Abstract: In accordance with an embodiment, a pattern inspection method includes modeling a shape simulation of a pattern, performing in-line measurement with respect to control parameters which are to be controlled in a manufacturing process of the pattern, executing the shape simulation by using a result of the in-line measurement, and judging acceptance of a pattern shape based on a result of the shape simulation.

Abstract: An abnormality determination system for a processing apparatus includes: a data acquiring section that acquires time-series data changing with time from a signal outputted by a sensor installed in a processing apparatus for processing a processing object; a data selecting section that selects only model data, which is useful time-series data, from the time-series data acquired by the data acquiring section; a threshold value setting section configured to calculate variable threshold value data changing with time from the model data selected by the data selecting section; and a determining section configured to determine an occurrence of an abnormality by comparing time-series data to be monitored, acquired by the data acquiring section, with the variable threshold value data. The selection of model data is performed based on an evaluation performed by an inspection device which is configured to evaluate a processing result of the processing object performed by the processing apparatus.

Abstract: Described herein are methods for matching the characteristics of a lithographic projection apparatus to a reference lithographic projection apparatus, where the matching includes optimizing projection optics characteristics. The projection optics can be used to shape wavefront in the lithographic projection apparatus. According to the embodiments herein, the methods can be accelerated by using linear fitting algorithm or using Taylor series expansion using partial derivatives of transmission cross coefficients (TCCs).

Abstract: A method of controlling process distribution of a semiconductor process includes receiving process distribution data representing the process distribution of the semiconductor process, receiving a parameter related to the process distribution, generating a virtual metrology model corresponding to the process distribution based on a relationship between the process distribution data and the parameter, and modifying a process variable affecting the process distribution based on the virtual metrology model.

Abstract: The present disclosure relates to systems and processes for detecting and rejecting defective absorbent articles from a converting line. In particular, the systems and methods may utilize feedback from technologies, such as vision systems, sensors, remote input and output stations, and controllers with synchronized embedded clocks to accurately correlate inspection results and measurements from an absorbent article converting process. As such, the systems and methods may accurately apply the use of precision clock synchronization for both instrumentation and control system devices on a non-deterministic communications network. In turn, the clock synchronized control and instrumentation network may be used to control a reject system on converters of absorbent articles. In some embodiments, the controller will reject only defective absorbent articles without the need to reject non-defective absorbent articles.

Abstract: In a monitoring system, when there is an evaluation that a product is defective, in a solder print inspecting device that is subject to monitoring, that information is sent to a mobile terminal possessed by an operator. The operator who views the notification performs, through the mobile terminal, a checking task for evaluating whether or not the evaluation result regarding the printed substrate that has been evaluated as a defective product is correct. Depending on the evaluation result, an operating instruction is sent to the solder print inspecting device, which has temporarily stopped the printed substrate. If correction information instructing that the defective-product evaluation be corrected to a non-defective-product evaluation is sent from a mobile terminal to the solder print inspecting device, the solder print inspecting device corrects the defective-product evaluation to a non-defective-product evaluation, and releases the temporary stop of the printed substrate.

Abstract: Timeline presentations of process control system alarms are described. An operator interface apparatus for a process control system is described that includes an operator display module to present an operator application on a display. The operator interface also includes an alarm presentation interface to be presented on the display via the operator application. The alarm presentation interface includes a timeline to graphically indicate a temporal relationship of a plurality of active alarms of the process control system.

Abstract: A yield prediction is received by a strategy engine. The strategy engine compares the end-of-line yield prediction to a plurality of rules. The strategy engine then instructs a component of an equipment engineering system to perform an action included in a rule that corresponds to the end-of-line yield prediction.

Abstract: A method of conducting vehicle usage data analysis is provided. The method includes providing usage data about at least one vehicle to a database. The usage data may be analyzed and compared to a member of a set of vehicle development models to determine whether to update a vehicle development model. The usage data may also be analyzed to determine whether to transmit a communication to a vehicle.

Abstract: A system and method include determining a state of a batch process. Historical segments are retrieved from a historical database of trajectories of the batch process as a function of the state of the batch process. A model is created as a function of the retrieved historical segments. The model is used to provide state information about the batch process and may then be discarded.

Abstract: An operation position locating system locates a position on a product where an operation is performed in a manufacturing process of the product including one or more operations to be performed. The system includes an operation completion coordinates detection unit and an operation position locating unit. The operation completion coordinates detection unit processes a plurality of images obtained by capturing from a plurality of viewpoints a range including an operation completion position where an operation is completed when the operation is completed, thereby detecting a set of operation completion coordinates representing the operation completion position.

Abstract: A method determines a defect on a surface of an object. A symmetric representation of at least part of the object is generated and a pair of unmatched areas between the surface of the object and a surface of the symmetric representation is determined. Next, the defect on the surface of the object is determined based on the pair of unmatched areas.

Abstract: A quality validation method to improve inspection and validation processes by increasing their quality, efficiency, and positive impact. This method automatically prompts operators at one or more validation stations to follow a validation path comprising one or more validation items configurable by part number. It allows for automatic or manual feedback on the result of each item checked, the ability to enforce a particular pack-out consist based upon user provided specifications, and the ability of historically storing inspection results comprising container, part and inspection item information and results. It additionally provides an easily accessible interface to configure validation items and areas by part number, configure validation paths comprising of a variable quantity and order of validation items, and obtain information in a variety of useful formats.

Abstract: The present invention provides a generation method of generating data for a mask pattern to be used for an exposure apparatus including a projection optical system for projecting a mask pattern including a main pattern and auxiliary pattern onto a substrate, including a step of setting a generation condition under which the auxiliary pattern is generated, and a step of determining whether a value of an evaluation function describing an index which indicates a quality of an image of the mask pattern calculated, wherein if it is determined that the value of the evaluation function falls outside a tolerance range, the generation condition is changed to set a new generation condition.

Abstract: This invention provides a test structure for inspecting word line array fabricated by SADP process, wherein the test structure comprises a contour circuit to cover one end of the WL array, and is alternatively float and ground to the word line array. The word line array then can be inspected by using E-beam inspection tool to identify open and short defects.

Abstract: A system and method for controlling the quality of an object during machining thereof with a machine. Measurement data is received from a measuring device during the machining, the measurement data comprising at least one measurement of the object. It is determined from the received measurement data whether the object comprises a defect. An output signal is then generated to cause the machine to correct a detected defect.

Abstract: Autonomous biologically based learning tool system(s) and method(s) that the tool system(s) employs for learning and analysis of performance degradation and mismatch are provided. The autonomous biologically based learning tool system includes (a) one or more tool systems that perform a set of specific tasks or processes and generate assets and data related to the assets that characterize the various processes and associated tool performance; (b) an interaction manager that receives and formats the data, and (c) an autonomous learning system based on biological principles of learning. Objectively generated knowledge gleaned from synthetic or production data can be utilized to determine a mathematical relationship among a specific output variable and a set of associated influencing variables. The generated relationship facilitates assessment of performance degradation of a set of tools, and performance mismatch among tools therein.

Abstract: A mobility building product traceability system and a production line controlling method is used to set product information and to test quality of each product, wherein a product traceability system comprises a mobile electronics device used by an inspector and an ID (Identification) confirmation code inputted by the inspector; a storing unit built in the mobile electronics device and having feature standards related to products built therein; at least one imaging apparatus built in the mobile electronics device and applied to scan product serial number barcodes, product features, and two-dimensional barcodes associated with the products so as to receive, record or read production and test information of the products, and then the production and test information is stored in the storing unit.

Abstract: A tire measurement system includes a computer with various memory/media elements for storing raw and transformed tire measurement data (e.g., a data set of measured radial or lateral run-out values) as well as software in the form of computer-executable instructions, which are executed by a processor to filter selected run-out values within the obtained data set that spike above adjacent measurements, identify selected ones of the filtered run-out values that lie on a convex hull surrounding the entire set of values, and perform interpolation of the identified selected ones of the run-out values that lie on the convex hull to obtain a final data set of filtered run-out measurements. Similar steps can be performed on an inverted data set to better detect sidewall deformation features such as sidewall depressions.

Abstract: A system for determining a list of potential lots for consolidation is presented. The system includes a module having a database and an input for receiving an event occurrence. The database may include a set of consolidation rules. The module, upon receiving the event occurrence, retrieves the consolidation rules and initiates a consolidation analysis to determine the list of potential lots for consolidation based on the consolidation rules.

Abstract: The present disclosure relates to systems and processes for detecting and rejecting defective absorbent articles from a converting line. In particular, the systems and methods may utilize feedback from technologies, such as vision systems, sensors, remote input and output stations, and controllers with synchronized embedded clocks to accurately correlate inspection results and measurements from an absorbent article converting process. As such, the systems and methods may accurately apply the use of precision clock synchronization for both instrumentation and control system devices on a non-deterministic communications network. In turn, the clock synchronized control and instrumentation network may be used to control a reject system on converters of absorbent articles. In some embodiments, the controller will reject only defective absorbent articles without the need to reject non-defective absorbent articles.

Abstract: A diagnostic system to diagnose a pressure profile of a molding machine M in an operating state is disclosed. The pressure profile of the molding machine M in the operating state is measured with a pressure sensor of a measurement system 3. In a diagnostic system A, a database is formed such that a reference pressure profile and the actual pressure profile selected according to a mold to be made are preserved therein. The diagnostic system A compares the reference pressure profile to the actual pressure profile in the database to determine whether the actual pressure profile is within a predetermined tolerance.

Abstract: Embodiments of the invention include systems and methods for automatically predicting production yield for a circuit assembly according to attributes of its components and defect data mapped thereto. Embodiments receive a proposed design specification for a circuit assembly, including bill of materials (BOM) and schematic data, at a yield prediction environment. The yield prediction environment maps a set of attributes to each component in the BOM and maps a set of possible defects to each component according to its attributes. Defects may be further mapped to a manufacturing process assigned to populate each component in the circuit assembly. The defects are associated with predicted frequencies of occurrence, which can be used to roll up a yield prediction for the circuit assembly. Embodiments further allow “what-if” analyses to be performed so that different yield prediction results can be compared according to different form factor options and/or different manufacturing process options.

Abstract: A method for analyzing abnormalities in a semiconductor processing system provides performing an analysis of variance on a production history associated with each of a plurality of tools at each of a plurality of process steps for each of a plurality of processed wafers, and key process steps are identified. A regression analysis on a plurality of measurements of the plurality of wafers at each process step is performed and key measurement parameters are identified. An analysis of covariance on the key measurement parameters and key process steps, and the key process steps are ranked based on an f-ratio, therein ranking an abnormality of the key process steps. Further, the plurality of tools associated with each of the key process steps are ranked based on an orthogonal t-ratio associated with an analysis of covariance, therein ranking an abnormality each tool associated with the key process steps.

Abstract: A hot glue application system includes a melter and components attached to the melter. The components comprise at least one heatable feed hose, and at least one heatable application valve. The components comprise a data storage medium which is configured to be machine-readable which comprises on at least one of data transmitted for a component-specific control parameter, during an initialization, cyclically, and when a change is made in a system configuration.

Abstract: A method of designing a pattern layout includes defining one shot area including a plurality of chip areas, generating an initial common layout in the plurality of chip areas, primarily correcting the initial layout to form a primary corrected layout, and secondarily correcting the primary corrected layout independently to form a plurality of secondary corrected layouts.

Abstract: Methods of monitoring pharmaceutical manufacturing processes are disclosed herein. The methods described herein provide an ability to control and monitor pharmaceutical manufacturing processes (for example, tablet press systems and powder blending systems) and can ensure data and product integrity and ultimately minimize overall manufacturing cost.

Abstract: An advanced process control (APC) system, an APC method, and a computer program product, which, when executed, performs an APC method are provided for incorporating virtual metrology (VM) into APC. The present inventions uses a reliance index (RI) and a global similarity index (GSI) to adjust at least one controller gain of a run-to-run (R2R) controller when the VM value of a workpiece is adopted to replace the actual measurement value of the workpiece. The RI is used for gauging the reliability of the VM value, and the GSI is used for assessing the degree of similarity between the set of process data for generating the VM value and all the sets of historical process data used for building the conjecturing model.

Abstract: Some embodiments of the invention provide a method for verifying an integrated circuit (IC) design. The method receives a process description file that specifies a process technology for building the IC. The process description file describes a particular device type in which a first conductor overlaps a second conductor by recessing from the second conductor in one or more cut-outs. Based on the process description file, the method finds a section of the IC design that matches the particular device type and uses the description of the particular device type to compute a capacitance value and a resistance value for the section of the IC design.

Abstract: The present invention provides a drawing apparatus including a generation device configured to generate drawing data, a blanking device configured to blank a beam, and a blanking controller includes a first storage device, a second storage device, and a third storage device configured to respectively store the drawing data generated by the generation device, and being configured to control operations of the first storage device, the second storage device, and the third storage device so that an operation of storing the drawing data generated by the generation device in a selected one of the first storage device and the second storage device, and an operation of reading out the drawing data stored in the other of the first storage device and the second storage device, and storing the readout drawing data in the third storage device are executed in parallel.

Abstract: A method to enable wafer result prediction includes collecting manufacturing data from various semiconductor manufacturing tools and metrology tools; choosing key parameters using an autokey method based on the manufacturing data; building a virtual metrology based on the key parameters; and predicting wafer results using the virtual metrology.

Abstract: A method, apparatus and a system, for provided for performing a dynamic weighting technique for performing fault detection. The method comprises processing a workpiece and performing a fault detection analysis relating to the processing of the workpiece. The method further comprises determining a relationship of a parameter relating to the fault detection analysis to a detected fault and adjusting a weighting associated with the parameter based upon the relationship of the parameter to the detected fault.

Abstract: A system includes a handheld tool for executing steps of a sequence within a work cell. An electromagnetic marker connected to the tool emits a magnetic field within the cell. A receptor detects the magnetic field and generates a raw position signal in response thereto. A control unit updates an assembly setting of the tool. The host executes a control action when a position determined using the raw data is not equal to an expected position in the sequence. A method calculates the present position of a torque wrench using magnetic fields generated by the marker and measured by a receptor array, and calculates a present position of the tool or a fastener. The present position of the fastener may be compared to an expected position in the calibrated sequence, and the torque wrench may be disabled when the fastener position is not equal to the expected position.

Abstract: A method for monitoring a production process with regard to quality is disclosed. The method includes: a) breaking down the production process into a sequence of individual steps, defined by a sequence of control commands for a production program for carrying out the production process on a machine tool; b) generating at least one signal template per individual step of the production process from the control commands for the individual steps, each signal template corresponding to a theoretical signal curve for a parameter which may be measured upon executing the production process; c) measurement of a signal curve for at least one parameter per individual step during the execution; and d) comparison of the or each measured signal curve with the respective arithmetically generated signal template, wherein a qualitatively poor production process is determined if the measured signal curve deviates from the signal template by more than a given tolerance.

Abstract: An industrial controller module (13a) is provided with a routine of program instructions (29a) for storing a log of I/O table state changes (31) in a defined portion of memory (23). Upon the occurrence of a trigger event, a file of the state changes (37) is saved in the memory (23). Each entry (32) in the log of I/O table state changes (31) includes a timestamp (33) and values of each word of I/O state data (36) that changed at a time of the timestamp. Logs of state change data (16a), including timestamp data can also be saved for intelligent sensors and actuators (16) and uploaded with the log of controller processor state data (31) to a computer (20) with a diagnostic program (21a) for playing back the state changes and synchronizing changes of the intelligent sensors and actuators (16) with changes of the controller processor module (13a).

Abstract: The present invention generally relates to a method for flexible process condition monitoring. In a process that utilizes RF power, the RF power may be applied at different levels during different points in the process. Software may be programmed to facilitate the monitoring of the different points in the process so that the acceptable deviation range of the RF power for each point in the process may be set to different values. For example, one phase of the process may permit a greater range of RF power deviation while a second phase may be much more particular and permit very little deviation. By programming software to permit each phase of the process to be uniquely monitored, a more precise RF process may be obtained.

Abstract: A method, system and computer program product for controlling a manufacturing process of an electronic circuit, the method includes: calculating at least one layer misalignment between layers of an electrical circuit that are expected to be mutually aligned; wherein the layers are manufactured by at least a direct imaging device that exposes a photo-resistive material to radiation to provide a pattern; selecting, in response to the at least one layer misalignment and in response to at least one allowable misalignment threshold, a selected response out of: manufacturing at least one additional layer of the electrical circuit; and stopping the manufacturing process of the electrical circuit; and participating in executing the selected response.

Abstract: A process monitoring system may detect out-of-control situations on the basis of a single criterion for a plurality of different lithography processes. To this end, each data set related to a specific type of lithography process may be processed so as to determine relative data, which may be centered around the same mean value for each of the different process types for a standard control situation.

Abstract: Methods of monitoring an acceptance criteria of pharmaceutical manufacturing processes are described and disclosed herein. Consequently, the methods provide a means to perform validation and quality control on an integrated level whereby a pharmaceutical manufacturer can ensure data and product integrity and minimize cost.

Abstract: A method for creating a photolithography mask from a set of initial mask cells arranged to form an initial mask. The set includes first and second initial mask cells having a mask element in common within an initial region of the initial mask. The method includes a creation of a first modified mask cell and of a second modified mask cell including OPC processing operations, a comparison of the position of the mask element in common between the first modified mask cell and the second modified mask cell, and if the result of the comparison is greater than a threshold, a creation of a new mask region including an optical proximity correction processing operation on the initial region, and a creation of the photolithography mask from the new mask region.

Abstract: A method for automatic process control (APC) performance monitoring may include, but is not limited to: computing one or more APC performance indicators for one or more production lots of semiconductor devices; and displaying a mapping of the one or more APC performance indicators to the one or more production lots of semiconductor devices.

Abstract: In a robotic scanning and processing system, at least one work station includes a pair of passing lanes along which workpieces are passable, a pair of scanners each for one of the passing lanes, and a robot arranged between the passing lanes and downstream of the scanners. The robot processes the workpieces, that have been scanned by the scanners, based on respective scan results provided by the scanners. Each of the scanners scans at least one workpiece on the respective passing lane, while the robot is processing another workpiece on the other passing lane based on the respective scan result outputted by the other scanner.

Abstract: The purpose of the present invention provides a disk transfer unit and inspection apparatus that can transfer a plurality of disks and increase throughput. The present invention includes: a supply/discharge/transfer portion fetching disks from a disk supply portion and discharging inspected disks to a predetermined place; an inspection unit transfer portion transferring the disks within an inspection unit; and a delivery/transfer portion transferring the disks between the disk supply/discharge/transfer portion and the inspection unit transfer portion. The delivery/transfer portion comprises: a base having a rotational center and is formed in an arc-like shape with center at the rotational center and providing with even numbers of disk mounting portions for mounting the disks and a driving portion for moving the base up and down and rotating the base about the rotational center, and transfers the disks between the supply/discharge/transfer portion and the inspection unit transfer portion.

Abstract: A method of detecting variance by regression model has the following steps. Step 1 is preparing the FDC data and WAT data for analysis. Step 2 is figuring out what latent variable effect of WAT data by Factor Analysis Step 3 is utilizing Principal Component Analysis to reduce the number of FDC variables to a few independent principal components. Step 4 is demonstrating how the tools and FDC data affect WAT data by Analysis of covariance model, and constructing interrelationship among FDC, WAT and tools. The interrelationship can point out which parameter effect WAT significantly. By the method, when WAT abnormal situation happened, it is easier for engineers to trace where the problem is.

Abstract: In nano-imprint lithography it is important to detect thickness non-uniformity of a residual layer formed on a substrate. Such non-uniformity is compensated such that a uniform residual layer may be formed. Compensation is performed by calculating a corrected fluid drop pattern.

Abstract: There is provided a production management system that requires no backup step for performing a backup operation when trouble occurs in a robot, and can increase workability of a repair operation of the robot. The production management system for a production line mixedly including robot operation steps and manual operation steps, including: a monitor that displays the cause of abnormality that occurs in the robot operation step; a warning device that warns of occurrence of abnormality in the robot operation step; and a robot reversing device that reverses the orientation of a robot when abnormality occurs in the robot, wherein production is continued by changing the robot operation step where the abnormality occurs to the manual operation step. Also, a repair operation is performed for the robot reversed by the robot reversing device.

Abstract: A system for reducing processing defects during processing of a semiconductor wafer prior to back-grinding the wafer includes a table having one or more holes formed therein, wherein the table comprises at least one of a chuck table or a support table, wherein the holes are perpendicular to the surface upon which a pre-back-grinding (PBG) process occurs. The system further includes one or more sensors disposed in said holes for monitoring a parameter during the PBG process. The system further includes a computer-implemented process control tool coupled with the one or more sensors and configured to determine whether the PBG process will continue.

Abstract: Provided is a substrate processing system, which comprises a plurality of substrate processing apparatuses configured to process a substrate; and a group management apparatus configured to connect and manage the plurality of substrate processing apparatuses, wherein the group management apparatus includes: a communication part configured to transmit and receive data to and from the plurality of substrate processing apparatuses; a first storage part configured to store the data transmitted through the communication part from the plurality of substrate processing apparatuses; a second storage part configured to store a file prescribing a condition for determining an abnormality of the plurality of substrate processing apparatuses from the data; a display part including a manipulation screen for inputting the condition for determining the abnormality using the data stored in the first storage part or the file stored in the second storage part; a screen control part configured to control the display part to chang

Abstract: A system, method and/or computer program product for analyzing a functionality of at least two manufactured products obtain a first characteristic of a first manufactured product. The system acquires a second characteristic of a second manufactured product. The system identifies a common feature between the first characteristic and the second characteristic. The system identifies a distinguishable feature between the first characteristic and the second characteristic. The system determines a cause of a deviation of a functionality in the first manufactured product or the second manufactured product or both manufactured products based on the identified common feature or the identified distinguishable feature or both features.

Abstract: Methods for optimizing conductor patterns for conductors formed by ECP and CMP processes. A method includes receiving layout data for an IC design where electrochemical plating (ECP) processes form patterned conductors in at least one metal layer over a semiconductor wafer; determining from the received layout data a global effects factor corresponding to a global pattern density; determining layout effects factors for unit grid areas corresponding to the pattern density of the at least one metal layer within the unit grid areas, determining local effects factors for each unit grid area; using a computing device, executing an ECP simulator using at least one of the global effects factor and the local effects factors, and using the layout effects factor; outputting an predicted post-ECP hump data map from the ECP simulator; and if indicated by a threshold comparison, modifying the layout data.