Abstract: The present invention provides: a novel organic titanium compound having an effect as an adhesion promoter by itself; a production method of such organic titanium compound; and a room temperature-curable resin composition containing such organic titanium compound both as a curing catalyst and as an adhesion promoter. Provided are an organic titanium compound represented by an average composition formula (I): Ti(OR1)4-a(Y3Si-A-O—CO—CH?C(O)R)a (wherein R1 represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms, R represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms, A represents a divalent hydrocarbon group having 3 to 6 carbon atoms, Y represents a hydrolyzable group, and a represents a number satisfying 0<a<4); a production method of such organic titanium compound; and a room temperature-curable resin composition that contains a room temperature-curable resin.

Abstract: A gelatinous vibration reducing composition comprises a poly-alpha-olefin component and polymeric granules. A method of forming the gelatinous vibration reducing composition comprises the steps of providing the poly-alpha-olefin component, providing the polymeric granules, and combining the poly-alpha-olefin component and the polymeric granules to form the gelatinous vibration reducing composition. A method for reducing vibration transmissivity of an article defining a cavity comprises the steps of providing a gelatinous vibration reducing composition comprising the poly-alpha-olefin component and the polymeric granules, providing the article defining the cavity, and disposing the gelatinous vibration reducing composition into the cavity of the article for reducing vibration transmissivity of the article.

Abstract: The present invention relates to a process for producing an Sn(II)-crosslinked novolac material, to the Sn(II)-crosslinked novolac material obtainable by the process according to the invention, to a process for producing an electroactive material comprising a carbon phase C and a tin phase and/or tin oxide phase, comprising the process for producing an Sn(II)-crosslinked novolac material and a subsequent carbonization step, to the electroactive material obtainable by the process according to the invention, and to electrochemical cells and batteries comprising the electroactive material.

Abstract: A meta crosslinked polar benzyl polymer is made by combining a transition metal crosslinker, or one or more source compounds capable of reacting to form such a transition metal crosslinker, with a polar benzyl polymer which has been activated for meta crosslinking

Abstract: The object of the present invention is to provide an adhesive composition which can form a thinner adhesive layer, which has good storage stability and which can actualize high package reliability even when exposed to severe reflow conditions in a semiconductor package in which a semiconductor chip being reduced in a thickness is mounted, and an adhesive sheet having an adhesive layer comprising the adhesive composition. The adhesive composition of the present invention comprises an epoxy thermosetting resin (A), a thermosetting agent (B) and a thermosetting accelerating agent (C); the thermosetting accelerating agent (C) being soluble in methyl ethyl ketone and inactive as a thermosetting accelerating agent at room temperature.

Abstract: The invention provides an improvement to the useable lifetimes of phenolic-epoxy, phenolic-benzoxazine, phenolic-epoxy-benzoxazine mixtures and other phenolic mixtures through the use of protected phenolics, where a phenolic compound, polymer, or resin is released on demand by the addition of a deblocking agent.

Abstract: The present invention relates to a moisture barrier for the protection of internal environment of sensitive devices comprising a homogeneous dispersion of superficially functionalized containing surface modifying organic group belonging to the same chemical class of at least one functional group of the polymeric compound, to a process for the production of said barrier and to sensitive device comprising such barriers.

Abstract: The invention relates to a liquid resin composition intended for manufacturing abrasives that comprises at least one novolac resin having a glass transition temperature less than or equal to 60° C., at least one reactive diluent and optionally at least one crosslinking agent. Application of the resin composition for producing abrasive articles, especially bonded abrasives and coated abrasives. It also relates to the abrasive articles comprising abrasive grains connected by such a liquid resin composition.

Abstract: The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when mixed with an epoxy resin, enable the mixture to be greatly improved in thermal stability that is extremely important for the control of a curing reaction and to have a prolonged pot life (stability as a one-pack mixture comprising the epoxy resin, curative, etc.) and improved curability at low temperatures.

Abstract: A curable coating composition is disclosed comprising a resinous binder comprising (a) a reaction product of an epoxy-containing polymer with a compound containing phosphorus acid groups, the reaction product having reactive functional groups, and (b) a curing agent having functional groups reactive with the functional groups of (a). An electroconductive pigment is dispersed in (a) such that the weight ratio of the electroconductive pigment to (a) plus (b) is within the range of 0.5 to 9.0:1. When the curable coating composition is deposited and cured on a metal substrate, the cured coating is weldable.

Abstract: The present invention relates to a nonflammable epoxy resin composition for using a thin copper film laminate, which is applied to a printed circuit board (PCB), and using the same. The present invention provides for nonflammable epoxy resin composition for using a thin copper film laminate, comprising bisphenol A-type epoxy resin, multifunctional epoxy resin, an imidazole-based curing catalyst, and a curing retarder, and using the same. As described above, since the ring-open of the epoxy group is prompted by an imidazole catalyst, without the use of dicyandiamide, epoxy polymer reaction occurs due to the chain-reaction of epoxy group, and the glass-transition temperature is 170° C. or greater, the nonflammable epoxy resin composition for using a thin copper film of the present invention has a strong heat-resistance, lower dielectric constant, controllable gelation time, and does not require the use of non-harmful catalysts to the human body.

Abstract: This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are bonded to the boron atom, and a latent catalyst having a structure wherein the above phosphonium borate is the recurring unit and at least two of said recurring unit are connected through at least one of the four specific groups bonded to the boron atom. This invention also provides a thermosetting resin composition comprising such a latent catalyst and an epoxy resin molding material comprising such a latent catalyst and further provides a semiconductor device in which a semiconductor is encapsulated with said epoxy resin molding material.

Abstract: A method for preparing a high-heat-resistant-epoxy-resin composition which comprises adding, as catalytic curing agent, a quinoxalinium salt having a benzyl group to difunctional and multifunctional epoxy resin and thermoset resin having a similar structure. The epoxy-resin composition obtained by the present invention is excellent in its impregnating property, processability, impact resistance, drug resistance, electric-insulating property, and adhesiveness.

Abstract: A method for preparing a high-heat-resistant-epoxy-resin composition which comprises adding, as catalytic curing agent, a pyrazinium salt having a benzyl group to difunctional and multifunctional epoxy resin and thermoset resin having a similar structure. The epoxy-resin composition obtained by the present invention is excellent in its impregnating property, processability, impact resistance, drug resistance, electric-insulating property, and adhesiveness.

Abstract: The present invention provides an epoxy resin composition useful for casting applications, comprising a reaction product obtained by reacting (A) a bisphenol epoxy resin, and (B) bisphenol compounds, and if necessary, (C) monofunctional phenols or carboxylic acid compounds, in the presence of sodium compounds, wherein the epoxy resin composition has(a) an epoxy equivalent: 250 to 500 g/equivalent,(b) a sodium content: 20 to 200 ppm, and(c) a haze of its 40 wt % methyl ethyl ketone solution measured according to ASTM D 1003: 15% or less.

Abstract: An epoxy resin composition for semiconductor sealing, which comprises an epoxy resin, a curing agent and an inorganic filler, and has a J-value of 10 to 50, which is a maximum jetting flow value determined according to a method of evaluating jetting flow of epoxy resin composition.

Abstract: Curable film-forming compositions containing epoxy functional copolymers, polycarboxylic acid crosslinking agents, and triaryltin compound having the chemical structure of (Ar).sub.3 SnOR wherein the aryl groups are the same or different and at least one aryl group is substituted with at least one atom or group selected from the group consisting of carbon, nitrogen, oxygen, sulfur, phosphorous, silicon and halogen and R is selected from the group consisting of hydrogen, alkyl, and acyl groups are disclosed. The compositions do not release benzene during cure. The compositions may be powder or liquid and are useful as clear coats, particularly in a color-plus-clear composite coating system.

Abstract: An impregnation resin composition comprising an alicyclic epoxy compound, an acid anhydride, an aluminum compound having an organic group, and butylglycidyl ether, wherein the alicyclic epoxy compound contains not more than 30 ppm in concentration of Na ion component.

Abstract: The invention pertains to a method for producing preparations containing bismuth salts, wherein bismuth oxide is reacted in a specific way with lactic acid and the resulting mixture of bismuthyl lactate and bismuth lactate is dispersed in a binder. These preparations are used as catalytic components in electrophoretic paints to be applied by cathodic deposition. Dipping paints of this kind have excellent application and film properties. This obviates the need to use lead and tin compounds as catalysts.

Abstract: A method for producing a metal-containing transparent polymer by the reaction of a metal carboxylate, with a clear setting resin system comprising a thermosetting resin and a curing agent. The reaction occurs in a temperature in the range of from about 0.degree. to about 100.degree. C. under conditions which prevent air from being entrapped in the mixture, either during mixing of the reagents or during reaction. The metal carboxylate contains from about 20 to about 60 weight percent of metal. The reagents react for a time sufficient to form a transparent polymer. The resins include preferably epoxies, polyesters, polyurethane, polyisocyanurate, polyether sulfones, polyimides, and mixtures of two or more of these thermoset polymers. The final metal-containing transparent polymer preferably contains at least 15% by weight of the metal. Preferred metals include antimony, barium, bismuth, cadmium, cerium, cobalt, copper, iron, lead, molybdenum, tungsten, ranadium, and zirconium.

Abstract: The invention pertains to an adduct obtainable by condensation of a bisepoxy compound and a P-guanamine according to the formula ##STR1## wherein X is CR.sub.3 R.sub.4 --(CR.sub.1 R.sub.2).sub.n --CR.sub.5 R.sub.6 or o-phenylidene, n is 0 or 1, and R.sub.1 -R.sub.8 may be the same or different and represent H, methyl or ethyl, and the molar ratio P-guanamine: bisepoxide is 0.60 to 0.35. The adduct is used in the manufacture of synthetic materials, notably printed wiring boards (PWBs).

Abstract: A carboxyl-containing phenolic resin represented by the formula: ##STR1## where n is 0 to 100, the phenolic units of the resin being directly bonded to one another through positions ortho or para to the OZ group; Z is selected from the group consisting of H and the residue of a mono or dianhydride, said mono or dianhydride having been reacted with a hydroxy group of a phenolic resin; and Y is present at a position meta or para to the OZ group and is selected from the group consisting of an alkyl group, a halogen atom, an aryl group, a phenylalkyl group, an alkyl group, a carboxyl group of the formula--COOR where R is H, an alkyl group or a phenylalkyl group, an alkoxy group, an aryloxy group, and an amino group of the formula--NR.sub.1 R.sub.2 where R.sub.1 and R.sub.2 are the same or different and represent H or an alkyl group.

Abstract: Modified epoxy resins are obtained by reaction of an epoxy resin with up to one mol equivalent per epoxy group of an alkyl or alkenyl substituted, hydroxy substituted aromatic acid, especially by reaction of a bisphenol A epoxy resin with an alkylated salicylic acid. Also are described a process for the production of such modified resins, curable compositions comprising the modified epoxy resin and products provided with the cured composition, especially in coating applications and civil engineering applications.

Abstract: Epoxy resins for preparing water-dispersible binders for cathodic electrodeposition coating materials, the epoxy resin being preparable by reacting a) polyepoxides having at least one glycidyl group per molecule b) and, optionally, up to 60% by weight, based on the overall epoxy resin reaction product, of aliphatic and/or alicyclic hydroxy compounds having preferably two or on average less than two hydroxyl groups per molecule and a molecular weight of less than 9000 g/mol, c) in the presence of a catalyst consisting of neutral metal salts, such as alkali metal salts and alkaline earth metal salts, zinc salts and nickel salts of tetrafluoroboric, tetrachloroboric, hexafluoro- antimonic,hexachloroantimonic,hexafluorophosphoric, perchlorate and periodic acid, and d) adding a deactivating agent which prevents the epoxy groups reacting further or effectively reduces the rate of such reaction as soon as the phenolic hydroxyl groups have already substantially reacted and at least 0.

Abstract: An increase in the molecular weight of polyester and recycled polyester can be achieved by blending said polyester with a difunctional epoxy resin and a sterically hindered hydroxyphenylalkylphosphonic acid ester or half-ester and heating the blend to above the melting point (glass transition temperature) of the polyester.

Abstract: A coating powder based on an epoxy resin is applied to a substrate and fused and cured thereon. Curing is effected by exposing the coating powder at the point of application to a fluid curative or cure catalyst, e.g., by exposing the fusing coating powder to an ammonia-containing atmosphere.

Abstract: A class of compounds which inhibits the reaction of a polyepoxide with a curing agent at low temperatures including an epoxy resin composition containinga) a polyepoxide;b) an amine or amide curing agent for the polyepoxide;c) at least about 15 meq (per equivalent of polyepoxide) of a catalyst for the reaction of the polyepoxide with the curing agent; andd) a cure inhibitor selected such that:(1) at about 171.degree. C. the composition has a gel time that is at least about 50 percent longer than a similar composition without the inhibitor, and(2) at about 175.degree. C. and higher the composition cures in no more than about 50 minutessuch that the composition cures rapidly with high cross-link density because it has a high catalyst loading, while the inhibitor lengthens the gel time to permit laminating and other processing.

Abstract: A halogen-free resin mixture comprising an epoxy resin, a hardener, a flame retardant as well as additives, a self-extinguishing prepreg composed of this resin mixture as well as its advantageous application, particularly as an insulation material. The halogen-free resin mixture being composed of:a) 20-60 weight % epoxy resin;b) 20-60 weight % phenolic novolak hardener;c) 5-65 weight % zinc borate as flame retardant; andd) 0-30 weight % additives.

Abstract: A binder resin composition, a curing agent composition, a caking additive composition, a kit, a casting mold composition and a process for manufacturing a casting mold are disclosed, wherein a metallic compound containing a metallic element belonging to Group IB to VIII of the Periodic Table is utilized. The compositions are useful for the production of a sand mold for casting, having an excellent strength, from reclaimed sand, in a self-hardening or gas hardening mold process. The casting mold according to the present invention, which is manufactured in the presence of a metallic compound containing a metallic element belonging to Group IB to VIII of the Perioidic Table has excellent strength.

Abstract: The invention relates to the use of tripotassium citrate monohydrate and other alkali metal salts of polybasic acid as bench life extenders in heat curable hot box foundry mixtures comprising sand, thermosetting binder resin, and a latent acid catalyst composition. In one embodiment, the thermosetting binder resin is a phenolic resole resin modified with urea formaldehyde resin. In another embodiment, the thermosetting binder resin is a furfuryl alcohol resin modified with urea formaldehyde resin.

Abstract: In the method described, one or more halogen-free phosphorus compounds are incorporated in the precondensed resins before the final resin-curing stage. During final curing, the phosphorus compounds are bound by covalent bonds into the resin structure and/or are trapped in the resin structure as such or in the form of aggregates or condensates.

Abstract: Heat-curable epoxy resin systems comprising(a) at least one epoxy resin,(b) at least one polycarboxylic acid anhydride, and(c) 1,4-diazabicyclo(2,2,2)octane or a C.sub.1 -C.sub.4 alkyl-substituted derivative of 1,4-diazabicyclo(2,2,2)octane as curing accelerator, and wherein one portion of the curing accelerator (c) is replaced by(d) a complex of a boron halide with an amine, have good reactivity at elevated temperatures and comparatively high stability at temperatures below c. 80.degree. C.

Abstract: A thermally-curable aromatic amine-epoxy composition comprises(a) at least one polyepoxy compound;(b) a curing amount of at least one aromatic polyamine compound; and(c) a catalytically effective amount of at least one cure accelerator compound which is a .pi.-electron acceptor, and which lowers the cure exotherm peak temperature (as measured by differential scanning calorimetry (DSC) at 10.degree. C. per minute) of the composition by at least about 8 percent relative to the corresponding composition without the cure accelerator. Such accelerator compounds moderate and/or accelerate the thermal curing of aromatic amine-epoxy resins, enabling cure to occur at lower temperatures and/or in shorter time periods than those required for the unaccelerated composition.

Abstract: A heat-curable, formaldehyde-free binding agent comprising a polyflavonoid type tannin and as a curing catalyst, a compound having a weak acid reaction curable at relatively high temperatures and compatible with cellulose containing materials such as wood chips for the production of particle boards.

Abstract: A polymerizable composition of matter comprises a cycloaliphatic epoxy resin, a cyanate ester resin, optionally a polyol, and, as initiator, a Bronsted acid. When cured, the compositions provide interpenetrating polymer networks (IPNs). The IPNs are useful as high temperature stable vibration damping materials, adhesives, binders for abrasives, and protective coatings.

Abstract: Described are novel triethylenediamine adducts of certain 4-hydroxy-substituted, 3,5-hydroxy-substituted and 2,3,4-hydroxy-substituted benzoic acid derivatives, and novel boron trifluoride complexes with cyclic amidines, which are useful for the conversion of thermosettable compositions. Also described are novel thermosettable compositions incorporating the adducts and complexes.

Abstract: There are disclosed methods and compositions for retarding the ambient temperature hardening of a phenolic resole resin alone or with an aggregate when such resin is contacted with a nitroalkane and a hardening agent such as lightburned magnesium oxide, an organic ester functional hardening agent, and mixtures of lightburned magnesium oxide and an organic ester functional hardening agent in an alkaline medium. There is also disclosed a hardener composition for phenolic resole resins wherein the hardener composition consists essentially of a solution of a nitroalkane in an organic ester functional hardening agent.

Abstract: There are disclosed methods and compositions for retarding the room temperature gelation and eventual hardening of phenolic resole resins when such resins are mixed with lightburned magnesium oxide or magnesium hydroxide hardening agents with or without an ester functional hardening agent. Retardation of gelation and hardening is achieved by incorporating into said mixture a compound which decreases the solubility of magnesium in said mixture. Additionally, hardening at higher temperatures, thermal curing, as well as refractories, coated abrasives, polymer concrete, and other methods and compositions of this invention are disclosed.

Abstract: Reaction products of organosilane compounds and a novolac resin having phenolic groups have been found to have a very low rate of etching, thereby enabling the material to also be used as an RIE barrier in semiconductor manufacturing processes.

Abstract: The hardening of a composition containing a phenolic resin solution and a magnesia aggregate is effected by mixing into such composition at a pH of at least 4.5: a compound which provides an acetate, adipate, 4-aminobenzenesulfonate, 1,2,4-benzenetricarboxylate, formate, glycolate, lactate, nitrate, benzenesulfonate, naphthalenesulfonate, methanesulfonate, phenolsulfonate, succinate, sulfamate, or toluenesulfonate anion to the composition; or an acetylacetone, 2-nitrophenol, 4-nitrophenol, salicylaldehyde compound; or a mixture of said compounds.

Abstract: A binder composition for producing articles of bonded particulate material such as foundry molds or cores comprises an alkaline aqueous solution of a resol phenol-aldehyde resin, an oxyanion which can form a stable complex with the resin, and a phenyl ethylene glycol ether. The binder composition has an alkali to phenol molar ratio of from 1.5:1 to 2.5:1 and the amount of alkali present in the solution is sufficient to substantially prevent stable complex formation between the resin and the oxyanion. Bonded articles are produced by passing carbon dioxide gas through articles formed from a mixture of particulate material and the binder composition so as to produce stable complex formation and curing of the resin.

Abstract: There are disclosed methods and compositions for accelerating the hardening of phenolic resole resins having a pH of about 4.5 to 9.5 with lightburned magnesium oxide or magnesium hydroxide, with or without the addition of an ester functional hardening agent. Acceleration of hardening is achieved by incorporating into said compositions an effective quantity of a material which: increases the solubility of magnesium in the hardenable mixture; by certain amines; or by certain chelating agents. Accelerator compounds include those which provide chloride, sulfamate, nitrate, formate, and phosphite anions as well as selected tertiary amines.

Abstract: Reaction products of organosilane compounds and a novolac resin having phenolic groups are capable of generating either positive or negative tone patterns depending on the time and temperature of processing.

Abstract: There are disclosed methods and compositions for retarding the room temperature gelation and eventual hardening of phenolic resole resins when such resins are mixed with lightburned magnesium oxide or magnesium hydroxide hardening agents with or without an ester functional hardening agent. Retardation of gelation and hardening is achieved by incorporating into said mixture a compound which decreases the solubility of magnesium in said mixture. Additionally, hardening at higher temperatures, thermal curing, as well as refractories, coated abrasives, polymer concrete, and other methods and compositions of this invention are disclosed.

Abstract: Latent, heat-curable epoxy resin compositions containing metal carboxylate curing systems provide exceptional latency, particularly at elevated temperature, as well as facile curing, high T.sub.g and adhesive strength, and other attractive properties. The metal carboxylates comprise alkali metals and alkaline earth metals, aromatic and aliphatic metal carboxylates. The preferred curing systems comprise synergistic combinations of the metal carboxylates with cure modifiers.

Abstract: A binder composition for producing articles of bonded particulate material such as foundry moulds or cores comprises an alkaline aqueous solution of a resol phenol-aldehyde resin, an oxyanion which can form a stable complex with the resin, and pyrrolidone or an N-substituted pyrrolidone, and the amount of alkali present in the solution is sufficient to substantially prevent stable complex formation between the resin and the oxyanion. Bonded articles are produced by passing carbon dioxide gas through articles formed from a mixture of particulate material and the binder composition so as to produce stable complex formation and curing of the resin.

Abstract: There are disclosed methods and compositions for accelerating the hardening of phenolic resole resins having a pH of about 4.5 to 9.5 with lightburned magnesium oxide or magnesium hydroxide, with or without the addition of an ester functional hardening agent. Acceleration of hardening is achieved by incorporating into said compositions an effective quantity of a material which: increases the solubility of magnesium in the hardenable mixture; by certain amines; or by certain chelating agents. Accelerator compounds include those which provide chloride, sulfamate, nitrate, formate, and phosphite anions as well as selected tertiary amines.

Abstract: A coating composition is disclosed comprising an organosilane polymer, a polyester or a copolymer thereof, an amino resin crosslinking agent, and a silsesquioxane compound. Such a composition is especially useful for providing a flexible finish on non-metallic parts of automobiles and trucks. This finish has the advantage of superior etch resistance and outstanding weatherability and durability characteristics.

Abstract: Initiator compositions for materials which can be polymerized cationically are described, these containingi) an anhydride of a polycarboxylic acid, a polyisocyanate, a cyclic carbonate, a lactone or a mixture of such compounds, and dissolved thereinii) at least one compound of the formula I[M.sup.+n (L).sub.x ].sup.n+ nX.sup.- (I)in which n is 2 or 3, M is a metal cation selected from the group consisting of Zn.sup.2+, Mg.sup.2+, Fe.sup.2+, Co.sup.2+, Ni.sup.2+, Cr.sup.2+, Ru.sup.2+, Mn.sup.2+, Sn.sup.2+, VO.sup.2+, Fe.sup.3+, Al.sup.3+ and Co.sup.3+, X.sup.- is an anion which is selected from the group consisting of AsF.sub.6.sup.-, SbF.sub.6.sup.-, BiF.sub.6.sup.- and derivatives derived from these anions in which a fluorine atom is replaced by hydroxyl groups, or in which up to 50% of the anions X.sup.-, based on the total amount of anions, can also be any desired anions, L is water or an organic .sigma.

Abstract: Retarding the hardening of a composition containing a phenolic resin solution and a magnesia aggregate is effected by mixing into such composition a compound which provides an aspartate, fluoride, bifluoride, malate, tartrate, citrate, oxalate, phosphate or phosphonate anion to the composition or a tetraalkoxy silane, a partially hydrolyzed tetraalkoxy silane, 2-, or 4-chlorophenol, or 2'-, or 4'-hydroxyacetophenone.