Abstract: A method for designing and making an integrated circuit is described. That method utilizes statistical models of wire segments to accurately estimate the expected length of minimum-length, orthogonal wire segments within a block. From these estimates, the method accurately estimates an ratio between the horizontal and vertical routing resources required, termed the “H/V Demand Ratio.” From the H/V Demand Ratio, an accurate estimate of the height and width of the block may be determined. Thereafter, placement and routing may be performed quickly and accurately, thereby allowing the block to be designed and manufactured quickly and cost effectively. A method for designing an integrated circuit with efficient metal-1 resource utilization is also described.

Abstract: The invention discloses a power mesh management method utilized in an integrated IC. The integrated circuit includes a macro block including at least a macro block power supplying line growing along a first direction. The management method includes: defining a plurality of first power supplying lines located in a metal layer above the macro block, wherein each of the first supplying lines grows along the first direction; defining a plurality of second power supplying lines located in another metal layer above the macro block, wherein each of the second supplying lines grows along a second direction; defining a partial power supplying line from the plurality of first power supplying lines where the partial power supplying line overlaps the macro block power supplying line; and removing the partial power supplying line from the plurality of first power supplying lines.

Abstract: A method, system, and computer usable program product for multiple threshold voltage cell families (mVt families) based integrated circuit design are provided in the illustrative embodiments. The integrated circuit includes cells, and a cell includes an electronic component. A design process is initialized by using cells from the mVt families in the design. The cells from the mVt families are included in iterative manipulation of the design. The cells from the mVt families are further included in violation cleanup and subsequent steps of the design process. A version of the design is produced that is usable to implement the circuit with the cells from the mVt families.

Abstract: A system and several methods for inferring higher level descriptions of circuit connectivity from register transfer level (RTL) netlists in order to provide more understandable and manageable design descriptions for complex System-on-Chip (SOC) designs, is provided. In particular, interface matching based on connectivity propagation is automatically performed whereby port names and properties on instances of functional elements and blocks are propagated to top level design ports as well as other instances of functional elements and blocks to create a more robust description of connectivity according to the RTL netlist, and to automatically form signal groupings that comprise a higher-level abstracted description. Also, a facility is included to allow user-guided grouping of instantiated interfaces with respect to actual signal names and properties in an RTL-level design.

Abstract: A method for verifying power management of an integrated circuit design includes estimating a current load requirement of clocked modules in the circuit design based on the clock frequency and a predefined current load model. The voltage supplied to the circuit design is monitored. A first voltage regulator provides additional current drive to the circuit design when the supplied voltage drops below a threshold value of a full throttle run mode of the circuit design. A second voltage regulator is enabled to boost a response time of the first voltage regulator when the voltage drops below the threshold value.

Abstract: A digital circuit block includes first to fourth conducting segments, a digital logic, first and second conducting layers, and a dielectric layer. The first and second conducting segments are coupled to first and second supply voltages, respectively. The digital logic and dielectric layer are between the first and second conducting segments. The third conducting segment includes a first end electrically connected to the first conducting segment, a second end not electrically connected to the second conducting segment, and a first portion located at the first conducting layer. The fourth conducting segment includes a first end electrically connected to the second conducting segment, a second end not electrically connected to the first conducting segment, and a second portion located at the second conducting layer. The first and second portions and dielectric layer are formed a first capacitive element to reduce the supply voltage drop between the first and second supply voltages.

Abstract: Circuits, architectures, a system and methods for providing multiple power rails to a plurality of standard cells in a region of an integrated circuit. The circuitry generally includes a plurality of cells configured for connection to a first or second power rail, the first power rail providing a first voltage to at least one of the plurality of cells, and the second power rail providing a second voltage (which may be independent from the first voltage) to remaining cells in the plurality of cells. The method generally includes routing, in an IC layout, a first power rail providing a first voltage and a second power rail providing a second voltage, placing the plurality of cells, and selectively connecting first and second subsets of the plurality of cells to the first and second power rails, respectively. The present invention further advantageously minimizes regional layout design considerations and time delays.

Abstract: A power domain is automatically generated. A computer performs a function simulation process 9 for evaluating whether or not a designed circuit satisfies a specification, and a clustering process 10 which obtains a power domain by clustering logical blocks in which activation timings are within a range, based on the result of the function simulation process. Since the power domain is obtained by a process performed by the computer, the power domain can be optimized compared to a case when it is obtained by hand (manual work of the designer).

Abstract: It is an object of the invention to provide a thin, lightweight, high performance, and low in cost semiconductor device and a display device by reducing an arrangement area required for a power supply wiring and a ground wiring of a functional circuit and decreasing a drop in power supply voltage and a rise in ground voltage. In the functional circuit of the semiconductor device and the display device, a power supply wiring and a ground wiring are formed in a comb-like arrangement, and the tips thereof are electrically connected with a first wiring, a second wiring, and a contact between the first wiring and the second wiring, thereby forming in a grid-like arrangement. The drop in power supply voltage and the rise in ground voltage can be decreased and the arrangement area can be decreased in the grid-like arrangement.

Abstract: Systems and methods are disclosed to automatically method to manage power in a custom integrated circuit (IC) design with a code profile by receiving an instruction execution sequence based on the code profile and reassigning or delaying the instruction sequence to spread operations or activities over a plurality of processing blocks to reduce hot spots; applying sub-region weight distributions to estimate power hot-spot locations; and synthesizing the generated architecture into a computer readable description of the custom integrated circuit for semiconductor fabrication.

Abstract: A computer-readable software product is provided for executing a method of determining the location of a plurality of power rail vias in a semiconductor device. The semiconductor device includes an active region and a power rail. Locations of a first via and a second via are assigned along the power rail. The spacing between the location of the first via and the location of the second via is a minimum spacing allowable. The spacing between the location of the second via and the locations of structures in the active region which may electrically interfere with the second via is determined. The location of the second via is changed in response to the spacing between the location of the second via and the location of one of the structures in the active region being less than a predetermined distance.

Abstract: In a particular embodiment, a method is disclosed that includes automatically adding a first power line in a channel between at least two macros when less than two system power supply lines with opposite polarities are detected within the channel.

Abstract: Systems and methods are disclosed to automatically synthesize a custom integrated circuit by automatically generating an application specific instruction set processor architecture uniquely customized to the computer readable code with a compiler-in-the-loop to compile, assemble and link code for each processor architecture iteration, the processor architecture having one or more processing blocks on the IC executing one or more instructions; and synthesizing the generated architecture into a computer readable description of the custom integrated circuit for semiconductor fabrication.

Abstract: In an embodiment, the design flow is modified to avoid the flattening process but still accurately annotate the transistors with stress parameters. The location-based stress parameters may be generated, but may not be provided to the LVS tool. Instead, a hierarchical LVS process may be performed, black-boxing lower level blocks that already have stress parameter assignments, preserving hierarchy, etc. The output database from LVS thus includes a cross reference between layout devices and schematic devices, as well as locations of the schematic devices. The database may then be queried for the transistors in the non-flattened design, and the stress parameters may be assigned to the transistors based on the location-based stress parameters. In this fashion the stress parameters may be assigned to the desired transistors, permitting annotation of these parameters into the schematics, without flattening the design and doing unnecessary work on blocks to be skipped.

Abstract: An integrated circuit structure includes a chip including a substrate and a power distribution network. The power distribution network includes a plurality of power through-silicon vias (TSVs) penetrating the substrate, wherein the plurality of power TSVs forms a grid; and a plurality of metal lines in a bottom metallization layer (M1), wherein the plurality of metal lines couples the plurality of power TSVs to integrated circuit devices on the substrate.

Abstract: A method for implementing a single file format for power-related information for an IC comprising: providing a circuit design in at least one design file in a non-transitory computer readable storage device; providing power-related design information in a file in the computer readable storage device that is separate from the at least one design file and that specifies multiple power domains within the circuit design, each power domain including one or more design object instances from within the circuit design and that specifies multiple power modes each power mode corresponding to a different combination of on/off states of the multiple specified power domains and that specifies isolation behavior relative to respective power domains; and using a computer to add power control circuitry to the circuit design that implements the power domains and power modes and isolation behavior specified in the power specification information.

Abstract: A system and method are provided for reducing signal skew. The method includes receiving a netlist having components and connections among the components. Each connection has at least one signal wire. A plurality of net groups is identified, each net group including at least some of the connections and for which equivalent routing is desired. For each net group, the method includes systematically routing connection paths between the components for the connections, each connection path extending between an output of one of the components and an input to at least one other of the components and including at least one path fragment. Routing includes, for at least one of the connections of the net group, routing at least one grounded shielding wire in a routing channel adjacent and parallel to at least one of the path fragments of the connection path.

Abstract: A transaction level (TL) system power estimation method and system are provided. The method includes inserting at least a characteristic extractor into an electronic device of a target system. The characteristic extractor extracts at least a power characteristic of the electronic device when a TL simulation is proceeding. The power characteristic provided from the characteristic extractor is converted to at least a power consumption value by using a power model. The power consumption value is recorded into a power database, for analyzing power consumption of the whole target system. In some embodiments, the TL system power estimation method and system can be applied in the target system with dynamic power management. The TL system power estimation method and system also can be used with a high-level synthesizer to develop the power-aware electronic device in a short time.

Abstract: Some aspects of this disclosure provide for electronic design automation (EDA) techniques that check whether individual blocks, such as transistors or other semiconductor devices, are connected to their correct power domains during design. In this way, the disclosed EDA techniques can limit or prevent overstress conditions applied to blocks and help to improve reliability of integrated circuits, when manufactured.

Abstract: A power supply wiring design support method of an embodiment includes: receiving input of information about multiple elements formed on a semiconductor chip and circuit information about the semiconductor chip; calculating a voltage drop of power supply voltage in each of areas into which the semiconductor chip is virtually divided based on a grid indicated by XY coordinates; and calculating a voltage drop gradient from the voltage drop of the area and voltage drops of adjacent areas.

Abstract: A semiconductor device includes: first and second circuit cell arrays extending in first direction; first and second power supply lines each extending in first direction and arranged over first circuit cell array, first power supply line being supplied with first power source voltage; third power supply line extending in first direction separately from second power supply line, arranged over second circuit cell array, and supplied with second power source voltage; first transistor coupled between second and third power supply lines; and first circuit arranged on first circuit cell array and operating on first and second power source voltages supplied from first and second power supply lines, respectively.

Abstract: The present disclosure relates to an electromigration tolerant power distribution network generated by an automatic place and route (APR) methodology. In some embodiments, an automatic place and route tool constructs a local power network having multi-level power rails. The multi-level power rails have interleaved segments of vertically adjacent metal layers, wherein each interleaved segment is shorter than a predetermined characteristic length corresponding to a Blech length. By limiting the length of the interleaved metallization segments, electromigration within the multi-level power rails is alleviated, allowing for the maximum current density requirement (Jmax) for mean time to failures (MTTF) to be increased.

Abstract: A capacitor arrangement assisting method wherein data entered by a user, such as the width w of a power supply wiring, the thickness h of a dielectric between the power supply wiring and a ground plane, the ESLcap of a capacitor, and a target frequency fT and a target impedance ZT of an IC, are received, the maximum allowable wiring length lmax of the power supply wiring is calculated on the basis of the received width w of the power supply wiring, the thickness h of the dielectric, the ESLcap of the capacitor, and the target impedance ZT of the IC at the target frequency fT, and the calculated maximum allowable wiring length lmax is displayed.

Abstract: Circuits, architectures, a system and methods for providing multiple power rails to a plurality of standard cells in a region of an integrated circuit. The circuitry generally includes a plurality of cells configured for connection to a first or second power rail, the first power rail providing a first voltage to at least one of the plurality of cells, and the second power rail providing a second voltage (which may be independent from the first voltage) to remaining cells in the plurality of cells. The method generally includes routing, in an IC layout, a first power rail providing a first voltage and a second power rail providing a second voltage, placing the plurality of cells, and selectively connecting first and second subsets of the plurality of cells to the first and second power rails, respectively. The present invention further advantageously minimizes regional layout design considerations and time delays.

Abstract: A method of designing an integrated circuit includes deploying an active area in a first standard cell. At least one gate electrode is routed, overlapping the active area in the first standard cell. At least one metallic line structure is routed, overlapping the active area in the first standard cell. The at least one metallic line structure is substantially parallel to the gate electrode. A first power rail is routed substantially orthogonal to the at least one metallic line structure in the first standard cell. The first power rail overlaps the at least one metallic line structure. The first power rail has a flat edge that is adjacent to the at least one metallic line structure. A first connection plug is deployed at a region where the first power rail overlaps the at least one metallic line structure in the first standard cell.

Abstract: A method of producing a hierarchical power information structure for a circuit design, the method comprising traversing a circuit design hierarchy from a top design level to a bottom design level to identify any intermediate design levels, associating identified power nets with ground nets to produce one or more power domains, producing one or more power domains using the identified power nets and ground nets, identifying an instance of one or more special cells that are associated with a power related property and creating constructs for the special cells in the hierarchical power information structure, generating power rules for the intermediate level design using the special cell constructs, mapping higher design level power domains to lower design level power domains within the intermediate design level, and storing the power domains and power rules as power intent within an information structure associated with a schematic for the intermediate level design.

Abstract: A graphical block-based design exploration tool displays multiple views of a chip design. These views may include a logical view, physical view, hierarchy view, and a timing display view, displayed side-by-side or sequentially with or without animation. Various entities and their relationships to each other are displayed in these different view arrangements to allow a user to quickly grasp the entire design and to perform design techniques such as partitioning and floor planning. The display properties are user configurable to organize the information based on user preferences.

Abstract: An integrated circuit with standard cells with top and bottom metal-1 and metal-2 power rails and with lateral standard cell borders that lie between an outermost vertical dummy poly lead from one standard cell and an adjacent standard cell. A DPT compatible standard cell design rule set. A method of forming an integrated circuit with standard cells constructed using a DPT compatible standard cell design rule set. A method of forming DPT compatible standard cells.

Abstract: According to an embodiment, a semiconductor integrated circuit including first and second lower-layer power supply wires extending in a first direction and first and second upper-layer power supply wires extending in a second direction is provided. First and second connection wires between the upper-layer power supply wires and the lower-layer power supply wires are arranged in a same line along the second direction. First and second position converting wires extending from the connection wires are arranged between the first and second connection wires. First and second upper-side vias provided on the position converting wires are arranged in a same line along the first direction.

Abstract: A power supply noise analysis model creation method comprising; obtaining a distance which appears most frequently, from among the distances from a vias judged to be the nearest to the vias, respectively, as a reference via pitch, generates four nodes for the via of target wherein the four nodes generates the middle point with the other four via that are near the via of the target, obtaining meshes which include the nodes, respectively, by dividing the power island structure and the power supply pair by dividing lines which pass between the generated nodes, and converting each of the meshes obtained to a circuit element equivalent to the mesh.

Abstract: A power-gated retention flop circuit is disclosed. In one embodiment, a retention flop includes a first latch coupled to a first global voltage node and a virtual voltage node and configured to receive a data input signal, and a second latch coupled to receive the data input signal from the first latch, wherein the second latch is coupled to the first global voltage node and a second global voltage node. The second latch is configured to provide a data output signal based on the data input signal. A power-gating circuit is coupled between the virtual voltage node and the second global voltage node, wherein the power-gating circuit is configured to, when active, couple the virtual voltage node to the second global voltage node. Thus, the first latch may be powered down while the second latch remains powered on.

Abstract: An aspect of the present invention is a method for laying out a power wiring of a semiconductor device. The method includes: modeling the power wiring as an analysis model including a plurality of nodes and a plurality of element resistors provided between the plurality of nodes neighboring each other; obtaining voltage values of the plurality of nodes by a circuit simulation; searching a path of a current flowing into a node of the plurality of nodes when an IR drop violation exists in the voltage values, the node having a maximum value of the IR drop violation; selecting a bottleneck element resistor from among the plurality of element resistors included in the path; and changing a resistance value of the bottleneck element resistor.

Abstract: A method for providing an alternative power source for a graphics card are disclosed. Specifically, one embodiment of the present invention sets forth a method, which includes the steps of laying a set of gold fingers on a printed circuit board according to an industrial standard bus interface, positioning a wire in a middle layer of the printed circuit board, attaching a first end of the wire to a specific gold finger, and attaching the alternative power source to a second end of the wire, wherein the second end of the wire is an electroplated contact protruded external to the printed circuit board.

Abstract: A computer-implemented method for debugging the power aspect of an IC design by integrating the power specification expressed in certain power specification format and its corresponding circuit design within a power schematic diagram called power map. Power map is created by using a power data base generated by regrouping the original circuit design hierarchy to new hierarchies defined by the power specification. Power map contains power cell symbols (such as isolation cells, level shifters, power switches) and signal nets, and can show the relationship between power domains. Power map can also display mismatches or errors between the power specification and the circuit design for those signals connecting the power domains. Furthermore, power map can be used in conjunction with simulation result.

Abstract: The invention concerns a method and devices for analyzing the feasibility of a computer system composed of subsystems, each having functions. After having determined the functional architecture of the computer system comprising at least one subsystem and at least one function, the characteristics of the functions implemented are imported from a database. The user determines the number of subsystems and the number of connectors per subsystem. He then distributes the functions to the subsystems and enters the characteristics of the connectors and the characteristics of the subsystems. The computer system is analyzed in light of the information provided by the user and the characteristics of the functions implemented in order to determine the feasibility of the computer system.

Abstract: Aspects of the disclosure provide a method to design integrated circuit (IC) using power gating techniques. The method includes determining a placement of a plurality of power gating cells and at least a circuit block in an IC layout. On the IC layout, a first set of power gating cells and a second set of power gating cells are separated by the circuit block with a distance longer than a threshold. Further, the method includes optimizing a stitching order of the power gating cells for the placement to reduce a number of instances that the power gating cells in the first set and the power gating cells in the second set are neighboring power gating cells in the stitching order.

Abstract: Systems and methods are disclosed to automatically generate a custom integrated circuit (IC) described by a computer readable code or model. The IC has one or more timing and hardware constraints. The system extracts parameters defining the processor architecture from a static profile and a dynamic profile of the computer readable code; iteratively optimizes the processor architecture by changing one or more parameters of the architecture in a hierarchical manner until all timing and hardware constraints expressed as a cost function are met using an architecture optimizer (AO); and synthesizes the generated processor architecture into a computer readable description of the custom integrated circuit for semiconductor fabrication.

Abstract: A global power distribution network in an integrated circuit comprising a first layer of conductive material and a second layer of conductive material. The first layer of conductive material may be (i) coupled to one or more power supplies and (ii) configured to form a plurality of first rails of a mesh. The first rails may (a) supply power to one or more components of a core logic of the integrated circuit, (b) be aligned with a first axis of the integrated circuit, and (c) have one or more parameters configured such that the mesh has a uniform voltage gradient from a perimeter of the integrated circuit to a center of the integrated circuit along the first axis. The second layer of conductive material may be (i) coupled to the one or more power supplies and (ii) configured to form a plurality of second rails of the mesh.

Abstract: In one embodiment, there is provided a method for a computer aiding a design of a power supply that includes extracting data of one of a plurality of power supplies of an apparatus from product data about the apparatus, extracting data of a power supply system from power supply system data, the one of the plurality power supplies system is not allocated to any of the plurality of power supplies of the apparatus and associating the extracted data of the power supply with the extracted data of the power supply system in power supply allocation result data.

Abstract: An integrated circuit structure includes a chip including a substrate and a power distribution network. The power distribution network includes a plurality of power through-silicon vias (TSVs) penetrating the substrate, wherein the plurality of power TSVs forms a grid; and a plurality of metal lines in a bottom metallization layer (M1), wherein the plurality of metal lines couples the plurality of power TSVs to integrated circuit devices on the substrate.

Abstract: A mixed-height cell library for designing integrated circuits is provided. The mixed-height cell library includes a first plurality of cells having a first track height and a second plurality of cells having a second track height that are configured to be coupled to the first plurality of cells at respective power and ground rail lines. A method for mixed-height cell placement and optimization is also provided. The method comprises abutting cells of different track heights to form a plurality of rows of cells by coupling power and ground rails of the cells at a secondary layer that is different from a primary layer that is used to connect active material and determining whether re-ordering cells within rows allows for further compaction of adjacent rows. The method further comprises re-ordering cells within rows so to allow for further compaction of adjacent rows. The method also includes the steps of splitting rows vertically to minimize the distance between the split rows.

Abstract: One or more portions of the design (e.g., components, channels, or portions thereof) can be assigned instances of one or more component power domains (CPDs). Assigning an instance of a CPD to a design element (or to a portion thereof) can indicate, for example, whether the element can be switched on and off, or whether the element can operate over a range of voltages. The CPD instances can, in turn, be assigned to one or more design power domains (DPDs). Assignments of a CPD to a DPD can be evaluated according to a set of compatibility rules. Two or more electronic design elements can be connected by one or more signal paths. Organizing the CPD instances into DPDs can aid in finding signal paths that cross from a first DPD to a second DPD. To improve the reliability of signal paths traversing a DPD boundary, one or more power domain interface (PDI) components can be created to handle the signal paths at the boundary.

Abstract: A power domain is automatically generated. A computer performs a function simulation process 9 for evaluating whether or not a designed circuit satisfies a specification, and a clustering process 10 which obtains a power domain by clustering logical blocks in which activation timings are within a range, based on the result of the function simulation process. Since the power domain is obtained by a process performed by the computer, the power domain can be optimized compared to a case when it is obtained by hand (manual work of the designer).

Abstract: A system and method for storing power utilization information in an integrated circuit and utilizing such information. Various aspects of the present invention provide an integrated circuit that comprises a first module, which stores power utilization information for at least a portion of the integrated circuit. A second module of the integrated circuit may communicate the power utilization information with an electrical device external to the integrated circuit. Various aspects of the present invention provide a method for storing power utilization information in an integrated circuit. For example, a performance characteristic and/or a power supply characteristic may be monitored as the integrated circuit is utilized. Power utilization information may be determined from the monitored characteristic(s), and the power utilization information may be stored in the integrated circuit.

Abstract: An area partitioning processing unit equally partitions a power source network analysis object area of an LSI according to the number or size of partitioned areas specified by a user or partitions the power source network analysis object area according to the user's specification. A border processing unit extracts and adds a range-of-influence part of the power source network that can electrically influence a border between the partitioned area partitioned by the area partitioning processing unit and an adjacent power source network area. A modeling processing unit performs processing of resistance modeling of the partitioned area or a correction spot with the range-of-influence part added thereto by the border processing unit. A power source network analyzing processing unit analyzes a resistance model modeled by the modeling processing unit and calculates potential of each via as a current source to a load element.

Abstract: A method reduces coupling noise and controls impedance discontinuity in ceramic packages by: providing at least one reference mesh layer; providing a plurality of signal trace layers, with each signal layer having one or more signal lines and the reference mesh layer being adjacent to one or more of the signal layers; disposing a plurality of vias through the at least one reference mesh layer, with each via providing a voltage (Vdd) power connection or a ground (Gnd) connection; selectively placing via-connected coplanar-type shield (VCS) lines relative to the signal lines, with a first VCS line extended along a first side of a first signal line and a second VCS line extended along a second, opposing side of said first signal line. Each of the VCS lines interconnect with and extend past one or more vias located within a directional path along which the VCS lines extends.

Abstract: A method of producing a hierarchical power information structure for a circuit design, the method comprising traversing a circuit design hierarchy from a top design level to a bottom design level to identify any intermediate design levels, associating identified power nets with ground nets to produce one or more power domains, producing one or more power domains using the identified power nets and ground nets, identifying an instance of one or more special cells that are associated with a power related property and creating constructs for the special cells in the hierarchical power information structure, generating power rules for the intermediate level design using the special cell constructs, mapping higher design level power domains to lower design level power domains within the intermediate design level, and storing the power domains and power rules as power intent within an information structure associated with a schematic for the intermediate level design.

Abstract: A design support method for causing a computer using layout data for providing a layout in which macro cells are arranged and in which power supply wirings are formed at certain intervals in each wiring layer to execute, the method including: extracting a set of adjacent macro cells from the layout data; specifying a region located between macro cells that constitute the set of adjacent macro cells extracted in the extracting step from among row regions included in the layout represented by the layout data; detecting a power supply wiring of a specific wiring layer in a projection area located above the region specified in the specifying step, the specific wiring layer being higher than a bottom layer of the layout represented by the layout data; and outputting a region where no power supply wiring of the specific wiring layer is detected in the detecting step.

Abstract: In a method for simulating electrical characteristics of a plurality of power planes, each power plane includes a plurality of geometric features. The geometric features of each power plane are projected onto a single planar construct. A polygonal mesh, including a plurality of pairs of interconnected nodes, that corresponds to the single planar construct is generated. The polygonal mesh is projected onto at least one power plane an equivalent circuit between each adjacent node of the plurality of interconnected nodes is projected onto the power plane. An equivalent capacitance is assigned between each node and a common ground planer. A finite element equation that includes a plurality of discrete terms is generated. The equation is solved, thereby determining the electrical characteristic value between each pair of adjacent nodes.

Abstract: Methods and/or associated devices and/or systems for providing power management in electronic circuits, including custom ICs, programmable logic devices, and application specific integrated circuits (ASICs) places portions of various power management solutions in the I/O ring or in I/O macros. The invention has numerous specific embodiments and applications to a wide variety of ICs and logic or other circuit design components including circuit modules, software descriptions of circuit modules and/or design or simulation or test systems for circuit development.