From Phenol Reactant Patents (Class 524/611)
  • Publication number: 20130059135
    Abstract: The present invention relates to a printing composition including an ionic liquid, a printing method using the same, and a pattern formed by using the same. The printing composition according to the exemplary embodiment of the present invention is useful in providing a pattern of a fine line width.
    Type: Application
    Filed: June 3, 2011
    Publication date: March 7, 2013
    Applicant: LG CHEM LTD
    Inventors: Sang Ki Chun, In-Seok Hwang, Dong Wook Lee, Yong Koo Son
  • Publication number: 20130059127
    Abstract: An epoxybenzyl-terminated poly(arylene ether) has the structure R-W-R wherein W is a divalent poly(arylene ether) residue terminated with phenolic oxygen atoms, and R is an epoxybenzyl group, wherein each occurrence of R is the same or different. The epoxybenzyl-terminated poly(arylene ether) is formed by reacting a peroxide-containing reagent with a vinybenzyl-terminated poly(arylene ether). Also disclosed is a curable composition including the epoxybenzyl-terminated poly(arylene ether)s, a curing promoter, and, optionally, an auxiliary epoxy resin. The curable composition is useful for the preparation of composites, and in particular, composites used in manufacturing printed circuit boards.
    Type: Application
    Filed: September 1, 2011
    Publication date: March 7, 2013
    Inventor: Edward N. Peters
  • Publication number: 20130052381
    Abstract: This disclosure relates to epoxides, polyepoxide compositions and epoxy resins whose degradation products exhibit little or no estradiol binding activity. Also disclosed are methods for making the disclosed compositions and articles of manufacture comprising the disclosed compositions.
    Type: Application
    Filed: August 1, 2012
    Publication date: February 28, 2013
    Inventors: Robert R. Gallucci, James A. Mahood, Jean Francois Morizur, Steve Dimond
  • Patent number: 8372942
    Abstract: Provided are: a urethane-based polycarbonate resin, including a repeating unit represented by the general formula [1], and a repeating unit represented by the general formula [2], in which the urethane-based polycarbonate resin has high wear resistance by virtue of a strong hydrogen bond between urethane groups; and an electrophotographic photoconductor, including a photosensitive layer provided on a conductive substrate, in which the electrophotographic photoconductor includes the above-mentioned polycarbonate resin as a component of the photosensitive layer, has high wear resistance, and maintains an excellent electrophotographic characteristic over a longtime period: [Chem. 1] (Ar2 represents a group having a divalent aromatic group, and Ar1 represents a divalent aromatic group-containing group having a specific structure).
    Type: Grant
    Filed: December 24, 2009
    Date of Patent: February 12, 2013
    Assignee: Idemitsu Kosan Co., Ltd.
    Inventor: Kengo Hirata
  • Publication number: 20130035441
    Abstract: In some embodiments, a composition comprises a bisphenol-A polycarbonate, wherein a molded article of the composition has transmission level greater than or equal to 90.0% at 2.5 mm thickness as measured by ASTM D1003-00 and a yellow index (YI) less than or equal to 1.5 as measured by ASTM D1925.
    Type: Application
    Filed: August 2, 2012
    Publication date: February 7, 2013
    Applicant: SABIC INNOVATIVE PLASTICS IP B.V.
    Inventors: Johannes de Brouwer, Paulus Johannes Maria Eijsbouts, Hatem Abdallah Belfadhel, Jos Arie van den Bogerd
  • Publication number: 20130030116
    Abstract: Provided is a film comprising a polymer that comprises a structural unit represented by the following formula (1), wherein at least part of the terminal structure of the polymer is at least one structure selected from the group consisting of structural units represented by the following formula (2) and structural units represented by the following formula (3).
    Type: Application
    Filed: April 20, 2011
    Publication date: January 31, 2013
    Applicant: JSR Corporation
    Inventors: Motoki Okaniwa, Takaaki Uno, Takashi Okada
  • Publication number: 20130018137
    Abstract: A masterbatch comprising pigment and demoulding agent is provided. The demoulding agent is selected from the group comprising low molecular weight polyolefin oils, low molecular weight polyolefin waxes, montan waxes and aliphatic or aromatic carboxylic acid esters of fatty acids and/or fatty alcohols, wherein the pigment content of the masterbatch is from 3 to 70 wt. %, based on the total weight of the masterbatch. The masterbatch is suitable for preparation of a polymer composition having improved pigment dispersion.
    Type: Application
    Filed: December 20, 2011
    Publication date: January 17, 2013
    Applicant: BAYER MATERIALSCIENCE AG
    Inventors: Andreas SEIDEL, Hans-Juergen THIEM, Reiner RUDOLF, Joerg REICHENAUER, Thomas ECKEL
  • Patent number: 8349911
    Abstract: Production of a composition based on silanes for the scratch-resistant, hydrophobic, aqueous coating of metals, plastics, chemical products, ceramic materials, concrete and glass.
    Type: Grant
    Filed: July 2, 2008
    Date of Patent: January 8, 2013
    Assignee: Evonik Degussa GmbH
    Inventor: Adolf Kuehnle
  • Patent number: 8349942
    Abstract: Described herein is an intermediate transfer member that includes a layer of phenoxy resin having dispersed therein graphene particles.
    Type: Grant
    Filed: May 10, 2011
    Date of Patent: January 8, 2013
    Assignee: Xerox Corporation
    Inventors: Michael S. Roetker, Francisco J. Lopez, Kyle B. Tallman, Jonathan H. Herko, David W. Martin, Scott J. Griffin, Mandakini Kanungo, Yuhua Tong
  • Publication number: 20120329945
    Abstract: The present invention relates to a curable composition, comprising specific meta-substituted aromatic compounds and at least one benzoxazine compound. In particular, the invention relates to the use of said meta-substituted aromatic compounds as curatives/catalysts for benzoxazine-containing compositions.
    Type: Application
    Filed: April 27, 2012
    Publication date: December 27, 2012
    Applicant: Henkel AG & Co. KGaa
    Inventors: Atsushi Mori, Atsushi Sudo, Takeshi Endo, Ryoichi Kudoh, Andreas Taden, Rainer Schoenfeld, Thomas Huver, Iris Christa Huver, Stefan Kreiling
  • Patent number: 8309066
    Abstract: Cationic benzoxazine (co)polymers wherein at least 5% of all nitrogen atoms are in the form of quaternary nitrogen atoms, and to a method for producing said polymers. The invention also relates to a washing and cleaning agent, a textile treatment agent or a cosmetic agent containing at least one cationic benzoxazine (co)polymer according to the invention.
    Type: Grant
    Filed: November 9, 2011
    Date of Patent: November 13, 2012
    Assignee: Henkel AG & Co. KGaA
    Inventors: Andreas Taden, Stefan Kreiling, Rainer Schoenfeld, Paula Barreleiro, Thomas Eiting
  • Publication number: 20120281998
    Abstract: Provided is an electro-conductive member for electrophotography that stably shows high electro-conductivity even under a low-temperature, low-humidity environment. The electro-conductive member for electrophotography has an electro-conductive mandrel and an electro-conductive layer. The electro-conductive layer contains an ionic electro-conductive resin and an ion carrier. The ionic electro-conductive resin has at least one structure selected from the group consisting of structures represented by the following formulae (1), (2), (3), and (4), and a structure represented by the following formula (5) (in the formula (1) to the formula (5), R1, R2, R3, and R4 each represent a divalent organic group, X1, X2, X3, and X4 each independently represent a sulfonic group or a quaternary ammonium base, and 1 represents an integer of 1 or more and 23 or less).
    Type: Application
    Filed: July 17, 2012
    Publication date: November 8, 2012
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Yuichi Kikuchi, Kazuhiro Yamauchi, Norifumi Muranaka, Satoru Nishioka
  • Publication number: 20120261087
    Abstract: A process for producing a mold, comprising a step of mixing refractory particles, a water-soluble phenol resin, and a curing agent composition comprising an ester compound, thereby yielding mixed sands, and a step of putting the mixed sands into an original pattern to shape the sands, wherein the refractory particles comprise reclaimed sands that are artificial sands produced by a fusion method in a proportion of 70% or more by weight, the curing agent composition comprises at least one selected from triethylene glycol diacetate, triethylene glycol, 3-phenylpropane-1-ol, and benzyl alcohol.
    Type: Application
    Filed: December 20, 2010
    Publication date: October 18, 2012
    Inventors: Masahiko Kagitani, Yoshimitsu Ina, Hitoshi Funada
  • Publication number: 20120251956
    Abstract: The invention relates to an antireflective coating composition comprising a crosslinker and a crosslinkable polymer capable of being crosslinked by the crosslinker, where the crosslinkable polymer comprises a unit represented by structure (1): [-A-B-C-]??(1) where A is a fused aromatic ring, B has a structure (2), and C is a hydroxybiphenyl of structure (3) where R1 is C1-C4alkyl and R2 is C1-C4alkyl. The invention further relates to a process for forming an image using the composition.
    Type: Application
    Filed: January 17, 2012
    Publication date: October 4, 2012
    Applicant: AZ ELECTRONIC MATERIALS USA CORP.
    Inventors: M. Dalil RAHMAN, Douglas MCKENZIE, Jianhui SHAN, JoonYeon CHO, Salem K. MULLEN, Clement ANYADIEGWU
  • Publication number: 20120252218
    Abstract: A biphenyl derivative having formula (1) is provided wherein Ar1 and Ar2 denote a benzene or naphthalene ring, and x and z each are 0 or 1. A material comprising the biphenyl derivative or a polymer comprising recurring units of the biphenyl derivative is spin coated and heat treated to form a resist bottom layer having improved properties, optimum values of n and k, step coverage, etch resistance, heat resistance, solvent resistance, and minimized outgassing.
    Type: Application
    Filed: March 20, 2012
    Publication date: October 4, 2012
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Daisuke Kori, Takeshi Kinsho, Katsuya Takemura, Tsutomu Ogihara, Takeru Watanabe, Hiroyuki Urano
  • Publication number: 20120236070
    Abstract: An ink set includes a first ink that contains a white material and a first resin; and a second ink that contains a color material other than the white material and a second resin, wherein the first resin includes a component (A) causing cracks when resin of 0.5 g is dropped onto a slide glass and is dried at a temperature of 50° C. and a humidity of 0% RH for 10 minutes, and wherein the second resin includes a component (B) of at least one of polyolefin wax and ethylene vinyl acetate resin.
    Type: Application
    Filed: March 16, 2012
    Publication date: September 20, 2012
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Ippei Okuda, Tsuyoshi Sano
  • Publication number: 20120171868
    Abstract: There is disclosed A resist underlayer film composition, wherein the composition contains a polymer obtained by condensation of, at least, one or more compounds represented by the following general formulae (1-1) and/or (1-2), one or more kinds of a compound represented by the following general formula (2), and one or more kinds of a compound, represented by the following general formula (3), and/or an equivalent body thereof. There can be provided an underlayer film composition, especially for a trilayer resist process, that can form an underlayer film having reduced reflectance, (namely, an underlayer film having optimum n-value and k-value as an antireflective film), excellent filling-up properties, high pattern-antibending properties, and not causing line fall or wiggling after etching especially in a high aspect line that is thinner than 60 nm, and a patterning process using the same.
    Type: Application
    Filed: December 5, 2011
    Publication date: July 5, 2012
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Tsutomu OGIHARA, Takeru WATANABE, Yusuke BIYAJIMA, Daisuke KORI, Takeshi KINSHO, Toshihiko FUJII
  • Publication number: 20120164464
    Abstract: The present invention provides a cyanate ester resin composition, and a prepreg and a laminated made from the cyanate ester resin composition. The cyanate ester resin composition includes a cyanate ester resin containing the structure expressed by the following structure formula (1): wherein, R1, R2 and R3 are hydrogen atom, alkyl or aralkyl; and n is an integer between 1 and 50. The cyanate ester resin composition of the present invention has excellent thermal resistance, low water absorption, and good elastic modulus, etc. The prepreg, the laminate, and the metal foil clad laminate made from the cyanate ester resin composition have excellent thermal resistance, mechanical property and humidity resistance, and low water absorption, etc., thereby adapted for making substrate material of high density PCB, and have a very high industrial application value.
    Type: Application
    Filed: December 22, 2011
    Publication date: June 28, 2012
    Applicant: GUANGDONG SHENGYI SCI.TECH CO., LTD
    Inventors: JUNQI TANG, XIANPING ZENG
  • Publication number: 20120164463
    Abstract: The present invention provides a cyanate ester resin composition, and a prepreg and a laminated made from the cyanate ester resin composition. The cyanate ester resin composition includes a cyanate ester resin containing the structure expressed by the following structure formula (1): wherein, R1, R2 and R3 are hydrogen atom, alkyl or aralkyl; and n is an integer between 1 and 50. The cyanate ester resin composition of the present invention has excellent processability, thermal resistance and humidity resistance, and low water absorption, etc. The prepreg, the laminate, and the metal foil clad laminate made from the cyanate ester resin composition have excellent processability, thermal resistance and humidity resistance, and low water absorption, etc., thereby adapted for making substrate material of high density PCB, and have a very high industrial application value.
    Type: Application
    Filed: December 22, 2011
    Publication date: June 28, 2012
    Applicant: GUANGDONG SHENGYI SCI.TECH CO., LTD
    Inventors: Junqi Tang, Xianping Zeng
  • Publication number: 20120149837
    Abstract: A thermoplastic resin composition obtained by mixing 100 parts by weight of at least one thermoplastic resin (A) with 0.1 to 4 parts by weight of (B) a polyfunctional compound having three or more functional groups in which at least one of the terminal structures haying the functional groups is a structure represented by formula (1): where R is an alkylene group with 1-15 carbon atoms; n is an integer of 1 to 10; and X is at least one functional group selected from the group consisting of hydroxyl group, aldehyde group, carboxyl group, sulfo group, amino group, isocyanate group, carbodiimide group, oxazoline group, oxazine group, amide group, silanol group and silyl ether group.
    Type: Application
    Filed: January 27, 2012
    Publication date: June 14, 2012
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Sadanori Kumazawa, Hiroyuki Ohme, Yuki Amano, Takamasa Owaki
  • Publication number: 20120129992
    Abstract: A synthetic resin composition for metal-texture resin molded articles includes 100 parts by weight of a thermoplastic resin, 0.1 to 10 parts by weight of a plate-like metallic pigment, 1 to 50 parts by weight of a spherical glassy material and 1 to 50 parts by weight of an ultrafine filamentary material. An injection molding method for producing a metal-texture resin molded article from the synthetic resin composition and a metal-texture resin molded article molded from the synthetic resin composition are also provided.
    Type: Application
    Filed: July 2, 2010
    Publication date: May 24, 2012
    Inventors: Myung Ho Kang, Byoung Uk Ahn
  • Publication number: 20120130015
    Abstract: The present invention relates to a method for the accelerated production of thermoplastic molded bodies containing additives in reproducible quality, particularly for the accelerated production of dyed thermoplastic molded bodies with high color consistency.
    Type: Application
    Filed: July 31, 2010
    Publication date: May 24, 2012
    Applicant: Bayer MaterialScience AG
    Inventors: Klaus Horn, Olaf Zoellner, Gianmaria Malvestiti, Andrea Scagnelli, Massimo Tironi
  • Publication number: 20120123034
    Abstract: A polycarbonate containing composition comprising a peak melt viscosity of at least 8,000 poise when measured using a parallel plate melt rheology test at a heating rate of 10° C./min at a temperature of between about 350° C. to about 450° C., and wherein a molded article of the composition has a UL 94 VO rating at a thickness of 1.0 mm, 1.5 mm, 2.0 mm, or between 1.0 mm and 2.0 mm is disclosed.
    Type: Application
    Filed: November 14, 2010
    Publication date: May 17, 2012
    Applicant: SABIC INNOVATIVE PLASTICS IP B.V
    Inventors: Jean-Francois Morizur, Thomas L. Evans
  • Publication number: 20120108732
    Abstract: The present invention provides: a white turbid dispersion liquid of a chemical for rubber, containing the chemical for rubber at a concentration of 1% by mass or more; a method for producing the white turbid dispersion liquid of a chemical for rubber, containing mixing a solution containing a chemical for rubber dissolved in a good solvent for the chemical for rubber, with a poor solvent for the chemical for rubber; and a wet master batch containing a chemical for rubber, containing a liquid mixture containing the white turbid dispersion liquid of a chemical for rubber, and a rubber latex, or a rubber latex and a filler slurry, the liquid mixture being coagulated, and thus provides: the dispersion liquid of a chemical for rubber that is for making various chemicals for rubber be contained in a rubber wet master batch with good dispersibility; the method for producing the same; and the rubber master batch that provides a rubber composition enhanced in thermal aging resistance, reinforcing property, elastic mod
    Type: Application
    Filed: April 22, 2010
    Publication date: May 3, 2012
    Applicant: BRIDGESTONE CORPORATION
    Inventors: Atsushi Nakayama, Takeshi Kasai, Masaaki Izuchi, Fumiteru Nishiura
  • Patent number: 8168742
    Abstract: To provide a crosslinkable fluorinated aromatic prepolymer which is capable of forming a cured product having a low relative permittivity, high heat resistance, low birefringence and high flexibility, and its uses.
    Type: Grant
    Filed: December 4, 2009
    Date of Patent: May 1, 2012
    Assignee: Asahi Glass Company, Limited
    Inventors: Shunsuke Yokotsuka, Masahiro Ito, Kaori Tsuruoka
  • Patent number: 8168301
    Abstract: A composition comprising a combination of a thermoplastic polyester; and 0.2 to 0.7 parts by weight of an alkali metal salt, an alkaline earth metal salt, and/or a C1-12 ester of an aliphatic C24-36 carboxylic acid, based on 100 parts by weight of the polyester. The compositions are useful for molding parts, such as automotive headlamp reflectors.
    Type: Grant
    Filed: November 9, 2006
    Date of Patent: May 1, 2012
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Kayoko Onda, Francois de Bie, Theodorus Sweegers, Rama Konduri
  • Publication number: 20120101220
    Abstract: A method of purifying a thermoplastic polymer having at least one dispersed filler, including preparing a polymer melt of the thermoplastic polymer, and filtering the polymer melt, where the dispersed filler is at least partially transformed to a coagulated and filterable form before the filtering step. Also, a device for purifying the thermoplastic polymer, including means for preparing a polymer melt from the thermoplastic polymer, and filter means, and means for generating sound waves, preferably ultrasonic waves.
    Type: Application
    Filed: October 26, 2011
    Publication date: April 26, 2012
    Applicant: KRONES AG
    Inventor: Thomas Friedlaender
  • Publication number: 20120100474
    Abstract: A polycarbonate copolymer includes a repeating unit represented by a formula (1) below and a molar copolymer composition represented by Ar2/(Ar1+Ar2) in a range of 25 mol % to 50 mol %. In the formula (1): Ar1 and Ar2 represent a divalent aromatic group; a chain end is terminated by a monovalent aromatic group or a monovalent fluorine-containing aliphatic group; and n represents an average repeating number of an Ar1 block and is a numeral of 1.0 to 3.0, provided that Ar1 and Ar2 are not the same.
    Type: Application
    Filed: June 25, 2010
    Publication date: April 26, 2012
    Applicant: IDEMITSU KOSAN CO., LTD.
    Inventors: Takaaki Hikosaka, Hideyuki Miyamoto
  • Publication number: 20120076573
    Abstract: Materials, apparatus and methods of forming structural components for consumer electronics devices are described. In one embodiment, ceramic fibers, such as alumina, are mixed with a thermoplastic, such as nylon, to form a composite material usable in an injection molding process. The volume percent of ceramic fibers used with the thermoplastic can be selected to improve the strength properties of the composite material. Pigments can be added to the composite material to affect its aesthetic appeal. In one embodiment, the composite material including the ceramic fibers can be used to form frame components usable in a consumer electronic device. The frame components can be load bearing structures that are externally visible or used within the interior of the device.
    Type: Application
    Filed: March 3, 2011
    Publication date: March 29, 2012
    Applicant: APPLE INC.
    Inventors: Michael K. Pilliod, Paul Choiniere
  • Publication number: 20120063109
    Abstract: The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.
    Type: Application
    Filed: November 17, 2011
    Publication date: March 15, 2012
    Inventors: Shigeki KATOGI, Houko SUTOU, Hiroyuki IZAWA, Toshiaki SHIRASAKA, Masami YUSA, Takanobu KOBAYASHI
  • Publication number: 20120064788
    Abstract: The present invention relates to fiber glass strands, yarns, fabrics, composites, prepregs, laminates, fiber-metal laminates, and other products incorporating glass fibers formed from glass compositions. The glass fibers, in some embodiments, are incorporated into composites that can be used in reinforcement applications. Glass fibers formed from some embodiments of the glass compositions can have certain desirable properties that can include, for example, desirable electrical properties (e.g. low Dk) or desirable mechanical properties (e.g., specific strength).
    Type: Application
    Filed: September 14, 2011
    Publication date: March 15, 2012
    Inventors: James Carl Peters, Juan Camilo Serrano, Hong Li, Cheryl A. Richards, Steven Joel Parks
  • Publication number: 20120063988
    Abstract: Methods for dissolving carbon materials such as, for example, graphite, graphite oxide, oxidized graphene nanoribbons and reduced graphene nanoribbons in a solvent containing at least one superacid are described herein. Both isotropic and liquid crystalline solutions can be produced, depending on the concentration of the carbon material The superacid solutions can be formed into articles such as, for example, fibers and films, mixed with other materials such as, for example, polymers, or used for functionalization of the carbon material. The superacid results in exfoliation of the carbon material to produce individual particles of the carbon material. In some embodiments, graphite or graphite oxide is dissolved in a solvent containing at least one superacid to form graphene or graphene oxide, which can be subsequently isolated. In some embodiments, liquid crystalline solutions of oxidized graphene nanoribbons in water are also described.
    Type: Application
    Filed: February 19, 2010
    Publication date: March 15, 2012
    Applicant: WILLIAM MARSH RICE UNIVERSITY
    Inventors: James M. Tour, Matteo Pasquali, Natnael Behabtu, Jay R. Lomeda, Dmitry V. Kosynkin, Amanda Duque, Micah J. Green, A. Nicholas Parra-Vasquez, Colin Young
  • Patent number: 8133933
    Abstract: Phenolic resin binder systems for sand molds, used in metal casting, which improve the quality of thermally reclaimed sand, are described. The substantial or complete elimination of calcium compounds (e.g., calcium stearate and calcium hydroxide, conventionally employed as a mold lubricant and a resin curing catalyst, respectively) allows the thermally reclaimed sand to be reused over multiple thermal reclamation cycles without the adverse effects previously encountered.
    Type: Grant
    Filed: August 11, 2006
    Date of Patent: March 13, 2012
    Assignee: Georgia-Pacific Chemicals LLC
    Inventors: Richard Rediger, Edward Lucas
  • Patent number: 8133535
    Abstract: An antipenetrating agent is to be added to a solvent ink for preventing penetration of the solvent ink into a medium to be printed. The antipenetrating agent includes inorganic fine particles and a resin soluble in an organic solvent.
    Type: Grant
    Filed: March 20, 2008
    Date of Patent: March 13, 2012
    Assignee: Mimaki Engineering Co., Ltd.
    Inventors: Tomotaka Furuhata, Satoshi Takezawa, Isao Tabayashi
  • Publication number: 20120058345
    Abstract: Low-gloss flexible clear coast can include a base formula that includes a base resin and a cross-linker, a silica-based flattener, wherein the silica-based flattener comprises from 5 parts by weight per 100 parts by weight of the base formula to 20 parts by weight per 100 parts by weight of the base formula, one or more flattener enhancing agents, wherein the one or more flattener enhancing agents comprise 0.25 parts by weight per 100 parts by weight of the base formula to 5 parts by weight per 100 parts by weight of the base formula, and possess 90° flexibility and a 60° gloss finish from 22 gloss units to 34 gloss units.
    Type: Application
    Filed: September 8, 2010
    Publication date: March 8, 2012
    Applicants: NB Coatings, Inc., Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Yuko Nagata Gidcumb, Scott Dale Kubish, Joe Mecozzi, Makoto Imai
  • Publication number: 20120058069
    Abstract: Cationic benzoxazine (co)polymers wherein at least 5% of all nitrogen atoms are in the form of quaternary nitrogen atoms, and to a method for producing said polymers. The invention also relates to a washing and cleaning agent, a textile treatment agent or a cosmetic agent containing at least one cationic benzoxazine (co)polymer according to the invention.
    Type: Application
    Filed: November 9, 2011
    Publication date: March 8, 2012
    Inventors: Andreas Taden, Stefan Kreiling, Rainer Schoenfeld, Paula Barreleiro, Thomas Eiting
  • Publication number: 20120059096
    Abstract: A stable solution of the polymer prepared from N,O-heterocyclic compound and its preparing method are provided, wherein the stable solution is prepared by making the N,O-heterocyclic compound of formulae I or II carry out a ring-opening polymerization: wherein R1 to R3, W1, W2, m, n, p and q are as defined in the specification. The stable solution can be used as a hardener for curing epoxy resin.
    Type: Application
    Filed: December 13, 2010
    Publication date: March 8, 2012
    Applicant: Taiwan Union Technology Corporation
    Inventors: Shih-Hao Liao, Chih-Wei Liao, Hsuan-Hao Hsu, Hsien-Te Chen, Tsung-Hsien Lin
  • Patent number: 8129467
    Abstract: The present invention relates to a curing accelerating compound-silica composite material capable of giving excellent storage stability to a curable resin composition, which is obtained by subjecting one or more compounds selected from compounds represented by the general formula (I-1) below and partial condensates thereof to a sol-gel reaction in the presence of a curing accelerating compound and water; a curable resin composition comprising the same; and an electronic component device comprising a device sealed with the curable resin composition.
    Type: Grant
    Filed: April 14, 2006
    Date of Patent: March 6, 2012
    Assignee: Hitachi Chemical Co., Ltd.
    Inventor: Shinya Nakamura
  • Patent number: 8124694
    Abstract: The present invention relates to a mold releasing film for printed circuit board production, which comprises a resin layer (P) containing (A) a polyphenylene ether-based resin in an amount of 50 wt % or more. According to the present invention, it is possible to provide a mold releasing film suitable for production of printed circuit boards, particularly flexible printed circuit boards, which is excellent in mold-releasing property, exhibits little heat shrinkage, hardly imparts wrinkles to printed circuit board products, itself hardly gets wrinkled, and is excellent in contamination resistance since no bleeding-out is observed, and which is also excellent in an anti-moisture absorbing property, shape-following property, less overflow of adhesive, adhesion between multilayer films and slipping property between films.
    Type: Grant
    Filed: July 23, 2009
    Date of Patent: February 28, 2012
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Hiroshi Kamo, Yuuji Kusumi
  • Patent number: 8106523
    Abstract: A liquid resin composition for use as a sealing resin which reduces wear on a dicing blade or grinder employed for signularization or grinding. The liquid resin composition includes hollow and/or porous particles as a filler, and is adapted in use to be applied on a substrate constituting a semi-conductor device or electronic part.
    Type: Grant
    Filed: May 5, 2009
    Date of Patent: January 31, 2012
    Assignee: Panasonic Electric Works Co., Ltd.
    Inventors: Naoki Kanagawa, Yasutaka Miyata
  • Publication number: 20120018902
    Abstract: The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected to an adherend, the film for flip chip type semiconductor back surface containing an inorganic filler in an amount within a range of 70% by weight to 95% by weight based on the whole of the film for flip chip type semiconductor back surface.
    Type: Application
    Filed: July 18, 2011
    Publication date: January 26, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Naohide TAKAMOTO, Goji SHIGA, Fumiteru ASAI
  • Publication number: 20110315914
    Abstract: A nanocomposite with high dielectric constant includes both ferroelectric with non-ferroelectric fillers. This may improve, not only the dielectric constant of the nanocomposite but also provide additional thermal, electrical, optical, mechanical, or chemical properties to the nanocomposite for specific applications.
    Type: Application
    Filed: June 29, 2011
    Publication date: December 29, 2011
    Applicant: PIXELLIGENT TECHNOLOGIES, LLC
    Inventors: ZHIYUN CHEN, JUN XU, BRIAN L. WEHRENBERG, ZEHRA SERPIL GONEN-WILLIAMS, GREGORY D. COOPER
  • Patent number: 8075984
    Abstract: The present invention provides a thermoplastic resin composition characterized by comprising (A) a thermoplastic resin and (B) a white pigment in a mass ratio of 50:50 to 90:10 and further comprising (C) a black coloring material and a blue coloring material; and provides a formed article using the resin composition. The above thermoplastic resin composition is an improvement of the conventional technique for preventing the permeation of light from a thin part of the formed article while securing a satisfactory reflectance, and can markedly improve the light blocking effect of a thermoplastic resin composition, without the increase of the number of parts, the employment of a more complicated process, or the like.
    Type: Grant
    Filed: April 20, 2005
    Date of Patent: December 13, 2011
    Assignee: Idemitsu Kosan Co., Ltd.
    Inventors: Yoshihiko Horio, Hiroshi Kawato
  • Publication number: 20110287354
    Abstract: Provided are: a urethane-based polycarbonate resin, including a repeating unit represented by the general formula [1], and a repeating unit represented by the general formula [2], in which the urethane-based polycarbonate resin has high wear resistance by virtue of a strong hydrogen bond between urethane groups; and an electrophotographic photoconductor, including a photosensitive layer provided on a conductive substrate, in which the electrophotographic photoconductor includes the above-mentioned polycarbonate resin as a component of the photosensitive layer, has high wear resistance, and maintains an excellent electrophotographic characteristic over a longtime period: [Chem. 1] (Ar2 represents a group having a divalent aromatic group, and Ar1 represents a divalent aromatic group-containing group having a specific structure).
    Type: Application
    Filed: December 24, 2009
    Publication date: November 24, 2011
    Applicant: IDEMITSU KOSAN CO., LTD.
    Inventor: Kengo Hirata
  • Publication number: 20110274907
    Abstract: Curative fibre components comprise one or more fibres for filaments of curative suitable to cure curable resins such as thermoset resin. In curative fibre components comprising a plurality of fibres of curative, the fibres can be commingled, such as twisting, to form a thread or yarn. Curative fibre components can be used to form a material in the form of a sheet, fabric, layer, textile or mat of woven or non-woven curative fibres. Curative fibre components can be used to produce composite materials such as fibre reinforced resinous composite materials. The curative fibre components can be commingled, including interwoven, stitched and layered with other fibres or fibrous materials, such as fibrous reinforcement, fibrous curable resin, fibrous thermoplastic, other non-reinforcing fibres to form composite materials, prepregs, preforms and articles.
    Type: Application
    Filed: November 24, 2009
    Publication date: November 10, 2011
    Inventors: Mark Raymond Steele, Andrew Gibbs, Amy Grace Atinkson
  • Patent number: 8048955
    Abstract: A polycarbonate thin molded article containing a resin composition, the resin composition containing: 100 parts by weight of a resin (A), the resin (A) being an aromatic polycarbonate or a resin mainly containing an aromatic polycarbonate; 0.1 to 200 parts by weight of an inorganic compound (B); 0.001 to 10 parts by weight of at least one compound (C) selected from an organic acidic compound and an organic acidic compound derivative; and 0.001 to 1 part by weight of at least one metal salt (D) selected from an organic acid alkali metal salt and an organic acid alkaline earth metal salt, a part corresponding to at least 50% of the surface area of the polycarbonate thin molded article having a thickness of less than 0.7 mm, and a shrinkage ratio S1(%) in a molding flow direction of the polycarbonate thin molded article upon its being left under an atmosphere of 170° C. for 30 minutes satisfying the following formula (1): ?60<S1<?1??formula (1).
    Type: Grant
    Filed: April 25, 2005
    Date of Patent: November 1, 2011
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Kazuhiro Shibuya, Akira Miyamoto, Kazuharu Yasuda
  • Patent number: 8044142
    Abstract: This invention provides a polymer alloy comprising a polyphenylene sulfide resin and a polyphenylene ether resin. This polymer alloy can eliminate molding whitening which, upon molding, occurs on the surface of the molded product, can impart excellent surface appearance and flame retardance, and further can improve balance between heat resistance and toughness (impact strength) and mechanical strength. The resin composition comprises 45 to 99 parts by weight of a polyphenylene sulfide resin comprising (a) 0 to 96% by weight of a specific linear polyphenylene sulfide resin and (b) 100 to 4% by weight of a specific crosslinking-type polyphenylene sulfide resin. The resin composition further comprises (c) 55 to 1 part by weight of a polyphenylene ether resin. Further, the resin composition comprises (d) 1 to 20 parts by weight, based on 100 parts by weight in total of components (a) to (c), of a styrene copolymer and/or an ethylene copolymer containing any one functional group of glycidyl and oxazolyl groups.
    Type: Grant
    Filed: September 21, 2005
    Date of Patent: October 25, 2011
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Yoshikuni Akiyama, Minoru Sakata
  • Publication number: 20110224345
    Abstract: This invention relates to a low dielectric resin varnish composition for laminated printed circuit boards, wherein the resin composition includes (A) Dicyclo-pentadiene-Phenolic Novolac resin (abbreviated as DCPD-PN); or (B) at least one kind of dicyclopentadiene Phenolic Novolac Epoxy resins(DCPD-PNE, referred to as Resin 1); or (C) a novel Dicyclopentadiene-Dihydrobenzoxazine resin (DCPD-BX, referred to as Resin 2); or the mixture of (B) and (C), and (D) Flame retardant agent, curing agent and accelerating agent solutions. Because all of component (A) DCPD-PN, component (B) DCPD-PNE and component (C) DCPD-BX in this resin varnish composition contain a saturated multi-cyclic structure of dicyclopentadiene, the resin varnish shows lower dipole, dielectric constant (Dk), dissipation factor (Df) and moisture absorption; and via adding a brominated or phosphorus flame retardant, the composition exhibits high thermal stability characteristic.
    Type: Application
    Filed: March 15, 2010
    Publication date: September 15, 2011
    Inventors: Ming Jen TZOU, June Che Lu, Yi Cheng Lin
  • Publication number: 20110213070
    Abstract: A curing accelerator for epoxy resin compositions, which is used in a one-pack type epoxy resin composition having excellent storage stability and rapid curability. The curing accelerator for epoxy resin compositions contains a microcapsule type curing accelerator wherein a compound represented by formula (I) is encapsulated by a thermosetting resin. (In formula (I), R1 and R2 each represents a hydrogen atom or an alkyl group.
    Type: Application
    Filed: September 28, 2009
    Publication date: September 1, 2011
    Applicant: THE YOKOHAMA RUBBER CO., LTD.
    Inventors: Tsubasa Okuno, Nao Sato, Kazunori Ishikawa
  • Patent number: 8003750
    Abstract: A thermosetting composition comprising (a) 97.9 to 40 percent by weight of at least one bis(dihydrobenzoxazine) prepared by the reaction of an unsubstituted or substituted bisphenol with at least one unsubstituted position ortho to each hydroxyl group, formaldehyde and a primary amine; (b) 2 to 50 percent by weight of at least one organic polyamine; and (c) 0.1 to 10 percent by weight of at least one curing catalyst, selected from the group of carboxylic acids, sulfonic acids and phosphonic acids having at least two acid groups and no other reactive groups; wherein the percent by weight refer to the total amount of components (a), (b) and (c) in the composition, with the proviso that (a), (b) and (c) add up to 100 percent by weight; and (d) and optionally other components. Cured products of these compositions show valuable chemical, physical and mechanical properties.
    Type: Grant
    Filed: January 31, 2008
    Date of Patent: August 23, 2011
    Assignee: Huntsman International LLC
    Inventor: Frans Setiabudi