Abstract: A terrazzo composition containing a resin component; a hardener component; and an aggregate component, where the composition has a tensile strength of about 8500 psi to about 8900 psi, a compressive strength of about 2600 psi to about 3000 psi, a Shore D Hardness of about 50 to about 100, and a weight of about 0.60 pounds per square foot at 0.25 inch thickness to about 0.76 pounds per square foot at 0.25 inch thickness.

Abstract: The present invention relates to an epoxy resin composition for an optical semiconductor device having an optical semiconductor element mounting region and having a reflector that surrounds at least a part of the region, the epoxy resin composition being an epoxy resin composition for forming the reflector, the epoxy resin composition including the following ingredients (A) to (D): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; and (D) at least one antioxidant selected from the group consisting of hindered-phenol antioxidants, sulfide antioxidants and hindered-amine antioxidants.

Abstract: A thermosetting resin composition containing: (A) a resin composition having an unsaturated maleimide group, produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound, such as an isocyanate-masked imidazole and an epoxy-masked imidazole, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same.

Abstract: The present invention relates to a method of producing an aqueous dispersion of silanized colloidal silica particles comprising mixing in an aqueous medium a) at least one silane compound containing an epoxy-functionality, b) at least one silane compound having no epoxy-functionality capable of modifying colloidal silica particles; and c) colloidal silica particles in any order to form an aqueous dispersion of silanized colloidal silica particles containing silane compounds originating from a) and b). It also relates to a dispersion obtainable by said method and to the use thereof in coating applications.

Abstract: A heat curable epoxy composition comprising the contact product of an epoxy resin, an epoxy curing agent and an accelerator for the epoxy curing agent, the curing agent or the accelerator comprising a urea compound which is the reaction product of an isocyanate and an alkylated polyalkylenepolyamine having one primary or secondary amine and at least two tertiary amines of the general formula: where R1, R2, R3, R4 and R5 independently represent hydrogen, methyl or ethyl, n and m independently are integers from 1 to 6 and; X is an integer from 1 to 10.

Abstract: The invention is aimed at providing a liquid resin composition capable of densely containing a filler and of filling up a narrow gap in a flip-chip-bonded semiconductor device, and a highly-reliable semiconductor device using the same. The liquid resin composition of the present invention contains (A) an epoxy resin; (B) an epoxy resin curing agent; and (C) a filler, wherein content of (C) the filler is 60% by weight or more and 80% by weight or less of the whole liquid resin composition, and contact angle (?) of the liquid resin composition, measured at 110° C. in accordance with JIS R3257, is 30° or smaller.

Abstract: The invention relates to watery resin dispersions, a process for their manufacture, and a product. To make available resin dispersions that do not pollute the environment during their processing, while simultaneously generating products that have a high glass transition temperature, it is suggested that the watery resin dispersion contain at least components (I), (II) and (III), whereby R1: unsubstituted single or polynuclear aromatic rest or with amino groups and/or cyano groups and/or nitrile groups and/or with saturated and/or unsaturated aliphatic C2 to C12 carbon chains substituted single or polynuclear aromatic rests R2, R3 and R4: hydrogen, alkyl residue group with up to 15 C atoms or aromatic rest whereby R2, R3 and R4 can be equal to or different from each other, (II) is a co-dispersion agent based on epoxide resins and/or novolak resins and (II) one surfactant.

Abstract: The adhesive composition of the invention comprises (A) a thermoplastic resin with a Tg of no higher than 100° C. and (B) a thermosetting component, wherein the (B) thermosetting component includes (B1) a compound with an allyl group and (B2) a compound with a maleimide group.

Abstract: Silanes of formula (I), or of substrates whose surface is coated or derivatized with a silane of formula (I), as a curing agent for epoxy resins which is activatable at elevated temperature. Such thermosetting epoxy resin compositions allow a large reduction in the curing temperature without great impairment of their storage stability.

Abstract: The invention relates to a method for treating an ammonium halogenide and/or residue containing organic aminhydrohalogenides, produced during the production of an amino-functional organosilane of general formula (I) R2N[(CH2)2NH]z(Z)Si(R?)n(OR?)3-n (Ia), wherein the production of the amino-functional organosilane according to formula (Ia) is based on the conversion of a halogen-functional organosilane of general formula (II) X—Z—Si(R?)n(OR?)3-n (II), with excess ammonia or an organic amine of general formula (III) RNH[(CH2)2NH]zR (III) and subsequently separating and treating the raw product and the resulting residue containing salt. The treatment consists of adding an essentially non-polar organic solvent and an aqueous lye to the residue. The mixture is reacted, subsequently the aqueous phase is separated from the organic phase, the organic solvent contained in the organic phase is removed from said phase and the residual organic phase is recovered.

Abstract: The present invention relates to an epoxy resin compound, a preparation method thereof, a prepreg made therefrom, and a copper cladded laminate made therefrom. The epoxy resin compound comprises: 30-80 parts by weight of epoxy resin; 20-50 parts by weight of polyphenylene ether resin of new structure with the number average molecular weight thereof being 1000-5000, which is prepared via the redistribution reaction of polyphenylene ether and phenolic resin with the existing of initiator agent; 0-50 parts by weight of filler; 1-20 parts by weight of ingredient. The epoxy resin compound of the present invention, has good heat resistance and dielectric property, and has a simple preparation process, which is good for batch production.

Abstract: An epoxy composition for applications such as one-part adhesives, coatings, prepreg and molding compounds that includes leuco dyes, particularly those comprising a N,N-dialkylamino-, N,N-diarylamino-, N-alkyl-N-arylamino-, N-alkylamino- or N-arylamino- functional group on one of the aromatic rings, as a co- catalyst or co-curing agent. The use of the leuco dye co-catalyst provides improved curing speed of the epoxy composition comprising a latent curing agent/catalyst such as imidazole microcapsules while maintaining the shelf-life stability. The epoxy may also include a secondary co-catalyst that includes a urea, particularly those comprising a N,N-dialkylamino-, N,N-diarylamino-, N-alkyl-N-arylamino- or dicycloalkylamino- functional group. Secondary cocatalysts of low mobility at the storage conditions are particularly preferred.

Abstract: A resin composition for a pre-coated steel sheet having good processibility, heat resistance, and corrosion resistance, and a pre-coated steel sheet fabricated by using the resin composition are disclosed. The resin composition includes a 10 to 40 parts by weight of a hardener comprising end-capped blocked polyisocyanate and a melamine resin by 2:1 to 3:1 by parts by weight and 0. 1 to 10 parts by weight of organized layered nano-clay, based on a 100 parts by weight of a base resin. The pre-coated steel sheet obtained by the method exhibits good processibility, heat resistance, and corrosion resistance.

Abstract: The present invention relates to a halogen-free resin composition with high frequency dielectric property, and a prepreg and a laminate made therefrom. The halogen-free resin composition with high frequency dielectric property comprises, calculating according to the parts by weight of organic solids: (A) 10-50 parts by weight of copolymer of styrene-maleic anhydride; (B) 10-50 parts by weight of at least one compound having dihydrobenzoxazine ring; (C) 10-50 parts by weight of at least one polyepoxide; (D) 5-30 parts by weight of at least one phosphorus-containing flame retardant. Prepregs and laminates made from the resin composition have low dielectric constant, low dielectric dissipation factor, high glass transition temperature, high heat resistance, low moisture adsorption, and the technological operation is simple.

Abstract: This invention relates to compositions useful as adhesives and more particularly to the preparation of heat-curable epoxy-based adhesive compositions that are capable of being easily pumped under high shear at temperatures around room temperature but are resistant to being washed off substrate surfaces prior to being cured.

Abstract: A method of making a filled resin includes providing functionalized particles; and combining and homogenously mixing the functionalized particles with an organic matrix in a vacuum kneader to provide the filled resin so that the functionalized particles comprise at least about 20% by weight of the filled resin. The step of providing functionalized particles can also include providing a feedstock of (i) untreated particles, (ii) a surface treatment agent reactive with the particles, and (iii) solvent, and directing the feedstock through a continuous reactor maintained at a temperature sufficient to react the particles with the surface treatment agent to provide the functionalized particles in less than about 4 hours; and directing the functionalized particles from the continuous reactor directly into the vacuum kneader. In another aspect, the a finished resin comprises at least about 20% by weight of functionalized particles in an organic matrix.

Abstract: A curable composition comprising a) an epoxy resin containing on average more than one epoxy group per molecule, and b) as curing agent a hybrid hardener, whereby said hardener is a blend of b1) an aminic compound selected from aliphatic, cycloaliphatic, araliphatic amines, imidazoline group-containing amidoamines based on mono- or polybasic acids, adducts of said amines or amidoamines made from glycidyl compounds, adducts of said amines or amidoamines with cyclic carbonates, whereby said aminic compound contains, on average per molecule, at least two reactive hydrogen atoms bound to nitrogen atoms, and b2) a polyphenol novolac, and wherein the polyphenol novolac is used in an amount of from 30% to 45% by weight, based on the total weight of hardener blend comprising b1) and b2), useful for rapid setting and protective coatings and adhesives in application fields like civil engineering, marine, architectural and maintenance.

Abstract: An adhesive composition that is capable of achieving a superior combination of process characteristics such as adherend fill properties (embedability) and low-temperature lamination properties, and semiconductor device reliability such as reflow resistance, as well as a film-like adhesive, an adhesive sheet that exhibits excellent process characteristics including ready releasability from dicing sheets, and a semiconductor device that exhibits excellent productivity, superior adhesive strength when heated and superior moisture resistance, all of which use the adhesive composition. The adhesive composition comprises (A) a thermoplastic resin, (B) a bisallylnadimide represented by a general formula (I) shown below, and (C) a bifunctional or higher (meth)acrylate compound. (wherein, R1 represents a bivalent organic group containing an aromatic ring and/or a straight-chain, branched or cyclic aliphatic hydrocarbon).

Abstract: A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed circuit board, prepreg and adhesive sheet are provided which exhibit improved physical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. A resin composition containing 100 parts by weight of a thermoplastic resin and 0.1-65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (?2) of 1.0×10?3 [° C.?1] or below over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.

Abstract: The invention relates to compositions containing at least one solid epoxide resin A, at least one polymer B of formula (I), at least one thixotropic agent C made from a urea derivative and at least one curing agent for epoxide resins D activated by high temperatures. The compositions are particularly suitable for use as adhesives. Low-temperature impact-resistant adhesives can be produced for use in particular as structural adhesives.

Abstract: An epoxy resin composition for photosemiconductor element encapsulation, which is excellent in both light transmissibility and low stress property, as well as light resistance against short wavelength light (for example, 350 to 500 nm), is provided. The epoxy resin composition for photosemiconductor element encapsulation, which comprises the following components (A) to (C): (A) an epoxy resin, (B) an acid anhydride curing agent, and (C) a specific silicone resin.

Abstract: An epoxy resin composition for semiconductor encapsulation includes at least one epoxy resin, at least one curing agent, at least one filler, and at least one first curing accelerator, the first curing accelerator having a tetracyanoethylene, a 7,7,8,8-tetracyanoquinodimethane, a compound having the chemical structure of Formula 1, or a mixture thereof, wherein each of R1 through R7, independently, represents a hydrogen atom or a C1-C12 hydrocarbon group, provided that when R1 through R7 are C1-C12 hydrocarbon groups, R1 and R2, R2 and R3, R3 and R4, R4 and R5, R5 and R6, and R6 and R7 can be joined to each other to form a cyclic structure.

Abstract: This invention relates to an epoxy resin composition which has better adhesive performance and flexibility at low temperatures (about ?20° C.) to normal temperature as well as elevated temperatures (about 80° C.) and is suitable for use as a structural adhesive. The epoxy resin composition includes 100 mass parts epoxy resin, 5 to 100 mass parts core-shell particles, and a curing agent. 1 to 50 mass % of the epoxy resin is a urethane-modified epoxy resin and the core-shell particles include acrylonitrile in the monomer used during the production of the shell layer, and/or comprise a structure having at least three layers of a core layer, an interlayer, and a shell layer.

Abstract: The invention refers to salts of at least one imidazole of the general formula (I), in which R1, R2, R3 and R4 are the same or different and denote hydrogen, an alkyl residue having 1 to 20, preferably 1 to 10, more preferably 1 to 4 carbon atoms, or a substituted or unsubstituted aryl or arylalykl residue having 6 to 10 carbon atoms, and at least one aliphatic or aromatic mono- or dicarboxylic acid. The molar ratio of carboxylic acid to imidazole, based on the functionality of the acid, is 1:1.1 to 1:6. The invention also relates to a method for manufacturing the imidazole salts, to their use, and to epoxy resin compositions containing said salts.

Abstract: Disclosed is a method of preparation of corrosion-resistant epoxy coatings. The coating composition contains two main corrosion resistant factors: The first one was Eemeraldine-Base polyaniline (EB-PANi), dissolved in the aminic hardener of epoxy. The other one was montmorrilonite clay, dispersed or exfoliated in the base component of epoxy resin. The hardener composition was prepared via dissolution of EB-PANi in functional amines like 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine adopting sonication and nanoscale filtering methods. The base component was prepared via gradual charging of MMT clay in epoxy resin via high-shear mixing plus sonication method. The morphology of the coatings during different stages of preparation was studied by optical microscopy and scanning electron microscopy and TEM. The corrosion-protective performance of the resultant coatings was evaluated by electrochemical impedance spectroscopy and salt spray tests.

Abstract: A liquid epoxy resin composition comprising (A) a liquid epoxy resin; (B) an amine curing agent; (C) a nitrogen compound selected from the group consisting of organic acids salts of tertiary amines, amino acids, imino acids, and monoamine compounds having an alcoholic hydroxyl group in an amount of from 0.1 to 20 parts by weight per total 100 parts by weight of the components (A) and (B); and (D) an inorganic filler in an amount of from 50 to 900 parts by weight per 100 parts by weight of the component (A).

Abstract: Discussed are heat-curable epoxy resin compositions containing at least one epoxy resin A with, on average, more than one epoxide group per molecule, at least one curing agent B for epoxy resins, which is activated by an increased temperature, at least one terminally blocked polyurethane prepolymer of formula (I) and at least one epoxide-terminated polyurethane prepolymer of formula (II). The epoxy resin compositions are particularly suitable for use as one-component, heat-curable adhesives and are characterized by excellent mechanical properties, high glass transition temperatures and high impact resistance.

Abstract: The object of the present invention is to provide an adhesive composition that enables to produce conforming products with a high manufacturing yield and without breaking or chipping of the chips in the picking-up step and that enables to stably connect a wire without contaminating a wire pad part disposed at the circumference of a bonding surface during a wire bonding step that is performed after die bonding, even in the case of chips being reduced in a thickness. The adhesive composition of the present invention comprises: (A) an acrylic polymer; (B) an epoxy resin; (C) a thermosetting agent; and (D) a silicone compound having a specific side chain.

Abstract: Curable compositions are provided which contain a curable component and particular m-hydroxybenzene derivatives, wherein such derivatives function as aging inhibitors. Such curable compositions are useful as coating agents and adhesives having improved aging resistance.

Abstract: A solvent-free epoxy resin matrix composition comprising: (a) a liquid epoxy resin or a liquid mixture of epoxy resins, (b) a benzylidenamine compound, (c) an aliphatic or cycloaliphatic primary monoamine and/or disecondary diamine; and (d) a catalytically curing tertiary amine. The epoxy resin matrix composition is used as an impregnating resin to form impregnated fiber composite materials.

Abstract: Hybrid powder coating composition with low baking temperature for semiglossy to matt (flat) coatings.

Abstract: A reworkable conductive adhesive composition, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix.

Abstract: Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to 0.03% by weight, based on the weight of the component (a), and subjecting the resultant mixture to reaction for heat treatment in an organic solvent at a temperature of 70° C. to less than 140° C. so that all of the components are compatible with one another in the absence of a solvent; and (d) inorganic filler, a laminate or prepreg prepared using the varnish and a printed wiring board prepared using the laminate and/or prepreg.

Abstract: Epoxy functional polymers comprising the reaction product of a terpene and a epoxy functional monomer are disclosed. Coatings comprising these polymers are also disclosed, including cationic electrodepositable coatings.

Abstract: An epoxy composition for applications such as one-part adhesives, coatings, prepreg and molding compounds that includes leuco dyes, particularly those comprising a N,N-dialkylamino-, N,N-diarylamino-, or cycloalkylamino-functional group on one of the aromatic rings, as a co-catalyst or co-curing agent. The use of the leuco dye co-catalyst provides improved curing speed of the epoxy composition comprising a latent curing agent/catalyst such as Novacure imidazole microcapsules while maintaining the shelf-life stability. The epoxy may also include a secondary co-catalyst that includes amides and lactams, particularly those comprising a N,N-dialkylamino-, N,N-diarylamino-, or dicycloalkylamino-functional group. Secondary cocatalysts of low mobility at the storage conditions, such as those with a long chain substitutent, dimeric or oligomeric amides or lactams, are particularly preferred.

Abstract: A composition for coating having a gas barrier property comprising coating-forming components of an epoxy resin and an amine curing agent, wherein said amine curing agent is a reaction product of (A) methaxylylenediamine or paraxylylenediamineand (B) polyfunctional compound having at least one acyl group which is capable of forming amide group moiety by reaction with a polyamine to form an oligomeror or (A), (B) and (C)monocarboxylic acid having 1 to 8 carbon atoms and/or derivative thereof and a coating and a coated film a gas barrier property the same.

Abstract: The present invention relates to a thermosetting resin composition for a high speed transmission circuit board, more particularly to a thermosetting resin composition having superior dielectric characteristics with low dielectric constant and dissipation factor and having superior glass transition temperature, heat resistance after moisture absorption, dielectric reliability, adhesion to copper film, workability, dispersibility of inorganic filler, electric characteristics, etc., and thus being useful for a copper clad laminate for high speed signal transfer.

Abstract: An epoxy resin composition is provided, which includes (A) an epoxy resin with at least 2 epoxy groups within each molecule, (B) a curing agent, and (C) a foaming agent. This composition displays excellent flame retardancy and reliability and is suitable for use as a semiconductor encapsulating material.

Abstract: A halogen-free resin composition is provided, comprising: (A) one or more phosphorous-containing epoxy resins; (B) a hardener; and (C) a hardening accelerator, wherein the hardener of component (B) has the structure represented by the following formula (I): wherein, each symbol is defined as in the specification. The halogen-free resin composition of the present invention has excellent thermal resistance and flame retardant property, and is thereby suitably useful in the application of adhesives, composite materials, laminated plates, printed circuit boards, copper foil adhesives, inks used for build-up process, semiconductor packaging materials, and the like.

Abstract: The present invention relates to a phosphorus-containing epoxy resin, which is an epoxy resin modified with a side chain having a reactive phosphorus-containing compound. Also, the present invention relates to a flame-retardant resin composition, which comprises: (1) the phosphorus-containing epoxy resin, (2) a halogen-free hardener having a reactive hydrogen capable of reacting with the epoxy group in epoxy resin, and (3) a hardener promoter. The flame-retardant resin composition described above has improved excellent heat resistance and flame retardant property, and is especially suitable for adhesive laminates, composite materials, printed circuit boards, adhesive material for copper foils, and is suitable for IC packaging materials.

Abstract: Compounds of formula (I) or (II), wherein R1 is C1–C18alkyl; C5–C12cycloalkyl that is unsubstituted or substituted by one or more C1–C6alkyl groups or C1–C6alkoxy groups; C5–C22aryl that is unsubstituted or substituted by one or more C1–C6alkyl groups or C1–C6alkoxy groups; or C7–C30aralkyl that is unsubstituted or substituted by one or more C1–C6alkyl groups or C1–C6alkoxy groups, and the radicals R2 to R13 are each independently of the others hydrogen; —NO2; dialkylamino; alkylthio; alkylsulfonyl; halogen; C1–C18alkyl; C1–C18alkoxy; C1–C18alkoxyalkyl; C5–C12cycloalkyl that is unsubstituted or substituted by one or more C1–C6alkyl groups or C1–C6alkoxy groups; C5–C22aryl that is unsubstituted or substituted by one or more C1–C6alkyl groups or C1–C6alkoxy groups; or C7–C30aralkyl that is unsubstituted or substituted by one or more C1–C6alkyl groups or C1–C6alkoxy groups, are suitable as flame-proofing agents for thermoplastic or thermosetting polymers

Abstract: Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to 0.03% by weight, based on the weight of the component (a), and subjecting the resultant mixture to reaction for heat treatment in an organic solvent at a temperature of 70° C. to less than 140° C. so that all of the components are compatible with one another in the absence of a solvent; and (d) inorganic filler, a laminate or prepreg prepared using the varnish and a printed wiring board prepared using the laminate and/or prepreg.

Abstract: The invention relates to thermoplastic moulding materials containing A) 29 to (100 wt. % minus 1 ppb) of at least one thermoplastic polymer. B) 1 ppb to 1 wt. % or at least one polyethyleneimine homopolymer of copolymer, as well as C) 0 to 70 wt. % of other additives, as the essential constituents thereof. The weight percent of constituents A) to C) amounts to 100% in every case.

Abstract: Epoxy resin composition curing agents, which include a primary amino alcohol, are disclosed. Specifically, the invention relates to curing agents which include a primary amino alcohol physically blended therewith. Alternatively, the invention relates to curing agents which include a primary amino alcohol reacted into a resinous phenolic compound. Resin systems utilizing the curing agents of the invention exhibit enhanced hot wet adhesion to metal substrates and are particularly useful in the manufacture of powder coatings for pipe.

Abstract: Provided herein are amine blends which may be used in place of N-aminoethyl piperazine as accelerator in the curing reaction of epoxy resins.

Abstract: A flame-retardant molding composition that includes an epoxy resin, melamine cyanurate, and one or more hydrate metal salts capable of liberating water when heated. The hydrated metal salt may include one or more compounds selected from metal borate salts, Group IIB oxides, and polyhydroxides of one more elements selected from Group IIA elements and Group IIIB elements. The molding composition may be used to coast an electrical or electronic device by heating the molding composition to a temperature sufficient to cure the molding composition and form a polymer on the surface of the device. Electrical and electronic devices formed by the method are also disclosed.

Abstract: An environmentally preferred flock adhesive composition containing low molecular weight prepolymers of isocyanate terminated polyether and/or polyalkadiene polyols is disclosed. The prepolymers are free of residual volatile isocyanate (<1000 ppm) without blocking the isocyanate thereby providing favorable effects on viscosity, cure kinetics, and safety. The flock adhesive composition preferably contains an aromatic nitroso compound an epoxy novolak resin and a catalyst. The adhesive compositions can be made at high solids, with minimal co-solvent, while maintaining low viscosity, which is favorable to environmental regulations aimed at reducing solvent emissions. Furthermore, the solvents can be non-HAP and non-photochemically reactive. The adhesive composition can be utilized for the application of flocking fibers to various elastomer substrates.

Abstract: An undercoat composition comprises a film-forming synthetic resin and contains a non-volatile acidic aromatic polar organic compound in free acid or salt form, which compound facilitates the removal by a stripping composition of a top coat paint which is subsequently applied over the undercoat. A top coat composition for applying as the outer coating on a substrate comprises a film-forming synthetic resin having functional groups and a curing agent for crosslinking the synthetic resin and contains a non-volatile acidic aromatic polar organic compound in free acid or salt form, which compound facilitates the removal of the cured top coat by a stripping composition from a cured undercoat of similar composition which does not contain the said acidic aromatic polar organic compound.

Abstract: This invention relates to an UV stabilizing additive composition comprising an ortho-hydroxy triazine compound, a hindered hydroxybenzoate compound and optionally a hindered amine compound. This additive composition may be used to stabilize materials from UV radiation. This invention also contemplates a method of stabilizing a material by contacting the material with the UV stabilizing additive composition.

Abstract: A method for making a one-component epoxy resin system comprises reacting (A) an epoxy resin and (B) an amine solidifying system present in insufficient quantities to cause gelation in the presence of a latent hardener (C) and an expanding agent (E), each of which remains unreacted under the reaction conditions for (A) and (B), to yield a product with a Kofler Heat Bank melting point of less than 55° C. and a melting point stability of at least six months at normal workshop temperatures.