Specific Type Of Electric Sensor Or Specific Type Of Magnetic Sensor Patents (Class 73/514.16)
  • Patent number: 10281269
    Abstract: A method for determining a height (hs) of a settled bed in a mixture in a loading space (1). The mixture consists of a settled bed (5) and a mixture soup (3) which is located above the settled bed (5). The method includes: a) providing an elongated resonance member (10) in the loading space (1) which extends in a substantial vertical direction, b) measuring a resonance frequency (fo) of the resonance member (10), c) computing a height (hs) of the settled bed (5), Action b) includes determining an indication of or imposing the tensile force (Fs) acting in the longitudinal direction of the resonance member (10) and c) includes computing a height (hs) of the settled bed (5) based on the measured resonance frequency (fo) and the determined indication of the tensile force or the imposed tensile force.
    Type: Grant
    Filed: July 17, 2013
    Date of Patent: May 7, 2019
    Assignee: IHC Holland IE B.V.
    Inventor: Cornelis De Keizer
  • Patent number: 10254305
    Abstract: An inertial sensor includes a base portion, a weight portion, a connection portion, and a first sensing element unit. The connection portion connects the weight portion and the base portion and is capable of being deformed in accordance with a change in relative position of the weight portion with respect to the position of the base portion. The first sensing element unit is provided on a first portion of the connection portion and includes a first magnetic layer, a second magnetic layer, and a nonmagnetic first intermediate layer. The nonmagnetic first intermediate layer is provided between the first magnetic layer and the second magnetic layer.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: April 9, 2019
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hideaki Fukuzawa, Michiko Hara, Yoshihiko Fuji, Yoshihiro Higashi, Shiori Kaji, Akio Hori, Tomohiko Nagata, Akiko Yuzawa, Akira Kikitsu
  • Patent number: 10209269
    Abstract: Described herein is a microelectromechanical detection structure, provided with: a substrate having a top surface extending in a plane; a detection-electrode arrangement; an inertial mass, suspended above the substrate and the detection-electrode arrangement; and elastic elements, coupling the inertial mass to a central anchorage element fixed with respect to the substrate, in such a way that it is free to rotate about an axis of rotation as a function of a quantity to be detected along a vertical axis, the central anchorage element being arranged at the axis of rotation. A suspension structure is coupled to the detection-electrode arrangement for supporting it, suspended above the substrate and underneath the inertial mass, and is anchored to the substrate via at least one first anchorage region; the fixed-electrode arrangement is anchored to the suspension structure via at least one second anchorage region.
    Type: Grant
    Filed: September 18, 2015
    Date of Patent: February 19, 2019
    Assignee: STMICROELECTRONICS S.R.L.
    Inventor: Alessandro Tocchio
  • Patent number: 10101158
    Abstract: A circuit for an angular velocity sensor as a circuit for a physical quantity sensor according to an embodiment of the invention includes a drive circuit that generates a drive signal that drives a driver to vibrate and a switch circuit that switches a state in which a detector that outputs a detection signal in accordance with a physical quantity is electrically continuous with the drive circuit or a state in which the detector is not electrically continuous with the drive circuit to the other state.
    Type: Grant
    Filed: April 15, 2016
    Date of Patent: October 16, 2018
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Masahiro Oshio
  • Patent number: 10088923
    Abstract: An operation input device provided in a vehicle and operated by a hand or a finger of a driver to carry out an input according to a movement amount of the hand or the finger of the driver is provided. The operation input device includes a time series signal generator that detects the movement amount and generates a time series signal of the movement amount, an input operation accepter that accepts an input operation of the driver based on the time series signal, and a band attenuation filter that is provided between the time series signal generator and the input operation accepter and attenuates, of signal components of the time series signal, a signal component from a predetermined first frequency to a predetermined second frequency larger than the first frequency.
    Type: Grant
    Filed: March 9, 2015
    Date of Patent: October 2, 2018
    Assignee: DENSO CORPORATION
    Inventors: Shinji Hatanaka, Tetsuya Tomaru
  • Patent number: 10001504
    Abstract: There is provided an acceleration detecting device capable of using a flat plate-like packaging substrate having no recess portion as a packaging substrate and reducing the height thereof. In an acceleration detecting device, an acceleration detecting element is held by first and second holding members therebetween so as to configure a plate-like structure. In the plate-like structure, at least one of a third surface and a fourth surface of the acceleration detecting element is located at the inner side relative to first holding member surfaces or second holding member surfaces of the first and second holding members in the thickness direction connecting the third surface and the fourth surface.
    Type: Grant
    Filed: April 22, 2015
    Date of Patent: June 19, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Eriko Nishioka, Tsuyoshi Futamata
  • Patent number: 9914639
    Abstract: A MEMS device is provided with: a supporting base, having a bottom surface in contact with an external environment; a sensor die, which is of semiconductor material and integrates a micromechanical detection structure; a sensor frame, which is arranged around the sensor die and is mechanically coupled to a top surface of the supporting base; and a cap, which is arranged above the sensor die and is mechanically coupled to a top surface of the sensor frame, a top surface of the cap being in contact with an external environment. The sensor die is mechanically decoupled from the sensor frame.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: March 13, 2018
    Assignee: STMicroelectronics S.r.l.
    Inventors: Enri Duqi, Sebastiano Conti
  • Patent number: 9809447
    Abstract: A pressure sensor using the MEMS device comprises an airtight ring surrounding a chamber defined by the first substrate and the second substrate. The airtight ring extends from the upper surface of the second substrate to the interface between the first substrate and the second substrate and further breaks out the interface. The pressure sensor utilizes the airtight ring to retain the airtightness of the chamber.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: November 7, 2017
    Assignee: MIRAMEMS SENSING TECHNOLOGY CO., LTD.
    Inventors: Yu-Hao Chien, Li-Tien Tseng
  • Patent number: 9612254
    Abstract: Microelectromechanical system (MEMS) devices and methods for forming MEMS devices are provided. The MEMS devices include a substrate, an anchored structure fixedly coupled to the substrate, and a movable structure resiliently coupled to the substrate. The movable structure has an opening formed therethrough and is positioned such that the anchored structure is at least partially within the opening and is in a capacitor-forming relationship with the movable structure. The movable structure comprises a movable structure finger extending only partially across the opening.
    Type: Grant
    Filed: June 27, 2014
    Date of Patent: April 4, 2017
    Assignee: NXP USA, Inc.
    Inventor: Michael Naumann
  • Patent number: 9499393
    Abstract: Stress relief structures and methods that can be applied to MEMS sensors requiring a hermetic seal and that can be simply manufactured are disclosed. The system includes a sensor having a first surface and a second surface, the second surface being disposed away from the first surface, the second surface also being disposed away from a package surface and located between the first surface and the package surface, a number of support members, each support member extending from the second surface to the package surface, the support members being disposed on and operatively connected to only a portion of the second surface. The support member are configured to reduce stress produced by package-sensor interaction.
    Type: Grant
    Filed: February 6, 2015
    Date of Patent: November 22, 2016
    Assignee: MKS Instruments, Inc.
    Inventors: Lei Gu, Stephen F. Bart
  • Patent number: 9404938
    Abstract: An acceleration sensor where the accuracy of acceleration detection is unlikely to fall even when the ambient temperature changes. A piezoelectric substrate includes a polarized central portion and first and second end portions. A first electrode is formed on a first main surface of the piezoelectric substrate so as to extend from the first end portion to the second end portion. A second electrode is formed inside the piezoelectric substrate so as to extend across the second end portion and the central portion. The second electrode opposes the first electrode in the central portion in a thickness direction. A supporting member clamps the second end portion. The piezoelectric substrate is formed such that a distance between the first electrode and the second electrode in the second end portion is greater than a distance between the first electrode and the second electrode in the central portion.
    Type: Grant
    Filed: June 12, 2013
    Date of Patent: August 2, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Takamasa Kuboki
  • Patent number: 9397015
    Abstract: A semiconductor device has an insulating substrate, a semiconductor element which is mounted on the insulating substrate, a hollow casing which surrounds a peripheral edge of the insulating substrate to contain the semiconductor element therein, and a sealing material which is charged into the casing to seal the inside of the casing. The casing has protrusion portions each of which partially protrudes from an upper surface of the casing. Thus, it is possible to provide a semiconductor device in which poor external appearance or lowering of adhesion to a cover can be prevented even when a sealing material is injected up to the vicinity of an upper surface of a casing.
    Type: Grant
    Filed: March 9, 2015
    Date of Patent: July 19, 2016
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Naoki Saegusa, Takashi Katsuki
  • Patent number: 9369809
    Abstract: A MEMS component for generating pressure pulses is provided, its micromechanical structure including at least three function levels: a first function level in which at least one stationary trench structure is implemented, a second function level, which is implemented above the first function level and includes at least one triggerable displacement element as well as through-openings as pressure outlet openings, the displacement element protruding into the trench structure and being movable in parallel with the function levels, whereby positive and negative pressure pulses are generated, and a third function level, which is implemented above the second function level and includes at least one triggerable cover element for at least one part of the pressure outlet openings in the second function level.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: June 14, 2016
    Assignee: Robert Bosch GmbH
    Inventors: Jochen Zoellin, Ricardo Ehrenpfordt, Rolf Scheben
  • Patent number: 9362479
    Abstract: A semiconductor sensor device includes a device substrate, a micro-controller unit (MCU) die attached to the substrate, and a packaged pressure sensor having a sensor substrate and a pressure sensor die. The sensor substrate has a front side with the pressure sensor die attached to it, a back side, and an opening from the front side to the back side. A molding compound encapsulates the MCU die, the device substrate, and the packaged pressure sensor. A back side of the sensor substrate and the opening in the sensor substrate are exposed on an outer surface of the molding compound.
    Type: Grant
    Filed: July 22, 2014
    Date of Patent: June 7, 2016
    Assignee: FREESCALE SEMICONDUCTOR, INC.
    Inventor: Wai Yew Lo
  • Patent number: 9331006
    Abstract: A semiconductor device includes a substrate that is made of a semiconductor material and has a main surface formed with a recess. The semiconductor device also includes a wiring layer formed on the substrate, an electronic element housed in the recess, and a sealing resin covering at least a part of the electronic element.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: May 3, 2016
    Assignee: ROHM CO., LTD.
    Inventors: Yuichi Nakao, Yasuhiro Fuwa
  • Patent number: 9305895
    Abstract: A package substrate includes a core layer having a first surface and a second surface which are opposite to each other, a ball land pad disposed on the first surface of the core layer, an opening that penetrates the core layer to expose the ball land pad, and a dummy ball land disposed on the second surface of the core layer to surround the opening. The dummy ball land includes at least one sub-pattern and at least one vent hole. Related semiconductor packages and related methods are also provided.
    Type: Grant
    Filed: April 25, 2014
    Date of Patent: April 5, 2016
    Assignee: SK HYNIX INC.
    Inventors: Jong Woo Yoo, Qwan Ho Chung
  • Patent number: 9255940
    Abstract: A sensor includes: a substrate on which an active chip including a semiconductor circuit is disposed; and a passive chip including an acceleration sensor, and a thick portion and a thin portion, the thick portion being disposed on the substrate so as to be in contact therewith. An active chip terminal is disposed on the active chip. A passive chip terminal is disposed on the passive chip at the thin portion. The passive chip terminal and the active chip terminal face each other and are connected via a bump.
    Type: Grant
    Filed: January 21, 2014
    Date of Patent: February 9, 2016
    Assignee: Seiko Epson Corporation
    Inventor: Satoshi Nakajima
  • Patent number: 9201089
    Abstract: A fiber optical accelerometer comprising a base structure, a first seismic mass movably coupled to the base structure through a first hinge element, a second seismic mass movably coupled to the base structure through a second hinge element, an optical fiber coupled to the first and second seismic masses at first and second attachment joints, respectively, to subject the optical fiber to varying strain by displacement of the first and second seismic masses about the first and second hinge structures, respectively.
    Type: Grant
    Filed: May 10, 2011
    Date of Patent: December 1, 2015
    Assignee: Brüel & Kjær Sound & Vibration Measurement A/S
    Inventors: Søren Andresen, Torben Rask Licht
  • Patent number: 9182423
    Abstract: A thermal convection type angular accelerometer includes an insulating substrate and an angular acceleration sensing device. The angular acceleration sensing device is disposed on the insulating substrate. The angular acceleration sensing device is configured to measure an angular acceleration of a rotation axis. The angular acceleration sensing device comprises a sensing group. The sensing group comprises two temperature sensing members and a heater disposed between the two temperature sensing members. The distance between two ends of the two temperature sensing members near the rotation axis is greater than the distance between the other two ends of the two temperature sensing members that are farther from the rotation axis.
    Type: Grant
    Filed: July 1, 2013
    Date of Patent: November 10, 2015
    Assignee: CHUNG HUA UNIVERSITY
    Inventor: Jium Ming Lin
  • Patent number: 9121785
    Abstract: A non-powered impact recorder is disclosed. The non-powered impact recorder includes a resonator tuned for a resonant response within a predetermined frequency range. A reduced cross-sectional area portion is formed within the resonator and configured to structurally fail when the resonator experiences the resonant response. Additionally, the non-powered impact recorder includes an electric circuit element disposed about the reduced cross-sectional area portion of the resonator. Upon structural failure of the resonator, the electric circuit element is broken to cause a discontinuity in the electric circuit element. Interrogation of the discontinuous electric circuit element facilitates approximation of impact frequency and/or impact energy.
    Type: Grant
    Filed: April 24, 2012
    Date of Patent: September 1, 2015
    Assignee: Sarcos LC
    Inventor: Fraser M. Smith
  • Patent number: 9046366
    Abstract: A signal processing circuit includes an I/V conversion circuit (current/voltage conversion section) that converts an oscillation current of a vibrator into a voltage, an RC filter (phase shift section) that shifts a phase of the output signal of the I/V conversion circuit, a full-wave rectifier (part of a drive amplitude control section) that binarizes a signal that has been shifted in phase to generate a switch control signal, a comparator (reference signal generation section) that generates a reference signal for synchronous detection based on the output signal of the I/V conversion circuit, and an EXOR circuit (clock signal generation section) that generates a clock signal for a switched capacitor filter (SCF) that has a frequency twice a frequency of a drive signal based on a phase difference between the reference signal and the switch control signal.
    Type: Grant
    Filed: February 24, 2012
    Date of Patent: June 2, 2015
    Assignees: SEIKO EPSON CORPORATION, SEIKO NPC CORPORATION
    Inventors: Yoshinao Yanagisawa, Masahiro Oshio, Takayuki Kikuchi, Toshihiro Nishida, Masayuki Takahashi
  • Publication number: 20150122023
    Abstract: A micromechanical sensor device, having a first unhoused sensor unit, and at least one second unhoused sensor unit, the sensor units being functionally connected to one another, the sensor units being essentially vertically configured one over the other so that a sensor unit having a larger footprint completely covers a sensor unit having a smaller footprint.
    Type: Application
    Filed: November 6, 2014
    Publication date: May 7, 2015
    Inventors: Jens FREY, Arnd KAELBERER, Jochen REINMUTH, Johannes CLASSEN
  • Patent number: 9016124
    Abstract: An acceleration-triggered or shock-triggered, smart, tunable MEMS switch that may function as both a classic accelerometer and an acceleration threshold detector. A parallel element MEMS device has a stationary and a movable element forming a capacitor. Varying acceleration moves the movable member with respect to the stationary member, thereby changing the capacitance of the device. The capacitance varying may be used, in cooperation with appropriate circuitry, to provide a signal representative of instantaneous acceleration. By applying a biasing voltage, the movable element may be positioned in a predetermined fashion such that acceleration of a predetermined magnitude causes the movable element to pull in (snap down). The movable and stationary elements may function as a switch such that when the predetermined acceleration or shock level occurs, electrodes close, a current flows between the elements so that an external device such as an air bag may be activated.
    Type: Grant
    Filed: September 4, 2012
    Date of Patent: April 28, 2015
    Assignee: The Research Foundation for The State University of New York
    Inventor: Mohammad I. Younis
  • Publication number: 20150096376
    Abstract: In accordance with one embodiment, a single chip combination inertial and pressure sensor device includes a substrate, an inertial sensor including a movable sensing structure movably supported above the substrate, and a first fixed electrode positioned adjacent to the movable sensing structure, and a pressure sensor including a gap formed in the sensor at a location directly above the movable sensing structure, and a flexible membrane formed in a cap layer of the device, the flexible membrane defining a boundary of the gap and configured to flex toward and away from the gap in response to a variation in pressure above the flexible membrane.
    Type: Application
    Filed: October 2, 2014
    Publication date: April 9, 2015
    Inventors: Ando Feyh, Gary O'Brien
  • Patent number: 8978474
    Abstract: A micro-electro-mechanical systems (MEMS) inertial measurement system facilitates accurate location and/or attitude measurements via passive thermal management of MEMS inertial sensors. Accuracy of the system is also improved by subjecting the inertial sensors to programmed single-axis gimbal motion, and by performing coarse and fine adjustments to the attitude estimates obtained by the system based on the programmed motion and on the passive thermal management of the sensors.
    Type: Grant
    Filed: July 29, 2011
    Date of Patent: March 17, 2015
    Assignees: The Charles Stark Draper Laboratory, Inc., Massachusetts Institute of Technology
    Inventors: Matthew S. Bottkol, Richard D. Elliott, Michael Y. Feng, Thomas F. Marinis, Michael F. Mcmanus, Shan Mohiuddin, Peter G. Sherman, John E. Pritchett, Jeffery W. Warren, Charles H. Lange
  • Publication number: 20150007656
    Abstract: A method of controlling exposed glass charging in a micro-electro-mechanical systems (MEMS) device is disclosed. The method includes providing a MEMS device comprising a proof mass positioned apart from at least one sense plate and at least one outboard metallization layer, wherein at least one conductive glass layer is coupled to the sense plate and the outboard metallization layer, the conductive glass layer including at least one exposed glass portion near the proof mass; and applying a first voltage to the sense plate and a second voltage to the outboard metallization layer. The first voltage is separated from the second voltage by a predetermined voltage level such that the exposed glass portion has an average voltage corresponding to a voltage midway between the first voltage and the second voltage.
    Type: Application
    Filed: July 8, 2013
    Publication date: January 8, 2015
    Inventors: Mark W. Weber, Timothy J. Hanson
  • Publication number: 20140360268
    Abstract: Described herein is an accelerometer that can be sensitive to acceleration, but not anchor motion due to sources other than acceleration. The accelerometer can employ a set of electrodes and/or transducers that can register motion of the proof mass and support structure and employ and output-cancelling mechanism so that the accelerometer can distinguish between acceleration and anchor motion due to sources other than acceleration. For example, the effects of anchor motion can be cancelled from an output signal of the accelerometer so that the accelerometer exhibits sensitivity to only acceleration.
    Type: Application
    Filed: August 21, 2014
    Publication date: December 11, 2014
    Inventors: Jin Qiu, Joe Seeger, Alexander Castro, Igor Tchertkov, Richard Li
  • Patent number: 8893563
    Abstract: A differential capacitance torque sensor utilizes multiple voltage sources in order to compensate for inherent electrical asymmetries in the sensor. A first voltage source having a voltage V1 is electrically connected across a longitudinally-extending, conductive proof mass, a first upper capacitor C1 and the second lower capacitor C4. A second voltage source having a voltage V2 is connected in series with the first voltage source, a second upper capacitor C3 and a first lower capacitor C2, such that the voltage V2 is given by V 2 = ? ? + 1 ? V 1 , where ? is a parameter defined as ? = C 2 + C 3 C 1 + C 4 - 1.
    Type: Grant
    Filed: January 15, 2014
    Date of Patent: November 25, 2014
    Assignee: King Fahd University of Petroleum and Minerals
    Inventors: Samir Mekid, Igor Gilavdary
  • Patent number: 8890512
    Abstract: A device for visually indicating a change in the operational state of a proximity sensor. The device includes a transparent housing having a cavity and a magnet device for generating a magnetic field. In addition, a sleeve is attached to the housing. The magnet device is concealed within the sleeve in a first position to indicate a first operational state. When a target is positioned adjacent the sensor end, magnetic attraction occurs between the target and the magnet device due to the magnetic field to cause movement of the magnet device to a second position within the cavity wherein the magnetic field does not act on the proximity sensor to change the operational state from the first operational state to a second operational state. Further, the magnet device is visible in the second position to indicate the second operational state.
    Type: Grant
    Filed: June 8, 2011
    Date of Patent: November 18, 2014
    Assignee: Pentair Flow Services AG
    Inventors: Leo Minervini, Kevin Connell
  • Publication number: 20140251011
    Abstract: A single-axis tilt-mode microelectromechanical accelerometer structure. The structure includes a substrate having a top surface defined by a first end and a second end. Coupled to the substrate is a first asymmetrically-shaped mass suspended above the substrate pivotable about a first pivot point on the substrate between the first end and the second end and a second asymmetrically-shaped mass suspended above the substrate pivotable about a second pivot point on the substrate between the first end and the second end. The structure also includes a first set of electrodes positioned on the substrate and below the first asymmetrically-shaped mass and a second set of electrodes positioned on the substrate and below the second asymmetrically-shaped mass.
    Type: Application
    Filed: March 5, 2013
    Publication date: September 11, 2014
    Applicant: ANALOG DEVICES, INC.
    Inventors: Xin Zhang, Howard R. Samuels, Michael W. Judy
  • Patent number: 8829924
    Abstract: This invention relates to methods and apparatus for measuring physical properties using microwave cavity sensors. In operation, a number of microwave cavity sensors are interrogated by a remote wireless unit in order to determine the current resonant frequency for the sensor. The current values for various parameters measured by the sensors, such as temperature, stress/stain, or the like, are determined by comparing the current resonant frequency to a first resonant frequency of the sensor, and thus, detect any change in the value of the selected parameter. In particular, the present invention is directed toward extending the range over which such measurements may be performed, using these types of sensors.
    Type: Grant
    Filed: August 20, 2012
    Date of Patent: September 9, 2014
    Assignee: Smart Autonomous Solutions, Inc.
    Inventor: Naftaly Ramrajkar
  • Publication number: 20140238131
    Abstract: An inertial force sensor that can suppress fluctuation of detection sensitivity even if an external stress is applied to the inertial force sensor. Angular velocity sensor (1), that is, an inertial force sensor includes ceramic substrate (6), lower lid (4) adhering to ceramic substrate (6) with adhesives (11a and 11b) (first adhesives), and sensor element (2) adhering to lower lid (4) with adhesives (10a and 10b) (second adhesives). The elastic moduli of adhesives (11a and 11b) are smaller than those of adhesives (10a and 10b).
    Type: Application
    Filed: September 28, 2012
    Publication date: August 28, 2014
    Inventors: Shigehiro Yoshiuchi, Satoshi Ohuchi, Tsuyoshi Fujii, Kensaku Yamamoto, Hideo Ohkoshi
  • Patent number: 8770043
    Abstract: An object of this invention is to detect an external force or acceleration with good sensitivity using a simple configuration. An external force detection sensor comprises a comb electrode including a fixed electrode having a plurality of fixed combtooth portions and a movable electrode having a plurality of movable combtooth portions inserted between the fixed combtooth portions; a power supply connected to the fixed electrode and the movable electrode in order to cause vibration of the movable electrode at a prescribed resonance frequency through an electrostatic force on the fixed electrode; and detection means for detecting an external force based on a change in electrical characteristics between the fixed electrode and the movable electrode when the movable electrode is caused to vibrate.
    Type: Grant
    Filed: June 5, 2009
    Date of Patent: July 8, 2014
    Assignee: National University Corporation Shizuoka University
    Inventor: Gen Hashiguchi
  • Patent number: 8746067
    Abstract: A tunneling accelerometer includes a proof mass that moves laterally with respect to a cap wafer. Either the proof mass or the cap wafer includes a plurality of tunneling tips such that the remaining one of proof mass and the cap wafer includes a corresponding plurality of counter electrodes. The tunneling current flowing between the tunneling tips and the counter electrodes will thus vary as the proof mass laterally displaces in response to an applied acceleration.
    Type: Grant
    Filed: January 8, 2013
    Date of Patent: June 10, 2014
    Assignee: Tialinx, Inc.
    Inventors: Hector J. De Los Santos, Farrokh Mohamadi
  • Publication number: 20140150553
    Abstract: A sensor device includes a first CMOS chip and a second CMOS chip with a first moving-gate transducer formed in the first CMOS chip for implementing a first 3-axis inertial sensor and a second moving-gate transducer formed in the second CMOS chip for implementing a second 3-axis inertial sensor. An ASIC for evaluating the outputs of the first 3-axis inertial sensor and the second 3-axis inertial sensor is distributed between the first CMOS chip and the second CMOS chip.
    Type: Application
    Filed: December 2, 2013
    Publication date: June 5, 2014
    Applicant: Robert Bosch GmbH
    Inventors: Ando Feyh, Po-Jui Chen
  • Patent number: 8680849
    Abstract: A resolver apparatus can include a resolver driven gear, a resolver stator, a resolver rotor coupled to the resolver stator and a resolver rotor drive shaft coupled to the resolver rotor, wherein the resolver rotor drive shaft is spring loaded to the resolver driven gear.
    Type: Grant
    Filed: March 1, 2011
    Date of Patent: March 25, 2014
    Assignee: Hamilton Sundstrand Corporation
    Inventor: Richard A. Himmelmann
  • Patent number: 8643128
    Abstract: The present invention discloses an MEMS sensor and a method for making the MEMS sensor. The MEMS sensor according to the present invention includes: a substrate including an opening; a suspended structure located above the opening; and an upper structure, a portion of which is at least partially separated from a portion of the suspended structure; wherein the suspended structure and the upper structure are separated from each other by a step including metal etch.
    Type: Grant
    Filed: February 24, 2009
    Date of Patent: February 4, 2014
    Assignee: Pixart Imaging Incorporation
    Inventor: Chuan Wei Wang
  • Patent number: 8635910
    Abstract: An accelerometer module for use with a touch sensor on a device, a method of detecting acceleration using a touch sensor, and a computer program product for receiving the touch sensor data and producing output representative of acceleration. The accelerometer module provides a device with a touch sensor, such as a mobile phone, with the ability to sense acceleration, orientation, or both. The accelerometer module may sense acceleration along a single axis or multiple axis. Sensing acceleration along three axis may be useful for producing a handheld game controller or for providing input to many other applications. The accelerometer module applies a force against a deformable member to change the contact area between the deformable member and the touch sensor, wherein the contact area is a function of the amount of applied acceleration.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: January 28, 2014
    Assignee: International Business Machines Corporation
    Inventor: Robert Thomas Cato
  • Patent number: 8631703
    Abstract: A sensor includes: a first polymer sensor element generating a first voltage corresponding to a deformation thereof; a second polymer sensor element generating a second voltage corresponding to a deformation thereof; a fixing member fixing a first end of each of the first and the second polymer sensor elements while electrically insulating the first ends from each other; and a detector detecting an acceleration and an angular acceleration based on the first voltage derived from the first polymer sensor element and the second voltage derived from the second polymer sensor element.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: January 21, 2014
    Assignee: Sony Corporation
    Inventors: Nobuyuki Nagai, Yusaku Kato
  • Patent number: 8627719
    Abstract: A micromechanical sensor element includes: a substrate; a first seismic mass suspended from the substrate, which is deflectable from a first rest position by an acceleration acting perpendicularly to a main plane of extension; and a second seismic mass, which is deflectable from a second rest position by the acceleration. At least a partial overlap is provided between the first seismic mass and the second seismic mass perpendicular to the main plane of extension.
    Type: Grant
    Filed: July 9, 2009
    Date of Patent: January 14, 2014
    Assignee: Robert Bosch GmbH
    Inventors: Michael Offenberg, Michael Baus
  • Patent number: 8604777
    Abstract: An integrated circuit (IC) current sensor that self-calibrates to adjust its signal gain when employed in a current divider configuration is presented. The current sensor includes an integrated current conductor, a magnetic field transducer, a controllable gain stage and a calibration controller. The integrated current conductor is adapted to receive a portion of a calibration current. The calibration current corresponds to a full scale current. The magnetic field transducer, responsive to the calibration current portion, provides a magnetic field signal having a magnitude proportional to a magnetic field generated by the calibration current portion. The controllable gain stage is configured to amplify the magnetic field signal with an adjustable gain to provide an amplified magnetic field signal.
    Type: Grant
    Filed: July 13, 2011
    Date of Patent: December 10, 2013
    Assignee: Allegro Microsystems, LLC
    Inventors: Michael C. Doogue, Shaun D. Milano
  • Publication number: 20130283912
    Abstract: Apparatus and related fabrication methods are provided for a sensor device. An exemplary sensor device includes a first structure including a first sensing arrangement and a second sensing arrangement formed therein and a second structure affixed to the first structure. The second structure includes a cavity aligned with the first sensing arrangement to provide a first reference pressure on a first side of the first sensing arrangement and an opening aligned with the second sensing arrangement to expose the first side of the second sensing arrangement to an ambient pressure.
    Type: Application
    Filed: April 27, 2012
    Publication date: October 31, 2013
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventor: Yizhen Lin
  • Publication number: 20130283913
    Abstract: Embodiments of compact micro-electro-mechanical systems (MEMS) devices are provided, as are embodiments of methods for fabricating MEMS devices. In one embodiment, the MEMS device includes a substrate, a movable structure resiliently coupled to the substrate, and an anchored structure fixedly coupled to the substrate. The movable structure includes a first plurality of movable fingers, and a second plurality of movable fingers electrically isolated from and interspersed with the first plurality of movable fingers. The anchored structure includes fixed fingers interspersed with first and second pluralities of movable fingers in a capacitor-forming relationship. First and second interconnects are electrically coupled to the first and second pluralities of movable fingers, respectively.
    Type: Application
    Filed: April 27, 2012
    Publication date: October 31, 2013
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Yizhen Lin, Sung Jin Jo, Lisa Z. Zhang
  • Patent number: 8549920
    Abstract: An accelerometer has a substantially linear strain sensor with a transducer joined to the strain sensor. The transducer has a base that provides rigidity perpendicular to a preferred measurement direction. A plurality of outer flaps are joined to the base supporting the strain sensor. The outer flaps are capable of translating acceleration in the predefined direction to strain in the strain sensor. Two centermost flaps are positioned on either side of the center line of the transducer. Struts are joined between a lower portion of one the centermost flap and an uppermost portion of the nearest outer flap. The struts enhance strain by linking outer flap motion to the centermost flaps. Bridges are joined between each two adjacent outer flaps supporting the strain sensor.
    Type: Grant
    Filed: September 22, 2009
    Date of Patent: October 8, 2013
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Jason M. Maguire, Gregory H. Ames
  • Patent number: 8554495
    Abstract: Systems and methods for head impact injury prediction. A computer implemented method is provided for event based injury predictions. The computer implemented method receives an indication of sensor data related to an impact of a user. The received sensor data is compared to previously stored sensor data in a data store. Each instance of the previously stored sensor data is associated with a medical diagnosis. If the received sensor data matches any of the previously stored sensor data based on the comparison, then an injury risk indicator is generated based on at least one of the medical diagnosis associated with the matching previously stored sensor data or an impact history of the user. The generated indicator is presented.
    Type: Grant
    Filed: January 19, 2011
    Date of Patent: October 8, 2013
    Assignee: X2 Biosystems, Inc.
    Inventors: Christoph Mack, Marina Kuznetsova, Scott Votaw, Robert Snook
  • Patent number: 8544324
    Abstract: A sensor device, method of fabricating the same, and a method of sensing a physical quantity. The sensor device comprises a substrate; a flexure member, one end of the flexure member being attached to the substrate, and a free end of the flexure member having an edge surface; a counter surface formed on the substrate such that the counter surface faces the edge surface of the flexure member and such that a separation distance between the counter surface and the edge surface remains substantially constant for movement of the edge surface as a result of flexure of the flexure member, each of the edge surface and the counter surface including one or more conductor layers disposed in a plane substantially perpendicular to a flexure direction of the flexure member; and means for applying an electrical potential difference between the conductors of the edge surface and the conductors of the counter surface for detecting a quantum tunnelling current therebetween.
    Type: Grant
    Filed: August 24, 2007
    Date of Patent: October 1, 2013
    Assignee: Pilsne Research Co., L.L.C.
    Inventors: Marek Michalewicz, Peter Slodowy
  • Patent number: 8535185
    Abstract: A device (120) for acquiring and providing information which can be associated with a football player, said device comprising: an acceleration sensor (129) for detecting accelerations acting on the devices; a memory unit (121) for storing measured acceleration values with associated time stamps and an ID associated with the device (120); and a radio unit (128) for receiving a first radio signal (150) with a first time stamp, wherein the first radio signal represents a deformation of a ball, and for transmitting a second radio signal (160) including the ID associated with the device (120) in case that a check of the values in the memory unit shows that an acceleration was detected by the device at the corresponding time.
    Type: Grant
    Filed: November 17, 2009
    Date of Patent: September 17, 2013
    Assignee: Cairos Technologies AG
    Inventor: Walter Englert
  • Publication number: 20130228013
    Abstract: A physical quantity sensor includes a base section, a movable body having a movable electrode section, pivot sections connected to the movable body, and forming a pivot axis of the movable body, a fixation section fixed to the substrate, and adapted to support the movable body via the pivot sections, and a fixed electrode section disposed on the substrate so as to be opposed to the movable electrode section, and the fixation section is provided with opening sections disposed on a line of the pivot axis.
    Type: Application
    Filed: February 27, 2013
    Publication date: September 5, 2013
    Applicant: Seiko Epson Corporation
    Inventor: Satoru TANAKA
  • Patent number: 8522612
    Abstract: An on-chip navigation system, optionally combined with GPS (Global Positioning System) and/or an imaging array, which incorporates MEMS (MicroElectroMechanical Systems) components is possible by the use of careful material selection and novel bonding techniques used during fabrication. The use of MEMS components permits many of the components of a typical inertial navigation system to reside on a single chip. Because the components are in close proximity, the components can then be used to monitor the environmental changes of the chip, such as temperature and vibration, and correct for the resulting offsets of other components. This allows improved system performance even if the individual sensor components are not ideal.
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: September 3, 2013
    Assignee: HRL Laboratories, LLC
    Inventor: Randall L. Kubena
  • Patent number: RE45792
    Abstract: A driving mass of an integrated microelectromechanical structure is moved with a rotary motion about an axis of rotation, and a sensing mass is connected to the driving mass via elastic supporting elements so as to perform a detection movement in the presence of an external stress. The driving mass is anchored to an anchorage arranged along the axis of rotation by elastic anchorage elements. An opening is provided within the driving mass and the sensing mass is arranged within the opening. The elastic supporting and anchorage elements render the sensing mass fixed to the driving mass in the rotary motion, and substantially decoupled from the driving mass in the detection movement. The detection movement is a rotation about an axis lying in a plane. The sensing mass has, in plan view, a non-rectangular shape; in particular, the sensing mass has a radial geometry and, in plan view, the overall shape of a radial annulus sector.
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: November 3, 2015
    Assignee: STMicroelectronics S.r.l.
    Inventors: Luca Coronato, Alessandro Balzelli Ludovico, Sarah Zerbini