with the leading end portion of the grinding stone.
    Type: Grant
    Filed: October 23, 2012
    Date of Patent: August 12, 2014
    Assignee: Mitsui High-Tec, Inc.
    Inventors: Tadao Hirose, Hiroshi Iwakiri, Akikazu Higuchi, Atsushi Nagata