Abstract: A hybrid thermoelectric-ejector active cooling system having an increased Coefficient of Performance (COP) when compared to typical thermoelectric cooling modules. A thermoelectric cooling module is integrated with an ejector cooling device so that heat from the thermoelectric cooling module is rejected to a high temperature evaporator of the ejector cooling device. This provides for a total COP greater than the sum of the COPs of the thermoelectric cooling module and ejector cooling device individually. For example, given 1 unit input power into the thermoelectric cooling module, the heat received by the cold side of the thermoelectric cooling module would be COPTEC×1; and the energy rejected by the hot side of the thermoelectric cooling module and to drive the ejector cooling device would be COPTEC+1. Thus, the cooling received by the low temperature evaporator of the ejector cooling device is COPEJ×(COPTEC+1); and therefore total COPTE-Ej-AC is COPEj+COPTEC+COPEj×COPTEC.

Abstract: An actively heated mug or travel mug is provided. The mug or travel mug can include a body that receives a liquid therein and a heating system at least partially disposed in the body. The heating system can include one or more heating elements that heat a surface of the receiving portion of the body and one or more energy storage devices. The mug or travel mug can include a wireless power receiver that wirelessly receives power from a power source and control circuitry configured to charge one or more power storage elements and to control the delivery of electricity from the one or more power storage elements to the one or more heating elements. The mug or travel mug also can have one or more sensors that sense a parameter of the liquid or sense a parameter of the heating system and communicates the sensed information to the control circuitry.

Abstract: In some embodiments, a regulated thermal transfer device for a storage container includes: a phase change material unit, the phase change material unit including one or more walls surrounding a phase-change material region, and an aperture in the one or more walls; a heat pipe with a first end positioned within the phase change material unit, and a second end; a thermoelectric unit thermally connected to the second end of the heat pipe; a heat sink connected to the thermoelectric unit, and positioned to radiate heat away from the thermoelectric unit; and an electronic controller operably connected to the thermoelectric unit; wherein the regulated thermal transfer device is of a size and shape to be positioned so that the phase change material unit is within a storage region of a temperature-stabilized storage container, and the thermoelectric unit is positioned adjacent to an external surface of the temperature-stabilized storage container.

Abstract: A thermoelectric module includes a thermoelectric element and an electrode. The thermoelectric element has a rectangular end face. The electrode includes a first joint portion joined to a center portion of the end face; and a second joint portion joined to one end and a third joint portion joined to the other end. Each of the second joint portion and the third joint portion is disposed at a distance from each of four corners of the end face. A joint length in the second direction orthogonal to the first direction between the first joint portion and the end face is longer than each of a joint length in the second direction between the second joint portion and the end face, and a joint length in the second direction between the third joint portion and the end face.

Abstract: The rapid thermal cycling of a material is targeted. A solid state heat exchanger with a first well and second well is coupled to a power module. A thermoelectric element is coupled to the first well, the second well, and the power module, is configured to transfer thermal energy from the first well to the second well when current from the power module flows through the thermoelectric element in a first direction, and is configured to transfer thermal energy from the second well to the first well when current from the power module flows through the thermoelectric element in a second direction. A controller may be coupled to the thermoelectric elements, and may switch the direction of current flowing through the thermoelectric element in response to a determination by sensors coupled to the wells that the amount of thermal energy in the wells falls below or exceeds a pre-determined threshold.

Abstract: There is disclosed an electronic apparatus comprising a chip within a casing. A thermoelectric cooler has thermal connections to the chip and the casing and is configured to transport heat from the chip to the casing. A temperature measuring device is provided for determining the temperature of the chip. A control system is configured to maintain the chip at a target temperature by controlling current supplied to the thermoelectric cooler in response to the measured temperature. A temperature selection system is configured to select the chip target temperature dynamically on the basis of the casing temperature.

Abstract: In certain embodiments, a thermoelectric heat pump includes a heat transfer region having an array of thermoelectric modules, a waste channel in substantial thermal communication with a high temperature portion of the heat transfer region, and a main channel in substantial thermal communication with a low temperature portion of the heat transfer region. An enclosure wall provides a barrier between fluid in the waste channel and fluid in the main channel throughout the interior of the thermoelectric heat pump. In some embodiments, the waste fluid channel and the main fluid channel are positioned and shaped such that differences in temperature between fluids disposed near opposite sides of the enclosure wall are substantially decreased or minimized at corresponding positions along the channels.

Abstract: A Peltier element cooling control circuit that accurately controls a small number of elements with a simple structure. First and second amplification circuits are connected between a current detection resistor detecting current of a Peltier element and a current control circuit performing current control on the Peltier element based on voltage proportional to the current. One of two resistors determines the amplification rate of the first amplification circuit includes a thermistor. When the ambient temperature is equal to a predetermined temperature or greater, the output voltage of the second amplification circuit is supplied to the current control circuit to control the current of the Peltier element so as to be constant. When the ambient temperature is less than the predetermined temperature, the output voltage of the first amplification circuit is supplied to the current control circuit to control the current of the Peltier element in accordance with the temperature characteristics.

Abstract: A magnetocaloric element (1) made by an alignment of at least two adjacent sets (MC1-10) of magnetocaloric materials having different Curie temperatures. The magnetocaloric materials within a same set (MC1-10) have the same Curie temperature. The sets (MC1-10) are arranged according to an increasing Curie temperature, and the magnetocaloric element (1) comprises elements (MA1-2) for initiating a temperature gradient between a hot end (6) and an opposed cold end (7) of the magnetocaloric element (1).

Abstract: Techniques herein describe a pumping system, adapted to reduce or eliminate fluid cavitation. Optionally, the pumping system is adapted for application to a passive fluid recovery system. In one example, the pumping system includes a pump and a thermal sub-cooling device. The thermal sub-cooling device may sub-cool fluid input to a pump and heat fluid output from the pump, particularly under start-up conditions. In a further example, a controller manages power supplied to both the pump and the thermal sub-cooling device, to transition from an ambient temperature start-up condition to an elevated temperature operating condition.

Abstract: A heat radiation-thermoelectric fin includes a thermoelectric inorganic material on a heterogeneous laminate of graphene. The heterogeneous laminate may be tube-shaped or plate-shaped, and a metal conductor may be coupled to one or more of the heterogeneous laminate. A thermoelectric module may be formed to include the fin, and a thermoelectric apparatus may include a heat supplier connected to the thermoelectric module.

Abstract: A device has a passive cooling device having a surface, at least one active cooling device on the surface of the passive cooling device, and a thermal switch coupled to the passive cooling device, the switch having a first position that connects the active cooling device to a path of high thermal conductivity and a second position that connects the passive cooling device to the path of high thermal conductivity.

Abstract: A flexible cooling loop for providing a thermal path between a heat source and a heat sink includes a plurality of mechanically rigid tubing sections configured for being in thermal contact with the heat source and the heat sink. The cooling loop further includes a plurality if mechanically flexible tubing sections configured for connecting the mechanically rigid tubing sections to form the loop. The loop is configured for containing a liquid. The liquid is configured for being circulated within the loop for promoting transfer of thermal energy from the heat source to the heat sink via the loop.

Abstract: A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board for use as a heat pump in the circuit assembly. The circuit board and the at least one electrical pathway form part of the thermoelectric module when the thermoelectric module is coupled to the circuit board via the at least one electrical pathway. The thermoelectric module, including the portion of the circuit board forming part of the thermoelectric module, defines a footprint that is smaller than a footprint of the circuit board. As such, the circuit board is capable of supporting electrical components on the circuit board in a position outside the footprint defined by the thermoelectric module.

Abstract: In certain embodiments, a thermoelectric heat pump includes a heat transfer region having an array of thermoelectric modules, a waste channel in substantial thermal communication with a high temperature portion of the heat transfer region, and a main channel in substantial thermal communication with a low temperature portion of the heat transfer region. An enclosure wall provides a barrier between fluid in the waste channel and fluid in the main channel throughout the interior of the thermoelectric heat pump. In some embodiments, the waste fluid channel and the main fluid channel are positioned and shaped such that differences in temperature between fluids disposed near opposite sides of the enclosure wall are substantially decreased or minimized at corresponding positions along the channels.

Abstract: An actively heated mug or travel mug is provided. The mug or travel mug can include a body that receives a liquid therein and a heating system at least partially disposed in the body. The heating system can include one or more heating elements that heat a surface of the receiving portion of the body and one or more energy storage devices. The mug or travel mug can include a wireless power receiver that wirelessly receives power from a power source and control circuitry configured to charge one or more power storage elements and to control the delivery of electricity from the one or more power storage elements to the one or more heating elements. The mug or travel mug also can have one or more sensors that sense a parameter of the liquid or sense a parameter of the heating system and communicates the sensed information to the control circuitry.

Abstract: The invention relates to a temperature-control device for the temperature control of an energy source, wherein the temperature-control device comprises a temperature-control unit, which has at least one Peltier element which is arranged between an accommodation area for the energy source and a fluid area in a thermally effective manner. Furthermore, the temperature-control device comprises a control unit for supplying voltage to the Peltier element, wherein the control unit is designed to supply a voltage to the Peltier element, which causes the Peltier element to transfer heat from the hotter part of the accommodation area or fluid area to the colder part of the accommodation area or fluid area.

Abstract: A means of providing solar powered electricity for day and nighttime use supported in part by power from the grid to allow a small generator to electrify the home or business with a small generator operating with much larger capacity. Excess solar energy is provided to the power company as needed.

Abstract: An auxiliary power supply unit of a data center includes a thermoelectric chip module and a direct current/alternating current (DC/AC) voltage converter connected to the thermoelectric chip module. The thermoelectric chip module includes a number of thermoelectric chips. At least one sidewall of each thermoelectric chip contacts a hot pipe of the data center. The thermoelectric chips generate a direct current (DC) voltage when a temperature difference between the sidewalls of each thermoelectric chip exists. The DC/AC voltage converter converts the DC voltage into an alternating current (DC) voltage to power an air treatment device of the data center.

Abstract: Embodiments of the present disclosure relate to controlling multiple Thermoelectric Coolers (TECs) to maintain a set point temperature of a chamber. In one embodiment, a controller receives temperature data corresponding to a temperature of the chamber. Based on the temperature data, the controller selectively controls two or more subsets of the TECs to maintain the temperature of the chamber at a desired set point temperature. In this manner, the controller is enabled to control the TECs such that the TECs operate to efficiently maintain the temperature of the chamber at the set point temperature. In another embodiment, the controller selects one or more control schemes enabled by the controller based on temperature data and a desired performance profile. The controller then independently controls one or more subsets of the TECs according to the selected control scheme(s).

Abstract: A method for managing thermal energy in an internal combustion engine including an exhaust gas recirculation system and an engine cooling system includes recirculating a portion of an exhaust gas through the exhaust gas recirculation system that is in thermal communication with a first side of a thermoelectric device, flowing an engine coolant into thermal communication with a second side of a thermoelectric device, and controlling electric current between an electrical energy storage device and the thermoelectric device to transfer thermal energy between the recirculated exhaust gas and the engine coolant.

Abstract: A thermal plate for a substrate support assembly in a semiconductor plasma processing apparatus, includes multiple independently controllable planar thermal zones arranged in a scalable multiplexing layout, and electronics to independently control and power the planar heater zones. Each planar thermal zone uses at least one Peltier device as a thermoelectric element. A substrate support assembly in which the thermal plate is incorporated has an electrostatic clamping electrode layer and a temperature controlled base plate. Methods for manufacturing the thermal plate include bonding together ceramic or polymer sheets having planar thermal zones, positive, negative and common lines and vias.

Abstract: An environment control apparatus for cultivating plants includes a casing having a bottom with first and second holes. A thermoelectric cooling module is mounted in the first hole and includes first and second sides. The first side faces the casing. A temperature control pipe includes two ends connected to a heat reservoir. The temperature control pipe includes a heat exchanging section in contact with the second side of the thermoelectric cooling module. A first power device is mounted on the temperature control pipe. An auxiliary heat pipe includes two ends connected to the heat reservoir. The auxiliary heat pipe includes a heat dissipating section located in the second hole. A processor is coupled to the thermoelectric cooling module and the first power device.

Abstract: In a power electronics system of a next generation vehicle, a power module is provided including a thermoelectric device which is provided in a thermally conductive path between a power device and a cooling plate such that the thermoelectric device creates useful electric power from the waste heat of the power device.

Abstract: According to an embodiment of the disclosure, a thermal electric cooler is provided that includes a plurality of segments and a plurality of couplers. The segments are coupled in series to form a ladder-configuration string of P-channel chips and N-channel chips. Each segment comprises at least two substrings coupled in parallel. Each substring comprises at least one of the chips. Each of the couplers is configured to couple one of the P-channel chips to one of the N-channel chips.

Abstract: Some embodiments of the present invention provide a system that cools an integrated circuit (IC) chip within a computer system. During operation, the system converts heat generated by a heat-generating device within the computer system during operation of the computer system into thermoelectric power. Next, the system supplies the thermoelectric power to drive a fluid pump. Finally, the system uses the fluid pump to conduct heat away from the IC chip.

Abstract: An apparatus for magnetically processing a specimen that couples high field strength magnetic fields with the magnetocaloric effect includes a high field strength magnet capable of generating a magnetic field of at least 1 Tesla and a magnetocaloric insert disposed within a bore of the high field strength magnet. A method for magnetically processing a specimen includes positioning a specimen adjacent to a magnetocaloric insert within a bore of a magnet and applying a high field strength magnetic field of at least 1 Tesla to the specimen and to the magnetocaloric insert. The temperature of the specimen changes during the application of the high field strength magnetic field due to the magnetocaloric effect.

Abstract: A thermal flux steering device and method for steering thermal flux into a concentrated area is provided. The thermal flux steering device includes a matrix impregnated with a plurality of thermally conductive inclusions. The thermally conductive inclusions are angled so as to steer thermal flux into a concentrated area such as a thermal energy sink in communication with the matrix. The thermally conductive inclusions may be filler fibers or thermally conductive particles impregnated within the matrix. Orientation of the thermally conductive inclusions may be determined by detecting the thermal flux of the thermal energy source, the thermodynamic properties of the matrix and the thermally conductive inclusions, and the location of the flux concentration area.

Abstract: A controller for a thermoelectric cooling system comprises a sensor input that receives input from a sensor that measures a performance parameter of a thermoelectric cooling system. The thermoelectric cooling system comprises a plurality of thermoelectric devices electrically coupled in a combination of in series and in parallel with one another and electrically driven by a common driver. The controller also comprises a voltage control signal output, a processor, and a non-transitory memory having stored thereon a program executable by the processor to perform a method of controlling the thermoelectric cooling system. The method comprises receiving sensor data from the sensor input, determining a parameter of the voltage control signal based on the input sensor data, and transmitting a voltage control signal having the parameter to the driver to control heat transfer by the plurality of thermoelectric devices.

Abstract: A high efficiency thermoelectric cooling system and method is described. The cooling system has a thermoelectric module having a semi-conductor body sandwiched in contact between a pair of thermally conductive plates. A smooth continuous variable output direct current source supplies the semi-conductor body to attenuate thermal stress in the conductive plates due to temperature differential fluctuation across the plates. Current flow in the semi-conductor body transfers heat from one plate to the other plate. A cold heat sink absorbs heat from the cold plate. A heat convection assembly, including a hot heat sink, evacuates heat from the hot plate. The thermoelectric cooling device is secured to a wall of an insulated enclosure. An air convection housing may b provided to evacuate heat from the hot heat sink using an outside air supply or ambient air supply.

Abstract: According to one embodiment, an information processing apparatus includes a cooling module configured to cool an electronic component, a thermoelectric element configured to absorb heat generated from the electronic component, and to generate first electricity by performing a thermoelectric conversion by use of the heat, a determination module configured to determine whether the supply source is a battery, and a switcher configured to switch between a first mode and a second mode, the thermoelectric element performing the thermoelectric conversion and the cooling module is driven by the first driving electricity generated from the first electricity in the first mode, and the thermoelectric element absorbing the heat and the cooling module is driven by the second driving electricity generated by use of second electricity from a supply source includes a battery in the second mode.

Abstract: A smoothie dispenser (20, 20S, 20A) comprises a frame (22); a smoothie receptacle storage section (24); and a receptacle conformed chiller section (26). The smoothie receptacle storage section (24) is provided within the frame (22) and configured to house plural smoothie receptacles (30) at a first temperature. The chiller section (26) is arranged to receive a selected smoothie receptacle released from the smoothie receptacle storage section and configured to crystallize contents of the selected smoothie receptacle. The receptacle conformed chiller section (26) is “receptacle conformed” in the sense that a surface of the chiller section is configured to conform to (e.g., have a surface of shape to mate with or to form substantially greater than linear contact with) at least a portion an exterior profile or periphery of the selected smoothie receptacle.

Abstract: Provided are thermoelectric cooling packages and thermal management methods thereof. The method may include measuring a temperature of the thermoelectric cooling package including a semiconductor chip and a thermoelectric cooler, comparing the temperature of the thermoelectric cooling package with a target temperature, operating the thermoelectric cooler when the temperature of the thermoelectric cooling package is higher than the target temperature, and stopping the operation of the thermoelectric cooler when the temperature of the thermoelectric cooling package becomes lower than the target temperature.

Abstract: A heating apparatus including at least two thermoelectric modules connected in series, and at least one switching arrangement connected in parallel with one of the at least two thermoelectric modules such that electrical current flows via the at least one switching arrangement in an event of a failure of the one of the at least two thermoelectric modules.

Abstract: A liquid cooling system for an electronic system includes a plurality of cooling modules that are adapted to circulate a liquid coolant therethrough. Each cooling module is configured to be coupled to a circuit board of the electronic system and placed in thermal contact with one of a plurality of heat-generating electronic components on the circuit board. The cooling system also includes a plurality of heat exchangers that are configured to dissipate heat from the liquid coolant to air. Each heat exchanger of the plurality of heat exchangers is fluidly coupled between two cooling modules of the plurality of cooling modules in a flow path of the liquid. The cooling system also includes a plurality of conduits that fluidly couple the plurality of cooling modules to the plurality of heat exchangers.

Abstract: A cooling apparatus for removing heat having a low profile unitary member. The low profile unitary member has an evaporator portion and a condenser portion. The evaporator portion is thermally exposed to a heat generating component. The condenser portion is disposed at an elevated angle with respect to the evaporator portion. A plurality of microtubes are disposed within the first low profile extrusion. The plurality of microtubes have a heat transfer fluid contained therein. A second plurality of low profile extrusion members are mounted as fins on the evaporator section of the low profile unitary member. Heat is transferred from the heat generating component to the heat transfer fluid contained with the microtubes located within the evaporator portion. The heat transfer fluid to which the heat was transferred migrates to the condenser portion of the low profile unitary member by way of the microtubes. The heat transfer fluid is cooled in the condenser portion of the low profile unitary member.

Abstract: A thermoelectric module and methods for making and applying same provide an integrated, layered structure comprising first and second, thermally conductive, surface volumes, each in thermal communication with a separate respective first and second electrically conductive patterned trace layers, and an array of n-type and p-type semiconducting elements embedded in amorphous silica dielectric and electrically connected between the first and second patterned trace layers forming a thermoelectric circuit.

Abstract: A cooling device includes a magnetocaloric unit disposed between a heat sink and a heat load, an electromagnet operably connected with the magnetocaloric unit, and at least one thermostat switch disposed between the magneto caloric unit and the heat load. The at least one thermostat switch is configured to make the magnetocaloric unit in contact with either the heat load or the heat sink according to a temperature of the magnetocaloric unit.

Abstract: A system for using a thermal cycle for healing or cooling. The system comprises a thermoelectric module flowing a gas; and an internal heat exchanger flowing the gas and exchanging heat between the gas and another fluid; the gas flow from at least one of the thermoelectric module and the internal heat exchanger flowing for heating or cooling. The system may be for using a closed cycle to remove a liquid from at least one object comprising moisture, the system comprising an enclosure containing the at least one object and arranged to receive a hot and dry gas for flow over the at least one object and thereby to produce a flow of moist gas at an intermediate temperature. The internal heat exchanger is arranged to exchange heat between the flow of the moist gas at the intermediate temperature and a flow of cold dry gas, thereby producing cooled moist gas and pre-warmed dry gas.

Abstract: A temperature control device includes a thermoelectric device and a first sink. The thermoelectric device includes a plurality of thermoelectric elements electrically interconnected with one another by a plurality of electrical interconnects which are coupled between an interior surface of a first plate and an interior surface of a second plate. The first sink has a flat bottom and a plurality of generally parallel fins extending out of the flat bottom. Also, the flat bottom is coupled to an exterior surface of the first plate by a coupling media that includes a resilient and thermally-conductive pad.

Abstract: Disclosed herein is a thermoelectric module. The thermoelectric module includes a first substrate, a second substrate, a diffusion prevention layer, and a thermoelectric device, wherein each of the first and second substrates is stacked with: a heat radiation layer performing heat generation reaction or heat adsorption reaction when power is applied to the thermoelectric module; an insulating layer formed on one surface of the heat radiation layer and formed in a first square wave pattern having a first protrusion part and a first groove part; and an electrode layer buried into the first groove part formed on a surface of the insulating layer.

Abstract: A means of providing solar powered electricity for day and nighttime use supported in part by power from the grid to allow a small generator to electrify the home or business with a small generator operating with much larger capacity. Excess solar energy is provided to the power company as needed.

Abstract: A thermoelectric device comprising an elongated panel, formed of a thermally insulating material, and having a plurality of thermoelectric elements comprising compacted conductors inside the insulating material and expanded conductors outside the insulating material wherein the thermoelectric elements run substantially parallel to or at an acute angle relative to the long dimension of the panel. The thermoelectric device may be integrated into a variety of surfaces or enclosures needing heating or cooling with controls and configurations to optimize the application.

Abstract: A method and system for multi-zone control of temperature for a substrate is described. The temperature control system comprises a heat exchanger coupled to two or more fluid channels in a substrate holder configured to support the substrate. The heat exchanger is configured to adjust the temperature of a heat transfer fluid flowing through the two or more fluid channels. The temperature control system further comprises a heat transfer unit having an inlet that is configured to receive heat transfer fluid from the heat exchanger at a bulk fluid temperature. Additionally, the heat transfer unit comprises a first outlet configured to couple a portion of the heat transfer fluid at a first temperature less than the bulk temperature to a first fluid channel of the two or more fluid channels, and a second outlet configured to couple a remaining portion of the heat transfer fluid at a second temperature greater than the bulk fluid temperature to a second fluid channel of the two or more fluid channels.

Abstract: The invention relates to thermoelectric systems, devices and methods for generating energy and, providing cooling and heating. Non-ceramic thermoelectric technology is employed. In the invention, non-ceramic substrates are used to replace the ceramic layers which are typically utilized in conventional thermoelectric structures. The non-ceramic substrates can be selected from metals and metal-containing materials known in the art which have a surface modification, such as but not limited to, a coating or a surface restructuring. The incorporation of non-ceramic substrates allows several other components which are associated with the use of ceramic layers in conventional thermoelectric structures to be eliminated from the thermoelectric device.

Abstract: Devices used in conjunction with detecting analytes and methods of their manufacture are disclosed. A pre-concentrator device includes a thermoelectric material and an aerogel which includes a nanostructured material disposed on, and in thermal communication with, the thermoelectric material. Such a pre-concentrator is part of a detection system including a sensor. The detection system is used in a method for detecting analytes.

Abstract: A light powered barrier for cooling a substrate includes a thermo-conductive layer for contacting the substrate, a first P-type layer disposed atop the thermo-conductive layer, a first N-type layer disposed over the first P-type layer and a thermoelectrically conductive insert that conducts heat from the thermo-conductive layer and electrically conducts electrons and holes from the first P-type layer and the first N-type layer.

Abstract: A device for conducting heat from a source to a sink is provided that, in one embodiment, includes a thermoelectric element coupled to a substrate via sintered material that includes nano and/or micro particles. In one aspect, the sintered material includes silver particles and in another aspect the sintered material also includes an additive to control the coefficient of thermal expansion of the sintered material.

Abstract: This is an enhanced thermoelectric cooler with superconductive heat-dissipative coolers for use in air-conditioner. This invention is comprised of a thermoelectric cooling chip sandwiched between two superconductive unidirectional heat-dissipative cooling devices. Each device consists of special superconductive pipes, heat-dissipative plates, and a fan. The cooling devices are to dissipate heat quickly from the thermoelectric cooling chip and to maintain constant hot to cold air flow.

Abstract: Disclosed is a system for thermally conditioning and pumping a fluid. The system includes a thermoelectric heat exchanger having a thermoelectric device configured to pump heat. Heat exchangers are provided for transferring heat to and from the thermoelectric device and for generating a fluid flow across the thermoelectric device. The conditioned fluid may be placed in thermal communication with a variety of objects, such as a vehicle seat, or anywhere localized heating and cooling are desired. Thermal isolation may also be provided in the direction of flow to enhance efficiency.