With Nitrogen-containing Reactant, Or Wherein The Poly 1,2-epoxy Reactant Contains A Nitrogen Atom Patents (Class 525/113)
  • Patent number: 5739209
    Abstract: Reductive alkylation of branched, short chain diamines, such as 2-methyl-1,5-pentanediamine, with certain aldehydes or ketones of moderate molecular weight, such as benzaldehyde or methyl isobutyl ketone, produces novel tri- and difunctional amines which are useful in curing epoxy resins to compositions having improved flexibility and enhanced resistance to moisture and chemicals. Particularly favorable results are achieved when this curative is combined in the epoxy formulation with low molecular weight acrylic copolymers added as flexibilizers. Further improvements are available by including in the recipe monofunctional epoxy or acrylic reactive diluents.
    Type: Grant
    Filed: February 7, 1997
    Date of Patent: April 14, 1998
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Kevin Rodney Lassila, Mark David Conner
  • Patent number: 5728755
    Abstract: Curable epoxy resin compositions, preferably solvent-free, wherein a fluorene amine curative is partially melt dissolved and partially dispersed as a solid in at least one aromatic polyepoxide. The compositions provide prepregs which exhibit tack with surprisingly good shelf life properties. Cured composites comprising the prepregs are also provided. The cured composites exhibit little resin migration and glass transition temperatures that are comparable to those of cured neat resins.
    Type: Grant
    Filed: September 22, 1995
    Date of Patent: March 17, 1998
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Mark D. Weigel, Steven C. Hackett, Timothy J. Clemens
  • Patent number: 5728779
    Abstract: A binder composition for thermosetting powder paints comprising (i) a polymer that is capable of reacting with epoxy groups and (ii) a crosslinker that contains epoxy groups, wherein the crosslinker comprises at least one C.sub.5 to C.sub.26 linear or branched aliphatic chain with the proviso that epoxy groups are carried on at least one aliphatic chain. In order to function as a crosslinker the amount of oxirane-oxygen originating from the crosslinker in the binder composition is higher than 0.1 meq/gram. The crosslinker is, for example, an epoxydized oil, a modified epoxydized oil or an epoxydized alkyd resin. A powder paint comprising the binder composition can contain a suitable catalyst and, optionally, an additional curing agent.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: March 17, 1998
    Assignee: DSM N.V.
    Inventors: Adrianus J. van de Werff, Leendert J. Molhoek, Marten Houweling, Robert van den Berg Jeths, Dirk A. W. Stanssens, Robert van der Linde, Tosko A. Misev
  • Patent number: 5726285
    Abstract: Condensation and addition polymers which comprise as structural repeating unit N,N'-bridged bistetramethylpiperidyloxy groups of the formula I ##STR1## in which m is 2 or 3 are suitable as light stabilizers and other stabilizers for organic material
    Type: Grant
    Filed: August 2, 1996
    Date of Patent: March 10, 1998
    Assignee: BASF Aktiengesellschaft
    Inventors: Alexander Aumuller, Hubert Trauth
  • Patent number: 5643975
    Abstract: An epoxy resin composition for semiconductor encapsulation use comprising an epoxy resin, a phenol resin, and an inorganic filler is improved by blending therein a component which is obtained by copolymerizing or homopolymerizing a reactive monomer having a vinyl group and an epoxy or phenolic hydroxyl group in a molecule thereof with or preferably in the presence of a thermoplastic elastomer or organic synthetic rubber. Alternatively, the modifying component (C) is obtained by copolymerizing a reactive monomer and a silane monomer with or preferably in the presence of a thermoplastic elastomer or organic synthetic rubber. The composition cures to products having improved thermal shock resistance and adherence.
    Type: Grant
    Filed: March 30, 1995
    Date of Patent: July 1, 1997
    Assignee: Shin-Etsu Chemical Company, Limited
    Inventors: Toshio Shiobara, Hisashi Shimizu
  • Patent number: 5629380
    Abstract: A curable, structural epoxy adhesive composition comprising two parts is provided. The first part comprises an amine curing agent and a catalyst; the second part comprises an epoxy resin having an average epoxide functionality of greater than one.
    Type: Grant
    Filed: September 19, 1995
    Date of Patent: May 13, 1997
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: John M. Baldwin, Janis Robins
  • Patent number: 5602209
    Abstract: A creping adhesive containing about 1% to about 25% polyoxazoline by weight, which imparts softness and resistance to bleaching, to a cellulosic web, and methods of using same are provided.
    Type: Grant
    Filed: June 1, 1995
    Date of Patent: February 11, 1997
    Assignee: Houghton International, Inc.
    Inventors: Joseph E. Warchol, Cynthia D. Walton-Bongers
  • Patent number: 5565508
    Abstract: Aqueous synthetic resin dispersions comprising A) an ionic resin, preferably a cationic resin, B) a blocked polyisocyanate and C) a polymer of at least one ethylenically unsaturated monomer which can be polymerized by free-radical polymerization. These synthetic resin dispersions are used as binders in electrodeposition coating baths.
    Type: Grant
    Filed: April 23, 1994
    Date of Patent: October 15, 1996
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Michael Hoenel, Achim Voelker, Gerd Walz, Peter Ziegler
  • Patent number: 5565525
    Abstract: A resin composition curable through a Michael reaction between (a) a component having a plurality of .alpha., .beta.-unsaturated carbonyl groups and (b) a component having a plurality of activated methylene, activated methyne or hydroxyl groups is disclosed. The curing reaction is catalyzed with a quaternary ammonium, quaternary phosphonium or tertiary sulfonium salt in the presence of an epoxy compound independently added to the composition or covalently attacted to either component (a) or component (b).
    Type: Grant
    Filed: October 26, 1994
    Date of Patent: October 15, 1996
    Assignee: Nippon Paint Co., Ltd.
    Inventors: Hideo Morimoto, Kei Aoki, Takashi Irie, Hiroto Yoneda
  • Patent number: 5548026
    Abstract: This invention is a two-part induction-curable epoxy adhesive comprising a first part of a polyfunctional epoxy such as a sorbitol polyglycidyl ether, and a diepoxy compound such as a diepoxy bisphenol-A wherein a portion of the diepoxy compound may preferably comprise a glycol-based epoxy having an epoxy equivalent weight of at least about 250. The second part of the adhesive is a curing agent which preferably maybe a mixture of nitrogen-based compounds di(aminoalkyl)ether of diethylene glycol, and a toughening agent. The invention also comprises a method of adjoining two substrates by applying the adhesive composition of the invention and curing as well as the article resulting from this method.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: August 20, 1996
    Assignee: H. B. Fuller Company
    Inventors: Steven A. Jorissen, Gregory A. Ferguson, Krystyna Imirowicz
  • Patent number: 5543486
    Abstract: An epoxy-resin composition containing, as essential components, (1) an epoxy resin having two or more epoxy groups in one molecule, (2) a solid-dispersing, amine adduct-type latent hardener, and (3) a titanium and/or zirconium alkoxide(s).
    Type: Grant
    Filed: January 6, 1995
    Date of Patent: August 6, 1996
    Assignee: Ajinomoto Co., Inc.
    Inventors: Chikara Abe, Junji Ohashi, Kiyomiki Hirai
  • Patent number: 5536775
    Abstract: Amine curable compositions containing a partially acrylated epoxy resin useful for forming protective and/or decorative coatings on a variety of substrates, particularly flooring substrates.
    Type: Grant
    Filed: November 4, 1994
    Date of Patent: July 16, 1996
    Assignee: Sandoz Ltd.
    Inventors: Benedict S. Curatolo, Frank V. Apicella, Jr., Thomas W. Richardson, Sr.
  • Patent number: 5536780
    Abstract: A process for making reduced gloss thermoplastic resin compositions is provided. The process involves compounding a nitrile polymer with an electrophilic reagent to form a polymeric gel compound, blending the polymeric gel compound with a first thermoplastic resin and a weight ratio of between 5:1 and 0.5:1 to make a concentrate comprising gels dispersed in the first thermoplastic resin, and admixing the concentrate with a second thermoplastic resin produced the desired composition, wherein the concentrate is used at a level of from 2 to 60 percent by weight based on the total weight of the composition. The process provides improved product consistency, and consistently yields a product exhibiting reduced gloss and high levels of impact strength with a uniformly dispersed concentration of polymeric gels therein. The compositions are useful in making molded articles exhibiting consistent reduced gloss and high impact strengths.
    Type: Grant
    Filed: August 20, 1993
    Date of Patent: July 16, 1996
    Assignee: General Electric Company
    Inventors: Qamar Bhatia, Jack Hill, Robert Hossan, William Pecak, Robert Wildi
  • Patent number: 5530062
    Abstract: Gels useful as low gloss additives for blends of addition polymers, such as ABS resins, with polycarbonates are prepared by a melt blending operation in which a polyepoxide such as 3,4-epoxycyclohexyl 3,4-epoxycyclohexanecarboxylate is blended with at least one addition polymer such as a styrene-acrylonitrile copolymer, and concurrently with at least one aromatic polycarbonate in at least two increments. The first increment comprises about 20-60% of total polycarbonate and the second increment is subsequently introduced.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: June 25, 1996
    Assignee: General Electric Company
    Inventors: Greg R. Bradtke, Robert H. Wildi, Jack A. Hill, Kenneth G. Powell
  • Patent number: 5516846
    Abstract: Coating compositions which comprise:(i) an acid-functional compound having an average of at least two carboxylic acid groups per molecule; and(ii) an anhydride-functional compound having an average of at least two cyclic carboxylic acid anhydride groups per molecule; and(iii) an epoxy-functional compound having an average of at least one epoxy group per molecule; wherein at least one of the compounds (i), (ii), or (iii) comprises a film forming polymer.
    Type: Grant
    Filed: August 25, 1995
    Date of Patent: May 14, 1996
    Assignee: The Sherwin-Williams Company
    Inventors: Mohamad D. Shalati, James A. Marquart, John L. Petty, Rodney M. Harris
  • Patent number: 5512613
    Abstract: A cleavable epoxy resin composition suitable for encapsulating electronic chips comprising the cured reaction product of a diepoxide containing a cyclic anhydride curing agent and an amine promoter.
    Type: Grant
    Filed: March 18, 1994
    Date of Patent: April 30, 1996
    Assignee: International Business Machines Corporation
    Inventors: Ali Afzali-Ardakani, Stephen L. Buchwalter, Jeffrey D. Gelorme, Laura L. Kosbar, Bert H. Newman, Frank L. Pompeo
  • Patent number: 5512372
    Abstract: Hardenable or polymerizable epoxy resin-based composition, characterized in that its hardener system comprises a combination in synergic quantities of:(i) at least one imidazole which, alone, can cause the polymerization of the epoxy resin only at a temperature above about 75.degree. C.,(ii) at least one polyamine compound which, alone, leads to the polymerization of the epoxy resin at a temperature lower than about 75.degree. C. Such a resin is particularly suitable for the manufacture of composite structures, applicable in particular in ship- or boatbuilding.
    Type: Grant
    Filed: August 24, 1994
    Date of Patent: April 30, 1996
    Assignee: Brochier, S.A.
    Inventors: Isabelle Blanc, Fran.cedilla.oise Eyriey, Xavier Gambert
  • Patent number: 5466754
    Abstract: A curable resin composition utilizing as the crosslinking mechanism thereof an acid catalyzed addition reaction of a cyclic alkylenecarbonate group with an alcoholic hydroxyl group is disclosed. The composition contains a compound or polymer having a plurality of 6-membered cyclic alkylenecarbonate groups and a polymer having a plurality of alcoholic hydroxyl groups. A polymer having pluralities of the cyclic alkylenecarbonate and hydroxyl groups in a single entity may also be used. The composition cures at room or elevated temperatures depending upon the acidity and amount of particular acid catalyst incorporated to the composition.
    Type: Grant
    Filed: January 27, 1995
    Date of Patent: November 14, 1995
    Assignees: Nippon Paint Co., Ltd., Daicel Chemical Industries, Ltd.
    Inventors: Takao Morimoto, Shinji Nakano
  • Patent number: 5457165
    Abstract: Encapsulant compositions which provide both dry heat and humid heat stability comprise:(a) a first liquid epoxy resin comprising either:(1) the diglycidyl ether of polyoxypropylene glycol; or(2) the diglycidyl ester of linoleic dimer acid;(b) a second liquid epoxy resin comprising the diglycidyl ether of 1,4-butanediol, present in the amount of about 12 to 55 parts by weight of said composition; and(c) a stoichiometric amount of an epoxy resin curing agent selected from the group consisting of a flexibilized polyamine and a flexibilized polyamide.
    Type: Grant
    Filed: August 12, 1992
    Date of Patent: October 10, 1995
    Assignee: Hughes Aircraft Company
    Inventors: Ralph D. Hermansen, Steven E. Lau
  • Patent number: 5457149
    Abstract: Reworkable adhesive that has a high shear strength through a range of use temperatures but which has a low strength and is reworkable at a suitable processing temperature.
    Type: Grant
    Filed: December 13, 1993
    Date of Patent: October 10, 1995
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Joyce B. Hall, Peter B. Hogerton, Jean-Marc Pujol
  • Patent number: 5439977
    Abstract: An acid anhydride-containing one package epoxy resin composition consisting indispensably of (1) an epoxy resin having two or more epoxy groups in one molecule, (2) an acid anhydride, (3) at least one of (a) a liquid latent curing accelerator, (b) a latent curing accelerator soluble in an epoxy resin having two or more epoxy groups in one molecule and (c) a latent curing accelerator soluble in an acid anhydride, and (4) a dispersible latent curing accelerator, wherein the ratio of (1) to (2) is from 0.8 to 1.2, defined as the number of acid anhydride equivalents/the number of epoxy equivalents, and the amounts of (3) and (4) each are from 0.1 to 10 parts by weight to 100 parts by weight of the epoxy resin. The composition has excellent infiltrability, storage stability and reactivity.
    Type: Grant
    Filed: April 15, 1994
    Date of Patent: August 8, 1995
    Assignee: Ajinomoto Co., Inc.
    Inventors: Tadahiko Yokota, Hiroyuki Sakata, Kiyomiki Hirai, Koji Takeuchi
  • Patent number: 5426150
    Abstract: A storage-stable suspension of an epoxy resin hardener and a toughener useful as a molding composition is prepared via a) the addition of an organic solvent to an aqueous emulsion of the toughener when using a water-sensitive hardener, such as a polycarboxylic anhydride, removing the water as an azeotrope by vacuum distillation, then adding the epoxy resin hardener and removing the residual solvent by vacuum distillation, or b) the addition of an aqueous emulsion of the toughener with or without an organic solvent to the epoxy resin hardener when using a water-insensitive hardener such as a polyamine, and removing the water and any organic solvent by vacuum distillation.
    Type: Grant
    Filed: May 10, 1994
    Date of Patent: June 20, 1995
    Assignee: Ciba-Geigy Corporation
    Inventors: Sameer H. Eldin, Robert P. Peyer, Frans Setiabudi
  • Patent number: 5420202
    Abstract: The present invention provides a toughened cycloaliphatic epoxy resin composition comprising:(a) a curable cycloaliphatic epoxy resin,(b) an epoxidized low viscosity polydiene polymer wherein the polymer contains from 2.0 to 6.0 milliequivalents of epoxy per gram of polymer, and(c) a curing agent.
    Type: Grant
    Filed: April 15, 1994
    Date of Patent: May 30, 1995
    Assignee: Shell Oil Company
    Inventors: David J. St. Clair, James R. Erickson
  • Patent number: 5414043
    Abstract: A curable molding material comprises a coherent phase of a free-radical curable, unsaturated polyester resin in which finely particulate polyolefin particles are dispersed as disperse phase, the two phases being chemically bound to one another at the interfaces by ionic bonds.
    Type: Grant
    Filed: October 12, 1993
    Date of Patent: May 9, 1995
    Assignee: BASF Aktiengesellschaft
    Inventors: Anton Hesse, Albin Berger, Walter Heckmann, Roger Klimesch
  • Patent number: 5401795
    Abstract: The description relates to a physically drying water-based coating agent. It contains water, pigments, neutralizing agents, conventional additives, small proportions of solvents and a binder mixture consisting ofA) 10 to 90 wt. % polyurethanes with carbonate groupings and a glass transition temperature of <0.degree. C. based on reaction products of polyisocyanates with polyhydroxyl compounds, with a content of polyhydroxy polycarbonates andB) 90 to 10 wt. % of reaction products of carboxy-functional polycondensates and .alpha.,.beta.-olefinically unsaturated monomers with a glass transition temperature of >0.degree. C. in the form of an aqueous dispersion.The coating agent is particularly suitable for manufacturing lacquers for repairs in the motor vehicle sector.
    Type: Grant
    Filed: April 19, 1993
    Date of Patent: March 28, 1995
    Assignee: Herberts Gesellschaft mit beschrankter Haftung
    Inventors: Thomas Brock, Hans-Peter Patzschke, Fritz Sadowski
  • Patent number: 5391399
    Abstract: A fiber glass reinforced plastic can be in-mold coated utilizing a free radical peroxide initiated thermosetting composition of at least one polymerizable epoxy based oligomer having at least two acrylate groups, at least one copolymerizable ethylenically unsaturated monomer, at least one copolymerizable monoethylenically unsaturated compound having a --CO-- group and a --NH.sub.2, --NH-- and/or --OH group, and other conventional components such as at least one zinc salt of a fatty acid, at least one accelerator, at least one filler, and the like. The thermosetting compositions of the present invention utilize a very low or nil amount of an adhesion agent such as a polyvinyl acetate and unexpectedly achieves better flow and good coverage at reduced coating weights.
    Type: Grant
    Filed: June 9, 1994
    Date of Patent: February 21, 1995
    Assignee: GenCorp Inc.
    Inventors: David S. Cobbledick, Donald F. Reichenbach, Brian Sullivan, Robert L. Spencer
  • Patent number: 5389705
    Abstract: Novel polymers which are suitable as binders are obtainable by reacting(A) a base resin which has an average molecular weight M.sub.w of from 200 to 5,000 and contains on average from 1 to 3 epoxy or isocyanato groups as the reactive groups per moleculewith(B) a mixture of(B1) 5 to 50% by weight of polyisobutylene which is terminated with primary amino groups and has an average molecular weight M.sub.w of from 500 to 5,000 and(B2) 5-95% by weight of an amidoamine which carries primary amino groups and is obtainable by condensation of diprimary diamines of 2 to 20 carbon atoms with aliphatic C.sub.2 -C.sub.44 -dicarboxylic acids,the amounts being such that from 1 to 5 equivalents of primary amino groups of (B) are present per equivalent of reactive groups of (A).
    Type: Grant
    Filed: August 6, 1993
    Date of Patent: February 14, 1995
    Assignee: BASF Lacke + Farben Aktiengesellschaft
    Inventors: Klaus Huemke, Helmut Fobbe, Konrad Knoll
  • Patent number: 5385977
    Abstract: Polymeric reaction products are obtained by reactingI) prepolymers obtained fromA) polyoxyalkylenes which have an average molecular weight M.sub.n of from 140 to 10,000 and contain on average from 1.5 to 3.0a.sub.1) primary or secondary amino groups ora.sub.2) epoxy groupsper molecule andB) polymers which are based on conjugated dienes, have an average molecular weight M.sub.n of from 250 to 50,000 and contain on average from 1.5 to 3.0b.sub.1) primary or secondary amino groups orb.sub.2) epoxy groupsper molecule, the components (a.sub.1) and (b.sub.2) or (a.sub.2) and (b.sub.1) being reacted with one another so that from at least an amino equivalent excess to 3 amino equivalents of component (a.sub.1) or (b.sub.1) are present per epoxide equivalent of component (a.sub.2) or (b.sub.2),withII) at least one compound which forms free radicals.
    Type: Grant
    Filed: March 31, 1994
    Date of Patent: January 31, 1995
    Assignee: BASF Lacke + Farben AG
    Inventors: Dieter Faul, Gerhard Hoffmann, Klaus Huemke, Ulrich Heimann, John A. Gilbert
  • Patent number: 5385978
    Abstract: Crimped acrylic fibers with a small diameter, a minimum aspect ratio in the 20-50 range, and having a crimp of greater than about 10% so as to enhance the viscosity of polymers, resistance to gravity-induced slumping when applied to vertical surfaces, and mix stability, as well as provide matrix reinforcement and toughness, are adapted to act as improved physical thixotropes in adhesives, sealants, coatings, paints, grouts, building materials and the like.
    Type: Grant
    Filed: June 8, 1994
    Date of Patent: January 31, 1995
    Assignee: Cytec Technology Corp.
    Inventors: Robert E. Evans, Arutun Maranci, Stanley S. Kaminski
  • Patent number: 5373068
    Abstract: Use of isophoronediamine isomer mixtures containing more than 40%, preferably more than 50 up to 70%, of the trans-isomer and less than 60%, preferably less than 50 down to 30%, of the cis-isomer as reactant in polyaddition resins selected from epoxy, polyurethane and polyurea resins. As curing agents in epoxy resins compared with previously known isomer mixtures, the isomer mixtures containing more than 40% of the trans-isomer and less than 60% of the cis-isomer unexpectedly lead to an extended pot life with simultaneously reduced maximum curing temperature and therefore reduced shrinkage problems. The isomer mixtures are also surprisingly suitable as amine components with reduced reactivity for the chain extension of polyurethane/polyureas.
    Type: Grant
    Filed: September 9, 1993
    Date of Patent: December 13, 1994
    Assignee: Degussa Aktiengesellschaft
    Inventors: Hermann Piana, Klaus Huthmacher
  • Patent number: 5359002
    Abstract: A fiber glass reinforced plastic can be in-mold coated utilizing a free radical peroxide initiated thermosetting composition of at least one polymerizable epoxy based oligomer having at least two acrylate groups, at least one copolymerizable ethylenically unsaturated monomer, at least one copolymerizable monoethylenically unsaturated compound having a --CO-- group and a --NH.sub.2, --NH-- and/or --OH group, and other conventional components such as at least one zinc salt of a fatty acid, at least one accelerator, at least one filler, and the like. The thermosetting compositions of the present invention utilize a very low or nil amount of an adhesion agent such as a polyvinyl acetate and unexpectedly achieves better flow and good coverage at reduced coating weights.
    Type: Grant
    Filed: September 13, 1993
    Date of Patent: October 25, 1994
    Assignee: GenCorp Inc.
    Inventors: David S. Cobbledick, Donald F. Reichenbach, Brian Sullivan, Robert L. Spencer
  • Patent number: 5346957
    Abstract: Disclosed herein is an adhesive composition comprising (A) 100 parts by weight of at least one rubber component selected from the group consisting of unsaturated nitrile-conjugated diene copolymer rubbers prepared by an aqueous suspension polymerization, containing 10-45 wt. % of unsaturated nitrile units in their polymer chains and having a Mooney viscosity (ML.sub.1+4, 100.degree. C.) of 30-100, and hydrogenated unsaturated nitrile-conjugated diene copolymer rubbers obtained by hydrogenating at least part of carbon-carbon double bonds in each of the unsaturated nitrile-conjugated diene copolymer rubbers, and (B) 50-500 parts by weight of at least one thermosetting resin selected from the group consisting of phenolic resins and epoxy resins.
    Type: Grant
    Filed: August 19, 1993
    Date of Patent: September 13, 1994
    Assignee: Nippon Zeon Co., Ltd.
    Inventors: Suguru Tsuji, Hiromi Numata, Shinji Komiyama
  • Patent number: 5336722
    Abstract: Polymeric reaction products are obtained by reactingI) prepolymers obtained fromA) polyoxyalkylenes which have an average molecular weight M.sub.n of from 140 to 10,000 and contain on average from 1.5 to 3.0a.sub.1) primary or secondary amino groups ora.sub.2) epoxy groups per molecule andB) polymers which are based on conjugated dienes, have an average molecular weight M.sub.n of from 250 to 50,000 and contain on average from 1.5 to 3.0b.sub.1) primary or secondary amino groups orb.sub.2) epoxy groups per molecule, the components (a.sub.1) and ( b.sub.2) or (a.sub.2) and (b.sub.1) being reacted with one another so that from at least an amino equivalent excess to 3 amino equivalents of component (a.sub.1) or (b.sub.1) are present per epoxide equivalent of component (a.sub.2) or (b.sub.2), withII) at least one compound which forms free radicals.
    Type: Grant
    Filed: November 20, 1992
    Date of Patent: August 9, 1994
    Assignee: BASF Lacke+Farben Aktiengesellschaft
    Inventors: Dieter Faul, Gerhard Hoffmann, Klaus Huemke, Ulrich Heimann, John A. Gilbert
  • Patent number: 5336701
    Abstract: A process is provided for producing improved color acrylonitrile polymer gels involving compounding a composition of an acrylonitrile polymer with an electrophilic reagent to produce acrylonitrile polymer gels, and admixing water with the gels to reduce the yellowness thereof. Improved color, reduced gloss polycarbonate/graft polymer blends are provided by compounding the resultant gels with polycarbonate, a styrene-acrylonitrile copolymer and ABS graft polymer to form reduced gloss PC/ABS/SAN composition. The process provides acrylonitrile gels and reduced gloss compositions exhibiting improved levels of color. The blend compositions are useful as molding resins and the gelled acrylonitrile polymer is useful as a gloss reducing additive.
    Type: Grant
    Filed: September 28, 1992
    Date of Patent: August 9, 1994
    Assignee: General Electric Company
    Inventors: Robert H. Wildi, Keith E. Cox, Jack A. Hill
  • Patent number: 5332785
    Abstract: A liquid coating composition based on a polymer containing acetoacetate groups and a polyamine in the form of the corresponding aldimine or ketimine, the polymer containing acetoacetate groups being obtained by reacting a polyepoxide containing hydroxyl groups, or a polyepoxide which is partially or completely reacted with monocarboxylic acids, with acetoacetic acid derivatives. These liquid coating compositions are suitable in particular as binders in two-component fillers for automotive refinishing or as two-component primers.
    Type: Grant
    Filed: March 29, 1993
    Date of Patent: July 26, 1994
    Assignee: Hoechst Aktiengesellschaft
    Inventor: Gerhard Brindoepke
  • Patent number: 5332781
    Abstract: Storage-stable suspension comprised of a solid or liquid epoxy resin hardener and a solid or liquid toughener suspended therein is distinguished by excellent homogeneous dispersion of the toughener in the epoxy resin hardener and are suitable for preparing suspensions of curable epoxy resin compositions.
    Type: Grant
    Filed: June 22, 1993
    Date of Patent: July 26, 1994
    Assignee: Ciba-Geigy Corporation
    Inventors: Sameer H. Eldin, Robert P. Peyer, Frans Setiabudi
  • Patent number: 5332783
    Abstract: A compatible polymer blend comprising: a curable aromatic epoxy resin, an epoxidized polydiene polymer, and an anhydride or polycarboxylic acid curing agent. The invention also relates to structural adhesive compositions comprising cured compatible polymer blends as described.
    Type: Grant
    Filed: July 12, 1993
    Date of Patent: July 26, 1994
    Assignee: Shell Oil Company
    Inventors: Steven H. Dillman, Michael A. Masse, James R. Erickson
  • Patent number: 5322896
    Abstract: The invention relates to a process for producing improved water absorbing resin comprising the steps of treating water absorbing resin particles (A) with an aqueous solution of a water-soluble compound (B) and a crosslinking agent (C), reacting, and obtaining resin particles crosslinked in the surface vicinity; and a water absorbing resin obtained by this process possessing the absorption characteristics of an absorbency under a pressure-free state of 50 times or more to physiological saline solution, and an absorbency under the pressurized state of 30 times or more to physiological saline solution. The water-soluble compound (B) is at least one water-soluble compound selected from the group consisting of alkylene-oxide adducts of monofunctional alcohols (1), a monofunctional salts of organic acids (2), and lactams (3), and inert to (A) and (C); and the crosslinking agent (C) has two or more functional groups capable of reacting with (A).
    Type: Grant
    Filed: January 6, 1993
    Date of Patent: June 21, 1994
    Assignee: Sanyo Chemical Industries, Ltd.
    Inventors: Shigeki Ueda, Kenji Tanaka
  • Patent number: 5318851
    Abstract: Curable compositions which are precursors for cured or partially cured light stabilized epoxy resins which are the product of the reaction of some or all of the epoxy groups of an epoxy resin with an N-(2,2,6,6-tetraalkyl-4-piperidinyl)amic acid hydrazide as well as the cured or partially cured reaction products thereof together with processes for their use and articles of manufacture produced thereby are disclosed.
    Type: Grant
    Filed: April 2, 1993
    Date of Patent: June 7, 1994
    Assignee: Elf Atochem N.A., Inc.
    Inventors: Arthur L. Baron, Ronald E. MacLeay, Jennifer P. Kmiec
  • Patent number: 5317067
    Abstract: The present invention provides an epoxy resin composition which is obtained by melt-mixing 100 parts by weight of an epoxy resin with 3 to 33 parts by weight of a thermoplastic resin alone or in combination with other components and additives than a hardener in the first mixing step and then with a hardener alone or in combination with other components and additives in the second mixing step, said epoxy resin having a number-average molecular weight of at least 200 and lower than 5000 and said thermoplastic resin having a number-average molecular weight of at least 5000; an adhesive epoxy resin molded article which is obtained by molding said epoxy resin composition; a process for producing an adhesive epoxy resin molded article which comprises molding said epoxy resin composition into a 0.01 to 10 mm thick film or sheet in a substantially uncured state and subsequently punching the film or sheet at temperatures higher than 15.degree. C. and lower than 70.degree. C.
    Type: Grant
    Filed: February 3, 1992
    Date of Patent: May 31, 1994
    Assignee: Tokyo Tire & Rubber Company Limited
    Inventors: Koji Yagi, Seiichi Fukunaga
  • Patent number: 5310789
    Abstract: An adhesive composition for a vinyl halide resin is disclosed. This adhesive composition is formed by incorporating an aliphatic polyamine having a plurality or ether bonds, an alicyclic polyamine or an alkylene diamine into a blend of an epoxy resin and a vinyl chloride copolymer resin. This adhesive composition is effectively used in the solvent-free state for a molded body of a vinyl halide type resin such as a vinyl chloride resin or a vinylidene halide resin.
    Type: Grant
    Filed: April 12, 1993
    Date of Patent: May 10, 1994
    Assignee: Mitsui Petrochemical Industries, Ltd.
    Inventors: Toshikazu Furihata, Toru Tomoshige
  • Patent number: 5302666
    Abstract: A resin composition for fiber reinforced plastic comprising the following components A, B, C, D and E as essential components:A: a bisphenol A epoxy resin having an epoxy equivalent of at most 250 and being liquid at room temperature,B: a bisphenol A epoxy resin having an epoxy equivalent within a range of from 400 to 5,000 and softening point of from 60.degree. to 200.degree. C.,C: a phenol novolak type epoxy resin,D: a nitrile rubber, andE: a curing agent.
    Type: Grant
    Filed: January 4, 1991
    Date of Patent: April 12, 1994
    Assignee: Mitsubishi Kasei Corporation
    Inventors: Seiichi Hino, Jun Enda, Masaki Yamamoto
  • Patent number: 5300584
    Abstract: A low viscosity, diprimary amine-terminated reactive liquid polymer with low residual amine content, comprising the reaction product of a diprimary amine having the following formulaH.sub.2 N--R--NH.sub.2wherein --NH.sub.2 is a primary terminal amine group; andwherein R is(1) a C.sub.4 -C.sub.12 aliphatic chain having alkyl branches containing 2 to 4 carbons, wherein the positions of said alkyl branches within the C.sub.4 -C.sub.12 aliphatic chain are such that they impart relatively different rates of reactivity to the terminal primary amine groups; or(2) a carbon to carbon backbone containing at least one non-reactive heteroatom, comprising(a) a C.sub.2 -C.sub.20 aliphatic or cycloaliphatic moiety containing at least one tertiary amine; or(b) a polyoxyalkylene wherein the alkyl portion of said polyoxyalkylene contains 2 to 4 carbon atoms;and a functional-terminated reactive liquid polymer useful as an epoxy resin modifier employed with a curing agent.
    Type: Grant
    Filed: September 17, 1992
    Date of Patent: April 5, 1994
    Assignee: The B. F. Goodrich Company
    Inventor: Julius Farkas
  • Patent number: 5292807
    Abstract: The present invention relates to compositions which are storage stable at room temperature and containA) at least one compound having at least two cyclic isourea groups per molecule andB) at least one compound having at least two carboxyl groups per molecule,in an amount sufficient to provide a molar ratio of isourea groups to carboxyl groups of 0.5:1 to 1.5:1.
    Type: Grant
    Filed: January 27, 1993
    Date of Patent: March 8, 1994
    Assignee: Bayer Aktiengesellschaft
    Inventors: Walter Schafer, Hanns P. Muller, Hans-Joachim Kreuder, Manfred Bock, Knud Reuter
  • Patent number: 5292808
    Abstract: A polyamide resin composition having a multi-phase structure and a process for producing the same are disclosed, the composition comprising:(A) from 60 to 97 parts by weight of a polyamide resin containing at least 2 parts by weight of (A-1) a polyamide resin having a concentration ratio of terminal carboxyl group to terminal amino group of 1.5 or more,(B) from 3 to 40 parts by weight of an ethylene copolymer comprising:(a) from 40 to 90% by weight of an ethylene unit,(b) from 5 to 60% by weight of an .alpha.,.beta.-unsaturated carboxylic acid alkyl ester unit, and(c) from 0.3 to 10% by weight of a maleic anhydride unit, and(C) from 0.
    Type: Grant
    Filed: June 7, 1993
    Date of Patent: March 8, 1994
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Tadayuki Ohmae, Yoshiki Toyoshima, Kentaro Mashita, Noboru Yamaguchi, Jinsho Nambu
  • Patent number: 5288770
    Abstract: A resin composition for a cationically electrodepositable paint comprising(A) a resin having hydroxyl groups and cationic groups,(B) an epoxy resin having at least 2 epoxy functional groups each of which comprises an epoxy group directly bound to an alicyclic ring and/or bridged alicyclic ring on average per molecule, and(C) a finely divided gelled polymer as principal components, wherein said finely divided gelled polymer is obtained by emulsion polymerizing(C-1) a polymerizable monomer containing at least two radically polymerizable unsaturated groups in the molecule, and(C-2) a radically polymerizable unsaturated monomer other than the one mentioned in (C-1), abovein the presence of a reactive emulsifier containing an allyl group in the molecule.
    Type: Grant
    Filed: January 22, 1991
    Date of Patent: February 22, 1994
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Teiji Katayama, Eisaku Nakatani, Haruo Nagaoka, Kenji Yamamoto, Reiziro Nishida
  • Patent number: 5288802
    Abstract: Curable coating compositions are provided containing an amine group containing polyepoxide resin, an acetoacetate containing polyester having a weight average molecular weight of at least 1000, and a polyacrylate containing material. The amine group containing polyepoxide can be modified with a ketone and/or an aldehyde to form a ketimine and/or an aldimine containing polyepoxide. The compositions are useful as coatings, particularly as ambient or low temperature curable automotive refinish primer coatings having good corrosion resistance, adhesion to both substrate and other organic coatings, sandability and pot-life.
    Type: Grant
    Filed: January 25, 1993
    Date of Patent: February 22, 1994
    Assignee: PPG Industries, Inc.
    Inventors: David N. Walters, Cathy A. Kreutzer, Padmanabhan Sundararaman
  • Patent number: 5284917
    Abstract: Disclosed is a thermoplastic resin composition having excellent moldability and thermal resistance which comprises(A) a methacrylimide-containing polymer having at least 10% by weight of units represented by the general formula ##STR1## where R is a hydrogen atom or an aliphatic, aromatic or alicyclic hydrocarbon radical having 1 to 20 carbon atoms,(B) at least one thermoplastic polymer selected from the group consisting of a thermoplastic polyester (B-1) and a thermoplastic polyamide (B-2), and(C) at least one multifunctional compound selected from the group consisting of a multifunctional epoxy compound, a multifunctional oxazoline compound and a multifunctional isocyanate compound.
    Type: Grant
    Filed: July 5, 1991
    Date of Patent: February 8, 1994
    Assignee: Mitsubishi Rayon Co., Ltd.
    Inventors: Naoki Yamamoto, Hiroshi Mori, Masaharu Fujimoto
  • Patent number: 5280068
    Abstract: Curable epoxy resins are toughened with statistical monofunctional carboxyl, amine or epoxy terminated reactive polymers and have low viscosities before cure thereby making them useful in a wide range of applications. The cured epoxy resin systems which are modified by the statistical monofunctional reactive polymers have physical properties, such as adhesion and elongation, generally equal to or better than those of cured epoxy resin systems modified with statistical difunctional reactive polymers. A process of preparation for the modified epoxy resin systems of the present invention includes admixing an epoxy resin with a statistical monofunctional carboxyl, amine, or epoxy-terminated reactive polymer in the presence of a curing agent and reaction therewith to form the toughened, cured epoxy resin system.
    Type: Grant
    Filed: May 26, 1992
    Date of Patent: January 18, 1994
    Assignee: The B.F. Goodrich Company
    Inventors: Alan R. Siebert, Robert J. Bertsch
  • Patent number: 5276125
    Abstract: The present invention relates to heat-curable coating compositions containingA) a prepolymer having an average of 2-4 ketoxime-blocked NCO groups, having an average moleculer weight of 500-15,000 and prepared from aliphatic, cycloaliphatic and aromatic polyisocyanates and one or more polyhydroxy components which contain 0 to 30% by weight of ethylene oxide units andB) a crosslinking agent of the formula ##STR1## wherein R and R.sup.1 represent H or C.sub.1 -C.sub.4 -alkyl, the ratio of equivalents of blocked NCO groups in A) to NH.sub.2 groups in B) being 1.35:1 to 0.
    Type: Grant
    Filed: November 21, 1990
    Date of Patent: January 4, 1994
    Assignee: Bayer Aktiengesellschaft
    Inventors: Josef Pedain, Wilhelm Thoma, Walter Schroer, Waldemar Kling, Manfred Dietrich