Abstract: A device (96) includes a microelectromechanical (MEMS) sensor (40). The sensor (40) includes a movable element (42) adapted for motion in a direction (44) and an anchor (46) coupled to a substrate (48). The MEMS sensor (40) further includes spring members (50) interconnected between the movable element (42) and the anchor (46). Each of the spring members (50) includes beams (56, 58, 60) arranged in substantially parallel alignment, with the beam (60) positioned between the other beams (56, 58). Each of the beams (56, 58) is coupled to the anchor (46) and the beam (60) is coupled to the movable element (42). Each of the spring members (50) further includes a support structure (64) joined with the beams (56, 58) to provide vertical stiffness to the beams (56, 58) of the spring member (50).

Abstract: An acceleration sensor (40R) for detecting a side surface collision which occurs in a vehicle is mounted on a beam (112) of a door via a support member (50). When a force due to a collision acts on the beam (112), this force is dampened by the support member (50) and thereafter transmitted to the acceleration sensor (40R). As a result, even if the beam (112) moves at an acceleration exceeding the rated input of the acceleration sensor (40R), the acceleration of the acceleration sensor (40R) is suppressed to a level not greater than the rated input. Accordingly, the side surface collision can be detected with high accuracy without using a sensor having a high rated input.

Abstract: A micromechanical acceleration sensor having a substrate, a suspension, a seismic mass, and stationary capacitive electrodes, in which the seismic mass is suspended over the substrate with the help of the suspension, the seismic mass has a mass center of gravity, the suspension has at least two anchors on the substrate, the two anchors are situated on opposite sides of the mass center of gravity, the distance between the two anchors being small compared to a horizontal extension of the seismic mass, the two anchors determine a central axis, the seismic mass have recesses which are situated on opposite sides of the central axis and are laterally open outward on the sides facing away from the central axis, and the stationary electrodes at least engage in the recesses of the seismic mass.

Abstract: According to the present invention, an in-plane sensor comprises a structure unit which includes: a fixed structure including a fixed finger and a fixed column connected to each other, the fixed finger having a supported end supported by the fixed column and a suspended end; and a movable structure including at least one proof mass which surrounds the fixed finger in a horizontal plane.

Abstract: An apparatus with a second movable portion that moves along an x-axis direction and a z-axis direction and a first movable portion that only moves along the z-axis direction is disclosed. The apparatus is provided with a fixed portion fixed to a support portion, a plurality of first spring portions connected to the fixed portion, a first movable portion connected to the plurality of first spring portions, a second spring portion connected to the first movable portion, and a second movable portion connected to the second spring portion. A spring constant of each of the plurality of first spring portions in the z-axis direction is lower than spring constants of each of the plurality of first spring portions in the x-axis and a y-axis directions respectively, and a spring constant of the second spring portion in the x-axis direction is lower than spring constants of the second spring portion in the y-axis and the z-axis directions respectively.

Abstract: A sensor element is provided for sensing accelerations in three spatial directions, which furnishes reliable measurement results and moreover can be implemented economically and with a small configuration. The sensor element encompasses at least one seismic mass deflectable in three spatial directions, a diaphragm structure that functions as a suspension mount for the seismic mass, and at least one stationary counterelectrode for capacitive sensing of the deflections of the diaphragm structure. According to the exemplary embodiments and/or exemplary methods of the present invention, the diaphragm structure encompasses at least four electrode regions, electrically separated from one another, that are mechanically coupled via the seismic mass.

Abstract: A tunneling accelerometer includes a proof mass that moves laterally with respect to a cap wafer. Either the proof mass or the cap wafer includes a plurality of tunneling tips such that the remaining one of proof mass and the cap wafer includes a corresponding plurality of counter electrodes. The tunneling current flowing between the tunneling tips and the counter electrodes will thus vary as the proof mass laterally displaces in response to an applied acceleration.

Abstract: An acceleration sensor is described that has a base substrate, a first electrode structure situated in stationary fashion relative to the base substrate, a sensor element having a first electrode area, and a spring device having at least one spring element. Via the spring element, the sensor element is coupled to the base substrate so that the sensor element is deflected relative to the base substrate as the result of an acceleration acting on the sensor element, thus changing the distance between the first electrode structure and the first electrode area. The sensor element and the first electrode structure are situated at least partially one over the other and are formed from a common functional layer.

Abstract: The disclosure discloses a motion sensing apparatus and a mobile terminal. The apparatus includes a sensing module and a processing module, wherein the sensing module includes at least two outputs, the processing module includes at least two signal ports, each signal port of the processing module is connected with one of the outputs of the sensing module respectively, and the sensing module outputs sensing signals from different outputs according to sensed different motions, and the processing module performs corresponding processes according to the sensing signals received from different signal ports. The apparatus simplifies a hardware circuit to some extent, saves the cost, and reduces the consumption of electric energy. By using the apparatus, a mobile terminal with screen shaking function can be produced.

Abstract: An acceleration sensor includes a substrate and a first mass element, which is connected to the substrate in such a way that the first mass element is rotatable about an axis, the first mass element being connected to a second mass element in such a way that the second mass element is movable along a first direction parallel to the axis, and the first mass element being connected to a third mass element in such a way that the third mass element is movable along a second direction perpendicular to the axis.

Abstract: An inertial sensor, comprising a substrate and a rocker that is connected to the substrate via a spring apparatus, the spring apparatus having at least two springs for suspending the rocker on the substrate, the two springs being disposed with an offset from one another with reference to their longitudinal axis.

Abstract: An acceleration sensor having a substrate, a first web that is connected to the substrate, and a seismic mass that is fashioned as a frame and is made up of four side frames, the first side frame and the third side frame being situated opposite one another, the second side frame and the fourth side frame being situated opposite one another, the second side frame and the first web being connected via a first spring element, stationary electrodes being provided inside the frame that are connected to the substrate, movable electrodes being provided that are connected to the first side frame and/or to the third side frame, the frame having a first transverse web that is connected to the first side frame and to the third side frame.

Abstract: The acceleration sensor according to the present invention includes a sensor chip having a movable portion operating in response to a change in a physical quantity and a silicon chip arranged to be opposed to a first side of the sensor chip and bonded to the sensor chip, while the sensor chip is provided with a penetrating portion penetrating the sensor chip in the thickness direction so that the first side is visually recognizable from a second side of the sensor chip, and the silicon chip is provided with an alignment mark on a portion opposed to the penetrating portion.

Abstract: An acceleration sensor includes a substrate, a rocker mass, a z spring connected to the rocker mass, which allows the rocker mass to rotate about an axis, and at least one additional spring system connected to the substrate and the rocker mass. The additional spring system allows the rocker mass to deflect in an x or y direction oriented parallel or perpendicular to the axis. The z spring or the additional spring system allows the rocker mass to deflect in a y or x direction oriented parallel or perpendicular to the axis.

Abstract: A method of making a resonating beam accelerometer (RBA). In an example process, a proof mass device and resonators are created from a quartz material. A direct bond is formed between the proof mass and the resonators by applying a predefined amount of pressure at a predefined temperature for a predefined amount of time. One or more damping plates are created from a quartz material. A direct bond is formed between the damping plates and the proof mass device. The proof mass device is created by applying a predefined amount of pressure at pressure at temperature to two bases, two proof mass portions, and a flexure. The proof mass bases are on opposite sides of the flexure. The proof mass portions are on opposite sides of the flexure. A gap is present between the proof mass bases and the proof mass portions.

Abstract: A MEMS device (20) includes a substrate (24) and a movable element (22) adapted for motion relative to the substrate (24). A secondary structure (46) extends from the movable element (22). The secondary structure (46) includes a secondary mass (54) and a spring (56) interconnected between the movable element (22) and the mass (54). The spring (56) is sufficiently stiff to prevent movement of the mass (54) when the movable element (22) is subjected to force within a sensing range of the device (20). When the device (20) is subjected to mechanical shock (66), the spring (56) deflects so that the mass (54) moves counter to the motion of the movable element (22). Movement of the mass (54) causes the movable element (22) to vibrate to mitigate stiction between the movable element (22) and other structures of the device (20) and/or to prevent breakage of components within the device (22).

Abstract: A monolithic guiding blade for a mobile proof mass in a monolithic electromechanical system micro-machined in a plate having thickness H and defining plane O,x,y, the system including a base and a measurement cell including the proof mass connected to the base by the guiding blade and capable of translation displacement along axis Oy, the blade extending along axis Ox and connected to a fixed portion of the base, the blade limiting movement of the proof mass along axis Ox, comprising: a first hinge section shaped as a parallelepiped having thickness h long axis Oz, length I1 along axis Ox and width L along axis Oy; a central section essentially shaped as a parallelepiped having thickness h long axis Oz, length It along axis Ox and width Lt along axis Oy; and a second hinge section essentially in the shape of a parallelepiped having thickness h long axis Oz, length I2 along axis Ox and width L along axis Oy.

Abstract: A rotation rate sensor for sensing a rotation ? by which the sensor is rotated has a substrate and a driving and sensing arrangement located substantially flat in an X-Y plane above a substrate surface of the substrate and having a center. The driving and sensing arrangement has a drive mass and a sense mass that are arranged at different spacings from the center of the driving and sensing arrangement symmetrically about the center. The oscillation modes of the drive mass and the sense mass are partially transmittable onto one another and are partially decoupled. The rotation ? is sensed in that a tilting of the sense mass out of a surface plane of the driving and sensing arrangement is sensed.

Abstract: A multi-axis accelerometer is consisted of a substrate with sensing electrodes and a structure layer. The structure layer includes anchor bases fixed on the substrate. A first proof mass is disposed over the substrate and has a first opening and a second opening symmetric to each other. The first proof mass is suspended to the anchor bases. Fixed sensing blocks are disposed on the substrate, and capacitors are formed between each fixed sensing block and the first proof mass for sensing acceleration along two in-plane directions. A second proof mass and a third proof mass are disposed in the first opening and the second opening and are asymmetrically suspended. Separate electrodes are disposed on the substrate and form two differential capacitors with the second proof mass and the third proof mass for sensing the out-of-plane acceleration.

Abstract: An accelerometer (50, 100, 120, 130) includes a substrate (58) and a proof mass (54) spaced apart from a surface (56) of the substrate (58). Compliant members (62) are coupled to the proof mass (54) and enable the proof mass (54) to move parallel to the surface (56) of the substrate (58) in a sense direction (68). Proof mass anchors (60) interconnect the compliant members (62) with the surface (56). The accelerometer (50, 100, 120, 130) includes an over-travel stop structure (52, 102, 122, 132) having stop anchors (70, 72) coupled to the substrate (58). The stop anchors (70, 72) are coupled to the substrate (58) at positions (76) on the surface (56) residing at least partially within an anchor attach area (71) bounded in the sense direction (68) by locations (78) of the proof mass anchors (60) on the surface (56).

Abstract: In an example, an interposer chip is provided. The interposer chip includes a base portion and a chip mounting portion. The interposer chip also includes one or more flexures connecting the base portion to the chip mounting portion. Additionally, a first plurality of projections extends from the base portion towards the chip mounting portion, and a second plurality of projections extends from the chip mounting portion towards the base portion and extending into interstices formed by first plurality of projections.

Abstract: Systems and methods sense out-of-plane linear accelerations. In an exemplary embodiment, the out-of plane linear accelerometer is accelerated in an out-of-plane direction, wherein the acceleration generates a rotational torque to an unbalanced proof mass. A rebalancing force is applied to at least one plurality of interleaved rotor comb tines and stator comb tines, wherein the rebalancing force opposes the rotational torque, wherein the rotor comb tines are disposed at an end of the unbalanced proof mass, and wherein the stator comb tines are disposed on a stator adjacent to the end of the unbalanced proof mass. An amount of acceleration is then determined based upon the applied rebalancing force.

Abstract: A fiber optic sensor employs at least two flexural discs that are spaced apart from one another along a central axis. A fiber optic coil is affixed to at least one of the flexural discs. A proof mass is disposed between the flexural discs. A first stop member is disposed between the proof mass and one flexural disc. A second stop member is disposed between the proof mass and the other flexural disc. The first and second stop members are sized to provide space between the proof mass and the corresponding flexural disc to allow for normal motion of the flexural discs, while interfering with movement of the flexural discs to prohibit unwanted extreme motion. The fiber optic sensor can be used for OTDR measurements of acceleration for real-time oilfield monitoring applications as well as other fiber-based interferometric measurement applications. A coupling structure preferably couples the outer edges of the flexible disks, the mass being attached to the coupling structure.

Abstract: In various embodiments, a microelectromechanical system may include a mass element; a substrate; a signal generator; and a fixing structure configured to fix the mass element to the substrate; wherein the mass element is fixed in such a way that, upon an acceleration of the microelectromechanical system, the mass element can be moved relative to the substrate in at least two spatial directions, and wherein a signal is generated by the movement of the mass element by means of the signal generator.

Abstract: An acceleration sensor having a high impact resistance to prevent breakage under excessive acceleration, but can stably exert a sensing performance. The acceleration sensor is formed of an SOI substrate of a three-layered structure including a silicon layer (active layer silicon), a silicon oxide layer, and a silicon layer (substrate silicon). The acceleration sensor includes frame parts, a plurality of beam parts, the beam parts projecting inward from the frame part, and a weight part supported by the beam parts. A strain sensing part is provided on each of the beam parts. A width W of each of the beam parts, a length I of each of the beam parts, and an inner frame length L of the frame part satisfy the following relationships of Expressions (1) and (2). 2<L/I?2.82??Expression (1) I/W?3.

Abstract: A micromechanical sensor comprising a substrate (5) and at least one mass (6) which is situated on the substrate (5) and which moves relative to the substrate (5) is used to detect motions of the sensor due to an acceleration force and/or Coriolis force which occur(s). The mass (6) and the substrate (5) and/or two masses (5, 7) which move toward one another are connected by at least one bending spring device (6). The bending spring device (6) has a spring bar (9) and a meander (10), provided thereon, having a circle of curvature (K1; K6; K8; K9; K11) whose midpoint (MP1; MP6; MP8; MP9; MP11) and radius of curvature (r1; r6; r8; r9; r11) are inside the meander (10). For reducing stresses that occur, in addition to the radius of curvature (r1; r6; r8; r9; r11) having the inner midpoint (MP1; MP6; MP8; MP9; MP11), the meander (10) has at least one further radius of curvature (r2; r3; r4; r5; r7; r10) having a midpoint (MP2; MP3; MP4; MP5; MP7; MP10) outside the meander (10).

Abstract: An inertial sensor includes a substrate, a mass element, and a detecting device for detecting a movement of the mass element relative to the substrate, the mass element being coupled to the substrate with the aid of a spring device, wherein the spring device has a T-shaped cross-sectional profile. A method for manufacturing an inertial sensor is also disclosed.

Abstract: A miniature sensor for detecting acceleration and deceleration processes has at least one bar-like spring element which is formed by a nanowire, which is connected by one end to the detector substrate and projects from the latter and which preferably carries at its free end a coating emitting a permanent magnetic stray field, or a nanoparticle of this type, wherein the nanowire and magnetic stray field coating, or mass, together form the inertial mass. A magnetic field detection layer composed, for example, of magnetoresistive material, is disposed at least in the region near the connected end of the nanowire. The substrate is preferably provided with such a layer which preferably, for its part, as sensor component forms a constituent part of a magnetic field detection unit.

Abstract: In a micromechanical system having a substrate and an electrode situated over the substrate, the electrode is connected to the substrate via a vertical spring. The vertical spring is sectionally provided in a first conductive layer and sectionally provided in a second conductive layer, the second conductive layer being situated over the first conductive layer and the first conductive layer being situated over the substrate. The electrode is provided in a third conductive layer, which is situated over the second conductive layer.

Abstract: A microelectromechanical systems (MEMS) sensor (52) includes a substrate (62) a movable element (58) spaced apart from the substrate (62), suspension anchors (66, 68, 70, 72) formed on the substrate (62), and compliant members (74) interconnecting the movable element (58) with the suspension anchors. The MEMS sensor (52) further includes fixed fingers (76) and fixed finger anchors (78) attaching the fixed fingers (76) to the substrate (62). The movable element (58) includes openings (64). At least one of the suspension anchors resides in at least one of the multiple openings (64) and pairs (94) of the fixed fingers (76) reside in other multiple openings (64). The MEMS sensor (52) is symmetrically formed, and a location of the fixed finger anchors (78) defines an anchor region (103) within which the suspension anchors (66, 68, 70, 72) are positioned.

Abstract: An acceleration sensor has a semiconductor acceleration sensor chip and a case. The semiconductor acceleration sensor chip has a fixed portion, a plummet portion surrounding the fixed portion without contacting the fixed portion, and a beam portion connecting the fixed portion and the plummet portion, the thickness of the beam portion being thinner than the thickness of the fixed portion. The case has a cavity housing the semiconductor acceleration sensor chip, and a projection portion formed on the bottom face of the cavity, the bottom face of the fixed portion being fixed to the top face of the projection portion.

Abstract: According to the present invention, an in-plane sensor comprises: a fixed structure including a fixed finger and a fixed column connected to each other, the fixed finger having a supported end supported by the fixed column and a suspended end which is unsupported; and a movable structure including at least one mass body and an extending finger connected to each other; wherein the supported end of the fixed finger is closer to the mass body than the suspended end is.

Abstract: The sensor device includes a dead-weight portion, a frame portion disposed so as to surround the dead-weight portion, a supporting portion provided at the frame portion via a first insulating layer, a mass portion provided at the dead-weight portion via a second insulating layer, a beam portion connecting the supporting and mass portions, a first concave portion, and a second concave portion, wherein a depth of the first or second concave portion is from 3.3% or more to 5.0% or less of the width of the frame portion.

Abstract: A micromechanical acceleration sensor includes a substrate, an elastic diaphragm which extends parallel to the substrate plane and which is partially connected to the substrate, and which has a surface region which may be deflected perpendicular to the substrate plane, and a seismic mass whose center of gravity is situated outside the plane of the elastic diaphragm. The seismic mass extends at a distance over substrate regions which are situated outside the region of the elastic diaphragm and which include a system composed of multiple electrodes, each of which together with oppositely situated regions of the seismic mass forms a capacitor in a circuit. In its central region the seismic mass is attached to the elastic diaphragm in the surface region of the elastic diaphragm which may be deflected perpendicular to the substrate plane.

Abstract: An acceleration sensor chip package includes an acceleration sensor chip; a sensor control chip; a re-wiring layer; an outer terminal; a sealing portion; and a substrate. The acceleration sensor chip includes a frame portion; a movable structure; a detection element; and an electrode pad electrically. The re-wiring layer has a wiring portion connected to the electrode pad. The electrode pad is electrically connected to a conductive bump. The sensor control chip has a sensor control electrode pad electrically connected to the conductive bump. The outer terminal is connected to the wiring portion and disposed in the outer region. The sealing portion seals the sensor control chip, the electrode pad, and the re-wiring layer, so that the movable structure is movable. The substrate is attached to the acceleration sensor chip to seal an opening portion.

Abstract: A micromechanical system includes a substrate, a first planar electrode, a second planar electrode, and a third planar electrode. The second planar electrode is movably positioned at a distance above the first planar electrode and the third planar electrode is positioned at a distance above the second electrode.

Abstract: A seismic sensor includes a frame, a pendulum pivotably mounted to the frame, a mechanism for sensing angular position of the pendulum, and a monolithic flat spring oriented between the frame and the pendulum for balancing the pendulum at an equilibrium position. The monolithic flat spring includes: (i) an operating region for providing a restoring force to the pendulum proportional to an angular displacement of the pendulum; and (ii) a suspension region for transmitting a force to a portion of the operating region and applying a negligible bending moment to the portion of the operating region.

Abstract: An out-of-plane sensing device is provided. A proof mass is movable with respect to a substrate. A frame is positioned on the substrate and encloses the proof mass. At least one spring connects the proof mass to the frame so that the spring will exert a force on the proof mass to make the proof mass move back to its equilibrium position when the proof mass moves perpendicularly to the substrate. An electrode extends from the proof mass toward the frame. A counter electrode extends from the frame toward the proof mass, wherein the projection of the electrode onto the substrate overlaps with that of the counter electrode onto the substrate.

Abstract: An acceleration sensing device includes a movable sensing member, a frame member and a supporting member. The supporting member is coupled between the movable sensing member and the frame member so as to support the movable sensing member. The acceleration sensing device further includes a covering member disposed above the movable sensing member, with a gap between the covering member and the movable sensing member. The acceleration sensing device still further includes internal electrodes, interconnection films, external electrodes and a resin film. The internal electrodes are arranged around the covering member. The interconnection films are disposed on the frame member so as to be coupled to the internal electrodes. The external electrodes are disposed on the interconnection films. The resin film is disposed on the frame member so as to seal the covering member.

Abstract: Sensing structures are provided which are designed using non-conventional designs. These sensing structures have improved sensitivity and noise floor at low frequencies.

Abstract: A MEMS sensor manufactured by processing a multi-layer stacked structure formed on a substrate, includes: a fixed frame portion formed in the substrate; a movable weight portion coupled to the fixed frame portion via an elastic deformable portion and having a hollow portion formed at the periphery; a fixed electrode portion protrudingly formed from the fixed frame portion toward the hollow portion; and a movable electrode portion moving integrally with the movable weight portion and facing the fixed electrode portion, wherein the movable weight portion includes a first movable weight portion formed of the multi-layer stacked structure and a second movable weight portion positioned below the first movable weight portion and formed of the material of the substrate.

Abstract: A sensor component having a housing and a sensor chip situated in it. The sensor chip is connected mechanically to the housing via at least one elastomer element. In addition, the sensor chip is also connected electrically to the housing via the at least one elastomer element.

Abstract: A drive frequency tunable MEMS sensor in one embodiment includes a mass, a mass drive component configured to drive the mass within a plane, a plurality of non-linear springs supporting the mass a first tuner operably connected to the plurality of non-linear springs for modifying the stress condition of the plurality of non-linear springs in response to a trim voltage, and a trim circuit electrically coupled with the first tuner for providing the trim voltage.

Abstract: In various embodiments, an accelerometer apparatus includes a center member; a resilient member, enclosing the center member; and, a mass member in contact with the resilient member, enclosing the center member; wherein, ambient motion of the apparatus at or beyond a selected threshold causes the resilient member or the mass member to contact the center member, thereby indicating the selected threshold has been met or exceeded. In one embodiment, the resilient member or the mass member contacting the center member closes an electrical circuit, whereby the accelerometer functions as an electrical switch.

Abstract: Disclosed are moveable microstructures comprising in-plane capacitive microaccelerometers, with submicro-gravity resolution (<200 ng/?Hz) and very high sensitivity (>17 pF/g). The microstructures are fabricated in thick (>100 ?m) silicon-on-insulator (SOI) substrates or silicon substrates using a two-mask fully-dry release process that provides large seismic mass (>10 milli-g), reduced capacitive gaps, and reduced in-plane stiffness. Fabricated devices may be interfaced to a high resolution switched-capacitor CMOS IC that eliminates the need for area-consuming reference capacitors. The measured sensitivity is 83 mV/mg (17 pF/g) and the output noise floor is ?91 dBm/Hz at 10 Hz (corresponding to an acceleration resolution of 170 ng/?Hz). The IC consumes 6 mW power and measures 0.65 mm2 core area.

Abstract: An acceleration sensor having a substrate, a first web that is connected to the substrate, and a seismic mass that is fashioned as a frame and is made up of four side frames, the first side frame and the third side frame being situated opposite one another, the second side frame and the fourth side frame being situated opposite one another, the second side frame and the first web being connected via a first spring element, stationary electrodes 50 being provided inside the frame that are connected to the substrate, movable electrodes being provided that are connected to the first side frame and/or to the third side frame, the frame having a first transverse web that is connected to the first side frame and to the third side frame.

Abstract: An acceleration sensor includes a seismic mass which is suspended on springs above a substrate and is deflectable in a direction perpendicular to a surface of the substrate. In order to reduce deflections of the seismic mass along the surface of the substrate because of interference accelerations, which lead to a falsification of the measurements of the deflection of the seismic mass perpendicular to the surface of the substrate, the springs include two bending bars which are interconnected via crosspieces.

Abstract: The invention relates to a miniature sensor for detecting acceleration and deceleration processes, which is characterized—in that it comprises at least one bar-like spring element which is formed by a nanowire (2), which is connected by one end (21) to the detector substrate (5) and projects from the latter and which preferably carries at it free end (22) a coating (3?) emitting a permanent magnetic stray field (ms), or a nanoparticle (3) of this type, wherein the nanowire and magnetic stray field coating, or mass, together form the inertial mass, and—in that a magnetic field detection layer (4), e.g. composed of magnetoresistive material, is arranged at least in the region near the connected end (21) of the nanowire (2),—wherein the substrate is preferably provided with such a layer which preferably, for its part, as sensor component forms a constituent part of a magnetic field detection unit (7).

Abstract: An acceleration sensor device comprising: an acceleration sensor chip comprising a mass portion, a support frame and flexible arms having piezo-resistors on their top surfaces; and an upper regulation plate having an IC circuit, which is larger in area than the support frame, bonded to a top surface of the support frame; wherein the acceleration sensor chip and the upper regulation plate are placed in a protection case with a lid. The regulation plate protrudes from outside walls of the support frame to partition the space accommodating the chip in the protection case by the protrusion and to prevent air circulation above and below the regulation plate, so that a temperature rise due to the IC circuit among the piezo-resistors provided on the top surfaces of the flexible arms is kept uniform to reduce offset voltage.

Abstract: An acceleration sensor is described that has a base substrate, a first electrode structure situated in stationary fashion relative to the base substrate, a sensor element having a first electrode area, and a spring device having at least one spring element. Via the spring element, the sensor element is coupled to the base substrate so that the sensor element is deflected relative to the base substrate as the result of an acceleration acting on the sensor element, thus changing the distance between the first electrode structure and the first electrode area. The sensor element and the first electrode structure are situated at least partially one over the other and are formed from a common functional layer.