Abstract: An electronic element package includes a plate-like sensor substrate with a detector formed thereon, and a plate-like first cover substrate and a plate-like second cover substrate joined directly or indirectly to a top surface and a bottom surface, respectively, of the sensor substrate so that the sensor substrate is located between the first and second cover substrates, the sensor substrate including, a frame surrounding the detector via a space, beams joining the detector to the frame, and an electrode disposed on the frame and electrically connected to the detector, one of the first cover substrate and the second cover substrate having a through-hole which contacts an electrode. The electronic element package enables a reduction in thickness and offers improved reliability.

Abstract: An apparatus is provided for recording information about an event resulting in application of a force to a body. The apparatus comprises data recording means for recording the information, sensor means for sensing a parameter which enables a predetermined source of force to be distinguished from another, predetermined source of force, and control means responsive to the sensed parameter for controlling the data recording means. The sensor means may comprise a pressure sensor for sensing shockwaves resulting from an explosive force and the resulting signal used to distinguish from other events, such as blunt impacts. The pressure signal may be used to control the storage of acceleration data for injury analysis.

Abstract: An apparatus is provided for recording information about an event resulting in application of a force to a body. The apparatus comprises data recording means for recording the information, sensor means for sensing a parameter which enables a predetermined source of force to be distinguished from another, predetermined source of force, and control means responsive to the sensed parameter for controlling the data recording means. The sensor means may comprise a pressure sensor for sensing shockwaves resulting from an explosive force and the resulting signal used to distinguish from other events, such as blunt impacts. The pressure signal may be used to control the storage of acceleration data for injury analysis.

Abstract: A method of mounting in-plane sensors of an inertial measurement unit. The method includes the steps of: providing a structure having first and second planar surfaces oriented orthogonally to one another, positioning a plurality of sensors on the first planar surface such that each of the sensors has a sense axis extending parallel to the first planar surface, positioning at least one other sensor on the second planar surface such that the at lease one other sensor has a sense axis extending parallel to the second planar surface, and orienting the sensors on the first and second surfaces so that the angles formed between any two sense axes are equal.

Abstract: An insulated accelerometer assembly is provided for attachment to a vibrated component. A base has a portion for engagement and connection with the vibrated component and to transmit vibration. An accelerometer senses vibration and is located at least partially within the base. A housing at least partially encloses the accelerometer and inhibits voltage discharge, corona damage, and voltage tracking on the accelerometer. The housing is made of an insulating material and has an interior for the accelerometer. The housing has a plurality of raised fins on the exterior. A mounting cap also inhibits voltage discharge, corona damage, and voltage tracking and secures the housing. The mounting cap is made of insulating material and has an exterior that includes a plurality of raised fins. A cable has an electrically conductive wire and has a shield to inhibit electrical noise.

Abstract: An inertia sensing module is connected to a portable electronic device. The inertia sensing module includes an accelerometer unit for generating at least one of acceleration sensing signals ax, ay, az corresponding to the directions of X, Y, Z respectively; a gyroscope unit for generating at least one of angular rate sensing signals ?x, ?y, ?z corresponding to the axes of X, Y, Z respectively; and a connector module having a plug that is inserted into a docking connector of the portable electronic device. With the inertia sensing module being connected to or disconnected from the portable electronic device, a user can control a specific cursor or graphic user interface on a picture of an electronic game player via his/her own motions.

Abstract: An acceleration sensor has a semiconductor acceleration sensor chip and a case. The semiconductor acceleration sensor chip has a fixed portion, a plummet portion surrounding the fixed portion without contacting the fixed portion, and a beam portion connecting the fixed portion and the plummet portion, the thickness of the beam portion being thinner than the thickness of the fixed portion. The case has a cavity housing the semiconductor acceleration sensor chip, and a projection portion formed on the bottom face of the cavity, the bottom face of the fixed portion being fixed to the top face of the projection portion.

Abstract: An inertial measurement system having a triangular cupola shaped base structure with three mutually orthogonal sides and a bottom surface surrounding a hollow core. The bottom surface includes an aperture providing access to the hollow core. An inertial module is mounted on each of the sides and includes a gyroscopic rotational rate sensor and a linear accelerometer connected to a circuit board. The inertial measurement system also includes a motherboard and a plurality of metallization elements. The metallization elements extend from the bottom surface to the sides of the base structure and conductively connect the inertial module to the motherboard. The inertial measurement system may also include a non-conductive adhesive underfill positioned between the inertial module and the base structure.

Abstract: A composite sensor includes an angular velocity sensor element, an acceleration sensor element, a signal processing IC for processing signals from the angular velocity sensor element and the acceleration sensor element, an inner package for accommodating the angular velocity sensor element, the acceleration sensor element, and the signal processing IC; a coupler connected to this inner package, and a fixing member connected to this coupler for holding the inner package via this coupler. The coupler is elastically deformable. One of the acceleration sensor element and the signal processing IC is located at the right with respect to the center of the inner package, and the other of the acceleration sensor element and the signal processing IC is located at the left with respect to the center of the inner package.

Abstract: There is provided an electronic part that has a substrate, an insulating layer formed on the substrate and a pad formed on the insulating layer and is electrically connected with an external terminal and that further includes a cavity formed at least at either one of the substrate corresponding to a bottom surface of the electrode pad and a region of the insulating layer. It provides a highly reliable electronic part, its fabrication method as well as an acceleration sensor using the electronic part and its fabrication method.

Abstract: The invention relates to devices and methods, which relate to the arrangement of a sensor on the shaft of a rail vehicle.

Abstract: A sensor unit has a reference base. An acceleration sensor block and angular velocity sensor support rods are arranged on the reference base, using a bottom face and one side face of the reference base as reference faces. Three acceleration sensors, which detect accelerations that act in the directions in which an X-axis, a Y-axis, and a Z-axis extend, are fitted to three faces of the acceleration sensor block, respectively. Three angular velocity sensors, which detect angular velocities about the X-axis, the Y-axis, and the Z-axis, are fitted to boards that are fitted, via rubber bushings serving as vibration-proofing rubber members, to the angular velocity sensor support rods with screws, respectively.

Abstract: An angular velocity sensor includes: a package housing a vibrator to sense an angular velocity; a mounting portion mounting the package, the mounting portion having a first terminal for making a connection with the package; a second terminal for making an external connection, and a resin portion covering the first and second terminals so that a part of the first terminal and a part of the second terminal are exposed; and a cover having a joint portion made of a metal and covering the package, the cover being fixed to the mounting portion by joining the joint portion to a joint terminal made of a metal and provided to the mounting portion.

Abstract: A clamshell device having a dual accelerometer detector includes a first keyboard portion including a first accelerometer, a second display portion including a second accelerometer, a hinge for coupling the first portion to the second portion, and circuitry coupled to the first and second accelerometers for providing an output signal in response to the position of the first and second portions of the clamshell device. The output signal is provided to indicate a shutdown or standby mode, tablet operation mode, a partially shut or power savings mode, a normal operating mode, or an unsafe operating mode.

Abstract: With a certain pipeline, either buried or deposited on a sea/lake bottom, the formation of critical faults is determined and localized, which arise in the walls of the pipeline, or the development of an already localized fault is monitored, through sensors regularly distributed along the pipeline, and fixed to the same by means of a plate equipped with a pass-through hole in which the sensor is inserted.

Abstract: An electronic device is provided that is able to detect noise to which the electronic device is exposed and an internal temperature of the device. The device contains a cooling unit to cool at least a portion of the electronic device and a subsystem coupled to the microphone and/or a thermal sensor and further coupled to the cooling unit. The cooling unit adjusts according to the detected noise and internal temperature. A method for cooling an electronic device is also provided. The method comprises monitoring the noise of the device's ambient environment, monitoring an internal temperature of the device, and actuating a user interface. The method provides for cooling the device by adjusting fan speed, clock speed, or power supply voltage applied to the device based on the noise of the ambient environment, an internal temperature of the device, and actuation of the user interface.

Abstract: A mounting and suspension system for mounting non-contact sliding measurement devices to the side of objects that slide on snow or ice like skis, snowboards, sleds, luges, and ice skates. A base component permanently attached to the sliding object allows a quick disconnect of the rest of the device. A linkage component permits the retraction of the measurement device relative to the sliding object in such a way that the measurement device remains aligned with the surface being measured while minimizing lateral displacement and fully retracted vertical height such that accurate measurement is obtained at any angle of sliding object relative to the surface of snow or ice. A bias device keeps the measurement device in firm contact with the surface without interfering with the use of the sliding object. A safety device prevents injury to user and damage to measurement device in case of impact with an external obstacle or fall.

Abstract: First and second semiconductor layers are attached to each other with an insulation layer sandwiched therebetween. An acceleration sensor device is formed in the first semiconductor layer. A control device for controlling the acceleration sensor device is formed on the second semiconductor layer. Through holes are formed in the second semiconductor layer, and an insulation layer is formed to cover the wall surfaces of the through holes. Through interconnections are formed within the through holes for electrically connecting the acceleration sensor device and the control device to each other. Accordingly, it is possible to obtain an acceleration sensor having excellent detection accuracy while having a reduced size, and a fabrication method thereof.

Abstract: A motorcycle wheel speed sensor mounting structure, includes an axle holder for supporting a front wheel is disposed below a front fork of the motorcycle and an axle support disposed in a lower part of the axle holder. Further, a caliper mount, for supporting a brake caliper of a disc brake, is disposed on a rear portion of the axle holder and a wheel speed sensor is mounted on the caliper mount, wherein the wheel speed sensor is located above a line connecting a lower end of the axle support to a lower end of the caliper mount.

Abstract: A physical quantity sensor includes a sensor portion, a casing, and a vibration isolator. The casing includes a supporting portion with a supporting surface that is located to face an end surface of the sensor portion. The vibration isolator is located between the end surface of the sensor portion and the supporting surface of the casing to join the sensor portion to the casing. The vibration isolator reduces a relative vibration between the sensor portion and the casing.

Abstract: A motion sensor includes a substrate at least having one micromechanical acceleration sensor and a magnetoresistive circuit. The micromechanical acceleration sensor and the magnetoresistive circuit are constructed on the same substrate.

Abstract: A door assembly includes a first door skin and a second door skin spaced apart from the first door skin. The assembly also includes an energy sensor generating an energy signature signal and a memory storing a door component operating signature. A controller is coupled to the accelerometer and forms a comparison of the energy signature signal to the door component operating signature and generates a door component operation status signal in response to the comparison.

Abstract: An impact resistant speed sensing object having an inner body with a processor and at least one speed detecting sensors adapted to engage the inner body and adapted to interact with the processor for determining the speed of the impact resistant speed sensing object. The impact resistant speed sensing object further includes an impact resistant housing having apertures adapted to receive the inner body and the speed detecting sensor. The impact resistant speed sensing object has an aperture adapted to receive the impact resistant housing with the inner body and speed detecting sensor.

Abstract: A composite sensor includes an external holding portion, an internal holding portion supported within the external holding portion via coupling portion, and a vibration-type angular velocity sensor element and an acceleration sensor element disposed within the internal holding portion, and is configured so that the internal holding portion is held in such a manner so as to substantially suppress a movement of the acceleration sensor element along a detection direction while to allow a movement of the vibration-type angular velocity sensor element in a direction in which it receives Coriolis force at least by an angular velocity. A reduction of the composite sensor in size can be achieved by this structure.

Abstract: A lead frame includes a frame body defining an internal region, a plurality of leads extending from the frame body, and first and second stages that are disposed in the internal region. The first and second stages are sloped and are parallel to a first line along which a primary stream of a molten resin runs, so that slope angles of the stages are not substantially changed by the injection of the molten resin into the cavity.

Abstract: A vehicle sensor assembly includes a housing assembly and a printed circuit board having a plurality of electronic components provided thereon, mounted in the housing assembly. A connector interface is integrally formed with the housing assembly by a polymer overmold. The connector interface includes a shroud member. The shroud member is made of a polymer harder than the polymer overmold.

Abstract: Systems and methods for potted shock isolation are provided. In once embodiment a shock isolation system comprises an isolator comprising an outer ring for mounting to an external housing, and an inner ring connected to the outer ring via an isolating element; and an inertial sensing assembly comprising: at least one circuit board secured to the inner ring of the isolator, the at least one circuit board further comprising a triad of gyroscopes and a triad of accelerometers; and a low durometer highly dampened supporting material encapsulating a first surface of the at least one circuit board.

Abstract: Packaging techniques for planar resonator gyroscopes, such as disc resonator gyroscopes (DRGs) are disclosed. A gyroscope die may be attached to its package substrate on a central disc area that is inboard of its embedded electrodes. This configuration eliminates contact of the die with the package substrate beneath the embedded electrodes allowing the internal electrode support structure to expand or contract freely without stress as its temperature changes. The central attachment can also be used diminish the package temperature gradients on the periphery of the die, if the thermal conductivity of the central disc attachment material is higher than the package substrate. Temperature gradients across the resonator also lead to thermoelastic damping asymmetry and rate drift. In addition, the electrical connections to the die may be formed by vertical vias within the central disc attachment area or by thin wirebonds to peripheral I/O pads on the gyro chip.

Abstract: Although a weight part of an acceleration sensor chip fixed on a die pad is coated with a gelatinous resin part of low elasticity, the weight part is easily displaced by an external acceleration. Thus, an acceleration can be detected with accuracy. Furthermore, long-term reliability equal to those of regular resin packages is ensured because those portions of an acceleration sensor device which are not used for acceleration sensing are sealed with a resin part.

Abstract: A transducer package 20 includes a substrate 32 having a first axis of symmetry 36 and a second axis of symmetry 38 arranged orthogonal to the first axis of symmetry 36. At least a first sensor 50 and a second sensor 52 each of which are symmetrically arranged on the substrate 32 relative to one of the first and second axes of symmetry 36 and 38.The first and second sensors 50 and 52 are adapted to detect movement parallel to the other of the first and second axes of symmetry 36 and 38. The first sensor 50 is adapted to detect movement over a first sensing range and the second sensor 52 is adapted to detect movement over a second sensing range, the second sensing range differing from the first sensing range.

Abstract: An inertial measurement unit comprises a mounting plate with an opening therethrough, and a sensor assembly disposed in the opening of the mounting plate. Upper and lower support shells having shell flanges are attached to upper and lower surfaces of the mounting plate. The upper and lower support shells surround the sensor assembly. A plurality of gas bearing pads each extends through apertures in the upper and lower support shells. Upper and lower gas plenums have plenum flanges attached to the shell flanges of the upper and lower support shells, with the upper and lower gas plenums surrounding the upper and lower support shells. Pressure relief valves are coupled to the plenum flanges of the upper and lower gas plenums. The gas bearing pads and the sensor assembly are separated by a gap when pressurized gas is fed into the upper and lower gas plenums, thereby creating a gas bearing that allows the sensor assembly to be freely suspended and rotated in all directions.

Abstract: The MEMS Sensor Suite on a Chip provides the capability, monolithically integrated onto one MEMS chip, to sense temperature, humidity, and two axes of acceleration. The device incorporates a MEMS accelerometer, a MEMS humidity sensor, and a MEMS temperature sensor on one chip. These individual devices incorporate proof masses, suspensions, humidity sensitive capacitors, and temperature sensitive resistors (thermistors) all fabricated in a common fabrication process that allows them to be integrated onto one micromachined chip. The device can be fabricated in a simple micromachining process that allows its size to be miniaturized for embedded and portable applications. During operation, the sensor suite chip monitors temperature levels, humidity levels, and acceleration levels in two axes. External circuitry allows sensor readout, range selection, and signal processing.

Abstract: A mounting system for a MEMS device includes a proof mass selectively coupled to a substrate using a centrally located, single anchor mount that minimizes sensitivity to strain variations experienced by the MEMS device. The mounting system may include isolation cuts arranged in the proof mass to advantageously achieve a desired amount of strain isolation and to produce hinges that extend in opposite directions from the anchor mount. The single anchor mount is arranged to reduce a separation distance from a mid-point or centroid of the anchor mount to its perimeter as compared to conventional mounting schemes that have multiple anchor mounts positioned distally from a common mid-point.

Abstract: A method of mounting in-plane sensors of an inertial measurement unit. The method includes the steps of: providing a structure having first and second planar surfaces oriented orthogonally to one another, positioning a plurality of sensors on the first planar surface such that each of the sensors has a sense axis extending parallel to the first planar surface, positioning at least one other sensor on the second planar surface such that the at lease one other sensor has a sense axis extending parallel to the second planar surface, and orienting the sensors on the first and second surfaces so that the angles formed between any two sense axes are equal.

Abstract: When a vehicle speed sensor is provided as a separate unit, the vehicle sensor should be removed when a vehicle wheel is changed. A brake caliper is fitted to an upper stay and a lower stay formed at a lower part of the front fork supporting the front wheel. The sensor stay is fitted to the inside of the lower stay in the vicinity of the brake caliper. A sensor cover is fastened integrally in an overlapping manner to the outside of the sensor stay. A projection formed on the sensor cover overlaps with a fitting bolt of the brake caliper. Thus, it is not possible to remove the brake caliper without first removing the sensor cover. Further, a vehicle speed sensor is sandwiched by the sensor stay and the lower end of the sensor cover and the three members are fastened together.

Abstract: An inertial measurement unit is described that includes a first subassembly comprising one or more inertial sensors, a second subassembly comprising support electronics for the one or more inertial sensors, and at least one pair of mating connectors configured to provide an interface between the first subassembly and the second subassembly.

Abstract: System and method for enabling direct determination of rigid body motion using data collected from a plurality of independent accelerometers are disclosed. A mechanical object that can be theoretically emulated as a rigid body is instrumented with a plurality of accelerometers at different locations. Direct determination of rigid body motion at a location of interest includes following operations at each solution time step: transform local acceleration to global, integrate accelerations to obtain velocities, calculate direction cosine matrix using the angular velocity matrix, form a first set of redundant equations, obtain the angular velocity by solving the first set of equations using either least squares fitting or a selective Gaussian elimination scheme, form a second set of redundant equations and obtain the translational velocity by solving the second set of equations using either the averaged value or a pre-defined rule such as minimizing the contribution from the rotational term.

Abstract: An example geolocation system for mounting on a mammal incorporates simple sensing sleeves on the calves of the body support members, combined with an accelerometer based gravity direction and force sensing at the center of mass of the body. The example system is connected to a digital processing unit and a battery power supply to integrate the sensing to determine kinetic and potential energy of the body locomotion over time in a method that integrates out the aperiodic motion of the body about the center of mass, and uses the residual motion to measure the center of mass locomotion from a known point.

Abstract: A circuit board mounting system in one example comprises an improved mounting system for a circuit board disposed between housing elements, wherein the improvement comprises a plurality of slots formed in the circuit board and a plurality of bushings disposed within the slots, such that the housing elements rest on opposed ends of the bushings, and the circuit board moves in a plane substantially parallel to its mounting surfaces in response to changes in temperature, thus reducing thermal stress.

Abstract: Piezomagnetic, magneto-strictive, or electro-strictive material particles may also be distributed throughout the structural material of the structural member, which serve to amplify and otherwise enhance the signals from the piezoelectric material particles. The piezoelectric, electro-strictive, magneto-strictive, and/or piezomagnetic material particles may allow the structural member to exhibit an electrical and/or magnetic response to forces on the structural member, such as accelerations. This may allow the structural member to function as a force sensor or an accelerometer. Signals induced by such external forces or accelerations may be taken from the conductive pickups and used for various operations, for example, for arming a warhead of a missile or for triggering passenger safety features such as air bags in automobiles.

Abstract: An angular rate sensor includes a sensor chip having an oscillator vibrating at a predetermined frequency and detecting an angular velocity applied to this oscillator around a predetermined rotation axis. A circuit chip, laminated with the sensor chip, has a circuit formed on a surface thereof to detect the angular velocity based on a signal obtained from the sensor chip. The sensor chip and the circuit chip are bonded with an adhesive film. A resonance frequency of the sensor chip is smaller than (½)1/2 times a driving frequency of the oscillator in a condition that adjustment is applied to at least one of configuration or elastic coefficient of the adhesive film.

Abstract: Systems and methods for forming an electronic assembly are provided. A first inertial sensor having a first sense axis is attached to a bracket. A second inertial sensor having a second sense axis is attached to the bracket such that the second sense axis is substantially orthogonal to the first sense axis. The bracket is attached to a circuit board having at least one microelectronic device mounted thereto.

Abstract: The invention relates to a method for mounting sensors (40), e.g. rpm sensors, on a support plate (10) of a control module. The method comprises the following steps: a cylindrical sensor (40) is oriented and is inserted into a tubular sensor dome (18) of the support plate (10) in the mounting direction (56). An assembly dimension (88) for the sensor is then set as the distance between the face of the sensor and a top side (16) of the support plate (10). A positive connection between the sensor (40) and the sensor dome (18) is established by introducing a fixing material (68) into a hollow space (64), and a positive or a bonding sensor contact (76) between the sensor (40) and contacts (70) located at the support plate end is created when the sensor (40) is inserted into the sensor dome (18).

Abstract: The shock isolation system for an inertial sensor arrangement, on the one hand, causes an advantageous moment of inertia by the special arrangement of the individual sensors, especially of the gyroscope used. On the other hand, an advantageous long interval of the required shock-absorbing components (“shock mounts”) is provided by the use of several tubular shells. A measurement device with this inertial sensor arrangement thus achieves improved accuracy and reliability.

Abstract: Electromechanical systems utilizing suspended conducting nanometer-scale beams are provided and may be used in applications, such as, motors, generators, pumps, fans, compressors, propulsion systems, transmitters, receivers, heat engines, heat pumps, magnetic field sensors, kinetic energy storage devices and accelerometers. Such nanometer-scale beams may be provided as, for example, single molecules, single crystal filaments, or nanotubes. When suspended by both ends, these nanometer-scale beams may be caused to rotate about their line of suspension, similar to the motion of a jumprope (or a rotating whip), via electromagnetic or electrostatic forces. This motion may be used, for example, to accelerate molecules of a working substance in a preferred direction, generate electricity from the motion of a working substance molecules, or generate electromagnetic signals. Means of transmitting and controlling currents through these beams are also described.

Abstract: According to the present invention, a package for an acceleration sensor, includes an acceleration sensor which is proved with a first terminal; a package base; an adhesive layer provided on the package base; and a spacer provided between the adhesive layer and the acceleration sensor. The spacer comprises a second terminal, which is electrically coupled to the first terminal of the acceleration sensor.

Abstract: Although a weight part of an acceleration sensor chip fixed on a die pad is coated with a gelatinous resin part of low elasticity, the weight part is easily displaced by an external acceleration. Thus, an acceleration can be detected with accuracy. Furthermore, long-term reliability equal to those of regular resin packages is ensured because those portions of an acceleration sensor device which are not used for acceleration sensing are sealed with a resin part.

Abstract: A bracket for securely positioning an anti-lock braking system sensor on a heavy-duty vehicle axle adjacent to wheel hub tone ring teeth is formed from a single piece of robust material such as sheet steel. A steel blank of a certain size and shape preferably is stamped from the sheet steel and is formed by a multi-stage process into the final bracket configuration. The bracket includes a tubular portion formed with a continuous opening for receiving the sensor and a retaining sleeve. A pair of spaced-apart, parallel rearwardly extending bracket feet ensure proper positioning of the sensor relative to the tone ring teeth, and enable use of the bracket in various applications having different wheel hub and/or axle spindle configurations.

Abstract: An angular rate sensor includes: a substrate; a drive-purpose vibrator capable of vibrating in a first direction; and an angular velocity detection-purpose vibrator capable of vibrating in a second direction. The sensor detects an angular velocity on the basis of vibration of the angular velocity detection-purpose vibrator in the second direction caused by a Coriolis force, when the drive-purpose vibrator is vibrated in the first direction, and the angular velocity is applied to the sensor in a third direction. The angular velocity detection-purpose vibrator has a length along with the second direction and a width along with the first direction. A ratio between the width and the length is equal to or larger than 0.1.

Abstract: A semiconductor device includes a package having a cavity in the interior thereof, a support member that extends out from a face of the cavity, and a semiconductor element fixed to the support member without contacting the faces that form the cavity.