Abstract: The present invention relates to crosslinked polymeric nanospheres having a star-shaped structure of the core-branch type, in which the branches are of a hydrophilic nature and the core is of a polymeric, crosslinked, hydrophobic nature and forms the imprint of all or at least part of a target molecule and to a process for preparing them.

Abstract: The present invention provides a comb-shaped epoxy resin represented by the following formula (1): in the formula (1), X1 and X2 represent a divalent group having a residue selected from xanthene residue, biphenylene residue, hydrogenated bisphenol residue, alkylene residue and polyoxyalkylene residue, each may having a methyl group or a ethyl group as a substituent, and at least one of them is an aromatic residue, Y represents a polymer chain such as linear polymer chain, a number average polymerization degree being 5 to 2000, and n (number average polymerization degree) represents an integer within a range of 3 to 200, and to a method for preparing the comb-shaped epoxy resin.

Abstract: Process for production of post-crosslinkable thermoplastic resins by bulk-polymerizing a polymerizable composition (A) comprising (I) a monomer fluid containing a cyclic olefin (?) having two or more metathetical ring-opening reaction sites in the molecule in an amount 10 wt % or above based on the total amount of the monomers or a monomer fluid containing a norbornene monomer and a crosslinking agent, (II) a metathetical polymerization catalyst, and (III) a chain transfer agent; thermoplastic resins obtained by this process. These thermoplastic resins are free from odor due to residual monomers and are excellent in storage stability. Process for producing crosslinked resins and composite materials which comprises laminating the thermoplastic resin to a substrate and then crosslinking the thermoplastic resin.

Abstract: The present invention provides epoxy curing agent compositions comprising benzylated aminopropylated alkylenediamine compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed.

Abstract: Biocompatible polymers having polymer backbones with at least one secondary amine suitable for diazeniumdiolation are disclosed. Specifically, methods for providing secondary amines-containing polymers using epoxide-opening reactions are provided. More specifically, nitric oxide-releasing medical devices made using these polymers are disclosed.

Abstract: A curing accelerator that enables a composition to exhibit excellent fluidity, reflow crack resistance and high-temperature storage properties, and exhibits excellent curability even upon moisture absorption, as well as a curable resin composition, and an electronic parts device comprising an element that has been encapsulated using the curable resin composition. The curable resin composition is prepared using a curing accelerator comprising a compound represented by a formula (I) shown below.

Abstract: A low temperature curable coating powder comprising an epoxy functional resin is cured with styrene maleimide in combination with at least one other curing agent such as dicyandiamide, imidazole, or an imidizole adduct. The combination of three curing agents such styrene maleimide, dicyandiamide, and an imidizole or imidizole adduct is useful for achieving gloss control. The coating powder may be curable at temperatures of 300° F. or lower. The coating of heat-sensitive and non-conductive substrates is facilitated with use of such coating powder, although other substrates, such as metal may be coated in accordance with the invention.

Abstract: The present invention relates to a composition for forming anti-reflective coating for use in a lithography process in manufacture of a semiconductor device which comprises polymer (A) having a weight average molecular weight of 5,000 or less, and a polymer (B) having a weight average molecular weight of 20,000 or more. The composition provides an anti-reflective coating for use in a lithography which is excellent in step coverage on a substrate with an irregular surface, such as hole or trench, has a high anti-reflection effect, causes no intermixing with a resist layer, provides an excellent resist pattern, and has a higher dry etching rate compared with the resist layer.

Abstract: A copolymer and a process of making the copolymer are disclosed. The copolymer is produced from reacting a glycidyl ester and/or ether with a polyol comprising a functionality of at least 2 wherein at least 50% by weight of the copolymer comprises a minimum of 3n+X repeating units, wherein n is a monomer unit and X is a monomer unit and/or other reactant. The copolymer may also include less than 50% of the polymeric units having the same molecular weight. The present invention is further directed to processes for preparing the copolymer and to coating compositions employing the copolymer.

Abstract: An underfill composition includes a thermosetting resin and a thermally cleavable component that releases sulfonic acid upon thermal activation. The underfill composition is applied to flip-chip technology during no-flow underfill mounting of the flip-chip to a mounting substrate. The mounting substrate can be further mounted on a board. A process includes formation of the underfill composition. A method includes assembly of the underfill composition with the flip-chip, and further can include assembly of the mounting substrate to a board. A computing system is also included that uses the underfill composition.

Abstract: A reworkable conductive adhesive composition, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix.

Abstract: In one embodiment of the present invention, a curable sealant composition and method for its preparation are provided. The composition includes a polymer which is prepared by functionalizing a poly(conjugated diene) with a curable group such as tetra-substituted silicon compound and then substantially hydrogenating the functionalized polymer in the presence of 2-jegler type catalyst. The composition can further include additional curable sealant ingredient selected from the group consisting of plasticizers, fillers, reinforcing agents, modifiers, curing catalysts/hardeners, stabilizers, and mixtures thereof.

Abstract: A method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.

Abstract: The invention provides high solids epoxy-based autodeposition coating materials that have improved moisture barrier properties and/or anti-corrosive properties and a means to obtain the high solids epoxy-based autodeposition coating materials that eliminates/minimizes the need for process solvents. A hydrophobic water barrier enhancing agent, epoxy pre-polymer and ethylenically unsaturated monomer, as an alternative to organic solvent, are combined to yield an epoxy pre-polymer-monomer-hydrophobic water barrier enhancing agent blend, which may be blended with other coating components and additives. The resulting blend is then dispersed in water with surfactant and the ethylenically unsaturated monomer is polymerized (in the presence of other formulation components) to yield a dispersion. The dispersion may then be used as one component of a coating formulation. The coating formulation can then be applied to materials and cured to form a final coating.

Abstract: Compositions comprising a matrix polymer and a mixture of monomers are used for making polymer mixtures containing the matrix polymer and a second polymer formed from the monomer mixture. Preferably, the matrix polymer comprises a polyester, polystyrene, polyacrylate, thiol-cured epoxy polymer, thiol-cured isocyanate polymer, or mixtures thereof. Preferably, the monomer mixture comprises a thiol monomer and at least one second monomer selected from the group consisting of ene monomer and yne monomer. The compositions may be used to fabricate optical elements such as lenses.

Abstract: A method for making a lubricating fast-setting epoxy compound comprising: mixing under vacuum dispersion a first micro-crystalline filler, a first talc, and a titanium oxide into a hardenable epoxide containing liquid forming an epoxy base. A second micro-crystalline filler, a second talc, and a hydrocarbon resin are mixed forming an accelerator mixture. A methylamino accelerator is mixed into the accelerator mixture forming an epoxy accelerator. Substantially equal amounts of the epoxy base and the epoxy accelerator are mixed to form the lubricating fast-setting epoxy compound having a high lubricity and a curing time ranging from two minutes to twelve minutes. Adjusting the mixing speed and temperature of the epoxy base, the accelerator mixture, and the epoxy accelerator is contemplated to promote homogeneity. The epoxy base can also include a flatting agent. The epoxy accelerator can also include a modified aliphatic amine, an acrylic resin, a coloring agent, or combinations thereof.

Abstract: The present invention provides a non-ester type epoxy resin having a low hydrolytic chlorine content and containing no ester bond that is easily hydrolyzed, and a resin composition containing the non-ester type epoxy resin as an essential ingredient. Using the non-ester type epoxy resin, a resin composition having a low chlorine content and also having low water absorption and acid value is obtained. The resin composition is useful as a curable resin composition for a material in an electronics.

Abstract: A heat-curable binder based on an aqueous polymer dispersion comprising an emulsion polymer (EP), a polymer composed of at least 5% by weight of an ethylenically unsaturated monocarboxylic acid, dicarboxylic acid or dicarboxylic anhydride (acid polymer SP for short), and monofunctional or polyfunctional epoxide compounds as curatives. The monofunctional or polyfunctional epoxide compound is stirred, preferably in the liquid state, into the aqueous polymer dispersion. Besides the epoxide compound, the heat-curable binder may further comprise a polyol or an alkanolamine as hardener.

Abstract: A reworkable conductive adhesive composition, and method of making such, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix. In an additional embodiment an improved method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.

Abstract: A flexible substrate with electromagnetic shielding (EMS) function is provided. This substrate comprises a conductive backing film; and a thermosetting resin layer coated on the conductive backing film. The conductive backing film comprises aluminum foil. The thermosetting resin layer comprises modified carboxylated NBR, dimer acid-modified thermosetting epoxy resins and heat-resistive acrylic resins. This type of substrate can be used for electromagnetic shielding purpose. The flexible substrate can be used in various electronic applications, for example, flexible display applications.

Abstract: A flame-retardant resin composition comprising 100 parts by weight of a rubber-reinforced polystyrene resin, from 0.1 to 20 parts by weight of an epoxy-modified phenolic resin, and from 1 to 30 parts by weight of an aromatic phosphate has good flame retardancy and good lightfastness, still having good mechanical characteristics intrinsic to the thermoplastic resin therein.

Abstract: A composition includes a cross-linkable epoxy resin, a polystyrene-polybutadiene-polymethylmethacrylate tri-block copolymer, and a filler material. The polystyrene-polybutadiene-polymethylmethacrylate tri-block copolymer has a concentration ratio of from about 1:1:1 to about 1:1:1.5.

Abstract: A polymeric composition comprises a thermosetting resin and a polyolefin resin that cures to a semi-interpenetrating polymer network and is useful for producing plastic shipping and storage containers. The containers exhibit one or more friction surfaces, and can include fire resistance and other properties derived from property enhancing agents.

Abstract: An epoxy resin composition for a cured material, comprising (A) an epoxy resin comprising an epoxy compound X, the epoxy compound X has an epoxy equivalent weight of at least 400, (B) a curing agent, and (C) a liquid rubber that is liquid at room temperature and comprises a reactive group; wherein the epoxy compound X has a solubility parameter value of SpX, the liquid rubber has a solubility parameter value of SpY and the ratio of SpY/SpX could be in the range of 0.7 to 1.3; and wherein the liquid rubber could form no visible domains by optical microscopy or has a maximum domain size of at most 3 microns in the cured material is described. The epoxy resin composition provides a fiber-reinforced material with higher compressive modulus and strength, toughness and better handling ability over standard epoxy resin systems. This invention is excellent for small thin walled tube structures like fishing rods or applications that require good compressive strength.

Abstract: Elastomers are formed from castor oil and/or ricinoleic acid estolides and a polyester formed from an epoxidized vegetable oil such as ESO and a polycarboxylic acid such as sebacic acid, optionally in the presence of a peroxide initiator, or include crosslinked reaction products derived from ricinoleic acid or castor oil estolides, epoxy group-containing compounds such as epoxy resins and/or epoxidized vegetable oil, epoxy hardeners such as polyamine and polycarboxylic acid hardeners, thermally activated free radical initiators such as peroxides, and optionally but preferably include fillers such as limestone or wood flour. The elastomers can be prepared using a two-step, solvent-less procedure at elevated or ambient temperatures. These predominantly “all-natural” elastomers have physical properties comparable to conventional petroleum-based elastomers and composites and exhibit good flexibility, resiliency, abrasion resistance and inertness to hydrolysis.

Abstract: Resin compositions which comprise the following components (A) to (E) are useful for interlayer insulation of a multilayer printed wiring board: (A) an epoxy resin having 2 or more epoxy group in one molecule and which exists in a liquid state at a temperature of 20° C.; (B) an aromatic epoxy resin having 3 or more epoxy groups in one molecule and an epoxy equivalent of 200 or less; (C) a phenol type curing agent; (D) one or more resins selected from the group consisting of a phenoxy resin, a polyvinyl acetal resin, a polyamide resin, a polyamideimide resin, and mixtures thereof, and having a glass transition temperature of 100° C. or more; and (E) an inorganic filler.

Abstract: The present invention provides an epoxy resin composition for packaging a semiconductor device, characterized in having improved mold releasability during a molding process, continuous-moldability and improved solder resistance. According to the present invention, there is provided an epoxy resin composition for packaging the semiconductor element, obtained by formulating: (A) an epoxy resin; (B) a phenolic resin; (C) a curing accelerator; (D) an inorganic filler; and (E) an oxidized polyethylene wax having a drop point within a range of from 60 to 140 degree C., an acid value within a range of from 10 to 100 (mg KOH/g), a number average molecular weight within a range of from 500 to 20,000, and a mean particle size within a range of from 5 to 100 ?m, wherein at least one of (A) epoxy resin and (B) phenolic resin is a novolac structured resin having biphenylene structure, and wherein content of (E) oxidized polyethylene wax in epoxy resin composition is within a range of from 0.01 to 1 % wt.

Abstract: The present invention relates to improved compositions for aqueous adhesives and aqueous primers that increase the durability of composites made by adhering elastomers to metal.

Abstract: The invention provides high solids epoxy-based autodeposition coating materials and a means to obtain the high solids epoxy-based autodeposition coating materials that eliminates/minimizes the need for process solvents. An epoxy pre-polymer is used. The epoxy pre-polymer is combined with ethylenically unsaturated monomer, as an alternative to organic solvent, to yield an epoxy-monomer blend, which may be blended with other coating components and additives. The resulting blend is then dispersed in water with surfactant and the ethylenically unsaturated monomer is polymerized (in the presence of other formulation components) to yield a dispersion. The dispersion may then be used as one component of a coating formulation. The coating formulation can then be applied to materials and cured to form a final coating.

Abstract: Water-based coating composition comprising: (a) from 0.5 to 90% by weight of at least one epoxy resin other than self-dispersing epoxy resins; (b) from 0.5 to 90% by weight of at least one (meth)acrylate of a polyol; (c) from 5.0 to 98.0% by weight of water; and (d) from 0.5 to 10% by weight of one or more dispersants; wherein the at least one (meth)acrylate comprises at least two (meth)acrylate groups per molecule, and wherein the Brookfield viscosity of the composition is less than 15000 mPas.

Abstract: Water-based coating composition comprising: (a) from 0.5 to 90% by weight of at least one epoxy resin, wherein the epoxy resin is solid at 20° C., and wherein the epoxy resin is self-dispersing in water; (b) from 0.5 to 90% by weight of at least one (meth)acrylate of a polyol; and (c) from 5.0 to 99.0% by weight of water; wherein the at least one (meth)acrylate comprises at least two (meth)acrylate groups per molecule, and wherein the Brookfield viscosity of the composition is less than 15000 mPas.

Abstract: An expandable adhesive for a structural foam insert useful for vehicular reinforcement is described. The adhesive is characterized by containing a viscosity enhancing agent such as a polymethylmethacrylate, which results in a cured adhesive having unusually small voids and unusually high Young's modulus.

Abstract: A thermosetting resin composition comprising: (1) a copolymer resin comprising (a) a monomer unit and (b) a monomer unit respectively represented by the following general formulae (I) and (II): wherein R1 represents hydrogen, a halogen, or a C1–C5 hydrocarbon group; R2 represents a halogen or a C1–C5 hydrocarbon group; x is 0 to 3; and each of m and n is a natural number; and (2) a cyanate resin having at least two cyanate groups per molecule; is used to provide a printed wiring board material and a printed wiring board for electronic appliances, having a low dielectric constant and a low dielectric dissipation factor as well as improved heat resistance.

Abstract: A method of self-healing cracks in a cured epoxy base underfill material between an I/C chip and a substrate is provided. A plurality of capsules is dispersed in the epoxy base. Each capsule has a curable thermosetting adhesive encapsulated in a rupturable shell to disperse the thermosetting adhesive in a crack in the epoxy base when the shell ruptures. Each capsule is less than 25 microns in diameter. A curing agent that will cause a reaction of the thermosetting adhesive on contact is dispersed in the epoxy to form a cured adhesive in a crack in said epoxy base. The shell will rupture when encountering a crack being propagated in the underfill material, which will at least partially fill the crack with the adhesive, and cure the adhesive with the curing agent to bond the edges of the crack together. The invention also includes the structure for crack self-healing.

Abstract: The present invention provides a method of making an aqueous coating composition comprising an aqueous dispersion of an epoxy acrylate resin and a polymerized reactive diluent. The aqueous coating composition preferably has a volatile organic compound content of no greater than 0.4 kilogram per liter of solids.

Abstract: A curable composition includes an unsaturated polyester and an unsaturated monomer copolymerisable with the unsaturated polyester in the presence of polymerisation accelerators and initiators. The unsaturated polyester is an epoxidised unsaturated polyester obtainable by reaction between unsaturated polyester obtainable by reaction between the carboxy end groups of a polyester having unsaturated monomer units and the epoxy groups of an epoxy resin.

Abstract: The invention relates to addition compounds of formula (1): in which: n is a number from 1 to 10; R1 and R2 are identical or different and are each a hydrogen atom or a saturated or unsaturated aliphatic radical having 1 to 4 carbon atoms; R3 and R4 are identical or different and are each a hydrogen atom or alkyl having 1 to 3 carbon atoms, and the bridge member (R3+R4) is in each case positioned ortho or meta in relation to the phenolic oxygen atom; Z represents a group —CH2—CH2—, —CH2—CH(CH3)—, —CH(CH3)—CH2— or a combination thereof; s is number from 1 to 200; B represents hydrogen, —CO—CH?CH—COOM, —COCH(SO3M)CH2COOM, —CO—CH2—CH(SO3M)—COOM, —SO3M, —SO2M and/or —PO3MM, whereby M is preferably a cation selected from the group Li+, Na+, K+, NH4+, HO—CH2—CH2—NH3+, (HO—CH2—CH2—)2NH2+ or (HO—CH2—CH2—)3NH+; and Y is a radical of an amine. The inventive addition compounds are used as dispersing agents of solids, for example, pigments, particularly in aqueous media.

Abstract: Overall, ebonite coatings or elastomeric linings are not recommended for direct immersion in sulfuric acid with higher than 65% concentration. By blending a chemical resistant epoxy resin to an ebonite coating, the resulting epoxy ebonite composition can be employed in more severe environment such as direct immersion in >65% sulfuric acid. In particular, the present invention provides a blend of an epoxy coating with an ebonite coating with a mix ratio of 95/5 to 5/95, the resulting epoxy ebonite composition of which has greatly increased adhesion to steel and excellent resistance to undercut corrosion when subjected to salt spray. The epoxy ebonite composition according to the present invention can be used as coatings, adhesives, encapsulants or sealants and is particularly useful as industrial coatings that are subject to wide temperature variations, salt contamination or chemical attack.

Abstract: The invention pertains to a coating composition comprising a compound comprising at least one bicyclo-orthoester group and at least one other functional group. The invention also comprises a process for curing the present coating composition. Further, a process for making a bicyclo-orthoester-functional compound from the corresponding oxetane compound is described.

Abstract: An ultraviolet curable resin composition is provided, which is excellent in developing width and resolution, and exhibits good solder heat resistance and resistance to gold plating.

Abstract: There are provided a curable resin composition composed of an epoxy compound having an ionic polymerizability and viscosity of not more than 1,000 cP at 25° C., an acrylic resin having an ionic polymerizable functional group, and a thermally-activating ionic polymerization catalyst which can be dissolved by heating and crystallized by cooling, a method for the preparation thereof, and a coated article using the curable resin composition. The curable resin composition is excellent in storage stability, and a cured coating layer therefrom is excellent in heat resistance, staining resistance, removability of staining substances, or scratch resistance, and an electrical insulating property, and in which dependence of volume resistivity upon temperatures is small, and from which an excellent coated article is obtained, and it is widely utilized in industry.

Abstract: A thermosetting resin composition which contains: (A) an epoxy resin having at least two epoxy groups per molecule; (B) a hardener; (C) a compound represented by the following general formula (1) or (2); and (D) a microcapsule type hardening accelerator containing microcapsules each having a structure made up of a core containing a hardening accelerator and a shell covering the core and containing a polymer having a structural unit represented by the following general formula (3), and which, when examined by differential scanning calorimetry at a heating rate of 10° C./min, shows an exothermic peak due to reaction in the range of from 180 to 250° C., and a semiconductor device obtained through sealing with the composition are described.

Abstract: A cationic electrodeposition coating composition containing no heavy metal-based anticorrosive agents such as lead compounds, and which is capable of forming a coating film with a high corrosion resistance. The composition contains 0.5 to 20% by weight of a compound having an N-substitued benzoxazine ring represented by formula (1), relative to a resin solid matter, and an unsaturated hydrocarbon group-containing sulfide-modified epoxy resin as a base resin: wherein R is a hydrocarbon group having 1 to 8 carbon atoms.

Abstract: Disclosed is a halogen-free resin composition comprising: (A) one or more phosphorus-containing epoxy resins; (B) a hardener; (C) a hardening accelerator; (D) a polyphenylene oxide resin; and (E) a filling material, wherein the hardener of component B has the structure represented by the following formula (I): wherein each symbol is as defined above. The halogen-free resin composition of the present invention without adding halogen has excellent heat resistance and flame retardant property, and excellent dielectric property. The halogen-free resin composition of the present invention is particularly useful in the application of bonding sheets, composite materials, laminated plates, printed circuit boards, copper foil adhesives, inks used for build-up process, semiconductor packaging materials and the like.

Abstract: An ultraviolet curable resin composition comprises (A) an ultraviolet curable resin obtained by reacting an epoxy group containing polymer (a), which is prepared by polymerizing an ethylenically unsaturated monomer component including an ethylenically unsaturated monomer (i) having an epoxy group, with an ethylenically unsaturated monomer (b) having a carboxyl group, and then reacting a resultant intermediate product with a saturated or unsaturated polybasic acid anhydride (c); (B) an epoxy compound having at least two epoxy groups in molecule; (C) a photopolymerization initiator; and (D) a diluent The ultraviolet curable resin includes 0.3 to 10 mol of a polymerizable unsaturated group in 1 kg thereof. A photo solder resist ink containing this resin composition has the capability of providing a permanent film with excellent flexibility and solder heat resistance, and is preferably used to manufacture flexible printed circuit boards.

Abstract: The present printing process provides a multilayer coating system comprising a low viscosity, latent, heat-curable thermoplastic adhesive layer, colored ink interlayer, and an abrasion-resistant top lacquer layer that can be utilized for production of heat transferable labels suitable for labeling bottles and other containers that are subjected for over ten cycles to immersion in heated aqueous sodium hydroxide solution for cleaning prior to re-use.

Abstract: A curable flame retardant epoxy resin composition including (a) at least one flame retardant epoxy resin; (b) at least one amphiphilic block copolymer; and (c) a curing agent. Such components are present in the curable composition in the appropriate amounts and ratios such that, upon curing, the block copolymer self-assembles into a nano structure morphology, such as a worm-like micelle morphology. The resulting cured product made from the composition of the present invention has a remarkably increased high fracture resistance; and allows the use of flame retardant epoxies in applications where fracture resistance is an issue.

Abstract: A laminating resin composition is disclosed which comprises an unsaturated polyester resin, a vinyl ester resin, a polyfunctional acrylate, and up to about 15 percent by weight of a vinyl monomer. Preferably, the vinyl ester resin has a molecular weight ranging from about 450 to 1500.

Abstract: Condensation products prepared from cyclic carboxylic anhydrides of dicarboxylic acids, tricarboxylic anhydrides or tetracarboxylic anhydrides and difunctional polyamines, in particular polyoxyalkyleneamines, are suitable as a builder component for epoxy resin compositions. The reaction products based on tricarboxylic anhydrides or tetracarboxylic anhydrides are distinguished by having on average more than one imide group and carboxyl group per molecule. The compositions may optionally also contain condensation products obtained from tri- or poly-functional polyols and/or tri- or poly-functional amino-terminated polymers and cyclic carboxylic anhydrides, wherein the latter reaction products contain on average more than one carboxyl group per molecule. These compositions additionally contain conventional rubber-modified epoxy resins together with liquid and/or solid polyepoxy resins and conventional hardeners and accelerators and optionally fillers and rheology auxiliaries.

Abstract: A process for the production of graft polymers is disclosed. Accordingly a mixture containing A) 50 to 98 parts by weight of vinyl monomers and B) 2 to 50 parts by weight of an epoxide or a mixture of epoxides is reacted in the presence of one or more multimetal cyanide catalysts. Optionally the resultant reaction mixture is further polymerized thermally or with the addition of additional free-radical formers, optionally together with the addition of further monomers. The inventive graft polymers are characterized by their excellent notched impact strength.