Abstract: A thermosetting resin composition that is useful as an epoxy resin-based overcoating agent for flexible circuit boards or for film carriers for the TAB method, and the like, providing basic properties required of general insulation protective films, since the cured coated films are excellent in adhesiveness, electric insulation property, chemical resistance, thermal resistance, and the like, reduced in warp caused by cure shrinkage, and excellent in flexibility.

Abstract: A reinforced thermoplastic composition includes a poly(arylene ether), a poly(alkenyl aromatic) compound, a polyolefin, a hydrogenated block copolymer with a high alkenyl aromatic content, a polyolefin-graft-cyclic anhydride copolymer, and a reinforcing filler. The composition exhibits high stiffness while maintaining high impact strength.

Abstract: A resin composition comprises a resin (A) and a resin (B) as constituents, said resin (A) having a number average molecular weight of 1,000 to 35,000 and being at least one member selected from the group consisting of following (A1) and (A2): (A1) a polyester polyol, a polyether polyol, a polycarbonate polyol, a polyurethane polyol, a polyolefin polyol and an acrylic polyol, (A2) a polymer obtained by reacting said (A1) with a compound having at least one functional group selected from the group consisting of isocyanato, carboxyl and epoxy groups within a molecule thereof, a dialkyl carbonate, a cyclic carbonate, an alcohol, or a mixture of these, and said resin (B) having a sulfonium group and a propargyl group within the molecule thereof.

Abstract: The present invention has an object to provide a flame-retardant epoxy resin composition excellent in heat resistance and moisture resistance. A flame-retardant epoxy resin composition relating to the present invention contains an epoxy resin (A), a phosphazene compound (B), an epoxy hardener (C) and an inorganic filler (D), wherein the phosphazene compound (B) and the epoxy hardener (C) are included in the range of 0.

Abstract: An epoxidized polyalkenylene is prepared reacting a polyalkenylene, an aqueous solution of 15 to 90% by volume of hydrogen peroxide and a carboxylic acid having from 1 to 3 carbon atoms in the presence of a catalyst which is phosphonic acid, a derivative of phosphonic acid or a mixture thereof, without addition of an organic solvent or water, to obtain the epoxidized polyalkenylene. The epoxidized polyalkenylene has a number-average molar mass of between 500 and 50 000 g/mol and an epoxide oxygen content of between 1 and 25 percent by mass.

Abstract: A photosensitive composition of (a) a compound of formula (Ia) or (Ib) and (b) a bifunctional acrylate or methacrylate.

Abstract: A high strength adhesive having a good impact strength at low temperatures, below 0° C., and at temperatures of 90° C. is provided. The adhesive comprises a copolymer having at least one glass transition temperature of −30° C. or lower having epoxy reactive end groups or a reaction product of the copolymer with a polyepoxide, a reaction product of a polyurethane prepolymer and a polyphenol or polyaminophenol and at least one epoxy resin.

Abstract: The present invention provides a polymeric material and a process for making the polymeric material. The polymeric material has adhesive and noise abatement properties over a broad temperature range. Further, the material is chip and corrosion resistant and provides metal panel reinforcement.

Abstract: The present invention relates to a new urethane oligomer (A) and a resin composition comprising (A) and an unsaturated group containing polycarboxylic acid resin (B) that can be diluted with water and is excellent in providing a cured product and that is suitable for a solder resist and an interlayer dielectric layer because the cured product is excellent in flexibility, soldering-heat resistance or the like and allows a development with an organic solvent or a dilute alkali solution; a photosensitive resin composition suitable for an etching resist or a cover lay; and a photosensitive film obtained thereby.

Abstract: A photo curable resin composition, which comprises (A) an acid-modified, vinyl group-containing epoxy resin, (B) an elastomer, (C) a photopolymerization initiator, (D) a diluent and (E) a curing agent, can give a high performance cured film having distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics, and a photosensitive element, which comprises a support and a layer of the photo curable resin composition laid on the support, has distinguished heat resistance, humidity-heat resistance, adhesibility, mechanical characteristics and electrical characteristics.

Abstract: A sheet resin composition is adhered to a silicon wafer. The sheet resin composition supports the silicon wafer during back grinding and dicing into chips. Further, the sheet resin composition interfacial underfills between a chip from the wafer and a substrate during subsequent fabrication of a semiconductor device, the chip being flip chip mounted to the substrate.

Abstract: The terminal glydidyl groups of a diglycidyl ether of a hydroxyaliphatic bisphenol is optionally reacted with (meth)acrylic acid to obtain a vinyl ester. The internal hydroxyaliphatic groups are reacted with (meth)acrylic acid or cyanoacrylic acid to prepare a diglycidyl and/or (meth)acrylate-terminated (meth)acrylate or urethane acrylate.

Abstract: A chemically amplified positive resist composition comprising a styrene polymer represented by formula (1), terminated with P, and having a weight average molecular wherein R is OH or OR3, R1 is H or CH3, R2 is alkyl, R3 is acid labile group, x≧0, y>0, k≧0, m≧0, n>0, 0<q≦0.8, p+q=1, P is H, alkyl, alkenyl, aromatic, carboxyl, OH, —R4(COR5)r, —R4O(OH)r or —R4 (OR5)r. A chemically amplified positive resist composition comprising the polymer as a base resin has high sensitivity and resolution and forms resist patterns having plasma etching resistance, heat resistance, and reproducibility.

Abstract: A resin composition for circuit boards. The resin composition comprises (i)1˜15 st % of bismaleimide modified by barbituric acid (BTA) and its derivatives; and (ii) 20˜50 wt % of polyphenylene ether (PPE) chain-broken in a phenol resin; wherein the phenol resin is terpene phenol resin or dicyclopentadiene phenol resin. Other additives, such as curing agent, catalyst or inorganic particle additive can be added as well, based on requirements. According to the invention, terpene novolac resin and initiator (peroxide) are added in polyphenylene ether so that molecules are rearranged to form a PPE resin having lower molecular weight and higher crosslinking density. Furthermore, BMI/epoxy resin/PPE are combined in different weight percentages. Semi-interpenetrating polymer network structures are thus formed. Consequently, Tg and resistances both to heat and solvent of the resin are increased.

Abstract: Disclosed is a radiation-crosslinkable thermoplastic polymer composition, a process for the preparation thereof, an angioplasty balloon made using such a composition, and a method of using the angioplasty balloon. The composition contains a reactive monomer cross-linker, that facilitates cross-linking of the reaction product upon contact of the cross-linker-containing composition with a particle beam from a radiation source.

Abstract: The present invention is directed to an adhesive composition, which comprises an epoxy resin, a coupling agent, filler, and an effective amount of an amine-curing agent or curative for said epoxy resin. Advantageously, tri-functional and/or tetrafunctional epoxy resins and/or acrylate monomers will be incorporated into the adhesive composition in order to reduce open time and enhance substrate adhesion. Advantageously, a mixture of amines will be used in the curative including aliphatic amines, which have low viscosities and efficiently wet the substrate for enhancing adhesion; polyamines, which can be used to manipulate open time and allow for improved ratio tolerance of the adhesive system; and amine-terminated rubbers (ATBN), which can improve impact resistance and the toughness of the cured adhesive. Preferred coupling agents are silanes.

Abstract: Phenolic resin polyols are disclosed. The polyols, which contain aliphatic or mixed phenolic and aliphatic hydroxyl groups, are the reaction products of aralkylated phenols or phenol aralkylation polymers with an oxyalkylating agent selected from alkylene oxides and alkylene carbonates. The phenolic resin polyols are versatile intermediates for many polymer systems, including urethanes, epoxies, alkyds, acrylates, and polyesters.

Abstract: Provided is a liquid crystal sealant composition in which an aqueous solution obtained by admixing the epoxy resin composition with purified water has an ionic conductivity of 1 mS/m or less; the B stage-reduced product has a viscosity of 50 to 10000 Pa·s at 80 to 100° C.; the cured matter of the above composition has a linear expansion coefficient of 10×10−5 mm/mm/° C. or less and a glass transition temperature Tg of 100° C. or higher; and the above cured matter has a moisture permeability of 200 g/m2·24 hours or less at 80° C. and which can meet a liquid crystal display element (cell) produced by a single layer press hot bonding system and exhibits high adhesion reliability and makes it possible to produce a homogeneous liquid crystal display element having a high quality.

Abstract: The invention provides adhesives and adhesive compositions that comprise epoxy resin and non-volatile anhydride. One embodiment further comprises a hydroxyl containing compound that is insoluble in the epoxy resin/anhydride blend at mixing temperatures which reacts with the anhydride at solder reflow temperatures to form a fluxing agent in-situ. Another embodiment further comprises catalyst.

Abstract: The present invention relates to multifunctional macromers, to a method for the manufacture thereof and to their use in unsaturated polyester resins as additives to improve mechanical properties of preparations manufactured thereof. The process for the manufacture of multifunctional macromers comprises the following steps: a) reacting a polycarboxylic acid with 2 to 4 carboxylic groups, preferably 3 to 4 carboxylic groups, with glycidyl (meth)acrylate or allyl glycidyl ether, the amount of glycidyl (meth)acrylate or allyl glycidyl ether being at least one mol of glycidyl (meth)acrylate or allyl glycidyl ether per free carboxylic group of formed macromer, and b) reacting the product from step a) with an unsaturated, aromatic or aliphatic anhydride in an amount sufficient to esterify part or all of the free hydroxyl groups of the product from step a).

Abstract: A thermosetting resin composition for carbon fiber reinforced composite materials of the present invention chiefly comprises (A)2 thermosetting resin such as epoxy resin and a curing agent, and (B)2 compound containing one functional group which can react with thermosetting resin (A) or its curing agent, and a moiety selected from the following formulae (1) to (4) Furthermore, the present invention also relates to a prepreg formed by impregnating reinforcing fiber with the aforesaid resin composition and to carbon fiber reinforced composite materials comprising reinforcing fiber and a cured aforesaid thermosetting resin composition.

Abstract: The present invention is to provide a resin composition excellent in moisture absorption property, heat resistance, adhesive property and electric characteristics, and excellent in molding property, and suitable for an insulating material such as a multilayer wiring substrate, electronic parts, etc., and an adhesive film.

Abstract: The present invention relates to a single-packaged epoxy resin coating composition comprising: (A) an epoxy resin having at least one epoxy group in a molecule and capable of being dissolved in the following organic solvent (D), (B) a ketimines compound having at least two primary amino groups blocked with a carbonyl compound and having no other amino groups than the above blocked amino groups, (C) a dehydrating agent and (D) an organic solvent, wherein the above organic solvent (D) comprises a hydrocarbon base solvent selected from the group consisting of an aliphatic hydrocarbon base solvent and an aromatic hydrocarbon base solvent having a boiling point of 148° C. or higher in a proportion of at least 95% by weight based on the above organic solvent (D).

Abstract: The present invention provides a novel amino-group-containing polymer (salt) and a production process therefor wherein the amino-group-containing polymer (salt) is a product by a process including the step of introducing amino groups into a grafted polymer having a polyether skeleton, and can make good use of the reactivity or cationic property of at least primary amino groups and further, according to circumstances, secondary amino groups, and further can display various performances, such as curability useful for various uses and adsorbency onto films or fibers.

Abstract: A method of removing ammonium ions or amines from contaminated water includes treating the water with sodium tetraphenylborate under acidic conditions. Advantageously, the tetraphenylborate is immobilized on polymer beads and the water is contacted with the beads or passed through a bed of the beads.

Abstract: A crosslinkable polymeric casting composition comprises an aromatic polyvinyl monomer such as divinyl benzene, a polythiol such as pentaerythritol tetrakis-(3-mercaptopropionate), an epoxide strain-reducing agent such as hexanediol diglycidyl ether, and, optionally, a polymerizable comonomer such as polyethylene glycol dimethacrylate.

Abstract: An epoxy resin composition comprising an epoxy resin containing 0-10% by weight of a 2-nucleus compound and 50-100% by weight of 3 to 5-nucleus compounds combined and having a dispersity (Mw/Mn) of up to 1.7, an inorganic filler, a curing catalyst, a thermoplastic resin, and an optional phenolic resin and having a Tg of lower than 15° C. in an uncured state is effective in forming a flexible film which is easy to work at room temperature. Owing to the thermoplastic resin added, the composition avoids the problem that when a semiconductor chip is sealed with an uncured film of the composition, the film will lose its original shape or entrapped voids will be formed near the chip.

Abstract: A curable powder film-forming composition which includes: (a) about 55 to 80 percent by weight based on the total weight of resin solids in the film forming composition, of an epoxy functional copolymer having a Tg of about 77° F. to about 158° F. formed by free radical initiated polymerization of: (i) about 25 to about 75 percent by of a glycidyl functional ethylenically unsaturated monomer, and (ii) about 25 to about 75 percent by weight of a copolymerizable ethylenically unsaturated monomer or mixture of monomers free of glycidyl functionality; (b) about 15 to about 35 percent by weight of a polycarboxylic acid; and (c) about 1.0 to about 4.0 percent by weight of a polyisocyanate at least partially capped with a capping agent. A multi-component composite coating composition is also provided, which includes a pigmented film-forming base coat and a transparent top coat of the film-forming composition described above.

Abstract: The present invention concerns hydroxyaliphatic functional diglycidyl ethers of bisphenols (epoxy resins); curable (thermosettable) mixtures of at least one hydroxyaliphatic functional epoxy resin and at least one curing agent and/or catalyst therefor, as well as cured (thermoset) compositions prepared therefrom; and derivatives prepared therefrom. The bisphenol precursor to the diglycidyl ether contains a hydroxyaliphatic group linkage between the two aromatic rings of the bisphenol.

Abstract: Conductive thermosetting epoxy resins are produced by mixing a metallic salt or oxide with an inorganic acid to form a metallic ion solution. An alcohol is added to effect a secondary dehydration and form a complex ion polymer with double bonds and p electrons. The mixture is neutralized to produce a high molecular weight polymer of low electronic impedance. This polymer is then copolymerized with an epoxy resin.

Abstract: A liquid surface coating composition which exhibits low gloss after curing or drying comprises binder resin other than polyvinyl acetal, pigment colorant and a gloss-reducing amount of matting agent consisting essentially of polyvinyl acetal containing acetal groups derived from one or more aliphatic or aromatic aldehydes having 1 to 10 carbon atoms, preferably polyvinyl butyral of weight average molecular weight between 10,000 to 500,000 Daltons.

Abstract: The invention is a curable resin composition comprising A) an epoxy vinylester resin or a polyester resin; B) a polymerizable monomer; C) a chelating agent; and D) a copper salt or complex of copper with an alcohol, aldehyde or ketone; and E) an inhibitor comprising alkylated phenolic compound or polyhydroxy aromatic compound. In another aspect it is a resin system comprising I) a resin composition comprising: A) an epoxy vinylester resin or a polyester resin; B) a polymerizable monomer; C) a chelating agent comprising a polar or aromatic ring containing compound; D) a copper salt or a copper complex with an alcohol, ketone or aldehyde; and E) an inhibitor comprising alkylated phenolic compound or a polyhydroxy aromatic hydrocarbon and I) a catalyst system which comprises E) an additional amount of an inhibitor; F) optionally an aliphatic amine, an aromatic amine, or a heterocyclic amine; G) a peroxide or persulphate initiator; and H) a transition metal accelerator.

Abstract: The present invention relates to a powder coating for application to packaging containers, 1) the powder coating comprising A) at least one thermoplastic, B) if desired, at least one thermoset, preferably an epoxy resin having an epoxy equivalent weight of from 400 to 3000, C) if desired, pigments, fillers, catalysts, typical powder coating additives such as degassing agents, levelling agents, free-radical scavengers and antioxidants, and 2) the powder coating having a particle-size distribution such that a) at least 90 percent by mass of the powder-coating particles have a size of between 1 and 120 &mgr;m, b) the maximum size of the powder-coating particles is ≦150 &mgr;m for at least 99 percent by mass of the particles, and c) the mean size of the powder-coating particles is between 1 and 60 &mgr;m, preferably from 1 to 30 &mgr;m.

Abstract: Compounds of formulae (Ia) and (Ib) wherein the substituents R1 are each independently of the other hydrogen or methyl, R2 is an unsubstituted C1-C20alkyl group or a C1-C20alkyl group which is substituted by one or more than one substituent selected from the group consisting of hydroxy, C6-C14aryl and halogen, an unsubstituted phenyl group or a phenyl group which is substituted by one or more than one substituent selected from the group consisting of C1-C6alkyl, hydroxy or halogen, or is a radical of formula —CH2—OR3, wherein R3 is an unsubstituted C1-C20alkyl group or a C1-C20alkyl group which is substituted by one or more than one substituent selected from the group consisting of hydroxy, C6-C14aryl and halogen, an unsubstituted phenyl group or a phenyl group which is substituted by one or more than one substituent selected from the group consisting of C1-C6alkyl, hydroxy and halogen, or is a C2-C6alkenyl group, a C2-C20acyl group or an unsubstituted cyclohexylcarbonyl group or

Abstract: A lactone chain-extended polyester polyol of the present invention comprises the reaction product of a lactone and a previously chain-extended phenolic-based hydroxyl compound. The previously chain-extended phenolic-based hydroxyl compound may comprise the reaction product of (i) a lactone or an alkoxylating agent selected from the group consisting of alkylene oxides and alkylene carbonates, and (ii) a phenolic aralkylation polymer comprising the reaction product of a phenolic monomer having at least two free reactive positions; a styrene derivative; and a coupling agent. The previously chain-extended phenolic-based hydroxyl compound also may be chain-extended by reacting with a lactam to produce a lactam chain-extended polyester polyamide. The polyols and polyamides of the present invention provide unique combinations of hard and soft functionalities, which translates into materials exhibiting a unique combination of toughness and hardness.

Abstract: The invention relates to a process for the preparation of hydrophobic-hydrophilic AB block copolymers wherein block A consists of the monomer unit a, which is conjugated diene, and block B consists of the monomer unit b, which is epoxide, and the invention also relates to the AB block copolymer synthesized by the preparation process, as well as to micellar systems made from the AB block copolymer. According to the invention, the AB block copolymer is synthesized in two steps, whereby the first step is the preparation of block A in a nonpolar solvent and the second step is the preparation of block B in a polar solvent.

Abstract: The present invention provides a novel amino-group-containing polymer (salt) and a production process therefor wherein the amino-group-containing polymer (salt) is a product by a process including the step of introducing amino groups into a grafted polymer having a polyether skeleton, and can make good use of the reactivity or cationic property of at least primary amino groups and further, according to circumstances, secondary amino groups, and further can display various performances, such as curability useful for various uses and adsorbency onto films or fibers.

Abstract: An acetylide-form propargyl-containing resin composition for cationic electrocoating, which comprises a resin having a skeleton of epoxy resin and has a number average molecular weight of 500 to 20,000, and which contains, per 100 grams of the resin composition solids, 5 to 400 millimoles of sulfonium group and 10 to 495 millimoles of propargyl group, the total content of the sulfonium and propargyl groups being not more than 500 millimoles per 100 grams of the resin composition solids, said propargyl group being partly in the form of an acetylide. This resin composition may further contain unsaturated double bonds.

Abstract: A multilayer coating film which comprises: a cationic electrodeposition coat formed from an epoxy-based cationic electrocoating composition containing 5 to 300 millimoles of sulfonium group and 50 to 2,000 millimoles of carbon-carbon unsaturated bond per 100 g of the resin solid content, with carbon-carbon triple bond accounting for at least 15% of said carbon-carbon unsaturated bond; and a top coat formed thereon.

Abstract: A lactone chain-extended polyester polyol of the present invention comprises the reaction product of a lactone and a previously chain-extended phenolic-based hydroxyl compound. The previously chain-extended phenolic-based hydroxyl compound may comprise the reaction product of (i) a lactone or an alkoxylating agent selected from the group consisting of alkylene oxides and alkylene carbonates, and (ii) a phenolic aralkylation polymer comprising the reaction product of a phenolic monomer having at least two free reactive positions; a styrene derivative; and a coupling agent. The previously chain-extended phenolic-based hydroxyl compound also may be chain-extended by reacting with a lactam to produce a lactam chain-extended polyester polyamide. The polyols and polyamides of the present invention provide unique combinations of hard and soft functionalities, which translates into materials exhibiting a unique combination of toughness and hardness.

Abstract: A composition that includes an epoxy compound, a thiol curing agent, a catalyst and a phosphorus--containing compound having at least one P--OH group and at least one organic moiety characterized by the presence of an ethylenically unsaturated group. The composition is particularly useful as a sealer for an adhesive joint.

Abstract: Phenolic resin polyols are disclosed. The polyols, which contain aliphatic or mixed phenolic and aliphatic hydroxyl groups, are the reaction products of aralkylated phenols or phenol aralkylation polymers with an oxyalkylating agent selected from alkylene oxides and alkylene carbonates. The phenolic resin polyols are versatile intermediates for many polymer systems, including urethanes, epoxies, alkyds, acrylates, and polyesters.

Abstract: The present invention relates to a powder coating for application to packaging containers,1) the powder coating comprisingA) at least one thermoplastic,B) if desired, at least one thermoset, preferably an epoxy resin having an epoxy equivalent weight of from 400 to 3000,C) if desired, pigments, fillers, catalysts, typical powder coating additives such as degassing agents, levelling agents, free-radical scavengers and antioxidants, and2) the powder coating having a particle-size distribution such thata) at least 90 percent by mass of the powder-coating particles have a size of between 1 and 120 .mu.m,b) the maximum size of the powder-coating particles is .ltoreq.150 .mu.m for at least 99 percent by mass of the particles, andc) the mean size of the powder-coating particles in between 1 and 60 .mu.m, preferably from 1 to 30 .mu.m.

Abstract: The present invention pertains to coating compositions including a particular class of internally blocked polyamines as replacement for traditional blocked and unblocked polyamine crosslinkers. The use of these internally blocked polyamines results in better appearance characteristics and a lower VOC than are generally available with the traditional blocked varieties.

Abstract: This invention provides an acoustic vibrational material containing various fibers as the reinforcement material and having the epoxy resin as the matrix resin, wherein the epoxy resin is modified by a polybutadiene base elastomer containing not less than 90 mole percent of 1,2-linked units. The epoxy resin modified with the above polybutadiene elastomer exhibits a maximum value of loss coefficient at the temperature region near the room temperature. Thus compatibility between large internal loss and high elastic modulus is achieved.

Abstract: Core/shell particles comprising a core comprising an elastomer having a T.sub.G value of <0.degree. C., onto which a shell of a crosslinked copolymer is grafted, where the proportion of the crosslinking component in the copolymer of the shell is from greater than 5 to 90% by weight, based on the total amount of the comonomers of the shell copolymer, are suitable as toughening agents for epoxy resins, with which they have good compatibility.

Abstract: A process for preparing an epoxidized organic polymer by dispersing or suspending a solid organic polymer in an organic solvent and epoxidizing the dispersed or suspended polymer with a peroxide. The epoxidized polymer thus obtained is usable for coating materials, resin modifiers, rubber modifiers or adhesives, thus being extremely useful. The epoxidized organic polymer is useful to prepare a thermoplastic resin composition having improved mechanical strength, and comprising a thermoplastic resin, an epoxidized EPDM and an acid anhydride. The thermoplastic composition can be used to prepare a primer composition including a 100 parts by weight of an epoxidized EPDM and 50 to 70 parts by weight of a product of chlorination of a polyolefin modified with an unsaturated carboxylic acid or an anhydride thereof.

Abstract: The specification describes processes for synthesizing vinyl ether functionalized oligomers or polymers, and methods for coating optical fibers with formulations containing these oligomers or polymers. Optical fibers coated with these formulations can be highly transparent to radiation used to write optical gratings in the optical fibers.

Abstract: Water-dispersible curing agents for epoxy resins are disclosed which, as a mixture with epoxy resins, have a potlife indication by showing the end of the processing time by a clear increase in viscosity, and which comprise reaction products (ABC) of adducts of aliphatic polyols (A) with a weight-average molar mass of from 200 to 20, 000 g/mol, comprising at least one polyol (A1) having a molar mass of less than 4000 g/mol, and at least one polyol (A2) having a molar mass of more than 4000 g/mol, and at least one epoxide compound (B) having at least two epoxide groups per molecule, and a specific epoxide group content of from 500 to 10 000 mmol/kg, (A1) and (A2) being reacted separately or as a mixture with (B), and then reacting this adduct with one or more polyamines (C) having at least three amine hydrogen atoms and at least one primary amino group per molecule, the ratio of the number of hydroxyl groups of component (A) to the number of epoxide groups of component (B) being 1:3 to 1:10, and the ratio of th

Abstract: A substantially ester-free, acid-functional thiol-functional resin is prepared via the reaction of an epoxy compound with a thiolacetic acid in the presence of an amine catalyst and heat to form a thioacetate derivative which is hydrolyzed to yield an ester-free, .beta.-hydroxy thiol-functional resin. The .beta.-hydroxy thiol-functional resin can then be reacted with a material capable of insert a group conferring aqueous-base developability such as a cyclic anhydride.