Hydrocarbon Wax Patents (Class 523/465)
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Patent number: 9884962Abstract: A composition, including at least one curable structural adhesive, and at least one thermoplastic elastomer, wherein the thermoplastic elastomer is present in the structural adhesive as penetrating polymer network. Such a composition constitutes a so-called shape memory material and is suitable for reinforcing cavities in structural components, such as, for example, in automobile bodies.Type: GrantFiled: September 26, 2012Date of Patent: February 6, 2018Assignee: SIKA TECHNOLOGY AGInventors: Matthias Gössi, Jürgen Finter
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Publication number: 20130324642Abstract: A curable compound of a formulation, a method for producing a polymer material from the curable compound, the resulting polymer material, and agents produced from the polymer material.Type: ApplicationFiled: January 25, 2012Publication date: December 5, 2013Applicant: THYSSENKRUPP UHDE GMBHInventor: Dieter Rossberg
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Patent number: 8445106Abstract: An object of the present invention is to provide a resin-coated metal sheet which not only is excellent in stamping performance (lubricity of a resin layer) and film removability by alkaline cleaning but also has improved blocking resistance. Further, another object of the present invention is to provide a resin composition used for forming a resin layer having such properties on a metal sheet. A resin-coated metal sheet according to the present invention is characterized in that a resin layer containing polyethylene glycol whose number average molecular weight is 18,000 to 500,000 and paraffin wax whose average molecular weight is 400 or less is laminated on one side or both the sides of the metal sheet.Type: GrantFiled: July 18, 2006Date of Patent: May 21, 2013Assignee: Kobe Steel, Ltd.Inventors: Yoshihiro Itou, Naoya Fujiwara, Kiyomi Aoki
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Patent number: 6881769Abstract: Matting agent for thermally curable systems, especially for powder coating compositions, that comprise at least, one carboxyl-containing polymer as binder and at least one epoxy-group-containing compound as cross-linking agent, wherein the matting agent comprises at least the following constituents: (a) a metal salt or a metal complex of an organic compound, the metal being selected from the group magnesium, calcium, strontium, barium, zinc, aluminium, tin and antimony, and (b) a polymerisation product of monomers, the monomers including epoxy-group-containing monomers and the epoxy value of the polymerisation product being from 0.1 to 8 equivalents of epoxy groups, and overall the ratio of epoxy equivalents of component (b) to metal equivalents of component (a) being from 0.2 to 120.Type: GrantFiled: March 7, 2000Date of Patent: April 19, 2005Assignee: Huntsman Advanced Materials Americas Inc.Inventors: Carmelina Grob, Christoph Rickert, Daniel Künzi
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Patent number: 6881768Abstract: A tile grout composition and method of using the tile grout composition to grout set tiles are provided. The tile grout composition is a water-based epoxy grout composition which has excellent stain and chemical resistant properties and is workable and easy to clean up after grouting the tiles. The grout composition employs a water dispersible epoxy polymer and a water compatible polyamine epoxy resin adduct as the curing agent in combination with a water repellent component. For colored grouts, a color coated filler such as sand is employed to obtain the enhanced tile grout properties. Luminescent and fluorescent additives and sparkle additives may be used in the grout to provide special visual effects in the light or dark.Type: GrantFiled: January 9, 2003Date of Patent: April 19, 2005Assignee: Laticrete International, Inc.Inventor: Rezvan Rooshenas
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Patent number: 6803414Abstract: A damping resin composition is provided which includes bifunctional diacrylate or bifunctional dimethacrylate (A) expressed by the formula (1) below, and an unsaturated polyester resin (B+C) containing an unsaturated polyester (B) and a cross-linking monomer (C), and/or an epoxy acrylate resin (B′+C) containing an epoxy acrylate (B′) and a cross-linking monomer (C), wherein the bifunctional diacrylate or bifunctional dimethacrylate (A) is contained in an amount of 15 to 85% by weight, and the unsaturated polyester resin (B+C) or the epoxy acrylate resin (B′+C) or a mixture (B″+C) thereof that contains the unsaturated polyester resin (B+C) in an amount of 5 to 95% by weight and the epoxy acrylate resin (B′+C) in an amount of 95 to 5% by weight is contained in an amount of 85 to 15% by weight, the bifunctional diacrylate or bifunctional dimethacrylate (A) being expressed by: CH2=CR2CO−(R1O)n−OCOCR2=CH2 (1) whType: GrantFiled: April 26, 2002Date of Patent: October 12, 2004Assignee: Mitsubishi Fuso Truck and Bus CorporationInventors: Takeshi Honjo, Harushige Yamamura, Tai Uruji, Masayoshi Yamaguchi, Yusuke Koizumi, Hiroshi Hayashi
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Patent number: 6797746Abstract: An ultraviolet radiation curable organic ink composition, comprising 80% to 95% by weight of an epoxy-polyurethane-based ink; 0.5% to 8% by weight of an additive including a mixture of polyethylenic waxes and polythetrafluoroethylenic waxes; 1% to 8% by weight of a blocked aliphatic polyisocyanate catalyst; and an adhesion promoter primer including 0.15% to 3% by weight of a silane, which can be directly included in the ultraviolet radiation curable organic ink composition or independently applied to a substrate, in order that the blocked aliphatic polyisocyanate catalyst promote a polymerization reaction and a crosslinking reaction between the epoxy-polyurethane-based ink and the adhesion promoter, when heated to 160 to 200° C., forming an interpenetration network.Type: GrantFiled: August 9, 2001Date of Patent: September 28, 2004Assignee: Vidriera Monterrey, S.A. de C.V.Inventor: Rodrigo Cavazos-Gutierrez
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Patent number: 6620862Abstract: A sheet resin composition is adhered to a silicon wafer. The sheet resin composition supports the silicon wafer during back grinding and dicing into chips. Further, the sheet resin composition interfacial underfills between a chip from the wafer and a substrate during subsequent fabrication of a semiconductor device, the chip being flip chip mounted to the substrate.Type: GrantFiled: May 8, 2001Date of Patent: September 16, 2003Assignees: Amkor Technology, Inc., Nitto Denko CorporationInventors: Hirotaka Ueda, Masaki Mizutani
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Patent number: 6515048Abstract: An adhesive powder for bonding flat, closed, or porous substrates, the adhesive powder being applied in the first step to a first substrate, an intermediate product that is non-adhesive at room temperature and stable in storage being produced, and the first substrate being bonded to a second substrate in a second step by applying an increased temperature and pressure, as a combination of the following components: i) a thermoplastic polymer having a proportion of 25 to 95% by weight; and ii) at least one epoxy resin that is solid at room temperature and has a proportion of 5 to 75% by weight; and, if desired, iii) at least one pre-adduct of epoxy resins and polyamines that is solid at room temperature and has a proportion of at most 25% by weight, a physical bonding taking place when the adhesive powder is applied to the first substrate in the first step, and the two substrates being bonded in the second step by the powder components being chemically cross-linked or post-cross-linked among one another, and beiType: GrantFiled: June 6, 2001Date of Patent: February 4, 2003Assignee: Firma Carl FreudenbergInventors: Michael Kalbe, Silke Wagener, Peter S. Grynaeus
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Patent number: 6467961Abstract: A lubricating coating compound used for forming a thermosetting synthetic resin lubricating film, wherein a resin composition composed of an epoxy resin, a curing agent, a reactive silicone oil with an epoxy group, and a triazinethiol is dissolved in an organic solvent, wherein if the sum of the epoxy resin and the curing agent is set to 100 parts by weight, the sum of the reactive silicone oil with an epoxy group and the triazinethiol is 2 to 30 parts by weight.Type: GrantFiled: April 13, 2001Date of Patent: October 22, 2002Assignee: Oiles CorporationInventors: Takashi Nakamaru, Yoshiaki Yamamoto, Namiko Kaneko
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Patent number: 6437026Abstract: The invention is directed to novel epoxy molding compounds for the encapsulation of microchips in the electronics industry. Known epoxy molding encapsulants are generally prepared from a blend epoxy resins, phenol hardeners, silica fillers, catalysts, flame retardant materials, processing aids and colorants. The addition of polybenzoxazines as a co-reactant with one or several epoxy resins provides a product with reduced moisture adsorption while maintaining a high glass transition temperature.Type: GrantFiled: January 5, 2001Date of Patent: August 20, 2002Assignee: Cookson Singapore PTE Ltd.Inventor: David William Garrett
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Patent number: 6432488Abstract: A powder coating composition and method of applying it to a substrate, such as medium density fibreboard, consisting of a glycidyl methacrylate resin, a dicarboxylic acid cross-linking agent, a catalyst selected from phosphines, phosphonium, ammonium 2-phenyl-2-imidazoline, substituted imidazoline and isopropyl imidazole Bis-A epoxy resin adduct and a matte texturing agent. The inventive formulation is able to create a matte texture finish on the surface of the substrate. Since the cured final coating is resistant to yellowing and moisture, it is of great utility in the kitchen cabinet making industry.Type: GrantFiled: July 28, 2000Date of Patent: August 13, 2002Assignee: Rohm and Haas CompanyInventors: Andrew T. Daly, Richard P. Haley, Edward G. Nicholl
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Patent number: 6403222Abstract: Waxes, particularly paraffin and microcrystalline waxes, can act as corrosion inhibitors when added at low levels to compositions based on thermosettable resins such as epoxy resins. When such wax-modified thermosettable compositions are used to coat a metallic surface, enhanced protection of the metallic surface against corrosion due to environmental exposure such as salt spray is obtained. The thermosettable compositions are particularly useful in expandable or foamable form for imparting structural reinforcement to hollow metal parts such as automotive components.Type: GrantFiled: September 22, 2000Date of Patent: June 11, 2002Assignee: Henkel CorporationInventor: Bruce L. Harrison
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Patent number: 6280846Abstract: Curable compositions for making fibre-reinforcement structural composites such as GRP comprise an unsaturated polyester resin base, a co-polymerizable monomer and preferably, one or more performance-enhancing additives. Thixotropy is endowed by 5% by weight or less of an organic amide.Type: GrantFiled: August 20, 1999Date of Patent: August 28, 2001Assignee: Cray Valley LimitedInventors: Paul Darby, Paul Sutton
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Patent number: 6245836Abstract: A lubricating coating compound used for forming a thermosetting synthetic resin lubricating film, wherein a resin composition composed of an epoxy resin, a curing agent, a reactive silicone oil with an epoxy group, and a triazinethiol is dissolved in an organic solvent, wherein if the sum of the epoxy resin and the curing agent is set to 100 parts by weight, the sum of the reactive silicone oil with an epoxy group and the triazinethiol is 2 to 30 parts by weight.Type: GrantFiled: March 4, 1999Date of Patent: June 12, 2001Assignee: Oiles CorporationInventors: Takashi Nakamaru, Yoshiaki Yamamoto, Namiko Kaneko
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Patent number: 6162504Abstract: Waste powder prime comprising from about 30 to about 70 weight percent epoxy resin, the balance of the waste powder prime comprising filler, pigment and/or curing agent, is advantageously employed as a replacement for epoxy resins in conventional adhesion promoter systems for polymeric plastisols. The resulting compositions are useful as adhesives and sealants in industrial manufacturing processes such as in the manufacture of automobiles.Type: GrantFiled: November 30, 1998Date of Patent: December 19, 2000Assignee: Henkel CorporationInventors: James F. Hubert, Joseph D. Lukanich
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Patent number: 5906784Abstract: Epoxy resin compositions, comprising(a) an epoxy resin which is liquid at below 160.degree. C. and which has an average of more than one epoxy group in the molecule,(b) a di- or polycarboxylic acid or its anhydride,(c) 0.1-15 % by weight, based on the amount of components (a) and (b), of a wax having a dropping point from 80 to 95.degree. C. and, optionally,(d) customary fillers or modifiers for epoxy resins, are preferably used as epoxy casting resin compositions, in particular for the preparation of moulded articles by the pressure gelation process.Type: GrantFiled: October 28, 1997Date of Patent: May 25, 1999Assignee: Ciba Specialty Chemicals CorporationInventor: Ulrich Weidmann
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Patent number: 5684067Abstract: Low gloss in a coating derived from a polyester/triglycidyl isocyanurate coating powder is achieved by including in the coating powder 2-10 phr ethylene acrylic acid copolymer, 0.2-1.0 phr of a compound selected from 2-mercapto benzothiazole, metal salts of 2-mercapto benzothiazole, such as zinc 2-mercapto benzothiazole, and up to 10 phr polyolefin wax.Type: GrantFiled: January 24, 1996Date of Patent: November 4, 1997Assignee: Morton International, Inc.Inventors: Jeno Muthiah, E. Susanne Deibert
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Patent number: 5468461Abstract: An anticorrosive primer composition comprises (1) 100 parts by weight of an epoxy resin having a number-average molecular weight of from 500 to 10,000, (2) from 10 to 60 parts by weight of an aromatic polyamine containing from 2% to 30% by weight, based on the aromatic polyamine, of a promoter selected from the group consisting of phenol compounds and cresol compounds, (3) from 10 to 60 parts by weight of a polyisocyanate, (4) from 10 to 40 phr, based on the sum of components (1), (2), and (3), of silica particles of colloidal silica or fumed silica or a mixture of these, (5) from 0.5 to 5 phr of a lubricant, and (6) an organic solvent. The composition is particularly suitable for use to apply onto the chromate coating of a chromated, zinc-plated steel sheet.Type: GrantFiled: August 25, 1994Date of Patent: November 21, 1995Assignees: Nippon Paint Co., Ltd., Sumitomo Metal Industries, Ltd.Inventors: Yasushi Hosoda, Toshiaki Shiota, Nobukazu Suzuki, Satoshi Ikeda, Taketosi Odawa, Koichi Kimura, Hisataka Yamamoto
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Patent number: 5432211Abstract: A lubricating paint including a resin mix, a lubricant additive and silica. The resin mix consists of a urethane resin with molecular weight of over 3,000 and an epoxy resin, with the solids of the urethane resin accounting for 50-97 wt % of the solids of the resin mix. The lubricant additive accounts for 2-40 wt % of all of the solids in the lubricating paint. The silica accounts for 5-100 wt % of all of the resin solids in the lubricating paint. The lubricating paint of the invention exhibits improved formability, corrosion resistance (rust resistance) and lubricity as compared with prior art paints. It also has improved weldability, stain resistance and chemical resistance.Type: GrantFiled: February 23, 1994Date of Patent: July 11, 1995Assignee: Nihon Parkerizing Co., Ltd.Inventors: Ryoji Morita, Osamu Furuyama, Shigeo Tanaka
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Patent number: 5380775Abstract: Vinyl ester or polyester resins containing polymerizable, vaporizable, ethylenically unsaturated monomers and an emission suppressing amount of ceresin wax is improved with the addition of a drying oil such as corn oil and an epoxidized drying oil such as epoxidized soybean oil. The improvement is in secondary adhesion.Type: GrantFiled: May 19, 1994Date of Patent: January 10, 1995Assignee: The Dow Chemical CompanyInventors: Terry W. Cowley, Mary L. N. White
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Patent number: 5378743Abstract: This invention relates to a stable, low level styrene emission vinyl ester or unsaturated polyester resin composition containing a nonionic surfactant or a copolymer of maleic acid half ester of a polyethylene glycol and a monoalkenyl aromatic monomer as stabilizing agents.Type: GrantFiled: September 24, 1993Date of Patent: January 3, 1995Assignee: The Dow Chemical CompanyInventor: Rolf F. Liedtke
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Patent number: 5374668Abstract: The present invention relates to a polysulfide based resin lens, comprising a mixture of at least one epoxy resin having at least two epoxy groups, and at least one polythiol compound having at least two mercaptan groups, and at least one internal release agent, which is cast polymerized, and the process for preparing the same.Type: GrantFiled: November 8, 1993Date of Patent: December 20, 1994Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Yoshinobu Kanemura, Katsuyoshi Sasagawa, Masao Imai
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Patent number: 5258151Abstract: In a ceramic or powder-metallurgical molding composition which contains a wax as the binder, the addition of an epoxy resin leads to an improvement in the dry flexural strength and the workability in the green state of the shaped articles produced therefrom.Type: GrantFiled: May 28, 1992Date of Patent: November 2, 1993Assignee: Hoechst AktiengesellschaftInventors: Michael Bayer, Iris Nagl
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Patent number: 5212218Abstract: Improved synthetic resin insulators having enhanced arc track resistance and reduced UV light degradation characteristics are provided which include a continuous resin phase and a discrete, discontinuous hydrophobic phase in the form of discrete, suspended droplets within the resin. The preferred insulators are formed of a continuous epoxy matrix having suspended droplets of petrolatum dispersed therein. The resin phase comprises from about 15 to 50% by weight of the composition, whereas the hydrophobe is present at a level from about 2 to 10% by weight. UV light resistance is improved by predissolving or predispersing a quantity of UV light absorber in the hydrophobe before the latter is mixed with the resin phase. Use of a hydrophobe which is solid at normal temperatures but which melts above about 80.degree. F. (such as petrolatum) results in lower dust attraction during ordinary conditions and the ability to melt and effectively encapsulate surface dust during periods of increased arcing activity.Type: GrantFiled: October 15, 1991Date of Patent: May 18, 1993Assignee: A. B. Chance CompanyInventor: William M. Rinehart
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Patent number: 5202365Abstract: The problem of the potential for creation of a reactive noncompressible crust in a fluid adhesive mixture comprising a deposit of an uncured curable fluid curable resin composition and a deposit of a fluid curing agent wherein the deposits are separated by a thin flexible barrier film formed from the interaction of the cured resin as reacted by the curing agent, is overcome by including with the fluid curing agent a thickener in an amount sufficient to render the fluid curing agent non-free-flowing at room temperature and preventing the formation of any substantial amount of noncompressible crust in the mixture.Type: GrantFiled: June 13, 1991Date of Patent: April 13, 1993Assignee: Reactive Industries, Inc.Inventor: Richard B. Wallace
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Patent number: 5165989Abstract: An essentially tack free prepreg article, characterized by a shelf life at about 25.degree. C. of at least about three months, and method of making the same are provided. The prepreg article comprises at least one network of fibers which has been impregnated with a solution of a resin in styrene and a catalyst. The resin is curable by the catalyst at a temperature above about 90.degree. C. The impregnated network is dried for a length of time and at a temperature sufficient to reduce the styrene content to less than about 1% by weight of the impregnated network without curing the resin. The prepreg article can subsequently be used as a component in a molded composite.Type: GrantFiled: December 4, 1989Date of Patent: November 24, 1992Assignee: Allied-Signal Inc.Inventors: Ashok Bhatnagar, David S. Cordova, Leroy C. Lin
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Patent number: 5166229Abstract: Epoxy resin composition containing an epoxy resin and an organic gelling agent selected from a polyamide wax, a castor oil wax, a sorbitol derivative and an amino acid derivative, which is in the gel form and is optionally further incorporated with a latent curing agent and an electrically conductive material. Said epoxy resin composition has excellent adhesion strength even under heating and excellent shower resistance and wiping properties and is useful as an adhesive, particularly as a structural adhesive in an assembly line of automobiles.Type: GrantFiled: November 13, 1989Date of Patent: November 24, 1992Assignee: Sunstar Giken Kubushiki KaishaInventors: Takahiro Nakano, Toshimori Sakakibara
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Patent number: 5095046Abstract: A heat curable hot melt adhesive system is disclosed. The system uses an epoxy-crosslinking ethylene polymer component, a tackifier compatible therewith and an epoxy crosslinking agent having an epoxide functionality of at least 2. The ethylene polymer component may be either an ethylene copolymer of an .alpha.,.beta.-ethylenically unsaturated carboxylic acid, or an ethylene copolymer of an ethylenically unsaturated alcohol used in combination with a dicarboxylic acid anhydride. The dicarboxylic acid anhydride and/or the epoxy can be encapsulated to inhibit premature crosslinking. The formulation is applied to a substrate surface as a hot melt at a moderate temperature, and subsequently cured by heating the adhesive composition to a higher curing temperature.Type: GrantFiled: February 6, 1990Date of Patent: March 10, 1992Assignee: Exxon Chemical Patents Inc.Inventor: Mun F. Tse
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Patent number: 4918120Abstract: A composition for reducing styrene monomer emissions in DCPD resins, while maintaining good interlaminate adhesion, comprising,(a) 0.001 to 1.0% by weight of a paraffin,(b) 0.001 to 3.0% by weight of an intermediate bonding promoter comprising the reaction product of(i) a saturated or unsaturated fatty acid containing 5 to 30, and preferably 10 to 20 carbon atoms,(ii) a mono- or diepoxy compound,(c) 0.0 to 10% by weight of alpha-methyl styrene, and(d) 0.0 to 1.0% by weight of a copper salt,wherein said composition results in styrene emission rates of 60 grams/square meter or less measured one hour after gelation, and retains at least 80% to 90% of the interlaminate adhesion properties of an unmodified resin.Type: GrantFiled: February 3, 1988Date of Patent: April 17, 1990Assignee: Reichhold Chemicals, Inc.Inventors: Douglas G. Vanderlaan, Wolfgang C. Forster
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Patent number: 4851269Abstract: Industrial high speed paint rollercoating processes are improved by the addition of wax particles to thermosetting rollercoatings. Wax particles having a particle size less than 50 microns and a softening point above 175.degree. F. are dispersed into the rollercoating compositions to provide highly desirable antiflashing properties during the rollercoating process.Type: GrantFiled: March 14, 1988Date of Patent: July 25, 1989Assignee: The Glidden CompanyInventors: Raymond E. Meyers, Albert S. Kukuca
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Patent number: 4767017Abstract: A filament-wound pressure vessel constructed of a rigid composite of an epoxy resin matrix reinforced with continuous filaments of a p-aramid coated with an adhesion modifier.Type: GrantFiled: April 16, 1987Date of Patent: August 30, 1988Assignee: E. I. Du Pont de Nemours and CompanyInventors: Francis M. Logullo, Sr., Yun-Tai Wu, George E. Zahr
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Patent number: 4756935Abstract: A primer composition for metallic material comprising (a) a urethane epoxy ester resin having primary hydroxyl groups and a number average molecular weight of 6000 to 12,000, (b) a chromate anticorrosive pigment and (c) a polyethylene wax having a density of 0.94 or more, a molecular weight of 1000 to 10,000 and an acid value of 15 or less (KOH mg/g), the pigment volume concentration being 24 to 45% of the total solids of the composition.A chemical pretreatment on various metallic materials for improvements in scratch resistance, corrosion resistance and the like can be obviated by the use of said primer composition.Type: GrantFiled: September 12, 1986Date of Patent: July 12, 1988Assignee: Nippon Paint Co., Ltd.Inventors: Masaaki Takimoto, Tamotsu Sobata, Shinji Nakano, Yuichi Yoshida
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Patent number: 4619953Abstract: Low styrene emission vinyl ester resin compositions containing a polyacrylate as an adhesion promoter. Said VER composition exhibits desirable physical properties such as low styrene emission and excellent adhesive bond strength.Type: GrantFiled: September 9, 1985Date of Patent: October 28, 1986Assignee: The Dow Chemical CompanyInventors: John A. Schols, Kee C. Yu
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Patent number: 4614674Abstract: Addition of waxes or wax-like substances, in conjunction with metal salts or metal complexes of organic compounds, to powder coating compositions based on epoxy resins and carboxyl-terminated polyesters affords a matting effect without substantially impairing the other properties of said coating composition.Type: GrantFiled: May 3, 1985Date of Patent: September 30, 1986Assignee: Ciba-Geigy CorporationInventor: Horst Lauterbach
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Patent number: 4609693Abstract: Low styrene emission vinyl ester resin compositions containing a drying oil as an adhesion promoter, such as linseed oil. Some VER composition exhibits desirable physical properties such as low styrene emission and excellent adhesive bond strength.Type: GrantFiled: June 3, 1985Date of Patent: September 2, 1986Assignee: The Dow Chemical CompanyInventors: John A. Schols, KeeChung Yu
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Patent number: 4604325Abstract: Non-aqueous coatings for glass fibers consist essentially of a cycloaliphatic epoxy resin, an ethylene-ethylacrylate copolymer, a microcrystalline wax, a phenolic-modified terpene resin, and an organosilane. Glass fibers coated with the composition of the present invention are suitable for being utilized as reinforcement media for various polymeric resins including nylon, rubber modified styrene-maleic anhydride copolymer, acetal, and polybutyl terphthalate.Type: GrantFiled: May 10, 1985Date of Patent: August 5, 1986Assignee: Owens-Corning Fiberglas CorporationInventors: Jean-Claude Pollet, Gordon P. Armstrong, Martin C. Flautt
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Patent number: 4595716Abstract: Provides new and improved water-reducible coating compositions and methods of making them. Three preferred processes are disclosed. These differ in the manner of incorporating and chemical nature of an extender polymer.Broadly, the process of the invention is one for forming an aqueous dispersion of a fluent resinous composition ofa. a mixture in an organic solvent of(i) an ionizable graft polymer of an epoxy resin and an addition polymerized resin, the addition polymerized resin being bonded to aliphatic backbone carbon atoms of the epoxy resin by carbon-to-carbon bonds, and(ii) an extender resin;b. an aqueous vehicle, andc. an ionizing agent;the ionization present from said combined components being sufficient to establish the components as a dispersion in the aqueous vehicle, and then addition polymerizing a quantity of addition polymerizable monomer, under addition polymerizing conditions, in said aqueous dispersion, the aqueous dispersion serving as a vehicle therefor.Type: GrantFiled: August 30, 1984Date of Patent: June 17, 1986Assignee: SCM CorporationInventors: James T. K. Woo, Vincent W. Ting, Richard M. Marcinko
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Patent number: 4456713Abstract: A composition for injection molding a sinterable material such as silicon nitride.This composition includes a binder system which imparts a greater flexibility to the, as molded, green body. The binder-system contains a major component of paraffin wax, a minor component of epoxy resin, and a surfactant.Type: GrantFiled: December 20, 1982Date of Patent: June 26, 1984Assignee: GTE Laboratories IncorporatedInventors: Kenneth W. French, Jeffrey T. Neil, Larry L. Turnbaugh
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Patent number: 4451591Abstract: This invention provides a two-component coating composition wherein:Component A contains a liquid polyglycidyl ether of a bisphenol having an epoxy equivalent weight between about 170 and about 200; an aluminum paste and optionally, a thixotropic agent; a coumarone-indene resin and/or silica gel; andComponent B contains a fatty acid polyamide; a fatty acid diamine salt; and, optionally, a coumarone-indene resin, microcrystalline silica; 2,4,6-tris-(dimethylaminomethyl) phenol; zinc phosphate and/or talc.Type: GrantFiled: June 16, 1982Date of Patent: May 29, 1984Assignee: Mobil Oil CorporationInventors: Henry A. Kozak, Tony Y. Liu
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Patent number: 4448913Abstract: Polyethylene terephthalate molding compositions characterized by rapid crystallization are provided by combining polyethylene terephthalate and a filler or reinforcing agent with a crystallization-rate promoter comprising sodium benzoate and a poly-alpha-olefin such as low density polyethylene. A flame retardant material is provided by the addition of flame retardant additives.Type: GrantFiled: October 29, 1982Date of Patent: May 15, 1984Assignee: Dart Industries Inc.Inventors: Ernest A. Coleman, Kevin J. Cronin, Frank K. Chu, Robin W. Kirwan
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Patent number: 4427803Abstract: A mold release composition consisting essentially of:(A) a fluorine-containing polyether comprising 3-perfluoroalkyl-1,2-epoxypropane having the formula ##STR1## wherein R.sub.f represents a perfluoroalkyl group containing from 5 to 13 carbon atoms and(B) at least one additive selected from the group consisting of a silicone oil, silicone varnish, a wax and a highly fluorinated organic compound having a boiling point above 100.degree. C.Type: GrantFiled: May 3, 1983Date of Patent: January 24, 1984Assignee: Daikin Kogyo Co., Ltd.Inventors: Shoshin Fukui, Masayoshi Shinjo, Hirokazu Aoyama
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Patent number: 4386173Abstract: This invention relates to a sprayable hot melt corrosion preventative composition and process for making the composition. The composition is characterized by comprising: (1) between about 10 and about 25 parts by weight of an epoxy resin elastomer adduct mixture, (2) between about 10 and about 25 parts by weight microcrystalline wax; and (3) between about 50 and about 80 parts by weight of a dispersion of petroleum sulfonate complex in nonvolatile diluent oil. The total weight of (1), (2) and (3) is 100 parts. The composition may additionally comprise up to about 20 parts by weight of optional materials such as pigments, fillers, and/or additional nonvolatile oil. The process for making the composition includes providing the adduct material which is maintained at an elevated temperature, blending the wax therein, heating the dispersion and adding thereto the adduct-wax mixture.Type: GrantFiled: April 23, 1982Date of Patent: May 31, 1983Assignee: Ford Motor CompanyInventor: Yun F. Chang
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Patent number: 4342674Abstract: This invention provides a two-component coating composition wherein:Component A contains a polyglycidyl ether of a bisphenol having an epoxy equivalent weight between about 170 and about 200 diluted with between about 10 weight percent and about 20 weight percent of butyl glycidyl ether; an organic thixotropic agent; a liquid polyglycidyl ether of a bisphenol having an epoxy equivalent weight between about 170 and about 210; a coumarone-indene resin having a softening point between about 40.degree. F. and about 60.degree. F.; a urea-formaldehyde resin; leafing aluminum paste; and 2-nitropropane; andComponent B contains a polyamide having a base number between about 300 and about 360; N-oleyl-1,3-propylenediamine oleate; a coumarone-indene resin having a softening point between about 40.degree. F. and about 60.degree. F.; microcrystalline silica; and 2,4,6-tris-(dimethylaminomethyl) phenol.Type: GrantFiled: April 22, 1981Date of Patent: August 3, 1982Assignee: Mobil Oil CorporationInventor: Roger E. Morgan
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Patent number: 4335220Abstract: Disclosed are compositions comprising an aqueous dispersion of a finely divided organic substance and a sequestering agent. The sequestering agent is a linear, water-dissipatable polymer having an inherent viscosity of at least about 0.1 and comprising the reaction products of the following components or ester forming or esteramide forming derivatives thereof;(a) at least one dicarboxylic acid;(b) at least one difunctional sulfomonomer containing at least one metal sulfonate group attached to an aromatic nucleus wherein the functional groups are hydroxy, carboxyl or amino; and(c) a glycol or a mixture of a glycol and diamine having two --NRH groups, the glycol containing two --CH.sub.2 --OH groups of which from at least 0.1 mole percent based on the total mole percent of hydroxy or hydroxy and amino equivalents, is a poly(ethylene glycol) having the structural formula:H--(--OCH.sub.2 --CH.sub.2 --)--.sub.Type: GrantFiled: April 6, 1981Date of Patent: June 15, 1982Assignee: Eastman Kodak CompanyInventor: Charles H. Coney