Heavy Or Transition Metal Or Compound Thereof Patents (Class 523/442)
  • Patent number: 10287387
    Abstract: The object of the present invention is to provide an epoxy resin composition for casting having excellent heat resistance and thermal shock resistance. The epoxy resin composition for casting of the present invention contains a silica powder (A), a liquid epoxy resin (B), a polyether polyol (C), a liquid acid anhydride (D), a curing accelerator (E), and a core shell polymer (F).
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: May 14, 2019
    Assignee: KANEKA CORPORATION
    Inventor: Nobuo Miyatake
  • Patent number: 9902805
    Abstract: The present invention relates to a pre-accelerated resin composition, characterized in that the resin composition comprises an unsaturated polyester resin and/or a vinyl ester resin, a soluble copper compound and a heterocyclic aromatic amine and which resin composition is essentially free of cobalt. The present invention further relates to a two component composition in which the first component comprises such a resin composition and in which the second component comprises an organic peroxide.
    Type: Grant
    Filed: July 18, 2016
    Date of Patent: February 27, 2018
    Assignee: AKZO NOBEL CHEMICALS INTERNATIONAL B.V.
    Inventors: Johan Jansen, Ronald Ivo Kraeger
  • Patent number: 9163170
    Abstract: Disclosed is an impact resistant adhesive composition including silica and core-shell polymer particles. The impact resistant adhesive composition includes: (a) a first component including an epoxy resin and a polymeric dispersant, or an epoxy resin-polymeric dispersant prepolymer; (b) a second component including silica and core-shell polymer particles having a particle diameter of 20 to 250 nm; and (c) a third component including a curing agent and an additive mixture. The polymeric dispersant is a flexible polyether monoamine or polyether diamine which includes a mixed form of a lipophilic alkyl oxide chain and a hydrophilic ethylene oxide chain in the main chain, and has a weight average molecular weight of 500 to 4,000.
    Type: Grant
    Filed: June 12, 2013
    Date of Patent: October 20, 2015
    Assignee: EP CHEMICAL CO., LTD
    Inventors: Young-Son Choe, Woo-Jin Jung
  • Publication number: 20150069877
    Abstract: Disclosed is a resin composition for electric insulation which contains an epoxy resin; a hardening agent; and fine particles, in which the fine particles form a plurality of threadlike agglomerates and the agglomerates have a dendritic structure when the epoxy resin, the hardening agent, and the fine particles are mixed and hardened, a base material of the fine particle is formed of silicon dioxide, aluminum oxide, titanium oxide, or boron nitride, and hydrophilic groups and hydrophobic groups are present together on a surface of the base material. Thus improvement of the electric characteristics and the mechanical characteristics of the insulation material and suppression of viscosity of the resin composition are made compatible.
    Type: Application
    Filed: September 10, 2014
    Publication date: March 12, 2015
    Inventors: Takuya OTOWA, Hiroshi MORITA, Atsushi OHTAKE, Kinya KOBAYASHI, Keiji SUZUKI
  • Patent number: 8974592
    Abstract: The present invention relates to a coating composition containing metal oxide particles with a high refractive index and low photocatalytic activity and a coating film obtained by applying the coating composition onto a substrate. The coating composition contains metal oxide particles with a high refractive index obtained by coating the specific fine particles of the titanium-based oxide on their surfaces with at least a silica-based oxide or a silica-based composite oxide, and the coating film is obtained by applying the coating composition onto a substrate. The metal oxide particles with not only a high refractive index but also low photocatalytic activity, and therefore a coating film with excellent weathering resistance and light resistance can be formed on a substrate.
    Type: Grant
    Filed: August 12, 2009
    Date of Patent: March 10, 2015
    Assignee: JGC Catalysts and Chemicals, Ltd.
    Inventors: Yoichi Ishihara, Sachio Murai, Toshiharu Hirai, Michio Komatsu
  • Publication number: 20140362494
    Abstract: The present invention provides a resin composition comprising: 1 to 20 parts by weight of a reinforcing fiber; 0.2 to 5 parts by weight of an anti-settling agent; 20 to 40 parts by weight of an epoxy resin; 0.1 to 3 parts by weight of a curing agent; and 50 to 75 parts by weight of a high dielectric constant filler. The present invention further provides a dielectric layer produced from the resin composition and a capacitor comprising the dielectric layer. In the dielectric layer made from the resin composition provided by the present invention, the fibers can be evenly dispersed and can enhance the mechanical strength of the resin composition, and cooperate with the epoxy resin to bring excellent toughness. Therefore, the mechanical strength of the produced dielectric layer can be remarkably improved, and its fragility can be effectively overcome when the dielectric layer is used in the PCB double-side etching process.
    Type: Application
    Filed: December 21, 2011
    Publication date: December 11, 2014
    Inventors: Tao Cheng, Qilin Chen, Zhou Jin
  • Publication number: 20140349106
    Abstract: Improved coating formulations for cementitious composite building materials are disclosed herein. The coating formulations provide both sealer and primer functions, particularly for substrates in a high alkaline environment, such as fiber cement composite materials.
    Type: Application
    Filed: May 21, 2013
    Publication date: November 27, 2014
    Applicant: James Hardie Technology Limited
    Inventors: Yongjun Chen, Caidian Luo
  • Publication number: 20140231148
    Abstract: A composite including a dispersed phase of an inorganic material of a metal chalcogenide composition with a fullerene-like or tubular-like geometry that is present in a polymeric matrix, wherein the inorganic material of the metal chalcogenide has a molecular formula MX2, where M is a metallic element selected from the group consisting of titanium (Ti), vanadium (V), chromium (Cr), manganese (Mn), iron (Fe), cobalt (Co), nickel (Ni), copper (Cu), zinc (Zn), zirconium (Zr), niobium (Nb), molybdenum (Mo), technetium (Tc), ruthenium (Ru), rhodium (Rh), palladium (Pd), silver (Ag), cadmium (Cd), hafnium (Hf), tantalum (Ta), tungsten (W), rhenium (Re), osmium (Os), iridium (Ir), platinum (Pt), gold (Au), mercury (Hg) and combinations thereof, and X is a chalcogen element selected from the group consisting of sulfur (5), selenium (Se), tellurium (Te), oxygen (O) and combinations thereof.
    Type: Application
    Filed: February 14, 2014
    Publication date: August 21, 2014
    Applicant: NANOTECH INDUSTRIAL SOLUTIONS, INC.
    Inventors: Eugene Kverel, Ronen Kreizman, George Diloyan, Alon Shapira
  • Patent number: 8795837
    Abstract: A thermally conductive adhesive comprises a mixture of at least two types of silver particles including a second type having a surface area to mass ratio in the range of 0.59 m2/g to 2.19 m2/g and a tap density in the range of 3.2 to 6.9 g/cm3 and a first type having a surface area to mass ratio of 0.05 to 0.15 m2/g and a tap density in the range of about 4.7 to 8.2 g/cm3. According to certain embodiments of the invention the first type of silver particles includes oblong silver particles. The thermally conductive adhesive further comprises a binder, and optionally a solvent.
    Type: Grant
    Filed: August 18, 2008
    Date of Patent: August 5, 2014
    Assignee: Diemat, Inc.
    Inventors: Terence L Hartman, Stavros Anagnostopoulos, Peter Crudele
  • Patent number: 8759413
    Abstract: A process for the preparation of lanthanum containing polyacrylates for optical applications. The process consists in dispersing lanthanum oxide in acrylic acid to form a monomer mixture. An aromatic carboxylic acid is added to the monomer mixture and then a cross linking agent is added thereto. Such a monomer mixture is subjected to the step of polymerization by gamma radiation.
    Type: Grant
    Filed: March 9, 2007
    Date of Patent: June 24, 2014
    Assignee: Shriram Institute for Industrial Research
    Inventors: Rakesh Kumar Khandal, Amita Malik, Geetha Seshadri, Mukti Tyagi
  • Patent number: 8735469
    Abstract: A resin material of high strength and high voltage equipment capable of improving the reliability by using the resin material, the resin material being a hardened product including fine particles and resin ingredients, in which the fine particles have hydrophobic groups on the surface and have a particle diameter of 200 nm or less, the resin ingredients have hydrophilic groups on the side chains, and the fine particles form a plurality of linear aggregates inside the resin, thereby forming a dendritic structure.
    Type: Grant
    Filed: August 18, 2011
    Date of Patent: May 27, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Akihiro Sano, Atsushi Ohtake
  • Patent number: 8692394
    Abstract: The present invention is aimed to provide an adhesive for bonding a semiconductor which has high transparency and facilitates recognition of a pattern or position indication on the occasion of semiconductor chip bonding. The present invention is an adhesive for bonding a semiconductor containing: an epoxy resin; an inorganic filler; and a curing agent, wherein the amount of the inorganic filler in the adhesive is 30 to 70% by weight, the inorganic filler contains a filler A having an average particle size of less than 0.1 ?m and a filler B having an average particle size of not less than 0.1 ?m and less than 1 ?m, and the weight ratio of the filler A to the filler B is 1/9 to 6/4. The present invention is an adhesive for bonding a semiconductor containing: an epoxy resin; an inorganic filler; and a curing agent, wherein difference in refractive index is not more than 0.1 between the epoxy resin and the inorganic filler.
    Type: Grant
    Filed: March 18, 2010
    Date of Patent: April 8, 2014
    Assignee: Sekisui Chemical Co., Ltd.
    Inventors: Yangsoo Lee, Sayaka Wakioka, Atsushi Nakayama, Carl Alvin Dilao
  • Publication number: 20140039094
    Abstract: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a curing agent; (C) an inorganic filler including manganese oxide; and (D) a curing accelerator.
    Type: Application
    Filed: October 11, 2013
    Publication date: February 6, 2014
    Applicant: Taiwan Union Technology Corporation
    Inventor: Hsien Te CHEN
  • Publication number: 20140017501
    Abstract: There are provided a resin composition which has excellent heat resistance, exhibits high optical reflectance in an ultraviolet light region and a visible light region, undergoes less deterioration in optical reflectance when subjected to a heat treatment, and can be used suitably for an LED-mounting printed wiring board; a prepreg containing the resin composition; and a metal foil-clad laminate containing the resin composition, or the like. The resin composition of the present invention contains a fluorene-containing epoxy resin (A) having a specific structure, an acid anhydride (B) of a completely or partially hydrogenated product of an aromatic polycarboxylic acid, titanium dioxide (C), and a wet dispersing agent (D).
    Type: Application
    Filed: February 10, 2012
    Publication date: January 16, 2014
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Koji Morishita, Kaoru Koizumi, Keisuke Takada
  • Patent number: 8623941
    Abstract: A method of making a nanoparticle filled dielectric material. The method includes mixing nanoparticle precursors with a polymer material and reacting the nanoparticle precursors mixed with the polymer material to form nanoparticles dispersed within the polymer material to form a dielectric composite.
    Type: Grant
    Filed: November 10, 2010
    Date of Patent: January 7, 2014
    Assignee: UT-Battelle, LLC
    Inventors: Enis Tuncer, Georgios Polyzos
  • Patent number: 8545977
    Abstract: Polymer concrete electrical insulation including a hardened epoxy resin composition filled with an electrically non-conductive inorganic filler compositions. The polymer concrete electrical insulation system optionally may contain additives. The epoxy resin composition is based on a cycloaliphatic epoxy resin. The inorganic filler composition can be present within the range of about 76% by weight to about 86% by weight, calculated to the total weight of the polymer concrete electrical insulation system. The inorganic filler composition includes a uniform mixture of (i) an inorganic filler with an average grain size within the range of 1 micron (?m) to 100 micron (?m) [component c(i)], and (ii) an inorganic filler with an average grain size within the range of 0.1 mm (100 micron) to 2 mm [component c(ii)].
    Type: Grant
    Filed: April 8, 2010
    Date of Patent: October 1, 2013
    Assignee: ABB Research Ltd.
    Inventors: Stephen Clifford, Faustine Soyeux, Andrej Krivda, Vincent Tilliette, Nikolaus Zant, Bandeep Singh, Felix Greuter, Leopold Ritzer
  • Publication number: 20130201605
    Abstract: Technologies are generally described for a nanocomposite polymer dielectric that may incorporate two types of nanoparticles and a polymer. One of the two types of nanoparticle may be a first, smaller nanoparticle, that may occupy spaces between larger second nanoparticles. Another of the two types of nanoparticle may be the second, larger, “high-?” nanoparticle, which supports the overall dielectric constant of the material. In an applied electric field, the first, smaller nanoparticle may redistribute local charge to homogenize electric fields in the dielectric material, tending to avoid the development of “hot spots”. Such a two-nanoparticle nanocomposite dielectric material may provide increased dielectric breakdown strength and voltage endurance in comparison with a nanoparticle dielectric which only contains a single type of “high-?” nanoparticle.
    Type: Application
    Filed: March 29, 2011
    Publication date: August 8, 2013
    Applicant: Empire Technology Development, LLC.
    Inventors: Seth Adrian Miller, Gary Lynn Duerksen
  • Publication number: 20130113121
    Abstract: The present invention relates to a resin paste composition including an organic compound, and a granular aluminum powder having an average particle diameter of from 2 to 10 ?m and a flake-shaped silver powder having an average particle diameter of from 1 to 5 ?m which are uniformly dispersed in the organic compound, and a semiconductor device manufactured by bonding a semiconductor element onto a supporting member through the resin paste composition and then encapsulating the resulting bonded product. According to the present invention, it is possible to provide a resin paste composition used for bonding an element such as semiconductor chips onto a lead frame which is excellent in not only electrical conductivity and bonding property but also working efficiency without using a large amount of rare and expensive silver, and a semiconductor device having a high productivity and a high reliability.
    Type: Application
    Filed: June 10, 2011
    Publication date: May 9, 2013
    Inventors: Chiaki Okada, Kazuhiko Yamada, Yukari Inoue
  • Patent number: 8309632
    Abstract: The invention provides an epoxy nanocomposite material for dental therapy, which can be applied to direct or indirect clinical restoration, dental core-post system, and dental brace etc. The epoxy nanocomposite filling material provided by the invention can be polymerized with various curing agents to form the polymer with low shrinkage.
    Type: Grant
    Filed: February 5, 2010
    Date of Patent: November 13, 2012
    Assignee: National Taiwan University
    Inventors: Wei-Fang Su, Sheng-Hao Hsu, Yun-Yuan Tai, Min-Huey Chen
  • Publication number: 20120270968
    Abstract: A coating composition, an anticorrosion film formed by the composition, as well as an anticorrosive article, are disclosed. The coating composition comprises 1-35% by weight of one or more fluoropolymer; 1-70% by weight of one or more epoxy resin; 5-70% by weight of one or more polyamideimide; 0-40% by weight an auxiliary binder consisting of one or more of polyethersulfone, polyphenylene sulfide, polyamide, polyimide, polyether ether ketone, polyetherimide, polyurethane, alkyd resin, polyester, or acrylic polymers; and, based on 100 parts by weight of the above components, 100-400 parts by weight of solvent.
    Type: Application
    Filed: September 30, 2010
    Publication date: October 25, 2012
    Applicant: E/I Du Pont De Nemours and Company
    Inventor: Xuepe Mao
  • Publication number: 20120267803
    Abstract: The present invention is aimed to provide an adhesive for bonding a semiconductor which has high transparency and facilitates recognition of a pattern or position indication on the occasion of semiconductor chip bonding. The present invention is an adhesive for bonding a semiconductor containing: an epoxy resin; an inorganic filler; and a curing agent, wherein the amount of the inorganic filler in the adhesive is 30 to 70% by weight, the inorganic filler contains a filler A having an average particle size of less than 0.1 ?m and a filler B having an average particle size of not less than 0.1 ?m and less than 1 ?m, and the weight ratio of the filler A to the filler B is 1/9 to 6/4. The present invention is an adhesive for bonding a semiconductor containing: an epoxy resin; an inorganic filler; and a curing agent, wherein difference in refractive index is not more than 0.1 between the epoxy resin and the inorganic filler.
    Type: Application
    Filed: March 18, 2010
    Publication date: October 25, 2012
    Applicant: Sekisui Chemical Co., Ltd
    Inventors: Yangsoo Lee, Sayaka Wakioka, Atsushi Nakayama, Carl Alvin Dilao
  • Publication number: 20120208003
    Abstract: The present invention relates to materials used for building products, construction projects, structural objects, mechanical devices and other materials applications. Specifically, the present invention concerns composite materials made with reinforcing elements in a binder matrix material. A method of strengthening materials is described that uses high volumes of reinforcing elements, which can be easily dispersed and uniformly distributed, consisting of large diameter fibers, miniature rods or other similar geometric shapes with a diameter or thickness between 0.05 mm and 20 mm where the reinforcements are incorporated either as short, randomly distributed elements or long, continuous aligned arrays.
    Type: Application
    Filed: April 23, 2012
    Publication date: August 16, 2012
    Inventor: Kirby Wayne Beard
  • Patent number: 8198347
    Abstract: A high thermal-conductive, halogen-free and flame-retardant resin composition used as a dielectric layer of a printed circuit board comprises 5% to 70% of phosphorus-containing epoxy resin, at most 50% of multifunctional or bifunctional epoxy resin, 1% to 20% of curing agent, 0.01% to 10% of accelerant, at most 20% of inorganic powder, 5% to 85% of high thermal conductivity powder and 0.
    Type: Grant
    Filed: November 3, 2009
    Date of Patent: June 12, 2012
    Assignee: Nan Ya Plastics Corporation
    Inventors: Dein-Run Fung, Te-Chao Liao, Hao-Sheng Chen
  • Publication number: 20120141774
    Abstract: Disclosed are reduced density coating compositions and articles, such as aerospace vehicles, at least partially coated with an opaque coating deposited from such compositions. The reduced density coating compositions include low density microspheres comprising a core and a solid opacifying coating covering a surface of the core.
    Type: Application
    Filed: January 7, 2008
    Publication date: June 7, 2012
    Applicant: PRC-DESOTO INTERNATIONAL, INC.
    Inventors: Siamanto Abrami, Razmik Boghossian
  • Publication number: 20110284276
    Abstract: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a curing agent; (C) an inorganic filler including manganese oxide; and (D) a curing accelerator.
    Type: Application
    Filed: October 19, 2010
    Publication date: November 24, 2011
    Inventor: Hsien Te CHEN
  • Publication number: 20110257298
    Abstract: The present invention relates to a coating composition containing metal oxide particles with a high refractive index and low photocatalytic activity and a coating film obtained by applying the coating composition onto a substrate. The coating composition contains metal oxide particles with a high refractive index obtained by coating the specific fine particles of the titanium-based oxide on their surfaces with at least a silica-based oxide or a silica-based composite oxide, and the coating film is obtained by applying the coating composition onto a substrate. The metal oxide particles with not only a high refractive index but also low photocatalytic activity, and therefore a coating film with excellent weathering resistance and light resistance can be formed on a substrate.
    Type: Application
    Filed: August 12, 2009
    Publication date: October 20, 2011
    Applicant: JGC CATALYSTS AND CHEMICALS LTD.
    Inventors: Yoichi Ishihara, Sachio Murai, Toshiharu Hirai, Michio Komatsu
  • Publication number: 20110224330
    Abstract: Fiber reinforced composites fabricated using a low-temperature, solution-based growth of nanowires such as ZnO nanowires on the surface of the reinforcing fibers such as carbon fibers and functionalized aramid fibers. The composites with nanowire interphase may have an enhanced fiber/matrix interface strength and a comparable in-plane strength, as compared to similar composites without such nanowire interphase.
    Type: Application
    Filed: June 26, 2009
    Publication date: September 15, 2011
    Inventors: Henry A. Sodano, Gregory John Ehlert
  • Publication number: 20110171474
    Abstract: A composite structure includes at least one resin matrix layer having a resin material and a plurality of fiber elements and a plurality of titanium particles provided in the resin material. A method of toughening a resin matrix layer is also disclosed.
    Type: Application
    Filed: March 28, 2011
    Publication date: July 14, 2011
    Inventors: Luther M. Gammon, Steven G. Lemery
  • Publication number: 20110170196
    Abstract: The light-shielding coating contains (a) a resin, (b) a coloring material, (c) inorganic fine particles, and (d) a surfactant and/or an oil. The concentration of Component (d), the surfactant and/or the oil, is higher in the uppermost layer of the coating than in the lower layer. The content ratio of Component (d) is in the range of 10 to 40 weight % relative to the total weight of the light-shielding coating. The optical element features this light-shielding coating.
    Type: Application
    Filed: January 6, 2011
    Publication date: July 14, 2011
    Applicant: CANON KABUSHIKI KAISHA
    Inventor: Yasuhiro Tanaka
  • Publication number: 20110111234
    Abstract: A thermally conductive adhesive comprises a mixture of at least two types of silver particles including a first type having a surface area to mass ratio in the range of 0.59 m2/g to 2.19 m2/g and a tap density in the range of 3.2 to 6.9 g/cm3 and a second type having a surface area to mass ratio of 0.04 to 0.17 m2/g and a tap density in the range of about 4.7 to 8.2 g/cm3. According to certain embodiments of the invention the first type of silver particles includes oblong silver particles. The thermally conductive adhesive further comprises a binder, and optionally a solvent.
    Type: Application
    Filed: August 18, 2008
    Publication date: May 12, 2011
    Inventors: Terrence L. Hartman, Stavros Anagnostopoulos, Peter Crudele
  • Publication number: 20100311871
    Abstract: There is provided colloidal silica particles comprising at least one polyvalent metal element M selected from a group consisting of iron, aluminum, zinc, zirconium, titanium, tin, and lead in an average content of 0.001 to 0.02 in terms of an M/Si molar ratio, and having an average primary particle diameter of 5 to 40 nm, wherein the content of the polyvalent metal element M present in an outermost layer of the colloidal particles is 0 to 0.003 atom per square nanometer (nm2) of a surface area of the colloidal particles; and a silica sol that the colloidal silica particles are dispersed in an organic solvent, a silica sol that the colloidal silica particles are dispersed in a polymerizable compound, and a silica sol that the colloidal silica particles are dispersed in a dicarboxylic anhydride.
    Type: Application
    Filed: February 12, 2009
    Publication date: December 9, 2010
    Applicant: NISSAN CHEMICAL INDUSTRIES, LTD.
    Inventors: Naohiko Suemura, Keiko Yoshitake, Toshiaki Takeyama
  • Patent number: 7811668
    Abstract: Epoxy resins comprising deagglomerated barium sulphate with an average particle size of less than 0.5 ?M feature increased flexural impact strength and breaking extension. Epoxy resins of this kind can be used as, for example, composite material or binders in watercraft construction, in wind turbines, in pipes, for containers or in aircraft construction, in particular in composite materials comprising glass fibre or carbon fibre.
    Type: Grant
    Filed: December 1, 2004
    Date of Patent: October 12, 2010
    Assignee: Solvay Infra Bad Hoenningen GmbH
    Inventors: Rainer Stahl, Won Jai Park, Ferdinand Hardinghaus, Christopher David Glende, Karl Koehler
  • Publication number: 20100227951
    Abstract: Polymer concrete electrical insulation including a hardened epoxy resin composition filled with an electrically non-conductive inorganic filler compositions. The polymer concrete electrical insulation system optionally may contain additives. The epoxy resin composition is based on a cycloaliphatic epoxy resin. The inorganic filler composition can be present within the range of about 76% by weight to about 86% by weight, calculated to the total weight of the polymer concrete electrical insulation system. The inorganic filler composition includes a uniform mixture of (i) an inorganic filler with an average grain size within the range of 1 micron (?m) to 100 micron (?m) [component c(i)], and (ii) an inorganic filler with an average grain size within the range of 0.1 mm (100 micron) to 2 mm [component c(ii)].
    Type: Application
    Filed: April 8, 2010
    Publication date: September 9, 2010
    Applicant: ABB Research Ltd.
    Inventors: Stephen CLIFFORD, Faustine Soyeux, Andrej Krivda, Vincent Tilliette, Nikolaus Zant, Bandeep Singh, Felix Greuter, Leopold Ritzer
  • Publication number: 20100189940
    Abstract: The invention provides titanium-dioxide-containing composites, a method for their production and the use of these composites.
    Type: Application
    Filed: August 27, 2007
    Publication date: July 29, 2010
    Applicant: SACHTLEBEN CHEMIE GMBH
    Inventors: Sonja Grothe, Petra Fritzen, Jochen Winkler, Bernd Rohe, Birgit Bittmann, Frank Haupert, Nicole Knör
  • Patent number: 7723407
    Abstract: It is an object of the present invention to provide a resin composition which can form cured formulations having various excellent properties such as an insulating property, thermal shock resistance, moldability/formability and strength, and exhibit an excellent appearance in which transparency is enhanced, a resin composition whose cured thin film has excellent flame retardancy, good mechanical property and heat resistance, a dispersing element containing an inorganic microfine particle which can give a flame retardancy to a resin, to which the inorganic microfine particle is added, and can reduce a hygroscopic property to the extent possible, a method for producing the same and a cured formulation obtained by using the resin composition.
    Type: Grant
    Filed: August 5, 2005
    Date of Patent: May 25, 2010
    Assignee: Nippon Shokubai Co., Ltd.
    Inventors: Takuo Sugioka, Yasunori Tsujino
  • Patent number: 7632545
    Abstract: In one embodiment, a radiation shielding composition comprises lead oxide or lead composite material of predetermined particle size, and an adhesive, wherein the composition comprises free flow property.
    Type: Grant
    Filed: May 10, 2005
    Date of Patent: December 15, 2009
    Assignee: General Electric Company
    Inventors: Cariappa Achappa Baduvamanda, Bhaskar Raj
  • Patent number: 7625477
    Abstract: This invention provides an electrodeposition paint comprising particles of at least one metallic compound selected from bismuth hydroxide, zirconium compound and tungsten compound, said particles of the metallic compound having an average particle diameter of 1-1,000 nm. The electrodeposition paint forms coating film excelling in corrosion resistance, finished appearance, paint stability and so on.
    Type: Grant
    Filed: December 22, 2006
    Date of Patent: December 1, 2009
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Masahide Kawaraya, Toshimitsu Muramatsu, Yuji Hirose
  • Patent number: 7560501
    Abstract: An encapsulant composition. The encapsulant composition includes a resin material consisting of epoxy or cyanate ester resins, from about 1.0% by weight to about 5% by weight of the composition of a flexibilizing agent including a flexibilizer containing functional groups capable of reaction with the epoxy or cyanate ester resin during thermally induced curing, a filler material including substantially spherical or spheroidal particles such that each particle has a diameter less than about 41 microns, and a thermoplastic other than the flexibilizer. The thermoplastic is separated from the cured epoxy or cyanate ester resin. The thermoplastic includes a poly(arylene)ether. The flexibilizer includes bis(2,3-epoxy-2-methylpropyl)ether.
    Type: Grant
    Filed: May 29, 2008
    Date of Patent: July 14, 2009
    Assignee: International Business Machines Corporation
    Inventor: Konstantinos I. Papathomas
  • Publication number: 20090111912
    Abstract: Disclosed are low temperature, moisture curable coating compositions, related coated substrates, and methods for coating a substrate. The coating compositions include an ungelled, secondary amine-containing Michael addition reaction product of reactants including a compound comprising more than one site of ethylenic unsaturation, and an aminofunctional silane.
    Type: Application
    Filed: December 5, 2008
    Publication date: April 30, 2009
    Applicant: PPG Industries Ohio, Inc.
    Inventors: Anthony M. Chasser, Susan F. Donaldson, Terri L. Ziegler, John R. Schneider
  • Patent number: 7498374
    Abstract: Disclosed is a composite material including from about 50 wt % to about 75 wt % (based on the total weight of the composite material) of inorganic material, wherein the inorganic material includes from about 30 wt % to about 50 wt % (based on weight of the inorganic material) of a first inorganic filler having an average particle size ranging from about 0.5 mm to about 5 mm; and from about 50 wt % to about 70 wt % (based on weight of the inorganic filler) of a second inorganic filler having an average particle size ranging from 0.02 mm to about 0.1 mm; and from about 25 wt % to about 50 wt % (based on total weight of the composite material) of a thermosetting polymeric resin.
    Type: Grant
    Filed: November 15, 2006
    Date of Patent: March 3, 2009
    Inventor: Irwin Frank
  • Publication number: 20080246185
    Abstract: A lamp body is an enclosing structure that encloses a blue light-emitting crystal to form a LED structure. In a method of manufacturing frame body of the LED, resin, titanium, and fluorescent powder are mixed uniformly to constitute a composition of frame body, then the composing materials being placed into a mould for processing a thermally pressing procedure to thus form a frame body. By the blue light emitted from the blue light-emitting crystal, the fluorescent powder of the frame body may be excited to emit uniform yellow light, which may be further mixed with the blue light to become white light.
    Type: Application
    Filed: April 4, 2007
    Publication date: October 9, 2008
    Inventors: Bily Wang, Jonnie Chuang, Chia-Hung Chen
  • Patent number: 7384682
    Abstract: An encapsulant composition and an electronic package. The composition includes a resin, a flexibilizing agent, and a filler material. The electronic package includes a substrate, a semiconductor chip, and a material. The semiconductor chip is mounted on an upper surface of the substrate and electrically coupled to the substrate. The material is positioned on the upper surface of the substrate and against an edge surface of the semiconductor chip. The edge surface of the semiconductor chip is substantially perpendicular to a bottom surface of the semiconductor chip. The material is the encapsulant composition.
    Type: Grant
    Filed: September 26, 2007
    Date of Patent: June 10, 2008
    Assignee: International Business Machines Corporation
    Inventor: Konstantinos I. Papathomas
  • Patent number: 7321005
    Abstract: A method of making an encapsulant composition. The method includes: providing a first quantity of resin material of epoxy or cyanate ester resins; adding to the first quantity of resin material a second quantity of flexibilizing agent; adding to the first quantity of resin material a third quantity of filler material; blending the resin material. After adding the flexibilizing agent, adding the filler material, and blending the resin material, applying the composition to a gap between a substrate and a semiconductor chip. After applying the composition to the gap, pregelling the composition. After pregelling the composition, substantially curing the composition.
    Type: Grant
    Filed: March 19, 2007
    Date of Patent: January 22, 2008
    Assignee: International Business Machines Corporation
    Inventor: Konstantinos I. Papathomas
  • Patent number: 7192997
    Abstract: A composition for use in making an encapsulant usable in the encapsulation of a semiconductor chip assembled to a substrate with C4 solder interconnections therebetween, which in turn may form part of an electronic package. The composition comprises a resin, a flexibilizing agent and a filler material.
    Type: Grant
    Filed: February 7, 2001
    Date of Patent: March 20, 2007
    Assignee: International Business Machines Corporation
    Inventor: Konstantinos I. Papathomas
  • Patent number: 7157507
    Abstract: A photocurable silver composition is provided which comprises an ultraviolet light curable organic mixture, a photoinitiator, a silver powder, and a silver flake composition. The silver flake composition comprises at least 20% of the weight of the silver powder. The disclosed compositions may be used to produce silver-containing coatings on a variety of different substrates. Related methods are provided.
    Type: Grant
    Filed: November 24, 2003
    Date of Patent: January 2, 2007
    Assignee: Allied PhotoChemical, Inc.
    Inventor: Roy C. Krohn
  • Patent number: 7008981
    Abstract: The present invention discloses an organic-inorganic hybrid composition with a high dielectric constant, which can be used as a bonding layer having a high thermal stability and a high dielectric constant. The composition includes a) a high Tg epoxy resin system; b) ferroelectric ceramic particles having two particle size distributions, with one of them pertaining to a nano level; c) at least one macromolecular flexibilizer; d) a macromolecular dispersant; and e) additives such as a diluent, an adhesive promoter, a catalyst, and an organic solvent.
    Type: Grant
    Filed: December 23, 2003
    Date of Patent: March 7, 2006
    Assignee: Industrial Technology Reserarch Institute
    Inventors: Shur-Fen Liu, Meng-Huei Chen, Bih-Yih Chen, Yi-Kai Chang, Jinn-Shing King
  • Patent number: 6855197
    Abstract: A method of restoring a tooth cavity is conducted by a direct or indirect method with a visible light curable nanocomposite of a dental restorative material with a low polymerization shrinkage, wherein the dental restorative material comprises an epoxy resin, inorganic oxide nano particles, a photoinitiator and a photosensitizer. The direct method involves the filling of the tooth cavity with the nanocomposite dental restorative material, stacking the nanocomposite dental restorative material in the tooth cavity, and curing with visible light followed by shaping and polishing. The indirect method involves making a mold of the tooth, casting the mold with the nanocomposite dental restorative material, curing with visible light followed by shaping and polishing, then removing the shaped and polished material and adhering it to the tooth cavity.
    Type: Grant
    Filed: March 6, 2003
    Date of Patent: February 15, 2005
    Assignee: National Taiwan University
    Inventors: Wei-Fang Su, Shih-Po Sun, Min-Huey Chen
  • Patent number: 6830815
    Abstract: The present invention relates to an anti-friction and anti-wear liquid coating composition for use with parts made of materials that have softening points below about 300° F. and articles so coated. The present invention also relates to a method of coating parts made from a low softening point materials with an anti-friction and anti-wear hard coating composition. The coating composition comprises a mixture of (i) solid lubricants comprising boron nitride, graphite and molybdenum disulfide, (ii) a thermoset resin system, (iii) catalyst for curing the resin system and (iv) a solvent system comprising highly volatile solvents. The coating composition is applied to the part and cured to form a coating on the part.
    Type: Grant
    Filed: April 2, 2002
    Date of Patent: December 14, 2004
    Assignee: Ford Motor Company
    Inventor: V. Durga Nageswar Rao
  • Patent number: 6737157
    Abstract: The present invention provides a coating type reinforcement composition of sheet metal which can be applied under warming for ensuring satisfactory levels of tensile rigidity and resistance to dent of a thin sheet metal mainly due to weight reduction of an automobile body, or for collision safety, and which improve a bending strength and a rigidity of the sheet metal without causing a distortion to the sheet metal. The coating type reinforcement composition of sheet metal according to the present invention comprises a liquid epoxy resin, a latent curing agent and an inorganic filler having an aspect ratio (L/D) of 5 or higher, an amount of the inorganic filler contained being 20 to 50% by weight and the composition being a viscous preparation with a high viscosity.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: May 18, 2004
    Assignee: Sunstar Giken Kabushiki Kaisha
    Inventors: Masaki Ukai, Yutaka Sugiura, Mutsuhisa Miyamoto
  • Patent number: 6730402
    Abstract: A flame-retardant epoxy resin composition includes an epoxy resin, a curing agent, and a metal hydroxide, wherein the curing agent as a phenolic resin (C) containing, in the molecular chain, structural units derived from a phenol (A) and structural units derived from an aromatic compound (B) other than the phenol (A), or the epoxy resin is a novolac epoxy resin CD) obtained by subjecting the phenolic hydroxyl groups of the phenolic resin (C) to etherification with glycidyl. The composition has a high degree of flame retardancy.
    Type: Grant
    Filed: March 11, 2002
    Date of Patent: May 4, 2004
    Assignee: NEC Corporation
    Inventors: Yukihiro Kiuchi, Masatoshi Iji