Abstract: A new class of polymeric or polymerizable aromatic-aliphatic ketones, the preferred of which are: 2-hydroxy-2-methyl(4-vinylpropiophenone), 2-hydroxy-2-methyl-p(1-methylvinyl)propiophenone, p-vinylbenzoylcyclohexanol, p-(1-methylvinyl)benzoyl-cyclohexanol and their oligomerization and polymerization products, they being suitable for use as photoinitiators for the photopolymerization of ethylenically unsaturated monomers and prepolymers.Said ketones are produced by subjecting an aromatic substrate, preferably a monomer or oligomer of styrene type, to the following reaction cycle: polymerization - acylation - alphachlorination - nucleophilic substitution with the formation of epoxyether - hydrolysis of the epoxyether; or to other reactions as modifications or alternatives to this cycle.The ketones according to the present invention have high efficiency as photoinitiators both with regard to the useful concentration to be used and with regard to the polymerization rate.

Abstract: Radiation curable copolymers useful in coating compositions are prepared by reacting part of the glycidyl groups of a glycidyl acrylate copolymer with acrylic or methacrylic acid followed by esterifying the remaining glycidyl groups with phosphoric acid.

Abstract: A coating composition is provided. The coating composition is a curable blend of ethylenically unsaturated polyester and ethylenically unsaturated thermoplastic polymers. The composition is capable of providing a thermoplastic, soluble, sandable, intermediate-stage coating and, when cured, a final stage coating which is unaffected by acetone placed on the final stage coating for two hours at 22.degree. C., has a percent haze value of 15% or less, and is unaffected when subjected to a Wet Print Test.

Abstract: Disclosed is an ungelled radiation curable resin which is a reaction product of (a) a polyfunctional hydroxyl-containing carboxylic acid having a molecular weight less than or equal to 1,000 and having a total functionality of equal to or greater than 3; (b) an organic hydroxyl-functional compound; and (c) an alpha, beta-ethylenically unsaturated carboxylic acid. Also disclosed is a radiation curable composition containing the radiation curable resin in combination with a polymer having a glass transition temperature equal to or higher than minus 17 degrees Celsius selected from an acrylic polymer and a polyester polymer.The radiation curable resins are particularly useful for coatings over non-metallic substrates such as ABS plastics, etc., having an adherent, thin film of metal deposited by vacuum metallizing, sputtering, electroless deposition, electroplating, and the like.

Abstract: A photopolymerizable resin composition is described which comprises, (a) 40 to 85 wt. %, based on the composition, of a thermoplastic polymer binder, (b) 15 to 60 wt. %, based on the composition, of a cross-linkable monomer having at least one ethylenically unsaturation, (c) 0.5 to 10 wt. %, based on the total of the binder (a) and the monomer (b), of a photopolymerization initiator, and (d) 0.005 to 1 wt. %, based on the total of the binder (a) and the monomer (b), of a tetrazole compound of the formula: ##STR1## wherein R.sub.1 is H, halogen, methyl, ethyl, phenyl, carboxyl, amino, dimethylamino, diethylamino, methoxy, ethoxy, mercapto or sulfonic acid; and R.sub.2 is H, methyl, ethyl, phenyl, amino or mercapto. The photopolymerization resin composition exhibits an enhanced adhesion to a metal surface, and is useful as a photoresist for fabrication of a printed circuit board.

Abstract: Printed circuit boards having a plurality of circuit layers are produced on a copper-clad substrate by first forming a pattern in a desired configuration to produce the first layer of the printed circuit board, then covering it with an energy-sensitive material comprising a rubber modified epoxy resin, an acrylated epoxy resin and a viscosity modifier; the energy-sensitive material is delineated in a desired pattern and developed to uncover portions of the underlying metallization pattern and the entire substrate is then blanket cured to produce a rigid layer having openings in appropriate places; the openings are metallized and a second copper pattern is produced on the cured polymer by conventional metallization and lithographic techniques. If desired, the process is repeated until a suitable number of copper patterned levels are obtained.