Abstract: The fixing resin composition for use in a rotor includes a thermosetting resin (A) containing an epoxy resin, a curing agent (B), and an inorganic filler (C), wherein the content of the inorganic filler (C) is equal to or more than 50% by mass, based on 100% by mass of the total content of the fixing resin composition.

Abstract: There are provided an adhesive resin composition for a HDD motor and a HDD motor fabricated using the same. The adhesive resin composition for a HDD motor includes: 25 to 35 parts by weight of a bisphenol E-epoxy resin; 10 to 25 parts by weight of an epoxy resin; 10 to 20 parts by weight of mercaptan; and 5 to 15 parts by weight of imidazole. The constituents of an epoxy adhesive material may be controlled, such that a curing speed may be increased, as compared to the case of the related art, thereby enhancing working efficiency and reliability.

Abstract: A liquid epoxy resin composition for semiconductor encapsulation comprising: (A) at least one epoxy resin, (B) at least one curing accelerator and (C) at least one acid anhydride terminated polyamic acid. The liquid epoxy resin composition provides a cured material that has an excellent adhesiveness to a semiconductor chip surface and has an excellent moisture resistance.

Abstract: A resin composition for laser engraving that comprises (Component A) an epoxy resin; (Component B) an epoxy resin curing agent; and (Component C) a silica, Component B comprising an amine curing agent having an amine value of no greater than 0.01 eq/g or an acid anhydride curing agent having an acid anhydride value of no greater than 0.0050 eq/g.

Abstract: Disclosed is an epoxy resin composition essentially containing (A) an epoxy resin having a structure represented by the general formula (1), (B) a curing agent, (C) an inorganic filler and (D) a cyanate resin and/or a prepolymer thereof, wherein Ar represents a fused aromatic hydrocarbon group; r is an integer of 1 or more; X is a hydrogen or an epoxy group (glycidyl ether group); R1 represents one selected from the group consisting of a hydrogen, a methyl group, an ethyl group, a propyl group, a butyl group, a phenyl group and a benzyl group; n is an integer of 1 or more; p and q are an integer of 1 or more; and p's and q's in respective repeating units may be the same as or different from one another.

Abstract: A phosphorous flame retardant primarily includes hexachlorotriphosphazene (HCP) having poly(oxyalkylene)amine substitutes. The poly(oxyalkylene)amine includes at least two end groups. The phosphorous flame retardant can further include layered silicate clay. The layered silicate clay can be intercalated and modified with the poly(oxyalkylene)amine substitutes of HCP to effectively promote thermal stability. The flame retardant, phosphazene-poly(oxyalkylene)amine adducts, can be applied to a polymer. By the cross-linking between them, the flame-retarding property of the polymer can be improved. Also provided is a method for producing the flame retardant of phosphazene-poly(oxyalkylene)amine adducts and application thereof to a polymer.

Abstract: A functional particle (100) contains an inorganic particle (101), a first layer (103) coating the inorganic particle (101), and a second layer (105) coating the first layer (103). Any one or two component(s) of a resin, a curing agent and a curing accelerator is (are) contained in the first layer (103), and the others are (is) contained in the second layer (105).

Abstract: Provided are a resin composition for the manufacture of marble chips including a halogenated epoxy resin binder and showing high heat resistance, high chemical resistance, high impact resistance, high specific gravity and high transparency, a marble chip manufacturing method using the resin composition and an artificial marble made from marble chips.

Abstract: An end-face sealing agent for display devices, which consists of a resin composition containing (1) a liquid epoxy resin, (2) an epoxy resin curing agent that is liquid at 23° C. and that is selected from the group consisting of acid anhydrides and thiol compounds having two or more mercapto groups in the molecule, (3) a secondary or tertiary amine that is solid at 233° C., or microcapsules that contain a secondary or tertiary amine therein, and (4) a filler, and in which the content of the component (4) is 50 to 150 parts by weight relative to 100 parts by weight of the sum total of the components (1), (2) and (3), and the viscosity as determined using an E-type viscometer at 253° C. and 2.5 rpm is 0.5 to 50 Pas.

Abstract: The present invention provides a halogen-free flame retardant resin composition, and, a prepreg, a laminate, and a laminate for printed circuit that are made from the halogen-free flame retardant resin composition. The halogen-free flame retardant resin composition comprises: (A) 40-80 parts by weight of the mixture of a phenoxyphosphazene compound (A1) and a dihydrobenzoxazine ring-containing compound (A2), and, the weight ratio between the phenoxyphosphazene compound (A1) and the dihydrobenzoxazine ring-containing compound (A2) being between 1:10 and 1:2; (B) 15-45 parts by weight of a polyepoxy compound; (C) 5-25 parts by weight of a phenolic resin type hardener; and (D) 0.1-1 parts by weight of an imidazole type compound as the curing accelerator.

Abstract: Disclosed herein is an epoxy resin composition including a core-shell structure of microemulsion silica surrounded by surfactant. By using the epoxy resin, surface roughness of a printed circuit board can be formed in an ecofriendly and economic manner. Further, high-reliability microcircuits can be realized by enhancing interface adhesive strength between a resin substrate and a metal layer in a buildup type printed circuit board.

Abstract: The present invention relates to artificial marble including chips of plate-shaped waste glass and a method for fabricating the same. The method includes preparing chips of plate-shaped waste glass having a thickness of 0.6 mm or less and a large diameter of 20 mm or less using thin plate glass as a waste product generated in production of an LCD backlight unit, and adding the chips to a base compound including at least one polymer resin and an additive. The prepared artificial marble has an outer appearance similar to that of natural stone, a surface having excellent properties, and optimum characteristics when used as an interior material for floors, walls, kitchens, and the like.

Abstract: A spherical ? type crystal silicon carbide powder having an average particle diameter is of 5 ?m-60 ?m, specific pore volume of the inside pores in it having a diameter of 1 ?m or smaller is 0.02 cc/g or smaller, specific surface area of it is 1 m2/g or smaller, and average aspect ratio (short diameter/long diameter) of it is 0.65 or higher is proposed; a method for manufacturing the same including the steps of (1) spray-drying a slurry of a raw material silicon carbide powder which has an average particle diameter of 1 ?m or smaller and has an ? type crystal, to obtain porous and spherical particles, and (2) sintering the thus obtained porous and spherical particles, is also proposed.

Abstract: A resin composition for obtaining a cured resin material exhibiting improved heat resistance and a higher glass transition temperature is disclosed. The resin composition contains a resin selected from a) a thermosetting resin and a curing agent, or b) a thermoplastic resin, and an inorganic filler with an average particle diameter of 1000 nm or less.

Abstract: An epoxy resin contains at least a bisphenol-F-type epoxy resin, a latent hardener, and a thixotropic agent. When the amount of the bisphenol-F-type epoxy resin is 100 parts by mass, the amount of the thixotropic agent is in the range of 3.0 parts by mass to 5.0 parts by mass.

Abstract: A composite material, which can be used as an encapsulant for an ultraviolet device, is provided. The composite material includes a matrix material and at least one filler material incorporated in the matrix material that are both at least partially transparent to ultraviolet radiation of a target wavelength. The filler material includes microparticles and/or nanoparticles and can have a thermal coefficient of expansion significantly smaller than a thermal coefficient of expansion of the matrix material for relevant atmospheric conditions. The relevant atmospheric conditions can include a temperature and a pressure present during each of: a curing and a cool down process for fabrication of a device package including the composite material and normal operation of the ultraviolet device within the device package.

Abstract: Prepreg that contains epoxy resin compositions that include an epoxy resin component and a curative powder comprising particles of 4,4?-diaminobenzanilide (DABA) wherein the size of the DABA particles is less than 100 microns and wherein the median particle size is below 20 microns.

Abstract: A curable epoxy resin composition including at least an epoxy resin component and a hardener component, and optionally further additives, wherein: (a) the epoxy resin component is an epoxy resin compound or a mixture of such compounds; (b) the hardener component includes (b1) an aliphatic and cycloaliphatic or aromatic polycarbonic acid anhydride; and (b2) a polyether-amine of the general formula (I), H2N—(CnH2n—O)m—CnH2n—NH2, wherein n is an integer from 2 to 8; and m is from about 3 to about 100; (c) the polycarbonic acid anhydride [component (b1)] is present in the curable epoxy resin composition in a concentration of 0.60 Mol to 0.93 Mol; and (d) the polyether-amine of the general formula (I) [component (b2)] is present in the curable epoxy resin composition in a concentration of about 0.02 Mol to about 0.1 Mol.

Abstract: A light guiding liquid glue and a touch sensitive display using the same are provided. The light guiding liquid glue includes a liquid glue and a plurality of light guiding particles dispersed in the liquid glue, wherein volume percent of the light guiding particles in the light guiding liquid glue ranges between 10% and 50%. The light guiding particles have a light scattering property, which can transfer a linear light into a flat light, and therefore the light guiding liquid glue of the present disclosure has a light guiding property. The touch sensitive display includes a display panel and a touch panel.

Abstract: The invention is based on the discovery that adhesive compositions containing certain low-viscosity, mono-ethylenically unsaturated monomers have surprisingly good cure parameters, resulting in very little weight loss upon cure. Many of these monofunctional monomers used alone or in combination with other monofunctional monomers described herein have high glass transition temperatures when cured. Moreover, since these monomers are monofunctional the crosslink density of the adhesive composition does not increase (relative to multi-functional monomers), which in turns results in lower stress, lower modulus adhesive compositions. As such, these monomers are useful in a variety of thermoset adhesive compositions, such as for example, die attach adhesive compositions.

Abstract: A low dielectric resin varnish composition for laminated printed circuit boards, wherein the resin composition includes (A) Dicyclo-pentadiene-Phenolic Novolac resin (abbreviated as DCPD-PN); or (B) at least one kind of dicyclopentadiene Phenolic Novolac Epoxy resins(DCPD-PNE, referred to as Resin 1); or (C) a novel Dicyclopentadiene-Dihydrobenzoxazine resin (DCPD-BX, referred to as Resin 2); and (D) Flame retardant agent, curing agent and accelerating agent solutions.

Abstract: A curable composition comprising (A) a resin component, comprising (i) an epoxy compound, (ii) a diluent, and (Hi) a first filler and (B) a hardener component, comprising (iv) a curing agent, (v) a second filler, and (vi) a non-reactive polyether block copolymer additive. The resin component and hardener component each having a viscosity of no greater than 30 Pascal-second under an applied shear of 10 reciprocal seconds at 25 degrees Celsius and the curable composition after 120 seconds of mixing the resin component and hardener component together under an applied shear of 10 reciprocal seconds has a viscosity of at least 100 Pascal-second at 25 degrees Celsius.

Abstract: A pulverizing apparatus is a gas stream type pulverizing apparatus. The pulverizing apparatus has a pulverizing unit for pulverizing a composition, a cooling device, a high-pressure air generating device and a collecting unit for receiving the pulverized composition. The chamber has a bottom portion, an outlet formed in the bottom portion for discharging the pulverized first composition therethrough and a wall portion formed in the bottom portion so as to surround the outlet. A plurality of first nozzles and a second nozzle are provided on a side portion of the chamber and a tubular supply unit is provided on an upper portion of the second nozzle. The gas pressure supplied into the chamber is 0.3 MPa or more, the gas temperature is 20° C. or less, and the humidity of the gas is 40% RH or less.

Abstract: A resin composition is provided. The resin composition comprises: an epoxy resin; a hardener, which comprises a melamine derivative of Formula I: wherein, R is the same with or different from each other and has the formula of R1 and R2 are individually selected from a group consisting of H, a halogen, a substituted or unsubstituted C1-C15 alkyl group, a substituted or unsubstituted C1-C15 aloxy group, a substituted or unsubstituted. C3-C15 cycloalkyl group, a substituted or unsubstituted C6-C20 aryl group, a substituted or unsubstituted C6-C20 aryloxy group, a substituted or unsubstituted C1-C15 unsaturated hydrocarbyl group, a naphthol group, a phenanthrenol group, and a dicyclopentadiene group, with a proviso that R2 is not H; and m is 1 or 2, wherein the amount of the hardener is about 20 parts by weight to about 150 parts by weight per 100 parts by weight of the epoxy resin.

Abstract: The present invention is relative to a heat-curable coating composition forming transparent tintable abrasion-resistant coatings, said compositions comprising, in an aqueous or hydro-organic solvent: (A) a hydrolysate of an epoxy-functional silane compound containing at least two alkoxy groups, (B) colloidal silica having an average particle diameter of 1 to 100 ?m, (C) an aluminium chelate compound of formula Al(O—C1-4 alkyl)nY3-n wherein n is 0, 1 or 2 and Y is a ligand selected from the group consisting of M-C(?O)—CH2—C(?O)-M and M-C(?O)—CH2—C(?O)O-M, wheren each M is independently a C1-4 alkyl group, and (D) a hydrolysate of a silylated poly(tetrahydrofurane) of formula (Ia) or (Ib) said heat-curable composition not containing any multifunctional cross-linking agents selected from the group consisting of multifunctional carboxylic acids and multifunctional anhydrides.

Abstract: The invention relates to water-in-oil (W/O) or oil-in-water (O/W) emulsions containing an oil phase of at least one water-insoluble constituent; an aqueous phase; pyrogenic silica at the oil-water interface, the pyrogenic silica partially silylated such that non-silylated surface silanol groups remaining are between 95% and 5% of initial silanol groups, the equivalent of 1.7 to 0.1 surface SiOH groups per nm2, a surface energy gamma-s-D of 30 to 80 mJ/m2, and a specific BET surface area between 30 and 500 m2/g; and optionally other substances, such as pigments or preservatives. The inventive emulsions have a mean particle size of the dispersed phase, of between 0.5 ?m and 500 ?m, and are of low viscosity.

Abstract: An epoxy resin composition for printed wiring board, characterized by containing (A) an epoxy resin component containing an epoxy resin (A-1) having nitrogen and bromine atoms in the same molecule, (B) a phenolic curing agent component containing a phenol resin (B-1), and (C) a curing accelerator component containing an imidazole-silane compound (C-1).

Abstract: A process for treating a tailings stream comprises (a) contacting (1) a gelling agent and (2) an activator with said tailings stream to produce a gel; (b) entrapping solids including sand and clay, and other solid particles with the gel; and (c) allowing the gel to strengthen and solidify to produce a trafficable deposit; wherein the tailings stream comprises water and solids, which solids comprise sand, clay and other solids particles, and wherein 5% by volume to 100% by volume of the solids have a particle size less than 0.05 mm, based on the total volume of the solids. The process may further comprises spreading the gel produced in step (a) or the trafficable deposit produced in step (c) over a surface. The present invention is particularly useful to treat tailings streams produced in processes to extract bitumen from oil sands ores.

Abstract: Dispersions of nanoparticles in a resin component are described. The nanoparticles have a multimodal particle size distribution including at least a first mode and a second mode. The number average particle diameter of the particles in the first mode is greater than the number average particle size distribution in the second mode. The use of multimodal nanoparticle size distributions and the relative number of particles in the first and second mode to reduce or eliminate particle stacking behavior is also described.

Abstract: A product and method for repairing holes and cracks in roads, parking lots, sidewalks and other similar surfaces using a mixture of powder coating (i.e. dry paint) and a filler. The first step is to obtain the powder coating material. Any suitable powder coating material may be used, however, it is preferable to use the excess or waste powder coating material obtained from a powder coating operation. The next step is to mix the powder coating material with a filler, such as sand, pea gravel, or another suitable material. After the components are mixed together, it is applied to a surface needing repair such as a pothole in a road or a crack in a sidewalk. The mixture is cured by heating the mixture to the point where the powder coating melts and binds the powder coating with the filler and the surface needing repair. It may be cured before or after it is applied to the surface needing repair. After the mixture cures, the result is a high quality patched surface.

Abstract: A phosphorous flame retardant primarily includes hexachlorotriphosphazene (HCP) having poly(oxyalkylene)amine substitutes. The poly(oxyalkylene)amine includes at least two end groups. The phosphorous flame retardant can further include layered silicate clay. The layered silicate clay can be intercalated and modified with the poly(oxyalkylene)amine substitutes of HCP to effectively promote thermal stability. The flame retardant, phosphazene-poly(oxyalkylene)amine adducts, can be applied to a polymer. By the cross-linking between them, the flame-retarding property of the polymer can be improved. Also provided is a method for producing the flame retardant of phosphazene-poly(oxyalkylene)amine adducts and application thereof to a polymer.

Abstract: Formulations containing a mixture of an epoxy resin and an ionic liquid or an adduct of an epoxy resin and an ionic liquid which may initiate curing of the epoxy resin, the mixture having nano-materials dispersed or dissolved therein. These formulations can be used for the preparation of nanocomposites. Methods of preparing nanocomposites by curing a dispersion of nano-materials in a mixture of an epoxy resin and an ionic liquid or an adduct of an epoxy resin and an ionic liquid which may initiate curing of the epoxy resin. Nanocomposites comprising a cured product formed by curing an epoxy resin with an ionic liquid or an adduct of an epoxy resin and an ionic liquid having nano-materials dispersed or dissolved therein. Embodiments of the invention permit manufacture of nanocomposites having relatively high fracture toughness, relatively high loadings of nano-materials and the ability to tailor the properties of the nano-composites.

Abstract: A coating for a substrate is a cured coating composition which includes binder and particles, wherein the particles are inorganic, organic or organo-metallic; have diameters between about 1 and 500 nm; may be treated with a surface modifer; and wherein the cured coating composition is in direct or indirect contact with the substrate.

Abstract: The invention provides an epoxy nanocomposite material for dental therapy, which can be applied to direct or indirect clinical restoration, dental core-post system, and dental brace etc. The epoxy nanocomposite filling material provided by the invention can be polymerized with various curing agents to form the polymer with low shrinkage.

Abstract: According to the invention, a mold for measuring flow characteristics which is used to measure the flow characteristics of a resin composition, which is a measurement subject, by injecting the resin composition into a flow path provided in the mold, in which the minimum distance from the cross-sectional center of gravity to the outline in the cross-sectional shape of the flow path is equal to or more than 0.02 mm and equal to or less than 0.4 mm, and a method for measuring flow characteristics in which a resin composition, which is a measurement subject, is injected into the flow path of the mold for measuring flow characteristics, and made to flow in a single direction, and the flow distance from the start point to the end point of the flow of the resin composition is obtained as the flow length are provided.

Abstract: Enhanced media transport systems and structures are provided for printing environments. Enhanced vacuum table structures and associated methods may also be implemented for a variety of printer systems. Enhanced rail systems and associated carriage structures may preferably be used within a variety of printing environments, such as for but not limited to grand scale printers. Water-based binary epoxy ink compositions and associated processes provide adhesion and material compatibility that exceeds that of currently available UV curable products, while providing ultra-low volatile organic carbon (VOCs), and no hazardous air pollutants (HAPs). An integrated system and method for identification of consumables through a central database may also be implemented within different printing systems.

Abstract: The invention relates to a curable composition comprising one or more epoxy compounds, one or more anionically curing catalysts, and an addition of one or more dendritic polymers, selected from the group consisting of the dendritic polyester polymers, the dendritic polyesteramide polymers, and the dendritic polymers based on 1,3,5-tris-alkanol-substituted cyanuric acid. These dendritic polymers improve mechanical properties, in particular the toughness of the cured epoxy resin.

Abstract: Corrosion and chip-resistant coatings for high tensile steel components, such as automotive coil springs, can be formed from a coating composition comprising a primer having an epoxy resin with the proviso that the epoxy resin does not have an EEW of about 860 to about 930, a polyhydroxyl functional phenolic curing agent having a HEW of about 200 to about 500, and a platy filler. The primer contains less than 20 wt % zinc. The topcoat includes an epoxy resin having an epoxy equivalent weight of about 450 to about 1400, an elastomer-modified epoxy resin having an epoxy equivalent weight of about 1000 to about 1600, a foaming agent and a reinforcing fiber.

Abstract: Disclosed are coatings comprising a matrix material and nanoscale bodies disposed within the matrix material. Also provided are methods of forming such coatings.

Abstract: This invention relates to curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition comprises an aromatic compound having meta-substituted reactive groups and a cationic or radical initiator.

Abstract: The present invention relates to a reinforced composite material and a method for its production. The composite material comprises at least one cured resin having a reinforcing material. Preferably the reinforcing material is a plurality of glass fibres which are treated such that the properties of the interphase substantially surrounding each fibre are substantially equivalent to those of the bulk cured resin. The fibre treatment may be selected from the group consisting of a polymeric coating, a hydrophilic surface coating, a surface coating of a free radical inhibitor, or a reduction in the total surface area of the fibres. The reinforced composite material of the invention provides improved long-term mechanical properties compared to traditional glass fibre reinforced materials.

Abstract: A vibration-damping sheet includes a resin layer having a glass transition temperature of more than 140° C. and 180° C. or less, and a constraining layer laminated on the resin layer.

Abstract: The present invention relates to a process for the production of a ready-to-use epoxy composition having a filler content of at least 55 vol.-%, relative to the complete ready-to-use epoxy composition, which comprises: providing a liquid A, which comprises at least one epoxy resin, providing a liquid B, which comprises at least one curing agent, providing a solid component C, which comprises at least one filler, wherein in a first step one of the liquids A or B is filled in a mixing container, in a second step the solid component C is deposited on top of the liquid in the mixing container, in a third step the remaining liquid A or B is deposited on top of the solid component C, and in a fourth step the components are mixed to obtain the ready-to-use epoxy composition.

Abstract: Provided are amorphous silica particles for application to industrial fields where there are increasing desires for high purity and colorlessness. The amorphous silica particles are produced through the steps of hydrolysis of an alkoxide, vacuum drying, and firing. The amorphous silica particles have been reduced in coloration and in Fe content, which is causative of coloration of the silica, and can meet the desires. The amorphous silica is characterized by having an Fe content of 20 ppm or less.

Abstract: A thermosettable composition including: (a) at least one thermosetting resin; (b) at least one curing agent for the at least one thermosetting resin; (c) at least one high aspect ratio filler; wherein the aspect ratio of the filler is higher than 5:1; and (d) optionally, at least one catalyst for polymerization, including homopolymerization, of the at least one thermosetting resin; or optionally, at least one catalyst for a reaction between the at least one thermosetting resin and the at least one curing agent.

Abstract: A process for making a molded composite comprising the following steps: reacting a reaction mass containing a polyepoxide, in the proportion of about 20% to 50% with respect to the reaction mass, a diol, in the proportion of about 10% to 20% with respect to the reaction mass, a hardener, in the proportion of about 20% to 50% with respect to the reaction mass, in the presence of an accelerator in the proportion of about 0.5 to 10.0% with respect to the reaction mass either alone or in solution with compatible diluents, to obtain an epoxy resin mix having intrinsic viscosity in the range of 100 to 850 cPs, pouring the resin mix in a mold having an in-situ glass fiber scaffold at a mold temperature in the range of 45 to 50 C. and applying pressure to the resin mix in the mold to form a compressed green composition: partially curing the compressed green composition at a temperature in the range of 60 to 80 C.

Abstract: The present invention provides a liquid resin composition for electronic components, which is excellent in migration resistance and also superior in formability and reliability, as well as an electronic component device sealed therewith, and relates to a liquid resin composition for electronic components, which comprises (A) an epoxy resin, (B) a cyclic acid anhydride which is liquid at ordinary temperature and has an acid anhydride equivalent of 200 or more, and (C) a coupling agent.

Abstract: A method comprising preparing a solution of clay particles solution, submitting the solution of clay particles first to a high pressure and high velocity flow for shearing the particles in the solution of clay particles, and to a sudden lower pressure, whereby the particles explode into the mist of the solution of clay particles, and mixing the finely dispersed clay solution, whereby epoxy is introduced in the solution of clay particles during on of the above steps of preparing the solution of clay particles or dispersing the solution of clay particles or to the resulting dispersed solution of clay particles, yielding an extremely fine and homogeneous distribution of the particles of nanodimensions in the epoxy, yielding a high-performance nanocomposite epoxy.

Abstract: A curable epoxy resin composition comprising: (I) a curable epoxy resin; (II) an epoxy-resin curing agent; and (III) a silicone rubber powder obtained by curing a condensation-curable silicone rubber composition in a dispersed state in water, the powder having an epoxy equivalent measured by titration equal to or lower than 3,000 and an average particle size in the range of 0.1 to 100 ?m, possesses excellent flowability and which, when cured, forms a cured product that in spite of low modulus of elasticity possesses high strength.

Abstract: Method of preparing a particle dispersion within a polymer is disclosed. The dispersion may include core shell rubber particles and the polymer may include epoxies. The particles are capable of being substantially dispersed within the polymer so as to substantially inhibit agglomeration of the particles. Mechanical properties, such as toughness are improved while glass transition temperature and viscosity are not substantially impaired by the presence of the particles.