Solid Polymer Derived From A Polycarboxylic Acid Which Is A Dimer Or Trimer Of An Aliphatic Acyclic Monocarboxylic Acid Having At Least Ten Carbon Atoms Or Adducts Of Unsaturated Aliphatic Acyclic Monocarboxylic Acids, Having Ten Carbon Atoms With An Alpha, Beta Ethylenically Unsaturated Carboxylic Acid Or Derivative Patents (Class 525/420.5)
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Patent number: 11708478Abstract: The present invention refers to the use of at least one mono-substituted succinic anhydride before or during extrusion of a polymer composition comprising polylactic acid as polymer component and at least one calcium carbonate-comprising material as filler, to reduce the polymer decomposition during processing and/or to decrease the melt flow rate of such an extruded polymer as well as a method for reducing the polymer decomposition during processing and decreasing the melt flow rate of a polymer composition comprising polylactic acid as polymer component and at least one calcium carbonate-comprising material as filler, the use of a polymer composition obtainable by a process comprising the steps of a) providing at least one polylactic acid as polymer component, b) providing at least one calcium carbonate-comprising material as filler, c) providing at least one mono-substituted succinic anhydride and d) contacting the components of a), b) and c) in any order and e) extruding the contacted components of step dType: GrantFiled: July 13, 2017Date of Patent: July 25, 2023Assignee: OMYA INTERNATIONAL AGInventors: Samuel Rentsch, Matthias Welker, Christopher Pichler, Martin Brunner, Michael Knerr, Tazio Fornera
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Patent number: 10550227Abstract: A semi-crystalline polyamide including at least one monomer resulting from the condensation of a diacid and of a diamine of formula AP.Y, the semi-crystalline polyamide having the following general formula (I): AP.Y/(A)m/(Pip.Y?)n/(B.Y?)q and the semi-crystalline polyamide having an Mp1 less than or equal to approximately 150° C., in particular less than or equal to approximately 130° C., in particular less than or equal to approximately 120° C. and/or a Tg less than or equal to approximately 60° C., in particular less than or equal to approximately 50° C., in particular less than or equal to approximately 40° C., as determined respectively by DSC according to standard ISO 11357-3 (2013) and ISO 11357-2 (2013).Type: GrantFiled: June 22, 2015Date of Patent: February 4, 2020Assignee: ARKEMA FRANCEInventor: Quentin Pineau
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Patent number: 10280344Abstract: An adhesive having water vapor barrier properties, comprising an adhesive base composed of at least one reactive resin, at least one elastomer and optionally at least one tackifying resin, and optionally a solvent, is particularly suitable as a barrier adhesive when it comprises at least one multifunctional oligomeric alkoxysiloxane, said oligomeric alkoxysiloxane containing more than one polymerizable group and more than one alkoxy group.Type: GrantFiled: October 15, 2015Date of Patent: May 7, 2019Assignee: TESA SEInventors: Christian Schuh, Klaus Keite-Telgenbüscher
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Patent number: 10211612Abstract: A protective textile sleeve having enhanced end fray resistance and being adapted to be bonded to an elongate member extending therethrough, and method of construction thereof, are provided. The sleeve has a wall with a cavity bounded by an innermost surface extending between opposite open ends. A first material, including a hot melt adhesive material, facilitating bonding the wall to an outer surface of an elongate member extending therethrough, is bonded to the wall immediately adjacent the opposite ends, and a second material, facilitating prevention of end fray of the wall ends, including an elastomeric material is bonded to the wall immediately adjacent the opposite ends.Type: GrantFiled: August 26, 2014Date of Patent: February 19, 2019Assignee: Federal-Mogul Powertrain LLCInventors: Hiroki Yamaguchi, Shozo Fukuyama
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Patent number: 9242398Abstract: The present invention relates to a hybrid process for producing molded plastic articles by reinforcing the walls thereof through the injection of a foamed thermoplastic material, thus increasing the thickness of the wall in previously determined zones in order to improve the mechanical characteristics thereof. According to the invention, said hybrid process comprises to strengthen previously defined zones of the plastic articles formed by any of the already known processes, such as: injection, extrusion, extrusion-blowing, injection-blowing, thermoforming, roto-molding, or any combination thereof; and afterwards the injection of a foamable thermoplastic material to fill up said strengthening predesigned zones.Type: GrantFiled: July 15, 2008Date of Patent: January 26, 2016Inventor: Sergio Sosa Bravo
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Patent number: 9156958Abstract: The invention relates to a thermoplastic polymer composition that contains polyamide and comprises an excellent compromise of properties, in particular mechanical properties, and a high fluidity at the molten state. The invention particularly relates to a composition containing at least a high-fluidity linear polyamide and optionally fillers such as glass fibers, and to a method for making such a composition.Type: GrantFiled: November 24, 2009Date of Patent: October 13, 2015Assignee: RHODIA OPERATIONSInventors: Marco Amici, Cesare Guaita
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Patent number: 9120895Abstract: Thermoplastic elastomer containing hard segments and soft segments, the soft segments containing the residue of a dimerized fatty acid and the residue of a dimerized fatty amine.Type: GrantFiled: April 20, 2010Date of Patent: September 1, 2015Assignee: DSM IP ASSETS B.V.Inventors: Atze Jan Nijenhuis, Zeynep Ozyurek
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Patent number: 8889771Abstract: The invention relates to the field of plasticizers, compounds used as additives in polymers for facilitating the transformation thereof or modifying the mechanical properties thereof especially rigidity.Type: GrantFiled: April 18, 2011Date of Patent: November 18, 2014Assignee: Arkema FranceInventors: Nicolas Dufaure, Jean-Luc Couturier, Manuel Hidalgo
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Patent number: 8729213Abstract: A curing agent composition including at least one benzylated polyamine compound. The benzylated polyamine compound is a reaction product of a benzaldehyde compound or benzyl halide compound and a polyamine according to the following formula: H2N—CH2-A-CH2-NH2 where A is a phenylene group or a cyclohexylene group. A method for making the curing agent composition and an amine-epoxy composition are also disclosed.Type: GrantFiled: September 23, 2011Date of Patent: May 20, 2014Assignee: Air Products and Chemicals, Inc.Inventors: Williams Rene Edouard Raymond, Gamini Ananda Vedage
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Publication number: 20130261255Abstract: A subject matter of the present invention is a composition comprising: (i) from 0.1 to 49 parts by weight of at least one thermoplastic condensation polymer; and (ii) from 51 to 99.9 parts by weight of at least one supramolecular polymer capable of being obtained by the reaction of at least one at least trifunctional compound (A) carrying first and second functional groups with: at least one compound (B) carrying, on the one hand, at least one reactive group capable of reacting with the first functional groups of (A) and, on the other hand, at least one associative group; and at least one at least bifunctional compound (C), the functional groups of which are capable of reacting with the second functional groups of the compound (A) in order to form ester, thioester or amide bridges.Type: ApplicationFiled: October 18, 2011Publication date: October 3, 2013Applicant: Arkema FranceInventors: Yves Deyrail, Anthony Dufrenne, Samuel Devisme, Nicolas Dufaure, Jean-Luc Couturier, Bruno Van Hemelryck, Manuel Hidalgo
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Publication number: 20130230726Abstract: The disclosure relates to the field of two-component epoxy resin compositions and to the use thereof as a repair adhesive, in particular in vehicle manufacturing. The two-component epoxy resin compositions according to the disclosure contain a curing component K2, which comprises between 1 and 10 wt. % of an amino group-terminated polyamide B, together with an epoxy resin component K1. The compositions show that the impact resistance is highly increased while an acceptable sheer strength is simultaneously retained.Type: ApplicationFiled: August 31, 2012Publication date: September 5, 2013Applicant: SIKA TECHNOLOGY AGInventors: Karsten FRICK, Jürgen Finter, Andreas Kramer, Ulrich Gerber
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Patent number: 8513376Abstract: The present disclosure provides polyamides and amidoamine curing agents including the reaction product of (1) a modified amine component comprising at least one multifunctional amine of structure 1: wherein R1 is selected from C1-C16 linear, cyclic, and branched alkyl, alkenyl, and alkaryl groups; R2 and R4 are hydrogen, R3 is R1 or hydrogen, X, Y, and Z are independently selected from C2-C10 alkylene, hexylene and cycloalkylene groups, n=0, 1, 2, 3, 4, 5, 6, or 7; and (2) a fatty acid component. Exemplary fatty acid components include at least one of monomer fatty acids, dimer fatty acids, trimer fatty acids, polymer fatty acids, esters of monomer, dimer, trimer, and polymer fatty acids and combinations thereof. The method for making the curing agents and articles formed therefrom are also disclosed.Type: GrantFiled: March 15, 2011Date of Patent: August 20, 2013Assignee: Air Products and Chemicals, Inc.Inventors: Williams Rene Edouard Raymond, David Alan Dubowik, Gamini Ananda Vedage
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Publication number: 20130203944Abstract: The invention relates to the field of plasticisers, compounds used as additives in polymers for facilitating the transformation thereof or modifying the mechanical properties thereof especially rigidity.Type: ApplicationFiled: April 18, 2011Publication date: August 8, 2013Applicant: Arkema FranceInventors: Nicolas Dufaure, Jean-Luc Couturier, Manuel Hidalgo
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Patent number: 8293863Abstract: The present invention provides polyamide curing agent compositions comprising the reaction products of (1) multifunctional amines of structure 1 where R1 is CH2CH2CH2NH2; R2, R3 and R4 independently are H or CH2CH2CH2NH2, and X is CH2CH2 or CH2CH2CH2 with (2) dimer fatty acids, optionally in combination with monofunctional fatty acids, the reaction product preferably comprising at least 15 wt % tetrahydropyrimidine-containing components. The curing agent compositions are useful for crosslinking epoxy resins to produce coatings, adhesives, floorings, composites and other articles.Type: GrantFiled: February 9, 2007Date of Patent: October 23, 2012Assignee: Air Products and Chemicals, Inc.Inventors: Gamini Ananda Vedage, Stephan Francis Monaghan, Williams René Edouard Raymond, Michael Ian Cook, Michael Paul Popule
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Patent number: 8153111Abstract: Compositions of dendrimer-photosensitizer complexes including therapeutic molecules, and methods for their synthesis and use are disclosed. The therapeutic molecules and the photosensitizers are each covalently attached to the dendrimer at its end-groups, essentially randomly. Upon exposure to radiation of a suitable wavelength, the photosensitizers are activated to break up the dendrimer structure and thus release the therapeutic molecules. In a preferred embodiment, the end-groups of the dendrimer are replaced with or covalently connected to therapeutic molecules and photosensitizers. In a further preferred embodiment, targeting molecules may also be attached to the dendrimer to create a more accurate treatment.Type: GrantFiled: June 18, 2004Date of Patent: April 10, 2012Assignee: CeramOptec Industries, Inc.Inventors: Volker Albrecht, Arno Wiehe, Beate Roeder, Wolfgang Neuberger
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Publication number: 20120059081Abstract: The invention relates to resins comprising acrylate groups that are liquid at 25° C., obtained in that polycarboxylic acids (a) comprising at least 2 carboxyl groups and at least 2 C atoms per molecule are converted in a first stage with polyamines (b) comprising at least 2 amino groups and at least 2 C atoms per molecule, such that an intermediate compound (z) results, said compound being terminated by carboxyl groups, and said compound (z) being functionalized in a second stage, such that the free carboxyl groups thereof are provided with one or more (meth)acrylate groups in one or more stages, said resins being suitable as radiation-curing compounds for producing coatings.Type: ApplicationFiled: April 30, 2010Publication date: March 8, 2012Inventors: Stefan Busch, Juergen Baro, Laurence Druene, Jean-Marc Ballin
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Patent number: 8022170Abstract: The invention relates to semi crystalline, melt processible, partially aromatic copolyamides, producible by condensation of at least the following monomers or the precondensates thereof: a) terephthalic acid b) at least one dimerised fatty acid with up to 44 carbon atoms and c) at least one aliphatic diamine of the formula H2N—(CH2)x—NH2, wherein x means a whole number from 4-18.Type: GrantFiled: December 17, 2003Date of Patent: September 20, 2011Assignee: EMS-Chemie AGInventors: Botho Hoffmann, Heinz Hoff, Hanns-Jörg Liedloff, Ralph Kettl
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Publication number: 20110168329Abstract: 1) Hot-melt adhesive composition comprising from 20 to 95% of a polyamide and from 5 to 80% of a supramolecular polymer capable of being obtained by reaction between 1-(2-aminoethyl)-2-imidazolidone (UDETA) and a mixture comprising: —from 51 to 100% of one or more dimers and/or trimers of fatty acids; and—from 0 to 49% of one or more monomers of fatty acids. 2) Use of said composition with a view to manufacturing disposable hygiene articles.Type: ApplicationFiled: June 4, 2009Publication date: July 14, 2011Applicant: BOSTIK S.A.Inventors: Nicolas Sajot, Christille Brunet, Majdouline Lachhab
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Patent number: 7791067Abstract: An object of the invention is to provide an electronic device which can be easily manufactured using a wet method. One of electronic devices according to the invention has a first layer and a second layer. The first layer contains a first compound including a conjugated double bond. Here, the first compound preferably has a molecular weight of 100 to 1000. The second layer contains a second compound having a cyclic structure which is formed by an addition reaction between two molecules of the first compound. Here, a light emitting element or an element such as a transistor can be given as the electronic device.Type: GrantFiled: August 12, 2005Date of Patent: September 7, 2010Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Ryoji Nomura, Tsunenori Suzuki
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Patent number: 7737227Abstract: A composition for the organic hard mask includes a polyamic acid compound, and a method for forming a pattern is used in a manufacturing process of semiconductor devices by coating the composition for organic hard mask film on an underlying layer, and depositing a second hard mask film with a silicon nitride SiON film thereon to form a double hard mask film having an excellent etching selectivity, thereby obtaining a uniform pattern.Type: GrantFiled: December 7, 2005Date of Patent: June 15, 2010Assignee: Hynix Semiconductor Inc.Inventor: Jae Chang Jung
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Patent number: 7655736Abstract: The present invention provides polyamide curing agent compositions comprising the reaction products of (1) multifunctional amines of structure 1 where R1 is CH2CH2CH2NH2; R2, R3 and R4 independently are H or CH2CH2CH2NH2, and X is CH2CH2 or CH2CH2CH2 with (2) dimer fatty acids, optionally in combination with monofunctional fatty acids, the reaction product preferably comprising at least 15 wt % tetrahydropyrimidine-containing components. The curing agent compositions are useful for crosslinking epoxy resins to produce coatings, adhesives, floorings, composites and other articles.Type: GrantFiled: March 21, 2008Date of Patent: February 2, 2010Assignee: Air Products and Chemicals, Inc.Inventors: Gamini Ananda Vedage, Stephen Francis Monaghan, Williams René Edouard Raymond, Michael Ian Cook, Michael Paul Popule
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Patent number: 7501477Abstract: The present invention relates to a deuterated polyimide, the backbone of which comprises an alternation between: at least one repeat unit corresponding to the following formula (I): in which: Y represents a single bond or a spacer group; and at least one repeat unit corresponding to the following formula (II): -A1-Z-??(II) in which: A1 represents a perdeuterated aromatic group comprising from 6 to 10 carbon atoms; Z represents a single bond or a group chosen from —O—C6D4-, —CO—C6D4- and —C6D4-. These polyimides are used in particular as materials which are transparent within the region from 2500 to 3500 cm?1, for example in laser devices.Type: GrantFiled: April 5, 2007Date of Patent: March 10, 2009Assignee: Commissariat A l'Energie AtomiqueInventors: Elsa Anselmi, Jacques Raby, Alexia Balland-Longeau, Marc Calonne
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Publication number: 20080281051Abstract: The invention relates to a method for producing a plastic part. According to said method, a plastic mass is heated to a moulding temperature which is equal to or higher than a melting temperature. Said plastic mass can be moulded by heat from the melting temperature. Plastic mass is moulded when it has reached the moulding temperature, the temperature of the moulding part is adjusted to a conversion temperature which is dependent on the type of plastic and which is lower than the melting temperature, and the moulded part is maintained at a conversion temperature for a defined conversion time frame. The invention also relates to a device comprising a plastic part which is produced according to said inventive method.Type: ApplicationFiled: March 21, 2006Publication date: November 13, 2008Applicant: BEHR GMBH & CO. KGInventors: Snjezana Boger, Peter Englert, Hans-Dieter Hinderberger, Georg Kammler, Ingo Trautwein, Thomas Weber- Lanig
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Patent number: 7358312Abstract: This invention describes epoxy-amine compositions that have low mix viscosity and a fast drying property at temperatures below freezing. The composition is useful for high solids coating applications, for adhesive and membrane applications, and for preparing impregnated substrates.Type: GrantFiled: August 21, 2002Date of Patent: April 15, 2008Assignee: Hexion Specialty Chemicals, Inc.Inventors: Christian Jean Charles De Cock, Pascale Charlotte Agnes Marie Ghislaine Claeys Bouuaert, Derek Scott Kincaid, Karin Van Poppel, Dominique Elisabeth Marie Vandenberghe, Pen Chung Wang
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Patent number: 7211632Abstract: The present invention relates to a deuterated polyimide, the backbone of which comprises an alternation between: at least one repeat unit corresponding to the following formula (I): in which: Y represents a single bond or a spacer group; and at least one repeat unit corresponding to the following formula (II): —A1—Z— ??(II) in which: A1 represents a perdeuterated aromatic group comprising from 6 to 10 carbon atoms; Z represents a single bond or a group chosen from —O—C6D4—, —CO—C6D4— and —C6D4—. These polyimides are used in particular as materials which are transparent within the region from 2500 to 3500 cm?1, for example in laser devices.Type: GrantFiled: April 6, 2004Date of Patent: May 1, 2007Assignee: Commissariat a L'Energie AtomiqueInventors: Elsa Anselmi, Jacques Raby, Alexia Balland-Longeau, Marc Calonne
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Patent number: 6310174Abstract: This invention concerns a composition containing a dimerized or trimerized fatty acid amide of a primary alkanolamine that remains clear of suspended solids during storage, making mixtures containing the additive particularly useful to the metalworking industry. The amide may be formed by the condensation of a primary alkanolamine and a dimerized or trimerized fatty acid. When added to an amide of a primary alkanolamine and fatty acid containing a single carboxylic acid group, these molecules are able to prevent crystallization of the amide mixture.Type: GrantFiled: April 28, 2000Date of Patent: October 30, 2001Assignee: Huntsman Petrochemical CorporationInventor: Karl E. Griswold
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Patent number: 6274682Abstract: An epoxy resin composition containing a) an epoxy resin and b) a liquid amine terminated polyamide curing agent prepared by condensing an aminoalkylpiperazine and a dicarboxylic acid. The epoxy resin composition typically requires less than 35% of solvent to produce a sprayable viscosity. The cured epoxy composition has good flexibility. A hydroxy-functional flexibilized resin is also produced by reacting (a) an epoxy resin, (b) a liquid aminoalkylpiperazine-based amine terminated polyamide and (c) a hydroxy-functional amine.Type: GrantFiled: January 25, 2000Date of Patent: August 14, 2001Inventors: Larry Steven Corley, Martin L. Ehrlich