Grinding Patents (Class 700/164)
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Patent number: 11507051Abstract: A parameter indicating a surface property of an object surface is plotted on the horizontal axis, a normal direction change rate of the shape of the object surface is plotted on the vertical axis, the minimum normal direction change rate visible to a person is associated with the parameter indicating the surface property of the object surface to create a visible area map, the relationship between the parameter indicating the surface property of a machining surface of a workpiece, and the maximum value of the normal direction change rate of the shape of the machining surface of the workpiece is displayed on the visible area map, and the object surface is evaluated.Type: GrantFiled: February 5, 2018Date of Patent: November 22, 2022Assignee: MAKINO MILLING MACHINE CO., LTD.Inventors: Ryuta Sato, Takumi Nakanishi, Mitsunari Oda, Nobu Nakayama
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Patent number: 11480938Abstract: A control device is configured to control operation of a drive unit and monitor a rotational balance of a rotating body, for a machine tool including the rotating body that is rotatable around a predetermined axial center in a state of fixing a workpiece and on which an adjusting tool that can adjust the rotational balance is arrangeable, and the drive unit that rotates the rotating body, and the control device includes: a physical quantity acquiring unit configured to acquire at least one physical quantity indicating a rotational state of the rotating body, the physical quantity being changed in response to an adjustment of the rotational balance; a comparing unit configured to compare a plurality of physical quantities having different acquisition times; and an output unit configured to output a comparison result.Type: GrantFiled: November 24, 2020Date of Patent: October 25, 2022Assignee: FANUC CORPORATIONInventor: Yohei Arimatsu
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Patent number: 11279081Abstract: Disclosed is a technology being implemented in an apparatus for depositing multiple layers of a stream of swarf particles. The stream of swarf particles is generated by interfacing a cutting abrasive wheel on a workpiece. The generated stream of swarf particles may be directed towards a cavity of a die. Multiple layers of stream of swarf particles further results in a 3D printed object that takes the shape of the cavity of the die. The apparatus may also be used to coat substrates. Substrates may include but not limited to metal surfaces, polymers, and ceramics.Type: GrantFiled: August 14, 2019Date of Patent: March 22, 2022Inventors: Malkeet Singh, Harpreet Singh, Christopher Charles Berndt, Prabir Sarkar
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Patent number: 10748406Abstract: A machine condition monitoring system employing a haptic feedback device. The haptic feedback device can be employed to notify an operator of an acquisition of a machine parameter measurement. The haptic feedback device can be integrated into a control unit of a condition monitoring device and/or a remote condition monitoring status receiving device. The haptic feedback device containing notification apparatus can be worn by the operator, thus providing immediate notification without requiring the Operator's undivided attention. The notification apparatus can be worn on the operator's waist, wrist, upper arm, ankle, neck, etc. The notification apparatus can also be stored within a pocket of a garment worn by the operator.Type: GrantFiled: July 2, 2015Date of Patent: August 18, 2020Assignee: Aktiebolaget SKFInventor: Johannes I. Boerhout
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Patent number: 10743732Abstract: A system, method, and a physical figure for presenting user progress in a virtual space are disclosed. The presented user progress may indicate user advancements in the virtual space and/or user development in the real-world. Based on information indicating such user progress, character representation may be determined to reflect the user progress for presentation on the physical figure. In some implementations, specific location(s) on the physical figure may be determined for presenting specific aspect(s) of user progress in the virtual space. The physical figure may receive the determined character representation information and present the character represent on one or more screens thereon.Type: GrantFiled: January 7, 2019Date of Patent: August 18, 2020Assignee: INTELLIFECT INCORPORATEDInventors: John Lundin, Daniel Westfall
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Patent number: 10564621Abstract: A control system of a machine tool includes an analysis device, the analysis device includes acquisition portions which acquire chronological speed control data when a work is machined and which acquire spatial machined surface measurement data after the machining of the work, a data-associating processing portion which associates the speed control data and the machined surface measurement data with each other, a machined surface failure detection portion which detects a failure depth of a failure location on the machined surface of the work and an identification portion which identifies the control data of the failure location corresponding to the machined surface measurement data of the failure location so as to identify a failure depth corresponding to the control data of the failure location and the numerical control device corrects the control data based on the control data of the failure location and the corresponding failure depth.Type: GrantFiled: April 13, 2018Date of Patent: February 18, 2020Assignee: FANUC CORPORATIONInventors: Satoshi Ikai, Shoutarou Hashimoto
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Patent number: 10427266Abstract: A processor receives measurement data from a measurement device (MD) connected to an electrical shop tool (EST). The MD can sample electrical signals of a circuit connected to a sensor, such as a current transformer, and provide measurement data based on sampled signals. The measurement data can represent use or non-use of the EST. An EST, such as a vehicle lift or wheel balancer, can comprise an electrical motor connected to the electrical circuit. An EST, such as an air compressor, can comprise an electrical pump connected to the electrical circuit. The processor can determine an actionable condition based on a single measurement value or an aggregate of measurement values and determine a notification to send to a destination regarding the actionable condition. The actionable condition can be based on a rule regarding a person's preferences and attributes. The destination can be a user account, a smartphone, or another destination.Type: GrantFiled: July 28, 2017Date of Patent: October 1, 2019Assignee: Snap-on IncorporatedInventors: Christopher L. Greenwald, Jeffrey P. Hastings
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Patent number: 10176544Abstract: A system, method, and a physical figure for presenting user progress in a virtual space are disclosed. The presented user progress may indicate user advancements in the virtual space and/or user development in the real-world. Based on information indicating such user progress, character representation may be determined to reflect the user progress for presentation on the physical figure. In some implementations, specific location(s) on the physical figure may be determined for presenting specific aspect(s) of user progress in the virtual space. The physical figure may receive the determined character representation information and present the character represent on one or more screens thereon.Type: GrantFiled: November 28, 2017Date of Patent: January 8, 2019Assignee: Intellifect IncorporatedInventors: John A. Lundin, Daniel A. Westfall
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Patent number: 10150199Abstract: The invention relates to a method for controlling an automated orbital sander, in which method an electrically powered orbital sander is moved around automatically, at constant pressure, over the surface of an object, along at least one predefined sanding path so as to perform sanding, characterized in that the instantaneous power consumed by the sander along the sanding path is measured and in that the measurement thus taken is processed in order to deduce therefrom information regarding the level of abrasion along said path and/or to detect any sanding incident that has occurred along the latter.Type: GrantFiled: March 11, 2015Date of Patent: December 11, 2018Assignees: Universite De Nantes, Centre National de la Recherche Scientifique (CNRS)Inventors: Samuel Bonnet, Benoît Furet, Sébastien Garnier, Raphaël Poiree
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Patent number: 9993887Abstract: The present disclosure relates to a method and to an apparatus for chamfering and deburring gear cut workpieces, especially of large-volume gear cut workpieces, using a deburring apparatus which is arranged on or at the cutting head of a gear cutting machine and which at least partially utilizes the machine axes of the gear cutting machine to chamfer and to deburr gear teeth along a tooth contour.Type: GrantFiled: September 21, 2015Date of Patent: June 12, 2018Assignee: Liebherr-Verzahntechnik GmbHInventor: Thomas Zeller
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Publication number: 20150147941Abstract: The present invention discloses a method for producing a golf club head with an ultra-thin crown, relating to a method for processing a golf club head. A grinding rotor, with an abrasive (2) on the surface, is placed in a to-be-grinded area inside a cavity of the golf club head (1). The outside of the golf club head (1) is provided with a rotary working shaft (6) of high-speed rotation, one end of which corresponding to the grinding rotor is provided with driving magnets (4). The driving magnets of the rotary working shaft (6) are driven by a driving device to make the grinding rotor rotate synchronously so that the grinding rotor that is rotating performs multi-point thinning and grinding to the cavity within the to-be-grinded area of the golf club head (1). The present invention, with advantages of uniform thinning of a golf club head and automation control, is applicable to mass industrial production.Type: ApplicationFiled: January 23, 2014Publication date: May 28, 2015Applicant: LUOYANG SUNRUI PRECISION CASTING CO., LTDInventors: Zhiqiang CHEN, Hongqiang ZHOU, Shujuan BAO, Changhao FU
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Publication number: 20150148937Abstract: An arrangement includes a grinding wheel and a hand-held power tool. The hand-held power tool comprises a housing, a drive shaft, a drive unit configured to drive the drive shaft, a first handle and a second handle which are each fixed on the housing, a sensor, and an evaluation and control device. The sensor is configured to record at least one property information of the grinding wheel so as to determine a diameter of the grinding wheel. The evaluation and control device is configured to generate a setpoint value for a rotational speed based on the at least one property information of the grinding wheel recorded.Type: ApplicationFiled: November 28, 2014Publication date: May 28, 2015Inventor: MIKE WOLF
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Patent number: 8989890Abstract: In polishing a substrate having a layer of GST disposed over an underlying layer, during polishing, a non-polarized light beam is directed onto the layer of GST. The non-polarized light beam reflects from the first substrate to generate a reflected light beam having an infra-red component. A sequence of measurements of intensity of the infra-red component of the reflected light beam are generated, and, in a processor, a time at which the sequence of measurements exhibits a predefined feature is determined.Type: GrantFiled: January 29, 2010Date of Patent: March 24, 2015Assignee: Applied Materials, Inc.Inventors: Kun Xu, Feng Liu, Dominic J. Benvegnu, Boguslaw A. Swedek, Yuchun Wang, Wen-Chiang Tu, Laksh Karuppiah
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Patent number: 8988033Abstract: A machine tool includes a main axis 30 to which a touch probe 17 is attached, a motor 15 that rotationally drives the main axis 30, a rotation angle position detector 16 that detects a rotation angle position of the motor 15, and a control device 20. The control device, when a measurement mode command for performing measurement of a workpiece by the touch probe 17 is input, multiplies a d-axis current command value Idc by a d-axis current correction coefficient K that is less than 1 to reduce the d-axis current command value Idc to a d-axis current command correction value Idc?, using a d-axis current command correction section 4. Thus, in the machine tool, small rotation vibrations of the main axis, generated when rotating the main axis to which the probe is attached and performing measurements of a workpiece, can be suppressed to thereby increase the measurement accuracy.Type: GrantFiled: October 18, 2012Date of Patent: March 24, 2015Assignee: OKUMA CorporationInventors: Tomohiro Shibata, Tomohisa Kameyama
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Patent number: 8977379Abstract: In one aspect, a method of polishing includes polishing a substrate, and receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing. The method includes measuring a sequence of spectra of light reflected from the substrate while the substrate is being polished, where at least some of the spectra of the sequence differ due to material being removed during the polishing. The method of polishing includes determining a value of a characteristic of the selected spectral feature for each of the spectra in the sequence of spectra to generate a sequence of values for the characteristic, fitting a function to the sequence of values, and determining either a polishing endpoint or an adjustment for a polishing rate based on the function.Type: GrantFiled: November 2, 2010Date of Patent: March 10, 2015Assignee: Applied Materials, Inc.Inventors: Jeffrey Drue David, Harry Q. Lee, Dominic J. Benvegnu, Boguslaw A. Swedek
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Patent number: 8965555Abstract: A method dresses a polishing member with a diamond dresser having diamond particles arranged on a surface thereof. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the determined dressing conditions. The simulation includes calculating the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member.Type: GrantFiled: January 8, 2014Date of Patent: February 24, 2015Assignee: Ebara CorporationInventors: Akira Fukuda, Yoshihiro Mochizuki, Yutaka Wada, Yoichi Shiokawa, Hirokuni Hiyama
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Patent number: 8930013Abstract: A method of controlling polishing includes polishing a substrate having a second layer overlying a first layer, detecting exposure of the first layer with an in-situ monitoring system, receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing, measuring a sequence of spectra of light from the substrate while the substrate is being polished, determining a first value for the characteristic of the feature at the time that the first in-situ monitoring technique detects exposure of the first layer, adding an offset to the first value to generate a second value, and monitoring the characteristic of the feature and halting polishing when the characteristic of the feature is determined to reach the second value.Type: GrantFiled: April 20, 2011Date of Patent: January 6, 2015Assignee: Applied Materials, Inc.Inventors: Jeffrey Drue David, Harry Q. Lee, Thian Choi Lim, Gary Ka Ho Lam
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Publication number: 20150005923Abstract: A deburring device includes a deburring tool for removing burrs from an object, a robot for moving an object or the tool, a force sensor for detecting force acting on the tool, and a visual sensor for detecting a position of a burr portion of the object. According to the deburring device, information regarding shape data of the burr portion and a posture of the tool is obtained beforehand based on three-dimensional data of the object. Based on the shape data and the posture of the tool, a robot program is created. In accordance with an actual burr portion detected by the visual sensor, the robot program is replaced as necessary. During the deburring, the robot is controlled according to the force control by using a detected value from the force sensor.Type: ApplicationFiled: June 25, 2014Publication date: January 1, 2015Applicant: FANUC CORPORATIONInventor: Yihua Gu
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Patent number: 8892238Abstract: A method and an apparatus for shaping an edge at a juncture of two adjoining surfaces of a part. A first surface and a second surface of the part are abraded by contacting a polishing surface of a polishing wheel to the first surface and to the second surface. The polishing surface spins in opposite rotational directions about an axis parallel to the edge when contacting the first and second surfaces respectively. The polishing surface moves at different translational speeds and the polishing wheel spins at different rotational speeds along straight segments and along curved segments of the edge. The shaped edge has a visually smooth and geometrically uniform appearance.Type: GrantFiled: January 26, 2010Date of Patent: November 18, 2014Inventors: Edward T. Sweet, Roberto Ortega, Andrew Davidson, Simon Lancaster, Thomas Johannessen
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Patent number: 8892235Abstract: A method and system for producing a dental implant surgical guide is disclosed. A patient-specific virtual model is generated using image data specific to a patient and virtual dental implants. The virtual model aligns the image data with the virtual dental implants using modeling software. A virtual mold is generated from the virtual model, and a physical mold is generated from the virtual mold. The physical mold is covered with a thermoplastic sheet via a thermoforming process. Excess thermoplastic material is trimmed off after the thermoforming process to produce a thermoformed piece. Metal tubes corresponding to each the virtual dental implants are placed onto the physical mold denoting the position, trajectory, and depth of the one or more virtual dental implants. A dental implant surgical guide that contains the thermoformed piece with the one or more tubes is produced.Type: GrantFiled: December 5, 2011Date of Patent: November 18, 2014Assignee: Anatomage Inc.Inventors: Woncheol Choi, Jia Leung Jeff Mar
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Patent number: 8874250Abstract: Methods, systems, and apparatus for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, measuring a sequence of spectra in-situ during polishing to obtain measured spectra, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, fitting a linear function to the sequence of index values, and halting the polishing either when the linear function matches or exceeds a target index or when the associated index value from the determining step matches or exceeds the target index.Type: GrantFiled: October 4, 2013Date of Patent: October 28, 2014Assignee: Applied Materials, Inc.Inventors: Jeffrey Drue David, Dominic J. Benvegnu, Harry Q. Lee, Boguslaw A. Swedek, Lakshmanan Karuppiah
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Patent number: 8831767Abstract: Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a measurement device during polishing of a specimen to generate output signals at measurement spots on the specimen. The method also includes determining if the output signals are outside of a range of output signals. Output signals outside of the range may indicate that a parameter of the measurement device is out of control limits. In a different embodiment, output signals outside of the range may indicate damage to the specimen. Another method includes scanning a polishing pad with a measurement device to generate output signals at measurement spots on the polishing pad. The method also includes determining a characteristic of the polishing pad from the output signals.Type: GrantFiled: August 27, 2011Date of Patent: September 9, 2014Assignee: KLA-Tencor Technologies Corp.Inventors: Kurt Lehman, Charles Chen, Ronald L. Allen, Robert Shinagawa, Anantha Sethuraman, Christopher F. Bevis, Thanassis Trikas, Haiguang Chen, Ching Ling Meng
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Publication number: 20140222188Abstract: A difference between a first expected required polish time for a first substrate and a second expected required polish time for a second substrate is determined using a first pre-polish thickness and a second pre-polish thickness measured at an in-line metrology station. A duration of an initial period is determined based on the difference between the first expected required polish time and the second expected required polish time. For the initial period at a beginning of a polishing operation, no pressure is applied to whichever of the first substrate and the second substrate has a lesser expected required polish time while simultaneously pressure is applied to whichever of the first substrate and the second substrate has a greater expected required polish time. After the initial period, pressure is applied to both the first substrate and the second substrate.Type: ApplicationFiled: April 7, 2014Publication date: August 7, 2014Applicant: Applied Materials, Inc.Inventors: Alain Duboust, Wen-Chiang Tu, Shih-Haur Shen, Jimin Zhang, Ingemar Carlsson, Boguslaw A. Swedek, Zhihong Wang, Stephen Jew, David H. Mai, Huyen Tran
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Patent number: 8774958Abstract: Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored.Type: GrantFiled: April 29, 2011Date of Patent: July 8, 2014Assignee: Applied Materials, Inc.Inventors: Huanbo Zhang, Garrett Ho Yee Sin, King Yi Heung, Nathan Bohannon, Qing Zhang
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Patent number: 8755928Abstract: A computer-implemented method of generating reference spectra includes polishing a plurality of set-up substrates, the plurality of set-up substrates comprising at least three set-up substrates, measuring a sequence of spectra from each of the plurality of set-up substrates during polishing with an in-situ optical monitoring system to provide a plurality of sequences of spectra, generating a plurality of sequences of potential reference spectra from the plurality of sequences of spectra, determining which sequence of potential reference spectra of the plurality of sequences provides a best match to remaining sequences of the plurality of sequences, and storing the sequence of potential reference spectra determined to provide the best match as reference spectra, and selecting and storing the sequence of potential reference spectra.Type: GrantFiled: April 27, 2011Date of Patent: June 17, 2014Assignee: Applied Materials, Inc.Inventors: Jimin Zhang, Harry Q. Lee, Zhihong Wang, Jeffrey Drue David, Boguslaw A. Swedek, Dominic J. Benvegnu
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Patent number: 8751033Abstract: A method of controlling polishing includes polishing a substrate, monitoring a substrate during polishing with an in-situ monitoring system, generating a sequence of values from measurements from the in-situ monitoring system, fitting a non-linear function to the sequence of values, determining a projected time at which the non-linear function reaches a target value; and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the projected time.Type: GrantFiled: April 20, 2011Date of Patent: June 10, 2014Assignee: Applied Materials, Inc.Inventors: Jeffrey Drue David, Dominic J. Benvegnu, Boguslaw A. Swedek, Harry Q. Lee
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Patent number: 8747189Abstract: A method of controlling polishing includes polishing a substrate of a non-metallic layer undergoing polishing and a metal layer underlying the non-metallic layer; storing a metal reference spectrum, the metal reference spectrum being a spectrum of light reflected from a same metal material as the metal layer; measuring a sequence of raw spectra of light reflected from the substrate during polishing with an in-situ optical monitoring system; normalizing each raw spectrum in the sequence of spectra to generate a sequence of normalized spectra, of which normalizing includes a division operation where the measured spectrum is in the numerator and the metal reference spectrum is in the denominator; and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least one normalized predetermined spectrum from the sequence of normalized spectra.Type: GrantFiled: April 26, 2011Date of Patent: June 10, 2014Assignee: Applied Materials, Inc.Inventor: Jeffrey Drue David
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Patent number: 8747188Abstract: A method and an apparatus for smart automation of robotic surface finishing of a three-dimensional surface of a work piece is described. A three-dimensional motion path is created along the surface of the work piece. A variable contact force profile is specified along the three-dimensional motion path. The three-dimensional motion path is modified based on the specified variable contact force profile. The surface of the work piece is finished using one or more surface finishing tools along the modified three-dimensional motion path. The surface of the work piece includes at least a flat region and a curved region.Type: GrantFiled: November 11, 2011Date of Patent: June 10, 2014Assignee: Apple Inc.Inventors: Max A. Maloney, Howard E. Bujtor, Brian K. Miehm
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Patent number: 8718810Abstract: While a substrate is polished, it is also irradiated with light from a light source. A current spectrum of the light reflected from the surface of the substrate is measured. A selected peak, having a first parameter value, is identified in the current spectrum. A value of a second parameter associated with the first parameter is determined from a lookup table using a processor. Depending on the value of the second parameter, the polishing of the substrate is changed. An initial spectrum of light reflected from the substrate before the polishing of the substrate can be measured and a wavelength corresponding to a selected peak of the initial spectrum can be determined.Type: GrantFiled: November 1, 2012Date of Patent: May 6, 2014Assignee: Applied Materials, Inc.Inventors: Dominic J. Benvegnu, Boguslaw A. Swedek, Jeffrey Drue David, Harry Q. Lee
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Patent number: 8712575Abstract: Systems and methods are disclosed for modulating the hydrostatic pressure in a double side wafer grinder having a pair of grinding wheels. The systems and methods use a processor to measure the amount of electrical current drawn by the grinding wheels. Pattern detection software is used to predict a grinding stage based on the measured electrical current. The hydrostatic pressure is changed by flow control valves at each stage to change the clamping pressure applied to the wafer and to thereby improve nanotopology in the processed wafer.Type: GrantFiled: March 16, 2011Date of Patent: April 29, 2014Assignee: MEMC Electronic Materials, Inc.Inventors: Sumeet S. Bhagavat, Roland R. Vandamme, Tomomi Komura
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Patent number: 8706287Abstract: The invention related to a control system for a mill, particularly a roller grinding mill, comprising a mill control device (11), which is designed to control at least one mill characteristic on the basis of an associated target variable, and a fuzzy-control device (13), which is connected to the mill control device (11) and designed to adjust the target variable of the at least one mill characteristic to be controlled when at least one operating parameter of the mill deviates from a predefined normal range as a function of fuzzy rules that are based on said at least one operating parameter of the mill until the at least one operating parameter of the mill has reached the predefined normal range again. A solution is to be provided, which enables automated optimized mill operation even with changing operating conditions, particularly a mill operation that prevents the “mill rumbling”.Type: GrantFiled: December 6, 2008Date of Patent: April 22, 2014Assignee: Steag Energy Services GmbHInventors: Dietmar Gocht, Werner Bischoff, Thomas Krause, Alfred Gwosdz
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Patent number: 8694144Abstract: A difference between a first expected required polish time for a first substrate and a second expected required polish time for a second substrate is determined using a first pre-polish thickness and a second pre-polish thickness measured at an in-line metrology station. A duration of an initial period is determined based on the difference between the first expected required polish time and the second expected required polish time. For the initial period at a beginning of a polishing operation, no pressure is applied to whichever of the first substrate and the second substrate has a lesser expected required polish time while simultaneously pressure is applied to whichever of the first substrate and the second substrate has a greater expected required polish time. After the initial period, pressure is applied to both the first substrate and the second substrate.Type: GrantFiled: August 30, 2010Date of Patent: April 8, 2014Assignee: Applied Materials, Inc.Inventors: Alain Duboust, Stephen Jew, David H. Mai, Huyen Tran, Wen-Chiang Tu, Shih-Haur Shen, Jimin Zhang, Ingemar Carlsson, Boguslaw A. Swedek, Zhihong Wang
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Patent number: 8694145Abstract: A method of controlling surface non-uniformity of a wafer in a polishing operation includes (a) providing a model for a wafer polishing that defines a plurality of regions on a wafer and identifies a wafer material removal rate in a polishing step of a polishing process for each of the regions, wherein the polishing process comprises a plurality of polishing steps, (b) polishing a wafer using a first polishing recipe based upon an incoming wafer thickness profile, (c) determining a wafer thickness profile for the post-polished wafer of step (b), and (d) calculating an updated polishing recipe based upon the wafer thickness profile of step (c) and the model of step (a) to maintain a target wafer thickness profile. The model can information about the tool state to improve the model quality. The method can be used to provide feedback to a plurality of platen stations.Type: GrantFiled: November 8, 2011Date of Patent: April 8, 2014Assignee: Applied Materials, Inc.Inventors: Arulkumar P. Shanmugasundram, Alexander T. Schwarm, Gopalakrishna B. Prabhu
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Patent number: 8682463Abstract: A denture grinding machine includes: a denture-holding table for holding dentures; a grinding tool for grinding the dentures held on the denture-holding table; a main body for holding the grinding tool; a moving mechanism for causing relative movement between the denture-holding table and the main body; and a driving mechanism for relatively driving the main body and the denture-holding table. The moving mechanism moves relatively the denture-holding table and the main body in three-dimensional coordinate directions based on grinding portion data, and the grinding tool performs grinding of the denture occlusal surface from a direction perpendicular to the occlusal surface.Type: GrantFiled: June 24, 2011Date of Patent: March 25, 2014Assignee: Kabushiki Kaisha ShofuInventors: Takeshi Moriyama, Yusei Kadobayashi
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Patent number: 8660684Abstract: A method of determining a desired power level (P) as a function of relative tool to workpiece position, thereby enabling adaptive control advantages that were previously inaccessible for machining, such as bevel gear grinding, from solid applications. Preferably, set point power is expressed as a function of specific power (P?, P?) and roll position (Q) for a generated gear or as a function of specific power and plunge position for a non-generated (i.e. Formate) gear. Specific power is defined and preferably remains as defined during machining even as process conditions vary during machining.Type: GrantFiled: June 6, 2011Date of Patent: February 25, 2014Assignee: The Gleason WorksInventors: Eric G. Mundt, Richard F. Culbert, Jr.
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Patent number: 8655478Abstract: A method dresses a polishing member with a diamond dresser having diamond particles arranged on a surface thereof. The method includes determining dressing conditions by performing a simulation of a distribution of a sliding distance of the diamond dresser on a surface of the polishing member, and dressing the polishing member with the diamond dresser under the determined dressing conditions. The simulation includes calculating the sliding distance corrected in accordance with a depth of the diamond particles thrusting into the polishing member.Type: GrantFiled: September 24, 2009Date of Patent: February 18, 2014Assignee: Ebara CorporationInventors: Akira Fukuda, Yoshihiro Mochizuki, Yutaka Wada, Yoichi Shiokawa, Hirokuni Hiyama
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Patent number: 8644978Abstract: A machining apparatus and method for fabricating endodontic instruments adapted for use in performing root canal procedures is disclosed. The machining apparatus includes computer numerical control (CNC) machining that automates much of the fabrication process. The disclosed machining apparatus and method is programmable to efficiently produce varying configurations of endodontic instruments on the same machining apparatus.Type: GrantFiled: January 20, 2011Date of Patent: February 4, 2014Assignee: D & S Dental, LLCInventors: Derek E. Heath, Brian J. Little, Steve A. Treadway
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Patent number: 8639377Abstract: Methods of determining thickness and phase of a GST layer on a semiconductor substrate are described using intensity spectra within the infra-red range. In particular, techniques for using certain transmission at certain frequencies are disclosed for faster thickness and phase determination in an in-line or standalone metrology/monitoring system for CMP processes.Type: GrantFiled: November 7, 2008Date of Patent: January 28, 2014Assignee: Applied Materials, Inc.Inventors: Kun Xu, Feng Q Liu, Yuchun Wang, Abraham Ravid, Wen-Chiang Tu
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Patent number: 8615317Abstract: A process and an apparatus for generating control data for controlling a tool on a machine tool comprising at least 5 axes for the production of a predetermined finished part having a base body and at least one flank section protruding from the base body, finished part geometry data of the predetermined finished part geometry of the finished part being generated by means of fundamental geometry parameters and path data being generated by means of the finished part geometry data, the path data indicating the tool path along the surface of the flank section over which the tool has to travel with what tool orientation relative to the workpiece to remove material from the workpiece, the tool orientation of the tool corresponding to an orientation of a axis of rotation of the tool and the tool rotating about the axis of rotation of the tool to remove material from the workpiece.Type: GrantFiled: February 9, 2010Date of Patent: December 24, 2013Assignee: Deckel Maho Pfronten GmbHInventors: Josef Neumaier, Thomas Lochbihler
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Publication number: 20130288572Abstract: A method of controlling polishing includes polishing a substrate, during polishing monitoring the substrate with an in-situ monitoring system, the monitoring including generating a signal from a sensor, and filtering the signal to generate a filtered signal. The signal includes a sequence of measured values, and the filtered signal including a sequence of adjusted values. The filtering includes for each adjusted value in the sequence of adjusted values, generating at least one predicted value from the sequence of measured values using linear prediction, and calculating the adjusted value from the sequence of measured values and the predicted value. At least one of a polishing endpoint or an adjustment for a polishing rate is determined from the filtered signal.Type: ApplicationFiled: April 26, 2012Publication date: October 31, 2013Applicant: Applied Materials, Inc.Inventor: Dominic J. Benvegnu
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Patent number: 8569174Abstract: Methods of determining a polishing endpoint are described using spectra obtained during a polishing sequence. In particular, techniques for using only desired spectra, faster searching methods and more robust rate determination methods are described.Type: GrantFiled: February 22, 2008Date of Patent: October 29, 2013Assignee: Applied Materials, Inc.Inventors: Harry Q. Lee, Boguslaw A. Swedek, Dominic J. Benvegnu, Jeffrey Drue David
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Patent number: 8560111Abstract: A method for uniformly planarizing a wafer that includes determining a first wafer warped value at a first zone on the wafer, determining a second wafer warped value at a second zone on the wafer, and calculating a pressure difference based on the first and second wafer warped values at the first and second zones is provided. The method also includes performing a chemical mechanical polishing of the wafer, applying a first pressure based on the first wafer warped value to the wafer at the first zone during the chemical mechanical polishing, and applying a second pressure based on the second wafer warped value to the wafer at the second zone during the chemical mechanical polishing, a difference between the first pressure and the second pressure based on the pressure difference.Type: GrantFiled: December 29, 2009Date of Patent: October 15, 2013Assignee: STMicroelectronics, Inc.Inventors: John H. Zhang, Walter Kleemeier, Ronald K. Sampson
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Patent number: 8554351Abstract: Methods, systems, and apparatus for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, measuring a sequence of spectra in-situ during polishing to obtain measured spectra, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, fitting a linear function to the sequence of index values, and halting the polishing either when the linear function matches or exceeds a target index or when the associated index value from the determining step matches or exceeds the target index.Type: GrantFiled: August 30, 2012Date of Patent: October 8, 2013Assignee: Applied Materials, Inc.Inventors: Jeffrey Drue David, Dominic J. Benvegnu, Harry Q. Lee, Boguslaw A. Swedek, Lakshmanan Karuppiah
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Patent number: 8540915Abstract: Molds and processes that permit high-speed, mass production of retaining wall blocks having patterned or other processed front faces, as well as retaining wall blocks formed by such processes. The invention permits the front face of the block to be impressed with a pattern or otherwise directly processed, to allow the formation of pre-determined block front faces, while at the same time facilitating high-speed, high-volume production of blocks. A mirror image of the desired pattern can be created on a stripper shoe by selecting a desired three-dimensional surface from a naturally occurring or man made object and digitally scanning the selected three-dimensional pattern to create scanned data. The scanned data can then be used to machine a face of the stripper shoe that is the mirror image of the selected pattern.Type: GrantFiled: January 27, 2012Date of Patent: September 24, 2013Assignee: Anchor Wall Systems, Inc.Inventor: Ronald J. Scherer
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Patent number: 8532809Abstract: A self-service, fully-automatic kiosk for duplicating keys includes a kiosk housing having a customer interface for receiving payment from a customer for the purchase of at least one duplicate of the customer's key. A key analysis system within the housing analyzes the blade of a key inserted in the key-receiving entry to determine whether the inserted key matches one of a group of preselected key types and, if so, which preselected key type is matched. A key blank extraction system extracts from a magazine within the kiosk a key blank for the preselected key type matched by the blade of the key inserted in the key-receiving entry. Then a key duplicating system within the kiosk replicates the tooth pattern of the blade of the key inserted in the key-receiving entry, on the blade of the extracted key blank.Type: GrantFiled: January 16, 2013Date of Patent: September 10, 2013Assignee: Minute Key Inc.Inventor: Daniel Freeman
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Patent number: 8527085Abstract: The present invention relates to a method for operating a gear grinding machine, with the following operating phases of the gear grinding machine: machining a workpiece on the gear grinding machine by means of a grinding disk and/or grinding worm and dressing a profiling tool for profiling a grinding disk and/or grinding worm on the gear grinding machine.Type: GrantFiled: February 20, 2009Date of Patent: September 3, 2013Assignee: Liebherr Verzahntechnik GmbHInventors: Thomas Breith, Manfred Zankl
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Patent number: 8506352Abstract: An eyeglass lens processing apparatus for processing a peripheral edge of an eyeglass lens, includes: a processing unit including a plurality of processing tools that process the peripheral edge of the eyeglass lens held by a lens chuck shaft; a calibrating lens; a mode selector that selects a calibration mode; a memory that stores calibration processing data for processing the calibrating lens to a predetermined shape; a detecting unit that includes a tracing stylus that contacts a surface of the calibrating lens which is processed by the processing unit based on the calibration processing data to detect the shape of the processed calibrating lens in the calibration mode; and a calculating unit that obtain calibration data by comparing a detected result by the detecting unit with the calibration processing data in the calibration mode.Type: GrantFiled: September 29, 2010Date of Patent: August 13, 2013Assignee: Nidek Co., Ltd.Inventors: Kyoji Takeichi, Ryoji Shibata, Motoshi Tanaka, Katsuhiro Natsume, Yuya Nakako
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Patent number: 8489222Abstract: A machine and a method for grinding a spacer grid of a nuclear fuel assembly. The machine includes a spacer grid holding unit, a first rectangular coordinates robot for grinding an outer surface of the spacer grid, a second rectangular coordinates robot for grinding a corner of the spacer grid, and a control unit. The spacer grid holding unit includes a holding jig onto which the spacer grid is seated and held, and a rotary index table which is coupled to the holding jig to rotate the holding jig. The first and second rectangular coordinates robots are provided at predetermined positions adjacent to the spacer grid holding unit. The control unit controls the spacer grid holding unit, the first and second rectangular coordinates robots and all programs required to conduct the operation for grinding the spacer grid.Type: GrantFiled: August 16, 2010Date of Patent: July 16, 2013Assignee: Korea Nuclear Fuel Co., Ltd.Inventors: Chang Kug Kim, Deuk Yeon Kim, Jung Hwan Hong, Hang Rae Kim, Cheol Ho Choi
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Publication number: 20130144422Abstract: A method and system for producing a dental implant surgical guide is disclosed. A patient-specific virtual model is generated using image data specific to a patient and virtual dental implants. The virtual model aligns the image data with the virtual dental implants using modeling software. A virtual mold is generated from the virtual model, and a physical mold is generated from the virtual mold. The physical mold is covered with a thermoplastic sheet via a thermoforming process. Excess thermoplastic material is trimmed off after the thermoforming process to produce a thermoformed piece. Metal tubes corresponding to each the virtual dental implants are placed onto the physical mold denoting the position, trajectory, and depth of the one or more virtual dental implants. A dental implant surgical guide that contains the thermoformed piece with the one or more tubes is produced.Type: ApplicationFiled: December 5, 2011Publication date: June 6, 2013Inventors: Woncheol Choi, Jia Leung Jeff Mar
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Patent number: 8452443Abstract: An industrial robot system including a workcell including a load area and a process area. A detector detects when a human enters the load area. A manipulator is located in the workcell. At least one positioner is adapted to hold a workpiece and to change the orientation of the workpiece about at least one axis while the manipulator processes the workpiece. A station exchanger is movable about an axis and adapted to move, upon command, the manipulator or the positioner between the load and process area. Each of the axes is provided with a motor and a drive unit. An axis controller is adapted to switch between executing a first task in which the axes of the positioner and the station exchanger are commanded to a standstill, and a second task in which the axes of the positioner and the station exchanger are allowed to move.Type: GrantFiled: October 1, 2007Date of Patent: May 28, 2013Assignee: ABB Research LtdInventors: Jan H. Karlsson, Antero Lassuri