Abstract: This invention relates to a method for storing a naphthol aralkyl type cyanate ester resin solution, which is difficult to precipitate due to long term storage in a solution state, and particularly relates to a method for storing a naphthol aralkyl type cyanate ester resin solution (AB), which comprises: preparing (i) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a naphthol aralkyl type cyanate ester resin (A), a maleimide compound (B) and a solvent, (ii) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a prepolymer of a naphthol aralkyl type cyanate ester resin (A), a maleimide compound (B) and a solvent, or (iii) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a prepolymer of a naphthol aralkyl type cyanate ester resin (A) and a maleimide compound (B), and a solvent, and; storing the resin solution (AB).

Abstract: There is provided a polyester-based primer composition including 100 parts by weight of a polyester resin, 1 to 20 parts by weight of water-dispersible particles, and water as a remainder. Since a polyester-based primer composition of the present disclosure is excellent in water resistance and solvent resistance differently from a urethane primer composition, the polyester-based primer composition may obtain sufficient adhesive strength between a protection film and a functional coating layer even without assistance from additives such as a cross-linking agent, and may retain stable adhesive strength for a long period of time.

Abstract: The present invention provides a structural adhesive sheet specifically for use in a mirror base of an automobile interior rear-view mirror and a method for producing the same, said structural adhesive sheet comprises in parts by weight of 20-100 parts of a nitrile-butadiene rubber, 10-70 parts of a partially cured polysulfide adhesive, 5-40 parts of a bisphenol A type epoxy resin, 0.1-2.5 parts of a crosslinking agent, 0.2-2.5 parts of a softening agent, 3-20 parts of a curing agent, 1-10 parts of an accelerator, 20-100 parts of an inorganic filler, and 0.1-3.0 parts of a silane coupling agent. The structural adhesive sheet of the present invention is obtained by subjecting the above-mentioned components to a compounding process and an extrusion film forming process. The advantages of said structural adhesive sheet include good film-forming property, and simple curing process, while having high structural strength, good toughness, and excellent heat-resistance and cold-resistance after cured.

Abstract: Compositions including a blend of a) a polysulfone (PSU); b) a polyphenylene sulfide (PPS); and, c) a polyetherimide and epoxy. The polyetherimide and epoxy can be present in an amount effective to act as a compatibilizer for the polysulfone (PSU) and polyphenylene sulfide (PPS). Various embodiments relate to a method of compatibilizing a blend of polysulfone (PSU) and polyphenylene sulfide (PPS). The method can include a) melt mixing a polysulfone (PSU) and a polyetherimide; and b) melt mixing a polyphenylene sulfide (PPS) and an epoxy. Step a) and b) can be carried out by one of sequential mixing and simultaneous mixing.

Abstract: The present invention is directed to a resin composition, comprising a blend of: (1) an epoxy polysiloxane resin; (2) an epoxyfluorosilicone resin; and (3) a fluorinated (or non-fluorinated) silane-modified polyacrylic resin. Further, the present invention is directed to a coating composition comprising the above resin blend composition and a curing agent. Further, the invention is directed to coating composition comprising an epoxy polysiloxane resin and a fluorinated (or non-fluorinated) silane-modified polyacrylic resin.

Abstract: A copier/printer exterior part uses a halogen-free flame-retardant resin composition. The halogen-free flame-retardant resin composition includes 5 wt % to 50 wt % of unused polycarbonate, 20 wt % to 63 wt % of recycled polycarbonate 5 wt % to 35 wt % of recycled polyethylene terephthalate, 0.2 wt % to 2 wt % of a styrene-acrylonitrile-glycidyl methacrylate terpolymer, 5 wt % to 15 wt % of a toughener, 10 wt % to 20 wt % of a flame retardant, 0.1 wt % to 0.8 wt % of a flame-retardant antidrip agent, 0.1 wt % to 1 wt % of an antioxidant, and 0.1 wt % to 2 wt % of a lubricant. The styrene-acrylonitrile-glycidyl methacrylate terpolymer includes 1 wt % to 5 wt % of glycidyl methacrylate and 20 wt % to 33 wt % of acrylonitrile.

Abstract: It is aimed to enhance adhesiveness between a resist pattern formed on a resist underlayer film and to reduce an undercut of the resist pattern. An additive for a resist underlayer film-forming composition, including: a polymer having a structural unit of Formula (1): (where R1 is a hydrogen atom or a methyl group; L is a divalent linking group; X is an acyloxy group having an amino group protected with a tert-butoxycarbonyl group or a nitrogen heterocycle protected with a tert-butoxycarbonyl group).

Abstract: Curable compositions containing thiol-terminated polythioethers and encapsulated polyepoxy curing agents are disclosed. The compositions exhibit extended pot life.

Abstract: A dual curable composition is provided, comprising a compound represented by formula (I): (acrylate)a-(A)-(silane)b??(I) in which a and b are identical or different and are each represented by an integer greater than or equal to 1; and wherein the dual curable composition is radiation curable and/or moisture curable. The moiety A comprises at least one of an aliphatic hydrocarbon, a cycloaliphatic hydrocarbon, an aryl moiety, an ether, an ester, an amide, a urethane, a urea, a hydroxyl group-containing organic moiety, an acrylic oligomer, an epoxy oligomer, a urethane oligomer, a polyester oligomer, or mixtures thereof, and the dual curable composition has a molecular weight greater than or equal to 300.

Abstract: The disclosure relates to curable polyepoxysilane compounds and compositions, methods related to curing of such compounds via hydrolysis and/or condensation to form coatings on a substrate, and coated articles formed from the curable polyepoxysilane compounds. The polyepoxysilane compounds are silane-functional precursors and can be used as coatings (or pretreatments) on various substrates (e.g., metals such as aluminum) and provide a substantial improvement in corrosion resistance relative to other anti-corrosion coatings. The silane-functional precursors can be prepared by reaction of functional silanes (e.g., amino-functional silanes or other epoxide-reactive functionalized silanes) with epoxide-containing organic or hydrocarbon compounds and oligomers/polymers thereof (e.g., glycidyl-type ethers or other epoxide-/oxirane-functionalized hydrocarbon compounds), for example including hydrocarbons with one or more aromatic hydrocarbon groups (e.g., in an aromatic polyether).

Abstract: A hardcoat composition comprises (a) an epoxy silane compound, (b) a reactive silicone additive and (c) photo-acid generator. The reactive silicone additive has one of the following general structures:formula (I) or X—SiR1R2—(O—SiR1R2)n-X (Formula 2) wherein: R1, R2, and R3 are independently a C1-C6 alkyl group or aromatic group with or without substitution; X is a curable group selected from —OH, —OR, —OC(0)R, —OSiY?Y3, —CHzCHrL-SiYVY3, and —C(O)(R)3, wherein: L is a divalent linkage group; Y1, Y2, and Y3 are independently selected from a C1-C6 alkyl group, and a curable group selected from —OH, —OC(O)R, and —OR, with the proviso that at least one of Y1, Y2, and Y3 is a curable group; R is a C1-C4 alkyl group; and n is at least 2 and m is at least 1, provided that the weight average molecular weight (Mw) of the reactive silicone additive is no more than 4200.

Abstract: Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition for a printed circuit board including a liquid crystal oligomer, an epoxy resin, an amino triazine novolac hardener, and an inorganic filler; the insulating film and the prepreg each being manufactured by using the resin composition; and the multilayer printed circuit board including the insulating film or the prepreg.

Abstract: An epoxy resin composition including (A) an epoxy resin that is solid at room temperature and has a softening point of 40° C. to 110° C., (B) a curing agent that is solid at room temperature and has a softening point of not less than 40° C. to 110° C., (C) a curing accelerator, (D) an inorganic filler having a mass-average particle size of 0.05 to 5 ?m, (E) a diluent, and (F) a specific dimethyl silicone, in which at least one of the component (A) and the component (B) is silicone-modified is provided. The composition can be used in a silicon chip die attach method or to produce a semiconductor device containing a silicon chip, a substrate and a cured product of the composition, in which the silicon chip is bonded to the substrate via the cured product.

Abstract: A pattern is formed by coating a chemically amplified resist composition comprising a resin having a dissolution rate in an organic solvent developer that lowers under the action of acid onto a processable substrate, prebaking, exposing the resist film, PEB, developing in an organic solvent developer to form a negative pattern, coating a solution comprising Si, Ti, Zr, Hf or Al, prebaking, and dry etching to effect image reversal for converting the negative pattern into a positive pattern.

Abstract: Disclosed is the use of a curable composition for padding-free encapsulation of instrument transformers comprising (a) a cycloaliphatic epoxy resin, (b) a polyoxyalkylene diglycidylether (c) an OH-terminated polysiloxane, (d) a cyclic polysiloxane and (e) a non-ionic, fluoroaliphatic surface-active reagent, (f) a filler, (g) a hardener selected from anhydrides, (h) a curing accelerator selected from accelerators for anhydride curing of epoxy resins.

Abstract: Blends of a polyphenylene sulfone (PPSU); a polyphenylene sulfide (PPS); and, a polyetherimide and epoxy. The polyetherimide and epoxy are present in an amount effective to act as a compatibilizer for the polyphenylene sulfone (PPSU) and polyphenylene sulfide (PPS). Methods of compatibilizing a blend of polyphenylene sulfone (PPSU) and polyphenylene sulfide (PPS). The method can include melt mixing a polyphenylene sulfone (PPSU) and a polyetherimide; and melt mixing a polyphenylene sulfide (PPS) and an epoxy.

Abstract: A curable liquid formulation comprising: (i) one or more near-infrared absorbing polymethine dyes; (ii) one or more crosslinkable polymers; and (iii) one or more casting solvents. The invention is also directed to solid near-infrared absorbing films composed of crosslinked forms of the curable liquid formulation. The invention is also directed to a microelectronic substrate containing a coating of the solid near-infrared absorbing film as well as a method for patterning a photoresist layer coated on a microelectronic substrate in the case where the near-infrared absorbing film is between the microelectronic substrate and a photoresist film.

Abstract: The invention relates to a high solids tint paste that is preferably substantially free of solvents that are volatile organic compounds. Preferably the universal tint paste is 100% solids and substantially free of any solvents. The universal tint paste is formed using a functional silicone resin intermediate that is end-capped with an alcohol, catalyzed to form a silicone resin product and combined with one or more desired pigments. The universal tint paste preferably can be used in a wide variety of solvent-borne and high solids coatings.

Abstract: This invention relates to a resin composition with enhanced heat-releasing properties, including a liquid crystal oligomer, an epoxy resin, or a resin mixture thereof, and graphene oxide as a filler, and to a heat-releasing film for an electronic device, an insulating film for a printed circuit board, and a prepreg, which are manufactured using the resin composition.

Abstract: A liquid binder composition for binding fibrous materials in the fabrication of resin-infusible preform is disclosed. The binder composition is an aqueous dispersion containing (a) one or more multifunctional epoxy resins, (b) at least one thermoplastic polymer, (c) one or more surfactants selected from anionic surfactants, nonionic surfactants, and combinations thereof, (d) water, and is essentially free of organic solvents. Also disclosed is an emulsification process for producing the liquid binder composition.

Abstract: Pre-impregnated composite material (prepreg) is provided that can be cured/molded to form composite parts having high damage tolerance and interlaminar fracture toughness. The matrix resin includes a thermoplastic particle component that includes a mixture of polyamide 12 particles and polyamide 11 particles.

Abstract: A halogen-free resin composition and a method for preparation of copper clad laminate with the same, wherein based on total parts by weight of solid components, the halogen-free resin composition comprises a reactive allyl phenoxy cyclotriphosphazene or vinyl phenoxy cyclotriphosphazene of 5-50 parts, a thermosetting resin of 15-85 parts, a crosslinking curing agent of 1-35 parts, a crosslinking curing accelerant of 0-5 parts and a filler of 0-100 parts. In the present invention, the reactive allyl phenoxy cyclotriphosphazene or vinyl phenoxy cyclotriphosphazene having very low water absorption is introduced into the thermosetting resin, satisfying both the halogen-free and antiflaming requirements and improving the electrical properties of the system, and making it possible to prepare the halogen-free high-frequency high-speed substrate material.

Abstract: Disclosed herein is a resin composition for a printed circuit board, including: a liquid crystalline oligomer; an epoxy resin; and an inorganic filler which is a reaction product of silica, silane having a vinyl group and an alkoxy group, and vinyl or hydroxyl terminated silicone oil. The resin composition has a low thermal expansion coefficient, excellent heat resistance and a high glass transition temperature.

Abstract: A coating includes an organosiloxane polymer and a mesoporous silica material bonded with the organosiloxane polymer. A monomer of the organosiloxane polymer is and the surface of the mesoporous silica material includes a hydrophilic group. A method for manufacturing the coating includes the following steps. Provide an organosiloxane polymer polymerized from a plurality of organosiloxanes including a terminal functional group. Provide a mesoporous silica precursor including a surface functional group. The organosiloxane polymer and the mesoporous silica precursor are blended in a solution, so that the surface functional group reacts with the terminal functional group to form a bond, and a mesoporous silica material is formed, as well as the surface of the mesoporous silica material includes a hydrophilic group. A film including a thickness of 0.1-500 ?m is formed by the coating.

Abstract: A coating composition and a method for coating metallic substrates, such as aircraft components exposed to elevated temperatures and/or oxidative conditions. The coating composition includes an aqueous mixture having about 2 vol % to about 50 vol % organosilane, about 0.3 to about 25 vol % metal alkoxide, and about 0.1 to about 30 vol % organic complexing agent. The coating composition may be deposited on a metallic substrate and cured to form a sol-gel coating on the surface of the substrate that is adherent to the substrate, and oxidation and discoloration resistant.

Abstract: A coating composition, an anticorrosion film formed by the composition, as well as an anticorrosive article, are disclosed. The coating composition comprises 1-35% by weight of one or more fluoropolymer; 1-70% by weight of one or more epoxy resin; 5-70% by weight of one or more polyamideimide; 0-40% by weight an auxiliary binder consisting of one or more of polyethersulfone, polyphenylene sulfide, polyamide, polyimide, polyether ether ketone, polyetherimide, polyurethane, alkyd resin, polyester, or acrylic polymers; and, based on 100 parts by weight of the above components, 100-400 parts by weight of solvent.

Abstract: The present invention has a purpose of providing an epoxy composition for encapsulating an optical semiconductor element which composition provides a cured product having a low gas permeability and excellent curability in a form of a thin film together with good light transmission and crack resistance. The present invention provides a composition comprising (A) a silicone-modified epoxy compound represented by the formula (1), (B) a curing agent and (C) a polyhydric alcohol. The present invention further provides a composition comprising a composition prepared by reacting (A) the silicone-modified epoxy compound, (B) the curing agent and (C) the polyhydric alcohol and (D) a curing catalyst, and a cured product thereof.

Abstract: The invention provides a polyphenylene sulfide resin composition including: 1 to 100 parts by weight of an olefin elastomer (B); and 0.01 to 10 parts by weight of a carboxylic acid amide wax mixture (C), relative to 100 parts by weight of a polyphenylene sulfide resin (A), wherein the carboxylic acid amide wax mixture (C) is obtained by adding 0.01 to 5 parts by weight of an antioxidant to 100 parts by weight of a carboxylic acid amide wax produced by reaction of a higher aliphatic monocarboxylic acid, a polybasic acid and a diamine.

Abstract: Disclosed herein are epoxy-based compositions that include a polysiloxane flexibilizer and amino-functional alkoxysilane, which provides flexibility, hardness and gloss to such compositions and that are useful as coatings, adhesives, sealants and composites. Also disclosed are cured compositions and substrates coated with such epoxy-based compositions.

Abstract: Provided is an insert molded article provided with a resin member, which has superior heat shock resistance, flame resistance, and hydrolysis resistance, and an insert member. The insert molded article is provided with the insert member and resin member, and a polybutylene terephthalate resin composition in which a halogenated epoxy compound (B) having a specific molecular weight, an antimony oxide compound (C), and a carbodiimide compound (D) are mixed into a polybutylene terephthalate resin (A) is used for the starting material for the resin member. The specific molecular weight of component (B) is a number average molecular weight of 2,000-20,000.

Abstract: A resin composition is provided. The resin composition comprises an epoxy resin, a zinc oxide powder and a hardener, wherein the zinc oxide powder has a Mohs hardness ranging from about 4 to about 5 and a diameter ranging from about 0.1 ?m to about 50 ?m, and the amount of the zinc oxide powder is more than 0.5 parts by weight and less than 10 parts by weight per 100 parts by weight of the epoxy resin.

Abstract: Disclosed herein are an epoxy resin composition, an insulating film using the same, and a multilayer printed circuit board; more particularly, an epoxy resin composition including a liquid crystal capable of lowering the coefficient of thermal expansion, improving chemical resistance, and increasing the glass transition temperature, an insulating film or prepreg manufactured by using the epoxy resin composition, and a multilayer printed circuit board including the insulating film or prepreg.

Abstract: Disclosed are oligomeric phosphonates including oligophosphonates, random or block co-oligo(phosphonate ester)s and co-oligo(phosphonate carbonate)s produced using a condensation process terminated with hydroxyl, epoxy, vinyl, vinyl ester, isopropenyl, isocyanate groups, and the like. These materials can be used as a reactive additive to other polymers, oligomers or monomer mixtures to impart flame resistance without diminishing melt processability which is important in the fabrication of polymers for many applications.

Abstract: Disclosed herein are an insulating resin composition, an insulating film manufactured therefrom, and a multilayer printed circuit board, and more specifically, in a build-up manner of multilayer printed circuit board, an insulating epoxy resin composition including a liquid crystal oligomer or the like capable of decreasing a dissipation factor, a dielectric constant, and a coefficient of thermal expansion, an insulating film manfuactured by using the insulating epoxy resin composition, and a multilayer printed circuit board having multiple layers obtained by allowing inner circuits formed of copper (Cu) to be insulated by using the insulating film.

Abstract: The present invention relates to a siloxane hard resin including alicyclic epoxy siloxane alone or a reactive monomer, which is prepared by condensation reaction of alkoxysilanes, and has a weight average molecular weight in the range of 1000 to 4000 and a molecular weight distribution of PDI 1.05 to 1.4. A siloxane hard cured article produced by photo- or thermal polymerization has high hardness by compact crosslinking of siloxane molecules having different molecular weights.

Abstract: A compound suitable for hydroclaving is disclosed, comprising polyester, polysulfone, and an epoxy-functional styrene-acrylate oligomer. In order for successful repetitious hydroclaving to be possible, the compound must also have a polysulfone content of greater than 45 weight percent of the compound.

Abstract: The present invention relate to a halogen-free resin composition and a method for fabricating a halogen-free copper clad laminate using the same. The halogen-free resin composition comprises the following components: reactive small molecular polyphenylene oxide with a number average molecular weight of 500-3000, a polybenzoxazine resin, a phosphorus-containing epoxy resin, a composite curing agent, a curing promoter, a filler, and a benzene or ketone solvent.

Abstract: A resin composition including 10 to 90% by mass of (A) a component to be polymerized containing a compound represented by Formula (1), and 90 to 10% by mass of (B) a thermosetting resin, the (A) and (B) each being capable of undergoing a reaction to increase molecular weight by itself when heated: wherein, Ar represents an aryl; and X represents at least one selected from the group consisting of ethers, ketones, sulfides, sulfones, amides, carbonates and esters.

Abstract: The invention relates to a two-component protective coating comprising mineral pigments, epoxy-siloxane binder component, and aminic hardener. Provision is made here for this coating to consist of initially separate components A and B, where component A comprises (a1) x wt. % of inorganic pigments, where x=30 to 70, (a2) 10 to 50 wt. % of at least one epoxy-siloxane, (a3) 0 to 40 wt. % of an organic solvent and where component B comprises (b1) at least one aminic hardener and (b2) optionally at least one organic solvent.

Abstract: A undercoat agent used for performing phase separation of a layer formed on a substrate and containing a block copolymer having a plurality of blocks bonded, wherein the undercoat agent contains a resin component, the resin component is formed from a structural unit having an aromatic ring and a structural unit not having an aromatic ring, and the resin component has a group that can interact with the substrate, and also has a 3 to 7-membered, ether-containing cyclic group.

Abstract: A curable silicone resin composition is provided comprising (A) a linear organopolysiloxane having at least two aliphatic unsaturated radicals and optionally, an organopolysiloxane of branched or three-dimensional network structure, (B) an organohydrogenpolysiloxane having at least two SiH radicals and free of aliphatic unsaturation, (C) a hydrosilylation catalyst, and (D) silicone powder having an average particle size of 0.5-100 ?m. The composition is suitable for LED encapsulation.

Abstract: Epoxy-polysiloxane based coating and flooring compositions exhibiting improved flexibility, and excellent weatherability and corrosion resistance after curing are described. The epoxy-polysiloxane polymer coating composition may be prepared by combining a polysiloxane, an epoxide resin material and a cure system including a blend of compounds selected from a dialkoxy functional aminosilane, a trialkoxy functional aminosilane, and an amino functional polysiloxane resin, where the blend has an average alkoxy functionality value of 2.0 to 2.8.

Abstract: The present invention is directed to the surprising discovery that a hard, low energy epoxysilicone/organic epoxy coating can be generated that can be easily sanded, easily repaired and are chemically stable to the marine environment. The invention reveals the use of epoxy functional siloxanes that chemically bond with an organic epoxy polymer and a polyfunctional amine or amide to form block copolymer networks with the silicone distributed through the entire matrix. The coating thus generated can be applied directly over most hull substrates, anticorrosion coatings or as a repair over itself.

Abstract: A zinc electroplating bath includes zinc ions and a brightening agent. The brightening agent is a polyamine or a mixture of polyamines that include a quaternary ammonium group.

Abstract: To provide a composition for a wire coating material, which requires no electron irradiation crosslinking, and requires a filler defining a flame retardant agent as less as possible, and from which an insulated wire having a high heat resistance and a high gel fraction can be produced, and to provide an insulated wire and a wiring harness containing the composition. The composition contains (A) silane-grafted polyolefin, which is polyolefin to which a silane coupling agent is grafted, (B) undenatured polyolefin, (C) functional-group modified polyolefin modified by one or more functional groups selected from a carboxylic acid group, an acid anhydride group, an amino group, and an epoxy group, (D) a bromine flame retardant having a phthalimide structure, or a bromine flame retardant having a phthalimide structure and an antimony trioxide, (E) a crosslinking catalyst, and (F) a zinc sulfide, or a zinc oxide and an imidazole compound.

Abstract: The present invention relates to stable, zero or low VOC epoxy-containing polysiloxane oligomer compositions that provide for a high degree of chemical resistance to compositions containing organic resins, while at the same time, maintaining or improving the flexibility of these organic resin-containing compositions, to processes for preparing epoxy-containing polysiloxane oligomer compositions, and to uses in coatings, sealants, adhesives, and composites containing the same.

Abstract: An non-skid coating comprising a two-part epoxy and a filler comprising particles of a thermoset resin provides a durable, low-weight, low-abrasive coating for decks and floors, especially for aircraft carrier flight decks. The coating has the further advantage of having lower heavy metal content than current aluminum-based, non-skid coatings.

Abstract: Embodiments include copolymers obtainable by reacting styrenic compound, maleic anhydride, and a cyclo-olefin, wherein the cyclo-olefin is selected from the group consisting of dicyclopentadiene, dicyclopentadiene derivatives, norbornene, norbornene derivatives, and combinations thereof. Embodiments include curable compositions having the copolymer, an epoxy compound and a solvent.

Abstract: A resin composition which can be formed into a film for use in molding a large diameter thin film wafer is provided. The composition comprises components (A) a silicone resin containing repeating units represented by the following formulae (1-1), (1-2), and (1-3) and having a weight average molecular weight as measured by GPC in terms of polystyrene of 3,000 to 500,000, wherein r, s, and t are independently a positive integer; the silicon atom at the terminal of the units constituting the repeating units represented by the formulae (1-1), (1-2), and (1-3) is bonded to the terminal carbon atom of the X1, X2, or X3 in the same or different unit; R1 is independently a monovalent hydrocarbon group containing 1 to 8 carbon atoms; X1, X2, and X3 are independently a divalent group; (B) a thermosetting resin; and (C) a filler.

Abstract: The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.