Abstract: It is disclosed an over-coating agent for forming fine patterns which is applied to cover a substrate having thereon photoresist patterns and allowed to shrink under heat so that the spacing between adjacent photoresist patterns is lessened, with the applied film of the over-coating agent being removed substantially completely to form or define fine trace patterns, further characterized by containing either a water-soluble polymer and an amide group-containing monomer or a water-soluble polymer which contains at least (meth)acrylamide as a monomeric component. Also disclosed is a method of forming fine-line patterns using any one of said over-coating agents. According to the invention, the thermal shrinkage of the over-coating agent for forming fine patterns in the heat treatment can be extensively increased, and one can obtain fine-line patterns which exhibit good profiles while satisfying the characteristics required of semiconductor devices.

Abstract: A door assembly having a structural inner frame that is secured between an interior sheath and an exterior sheath. The inner frame provides rigidity and strength to the door assembly and will not warp or otherwise lose its dimensional integrity regardless of the environment or usage. Both the interior and exterior sheaths add strength and durability once attached to and combined with the inner frame. The internal frame is formed from metal, wood, plastic, composite panels, polystyrene panels or other structural materials. In the preferred embodiment, the inner frame by itself is not structural, it relies on the interior sheath and exterior sheath for its combined strength. The components of the internal frame are secured together by fastening onto the interior sheath and exterior sheath. This allows the components, while structurally supporting one another, to utilize the interior and exterior sheaths to fasten the components to one another.

Abstract: Hybrid powder coating composition with low baking temperature for semiglossy to matt (flat) coatings.

Abstract: Microelectronic packages formed by using novel fluxing agents are disclosed. In one aspect, a microelectronic package may include a microelectronic device, a substrate, and an interconnect structure including a solder material coupling the microelectronic device with the substrate. Underfill material may be included around the interconnect structure between the microelectronic device and the substrate. The underfill material may include an organic rosin acid moiety derived from an anhydride adduct of a rosin compound that was used as a fluxing agent. Methods of making such microelectronic packages using anhydride adducts of rosin compounds are also disclosed.

Abstract: A composition for coating having a gas barrier property comprising coating-forming components of an epoxy resin and an amine curing agent, wherein said amine curing agent is a reaction product of (A) methaxylylenediamine or paraxylylenediamineand (B) polyfunctional compound having at least one acyl group which is capable of forming amide group moiety by reaction with a polyamine to form an oligomeror or (A), (B) and (C)monocarboxylic acid having 1 to 8 carbon atoms and/or derivative thereof and a coating and a coated film a gas barrier property the same.

Abstract: An inkjet recording element comprising, over a porous, ink-receiving layer, a fusible, porous topmost layer comprising a film-forming, hydrophobic binder and fusible, polymeric particles of a non-segmented polyurethane, or salt thereof, comprising repeat units derived from a diisocyanate and a diol component comprising a mixture of diols, said diol mixture comprising: an anionically-substituted diol selected from carboxylic acid-, sulfonic acid-, and phosphonic acid-substituted diol and an ether containing short chain aliphatic diol, wherein the polyurethane has a Tg greater than about 70° C.

Abstract: A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) an aromatic amine curing agent comprising 5–100% by weight of a specific aromatic amine compound having a purity of at least 99%, (C) an inorganic filler, and (D) an ester organic solvent having a boiling point of 130–250° C. is useful for semiconductor encapsulation. The composition has an infiltration ability, adhesion to silicon chips, resistance to deterioration under hot humid conditions, and resistance to thermal shocks.

Abstract: A molding compound is provided for use in encapsulating electronic packages which include an optoelectronic component, such as an LED. The molding compound includes a partially cured epoxy composition, an antioxidant, and, optionally, a phosphor material substantially uniformly distributed throughout the epoxy composition. The optional phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the optional phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.

Abstract: An underfill material, such as a no flow underfill material, containing an anhydride adduct of a rosin compound is disclosed. In one aspect, the anhydride adduct of a rosin compound contains an organic rosin acid moiety and a substitute moiety for a hydroxyl group of a carboxylic acid attached at an acyl group of the organic rosin acid moiety. In another aspect, the anhydride adduct of the rosin compound contains a plurality of linked organic rosin acid moieties. Methods of using the underfill materials and packages formed by curing the underfill materials are also disclosed.

Abstract: A coating composition includes a thermoplastic dispersion and a stabilizer. The stabilizer includes the reaction product of an epoxy resin and an acid, wherein the stabilizer has at least two oxirane functional groups per molecule.

Abstract: The present invention provides an organic carboxylate composition that has long working life, cures epoxy resins, and improves adhesive properties, and also provides a method for producing the same. An organic carboxylate composition, obtained by heating and mixing a basic silane coupling agent and an amine compound with a softening point or melting point of 40° C. or greater together with an organic carboxylic acid; a method for producing the same; an additive for epoxy resin that contains this as the active ingredient thereof; and an epoxy resin composition containing the same. The basic silane coupling agent should preferably be a specific imidazole-group containing silane coupling agent, amino group-containing silane coupling agent, dialkylamino group-containing silane coupling agent, monomethylamino group-containing silane coupling agent, benzimidazole group-containing silane coupling agent, benzotriazole group-containing silane coupling agent, and pyridine ring-containing silane coupling agent.

Abstract: An undercoat composition comprises a film-forming synthetic resin and contains a non-volatile acidic aromatic polar organic compound in free acid or salt form, which compound facilitates the removal by a stripping composition of a top coat paint which is subsequently applied over the undercoat. A top coat composition for applying as the outer coating on a substrate comprises a film-forming synthetic resin having functional groups and a curing agent for crosslinking the synthetic resin and contains a non-volatile acidic aromatic polar organic compound in free acid or salt form, which compound facilitates the removal of the cured top coat by a stripping composition from a cured undercoat of similar composition which does not contain the said acidic aromatic polar organic compound.

Abstract: The invention relates to epoxy resin hardener compositions containing at least one mercaptan hardener and at least one metal salt of C8-24 carboxylic acids. These hardeners are distinguished in particular by the fact that catalyzed resins containing epoxy resins and the hardener compositions according to the invention give high-gloss molding compounds, more particularly coatings, after hardening by crosslinking.

Abstract: This invention relates to curable epoxy-based compositions for use in the field of microelectronics, such as those having an epoxy compound which has two or more epoxy groups per molecule, optionally a polythiol compound which has two or more thiol groups per molecule, a latent hardener, and at least one solid organic acid which is substantially insoluble in a mixture of the foregoing components at room temperature. The solid organic acid may be selected from the group consisting of: aliphatic, cycloaliphatic and aromatic carboxylic acids and derivatives thereof, aliphatic, cycloaliphatic, and aromatic quinones and derivatives thereof, phenols and derivatives thereof and enolisable aliphatic, cycloaliphatic and aromatic compounds and derivatives thereof. The solid organic acid should have a pKa of less than or equal to about 12.0, desirably less than or equal to about 10, and often less than or equal to about 9.0, such as less than or equal to about 7.5.

Abstract: This invention relates to an UV stabilizing additive composition comprising an ortho-hydroxy triazine compound, a hindered hydroxybenzoate compound and optionally a hindered amine compound. This additive composition may be used to stabilize materials from UV radiation. This invention also contemplates a method of stabilizing a material by contacting the material with the UV stabilizing additive composition.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) a curing agent comprising hexahydro-4-methylphthalic anhydride, (C) at least one a boron containing catalyst that is essentially free of halogen, and (D) at least one cure modifier. The encapsulant (11) may also optionally comprise at least one of ancillary curing catalysts, thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: This invention relates to curable epoxy-based compositions for use in the field of microelectronics, such as those having an epoxy compound which has two or more epoxy groups per molecule, a polythiol compound which has two or more thiol groups per molecule, a latent hardener, and at least one solid organic acid which is substantially insoluble in a mixture of the foregoing components at room temperature. The solid organic acid may be selected from the group consisting of: aliphatic, cycloaliphatic and aromatic carboxylic acids and derivatives thereof, aliphatic, cycloaliphatic, and aromatic quinones and derivatives thereof, phenols and derivatives thereof and enolisable aliphatic, cycloaliphatic and aromatic compounds and derivatives thereof. The solid organic acid should have a pKa of less than or equal to about 12.0, desirably less than or equal to about 10, and often less than or equal to 9.0, such as less than or equal to about 7.5.

Abstract: A single component epoxy coating precursor and a method for making such a precursor, a low VOC epoxy coating and a method for making such a coating, and a method for making a blocked amine which is more stable than previously known ones. The single component epoxy coating precursor includes an epoxy resin, a first solvent, and a blocked amine. The single component epoxy coating precursor has a viscosity after 30 days at a temperature of 55° C. of less than 16 stokes.

Abstract: A thermosetting resin composition usable for sealing a gap formed between a printed circuit board and a semiconductor element in a semiconductor package having a face-down structure; a semiconductor device comprising a printed circuit board, a semiconductor element, and the thermosetting resin composition mentioned above, wherein a gap formed between the printed circuit board and the semiconductor element is sealed by the thermosetting resin composition; and a process for manufacturing the semiconductor device.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) a curing agent comprising hexahydro-4-methylphthalic anhydride, (C) at least one a boron containing catalyst that is essentially free of halogen, and (D) at least one cure modifier. The encapsulant may also optionally comprise at least one of ancillary curing catalysts, thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip, and an encapsulant comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) at least one anhydride curing agent, (C) at least one a boron containing catalyst that is essentially free of halogen, (D) at least one cure modifier, and, optionally (E) at least one ancillary curing catalyst. The encapsulant may also optionally comprise at least one of thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip, and an encapsulant comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: The invention relates to two-component preparations comprising components (I) and (II), wherein at least one component comprises epoxy compounds and the preparations cure by cationic polymerization, initiated by Lewis and/or Brönsted acids, after mixing of the two components, the preparations comprising the Lewis and/or Brönsted acids in the form of precursor compounds which are suitable for the formation of Lewis and/or Brönsted acids.

Abstract: An assembly and method for connecting two substrates utilizes a nonconductive laminant that is compatible when wet with a conductive paste when wet. Thus, the curing of the nonconductive laminant and the conductive paste may be performed together. The nonconductive laminant also cures in a shorter time than those previously available, thus the stress on the semiconductor device created by exposure to the cure temperature is additionally reduced.

Abstract: The resin system comprises at least two components which can be stored separately and crosslinked with one another at room temperature, preferably without curing accelerators. The first component comprises at least one compound of the formula (I) where A is an unsubstituted or substituted aromatic radical. The second component comprises at least one cyclic anhydride of an organic acid.

Abstract: This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), flip chip assemblies (“FCs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), or semiconductor chips themselves and a circuit board to which the devices or chips, respectively, are electrically interconnected. The inventive fluxing underfill composition begins to cure at about the same temperature that solder used to establish the electrical interconnection melts.

Abstract: In order to provide a multilayer printed circuit board having a fine pitch circuit, the interlaminar insulating adhesive used therein must have heat resistance and low thermal expansion coefficient so that required accuracy can be obtained during circuit formation and mounting of components. Therefore, the present invention aims at providing a multilayer printed circuit board which uses an interlaminar insulating adhesive superior in heat resistance and low in thermal expansion coefficient and wherein the insulating adhesive layer has a small variation in thickness between circuit layers.

Abstract: The present invention relates to a thermally and cationically curable composition containing triarylcyclopropenylium salts and a solvent that is a Lewis base which contains acidic hydrogen and their use as thermal initiators in polymerization processes. The present invention includes the polymerization of epoxy resins, vinyl ethers and other cationically curable monomers.

Abstract: A thermosetting resin composition for prestressed concrete tendon, wherein the composition does not harden until the completion of the straining of the tendon, which is the inherent object in the post-tension technique, even if the heat storage temperature in the concrete structures elevates from 30° C. to 80° C. or higher due to heat of hydration reaction in setting a concrete, particularly 95° C. that is the maximum temperature in solidifying a concrete, and the composition including the site of 30° C. or lower where there is substantially no partial heat storage due to heat of hydration reaction in setting the concrete hardens within the prescribed period of time under spontaneous environmental temperature after the subsequent natural cooling, thereby achieving anti-rust and anti-corrosion of the tendon and also adhesion and integral bonding of the tendon and the concrete, a use method thereof and a prestressed concrete tendon.

Abstract: A curable composition useful for repairing worn surfaces on housings comprising an admixture of: (1) a mixture of (a) an one-component epoxy resin, (b) solvent and (c) reactive diluent, wherein said epoxy resin is present in a major amount in said mixture; (2) graphite powder; and (3) polytetrafluoroethylene powder.

Abstract: An epoxy based adhesive composition contains: (i) a barbituric acid-modified bismaleimide; (ii) an epoxy resin selected from the group consisting of tetraglycidylmethylenedianiline, diglycidyl ortho-phthalate, diglycidyl ether of bisphenol A, polyglycidyl ether of novolac, and epoxy cresol novolac; (iii) an elastomer such as a carboxylated acrylontrile rubber containing between 19 and 41 wt % of acrylontrile; (v) a hardening agent and (vi) a catalyst.

Abstract: The invention relates to curable compositions comprising a) an epoxy resin, b) an aminic curing agent and c) a curing accelerator,

Abstract: The compositions described include micronized zinc oxide UV blocking agents with at least one organic UV protective compound. Premix compositions are provided for imparting improved UV resistance to paints, coatings, finishes and plastic articles comprising both micronized inorganic zinc oxide and organic UV protective compounds suitable for easy later inclusion into paint, coating, finish and plastic articles formulations.

Abstract: A paint protecting and reactivating composition comprising a main ingredient selected from: a dicyclopentadiene polymer, soy oil, sunflower oil or corn oil; an organic solvent; alkanoates of cobalt, magnesium, and zirconium; a chelating agent; an epoxy resin; a hindered amine; and a nitrogen heterocyclic compound.

Abstract: This invention relates to a polyimide hybrid adhesive comprised of an epoxy component, an epoxy curing agent, and a polyimide oligomer of molecular weight of up to about 8,000 (Mn) having repeating units of Formula (1): The adhesives are particularly useful in applications where thermal stability and high adhesive strength are required.

Abstract: A triazine compound having formula I or formula II: Wherein n is integer from 1 to 5; R1 is hydrogen, halogen, C1-C4 alkyl, or C1-C4 alkoxyl; and R2 is aliphatic amine, aliphatic alcohol, alicyclic amine or alicyclic alcohol, and an epoxy resin composition containing the triazine compound. The epoxy resin composition is suitable for the preparation of the structural substrate of printed circuit boards having low dielectric constant.

Abstract: Dynamic balancing compositions are described which include an epoxy resin component and a curing component. The curing component contains at least one of a polyamide agent or polyamine agent. The balancing compositions drastically reduce the time required for balancing because, immediately after their application, they can be rotated and balanced in the uncured state. The balancing compositions also have an increased pot life and can be colored with pigment to approximate the color of copper windings.

Abstract: A thermosetting composition with a glass transition temperature of at least 100° C. comprises at least one epoxy resin formed from at least one polyepoxide containing at least two epoxy groups in its molecule and at least one aromatic polyamine containing at least two primary amino groups in its molecule, at least one alkyl substituent containing 1 to 12 carbon atoms located in the position alpha to one of the amino groups. The molar ratio of the amine to the epoxide is such that each amine group corresponds to 1.6 to 2.6 epoxy groups. The composition also includes a flow regenerator. The composition can be used as a protective coating for any metallic or non metallic surface. The invention also concerns a flexible deployable preform comprising the composition.

Abstract: A vinyl ester resin derived from the reaction of about equivalent amounts of an unsaturated monocarboxylic acid and a polyepoxide is stabilized with from 0.01 to 5 weight percent of maleic acid and/or maleic anhydride.

Abstract: A reworkable epoxy underfill encapsulant is provided for use in an electronic packaged system which incorporates an integrated circuit, an organic printed wire board, and at least one eutectic solder joint formed therebetween. A preferred embodiment of the encapsulant includes: a cycloaliphatic diepoxide; an organic hardener; a curing accelerator; a silica filler; and an additive, with the additive providing thermal reworkability to the composition. A method is also provided for forming the aforementioned reworkable epoxy underfill encapsulants.

Abstract: There is provided by the present invention a thermal transfer ribbon which employs reactive binder components that increase in molecular weight when heated during transfer to provide images with high scratch and smear resistance. The reactive components comprise an epoxy resin binder and crosslinker for the epoxy resin binder which are maintained in separate phases within the thermal transfer layer until exposed to a thermal print head through the use of a coating formulation solvent which does not solubilize either the crosslinker or the epoxy resin binder or both.

Abstract: A liquid, pourable 100% active rheological additive especially useful for thickening non-aqueous compositions is described. The additive, which exists in a pourable form at up to a 100% as a rheologically active composition, exhibits excellent thickening efficiency for systems including inks, epoxies, polyesters, paints, greases and other systems, including ease of dispersibility, without adversely affecting gloss. The additive may operate by both an associative and a reaction mechanism to provide rheological viscosity properties to such systems, and is also similarly useful for aqueous systems.

Abstract: The present invention relates to a binder for a building structure comprising a main ingredient, a curing agent and an accelerator for the main ingredient; the main ingredient being an epoxy acrylate resin diluted with a reactive monomer comprising a multifunctional ester of carboxylic acid and alcohol, at least one of which contains a reactive double bond; the curing agent being an organic peroxide; and the accelerator of the main ingredient being tertiary aromatic amines containing a hydroxyl group in a nitrogen substituent.

Abstract: Compositions and methods for improving the characteristics of foundry cores which includes adding to a foundry aggregate mixture polyurethane resin binder comprising epoxy resin and, preferably, paraffinic oil.

Abstract: A flame-retardant resin composition which comprises (A) 100 parts by weight of an unhalogenated epoxy resin having at least two epoxy groups in one molecule, (B) 20 to 205 parts by weight of a maleimide compound having at least one maleimido group in one molecule, (C) 20 to 65 parts by weight of a curing agent having an amino group and (D) a phosphorus compound in a proportion of 0.5 to 4.5 parts by weight in terms of phosphorus element per 100 parts by weight of a total of the components (A), (B) and (C), provided that the proportion of nitrogen element contained in the composition is 2.0 to 10.0 parts by weight per 100 parts by weight of the total composition. The above flame-retardant resin composition has a high flame retardance without adding a halogen compound and does not deteriorate the characteristics of commercial products.

Abstract: Conventional hot-melt adhesive compositions for the coating of textile sheet structures exhibit problems in respect of resistance to washing and cleaning. The presence of an epoxide in hot-melt adhesive composition enables the production of cleaning-resistant laminated materials having a particularly high level of wash resistance.

Abstract: The invention relates to a process for preparing soluble and/or meltable phosphorus-modified epoxy resins, which comprises reacting a polyepoxide compound having at least 2 epoxide groups per molecule with carboxyl-containing phosphinic or phosphonic acids.

Abstract: Dehydroshikimates are used as antioxidants for oxidation susceptible compositions, as well as for inhibiting oxidative physiological processes. Particularly, the parent acid and its derivatives find application in inhibiting the oxidation of food substances, feed, dietary supplements, oils, polymers, fuels, lubricants, cosmetics, medicinal agents, inks, dyes, and other oxidative sensitive products, over extended periods of time and at elevated temperatures. The subject compounds can be used at low concentrations.

Abstract: Disclosed is a thermosetting coating composition comprising (A) an epoxy compound and (B) an aromatic sulfonium salt represented by the formula ##STR1## wherein R.sup.1 represents a hydrogen atom, a hydroxyl group, an alkoxyl group, or a group represented by the formula ##STR2## wherein Y represents an alkyl group, an alkoxyl group, a phenyl group or a phenoxy group all of which may have a substituent, each of R.sup.2 and R.sup.3 represents a hydrogen atom, a halogen atom, or an alkyl group, each of R.sup.4 and R.sup.5 represents an alkyl group, an aralkyl group or an aryl group all of which may have a substituent, and X.sup.- represents SbF.sub.6.sup.-, PF.sub.6.sup.-, AsF.sub.6.sup.-, or BF.sub.4.sup.-.

Abstract: Compositions and methods for improving the characteristics of foundry cores which includes adding to a foundry aggregate mixture polyurethane resin binder comprising epoxy resin and, preferably, paraffinic oil.

Abstract: Molding compositions which are formed by first pre-reacting a thermoplastic polyester polymer or copolymer with a copolymer of ethylene and a glycidyl acrylate or methacrylate and then subsequently blending with a nucleating agent which is a Group I metal salt of a carboxylic acid to increase the crystallization rate of the polyester. At least one reinforcing component such as glass fibers or reinforcing fillers is preferred. The compositions exhibit a good balance of toughness, rigidity and gasoline resistance and are particularly useful for automotive structural parts such as inner door frames, panels, reinforcements, bumper beams, window surrounds, and other metal replacement applications.