Mixed With Silicon-containing Reactant Or Polymer Derived Therefrom Patents (Class 525/393)
  • Patent number: 7109273
    Abstract: It is an object of the present invention to provide a non-gelling solid silane coupling agent which enhances adhesion of a resin composition to metals and so forth when added to the resin composition, and which has excellent storage stability and molten fluidity. The present invention is a non-gelling, pulverizable, solid silane coupling agent composition composed of a reaction product of the following components.
    Type: Grant
    Filed: August 5, 2003
    Date of Patent: September 19, 2006
    Assignee: Nikko Materials Co., Ltd.
    Inventors: Katsuyuki Tsuchida, Masashi Kumagai
  • Patent number: 7105614
    Abstract: A curable epoxy resin composition comprising at least: (A) a crystalline epoxy resin, (B) a phenol resin, and (C) a silicone resin composed of epoxy-containing organic groups and phenyl groups that define an average unit formula of this component. Component (C) is used in an amount of 0.1 to 500 parts by weight for 100 parts by weight of the sum of weights of components (A) and (B). The composition of the invention is suitable for transfer and injection molding and may find use as a curable epoxy resin composition for sealing parts of electrical and electronic devices.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: September 12, 2006
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Yoshitsugu Morita, Hiroshi Ueki, Koji Nakanishi, Haruhiko Furukawa
  • Patent number: 6984699
    Abstract: This invention provides a sizing composition for glass fibers useful in reinforcing an olefin resin, which comprises at least a) an acid-modified olefin resin which has been neutralized with an amine and b) an amino-containing silane coupling agent. The sizing composition makes it possible to firmly adhere an olefin resin as a matrix resin and the glass fibers with each other and hence, to provide a molding having excellent strength without occurrence of fuzzing on the resin pellets or the molding. This invention also provides glass fibers for olefin resin reinforcement and a production process of an olefin resin composition for fiber-reinforced moldings.
    Type: Grant
    Filed: December 27, 2002
    Date of Patent: January 10, 2006
    Assignee: Asahi Fiber Glass Co., Ltd.
    Inventor: Yoshiro Niino
  • Patent number: 6878782
    Abstract: A curable composition includes a functionalized poly(arylene ether); an alkenyl aromatic monomer; an acryloyl monomer; and a polymeric additive having a glass transition temperature less than or equal to 100° C. and a Young's modulus less than or equal to 1000 megapascals at 25° C. The polymeric additive is soluble in the combined functionalized poly(arylene ether), alkenyl aromatic monomer, and acryloyl monomer at a temperature less than or equal to 50° C. The composition exhibits low shrinkage on curing and improved surface smoothness. It is useful, for example, in the manufacture of automotive body panels.
    Type: Grant
    Filed: April 9, 2002
    Date of Patent: April 12, 2005
    Assignee: General Electric
    Inventors: Glen David Merfeld, Gary William Yeager, Robert Edgar Colborn, Bryan Duffey
  • Patent number: 6852370
    Abstract: A composition for film formation capable of forming a coating film excellent in low dielectric constant characteristics, cracking resistance, modulus of elasticity, and adhesion to substrates and useful as an interlayer insulating film material in semiconductor devices, etc. The composition for film formation contains (A) at least one member selected from an aromatic polyarylene and an aromatic poly(arylene ether), (B) a polyvinylsiloxane, and (C) an organic solvent.
    Type: Grant
    Filed: March 22, 2002
    Date of Patent: February 8, 2005
    Assignee: JSR Corporation
    Inventors: Noriyasu Shinohara, Kaori Shirato, Michinori Nishikawa, Takashi Okada, Kinji Yamada
  • Publication number: 20040258727
    Abstract: Composite interpenetrating network (IPN) of PDMS and PNIPAAM was formed to generate polymers with oxygen and glucose permeability as well as improved wettability compared to PDMS homopolymers and greater mechanical strength than PNIPAAM homopolymers. Transparent vinyl and hydroxyl terminated PDMS/PNIPAAM IPNs (PDMS-V and PDMS-OH IPNs respectively) were successfully synthesized. Transmission electron microscopy images verified the structure of the IPNs. Surface analysis suggested that PNIPAAM was present on the surface as well as in the bulk material. PDMS-OH IPNs generated from a PDMS-OH matrix cured in the presence of solvent had the highest glucose permeability at 10−7 cm2/s, comparable to that of the native cornea. The LCST phenomenon remained in these materials, although changes were not as abrupt as with pure PNIPAAM. These results suggest that these materials may be further developed as ophthalmic biomaterials or for controlled drug release applications.
    Type: Application
    Filed: May 28, 2004
    Publication date: December 23, 2004
    Inventors: Lina Liu, Heather D. Sheardown
  • Patent number: 6797790
    Abstract: The polymeric composition for friction elements comprises a co-polymer between (I) a resin containing phenolic groups and a reticulation agent, and (II) an organopolysiloxane resin containing terminal silanol groups. A part at least of the phenolic groups is bound to the terminal silanol groups. A process of the preparation of the above polymeric composition may comprise the following steps: a) mixing (I) a resin containing the phenolic groups and the reticulation agent, (II) containing the terminal silanol groups, and (III) an epoxy resin or the epoxidisesd organopolysiloxane; b) curing the mixture for a period of time sufficient to complete substantially the reaction between the phenolic groups and the terminal silanol groups, c) post-heating the product obtained under b).
    Type: Grant
    Filed: April 23, 2002
    Date of Patent: September 28, 2004
    Assignee: Nisshinbo Industries, Inc.
    Inventors: Vasilios Kanellopoulos, Isabelle Louis-Joseph-Dogue, Vincent Daniel McGinniss, Duryodhan Mangaraj, Tomoki Tsuchiy Nakamura
  • Publication number: 20040039132
    Abstract: Resin modified elastomers, methods of making them and their uses. The method for making the elastomers comprises reacting in a diluent an ≡SiH functional siloxane; a diene, diyne or ene-yne compound, a resin having the formula (R13SiO1/2)x(SiO4/2)y(R1SiO3/2)z where each R1 is independently a monovalent hydrocarbon group having 1 to 30 carbon atoms or an unsaturated hydrocarbon group having 2 to 30 carbon atoms x is≧1, y≧0, z≧0 and y+z≧1.
    Type: Application
    Filed: August 26, 2002
    Publication date: February 26, 2004
    Inventors: Michael Salvatore Ferritto, Tina Marie Leaym, William James Schulz, Janet Mary Smith
  • Patent number: 6624260
    Abstract: By using a curable composition comprising, (A) per 100 parts by weight of an epoxy resin, (B) from 1 to 50 parts by weight of a reactive silicon group-containing polyoxyalkylene polymer, and (C) from 1 to 90 parts by weight of a curing agent for epoxy resins, the working properties of an existing rubber-modified epoxy resin are improved to thereby give stable adhesion properties (for example, improved peel strength) without worsening the shear strength.
    Type: Grant
    Filed: April 13, 2001
    Date of Patent: September 23, 2003
    Assignee: Kaneka Corporation
    Inventors: Katsuhiro Ando, Junji Takase, Fumio Kawakubo
  • Patent number: 6545116
    Abstract: A flame retardant for thermoplastic resins comprising polyorganosiloxane crosslinked particles having a toluene-insoluble matter content of at least 50% by weight and an average particle size of 0.01 to 2,000 &mgr;m, which provides flame retardant resin compositions of low environmental load generating no harmful gas at the time of burning and having an excellent impact resistance by the incorporation thereof into thermoplastic resins.
    Type: Grant
    Filed: September 15, 2000
    Date of Patent: April 8, 2003
    Assignee: Kaneka Corporation
    Inventors: Nobuo Miyatake, Kazunori Takikawa, Daisuke Nakamori, Shigeki Hamaguchi
  • Patent number: 6528590
    Abstract: The present invention relates to an aqueous copolymer dispersion consisting essentially of A) an aqueous dispersion of a copolymer having a solids content of from 20 to 65% by weight, said copolymer being composed of various monomers and the weight fractions of the various monomers being chosen within the stated limits such that a synthetic resin composed of these monomers alone would have a glass transition temperature in the range from −50 to 35° C., B) from 0 to 10% by weight, based on the copolymer A, of benzophenone, acetophenone, one or more acetophenone derivatives or benzophenone derivatives without an ethylenically unsaturated group, or a mixture thereof, C) from 0.3 to 10% by weight, based on the copolymer A, of emulsifiers, and D) from 0 to 5% by weight, based on the copolymer A, of protective colloids; to a process for its preparation and to its use.
    Type: Grant
    Filed: October 5, 2001
    Date of Patent: March 4, 2003
    Assignee: Clariant GmbH
    Inventors: Dierk Beyer, Volker Renisch, Rolf Kuropka, Susana Maria De Almeida Carvalho
  • Patent number: 6509421
    Abstract: To an aromatic ring-bearing synthetic resin such as an aromatic polycarbonate resin or aromatic epoxy resin is added a minor amount of an organopolysiloxane which contains phenyl radicals and monofunctional siloxane units in a molecule wherein the contents of alkoxy radicals and hydroxyl radicals are each set at less than 2% by weight. Molded parts of the resin composition are flame retardant, optically transparent, and recyclable for reuse.
    Type: Grant
    Filed: March 5, 2001
    Date of Patent: January 21, 2003
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Akinari Itagaki, Masaaki Yamaya, Yoshiteru Kobayashi
  • Patent number: 6506868
    Abstract: The present invention provides a partial condensate of glycidyl ether group-containing alkoxysilane which is obtainable by dealcoholization reaction between glycidol and a partial condensate of alkoxysilane, compositions comprising the same and preparation methods thereof. Further, the present invention provides an alkoxy-containing silane-modified polyimide resin, alkoxy-containing silane-modified polyamide-imide resin and alkoxy-containing silane-modified phenol resin which are modified with the partial condensate of glycidyl ether group-containing alkoxysilane, and preparation methods thereof.
    Type: Grant
    Filed: March 7, 2001
    Date of Patent: January 14, 2003
    Assignee: Arakawa Chemical Industries, Ltd.
    Inventors: Hideki Goda, Shoji Takeda, Tetsuji Higashino
  • Patent number: 6492482
    Abstract: A nonaqueous, heat-cured, two-component coating has a combination of good scratch resistance and resistance to etching by acid rain and comprises a solvent-containing polyol component and a cross-linking component. The cross-linking component comprises at least one aliphatic and/or cycloaliphatic polyisocyanate having 2 to 6 NCO functional groups per molecule in which 0.1 to 95 mol % of the isocyanate groups of the polyisocyanate are reacted with an N-alkyl-3-aminopropyltrialkoxysilane and/or an N-aryl-3-aminopropyltrialkoxysilane. The weight ratio of the polyol to the cross-linking component in the coating is 6:1 to 1:2.
    Type: Grant
    Filed: December 1, 2000
    Date of Patent: December 10, 2002
    Assignee: Deguss-Huels Aktiengesellschaft
    Inventors: Rainer Lomoelder, Friedrich Plogmann, Peter Speier
  • Patent number: 6479584
    Abstract: The invention provides a resin composition comprising a crosslinking silyl-terminated stellar-structure vinyl polymer or a stellar-structure vinyl block copolymer or chain-extended vinyl block copolymer. The invention provides a method of producing a stellar-structure vinyl block copolymer or chain-extended vinyl block copolymer which comprises forming a block copolymer using living radical polymerization and adding a compound having two or more polymerizable carbon-carbon double bonds at the end point of polymerization of the block copolymer.
    Type: Grant
    Filed: August 9, 2001
    Date of Patent: November 12, 2002
    Assignee: Kaneka Corporation
    Inventors: Yoshiki Nakagawa, Katsuhiko Kimura, Masayuki Fujita, Kenichi Kitano
  • Patent number: 6420556
    Abstract: The subject invention involves novel acyl isothiocyanate resins of formula (I) and processes for making them: (a) starting with a phenyl carboxy resin, treating the resin with any reagent that converts the carboxy to an acyl halide, followed by treatment with tetranikylammonium thiocyanate or an alkali metal salt thereof, to provide the acyl isothiocyanate resin. The subject invention also involves processes for making guanidine compounds and related cyclized compounds using an acyl isothiocyanate resin, comprising the following steps: (b) reacting the acyl isothiocyanate resin with a primary amine; (c) reacting the product from Step (b) with a sulfur activating agent and ammonia or a primary or secondary amine; (d) treating the product from Step (c) with a strong base or medium strength acid to cleave product from the resin, providing the guanidine compound or/and the related cyclized compound.
    Type: Grant
    Filed: June 12, 2001
    Date of Patent: July 16, 2002
    Assignee: The Procter & Gamble Company
    Inventor: Lawrence Joseph Wilson
  • Patent number: 6414091
    Abstract: There are provided: (I) a thermoplastic resin (X-1) obtained by a process comprising the step of reacting: (1) a polyphenylene ether resin (A) with (2) a specific polyorganosiloxane (B), (II) a thermoplastic resin (X-2) obtained by a process comprising the step of reacting: (1) a polyphenylene ether resin (A), with (2) a specific polyorganosiloxane (B) and (3) a coupling agent (C), (III) a process for producing the thermoplastic resin (X-1), which comprises the step of reacting: (1) a polyphenylene ether resin (A) with (2) a specific polyorganosiloxane (B), (IV) a process for producing the thermoplastic resin (X-2), which comprises the step of reacting: (1) a polyphenylene ether resin (A) with (2) a specific polyorganosiloxane (B) and (3) a coupling agent (C), and (V) a thermoplastic resin composition (Z-1) comprising: (i) the above-mentioned thermoplastic resin (X-1) or (X-2) and (ii) a thermoplastic resin (D).
    Type: Grant
    Filed: December 12, 2000
    Date of Patent: July 2, 2002
    Assignees: Sumitomo Chemical Company, Limited, NEC Corporation
    Inventors: Satoru Moritomi, Masatoshi Iji
  • Patent number: 6362263
    Abstract: Impact modified, compatibilized poly(phenylene ether)-polyamide compositions containing either a polybutene or an organosiloxane mixture give molded parts with good surface appearance, improved flow at high shear rate, and improved low temperature impact strength in comparison to control blends without added organosiloxane mixture or polybutene.
    Type: Grant
    Filed: December 7, 1999
    Date of Patent: March 26, 2002
    Assignee: General Electric Company
    Inventors: Sterling Bruce Brown, Norberto Silvi, Mark Howard Giammattei, Navjot Singh, Farid Fouad Khouri
  • Patent number: 6346362
    Abstract: Compositions comprising a polymer having silicon, germanium and/or tin; and a protecting group grafted onto a polymeric backbone are useful as resists and are sensitive to imaging irradiation while exhibiting enhanced resistance to reactive ion etching.
    Type: Grant
    Filed: June 15, 2000
    Date of Patent: February 12, 2002
    Assignee: International Business Machines Corporation
    Inventors: Ari Aviram, C. Richard Guarnieri, Wu-Song Huang, Ranee W. Kwong, David R. Medeiros
  • Patent number: 6329460
    Abstract: A polysiloxane composition comprising (i) an alkoxysilyl group-containing polysiloxane containing at least six siloxane structures having the following formula (I) in a molecule wherein R1 represents a methyl group, ethyl group or phenyl group, and R2 represents a group selected from the group consisting of hydrocarbon group and ether bond-containing hydrocarbon groups having 1 to 6 carbon atoms; and (ii) an alcohol having the formula R4(OR5)p—OH wherein R4 represents a C1-C18 alkyl group, a phenyl group or a benzyl group, R5 represents C1-C6 alkylene group and p is an integer of 0-20.
    Type: Grant
    Filed: April 11, 2000
    Date of Patent: December 11, 2001
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Kazunori Ishikawa, Fumito Yatsuyanagi, Hiroyuki Kaido, Naoya Adachi
  • Patent number: 6326425
    Abstract: To an aromatic ring-bearing synthetic resin such as an aromatic polycarbonate resin or aromatic epoxy resin is added a minor amount of an organopolysiloxane which contains phenyl radicals and monofunctional siloxane units in a molecule wherein the contents of alkoxy radicals and hydroxyl radicals are each set at less than 2% by weight. Molded parts of the resin composition are flame retardant, optically transparent, and recyclable for reuse.
    Type: Grant
    Filed: November 16, 1999
    Date of Patent: December 4, 2001
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Akinari Itagaki, Masaaki Yamaya, Yoshiteru Kobayashi
  • Patent number: 6322882
    Abstract: There is provided a polyphenylene ether resin composition comprising: (i) a polyphenylene ether resin; (ii) a phosphoric ester; and (iii) a dispersed substance having an aspect ratio of not less than about 2, and which composition has superior heat resistance and flame resistance without use of any halogen-containing flame retardant or any halogen-containing anti-dripping agent as an essential or mandatory component.
    Type: Grant
    Filed: October 12, 1999
    Date of Patent: November 27, 2001
    Assignee: Sumitomo Chemical Company, Limited
    Inventor: Satoru Moritomi
  • Patent number: 6284824
    Abstract: A polycarbonate composition comprising an aromatic polycarbonate resin and an organopolysiloxane having a specific structure is flame retardant, evolves no harmful gases upon combustion, and is molded into parts with optical transparency.
    Type: Grant
    Filed: November 4, 1998
    Date of Patent: September 4, 2001
    Assignees: NEC Corporation, Shin-Etsu Chenical Co., Ltd.
    Inventors: Masatoshi Iji, Shin Serizawa, Akira Yamamoto, Masaaki Yamaya, Kenji Yamamoto, Yoshiteru Kobayashi
  • Patent number: 6235848
    Abstract: A crosslinkable molding material is provided that includes: (a) 3 to 98 parts by weight of one or more thermoplastics and (b) 2 to 97 parts by weight of a substantially amorphous poly-&agr;-olefin which is grafted with a silane which has at least one olefinic double bond and one to three alkoxy groups bonded directly to the silicon, this grafted poly-&agr;-olefin having a melt viscosity at 190° C. in the range from 100 to 50,000 mPa.s. A molding material or shaped articles are provided that have high impact strength, high tensile strength and a smaller tendency to creep.
    Type: Grant
    Filed: March 3, 1999
    Date of Patent: May 22, 2001
    Assignee: Huels Aktiengesellschaft
    Inventors: Peter Bickert, Hans Guenther Wey
  • Patent number: 6218503
    Abstract: Prepolymers of Formula (I) are useful in hydrogel materials wherein M is a hydrophilic radical derived from at least one hydrophilic ethylenically unsaturated monomer and having a molecular weight of about 500 to 5000; each R is independently selected from an alkylene group having 1 to 10 carbon atoms wherein the carbon atoms may include ether, urethane or ureido linkages therebetween; each R′ is independently selected from hydrogen, monovalent hydrocarbon radicals or halogen substituted monovalent hydrocarbon radicals wherein the hydrocarbon radicals have 1 to 18 carbon atoms which may include ether linkages therebetween; a is an integer equal to or greater than 1; each U is independently a divalent urethane or ureido segment; x is greater than or equal to 1, y is greater than or equal to 1; and z is greater than or equal to 1; and each E is independently a polymerizable, ethylenically unsaturated radical.
    Type: Grant
    Filed: February 25, 2000
    Date of Patent: April 17, 2001
    Assignee: Bausch & Lomb Incorporated
    Inventors: Yu-Chin Lai, Edmond T. Quinn
  • Patent number: 6194518
    Abstract: Solid blends of rubbery polymers and amorphous or crystalline polymers, said blends being free-flowing at temperatures lower than the glass transition temperature or crystalline melting temperature of the amorphous or crystalline polymer, are prepared by intimate mixing procedures. In general, said mixing conditions include high shear conditions sufficient to convert polymer A to dispersed particles coated with polymer B and produce a free-flowing blend.
    Type: Grant
    Filed: December 22, 1998
    Date of Patent: February 27, 2001
    Assignee: General Electric Company
    Inventors: Navjot Singh, Joseph Michael Anostario
  • Patent number: 6184312
    Abstract: A resin composition comprising (A) an aromatic polycarbonate resin or aromatic epoxy resin and (B) a minor amount of an organosiloxane containing phenyl and alkoxy radicals is flame retardant and does not emit harmful gases when burned. It can be molded into parts having optical transparency.
    Type: Grant
    Filed: November 18, 1998
    Date of Patent: February 6, 2001
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kenji Yamamoto, Masaaki Yamaya, Akira Yamamoto, Yoshiteru Kobayashi
  • Patent number: 6051662
    Abstract: Polyphenylene ether-thermosetting resin compositions are provided that are useful as dielectrics, particularly printed circuit boards having improved processability, good solvent and solder resistance, as well as improved morphology as compared to other polyphenylene ether-thermosetting resin compositions. More specifically, the particular polyphenylene ether resin component of this invention has a molecular weight of less than about 3,000 number average in contrast to higher molecular weight polyphenylene ethers employed in other polyphenylene ether-thermosetting resin compositions for use in preparing printed circuit boards.
    Type: Grant
    Filed: August 20, 1998
    Date of Patent: April 18, 2000
    Assignee: General Electric Co.
    Inventors: James E. Tracy, Gary William Yeager
  • Patent number: 5955542
    Abstract: Novel methods and compositions for improving the flame retardant capabilities of aromatic-based polymers like polycarbonate are disclosed. Other important polymer properties are substantially maintained, such as transparency. One aspect of the invention is directed to a flame retardance additive which comprises a copolymer of an aryl-containing silicone compound and a diorganic polysiloxane compound. In some preferred embodiments, the aryl-containing silicone compound is triphenyl- or diphenyl-based. This invention is also directed to new polymer compositions, which comprise an aromatic-based polymer and the flame retardance additive described above. The polymer compositions can be molded into a variety of articles which have a very useful combination of properties.
    Type: Grant
    Filed: March 3, 1997
    Date of Patent: September 21, 1999
    Assignee: General Electric Company
    Inventors: Gary Charles Davis, Larry Neil Lewis
  • Patent number: 5889081
    Abstract: This invention provides: (1) a hinder composition for friction materials, characterized in that it comprises a thermosetting resin and a specific organic silicon compound having phenyl groups, and (2) a friction material having as a binder composition shown in the above item (1). When used for manufacturing friction materials in the brakes and clutches for various kinds of vehicles such as automobiles, it can remarkably improve the facing and abrasion resistances of the friction material.
    Type: Grant
    Filed: January 17, 1996
    Date of Patent: March 30, 1999
    Assignee: Osaka Gas Company Limited
    Inventors: Hiroya Kakegawa, Tokugen Yasuda, Xiangsheng Wang
  • Patent number: 5834565
    Abstract: Polyphenylene ether-thermosetting resin compositions are provided that are useful as dielectrics, particularly printed circuit boards having improved processability, good solvent and solder resistance, as well as improved morphology as compared to other polyphenylene ether-thermosetting resin compositions. More specifically, the particular polyphenylene ether resin component of this invention has a molecular weight of less than about 3,000 number average in contrast to higher molecular weight polyphenylene ethers employed in other polyphenylene ether-thermosetting resin compositions for use in preparing printed circuit boards.
    Type: Grant
    Filed: November 12, 1996
    Date of Patent: November 10, 1998
    Assignee: General Electric Company
    Inventors: James E. Tracy, Gary William Yeager
  • Patent number: 5756562
    Abstract: A novel silicone system comprising a methoxy terminated silane or polysiloxane, an adhesion promoter and water, useful as a filler alone or in combination with other fillers is disclosed.
    Type: Grant
    Filed: August 21, 1996
    Date of Patent: May 26, 1998
    Assignee: General Electric Company
    Inventors: Michael Anthony Lucarelli, William John Raleigh
  • Patent number: 5736619
    Abstract: Phenolic siloxane compositions are prepared in a first embodiment by combining phenol with an aldehyde and an alkoxy or silanol-functional silicone intermediate; in a second embodiment by combining a phenolic novolac resin with a formaldehyde donor and an alkoxy or silanol-functional silicone intermediate; and in a third embodiment by combining a phenolic resole resin with an alkoxy or silanol-functional silicone intermediate. Optionally, a catalyst to facilitate formation of a phenolic resin from phenol and formaldehyde can be added, a catalyst to facilitate condensation of the phenolic resin can be added, and at least one catalyst to facilitate hydrolysis and/or condensation of the silicone intermediate can be added. The phenolic resin catalyst can include acids, bases, and formaldehyde donors. The silicone intermediate catalyst can include organometallic compounds, amine compounds, and mixtures thereof.
    Type: Grant
    Filed: April 21, 1995
    Date of Patent: April 7, 1998
    Assignee: Ameron International Corporation
    Inventors: John F. Kane, Norman R. Mowrer
  • Patent number: 5714550
    Abstract: The invention is directed to a polymer composition comprising:a) a blend comprising at least one polyamide and at least one polyphenylene ether;b) at least one polymeric siloxane compound; andc) at least one boron compound.
    Type: Grant
    Filed: October 23, 1996
    Date of Patent: February 3, 1998
    Assignee: General Electric Company
    Inventor: Jeremy Paul Shaw
  • Patent number: 5639833
    Abstract: The invention is directed to molding materials containingA) from 1 to 99% by weight of polyarylene ethers having repeating units I ##STR1## where t and q may each be an integer 0, 1, 2 or 3,T, Q and Z may each be a chemical bond or --O--, --S--, --SO.sub.2 --, S.dbd.O, C.dbd.O, --N.dbd.N--, R.sup.a C.dbd.CR.sup.b -- or --CR.sup.c R.sup.d --, with the proviso that at least one of the groups T, Q and Z is --SO.sub.2 -- or C.dbd.O,R.sup.a and R.sup.b,R.sup.c and R.sup.d, andAr and Ar.sup.1 are as defined in the specification,B) from 1 to 99% by weight of copolyamides containingb.sub.1) from 30 to 44 mol % of units which are derived from terephthalic acid,b.sub.2) from 6 to 20 mol % of units which are derived from isophthalic acid,b.sub.3) from 43 to 49.5 mol % of units which are derived from hexamethylenediamine,b.sub.4) from 0.5 to 7 mol % of units which are derived from aliphatic cyclic diamines of 6 to 30 carbon atoms andb.sub.5) from 0 to 4 mol % of further polyamide-forming monomers which differ from b.sub.
    Type: Grant
    Filed: August 10, 1995
    Date of Patent: June 17, 1997
    Assignee: BASF Aktiengesellschaft
    Inventors: Martin Weber, Herbert Fisch, Gunter Pipper, Axel Gottschalk
  • Patent number: 5596048
    Abstract: A process for making polyarylene ether-siloxane copolymers is described and the process comprises the step of contacting polyarylene ethers with a hydroxyaromatic or aromatic ether terminated siloxane reagent in the presence of an oxidant.
    Type: Grant
    Filed: October 16, 1995
    Date of Patent: January 21, 1997
    Assignee: General Electric Company
    Inventors: Margaret L. Blohm, Timothy E. Banach, Christian M. E. Bailly
  • Patent number: 5571873
    Abstract: A new thermoplastic homopolymer of o-cresol which is a poly(2-methylphenylene oxide) having a high molecular weight distribution is described. The polymer is prepared using a 2 and/or 6 substituted pyridine catalyst to the molecular weight distribution. The homopolymer can be blended with other thermoplastic polymers. The homopolymer is rapidly biodegraded, particularly in soil containing soil microorganisms.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: November 5, 1996
    Assignee: Board of Trustees operating Michigan State University
    Inventors: Li-Xia Li, Patrick J. Oriel, Eric A. Grulke
  • Patent number: 5539041
    Abstract: Resin compositions comprising inorganic species selected from the group consisting of siloxanes and phosphazenes in combination with and capable to being bonded to thermoset and/or thermoplastic resin system derivable from cyanate functional monomers and/or oligomers. Reacted resin compositions are found to have enriched areas of the inorganic species. The resin compositions have a variety of improved properties including toughness and improved resistance to oxidation.
    Type: Grant
    Filed: February 9, 1995
    Date of Patent: July 23, 1996
    Assignee: Fiberite, Inc.
    Inventors: Cynthia A. Arnold, Paul D. MacKenzie
  • Patent number: 5530075
    Abstract: The instant invention pertains to a curable resin composition comprised of A) 100 parts by weight curable resin, and B) 0.1-500 parts by weight of an organopolysiloxane having organic groups that contain epoxy groups, which is expressed by the formula: ##STR1## wherein R.sup.1 is a univalent hydrocarbon group excluding alkenyl groups, R.sup.2 is a hydrogen atom or a univalent hydrocarbon group excluding alkenyl groups, R.sup.3 is an alkoxysilylalkyl group or an organic group that contains epoxy groups, a is 0 or a positive integer, b is a positive integer and c is a positive integer, where a/c has the value of 0 to 4, b/c has the value of 0.05 to 4 and (a+b)/c has the value of 0.2 to 4. The curable resin composition of the instant invention has superior flowability that produces a hardened resin with superior flexibility and adhesion.
    Type: Grant
    Filed: August 15, 1994
    Date of Patent: June 25, 1996
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Yoshitsugu Morita, Noriyasu Yokoyama
  • Patent number: 5527862
    Abstract: Methods are disclosed for the blending of inherently incompatible polymer systems to provide compositions comprising (i) 1 to 99.99 percent by weight of a diorganopolysiloxane; and (ii) 0.01 to 99 percent by weight of an organopolysiloxane-grafted rigid linear aromatic polymer selected from the group consisting of organopolysiloxane-grafted polyimide and organopolysiloxane-grafted polybenzobisoxazole.
    Type: Grant
    Filed: August 24, 1994
    Date of Patent: June 18, 1996
    Assignee: Dow Corning Asia, Ltd.
    Inventors: Maki Itoh, Akihito Sakakibara
  • Patent number: 5508323
    Abstract: A free-flowing silicone polymer powder, having an average particle size of 1 to 1000 microns and prepared by mixing a polydiorganosiloxane with a silica filler, is uniformly dispersed in an organic resin using conventional equipment, such as a single screw or, preferably, a twin screw extruder. When employed at a concentration of about 0.5 to 25 parts by weight of powder per 100 parts by weight of resin, a significant improvement in the burn character of the modified resin is obtained such that the rate of heat release, generation of smoke and evolution of toxic carbon monoxide gas is significantly reduced relative to the unmodified resin.
    Type: Grant
    Filed: October 11, 1994
    Date of Patent: April 16, 1996
    Assignee: Dow Corning Corporation
    Inventors: David J. Romenesko, Robert R. Buch
  • Patent number: 5484858
    Abstract: The properties of polyphenylene ether-polyamide mixtures can be improved by the addition of polysiloxane compounds.
    Type: Grant
    Filed: October 18, 1994
    Date of Patent: January 16, 1996
    Assignee: General Electric Company
    Inventors: Hendrikus J. E. Smits, Roelof van der Meer, Adelbert H. L. Groothuis
  • Patent number: 5476908
    Abstract: A cured resin product has a strain energy release rate (GIC) of at least 400 J/m.sup.2, a flexural modulus of at least 300 Kg/mm.sup.2, and a glass transition temperature (Tg) of at least 120.degree. C. The cured resin composition comprises a thermoset resin component (A), optionally including a curing agent (B), and a thermoplastics resin component (C), the thermoplastics resin and thermoset resin components (C) and (A) being present at least partly in respective phases (1) and (2) each being elongate in at least one direction and each preferably having a three dimensionally continuous structure. Phase (1) may contain a silicon containing compound providing a concentration therein of elemental silicon higher than that in any other phase, and/or the cured resin product may additionally include regions where one of the phases (1) and (2) essentially surrounds the other.
    Type: Grant
    Filed: April 12, 1993
    Date of Patent: December 19, 1995
    Assignee: Toray Industries, Inc.
    Inventors: Hajime Kishi, Nobuyuki Odagiri, Kuniaki Tobukuro
  • Patent number: 5431765
    Abstract: A cured, fiber-reinforced composite is prepared by blending an amino-functional silicone resin containing monophenyl siloxy units and amino-functional siloxy units, an epoxy resin, a hardener for the epoxy resin and an aromatic oligomer such as a polyether optionally with reactive primary amine groups, impregnating fibers into said blend, laying up at least two layers of the impregnated fibers, and heating the layed-up laminate at a temperature and time sufficient to cure the epoxy resin.
    Type: Grant
    Filed: November 14, 1994
    Date of Patent: July 11, 1995
    Assignee: Toray Industries
    Inventors: Gary T. Decker, Gerald A. Gornowicz, Kuniaki Tobukuro
  • Patent number: 5405896
    Abstract: An adhesive silicone rubber composition of addition reaction curing type comprising (a) an organopolysiloxane containing an alkenyl group; (b) an organohydrogenpolysiloxane having at least one hydrogen atom directly attached to a silicon atom in a molecule; (c) an addition reaction catalyst; and (d) an adhesive agent selected from compounds of the following formulae (I), (II) and (III):A-(D-B).sub.x -D-A (I)C-(B-D).sub.
    Type: Grant
    Filed: December 9, 1993
    Date of Patent: April 11, 1995
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hironao Fujiki, Shigeki Shudo, Akira Matsuda
  • Patent number: 5391594
    Abstract: A free-flowing silicone polymer powder, having an average particle size of 1 to 1000 microns and prepared by mixing a polydiorganosiloxane with a silica filler, is uniformly dispersed in an organic resin using conventional equipment, such as a single screw or, preferably, a twin screw extruder. When employed at a concentration of about 0.5 to 25 parts by weight of powder per 100 parts by weight of resin, a significant improvement in the burn character of the modified resin is obtained such that the rate of heat release, generation of smoke and evolution of toxic carbon monoxide gas is significantly reduced relative to the unmodified resin.
    Type: Grant
    Filed: June 29, 1992
    Date of Patent: February 21, 1995
    Assignee: Dow Corning Corporation
    Inventors: David J. Romenesko, Robert R. Buch
  • Patent number: 5385984
    Abstract: Polyarylene ether-organopolysiloxane copolymers are provided having amine, or ester connecting linkages between blocks resulting from the melt extrusion of epoxy, carboxy or amine functionalized polyarylene ether with epoxy, carboxy or amine functionalized organopolysiloxane.
    Type: Grant
    Filed: October 21, 1993
    Date of Patent: January 31, 1995
    Assignee: General Electric Company
    Inventors: Margaret L. Blohm, Sterling B. Brown, George T. Seeger, Patricia P. Anderson
  • Patent number: 5362821
    Abstract: A composition useful in the fabrication of fiber-reinforced composites is prepared from a blend of an epoxy resin, a hardener for the epoxy resin, an aromatic oligomer and an aminofunctional silicone resin containing monophenyl siloxy units and aminofunctional siloxy units.
    Type: Grant
    Filed: July 16, 1993
    Date of Patent: November 8, 1994
    Assignee: Dow Corning Corporation
    Inventors: Gary T. Decker, Gerald A. Gornowicz
  • Patent number: 5357003
    Abstract: The properties of polyphenylene ether-polyamide mixtures can be improved by the addition of polysiloxane compounds.
    Type: Grant
    Filed: November 15, 1989
    Date of Patent: October 18, 1994
    Assignee: General Electric Company
    Inventors: Hendrikus J. E. Smits, Roelof van der Meer, Adelbert H. L. Groothuis
  • Patent number: RE35509
    Abstract: Compatiblized mixtures of a polyphenylene ether, a polyamide and a compatibilizer are described. The mixtures have improved physical properties as a result of using in the mixtures a polyamide having a terminal amine group to terminal carboxyl group ratio of greater than 1.
    Type: Grant
    Filed: July 15, 1994
    Date of Patent: May 13, 1997
    Assignee: General Electrical Company
    Inventors: Susumi Fujii, Hiromi Ishida, Masataka Morioka, Akihiro Saito, Roelof van der Meer