Diaphragm Patents (Class 73/715)
  • Patent number: 8429979
    Abstract: The present invention is adapted to prevent a diaphragm from being deformed by a thermal stress caused by thermal expansion coefficients of a sensor main unit and a fixing member and includes a sensor main unit to which a fixed electrode is fixed, a diaphragm structure that forms a sealed space between the diaphragm structure and the sensor main unit and a fixing member that is jointed to the diaphragm structure in a manner of surrounding a pressure receiving part of the diaphragm structure so as to lead a fluid to the pressure receiving part, wherein the diaphragm structure includes a flat plane diaphragm main unit and first and second ring members each having a known thermal expansion coefficient that are respectively provided on both sides of a circumference of the diaphragm main unit.
    Type: Grant
    Filed: May 25, 2011
    Date of Patent: April 30, 2013
    Assignee: Horiba STEC, Co., Ltd.
    Inventors: Akira Kuwahara, Takehisa Hataita, Soutaro Kishida
  • Publication number: 20130098159
    Abstract: A semiconductor filter is provided to operate in conjunction with a differential pressure transducer. In one embodiment, a method comprises receiving, at a filter, a pressure, wherein the pressure includes a static pressure component and a dynamic pressure component; filtering, by the filter, at least the dynamic pressure component of the pressure; outputting, from the filter, a filtered pressure; receiving, at a first surface of a diaphragm, the pressure; receiving, at a second surface of the diaphragm, the filtered pressure, wherein the second surface of the diaphragm is operatively coupled to the filter; and measuring, at a sensor operatively coupled to the diaphragm, a difference between the pressure and the filtered pressure.
    Type: Application
    Filed: October 22, 2012
    Publication date: April 25, 2013
    Applicant: Kulite Semiconductor Products, Inc.
    Inventors: Kulite Semiconductor Products, Inc., Nora Kurtz
  • Patent number: 8424388
    Abstract: An implantable capacitive pressure sensor apparatus and method for making such an apparatus includes a first pressure sensor portion and a second pressure sensor portion. The first pressure sensor portion includes a diaphragm electrode connectable to ground (e.g., the diaphragm electrode being positioned in close proximity to the body when implanted therein such that the diaphragm electrode is deformable in response to pressure applied thereto by the body). The second pressure sensor portion includes a signal electrode (e.g., wherein the first pressure sensor portion and the second pressure sensor portion are coupled such that a gap is provided between the diaphragm electrode and the signal electrode) and an insulator material. The signal electrode is provided on and in direct contact with the insulator material to electrically isolate the signal electrode such that parasitic capacitance effects on the signal electrode are reduced.
    Type: Grant
    Filed: January 28, 2011
    Date of Patent: April 23, 2013
    Assignee: Medtronic, Inc.
    Inventors: Michael F. Mattes, David A. Ruben
  • Patent number: 8418544
    Abstract: A bending transducer for generating electrical energy from deformations includes at least: one deformable support device, on which a first connecting electrode and a second connecting electrode are formed, one piezoelectric element attached to the support device having a least one first electrode and one second electrode, the first connecting electrode being contacted with the first electrode of the piezoelectric element, and the second connecting electrode being contacted with the second electrode of the piezoelectric element. The first connecting electrode and/or the second connecting electrode are applied as a structured conductive layer to the support device in at least some areas.
    Type: Grant
    Filed: November 25, 2008
    Date of Patent: April 16, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Michael Hortig, Thorsten Pannek, Gustav Klett, Marian Keck
  • Patent number: 8418547
    Abstract: Force, pressure, or stiffness measurement or calibration can be provided, such as by using a graphene or other sheet membrane, which can provide a specified number of monolayers suspended over a substantially circular well. In an example, the apparatus can include a substrate, including a substantially circular well. A deformable sheet membrane can be suspended over the well. The membrane can be configured to include a specified integer number of one or more monolayers. A storage medium can comprise accompanying information about the suspended membrane or the substrate that, with a deflection displacement response of the suspended membrane to an applied force or pressure, provides a measurement of the applied force or pressure.
    Type: Grant
    Filed: August 6, 2009
    Date of Patent: April 16, 2013
    Assignee: The Trustees of Columbia University in the City of New York
    Inventors: Jeffrey William Kysar, James C. Hone, Changgu Lee, Xiaoding Wei
  • Patent number: 8413518
    Abstract: A pressure or force sensor has a sensor housing, a measuring element in the housing, and a sensor membrane. The membrane is delimited by an inner edge and an outer edge, which is connected in a pressure-resistant manner to the sensor housing. The inner edge transitions in a pressure-resistant manner into a movable plunger, the travel of which can be detected by the measuring element. The membrane has one or more elastic regions between the outer edge and the inner edge, each region having a thinnest point, wherein the material thickness inside the elastic region increases steadily on both sides of this thinnest point. The cross-section of the membrane has an arched shape in each elastic region, and the arched shape has a convex outer and concave inner contour relative to the arch orientation.
    Type: Grant
    Filed: October 5, 2009
    Date of Patent: April 9, 2013
    Assignee: Kistler Holding AG
    Inventors: Adrian Kummer, Christof Sonderegger
  • Publication number: 20130069603
    Abstract: A container of an electrochemical double-layer capacitor for holding electrodes and electrolyte includes a housing having a cavity and a cap portion coupled to the housing forming a fluid-tight reservoir with the cavity. The container also includes a plurality of terminals incorporated into one or more of the housing or the cap portion, where the plurality of terminals adapted to be electrically coupled to the electrodes, and a pressure-compliant membrane incorporated into one of the housing or the cap portion. A pressure monitoring system that monitors the pressure inside the container includes a displacement measuring device adapted to measure a deflection of the pressure-compliant membrane.
    Type: Application
    Filed: September 20, 2011
    Publication date: March 21, 2013
    Inventors: Robert Wendell Sharps, Todd Marshall Wetherill
  • Patent number: 8397577
    Abstract: A system for measuring and indicating pressure that uses as its pressure sensing element an outer resilient tube, an inner resilient tube, and a rolling diaphragm connecting the inner and outer tubes, and held inside a protective enshrouding structure where pressure applied to the annulus between the tubes causes the diaphragm to deform and roll to axial extend the outer tube by an amount proportional to the applied pressure. The structure has features that enable visual correlation of the partially rolled tube's unrolled state with the applied pressure. The system can be incorporated into a syringe to create a pressure measuring syringe for inflating endotracheal cuffs while providing a reading of the cuff pressure.
    Type: Grant
    Filed: March 6, 2011
    Date of Patent: March 19, 2013
    Inventors: Alexander Henry Slocum, Sr., Alexander Henry Slocum, Jr.
  • Patent number: 8397576
    Abstract: A pressure of a fluid is determined in a vacuum-tight welded housing containing a first membrane enclosing a part of a first inner volume and having a first contact area associated with a first temperature sensor and a heater. A second membrane opposite the first contact area also encloses part of the first inner volume and has a second contact area associated with a second temperature sensor. The first or second membrane is elastic around the contact area. The membranes hermetically seal a second inner volume at a reference pressure. The contact areas determine the mechanical and thermal contact due to the elasticity of one of the membranes when the first inner volume is connected to the fluid. When the volume is connected to the fluid F, the intensity and/or the time gradient of the heat transfer from the first to the second contact area is measured.
    Type: Grant
    Filed: December 18, 2008
    Date of Patent: March 19, 2013
    Assignee: Paul Scherrer Institut
    Inventor: Knud Thomsen
  • Patent number: 8393222
    Abstract: An absolute piezo-resistive pressure sensor system and method employing multiple pressure sensing elements operating simultaneously to detect pressure. Both pressure sensing elements being subject to a common reference pressure within a sealed cavity. The first pressure sensing element detecting an offset voltage resulting from the progressive release of mechanical stress at an assembly interface between the sensing element and a base plate on which the sensing elements are assembled. Electronic circuitry compensates the pressure measured by the second pressure sensing element based on the offset voltage detected by the first pressure sensing element.
    Type: Grant
    Filed: February 27, 2010
    Date of Patent: March 12, 2013
    Assignee: Codman Neuro Sciences Sárl
    Inventor: Rocco Crivelli
  • Patent number: 8393223
    Abstract: A pressure sensor micromachined by using microelectronics technologies includes a cavity hermetically sealed on one side by a silicon substrate and on the other side by a diaphragm that is configured to be formed under the effect of the pressure outside the cavity. The sensor includes at least one resistance strain gage fastened to the diaphragm and has resistance that varies as a function of the deformation of the diaphragm. The diaphragm is fastened to the resistance strain gages. The gages are located inside the sealed cavity. The diaphragm has an insulting layer deposited on a sacrificial layer and may cover integrated measurement circuits in the silicon substrate.
    Type: Grant
    Filed: January 26, 2007
    Date of Patent: March 12, 2013
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Gilles Delapierre, Hubert Grange, Patrice Rey
  • Patent number: 8390782
    Abstract: A fluid proximity sensor having one or more measurement nozzles and a reference nozzle coupled to a common chamber. Diaphragms coupled to the measurement nozzles can be sensed by optical, capacitive or inductive means so as to detect changes in pressure. In addition, the number of pressure detectors can be minimized through the use of control valves to selectively couple the nozzles to the detectors, while maintaining the required high level of topographic sensitivity. Further, the measurement nozzle dimensions can be adjusted to optimize proximity measurements in response to accuracy, speed and similar requirements.
    Type: Grant
    Filed: August 11, 2009
    Date of Patent: March 5, 2013
    Assignee: ASML Holding N.V.
    Inventor: Joseph H. Lyons
  • Publication number: 20130047738
    Abstract: A method for the manufacture of a platform having a membrane bed includes providing a platform body, which comprises silicon; and removing silicon material from a surface of the platform body by means of laser ablation. Preferably, this is followed by oxidizing the ablated surface and then etching the oxidized surface. In an example of the invention, a resulting pressure sensor comprises two platforms, each with a membrane bed having a contour for supporting a measuring membrane, wherein the contour essentially corresponds to a bend line of the measuring membrane.
    Type: Application
    Filed: April 14, 2011
    Publication date: February 28, 2013
    Applicant: Endress + Hauser GmbH + Co. KG
    Inventors: Anh Tuan Tham, Dieter Stolze, Rafael Teipen
  • Patent number: 8384915
    Abstract: A method and test block for controlling weld penetration depth in a work piece are disclosed. The test block simulates a work piece relative to a welding process of the work piece. The test block includes a test welding path. The test welding path replicates a production welding path on a weld surface of the work piece. The test block includes a melt-thru surface that underlies the test welding path. The melt-thru surface is spaced apart from the test welding path by a spacing that decreases along a length of the test welding path. The spacing varies from more than a standard weld penetration depth to less than the standard weld penetration depth.
    Type: Grant
    Filed: October 1, 2010
    Date of Patent: February 26, 2013
    Assignee: Rosemount Inc.
    Inventors: Eric P. Petersen, Daniel S. Sampson
  • Publication number: 20130042694
    Abstract: An enclosed, flat covered leadless pressure sensor assembly suitable for extreme environment operation including dynamic, ultra-high temperature heating, light and heat flash, and high-speed, flow-related environments. The pressure sensor assembly comprises a substrate comprising a micromachined sensing diaphragm defined on a first side. A cover is attached to the first side of the substrate such that it covers at least the sensing diaphragm. The top surface of the cover is substantially flat, thereby promoting uniformity in the distribution of stress and thermal effects across a top surface of the cover.
    Type: Application
    Filed: August 19, 2011
    Publication date: February 21, 2013
    Applicant: Kulite Semiconductor Products, Inc.
    Inventors: ALEXANDER NED, Leo Geras, Joseph VanDeWeert
  • Patent number: 8375799
    Abstract: Methods and devices for adhesively bonding a sensor die to a substrate are described. In some cases, a sensor assembly may include a pressure sensor die mounted to a substrate with an adhesive. The pressure sensor die may be fabricated to include a back-side having one or more adhesion features (e.g. recesses or indentations), which increase the surface area of the pressure sensor die that is in contact with the adhesive, to thereby increase the adhesion force therebetween. In some cases, the one or more adhesion features may define a non-planar interface between the pressure sensor die and the adhesive which, in some instances, may reduce the formation and/or propagation of cracks in the adhesive, which also may help increase the adhesion force therebetween.
    Type: Grant
    Filed: December 10, 2010
    Date of Patent: February 19, 2013
    Assignee: Honeywell International Inc.
    Inventors: Alistair David Bradley, Lamar Floyd Ricks, Richard Alan Davis
  • Patent number: 8375797
    Abstract: The present invention relates to a method for the operation of a pressure measuring device for the measurement of the pressure in a system through which fluid flows, in particular in an extracorporeal circuit of a medical unit, with the pressure measuring device having a measuring chamber which is bounded by a flexible membrane, through which fluid flows in the operation of the system or which is filled with fluid and also having a pressure sensor connected to the membrane for the purpose of pressure measurement, with the method including the following steps not requiring any intervention of the staff: a. increasing the pressure in the measuring chamber (12) to a pressure value at which the membrane (13) is at least slightly outwardly curved relative to the measuring chamber (12) in the state not connected to the pressure sensor (14) or determining such a pressure value; b: separating the membrane (13) of the measuring chamber (12) from the pressure sensor (14); c.
    Type: Grant
    Filed: July 21, 2009
    Date of Patent: February 19, 2013
    Assignee: Fresenius Medical Care Deutschland GmbH
    Inventors: Josef Beden, Itka Bado, Patrick Spalt
  • Patent number: 8375796
    Abstract: A sensor assemblage, in particular a high-pressure sensor assemblage, includes a substrate element and a connector element, the substrate element comprising a sensor structure having a pressure-sensitive diaphragm and a cavity disposed in the region of the diaphragm, the substrate element being connected to the connector element in such a way that the cavity is connected to a hollow space of the connector element, the substrate element moreover including at least one further sensor structure having a pressure-sensitive further diaphragm and a further cavity disposed in the region of the further diaphragm, the further cavity being connected to a further hollow space of the at least one connector element or of a further connector element.
    Type: Grant
    Filed: September 8, 2009
    Date of Patent: February 19, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Frank Klopf, Arno Stoetzler, Juergen Kober
  • Patent number: 8371174
    Abstract: A micro-deformable piezoresistive material is provided, including a hard plastic body, a micro-deformable rough texture surface, and a plurality of conductive particles. The micro-deformable rough texture surface is formed on a side of the hard plastic body, wherein the maximum deformation of the rough texture surface is far less than the thickness of the hard plastic body. Additionally, the conductive particles are evenly dispersed in the plastic body.
    Type: Grant
    Filed: December 31, 2009
    Date of Patent: February 12, 2013
    Assignee: Universal Cement Corporation
    Inventors: Yi-Ling Chen, Chih Sheng Hou, Chia-Hung Chou
  • Patent number: 8371160
    Abstract: A piezoresistive sensor assembly is provided that has a flex circuit having at least one air flow aperture formed therein. A sensor die is coupled to an absolute support and the flex circuit. The sensor die has a diaphragm that deflects in response to air flow that flows through the air flow aperture and is incident on the diaphragm. The sensor die includes one or more gages positioned on or in the diaphragm.
    Type: Grant
    Filed: December 16, 2009
    Date of Patent: February 12, 2013
    Assignee: Meggitt (San Juan Capistrano), Inc.
    Inventors: Tom Kwa, Don L. Danielson
  • Patent number: 8359927
    Abstract: A method and apparatus are described for fabricating an exposed differential pressure sensor (30) which protects interior electrical components (37) formed on a topside surface of a differential pressure sensor transducer die (31) from corrosive particles using a molding compound (39), but which vents both sides of a piezoresistive transducer sensor diaphragm (33) through a first vent hole (42) formed in an exposed die flag (36) and a second vent hole (38) formed in an exposed cap structure (33), enabling the sensor diaphragm (33) to sense differential pressure variations directly or indirectly through a protective gel.
    Type: Grant
    Filed: August 12, 2009
    Date of Patent: January 29, 2013
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Stephen R. Hooper, James D. MacDonald, William G. McDonald
  • Patent number: 8353215
    Abstract: A fluid pressure differential measuring instrument comprises a diaphragm that is displaced by a pressure differential between two environmental pressure zones. Diaphragm displacement induced by the pressure differential between the two zones is converted to a torsional strain upon a cylindrical element in a third environmental zone. The torsional strain is measured by calibrated electrical sensing means positioned physically in the third environmental zone.
    Type: Grant
    Filed: June 17, 2010
    Date of Patent: January 15, 2013
    Inventor: Leroy C. Delatorre
  • Patent number: 8342030
    Abstract: An apparatus comprising a housing comprising an end wall and side walls defining a first chamber open at one end a slide at the open end a diaphragm in the chamber spaced from the slide and generally parallel to it, defining, with the slide and side walls of the first chamber, a second chamber; and an opening in the first chamber for permitting fluid to enter and exit the first chamber.
    Type: Grant
    Filed: October 22, 2010
    Date of Patent: January 1, 2013
    Assignee: University of New Brunswick
    Inventors: Dongbo Yan, Kecheng Li
  • Publication number: 20120325007
    Abstract: A gage having a motion detection mechanism magnetically attached to a pressure sensing diaphragm. The motion detection mechanism is magnetically coupled to a pointer rotation mechanism configured to indicate the position of the diaphragm and the corresponding pressure sensed by the diaphragm.
    Type: Application
    Filed: September 5, 2012
    Publication date: December 27, 2012
    Applicant: DWYER INSTRUMENTS, INC.
    Inventor: Michael A. Popp
  • Publication number: 20120325008
    Abstract: A gage having a motion detection mechanism magnetically attached to a pressure sensing diaphragm. The motion detection mechanism is magnetically coupled to a pointer rotation mechanism configured to indicate the position of the diaphragm and the corresponding pressure sensed by the diaphragm.
    Type: Application
    Filed: September 6, 2012
    Publication date: December 27, 2012
    Applicant: DWYER INSTRUMENTS, INC.
    Inventor: Michael A. Popp
  • Patent number: 8336385
    Abstract: A pressure sensor diaphragm system for efficiently and accurately measuring fluid pressure in harsh environments. The pressure sensor diaphragm system generally includes a pressure transducer, a diaphragm, and a pressure fluid within the diaphragm that is fluidly connected to the pressure transducer to transfer pressure from the diaphragm to the pressure transducer. The diaphragm is comprised of a deformable structure and is preferably comprised of a bellows structure having a plurality of furrow portions and a plurality of ridge portions.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: December 25, 2012
    Assignee: S.J. Electro Systems, Inc.
    Inventor: Alan J. Bergum
  • Patent number: 8336387
    Abstract: A variable capacitor, a microfabricated implantable pressure sensor including a variable capacitor and an inductor, and related pressure measurement and implantation methods. The inductor may have a fixed or variable inductance. A variable capacitor and pressure sensors include a flexible member that is disposed on a substrate and defines a chamber. Capacitor elements extend indirectly from the flexible member. Sufficient fluidic pressure applied to an exterior surface of the flexible member causes the flexible member to move or deform, thus causing the capacitance and/or inductance to change. Resulting changes in resonant frequency or impedance can be detected to determine pressure, e.g., intraocular pressure.
    Type: Grant
    Filed: August 2, 2010
    Date of Patent: December 25, 2012
    Assignee: California Institute of Technology
    Inventors: Yu-Chong Tai, Po-Jui Chen, Damien C. Rodger, Mark S. Humayun
  • Publication number: 20120318068
    Abstract: There is disclosed a high pressure sensing header which is relatively insensitive to mounting torque. The header comprises an outer torque isolating shell which surrounds an inner “H” section header. The inner “H” section header has a thick diaphragm and is surrounded by the torque isolating shell which is secured to the “H” section header at a peripheral flange of the “H” section header. In this manner when the header is installed, the installation force is absorbed by the outer shell and there is no installation force or torque exhibited by the inner “H” section which will respond only to stress due to pressure. The torque isolating shell also contains a top surface which has a counterbore that accommodates a crush ring. When the unit is installed, the crush ring is crushed against an installation wall to enable the inner header to receive pressure without experiencing significant installation force.
    Type: Application
    Filed: August 27, 2012
    Publication date: December 20, 2012
    Applicant: Kulite Semiconductor Products, Inc.
    Inventors: ANTHONY D. KURTZ, Adam Kane, Boaz Kochman
  • Patent number: 8327712
    Abstract: A semiconductor pressure sensor includes a silicon substrate, an active gauge resistance forming portion having a first diaphragm and a first gauge resistance formed on the silicon substrate, and a dummy gauge resistance forming portion for temperature compensation having a second diaphragm and a second gauge resistance, formed on the substrate. The first diaphragm of the active gauge resistance forming portion and the second diaphragm of the dummy gauge resistance forming portion for temperature compensation are formed of a common polysilicon film. The polysilicon film has an anchor portion to be connected to the substrate. The first and second diaphragms have mutually identical or symmetrical structures and the first and second gauges have mutually identical or symmetrical structures. Accordingly, a semiconductor pressure sensor capable of highly accurate temperature compensation and manufacturing method thereof can be provided.
    Type: Grant
    Filed: August 18, 2009
    Date of Patent: December 11, 2012
    Assignee: Mitsubishi Electric Corporation
    Inventor: Kimitoshi Sato
  • Patent number: 8322205
    Abstract: A method of fabricating a pressure sensor (30) for harsh environments such as vehicle tires, formed from a first wafer substrate (32) having first and second opposing planar surfaces. CMOS circuitry (34) is deposited on the first planar surface and a layer of passivation material is deposited on the circuitry. Openings in the passivation layer are etched to expose parts of the circuitry and an aperture is etched into the first wafer from the first planar surface towards the second planar surface. Sacrificial material is deposited in the aperture and then a flexible membrane (50) is deposited on the sacrificial material and the exposed parts of the circuitry. The sacrificial material is subsequently plasma cleaned out of the aperture from the second surface and a second substrate is sealed to the second planar surface of the first wafer substrate to define a chamber (58) containing a fluid at a reference pressure.
    Type: Grant
    Filed: May 31, 2009
    Date of Patent: December 4, 2012
    Assignee: Silverbrook Research Pty Ltd
    Inventors: Kia Silverbrook, Samuel George Mallinson
  • Patent number: 8324007
    Abstract: A method manufactures an electronic device comprising a MEMS device overmolded in a protective casing. The MEMS device includes an active surface wherein a portion of the MEMS device is integrated, and is sensitive, through a membrane, to chemical/physical variations of a fluid. Prior to the molding step, at least one resin layer is formed on at least one region overlying the active surface in correspondence with the membrane. After, at least one portion of at least one resin layer is removed from at least one region, so that in the region an opening is formed, through which the MEMS device is activated from the outside of the protective casing.
    Type: Grant
    Filed: August 2, 2010
    Date of Patent: December 4, 2012
    Assignee: STMicroelectronics S.r.l.
    Inventors: Federico Giovanni Ziglioli, Mark Andrew Shaw
  • Patent number: 8322984
    Abstract: A rotor blade of a wind energy installation has a wall forming an outer shell, and at least one pressure measurement device arranged inside the rotor blade. The pressure measurement device includes a hollow body that is closed in a gastight fashion and has at least one pressure-dependent deformable diaphragm. At least one optical strain sensor is non-positively connected to each diaphragm. In a method using the pressure measurement device, the wind force is determined at wind energy installations by an evaluation unit which determines a comparison value indicating the difference between the pressure at the side of the outer shell facing the wind and the pressure at the side of the outer shell averted from the wind. A measured value for the wind force acting on the rotor blade is determined from the comparison value. The method can be used for optimized operation and/or protection of wind energy installations.
    Type: Grant
    Filed: March 31, 2008
    Date of Patent: December 4, 2012
    Assignee: Siemens Aktiengesellschaft
    Inventor: Thomas Bosselmann
  • Publication number: 20120297884
    Abstract: A device for measuring environmental forces, and a method for fabricating the same, is disclosed that comprises a device wafer, the device wafer comprising a first device layer separated from a second device layer by a first insulation layer. The first device wafer is bonded to an etched substrate wafer to create a suspended diaphragm and boss, the flexure of which is determined by an embedded sensing element.
    Type: Application
    Filed: May 23, 2011
    Publication date: November 29, 2012
    Applicant: General Electric Company
    Inventors: Sisira Kankanam Gamage, Naresh Venkata Mantravadi
  • Patent number: 8317687
    Abstract: The inventive endoscopy system includes a cannula for arranging an endoscope and forming, between said cannula and endoscope, an irrigation or aspiration channel for transporting an irrigation or aspiration fluid, respectively, a connection ring mounted around the cannula and provided with a connection channel connectable to the irrigation or aspiration channel, respectively and a connector which is mounted on the connection ring and includes a transport channel with the connection channel and a first pressure sensor for detecting pressure in the transport channel. The connection ring is provided with a bypass circuit connectable to the irrigation or aspiration channel, respectively and the connector including a dead channel connectable to the bypass circuit and a second pressure sensor for detecting pressure in the dead channel.
    Type: Grant
    Filed: January 13, 2011
    Date of Patent: November 27, 2012
    Assignee: Future Medical System S.A.
    Inventors: Andre Francisco, Patrick Janin, Thierry Pascual, Armando Dias
  • Patent number: 8307713
    Abstract: A semiconductor filter is provided to operate in conjunction with a differential pressure transducer. The filter receives a high and very low frequency static pressure attendant with a high frequency low dynamic pressure at one end, the filter operates to filter said high frequency dynamic pressure to provide only the static pressure at the other filter end. A differential transducer receives both dynamic and static pressure at one input port and receives said filtered static pressure at the other port where said transducer provides an output solely indicative of dynamic pressure. The filter in one embodiment has a series of etched channels directed from an input end to an output end. The channels are etched pores of extremely small diameter and operate to attenuate or filter the dynamic pressure.
    Type: Grant
    Filed: November 2, 2010
    Date of Patent: November 13, 2012
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Anthony D. Kurtz, Tonghuo Shang, Boaz Kochman
  • Publication number: 20120279309
    Abstract: a clog resistant wing union pressure sensor is provided that includes a transmitter housing and a flange section. The flange section is coupled to the transmitter housing and has a pressure port formed therein that includes an open first end, a closed second end, and an inner surface that defines a bore between the open first end and the closed second end. The closed second end is defined by a pressure sensitive diaphragm and has a diameter. The pressure port has a depth defined between the open first end and the closed second end, the bore is tapered between the open first end and the closed second end, and is further defined by a rounded transition between the inner surface and the closed second end, and the diameter of the closed second end is greater than twice the depth of the pressure port.
    Type: Application
    Filed: May 2, 2011
    Publication date: November 8, 2012
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Brian Richards, Tungsheng Yang
  • Patent number: 8297124
    Abstract: A pressure sensor includes: a housing; a pressure receiver which seals an opening of the housing and transmits pressure from outside the housing to the inside of the housing; and a pressure sensing element having a pressure sensing portion and a pair of base portions which are respectively coupled to both ends of the pressure sensing portion. In the pressure sensor, a force detecting direction is set to be a detection axis, a line connecting the pair of base portions and a displacement direction of the pressure receiver are arranged in parallel, one of the base portions is coupled to a central region, which is displaced by the pressure, of the pressure receiver, and the other of the base portions is coupled to a marginal region, which is at a fixing side, of the pressure receiver through a connecting member.
    Type: Grant
    Filed: July 21, 2009
    Date of Patent: October 30, 2012
    Assignee: Seiko Epson Corporation
    Inventors: Jun Watanabe, Masanobu Fujisaki, Hisao Motoyama
  • Patent number: 8297125
    Abstract: A differential pressure sensor includes two pressure ports for allowing media to pass into contact with both the top and bottom sides of the diaphragm. A silicon pressure sensor die can be attached between the pressure ports using die attach materials for sensing a differential pressure between the media to evaluate media differential pressure. A cap with an opening can be placed on topside of a diaphragm formed in the silicon pressure die. The silicon pressure die can include die bond pads that can be electrically connected to the diaphragm to output electrical signals. The cap can seal the die bond pads from the harsh media and route the electrical signals therein. Media can pass through the opening in the cap such that a media path to the top of the diaphragm is not exposed to the die bond pads of the silicon pressure die to ensure long-term sensor reliability.
    Type: Grant
    Filed: May 23, 2008
    Date of Patent: October 30, 2012
    Assignee: Honeywell International Inc.
    Inventors: Carl Stewart, Richard Alan Davis, Gilberto Morales
  • Publication number: 20120266683
    Abstract: A sensor for measuring pressures in low-viscosity media for use in injection moulding includes a housing with an axis A, a flat end face to be exposed to a pressure space, and a diaphragm that is arranged on the end face and is permanently connected to the housing. A measuring element that can infer a pressure prevailing in the pressure space on the basis of deflection of the diaphragm is arranged behind the diaphragm. A pressure sleeve that is tightly connected to the sensor on the end face and is arranged at a distance from the housing with a gap behind this connection is arranged coaxially with the housing axis A outside the housing. The gap extends axially further across the measuring element than the region of the force path in the direction away from the pressure space.
    Type: Application
    Filed: November 18, 2010
    Publication date: October 25, 2012
    Applicant: KISTLER HOLDING AG
    Inventor: Ernst Pletscher
  • Publication number: 20120266682
    Abstract: Disclosed is an electromechanical transducer, including: a cell including a substrate, a vibration film, and a supporting portion of the vibration film configured to support the vibration film so that a gap is formed between the substrate and the vibration film; and a lead wire that is placed on the substrate with an insulator interposed therebetween and extends to the cell, wherein the insulator has a thickness greater than the thickness of the supporting portion. The electromechanical transducer can reduce parasitic capacitance to prevent an increase in noise, a reduction in bandwidth, and a reduction in sensitivity.
    Type: Application
    Filed: March 20, 2012
    Publication date: October 25, 2012
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Kazutoshi Torashima, Ayako Kato
  • Publication number: 20120267291
    Abstract: A pressure sensor for a dialysis machine, the sensor having a body and a sensing surface, the sensor surface configured to detect the pressure of a fluid across an elastic membrane, the sensor in use generating a vacuum between the sensing surface and the membrane so as to draw the membrane into contact with the sensing surface, wherein the elastic membrane is further retained in use between a sealing surface on the dialysis machine and a membrane engaging surface on the body of the sensor.
    Type: Application
    Filed: September 3, 2010
    Publication date: October 25, 2012
    Applicant: QUANTA FLUID SOLUTIONS LTD
    Inventor: James Coates
  • Publication number: 20120266684
    Abstract: Apparatus and related fabrication methods are provided for a sensor device. The sensor device includes a sensor structure including a first portion having a sensing arrangement formed thereon and a second structure. A sealing structure is interposed between the sensor structure and the second structure, wherein the sealing structure surrounds the first portion of the sensor structure. The sealing structure establishes a fixed reference pressure on a first side of the first portion, and an opposing side of the first portion is exposed to an ambient pressure.
    Type: Application
    Filed: April 21, 2011
    Publication date: October 25, 2012
    Applicant: Freescale Semiconductor, Inc.
    Inventors: Stephen R. Hooper, Dwight L. Daniels, James D. MacDonald, William G. McDonald, Chunlin C. Xia
  • Patent number: 8286495
    Abstract: There is disclosed a high pressure sensing header which is relatively insensitive to mounting torque. The header comprises an outer torque isolating shell which surround an inner “H” section header. The inner “H” section header has a thick diaphragm and is surrounded by the torque isolating shell which is secured to the “H” section header at a peripheral flange of the “H” section header. In this manner when the header is installed, the installation force is absorbed by the outer shell and there is no installation force or torque exhibited by the inner “H” section which will respond only to stress due to pressure. The torque isolating shell also contains a top surface which has a counterbore that accommodates a crush ring. When the unit is installed, the crush ring is crushed against an installation wall to enable the inner header to receive pressure without experiencing significant installation force.
    Type: Grant
    Filed: January 21, 2011
    Date of Patent: October 16, 2012
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Anthony D. Kurtz, Adam Kane, Boaz Kochman
  • Patent number: 8286496
    Abstract: In a sensor, a joint is provided with a sensor module, and the sensor module is accommodated in a housing. The housing is provided with a terminal, and a flexible circuit board electrically connects a diaphragm of the sensor module with the terminal. The joint is also provided with a cap-shaped base, and the top of the base is provided with an opening through which the diaphragm is exposed. A lateral surface of the base, which is crosswise with the top where the opening is provided, is provided with a part of the flexible circuit board, and the part is provided with an electronic component. With this arrangement, no plate-shaped circuit board for mounting the electronic component is required, thereby reducing the manufacturing cost. Moreover, since the electronic component is provided on the lateral surfaces of the base, the base and the electronic component are horizontally arranged.
    Type: Grant
    Filed: February 16, 2010
    Date of Patent: October 16, 2012
    Assignee: Nagano Keiki Co., Ltd.
    Inventors: Haruhiko Sekiya, Shuji Tohyama, Hironori Kobayashi, Nobuhiko Akimoto
  • Patent number: 8281665
    Abstract: A pressure sensor assembly having a pressure tube, in which a diaphragm is situated as a pressure pickup, and having means for detecting the diaphragm deformations, which allow a spatial separation between the measuring medium acting on the diaphragm and the means for detecting the diaphragm deformations. The diaphragm of this pressure sensor assembly includes at least two diaphragm sections oriented at an angle to one another. A first diaphragm section is situated as a partition diaphragm in the cross-section of the pressure tube, while at least one second diaphragm section forms an area of the wall of the pressure tube as a side wall diaphragm. The means for detecting diaphragm deformations are situated on the outer side of the pressure tube on the side wall diaphragm.
    Type: Grant
    Filed: April 27, 2009
    Date of Patent: October 9, 2012
    Assignee: Robert Bosch GmbH
    Inventors: Anton Dukart, Gilbert Moersch
  • Patent number: 8276456
    Abstract: A differential pressure sensor for measuring a pressure difference between two high-pressure environments is comprised of a sensor block including internal, oil-filled channels leading to an internally positioned differential pressure sensor element. Two process diaphragms are provided for transferring pressure from the high-pressure environments for isolating two distinct internal oil channels from the high-pressure environments. In order to achieve small internal oil volumes in the sensor block, additionally two separating discs, which initially separate between the two internal oil channels, are positioned in fluid communication with the high-pressure environments in order to block for the pressure from the high-pressure environments against the oil channels “from behind.” The separating discs bear against abutment faces having small openings into the internal oil channels.
    Type: Grant
    Filed: June 3, 2008
    Date of Patent: October 2, 2012
    Assignee: Presens AS
    Inventor: Bjorn Erik Seeberg
  • Publication number: 20120222488
    Abstract: A system for measuring and indicating pressure that uses as its pressure sensing element an outer resilient tube, an inner resilient tube, and a rolling diaphragm connecting the inner and outer tubes, and held inside a protective enshrouding structure where pressure applied to the annulus between the tubes causes the diaphragm to deform and roll to axial extend the outer tube by an amount proportional to the applied pressure. The structure has features that enable visual correlation of the partially rolled tube's unrolled state with the applied pressure.
    Type: Application
    Filed: March 6, 2011
    Publication date: September 6, 2012
    Inventor: Alexander Henry Slocum
  • Patent number: 8256301
    Abstract: A micromechanical pressure sensing device includes a silicon support structure, which is configured to provide a plurality of silicon support beams. The device further includes one or more diaphragms attached to and supported by the support beams, and at least one piezoresistive sensing device, which is buried in at least one of the support beams. The piezoresistive sensing device is arranged to sense a strain induced in the silicon support structure, the strain being induced by a fluid in contact with the one or more diaphragms, to determine the pressure acting on the one or more diaphragms.
    Type: Grant
    Filed: February 17, 2010
    Date of Patent: September 4, 2012
    Assignee: Infineon Technologies AG
    Inventor: Henrik Jakobsen
  • Publication number: 20120216621
    Abstract: A supporting frame section of a diaphragm layer and a fixing section of a pressure sensor are joined using a first joining material. A pair of bases of a pressure sensitive element layer and a pair of supporting sections are joined using a second joining material having a melting point higher than the melting point of the first joining material.
    Type: Application
    Filed: February 3, 2012
    Publication date: August 30, 2012
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Masayuki OTO
  • Patent number: 8250926
    Abstract: The invention relates to a capacitive pressure sensor and a method for fabricating thereof. The capacitive pressure sensor comprises a cover, a plurality of first electrode, a substrate and a plurality of second electrode. The cover owns an upper wall and a plurality of side walls. The plurality of first electrode is disposed on the inside of the upper wall of the cover. The side walls of the cover are connected to the substrate to form a space. The plurality of second electrode is disposed on the substrate. The plurality of first electrode and the plurality of second electrode are both in the space. In the invention, the material for cover, the plurality of first electrodes and the substrate are all flexible polymeric material.
    Type: Grant
    Filed: January 13, 2010
    Date of Patent: August 28, 2012
    Assignee: National Taiwan University
    Inventors: Yao-Joe Yang, Ming-Yuan Cheng, Xin-Hua Huang