Abstract: There is provided a thermal-type airflow meter that reduces the number of output signals of the sensor circuit and that can suppress the accuracy of flow rate detection from being deteriorated because due to a nonlinear sensor output characteristic and a response delay in the output signal, the output signal shifts toward the positive side or the negative side. A thermal-type airflow meter outputs one or both of a positive-side comparison signal that is at the positive side of a comparison threshold value and a negative-side comparison signal that is at the negative side of the comparison threshold value, outputs a coefficient multiplication signal obtained by multiplying an average signal acquired by averaging the comparison signal by an adjustment coefficient, and outputs, as a flow rate signal, a value obtained by applying the coefficient multiplication signal to increase correction or decrease correction of the amplitude increase signal.

Abstract: A thermal airflow sensor includes a semiconductor device, a protective film a bonding wire, and a resin. The resin covers over a part of the semiconductor device so that the bonding wire is covered with the resin and the region including a thin-wall portion is exposed. The protective film is not covered with the resin and has an outer peripheral edge located outside the thin-wall portion.

Abstract: In order to provide a thermal flow meter capable of preventing adherence of contaminants to an air flow sensing portion, the thermal flow meter (300) of the invention includes a bypass passage for flowing a measurement target gas (30) received from a main passage (124) and an air flow sensing portion (602) for measuring a flow rate of the measurement target gas (30) by performing heat transfer with the measurement target gas (30) flowing through the bypass passage through a heat transfer surface (437). The air flow sensing portion (602) is provided to be exposed to an exposed surface (402) arranged along a flow direction of the measurement target gas (30) inside the bypass passage is embedded, the mount support surface (402) has a stage (407) formed to surround a periphery of the air flow sensing portion (602), and an inner portion surrounded by the stage protrudes more than an outer portion of the stage.

Abstract: A gas sensor which works according to the principle of thermal conductivity is functionally tested. In the method, a calibration cycle is conducted in which a membrane of the gas sensor is immersed in a fluid calibration medium having a known concentration of a target gas. After the calibration cycle, a measurement chamber of the gas sensor is purged with a purging gas. Then, a measuring cycle is conducted, using a thermal conductivity sensor to measure the target gas in the measurement chamber. Using a calibration baseline established from the calibration cycle and a measurement baseline in the measurement cycle, a baseline comparison value is obtained and compared to a predetermined baseline threshold value. An error message, indicating a malfunction in the purging gas supply, is generated when the baseline comparison value exceeds the predetermined baseline threshold value.

Abstract: The present invention provides a thermal flow meter 300 which reduces a stress applied from a fixing portion 3721, which is used to hold and fix a circuit package 400 with respect to a housing 302, to the circuit package 400 and has high reliability. In the thermal flow meter of the invention, the circuit package 400 embedded with a flow rate measurement circuit is formed through a first resin molding process, the fixing portion 3721 is formed along with the housing 302 through a second resin molding process, and the circuit package 400 is enveloped by the fixing portion 3721, whereby the circuit package 400 is held by and fixed to the housing 302. In order to reduce the influence of a stress, generated based on a temperature change of the fixing portion 3721, on the circuit package 400, the fixing portion 3721 is constituted of a thick portion 4714 and a thin portion 4710.

Abstract: The present invention provides a thermal flow meter which can suppress a degradation of measurement accuracy caused by deformation of a diaphragm and a stained rear surface thereof even in a case where a gap is provided in order to form the diaphragm in an air flow sensing element. The present invention relates to a thermal flow meter 300 which includes a bypass passage through which a measurement target gas 30 received from a main passage 124 flows, and an air flow sensing element which measures a flow rate of the measurement target gas 30 by performing heat transfer with the measurement target gas 30 flowing through the bypass passage. The thermal flow meter 300 includes at least a circuit package 400 which contains the air flow sensing element 602. A gap 674 is formed in a rear surface of the air flow sensing element 602 to form a diaphragm 672 in an air flow sensing area 437 of the air flow sensing element 602, and the gap 674 becomes a sealed space reduced in pressure compared to an atmospheric pressure.

Abstract: A method for monitoring for a rupture in a storage element of a fuel tank system having a fuel tank includes: detecting, by a mass flow sensor, thermal conductivity of an unmoved air mass in a first line of the fuel tank system; and identifying a rupture in the storage element if the detecting by the mass flow sensor detects a change in the thermal conductivity of the unmoved air mass in the first line when a second valve is in a closed state and/or when an air pump is at a standstill.

Abstract: A gas flow sensing device, and related method of manufacturing, comprising a conductive layer encapsulated in dielectric film, suspended over a cavity to form a diaphragm. The conductive layer functions as both a heating a sensing element and is patterned to provide uniform heat distribution across the diaphragm. The device is designed to sense flow from any direction relative to the device and the design of the dielectric film and diaphragm reduces sensor drift during prolonged operation.

Abstract: An integrated circuit (“IC”) package comprising an IC die having a top surface and a bottom surface, an elongate member having opposite first and second end portions and a mid portion. The mid portion is positioned proximate the top surface of the IC die. The IC package also includes an encapsulant block having a top surface, a bottom surface and opposite first and second lateral side surfaces. The encapsulant block encapsulates the IC die and the elongate member. Either or both of the first and second end portions of the elongate member are exposed.

Abstract: An object of the present invention is to improve the reliability of a product in which a semiconductor device is partially exposed when sealed with resin. In achieving the above object and according to this invention, there is provided a thermal airflow sensor including: a semiconductor substrate having a thin-wall portion, a heating resistor provided over the thin-wall portion, and resistance temperature detectors installed upstream and downstream of the heating resistor; a protective film provided over the semiconductor substrate; and a resin that seals the semiconductor substrate, the resin further including an exposure portion for partially exposing an area including the thin-wall portion. The protective film is provided in a manner seamlessly enclosing the heating resistor, the protective film having an outer peripheral edge located outside the thin-wall portion and over the exposure portion.

Abstract: A sensor element (1) includes a substrate (2) and a strain-sensitive element (3) which is preferably applied to the substrate by means of thin-film technology and is used for measuring the deformation of the substrate (2) when pressure is applied or a force is introduced, the strain-sensitive element (3) including XAlOyN1-y, wherein X is a metal with a high melting temperature in the range of greater than 1400° C. and 0<y<0.4 applies. A passivation layer (5) can be applied to the strain-sensitive element (3).

Abstract: The present invention relates to a sample analyzing chip. The chip can prevent upper and lower substrates of a channel from being attached to each other due to deflection on a micro channel and can solve the problem of the sample drying up within a measuring time of a target. Also, the chip can prevent bubbles from being generated in a central portion of the micro channel.

Abstract: A micro flow sensor includes: a flow path through which a fluid to be measured flows; a detection unit having a heater configured to heat the fluid to be measured in the flow path and temperature sensors configured to measure temperature of a fluid to be measured in the flow path; an arithmetic unit configured to measure a flow rate of the fluid to be measured flowing through the flow path based on the temperature of the fluid to be measured, measured by the temperature sensors; and a narrowed portion disposed on an upstream side of the detection unit in the flow path for narrowing the flow path.

Abstract: A sensor element may include a measuring element and a functional housing at least partially surrounding the measuring element including a plastic molded housing. The measuring element may include a hot plate mounted on a carrier substrate by means of narrow arms in a broadly thermally decoupled manner. The carrier substrate may be provided with contacts leading to the measuring element and terminating in contact/bonding points on the carrier substrate. The carrier substrate together with the contact/bonding points may be at least partially integrated into the plastic molded housing, leaving the hot plate exposed. The housing may include connection wiring for the contact/bonding points.

Abstract: A flash heater element includes a first surface having a central region and an electrical flow path disposed on the first surface. The electrical flow path includes a central portion disposed at least partially within the central region and a peripheral portion disposed peripherally outwardly from the central region. A width of the electrical flow path is greater within at least a portion of the central portion than within the peripheral portion.

Abstract: A highly sensitive humidity measurement device is provided. The humidity measurement device has: a housing component integrally including a connector for performing input/output to/from the outside and a connector terminal component; an electronic circuit board mounted on the housing component and electrically connected to the connector terminal; and a humidity sensing element provided on the electronic circuit board. When the humidity measurement device is installed in an installation hole that is provided in a part of a main air flow passage through which suction air flows, apart of the housing component is exposed to the suction air flowing through the main air flow passage. The housing component is provided with a bypass passage to suction a part of the suction air. The bypass passage includes a bypass inlet opening that serves as a suction port of the suction air and a bypass outlet opening that discharges the suction air. The bypass outlet opening is exposed to the suction air.

Abstract: In a flow sensor, an upstream heating element and a downstream heating element are disposed, respectively, upstream and downstream in a flow direction of a fluid so as to undergo mutual thermal interference. By controlling heating currents flown through the respective heating elements, an average temperature control portion maintains an average temperature of the two heating elements at a temperature predetermined degrees higher than a temperature of the fluid detected by a fluid temperature detection portion while a voltage ratio control portion performs control so that a temperature difference or a ratio of applied voltages between the two heating elements takes a predetermined value. A detection signal corresponding to a flow direction of the fluid is obtained from a state of the control on the heating currents and whether a flow direction of the fluid is forward or backward is determined.

Abstract: In a thermal sensor with a detection part and a circuit part formed on the same substrate, an insulating film for protection of the circuit part causes problems of lowering in sensitivity of a heater, deterioration in accuracy due to variation of a residual stress in the detection part, etc. A layered film including insulating films is formed on a heating resistor, an intermediate layer is formed thereon, and a layered film including insulating films is formed further thereon. The intermediate layer is specified to be a layer made up of any one of aluminum nitride, aluminum oxide, silicon carbide, titanium nitride, tungsten nitride, and titanium tungsten. This configuration enables the layered film on the upper part of the detection part to be removed using the intermediate layer as an etch stop layer, which solves problems of lowering in sensitivity, a variation in residual stress, etc. resulting from these.

Abstract: Thermal flow sensors are disclosed. An example thermal flow sensor includes a chip substrate; a heater mounted to a first membrane on the chip substrate; and a temperature sensor mounted to a second membrane on the chip substrate, the second membrane being isolated from the first membrane by material of the chip substrate.

Abstract: The design and manufacture method of a silicon mass flow sensor made with silicon micromachining (a.k.a. MEMS, Micro Electro Mechanical Systems) process for applications of gas flow measurement with highly humidified or liquid vapors is disclosed in the present invention. The said silicon mass flow sensor operates with an embedded heater and an adjacent control temperature sensor beneath the integrated calorimetric and thermal dissipative sensing thermistors. When the condensation takes place at the surface of the said silicon mass flow sensor, the embedded heater shall be turned on to elevate the temperature of the supporting membrane or substrate for the sensing thermistors. The elevated temperature shall be adjusted to above the vaporization temperature with the feedback data of the adjacent temperature sensor such that the surface condensation due to the presence of the liquid vapors in a gas flow can be effectively eliminated.

Abstract: A measurement arrangement includes four electrically heated resistors which are arranged in gas paths and are connected to form a Wheatstone bridge, where each of two resistors which are diagonally opposite each other in the Wheatstone bridge are contained in a respective component arranged on a common heated carrier, each respective component is assigned to one heating resistor arranged near the component on the carrier, and where an unbalanced state of the Wheatstone bridge is compensated for by variably energizing the heating resistors.

Abstract: Apparatus and associated methods relate to a temperature-compensated drive for a heating element used in a micro-bridge flow sensor. In some embodiments, the heating element may be located substantially between two temperature sensors. The two temperature sensors may be convectively coupled to the heater by a fluid ambient. When the fluid ambient is flowing, one of the temperature sensors may be upstream of the heating element, and one of the temperature sensors may be downstream. The fluid may be heated by the heating unit, and this heated fluid may then flow past the downstream temperature sensor. The two temperature sensors may be used in a Wheatstone bridge configuration. In some embodiments, an output signal of the Wheatstone bridge may be indicative of a measure of fluid flow. The temperature-compensated drive for the heating element may enhance, for example, the flow meter's disturbance rejection of ambient temperature.

Abstract: A gas sensor on a semiconductor substrate. The gas sensor includes an elongate sensor element extending across an opening and has first and second opposed surfaces exposed for contact with a gas to be sensed. The first surface faces away from a major surface of the substrate. The second surface faces toward said major surface. The electrical conductivity of the elongate sensor element is sensitive to a composition and/or concentration of said gas to which the opposed first and second surfaces are exposable. The gas sensor further includes a support structure arranged to increase the mechanical robustness of the gas sensor by supporting the elongate sensor element in the opening.

Abstract: Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FS1 of the present invention, a part of a semiconductor chip CHP1 is configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHP1 is exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP1) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHP1 in a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP1) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP1) and the resin (MR).

Abstract: An object of the present invention is to provide a thermal type flow rate sensor that offers high sensitivity and improved reliability. A sensor element according to the present invention includes a semiconductor substrate, a cavity portion formed on the semiconductor substrate, a heating resistor formed on the cavity portion via an electrically insulating film, a heating temperature sensor for detecting heating temperature of the heating resistor, and a driving circuit for controlling the heating temperature of the heating resistor using the temperature detected by the heating temperature sensor. The heating temperature sensor comprises temperature-sensitive resistors having resistance values varying according to temperature and disposed upstream and downstream of a direction of flow of a fluid to be measured relative to the heating resistor and on upper and lower sides in a direction perpendicular to the direction of flow of the fluid to be measured relative to the heating resistor.

Abstract: A sensing system and method for use with a gas filter in a gas conduit attached to a gas blower, having a motor for producing a first gas flow blower speed, discards readings taken when the blower is off or during blower startup and shutdown, and recalculates a clog threshold in response to changes in the fan speed of a multi-speed blower.

Abstract: A device for detecting at least one flow characteristic of a fluid medium, in particular for detecting an air mass flow in the intake air of a motor vehicle, includes at least one flow channel, through which the fluid medium may flow, and at least one sensor element, which is situated in the flow channel, for detecting the flow characteristic. The sensor element has at least one heating element. The device includes at least one bidirectional electrical interface. The device is configured to receive information and transmit information via the bidirectional electrical interface.

Abstract: In a manufacturing method of a molded package, a lead frame including an island portion and a support portion is prepared. A circuit chip is mounted on the island portion, and the sensor chip is arranged such that a first end section having an electric connecting portion is adjacent to the circuit chip and a second end section having a sensing portion is supported by the support portion. The circuit chip and the electric connecting portion of the first end section is electrically connected through a connection member. The circuit chip, the island portion, the connection member and the first end section are sealed with a resin while maintaining the support state. After the sealing, the support portion is cut from the lead frame and separated from the second end section.

Abstract: A for operating a thermal, flow measuring device having a first sensor having a first heatable, resistance thermometer and at least one additional, second sensor having a second heatable, resistance thermometer, wherein a decision coefficient is calculated according to the formula DC=(PC1?PC2)/PC1, wherein PC1(t=t1)=P1,1(t1)/(T1,heated;actual(t=t1)?Tmedium;actual(t=t1)) and PC2(t=t2)=P2,2(t2)/(T2,heated;actual(t=t2)?Tmedium;actual(t=t2)), with P being the heating powers absorbed by the corresponding resistance thermometers at the points in time t and the temperature values T, wherein the value of the decision coefficient shows flow direction of a measured medium in the measuring tube.

Abstract: Measuring flow rate of gas based on amount of heat transfer from gas to temperature-sensing resistors, comprises: substrate having hollow space formed therethrough; an insulating film deposited on the substrate so as to cover the hollow space; a heat-generating resistor formed on the insulating film; temperature-sensing resistors arranged adjacent to the heat-generating resistor; electrodes arranged at an edge of the semiconductor substrate so electrodes are parallel to the edge; and wiring connecting the electrodes and heat-generating resistors. Thermal resistance of a first area is made almost equal to thermal resistance of a second area, first area is defined by the side of the heat-generating resistor closer to the electrodes and by the side of the hollow space closer to the electrodes, and the second area is defined by the opposite side of the heat-generating resistor and by the opposite side of the hollow space.

Abstract: A measuring device (1) with a housing (2) and two electronic devices (3, 4). To provide a measuring device whose electronics are modular, enabling easy adaptation to self-protection, the measuring device is provided with at least one encapsulated contact element (5) that is designed separately from the electronic units (3, 4) and the housing (2) and is arranged between the two electronic units (3, 4). Furthermore, the contact element (5) has at least one electronic transmission element (6) for creating an electric connection between the two electronic units (3, 4).

Abstract: A technique capable of suppressing performance variation of every flow sensor and achieving performance improvement is provided. For example, in an arbitrary cross-sectional surface in parallel to a moving direction of a gas flowing on an exposed flow detecting unit FDU which is formed in a semiconductor chip CHP1, a sealing body is released from the lower mold BM by thrusting up, from a lower mold BM, an ejection pin EJPN arranged in an outer region of the semiconductor chip CHP1 so as not to overlap with the semiconductor chip CHP1 arranged in the vicinity of the center part. Thus, according to the first embodiment, the deformation applied to the sealing body at the time of mold releasing can be smaller than that in a case in which the sealing body is released from the lower mold BM by arranging the ejection pin EJPN in a region overlapping with the semiconductor chip CHP1.

Abstract: A thermal mass flowmeter with a metal-encapsulated sensor system is provided. The sensor system included at least one heating resistor having a platelet geometry, and a sensor cap surrounding the at least one heating resistor. At least one distal end area of the sensor cap is formed with a flat rectangular cross section corresponding to the platelet geometry of the heating resistor, such that the distal end area of the sensor cap surrounds the heating resistor closely with an accurate fit (e.g., with a predetermined gap therebetween).

Abstract: A substrate mimicking intercellular lipids in stratum corneum consisting of a substrate and a lipid membrane formed on the substrate, wherein the lipid membrane is formed from ceramide, palmitic acid and cholesterol, and the ceramide, palmitic acid and cholesterol are present at a mass ratio of 20-70%:10-60%:20-40% (ceramide:palmitic acid:cholesterol).

Abstract: A crash sensor assembly including a printed circuit board and a crash sensor mounted on the printed circuit board, At least one connector pin is mounted to the printed circuit board so as to permit external electrical communication with the crash sensor. A first insert molded soft inner layer of material partially covers the printed circuit board and covers the crash sensor, and a second overmolded hard outer layer of material covers the first soft inner layer of material and bonded thereto and rigidly contacts the printed circuit board.

Abstract: The present invention provides a thermal conductivity detector capable of realizing high detection performance even with the use of a miniaturized heating element, and expanding an effective applicable temperature range of a heating element, and to provide a gas chromatograph using the same. The thermal conductivity detector comprises a flow-path through which a measurement gas is caused to flow, a heating element disposed inside the flow-path, the heating element being formed on the substrate, for detecting thermal conductivity of the measurement gas according to magnitude of an amount of heat taken away from the heating element by the measurement gas, wherein said heating element is provided with a beam including a part where the beam is folded at a predetermined angle, the part being formed at the central part of the beam.

Abstract: In order to provide a flow measuring device high in thermal responsiveness, the flow measuring device includes a temperature detecting element 2 for temperature detection, and a conductive metal lead frame 3 that supports and fixes the temperature detecting element. Of the metal lead frame, a part of the metal lead frame mounted with the temperature detecting element has a portion which is thinner than the thickness of the other metal lead frame or narrower than the width of the other metal lead frame.

Abstract: A spacer for a thermal, flow measuring device, wherein the spacer has a planar bearing surface for a thin-film resistance thermometer and an otherwise circularly cylindrical, lateral surface, wherein the bearing surface is inclined relative to a longitudinal axis of the spacer.

Abstract: A thermal air flow meter comprises: a bridge circuit unit that incorporates a bridge circuit including a heating resistor and supplies a current to the heating resistor so that the temperature of the resistor is always set higher by a predetermined temperature than the temperature of intake air detected by an intake-air temperature detection resistor, and outputs an output signal Vm based on the current value supplied to the heating resistor, in accordance with a flow rate of the intake air; a differential amplifier unit that amplifies a voltage dependent on difference in temperature between an upstream heating resistor and downstream heating resistor; and a subtraction processor that subtracts from the output signal Vm a constant times an output voltage Vd1 from the differential amplifier unit, and outputs a correction output signal Vout.

Abstract: Provided is a thermal type flowmeter in which contamination of a sensor element is reduced. The flowmeter includes a sensor element including a heating resistor formed in a thin film part, the thin film part being provided on a diaphragm formed on a substrate; a support member to locate the sensor element thereon; a secondary channel that includes part of the support member and takes in part of intake air flowing through an air intake pipeline; and a guide member provided on the support member or the sensor element that lies on a line L that extends along an air flow in the secondary channel and passing over the thin film part, the guide member allowing fine particles to be guided in a direction away from the line L, the fine particles coming together with an air flow along the surface of the support member or the sensor element.

Abstract: A flow rate detection device of the invention comprises a flow rate meter 11 for outputting an output value Vd depending on a gas flow rate and detects the gas flow rate by calculating the gas flow rate on the basis of the output value output from the flow rate meter. In this invention, it is judged if the output value output from the flow rate meter should be corrected on the basis of the flow rate of the gas passing through the flow rate meter and its change rate. When it is judged that the output value output from the flow rate meter should be corrected, the output value output from the flow rate meter is corrected and then, the gas flow rate is calculated on the basis of this corrected output value.

Abstract: Systems and methods in accordance with embodiments of the invention implement integrated environmental sensors that can operate in rigorous environments. In one embodiment, an integrated environmental sensor includes: at least one sensor and a substrate; where: the at least one sensor is disposed on the substrate; the at least one sensor can detect at least two environmental properties including: the surrounding temperature; the surrounding pressure; the flow rate of surrounding fluids; and the surrounding composition; the at least one sensor is capable of detection in an environment that has: a temperature greater than 150° C.; a pressure greater than 100 bar; and/or an inclusion of one of liquid hydrocarbons, H2S, CO2, and sulfur species; and the substrate can withstand an environment characterized by at least one of: a temperature greater than 150° C.; a pressure greater than 100 bar; and/or an inclusion of one of liquid hydrocarbons, H2S, CO2, and sulfur species.

Abstract: A thermal type air flow meter that is capable of suppressing deformation of a base member at the time of molding is disclosed, to thereby secure dimension accuracy and reduce an influence of a dimension change on measuring accuracy. The meter includes a housing member placed in an intake passage of an internal combustion engine, and a base member fixed to the housing member and includes a secondary air passage into which part of air passing through the intake passage flows. The base member is a plate-like resin molded component formed of a synthetic resin material and includes a reinforcing structure integrally formed between a board fixing part to which a circuit board is fixed; and a secondary passage constituting part formed at a leading end part of the board fixing part, the reinforcing structure enhancing strength of the base member.

Abstract: A sensor chip in a flow quantity measuring apparatus includes a first conductive line, through which a midpoint electric potential of a first series circuit of a bridge circuit is outputted, is branched from a first midpoint connection on a sensor chip. A second conductive line, through which a midpoint electric potential of a second series circuit of the bridge circuit is outputted, is branched from a second midpoint connection on the sensor chip. The output point of the midpoint electric potential of the first series circuit is provided at a midpoint between two temperature sensor resistors, and the first midpoint connection is provided on a center line of a heater resistor. The output point of the midpoint electric potential of the second series circuit is provided at a midpoint between two temperature sensor resistors, and the second midpoint connection is provided on the center line of the heater resistor.

Abstract: A thermal type air flow meter, which detects a flow rate of air flowing in an air passage, includes a sensor portion having a heating element in an air passage, a temperature control unit. The temperature control unit includes a first arm serially connecting a first resistive element and a heater temperature detection resistor which detects a temperature of the heating element, a second arm serially connecting a second resistive element and an air temperature detection resistor which detects a temperature of air flowing in the air passage, and a voltage supply unit which supplies first and second voltages respectively to the first and second arms. The voltage supply unit includes a voltage adjusting portion which can adjust at least one of the first and second voltages such that the detection temperature difference between the heater temperature detection resistor and the air temperature detection resistor becomes constant.

Abstract: An apparatus comprising a micromachined (a.k.a. MEMS, Micro Electro Mechanical Systems) silicon flow sensor, a flow channel package, and a driving circuitry, which operates in a working principle of thermal time-of-flight (TOF) to measure gas or liquid flow speed, is disclosed in the present invention. The micromachining technique for fabricating this MEMS time-of-flight silicon thermal flow sensor can greatly reduce the sensor fabrication cost by batch production. This microfabrication process for silicon time-of-flight thermal flow sensors provides merits of small feature size, low power consumption, and high accuracy compared to conventional manufacturing methods. Thermal time-of-flight technology in principle can provide accurate flow speed measurements for gases regardless of its gas compositions. In addition, the present invention further discloses the package design and driving circuitry which is utilized by the correlated working principle.

Abstract: A flow measuring device includes a housing, a support, and a flow measurement element. The housing defines a passage therein and includes a passage narrowing part, which reduces a cross-sectional area of the passage, in a predetermined part of the passage. The support has a platy shape and is disposed along a flow direction of fluid flowing in the passage. The flow measurement element is located inside the passage narrowing part and is disposed on a surface of the support. The flow measurement element detects a flow rate of fluid flowing in the passage. The passage narrowing part has an inner wall surface that gradually reduces a width of the passage from a center side to both end sides of the passage in a height direction of the passage, which is perpendicular to a direction of the width of the passage.

Abstract: A measuring device with at least one housing and at least one electronic unit, wherein the housing has at least one electronic access opening for the electronic unit, wherein a first longitudinal axis extends through the electronic access opening, wherein the housing has a sensor access opening for connecting to a sensor unit, wherein a second longitudinal axis extends through the sensor access, wherein the first longitudinal axis and the second longitudinal axis span an orientation plane, wherein the electronic unit has at least one printed circuit board which lies essentially in a printed circuit board plane that, to provide a measuring device, in which the effect of external mechanical stresses on electronic components can be reduced, is arranged in the housing such that the printed circuit board plane is at an angle relative to the orientation plane which differs from an integral multiple of 90°.

Abstract: The flow rate detection device includes a sensor element and a support. The sensor element includes: a cavity which is formed in a rear surface of a plate-shaped semiconductor silicon substrate by removing part of the plate-shaped semiconductor silicon substrate; and a thin film portion which is disposed over the cavity and includes a detecting element. The support includes a fitting portion into which the sensor element is to be disposed. The sensor element is supported to the fitting portion by an adhesive in a floating manner. A gap formed between the sensor element and the fitting portion is filled with an anti-undercurrent material. The sensor element has a texture including protrusions and depressions formed on a surface opposed to the fitting portion, and the anti-undercurrent material is brought into contact with the texture.

Abstract: Fluidic systems and methods of determining properties of fluids flowing therein. The fluidic systems and methods make use of a micromachined device that determines at least one property of the fluid within the system. The micromachined device includes a base structure on a substrate and a tube structure extending from the base structure and spaced apart from a surface of the substrate. The tube structure has at least one pair of geometrically parallel tube portions substantially lying in a plane, and at least one continuous internal passage defined at least in part within the parallel tube portions. A drive element induces vibrational movement of the tube structure in the plane of the tube structure and induces resonant vibrational movements in the tube portions in the plane of the tube structure. A sensing element senses deflections of each tube portion in the plane of the tube structure.