Abstract: A method is provided which includes providing a cooling apparatus which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly includes: an airflow opening configured to facilitate ingress or egress of airflow through the electronics rack with the door assembly mounted to the rack; an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger being configured to extract heat from the airflow passing thereacross; and a vapor condenser configured to facilitate condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack. The cooling apparatus, including the door assembly, facilitates air-cooling and immersion-cooling of different electronic components of the electronics rack.

Abstract: The electronic control has an electric control which incorporates circuitry which will generate heat in use. A cooling channel placed in contact with at least one surface on the electric control. The cooling channel has a portion which receives an enhanced heat transfer surface. At least one electrode pair is mounted on an inlet channel portion upstream of the portion of the channel that receives the enhanced heat transfer surface. A source of current is provided for the electrode. The electrode induces an electric field in the inlet channel, to drive a dielectric fluid across the enhanced heat transfer surfaces.

Abstract: An assembly for cooling heat generating components, such as power electronics, computer processors and other devices. Multiple components may be mounted to a support and cooled by a flow of cooling fluid. A single cooling fluid inlet and outlet may be provided for the support, yet multiple components, including components that have different heat removal requirements may be suitably cooled. One or more manifold elements may provide cooling fluid flow paths that contact a heat transfer surface of a corresponding component to receive heat.

Abstract: A cooling apparatus for an electronics rack is provided which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly includes: an airflow opening configured to facilitate ingress or egress of airflow through the electronics rack with the door assembly mounted to the rack; an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger being configured to extract heat from the airflow passing thereacross; and a vapor condenser configured to facilitate condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack. The cooling apparatus, including the door assembly, facilitates air-cooling and immersion-cooling of different electronic components of the electronics rack.

Abstract: Methods are provided for cooling data centers based on a cooperative system including a plurality of Indirect Air-Side Economizers, also referred to as Recirculation Air Cooling Units, that are advantageously operated in conjunction with one or more Side Stream Filtration Units or filters inclusive to a portion of the IASE/RACUs, and one or more Make-Up Air Dehumidification/Humidification Units for the introduction of ventilation air and control of humidity within the enclosed space. An objective of the systems and methods according to this disclosure is to provide the necessary rejection of heat, removal of particulate from the air, and control of the absolute moisture content of the air within a data center.

Abstract: The invention relates to heating, ventilation and/or air-conditioning equipment (1) including a device (9) for controlling the temperature of a battery (7) of an automobile including at least a compressor (11), a condenser (13), a first expansion member (15), a thermal-conditioning exchanger (17) for exchanging heat between a coolant and a heat-transport fluid (FC), and switching means. The temperature control device (9) includes at least one bypass line (9b) connecting an outlet of the compressor (11) to an inlet of the thermal-conditioning exchanger (17) while bypassing the condenser (13). The invention also relates to a method for controlling the temperature of an automobile battery (7) implemented by means of such heating, ventilation and/or air-conditioning equipment (1).

Abstract: In a refrigeration apparatus, a main surface of a printed wiring board has a heavy electric region, which is a region in the lower part of the printed wiring board where a heavy electric component group is disposed, and a light electric region, which is a region positioned above the heavy electric region, where a light electric component group is disposed. A refrigerant jacket contacts a power device which is disposed in the heavy electric region. A liquid pipe of the refrigerant pipe includes a portion that extends upwards towards the refrigerant jacket, and a cooling portion contacts the refrigerant jacket.

Abstract: Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled structure, a thermal conduction path coupling the electronic component and the liquid-cooled structure, a coolant loop in fluid communication with a coolant-carrying channel of the liquid-cooled structure, and an outdoor-air-cooled heat exchange unit coupled to facilitate heat transfer from the liquid-cooled structure via, at least in part, the coolant loop. The thermoelectric array facilitates transfer of heat from the electronic component to the liquid-cooled structure, and the heat exchange unit cools coolant passing through the coolant loop by dissipating heat from the coolant to outdoor ambient air. In one implementation, temperature of coolant entering the liquid-cooled structure is greater than temperature of the outdoor ambient air to which heat is dissipated.

Abstract: A method is provided which includes providing a cooling apparatus for an electronics rack which includes a door assembly configured to couple to an air inlet side of the electronics rack. The door assembly includes: one or more airflow openings facilitating passage of airflow through the door assembly and into the electronics rack; one or more air-to-coolant heat exchangers disposed so that airflow through the airflow opening(s) passes across the heat exchanger(s), which is configured to extract heat from airflow passing thereacross; and one or more airflow redistributors disposed in a direction of airflow through the airflow opening(s) downstream of, and at least partially aligned to, the heat exchanger(s). The airflow redistributor(s) facilitates redistribution of the airflow passing across the air-to-liquid heat exchanger(s) to a desired airflow pattern at the air inlet side of the electronics rack, such as a uniform airflow distribution across the air inlet side of the rack.

Abstract: A linked semiconductor module unit links a plurality of semiconductor modules by a first bus bar and a second bus bar, which are embedded in resin parts. The linked semiconductor module unit is disposed in a place other than on a printed circuit board. The semiconductor module linking structure is implemented readily by molding the bus bars together with semiconductor chips and lands to form the resin parts.

Abstract: A cooling apparatus for an electronics rack is provided which includes a door assembly configured to couple to an air inlet side of the electronics rack. The door assembly includes: one or more airflow openings facilitating passage of airflow through the door assembly and into the electronics rack; one or more air-to-coolant heat exchangers disposed so that airflow through the airflow opening(s) passes across the heat exchanger(s), which is configured to extract heat from airflow passing thereacross; and one or more airflow redistributors disposed in a direction of airflow through the airflow opening(s) downstream of, and at least partially aligned to, the heat exchanger(s). The airflow redistributor(s) facilitates redistribution of the airflow passing across the air-to-liquid heat exchanger(s) to a desired airflow pattern at the air inlet side of the electronics rack, such as a uniform airflow distribution across the air inlet side of the rack.

Abstract: A cabinet for housing and cooling electronic components with internally circulating air that is cooled at each of a plurality of equipment shelves.

Abstract: A facing surface of a refrigerant jacket includes a contact portion which contacts a device main body, a first recessed portion which faces a first lead section and secures an insulation distance to the first lead section due to being positioned further away from a power device than the contact portion, and a second recessed portion which faces the second lead section and secures an insulation distance to the second lead section due to being positioned further away from the power device than the contact portion.

Abstract: A two chamber heat transfer unit configured such that hazardous air can circulate through one of the chambers and potential ignition source components are contained in another chamber through which the gas to be heated or cooled will circulate.

Abstract: Methods are provided for creating and operating data centers. A data center may include an information technology (IT) load and a fuel cell generator configured to provide power to the IT load.

Abstract: Methods and means related to rejecting heat through thermal storage are provided. A heat sink includes internal cavities containing a phase-change material. Heat from a thermal load is rejected by flowing fluid coolant at a normal operating temperature. Failure of the fluid coolant system causes heat storage within the phase-change material at a temperature slightly greater than the normal operating temperature. Restoration of the fluid coolant system results in stored heat rejection and a return to a normal operating temperature. Normal operation of the thermal load can be performed while efforts are made to restore the fluid coolant system.

Abstract: A reliable, leak-tolerant liquid cooling system with a backup air-cooling system for computers is provided. The system may use a vacuum pump and a liquid pump and/or an air compressor in combination to provide negative fluid pressure so that liquid does not leak out of the system near electrical components. Alternatively, the system can use a single vacuum pump and a valve assembly to circulate coolant. The system distributes flow and pressure with a series of pressure regulating valves so that an array of computers can be serviced by a single cooling system. The system provides both air and liquid cooling so that if the liquid cooling system does not provide adequate cooling, the air cooling system will be automatically activated. The heat may be removed from the building efficiently with a cooling tower.

Abstract: A method of fabricating a cooling unit is provided to facilitate cooling coolant passing through a coolant loop. The cooling unit includes one or more heat rejection units and an elevated coolant tank. The heat rejection unit(s) rejects heat from coolant passing through the coolant loop to air passing across the heat rejection unit. The heat rejection unit(s) includes one or more heat exchange assemblies coupled to the coolant loop for at least a portion of coolant to pass through the one or more heat exchange assemblies. The elevated coolant tank, which is elevated above at least a portion of the coolant loop, is coupled in fluid communication with the one or more heat exchange assemblies of the heat rejection unit(s), and facilitates return of coolant to the coolant loop at a substantially constant pressure.

Abstract: An air conditioner includes a printed circuit board to which a power device is attached; and a refrigerant jacket which is connected to the power device, and through which refrigerant used for a refrigeration cycle flows. The printed circuit board is accommodated in a switch box. The refrigerant jacket is fixed to the switch box through a heat transfer plate, and the refrigerant jacket and the printed circuit board are connected together by the switch box.

Abstract: A Dewar apparatus includes a focal plane array (FPA) component coupled to an FPA carrier, and a cold bridge coupled to the FPA carrier. A cold shield is aligned with the optical axis and coupled to the cold bridge (e.g., via a direct-metal bond), and at least one cryostat enclosure is similarly coupled to the cold bridge such that it has an axis that is noncollinear with the optical axis.

Abstract: A method of providing cooling by a cooling system to a computer data center. The method includes providing a plurality of air-and-water radiators and one or more chillers, the chillers each having a first side in fluid communication with a chilled water loop and a second side in communication with a condenser water loop. The method also includes circulating a first portion of return water coming from the computer data center to a first subset of the air-and-water radiators and through the condenser water loop, circulating a second portion of the return water from the computer data center to a second subset of the air-and-water radiators and through the chilled water loop, and circulating the first portion and the second portion of the return water to the computer data center as cooled supply water.

Abstract: A system for cooling items of equipment likely to give off energy, comprises: an enclosure comprising a membrane that is porous to water vapor and sealed to liquid water, said membrane separating the cavity into a first portion designed to contain a fluid consisting of water and vapor, a second portion designed to contain the vapor resulting from the vaporization of the water, a temperature sensor for measuring the temperature of the liquid-vapor fluid contained in the cavity, a device to discharge the vapor from the cavity into the environment creating a vacuum in this cavity and breaking the natural liquid/vapor balance of the cavity containing the liquid, thus causing a vaporization of a portion of the liquid, a means for controlling the flow rate of the vapor discharged to outside of the cavity, said control means being regulated on the signal delivered by the temperature sensor.

Abstract: An object of the present invention is to provide an air-conditioning apparatus that can effectively utilize heat energy generated by a control unit. In an air-conditioning apparatus in which a main heat source unit having a main compressor, a main four-way switching valve, and a main heat-source-side water-cooling heat exchanger and a use side load device having a throttle device and a use side heat exchanger are connected by a pipeline so as to constitute a refrigerant circuit that performs cooling/heating by switching a circulation path of a refrigerant by the main four-way switching valve, a main control unit that controls operations of at least the main compressor and the main four-way switching valve is disposed in the refrigerant circuit as an evaporator that exchanges heat generated by the main control unit with the refrigerant.

Abstract: A cooler is placed on a power module to cool the power module with refrigerant through a refrigerant pipe, and includes a heat transfer plate having a groove into which a cooling pipe is fitted, and a presser plate configured to press the cooling pipe against the groove. The cooler includes a hinge mechanism configured to rotatably attach the presser plate to the heat transfer plate such that the presser plate is switched between an open position at which the groove is exposed and a closed position at which the presser plate covers the groove.

Abstract: A printed board on which a power module is mounted, a cooling pipe that is a refrigerant pipe of a refrigerant circuit, and a cooler attached to the power module and the cooling pipe are disposed in a casing. A support member by which the cooler is attached to the printed board and supported on the printed board, and a fixing member by which the printed board is fixed to the casing and supported on the casing are used.

Abstract: A datacenter cooling apparatus includes a portable housing having lifting and transporting structures for moving the apparatus, opposed sides in the housing, at least one of the opposed sides defining one or more air passage openings arranged to capture warmed air from rack-mounted electronics, opposed ends in the housing, at least one of the opposed ends defining one or more air passage openings positioned to allow lateral passage of captured air into and out of the housing, and one or more cooling coils associated with the housing to receive and cool the captured warm air, and provide the cooled air for circulation into a datacenter workspace.

Abstract: An improved solution for cooling a data center is provided. In an embodiment of the invention, a data center design that combines physical segregation of hot and cold air streams together with a data hall variable air volume system is provided. The invention is a data center design that resolves air management issues of re-circulation, bypass and load balance. Bypass is airflow supplied by the cooling units that directly returns without cooling servers. Recirculation airflow is server discharge warm air that returns directly without being cooled. Load balance is supplying the required server airflow. An embodiment includes physical segregation of cold and hot air streams and by providing variable air volume to match server load. Air segregation is done by enclosing the hot aisle end and above the cabinets. The air conditioning system provides variable air volume to the data hall (cold side) to meet server demands.

Abstract: Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a holding container with highly thermally conductive surfaces installed in the warmest area(s) of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances.

Abstract: A boiling refrigerant type cooling system to suppress overshoot upon start of heat generation and realize stable start of boiling. In the boiling refrigerant type cooling system, a metal boiling heat transfer unit has a base in thermal contact with a heat generating body. The boiling heat transfer unit is in contact with a liquid refrigerant. The boiling heat transfer unit has plural parallel tunnels communicating with the outside via holes or gaps under its surface, a groove deeper than a tunnel diameter formed through all the tunnels in an orthogonal direction to the tunnels, and a cover plate on the groove.

Abstract: An air conditioner includes a printed circuit board (31) to which a power device (33) is attached; and a refrigerant jacket (20) which is connected to the power device (33), and through which refrigerant used for a refrigeration cycle flows. The printed circuit board (31) is accommodated in a switch box (40). The refrigerant jacket (20) is fixed to the switch box (40) through a heat transfer plate (50), and the refrigerant jacket (20) and the printed circuit board (31) are connected together by the switch box (40).

Abstract: A device for reducing temperature variation in a plenum includes at least one pipe and a plurality of sumps containing a fluid operable to vary between a liquid state and a gaseous state depending upon a temperature of the fluid. The plurality of sumps are positioned at various locations within the plenum and the at least one pipe is in fluid communication with the plurality of sumps. In addition, the fluid, in the gaseous state, is caused to move through the at least one pipe and condense, thereby reducing the temperature at the location of the sump where the fluid was vaporized and thereby reducing temperature variation in the plenum.

Abstract: A data center cooling system may include heat transfer equipment to cool a liquid coolant without vapor compression refrigeration, and the liquid coolant is used on a liquid cooled information technology equipment rack housed in the data center. The system may also include a controller-apparatus to regulate the liquid coolant flow to the liquid cooled information technology equipment rack through a range of liquid coolant flow values based upon information technology equipment temperature thresholds.

Abstract: An electric machine system includes: an electric motor; and an absorption cooling system driven by heat generated by the electric motor and configured to cool a primary cooling fluid that removes the heat from the electric motor to a temperature below an ambient temperature of an ultimate heat sink. A method for operating the electric machine system is also disclosed.

Abstract: A cooling apparatus for electric equipment includes a generator configured to receive a heat load from first electric components, a evaporator configured to receive a heat load from second electric components, a closed compartment enclosing the generator and evaporator, and a absorber transferring heat from heated fluid to the outside of the closed compartment. To obtain an efficient and reliable cooling apparatus, the cooling apparatus includes a first expansion device which reduces the pressure of the fluid, and forwards the fluid in a liquid state and with a lower pressure to the secondary cooling element, which transfers heat to the received fluid from the second electric components for evaporating the fluid.

Abstract: An electric traction vehicle having: at least one pair of driving wheels; at least one reversible electric machine which can be mechanically connected to the driving wheels; an electronic power converter which pilots the electric machine; a storage system, which is aimed at storing electric energy, is connected to the electronic power converter and comprises at least one storage device; a passenger compartment; an air conditioning system of the passenger compartment which fulfills the function of regulating the temperature inside the passenger compartment; and a cooling system, which is completely independent and separate from the air conditioning system of the passenger compartment and uses a compression refrigeration cycle to cool at least one of the electric components, i.e. the electric machine, the electronic power converter and the storage system.

Abstract: An apparatus includes a cooling device that cools, by using refrigerant, heating components mounted over a circuit board and has different use-temperature conditions, wherein the circuit board is provided with a first area in which a first group of heating components having an operating condition of generating heat less than a given-heat quantity and operating in a temperature range lower than a first temperature is arranged, a second area in which a second group of heating components having an operating condition of generating heat equal not less than the given-heat quantity and operating in a temperature range between the first temperature and a second temperature exceeding the first temperature is arranged, and a third area in which a third group of heating components having an operating condition of generating heat equal to or less than the given-heat quantity and operating in a temperature range exceeding the second temperature is arranged.

Abstract: A refrigeration unit is disclosed that includes a fluid cooled power electronics package. The refrigeration unit can include a variable speed motor used to drive a compressor. The variable speed motor is driven by the fluid cooled power electronics where the fluid used to cool the electronics is working fluid from the refrigeration cycle of the refrigeration unit. A conduit is configured to route cooling fluid to the electronics. In one embodiment the electronics can be removed without the need to disassemble the conduit that carries the cooling fluid to the power electronics.

Abstract: A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immersion cooling of electronic components of the electronic subsystem, or one or more liquid-cooled structures providing conductive cooling to the electronic components of the electronic subsystem. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger of the local cooling station. In operation, heat is transferred via circulating coolant from the electronic subsystem and rejected in the liquid-to-air heat exchanger of the local cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.

Abstract: A container data center system includes a container, a plurality of servers, at least a regulation device, a first refrigeration device and a second refrigeration device. The container defines a first receiving room and a second receiving room isolated from the first receiving room. The servers are received in the first receiving room. The at least a regulation device is received in second receiving room. The at least regulation device is electrically connected to the servers for regulating the servers. The first refrigeration device is installed outside the container for cooling the first receiving room. The second refrigeration device is installed outside the container for cooling the second receiving room.

Abstract: A cooling system includes: a compressor; a first condenser; a cooling portion; a heat exchanger; a first line; a second line; a switching device; and an ejector. The first line forms a vapor compression refrigeration cycle by flowing refrigerant in order of the heat exchanger, the compressor, the first condenser and the cooling portion. The second line forms a heat pipe by circulating refrigerant between the first condenser and the cooling portion. The switching device flows refrigerant through the first line when air conditioning is performed, and flows refrigerant through the second line when air conditioning is stopped. The ejector is configured to, when refrigerant flows from the compressor to the first condenser via the ejector, draw refrigerant from the second line and join the drawn refrigerant into refrigerant from the compressor.

Abstract: A cooling apparatus and method are provided for cooling an electronics rack. The cooling apparatus includes an air-cooled cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronics rack, and includes a liquid-cooled condenser facilitating immersion-cooling of electronic components of the electronics rack, a liquid-cooled structure providing conductive cooling to electronic components of the electronics rack, or an air-to-liquid heat exchanger associated with the rack and cooling airflow passing through the electronics rack. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger. In operation, heat is transferred via circulating coolant from the electronics rack, and rejected in the liquid-to-air heat exchanger of the cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.

Abstract: Cooling apparatuses and methods are provided for facilitating pumped immersion-cooling of electronic components. The cooling apparatus includes a housing forming a compartment about one or more components, a supply manifold, a return manifold, and a coolant loop coupling in fluid communication the supply and return manifolds and the housing. Coolant flowing through the coolant loop flows through the compartment of the housing and at least partially immersion-cools the component(s) by flow boiling. A pump facilitates circulation of coolant within the loop, and a coolant bypass line is coupled between the supply and return manifolds. The return manifold includes a mixed-phase manifold section, and the bypass line provides coolant from the supply manifold directly to the mixed-phase manifold section. Coolant flows from the coolant bypass line into the mixed-phase manifold section in a direction counter to the direction of any coolant vapor flow within that manifold section.

Abstract: Systems and methods are provided for cooling electronic equipment in a data center. Ambient air is vertically circulated from a workspace across a plurality of rack-mounted electronic devices. The electronic devices are located in a plurality of trays such that each tray has a major plane that is substantially parallel to a side plane of the rack. The circulated air is cooled with a heat exchanger that is connected to a vertical end of the rack via a sealed interface. Multiple racks can be arrayed in a distributed cooling arrangement, which increases reliability and scalability of the data center.

Abstract: Cooling methods are provided for facilitating pumped immersion-cooling of electronic components. The cooling method includes: providing a housing forming a compartment about one or more components, and providing a supply manifold, a return manifold, and coupling a coolant loop coupling in fluid communication the supply and return manifolds and the housing. Coolant flowing through the coolant loop flows through the compartment of the housing and, at least partially, immersion-cools the component(s) by flow boiling. A pump facilitates circulation of coolant within the loop, and a coolant bypass line is coupled between the supply and return manifolds. The return manifold includes a mixed-phase manifold section, and the bypass line provides coolant from the supply manifold directly to the mixed-phase manifold section. Coolant flows from the coolant bypass line into the mixed-phase manifold section in a direction counter to the direction of any coolant vapor flow within that manifold section.

Abstract: A cooling apparatus is provided for a switchgear. The switchgear has one or more primary contacts constructed and arranged to connect to a terminal of a circuit breaker. The cooling apparatus includes an evaporator constructed and arranged to be associated with each primary contact. A condenser is located at a higher elevation than the evaporator. Fluid conduit structure fluidly connects the evaporator with the condenser. A portion of the fluid conduit structure defines a busbar tube electrically connected with an associated primary contact and defining a busbar of the switchgear. Working fluid is in the evaporator so as to be heated to a vapor state, with the fluid conduit structure being constructed and arranged to transfer the vapor to the condenser and to passively return condensed working fluid back to the evaporator for cooling the at least one primary contact and the associated busbar tube.

Abstract: A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immersion cooling of electronic components of the electronic subsystem, or one or more liquid-cooled structures providing conductive cooling to the electronic components of the electronic subsystem. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger of the local cooling station. In operation, heat is transferred via circulating coolant from the electronic subsystem and rejected in the liquid-to-air heat exchanger of the local cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.

Abstract: Apparatus and method are provided for cooling an electronic component. The apparatus includes a coolant-cooled structure in thermal communication with the component(s) to be cooled, and a coolant-to-refrigerant heat exchanger coupled in fluid communication with the coolant-cooled structure via a coolant loop to receive coolant from and supply coolant to the coolant-cooled structure. The apparatus further includes a refrigerant loop coupled in fluid communication with the coolant-to-refrigerant heat exchanger, and the heat exchanger cools coolant passing therethrough by dissipating heat from the coolant in the coolant loop to refrigerant in the refrigerant loop. A controllable coolant heater is associated with the coolant loop for providing an adjustable heat load on the coolant in the coolant loop to ensure at least a minimum heat load is dissipated from the coolant to the refrigerant passing through the heat exchanger.

Abstract: A system, compressor, and method that cools an electronics module with a low-pressure refrigerant. The system, compressor, and method utilize a temperature sensor that detects a temperature of the low pressure refrigerant and communicates with the electronics module. Based on the temperature detected by the temperature sensor, the electronics module controls a liquid dry out point of the refrigerant that is used to cool the electronics module.

Abstract: This invention provides a simple integrated system that uses roof-spray, water collection, and water storage components to cool a building, collect and store rainwater, and clean a rooftop solar array.

Abstract: A data center container includes a chassis, a cover, a cooling system, a water outlet, a water tray, and a connecting pipe. The cover is secured to the chassis. The cooling system is located in the chassis and includes a water inflow portion, a water outflow portion, and a drainer tray. The water outlet is located in the chassis. The water outlet communicates with the drainer tray and extends out of the chassis. The drainer tray is secured to the chassis. The water inflow portion and the water outflow portion are located between the cover and the water tray. The connecting pipe connects the water tray with the drainer tray. The water tray receives condensation dripping from the water inflow portion and the water outflow portion.