Mixed With Unsaturated Reactant Or Polymer Derived Therefrom Patents (Class 525/529)
  • Patent number: 5922817
    Abstract: A water-dispersible polymer and a coating composition containing the water-dispersible polymer are disclosed. The water-dispersible polymer is prepared from: (a) an epoxy compound having about two epoxy groups, such as an epoxy resin, (b) a linking compound having (i) conjugated carbon--carbon double bonds or a carbon--carbon triple bond and (ii) a moiety capable of reacting with an epoxy group, such as sorbic acid, and (c) acrylic monomers, at least a portion of which are capable of rendering the polymer water dispersible, such as acrylic acid, wherein the epoxy portion (a) of the polymer is covalently linked to the polymerized acrylic portion (c) by linking compound (b). The coating composition contains the water-dispersible polymer, a fugitive base to solubilize the polymer, a curing agent, and a carrier containing water.
    Type: Grant
    Filed: May 11, 1998
    Date of Patent: July 13, 1999
    Assignee: The Dexter Corporation
    Inventors: Walter R. Pedersen, Joseph Devasia Ponmankal
  • Patent number: 5908901
    Abstract: An epoxy composition which is an infusible, gelled, heat curable, epoxy functional reaction product formed by mixing together:(A) one or more epoxy resins or epoxy group containing compounds;(B) a hardener system which will react with (A) to give a gelled solid, but which does not cause complete curing of (A) under the reaction conditions chosen for reaction of (A) and (B) to give a gelled solid; and(C) an optional further hardener system for (A) and the reaction product of (A) and(B), which is different from (B), and which remains largely unreacted with (A) and(B) under said reaction conditions.
    Type: Grant
    Filed: October 7, 1997
    Date of Patent: June 1, 1999
    Assignee: Ciba Specialty Chemicals Corporation
    Inventor: Peter Drummond Boys White
  • Patent number: 5905103
    Abstract: The invention relates to a process for the preparation of pigment paste resins for cathodically depositable coating compositions, wherein diepoxide compounds which contain polyoxyalkylene structures and alkyl and/or alkylene and/or hydroxyalkyl radicals having more than 3 carbon atoms are first reacted to form epoxy resin/amine adducts and final products with oxazolidine structures are obtained by a partial or complete reaction of secondary amino groups with formaldehyde.
    Type: Grant
    Filed: March 15, 1993
    Date of Patent: May 18, 1999
    Assignee: Vianova Resins, AG
    Inventors: Helmut Honig, Georg Pampouchidis, Willibald Paar, Herbert Matzer, Manfred Valtrovic
  • Patent number: 5883193
    Abstract: A thermosettable adhesive composition that includes a monomeric or partially polymerized composition that includes at least one polymerizable acrylic or methacrylic acid ester of a non-tertiary alcohol, a thermosettable epoxy resin, an amine curative, a silane coupling agent, and a chelating agent.
    Type: Grant
    Filed: July 1, 1997
    Date of Patent: March 16, 1999
    Assignee: Minnesota Mining and Manufacturing Company
    Inventor: Naimul Karim
  • Patent number: 5876210
    Abstract: The invention concerns a process for preparing a polymer composition, that is free-radical/photochemical and thermal curing epoxide-methacrylate and/or isocyanate-methacrylate adhesives in broadest terms, dental/medical adhesives, and dental restoratives. Furthermore the dual curing epoxide-methacrylate and/or isocyanate-methacrylate adhesives can be used in the optical industry, in optoelectronics and microelectronics, for example for the adhesion of complicated optical components in the combination glass/glass, glass/metal. Advantageous is the small shrinkage during polymerization and the good mechanical properties in combination with the possibility of step-wise or one-step polymerization.
    Type: Grant
    Filed: November 21, 1996
    Date of Patent: March 2, 1999
    Assignee: Dentsply G.m.b.H.
    Inventors: Joachim E. Klee, Walter Leube
  • Patent number: 5861466
    Abstract: Vinyl ester resins processed until low epoxy values are reached are storage stable for two weeks at 54.degree. C. (130.degree. F.). Adding a copper salt inhibitor also provides two weeks storage stability at 54.degree. C. (130.degree. F.). A synergistic effect is observed if both low epoxy values are reached and copper naphthenate inhibitor is used, extending shelf life stability to two months at 54.degree. C. (130.degree. F.).
    Type: Grant
    Filed: April 1, 1997
    Date of Patent: January 19, 1999
    Assignee: Ashland Inc.
    Inventor: Danny G. Hartinger
  • Patent number: 5854313
    Abstract: Fine particles of high heat resistant polymer obtained by emulsion polymerization or seeded polymerization of at least one epoxy ester (C) having two or more unsaturated bonds in one molecule and at least one reactive monomer (D) having at least one unsaturated double bond in one molecule, in the absence of a water-insoluble inorganic material as a dispersion stabilizer, the epoxy ester (C) being obtained by adding at least one unsaturated monobasic acid (B) to at least one epoxide (A-1) having at least one glycidyl group and one monocyclic hydrocarbon group in one molecule, and/or at least one epoxide (A-2) having at least one cycloaliphatic epoxy group in one molecule. The fine polymer particles have excellent heat resistance and solvent resistance, and an aqueous or alcoholic dispersion of such fine polymer particles is produced therefrom.
    Type: Grant
    Filed: April 21, 1997
    Date of Patent: December 29, 1998
    Assignee: Takeda Chemical Industries, Ltd.
    Inventors: Yoshimasa Omori, Hiroya Okumura, Takashi Shibata
  • Patent number: 5830952
    Abstract: A water-dispersible polymer and a coating composition containing the water-dispersible polymer are disclosed. The water-dispersible polymer is prepared from: (a) an epoxy compound having about two epoxy groups, such as an epoxy resin, (b) a linking compound having (i) conjugated carbon--carbon double bonds or a carbon--carbon triple bond and (ii) a moiety capable of reacting with an epoxy group, such as sorbic acid, and (c) acrylic monomers, at least a portion of which are capable of rendering the polymer water dispersible, such as acrylic acid, wherein the epoxy portion (a) of the polymer is covalently linked to the polymerized acrylic portion (c) by linking compound (b). The coating composition contains the water-dispersible polymer, a fugitive base to solubilize the polymer, a curing agent, and a carrier containing water.
    Type: Grant
    Filed: February 22, 1996
    Date of Patent: November 3, 1998
    Assignee: The Dexter Corporation
    Inventors: Walter R. Pedersen, Joseph Devasia Ponmankal
  • Patent number: 5807910
    Abstract: An adhesive for a flexible printed circuit board and the method of preparing the same where the adhesive displays excellent migration inhibition, moisture adsorption resistance, and superior peeling strength, heat resistance, solvent resistance, chemical resistance, flexibility, and electrical properties. The adhesive is prepared by pre-polymerizing an epoxy resin, a COOH-containing rubber, a filler, and a primary catalyst in a solvent using a tertiary amine as a primary catalyst to form a prepolymer, followed by curing the prepolymer using a curing agent and a curing catalyst. The adhesive is coated on a plastic film, dried and laminated with a copper foil and then cured at an elevated temperature to form a substrate.
    Type: Grant
    Filed: June 23, 1997
    Date of Patent: September 15, 1998
    Assignees: Industrial Technology Research Institute, Mek Tec Corporation
    Inventors: Tseng-Young Tseng, Yeong-Tsyr Hwang, Hsiao-Chian Li
  • Patent number: 5804680
    Abstract: A flame-resistant, UV-curable single-component reactive resin system comprises a phosphorus-containing acrylate, another unsaturated compound which can undergo free radical copolymerization with acrylates and a free radical initiator system.
    Type: Grant
    Filed: March 5, 1997
    Date of Patent: September 8, 1998
    Assignee: Siemens Aktiengesellschaft
    Inventors: Winfried Plundrich, Ernst Wipfelder
  • Patent number: 5792804
    Abstract: The present invention relates to a process for the preparation of an aqueous coating composition containing a carboxyl-containing epoxy resin having an acid number in the range from 5 to 200 mg of KOH/g and having an epoxide equivalent weight in the range from 1000 to 40,000, optionally crosslinking agents, organic solvents, optionally conventional assistants and additives, and optionally pigments and fillers. The organic binder solution is neutralized using a tertiary amine in the temperature range from 60.degree. C. to 120.degree. C. This is followed by dispersion in water, with the proviso that at least 95% of the epoxide groups of the epoxy resin have been reacted. The aqueous coating compositions prepared by the process are preferably used for coating cans.
    Type: Grant
    Filed: March 14, 1994
    Date of Patent: August 11, 1998
    Assignee: BASF Lacke + Farben, AG
    Inventors: Klaus Cibura, Hans Jurgen Figge, Regina Willmer, Holger Herbert Dartmann
  • Patent number: 5789039
    Abstract: The present invention relates to powder coatings curable by exposure to radiation, typically ultraviolet radiation. Powder coatings based upon cationically catalyzed resins (typically epoxy resins) are described including bisphenols, bisphenols modified by novolac, as well as aliphatic type epoxides including hydrogenated bisphenol-A, glycidyl methacrylic, glycidyl acrylics or related compounds, and vinyl ethers including mixtures of the foregoing compounds. Photoinitiators of sulfonium type, ferrocinium type, iodonium type, triphenolic types and related compounds are also included. Opacifiers, flow agents and plasticizers are also included. Charge additives for improved electrostatic deposition of the power coating are also described. Degassing agents are also typically included in the formulation, both for degassing the powder coating during cure, and to assist in degassing those substrates (such as wood) which tend to form bubbles during cure. Flow agents are also typically included in the formulation.
    Type: Grant
    Filed: January 26, 1996
    Date of Patent: August 4, 1998
    Assignee: Herberts Powder Coatings, Inc.
    Inventors: Kevin M. Biller, Ben A. MacFadden
  • Patent number: 5780117
    Abstract: Radiation-curable latex compositions having a secondary curing mechanism are disclosed. In these compositions, an anionically stabilized, water-borne dispersion of one or more radiation-curable resins is combined with a low molecular weight compound having at least two reactive functional groups, wherein one reactive functional group comprises an epoxy and the other reactive functional group comprises either an epoxy or a functionality capable of self-condensation after film formation. Also disclosed is a method for providing a cross-linked protective coating on a substrate, wherein a coating of the composition of the present invention is applied to the substrate, the coated substrate is exposed to actinic radiation to effect curing, and then the unexposed or underexposed portions of the coated substrate are allowed to cure at room temperature or greater.
    Type: Grant
    Filed: February 25, 1997
    Date of Patent: July 14, 1998
    Assignee: Rohm and Haas Company
    Inventors: Andrew Joseph Swartz, Kurt Arthur Wood
  • Patent number: 5776569
    Abstract: A coating composition for metal containers, a method of coating a metal container, and a metal article useful as a food or beverage container are disclosed. The coating composition for metal container interiors and exteriors comprises: (a) a low molecular weight polyfunctional epoxy novolac resin; (b) a phenolic resin; (c) a solution grade vinyl chloride copolymer, a high molecular weight epoxy resin or a mixture thereof; (d) about 60% to about 90% by weight of nonvolatile material of a vinyl chloride dispersion resin; and a nonaqueous carrier. The coating composition is stored as a single unit system from manufacture until use without an unacceptable increase in viscosity.
    Type: Grant
    Filed: May 1, 1996
    Date of Patent: July 7, 1998
    Assignee: The Dexter Corporation
    Inventor: Harold F. Cole
  • Patent number: 5760138
    Abstract: Polyacetal resin compositions characterized in that they are polyacetal resin compositions essentially consisting of a polyacetal resin, an olefin polymer containing a glycidyl group on the side chain and a styrene polymer having an oxazolyl group, the total content of the said olefin polymer having a glycidyl group on the side chain and the said styrene polymer having an oxazolyl group is 0.1-15 weight % with respect to the said polyacetal resin composition, and the content of the said styrene polymer having an oxazolyl group is 50-200 weight parts with respect to 100 weight parts of the said olefin polymer containing a glycidyl group on the side chain.
    Type: Grant
    Filed: October 25, 1996
    Date of Patent: June 2, 1998
    Assignee: E. I. du Pont de Nemours and Company
    Inventor: Kenichi Shinohara
  • Patent number: 5739185
    Abstract: The present invention provides a cationic electrodepositable coating composition comprising:?I! a polyurethane-modified epoxy resin-amine adduct obtained by a reaction of:(A) a polyurethane compound having one terminal isocyanate group in the molecule, obtained by a reaction of (a) a polyhydroxy compound having a number-average molecular weight of 50-8,000, (b) a polyisocyanate compound, and (c) a compound having one active hydrogen atom in the molecule,(B) a bisphenol type epoxy resin having at least two epoxy groups in the molecule, and(C) an active-hydrogen-containing amine compound, and ?II! a nonionic film-forming resin.
    Type: Grant
    Filed: August 16, 1995
    Date of Patent: April 14, 1998
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Hidehiko Haneishi, Masanobu Kudoh, Koji Kamikado
  • Patent number: 5728468
    Abstract: The invention relates to an organic phosphorus compound-containing which comprises an interpenetrating polymer network (IPN) produced by polymerizing free-radically polymerizable monomers comprising at least an allyl group-containing monomer and an epoxy resin.
    Type: Grant
    Filed: August 3, 1994
    Date of Patent: March 17, 1998
    Assignee: Akzo Nobel N.V.
    Inventors: Jan Andre Jozef Schutyser, Antonius Johannes Wilhelmus Buser, Andre Steenbergen
  • Patent number: 5726219
    Abstract: The present invention provides a rein composition comprising the following components (a), (b), (c), (d) and (e) as essential components; and an excellent multilayer printed circuit board obtained by using the resin composition:(a) a polyfunctional epoxy resin having an epoxy equivalent of 120-500,(b) a modified phenol novolac obtained by reacting 20-60 mole % of the phenolic hydroxyl groups of a phenol novolac obtained by condensing a phenol compound with formaldehyde in the presence of an acidic catalyst, with a glycidyl group-containing acrylate or methacrylate,(c) an epoxy acrylate or epoxy methacrylate compound,(d) a diluent consisting of a polyfunctional monomer having a plurality of photosensitive functional groups or a polyfunctional monomer having a photosensitive functional group and a heat-sensitive functional group, or a diluent consisting of a combination of the two monomers, and(e) a photopolymerization initiator.
    Type: Grant
    Filed: March 4, 1997
    Date of Patent: March 10, 1998
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Takeshi Hosomi, Hiroshi Hayai, Takayuki Baba
  • Patent number: 5721316
    Abstract: A process for incorporation of epoxidized polydienes into aromatic epoxy resins which comprises (a) blending the epoxidized polydiene into a curing agent in a ratio of 1:20 to 1:4, (b) reacting the epoxidized polydiene and a curing agent at a temperature of from 100.degree. to 150.degree. C. over a time from 10 to 100 minutes, (c) mixing the pre-reacted epoxidized polydiene and curing agent with the aromatic epoxy resin and accelerator, and (d) curing the aromatic epoxy resin by heating the full mixture of paragraph (c) to a temperature of from 110.degree. to 170.degree. C. for from 2 to 6 hours.
    Type: Grant
    Filed: July 3, 1996
    Date of Patent: February 24, 1998
    Assignee: Shell Oil Company
    Inventors: Michael Alan Masse, Kailash Dangayach, James Robert Erickson
  • Patent number: 5710214
    Abstract: Provided are novel thermosetting powder coating compositions which are useful for coating metal articles and protecting such articles from acidic corrosion. The compositions are comprised of an epoxy containing acrylic copolymer crosslinked with both an aliphatic dibasic acid and a blocked polyisocyanate.
    Type: Grant
    Filed: April 30, 1996
    Date of Patent: January 20, 1998
    Assignee: PPG Industries, Inc.
    Inventors: Chun-Tzer Chou, Robert B. Barbee
  • Patent number: 5709948
    Abstract: A curable composition comprises 0.1 to 50 weight percent of a curable epoxy resin, the weight percent being based on the total resin composition, an effective mount of a curative for the curable epoxy resin, 50 to 99.9 weight percent of at least one of a fully prepolymerized hydrocarbon polyolefin resin and a fully prepolymerized functionalized polyolefin resin, the weight percent being based on the total resin composition, wherein said hydrocarbon polyolefin is present in the range of 25 to 99.9 weight percent of the total resin composition and said functionalized polyolefin is present in the range of 0 to 49.9 weight percent of the total resin composition, said composition being free of epoxidized natural and/or synthetic rubber.
    Type: Grant
    Filed: December 21, 1995
    Date of Patent: January 20, 1998
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Mario A. Perez, David A. Ylitalo, Thomas M. Clausen, Robert J. DeVoe, Kevin E. Kinzer, Michael D. Swan
  • Patent number: 5708059
    Abstract: A stable, aqueous epoxy resin dispersion including: (A) an epoxy resin prepared by condensation of at least one epoxide compound having on average at least two epoxide groups per molecule, with an aralkylated polyhydroxy aromatic compound obtained by reaction of a polyhydroxy aromatic compound with an aromatic compound which carries an alkenyl group; (B) a dispersant; and water, is useful, for example, in a coating or adhesive.
    Type: Grant
    Filed: February 11, 1997
    Date of Patent: January 13, 1998
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Armin Pfeil, Michael Hoenel, Uwe Neumann
  • Patent number: 5696212
    Abstract: In a method for curing a resin by utilizing an intramolecular crosslinking reaction, the improvement wherein the crosslinking reaction is a ring opening addition reaction between a lactone structure and an active hydrogen-containing functional group.
    Type: Grant
    Filed: May 24, 1996
    Date of Patent: December 9, 1997
    Assignee: Kansai Paint Co., Ltd.
    Inventor: Osamu Isozaki
  • Patent number: 5665797
    Abstract: A resin composition for sealing liquid crystal cells comprising as principal ingredients epoxy resin containing a polysulfide modified epoxy resin, hydrazide compounds and fillers.The said epoxy resin contains a polysulfide modified epoxy resin expressed in an amount of the general formula (1) by 20 to 100% by weight in the entire epoxy resin and the average molecular weight of the entire epoxy resin is between 300 and 3000 Formula (1) is defined as follows: ##STR1## where each of R.sup.1 and R.sub.3 represents at least one organic group selected from a group consisting of bisphenol structures, aliphatic oxyether structures and aliphatic thioether structures and R.sup.2 represents a polysulfide structure expressed by --(C.sub.2 H.sub.4 OCH.sub.2 OC.sub.2 H.sub.4 S.sub.m).sub.n --, wherein m represents the number of sulfur atoms contained in a polysulfide structure, which is 1 or 2, and n represents the average number of polysulfide structures contained in the above formula, which is between 1 and 50.
    Type: Grant
    Filed: January 16, 1996
    Date of Patent: September 9, 1997
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Syuji Tahara, Koichi Machida, Seiji Itami, Masayuki Horiuchi
  • Patent number: 5663247
    Abstract: A hyperbranched macromolecule of polyester type comprising a central monomeric or polymeric nucleus and at least one generation of a branching chain extender having at least three reactive sites of which at least one is a hydroxyl or hydroxyalkyl substituted hydroxyl group and at least one is a carboxyl or terminal epoxide group. The nucleus is an epoxide compound having at least one reactive epoxide group. Optionally, the macromolecule comprises at least one generation consisting of at least one spacing chain extender having two reactive sites of which one is a hydroxyl or hydroxyalkyl substituted hydroxyl group and one is a carboxyl or terminal epoxide group. The macromolecule may be terminated by means of at least one chain stopper.
    Type: Grant
    Filed: October 24, 1995
    Date of Patent: September 2, 1997
    Assignee: Perstorp AB
    Inventors: Kent Sorensen, Bo Pettersson
  • Patent number: 5643975
    Abstract: An epoxy resin composition for semiconductor encapsulation use comprising an epoxy resin, a phenol resin, and an inorganic filler is improved by blending therein a component which is obtained by copolymerizing or homopolymerizing a reactive monomer having a vinyl group and an epoxy or phenolic hydroxyl group in a molecule thereof with or preferably in the presence of a thermoplastic elastomer or organic synthetic rubber. Alternatively, the modifying component (C) is obtained by copolymerizing a reactive monomer and a silane monomer with or preferably in the presence of a thermoplastic elastomer or organic synthetic rubber. The composition cures to products having improved thermal shock resistance and adherence.
    Type: Grant
    Filed: March 30, 1995
    Date of Patent: July 1, 1997
    Assignee: Shin-Etsu Chemical Company, Limited
    Inventors: Toshio Shiobara, Hisashi Shimizu
  • Patent number: 5629381
    Abstract: In a method for curing a resin by utilizing an intermolecular crosslinking reaction, the improvement wherein the crosslinking reaction is a a ring opening addition reaction between a lactone structure and an active hydrogen-containing functional group.
    Type: Grant
    Filed: May 24, 1996
    Date of Patent: May 13, 1997
    Assignee: Kansai Paint Co., Ltd.
    Inventor: Osamu Isozaki
  • Patent number: 5626939
    Abstract: A composition of matter and a process for the preparation thereof is disclosed for a fibrous composite (e.g., synthetic wood). The fibrous composite contains 50 to 95% by weight carpet and 5 to 50% by weight of a structural adhesive. Structural adhesives effective in this application would include phenol-formaldehyde resins, either of the resole or novalac type, phenol-formaldehyde resins that have at least one other co-monomer present, e.g., bis-phenol A, resorcinol, and other substituted phenols, urea-formaldehyde resins, melamine urea formaldehyde resins, tannin-phenol-formaldehyde resins, diisocyanate resin, epoxy resins, crosslinkable polyvinyl acetate, proteins, e.g., soy flour, blood and polyester resins.
    Type: Grant
    Filed: September 5, 1995
    Date of Patent: May 6, 1997
    Assignee: Georgia Tech
    Inventors: Abraham M. Kotlair, Daniel P. Fountain
  • Patent number: 5614581
    Abstract: A thermosetting in-mold coating for molded fiber-reinforced plastic parts is disclosed. The binder for the thermosetting coating is comprised of least one polymerizable epoxy-based oligomer having at least two acrylate groups and at least one copolymerizable ethylenically unsaturated monomer. The coating includes graphite and titanium dioxide which results in the gray color. The coating composition has good flow and coverage during molding, good adhesion, uniform color, good surface quality, and good paintability. The coating composition includes enough carbon black so that a 1.0 mil thick coating has a Ransburg conductivity meter reading of at least 165 units.
    Type: Grant
    Filed: October 18, 1995
    Date of Patent: March 25, 1997
    Assignee: GenCorp Inc.
    Inventors: David S. Cobbledick, Donald F. Reichenbach
  • Patent number: 5612394
    Abstract: Aqueous epoxy resin dispersion comprising (A) an epoxy resin which is a condensation product of (A-1) from 50 to 95% by weight, preferably from 55 to 85% by weight, of one or more epoxide compounds having at least two epoxide groups per molecule and an epoxide equivalent mass of from 100 to 2000 g/mol, (A-2) from 5 to 50% by weight, preferably from 15 to 45% by weight, of an aromatic polyol; and (A-3) from 0 to 25% by weight, preferably from 0 to 10% by weight, of modifying compounds containing at least two epoxide-reactive groups; (B) a dispersant comprising (B-1) a condensation product of a polyol having a weight-average molecular mass (M.sub.
    Type: Grant
    Filed: June 2, 1994
    Date of Patent: March 18, 1997
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Armin Pfeil, Michael Hoenel, Paul Oberressl, Dieter Dreischhoff, Stefan Petri
  • Patent number: 5580908
    Abstract: Polymer mixtures comprising at least one amino group-containing polymer A) and at least one polymer B) of ethylenically unsaturated monomers, which mixtures are obtained by reacting an epoxide with an amine in the presence of the ethylenically unsaturated monomers, and then arrying out free-radical polymerization. These polymer mixtures are employed for the preparation of binder vehicles for water-based printing inks and print varnishes.
    Type: Grant
    Filed: August 15, 1995
    Date of Patent: December 3, 1996
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Astrid Giencke, Robert Kiehl, Gerd Walz, Bernd Mergardt
  • Patent number: 5574079
    Abstract: The present invention relates to water-borne thermoplastic polyhydroxyether resins having narrow polydispersity (M.sub.w /M.sub.n <4.0 and M.sub.n >7,000 <12,000), and the use of such resins in water-borne coating compositions.
    Type: Grant
    Filed: December 21, 1994
    Date of Patent: November 12, 1996
    Assignee: Union Carbide Chemicals & Plastics Technology Corporation
    Inventors: Robert F. Eaton, Robert N. Johnson
  • Patent number: 5565525
    Abstract: A resin composition curable through a Michael reaction between (a) a component having a plurality of .alpha., .beta.-unsaturated carbonyl groups and (b) a component having a plurality of activated methylene, activated methyne or hydroxyl groups is disclosed. The curing reaction is catalyzed with a quaternary ammonium, quaternary phosphonium or tertiary sulfonium salt in the presence of an epoxy compound independently added to the composition or covalently attacted to either component (a) or component (b).
    Type: Grant
    Filed: October 26, 1994
    Date of Patent: October 15, 1996
    Assignee: Nippon Paint Co., Ltd.
    Inventors: Hideo Morimoto, Kei Aoki, Takashi Irie, Hiroto Yoneda
  • Patent number: 5565508
    Abstract: Aqueous synthetic resin dispersions comprising A) an ionic resin, preferably a cationic resin, B) a blocked polyisocyanate and C) a polymer of at least one ethylenically unsaturated monomer which can be polymerized by free-radical polymerization. These synthetic resin dispersions are used as binders in electrodeposition coating baths.
    Type: Grant
    Filed: April 23, 1994
    Date of Patent: October 15, 1996
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Michael Hoenel, Achim Voelker, Gerd Walz, Peter Ziegler
  • Patent number: 5552486
    Abstract: Propoxylated allyl alcohol homopolymers and copolymers of allyl alcohol and propoxylated allyl alcohol are disclosed. The polymers are soluble in many organic solvents, making them useful in a variety of applications, including polyesters, polyurethanes, alkyds, uralkyds, polyamines, acrylates, crosslinked polymeric resins, and polymer blends.
    Type: Grant
    Filed: May 25, 1995
    Date of Patent: September 3, 1996
    Assignee: ARCO Chemical Technology, L.P.
    Inventors: Shao-Hua Guo, Robert G. Gastinger
  • Patent number: 5539064
    Abstract: A resist ink composition developable with a diluted, alkaline solution, which exhibits high dispersion stability itself, can form a pattern with excellent resolution, even in the case of a low exposure amount, and can produce a cured resist film excellent in solvent resistance for high-performance printed circuits and which comprises an ultraviolet-curable resin obtained by copolymerizing (a) from 5 to 50% by weight of an ethylenically unsaturated monomer of a general formula: ##STR1## wherein R.sub.1 represents a hydrogen atom or a methyl group; R.sub.2 represents a hydrogen atom or an alkyl group; n represent an integer of from 1 to 4, and/or glycerol mono(meth)acrylate, (b) from 10 to 90% by weight or glycidyl (meth)acrylate and (c) from 0 to 80% by weight of other ethylenically unsaturated monomers capable of copolymerizing with these (a) and (b), followed by reacting the resulting copolymer with from 0.7 to 1.
    Type: Grant
    Filed: September 12, 1995
    Date of Patent: July 23, 1996
    Assignee: Goo Chemical Industries Co., Ltd.
    Inventors: Soichi Hashimoto, Satoshi Miyayama, Toshiaki Nishimura, Toshikazu Oda
  • Patent number: 5536775
    Abstract: Amine curable compositions containing a partially acrylated epoxy resin useful for forming protective and/or decorative coatings on a variety of substrates, particularly flooring substrates.
    Type: Grant
    Filed: November 4, 1994
    Date of Patent: July 16, 1996
    Assignee: Sandoz Ltd.
    Inventors: Benedict S. Curatolo, Frank V. Apicella, Jr., Thomas W. Richardson, Sr.
  • Patent number: 5516860
    Abstract: Radiation-curable acrylates are prepared by a process in which, in a 1st stage, a hydroxy compound is reacted with acrylic acid or methacrylic acid and, in or before a 2nd stage, the reaction product of the 1st stage is then reacted with an epoxy compound and compounds having one or more primary or secondary amino groups are added in the 2nd stage and the reaction in the 2nd stage is continued, after the addition of these compounds, until the acid number of the reaction mixture has decreased by at least 3 mg KOH/g of reaction mixture from the time of the addition of these compounds.
    Type: Grant
    Filed: May 1, 1995
    Date of Patent: May 14, 1996
    Assignee: BASF Aktiengesellschaft
    Inventors: Wolfgang Reich, Ulrich Jager, Erich Beck, Edmund Keil, Ulrich Erhardt, Adolf Nuber
  • Patent number: 5510428
    Abstract: Compositions (I), (II) and (III) comprising compounds having vinyl groups as side chains and epoxidized compositions (XI), (XII) and (XIII) thereof, which can be prepared by the various reaction combinations of (a) with (b) or (b)+(c), and or (d), where(a) is at least one compound having at least one vinyl group and one epoxy group in the molecule; (b) is at least one of a polybasic compound, an anhydride thereof, a polymer having carboxylic groups at terminals and a polymer having carboxylic groups as side chains; (c) is at least one organic compound having at least one active hydrogen atom; and (d) is at east one of an unsaturated monocarboxylic compound or an unsaturated monocarboxylic ester having a hydroxyl group.
    Type: Grant
    Filed: November 21, 1994
    Date of Patent: April 23, 1996
    Assignee: Daicel Chemical Industries, Ltd.
    Inventors: Yoshiyuki Harano, Sozo Namai, Katsuyuki Maeda, Takaaki Murai
  • Patent number: 5499409
    Abstract: The present invention provides a toughened cycloaliphatic epoxy resin composition useful as a coating comprising:(a) a curable cycloaliphatic epoxy resin,(b) an epoxidized low viscosity polydiene polymer wherein the polymer contains from 2.0 to 6.0 milliequivalents of epoxy per gram of polymer,(c) a curing agent,(d) an aromatic epoxy resin, and(e) a hydroxy functional material.
    Type: Grant
    Filed: July 18, 1994
    Date of Patent: March 19, 1996
    Assignee: Shell Oil Company
    Inventor: David J. St. Clair
  • Patent number: 5498783
    Abstract: A thermosetting powder coating composition resistant to overspray incompatibility defects that comprises solid particulates of a uniform mixture of (a) a polyester resin having an average of two or more carboxyl groups, (b) a first crosslinker that is reactive toward the carboxyl groups of the polyester resin, (c) from 1% to 20% of a reactive acrylic copolymer having a weight average molecular weight of from 10,000 to 40,000, and (d) a second crosslinker that is reactive toward the reactive functionality of the acrylic copolymer is described.
    Type: Grant
    Filed: August 22, 1994
    Date of Patent: March 12, 1996
    Assignee: BASF Corporation
    Inventors: Richard J. Foukes, Cynthia A. Stants
  • Patent number: 5494981
    Abstract: A polymerizable composition of matter comprises a cycloaliphatic epoxy resin, a cyanate ester resin, optionally a polyol, and, as initiator, a Bronsted acid. When cured, the compositions provide interpenetrating polymer networks (IPNs). The IPNs are useful as high temperature stable vibration damping materials, adhesives, binders for abrasives, and protective coatings.
    Type: Grant
    Filed: March 3, 1995
    Date of Patent: February 27, 1996
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Ilya Gorodisher, Michael C. Palazzotto
  • Patent number: 5488085
    Abstract: Polymer polyols prepared by a semi-batch process using a small amount of a seed polymer polyol are disclosed. The final polymer polyol has a broader particle size distribution as compared to an identically prepared polymer polyol prepared in the absence of the seed polymer polyol. The polymer polyols are suitable for use in producing polyurethanes, particularly polyurethane foams.
    Type: Grant
    Filed: August 18, 1994
    Date of Patent: January 30, 1996
    Assignee: ARCO Chemical Technology, L.P.
    Inventors: John E. Hayes, Donald W. Simroth, Xinhua Zhou
  • Patent number: 5478870
    Abstract: An aqueous resin dispersion which comprises as the chief component acrylic-modified epoxy-polyamine resin composed of a bisphenolic epoxy resin containing at least two epoxy groups per molecule; and, as bound to at least a part of said epoxy groups, an acrylic resin having on the average at least one functional group which is capable of reacting with said epoxy group, per molecule, the molecular weight distribution of said acrylic resin as expressed by its weight average molecular weight (Mw)/number average molecular weight (Mn) being within a range of 1 to 1.2, and an active hydrogen-containing amino compound. Said aqueous resin dispersion may further optionally contain non-ionic, film-forming resin. Such dispersions are useful for cationic electrodeposition paint which can form a coating excelling in weatherability and corrosion resistance.
    Type: Grant
    Filed: August 25, 1994
    Date of Patent: December 26, 1995
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Masanobu Kudoh, Hidehiko Haneishi
  • Patent number: 5472999
    Abstract: An aqueous resin dispersion which comprises as the chief component acrylic-modified epoxy-polyamine resin composed of a bisphenolic epoxy resin containing at least two epoxy groups per molecule; and, as bound to at least a part of said epoxy groups, an acrylic resin having on the average at least one functional group which is capable of reacting with said epoxy group, per molecule, the molecular weight distribution of said acrylic resin as expressed by its weight average molecular weight (Mw)/number average molecular weight (Mn) being within a range of 1 to 1.2, and an active hydrogen-containing amino compound. Said aqueous resin dispersion may further optionally contain non-ionic, film-forming resin. Such dispersions are useful for cationic electrodeposition paint which can form a coating excelling in weatherability and corrosion resistance.
    Type: Grant
    Filed: May 27, 1994
    Date of Patent: December 5, 1995
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Masanobu Kudoh, Hidehiko Haneishi
  • Patent number: 5439986
    Abstract: A thermo-curable resin composition which contains (a) an aromatic polyamide oligomer having polymerizable unsaturated group(s) at both terminals or within side chain(s), (b) a maleimide compound and (c) an epoxy resin; and a copper foil laminate which comprises impregnating said composition into substrates, followed by bonding by co-pressing copper foils is provided. The copper-clad laminate of the present invention has excellent adhesiveness to copper foil, heat resistance and electrical properties.
    Type: Grant
    Filed: November 16, 1993
    Date of Patent: August 8, 1995
    Assignee: Showa Highpolymer Co., Ltd.
    Inventors: Tadayuki Hosogane, Hiroshi Nakajima, Eiichiro Takiyama
  • Patent number: 5426150
    Abstract: A storage-stable suspension of an epoxy resin hardener and a toughener useful as a molding composition is prepared via a) the addition of an organic solvent to an aqueous emulsion of the toughener when using a water-sensitive hardener, such as a polycarboxylic anhydride, removing the water as an azeotrope by vacuum distillation, then adding the epoxy resin hardener and removing the residual solvent by vacuum distillation, or b) the addition of an aqueous emulsion of the toughener with or without an organic solvent to the epoxy resin hardener when using a water-insensitive hardener such as a polyamine, and removing the water and any organic solvent by vacuum distillation.
    Type: Grant
    Filed: May 10, 1994
    Date of Patent: June 20, 1995
    Assignee: Ciba-Geigy Corporation
    Inventors: Sameer H. Eldin, Robert P. Peyer, Frans Setiabudi
  • Patent number: 5426140
    Abstract: Resurfacing surfaces of highways, roads, etc. to provide skid-resistant surface by preparing polymer concrete composition containing a curable polymer composition containing ethylenically unsaturated polymer having carbon-bonded carboxyl groups and/or hydroxyl groups and at least one reactive thickener comprising Group IIA metal oxide or hydroxide or a polyisocyanate; mixing the resulting mixture with aggregate; coating said surface with the resulting composition; compacting and shaping the resulting composition and curing the compacted, shaped composition on said surface.
    Type: Grant
    Filed: July 14, 1993
    Date of Patent: June 20, 1995
    Assignee: Frank Fekete
    Inventors: Frank Fekete, David J. Thrash
  • Patent number: 5426157
    Abstract: This invention relates to improved polyepoxide resins having enhanced physical and elastic properties. The polyepoxide resins comprise a polyepoxide resin based on a polyglycidyl ether of a phenolic-type compound and an acrylate-terminated urethane prepolymer. The improvement in the polyepoxide resin formulation comprises incorporating a polymethylated amine curative having two secondary amine hydrogens represented by the formula: ##STR1## wherein R is alkylene or polyalkylene polyamine having from 2 to 20 carbon atoms. The presence of the aliphatic amine reactive component along with the acrylate-terminated urethane prepolymer results in an epoxy resin having enhanced properties.
    Type: Grant
    Filed: March 16, 1994
    Date of Patent: June 20, 1995
    Assignee: Air Products and Chemicals, Inc.
    Inventors: William E. Starner, John A. Marsella, Richard S. Myers
  • Patent number: 5420172
    Abstract: Cross-linked epoxy resins having nonlinear optical properties may be used in nonlinear optical media. These cross-linked epoxy resins may have the following structure: ##STR1## Z.sup.1 and Z.sup.2 being NLO-chromophores.
    Type: Grant
    Filed: August 23, 1993
    Date of Patent: May 30, 1995
    Assignee: Siemens Aktiengesellschaft
    Inventors: Jens Nordmann, Rainer Puehl