Abstract: Methods for making decorative grasses from materials wherein at least one surface of the material is modified to assimilate the appearance of cloth.

Abstract: A decorative shredded material having a complete pattern contained on each strip or piece of the decorative shredded material. Methods for making decorative shredded material.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A method for manufacturing an aperture web including bonding a first and second web together with the second web bonded to a lower surface of the first web and feeding the bonded web in a first direction, subjecting the first web to pillar-shaped water jets from at least one nozzle having a plurality of orifices arranged transversely to the first direction until the first web is locally torn and provided with a plurality of apertures in rows extending parallel to one another in the first direction, and then subjecting the second web to pillar-shaped water jets supplied from at least one nozzle having a plurality of orifices arranged transversely to the first direction until peripheral edges of the apertures are partially deformed upward from the lower surface of the first web.

Abstract: A method for cutting a substrate by scribing a scribe line in the substrate, wherein a working condition of the scribe line is varied during the scribing of one line.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A perforator for making perforations in a continuous film which is thereafter cut into individual filmstrips having variable lengths. A die set unit of the perforator has a plurality of punches and corresponding dies which are respectively arranged along the continuous film. The die set unit performs die-punching N times (N=1, 2, 3 . . . ) in every first section having a variable length Lx, and the measuring feeder transports the continuous film by a first length after each of (N−1) times die-punching and by a second length after the last die-punching for every first section. The first length is given as Lx/N, and the second length corresponds to the first length plus the length L2 of a second section disposed alternately with the first section along the continuous film. In alternative, the die set unit is constituted of first to nth die sets aligned in order from downstream to in the film transporting direction. The ith die set of the die sets has a number Gi (i=1, 2, . . .

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A method of automatically cutting a variable tooth pitch band saw blade from a bulk reel 40 of blade material 14 is achieved by using a cut to length machine 8. Blade material 14 from the bulk reel 40 is pulled on to a bed 42 of the machine 8. The blade material 14 is placed between rollers 50, which are powered and one of which is a metered roller 44 actuable to dispense a desired amount of the blade material. The cut to length machine 8 includes a cutting section 18 and an optical sensor 24, both connected to and controlled by a computer 46. The cutting section 18 comprises suitable cutting means, such as a mechanical cutter or laser cutter.

Abstract: A method for dicing small devices including MEMS, ink jet printheads, lasers etc. The method comprises making a first pass cut into a substrate with a blade of narrow kerf and having long wear characteristics. This first pass cut is then followed with a polishing blade of wider kerf having desirable smooth cutting qualities.

Abstract: Disclosed is an improved method of cutting and separating a bent board into individual small divisions. Prior to the cutting and separating of the board into the individual chips the board is cut and separated into two or more pieces each large enough to have a reduced bend, compared with the bend of the board. Thus, each large division can be put and fixedly held on the chuck table of a cutting machine in stable condition, thus permitting the smooth, stable cutting of the large division into final small divisions.

Abstract: An apparatus for cutting fabric includes at least one fabric wind-off device (1, 1′) for one fabric bolt (7), a conveyor belt (5) for conveying the unwound fabric, and a cutting device (3) which cuts a piece of fabric to a given shape from the length of fabric deposited on the conveyor belt (5). Said conveyor belt (5) extends without interruption from at least that point where the fabric is deposited by the wind-off device (1, 1′) to the working area of the said cutting device (3). The wind-off device (1, 1′) places the length of fabric directly onto the conveyor belt (5) or onto one of more lengths of fabric already deposited on the said conveyor belt. An apparatus control automatically feeds the unwound fabric to the cutting device and directs the cutting of the unwound fabric by the cutting device.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A method for manufacturing a one-way clutch cage allows slits of the cage to be formed with a short punching distance, wherein the slits are narrow in width and the cage is less prone to deformation. In this method for manufacturing a one-way clutch cage, after slits 8, 10, 11, 12 have been formed, windows 17 are formed and then an outer annular part 18 is cut. Therefore, since the slits can be formed in a cylindrical member 2 that has not yet been subjected to the window formation process of the outer annular part cut-out process, and that is sufficiently strong, a radially diagonal punching operation can be performed to form the slits. During this radially diagonal punching operation, a boundary portion between a cylindrical portion 3 and an outer flange 5 is punched out from an inside of the cylindrical member toward an outside of the cylindrical member.

Abstract: A micro-etalon having non-beveled outer edges may be mass-produced without suffering from expected breakage problems. Such a configuration allows etalons to be mass-produced, i.e., on a wafer level. The mass-production preferably includes aligning spacer block strips to be diced with two reflective surfaces to form the etalon.

Abstract: A process for packaging selected traditional cuts of pork loin by cutting the whole pork loin at successive saw stations to form a predetermined number of traditional cuts and moving the formed traditional cuts to corresponding traditional cut locations. After a first traditional cut is formed at the first saw station, the remainder of the whole loin is positioned at another saw station where a differing traditional cut is formed. The process is continued at additional saw stations so that the entire loin is formed into traditional cuts, the cuts are collected at collecting locations, and an array of cuts are placed in a package tray. The package is then sealed and can be gas flushed and thereafter accumulated in bulk or cases for removal to a remote location where they can be refrigerated or frozen.

Abstract: A method for making decorative grass having a three-dimensional pattern which constitutes at least a portion of the decor of the decorative grass. Printed designs or materials and/or embossed materials can also constitute a portion of the decor of the decorative grass. The method includes slitting a material having a three-dimensional pattern on at least a portion of at least one surface thereof and then cutting the slit material into segments of a predetermined length to provide the decorative grass having a three-dimensional pattern.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A method for trimming the width of blinds of the type having a headrail, a bottom rail and blind slats, by an apparatus having a support body with a headrail opening, and a bottom rail opening, and a blind slat opening, the headrail, bottom rail and blind slats being inserted into their openings from one side of the support body, and cutters located alongside the support body for cutting the blind components for cutting the ends of the components, and in which the blind slats are arranged in two bundles separated by a spacer. A method for trimming the width of a vertical blind having a headrail and control rods is also disclosed.

Abstract: A C-shaped clamp cut from a PVC tube having a longitudinal axis and comprising a circular ring of a predetermined diameter and having side edges and a predetermined radial wall thickness extending through a predetermined width between the side edges and a slit cut across the width of the ring to define jaws on either side of the slit. A plurality of the circular clamps are utilized in a method for fabricating a counter top. Edge trims strips are adhesively laminated together on a shelf while held by clamps for curing and later adhesively secured to the periphery of a counter top panel, again held in place by clamps including corner clamps. In an another version, two panels are held in edge to edge contact by either abutments on the panels or by a stringer held in a bowed configuration by a combination of abutting clamps Handles are provided to facilitate manual opening of the clamps.

Abstract: A concrete cutting saw and the process of using the concrete cutting saw for making a 45° chamfer cut at an edge of a 90° cut through a concrete wall. The process includes the steps of cutting a 90° cut through a concrete wall with a 90° saw mounted on a trolley riding along a track affixed to the concrete adjacent the cut. The 90° blade is lifted so that it is above the wall surface and a chamfer saw assembly is affixed to the frame. Next, the chamfer saw motor is started and the saw is lowered into a cutting position and the trolley is once again moved along the track, thereby forming a 45° chamfer along the edge of the cut. The apparatus utilizes a chamfer saw frame affixed to the trolley frame after the 90° saw blade has been lifted. The chamfer saw frame is mounted so that it is directly in the position which the 90° saw occupies when the 90° saw blade 16 is in a cutting position.

Abstract: A method for producing a polymeric foamed material panel including the steps of providing a polymeric foamed material; and cutting (e.g. hot wire cutting) the polymeric foamed material until reaching a preconfiguration cut point. The method further includes cutting subsequently from the preconfiguration cut point a brace-receiving configuration in the polymeric foamed material; and sliding a brace member into the brace-receiving configuration to produce a polymeric foamed material panel. A method for forming a structure comprising engaging together a pair of polymeric foamed material panels produced in accordance with the method for producing a polymeric foamed material panel. A polymeric foamed material panel comprising a panel consisting of a polymeric foamed material, and a brace-receiving-configured slot disposed in the polymeric foamed material of the panel. A brace member is disposed in the brace-receiving-configured slot in the polymeric foamed material of the panel.

Abstract: The invention relates to foam structures with enhanced physical properties which can be used in the areas of packaging, athletics, water sports, and construction. In general, the structures are laminated polymer foams that include a core of a low density foam and one or more skins of relatively high density foam covering the core. The skins provide improved physical properties to the foam structures by improving the flexural strength, resistance to bending, and resulting damage from bending in the laminated foam structure while modestly increasing the weight of the laminated structure, for example. Uses of the foam structures include, but are not limited to, packaging materials, gym mats, body boards, or eaves fillers. The skin can act as a hinge to fold a die cut piece into a collapsible packaging system.

Abstract: Thick matter and solids are conveyed together and substantially continuously through a conveyor pipeline. The thick matter is forced by a conveyor piston driven by a piston pump from a feed container into a conveyer cylinder. A forward face of the piston has a cutting crown with a cutting edge cooperating with an annular cutting ring to cut off solids projecting beyond an inlet in the conveyer pipeline.

Abstract: A method for fabricating a filter element to prevent contaminants from entering an ink supply inlet of an ink jet printhead. The filter is formed by laser ablation process in which output laser radiation is directed through a mask system or light transmitting system to create a filter hole pattern in a thin film. Slightly tapered holes are formed in the film, and the formed filter element is laminated to the ink supply inlet. The tapered holes provide improved flow/impedance and add increased structural strength.

Abstract: The present invention is related to a trimming station for sheet like articles comprising a first conveyor assembly (2) conveying sheet material (3) in a first orientation (4) having a first trimming section (16) with vibrating trimming elements (19, 20). Further, a sheet material reorienting section (23) is provided for the sheet material (3). Reoriented sheet material articles (3) are conveyed in a second orientation (25) to a second conveyor assembly (24) having a second trimming section (33) with trimming elements (34, 35).

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A method for use in making profile pieces. The method has the steps of feeding a profile into a work station, clamping the profile in the work station, and cutting it into a profile piece and a profile remainder. The profile piece is repositioned in the work station for further work by operably connecting it to the profile remainder while both the profile piece and the profile remainder are clamped, and moving the profile remainder. The invention also covers a machine for carrying out the method.

Abstract: A method used for rounding the corners of a pile of sheets. Air is injected between the sheets in the pile to create a lubricating fluid film between the sheets; at least one of the corners of the pile is placed in abutment against two reference surfaces formed facing at least one corner of the pile, and the four cutting devices corresponding to each corner are actuated.

Abstract: A method for forming a grating suitable for bridge decks using a punch and die, the die having a die opening having a generally cross shaped configuration having a generally vertical or first extent having a top and bottom and a generally horizontal or second extent having a first side and a second side, the distance between the top and bottom of the vertical extent being shorter than the distance between the first side and the second side of the horizontal extent, the opening having a first land and a second land substantially opposite to each other, the first land extending from the top of the vertical extent to the second side, the second land extending from the first side to the bottom, the punch having a cross-section configuration to mate with the die opening to punch the web openings in the web.

Abstract: A slider of the punch carry out unit is moved in the X-axis direction adjacent a punching section of the punch press machine before or after a plate material is punched into a punched product by a punch press machine. At the same time, a gravity center and a shape of the punched product are calculated and recognized on the basis of the manufacturing data. On the basis of the obtained gravity center and the shape of the punched product, the gravity center of the punched product is moved under the lift arm by the X- and Y-axis locating mechanism. Vacuum pads located just over the punched product are selected or discriminated. Then, the lift arm is lowered and the punched product is held by actuating only the discriminated vacuum pads. During this lift motion, it is preferable to bend one end of the punched product slightly upward to easily separate the punched product from the remaining flat plate material.

Abstract: An apparatus and method for cutting a surgical suture at a first and second different location along its length. The apparatus having a first and a second cutting die with channels for receiving at least a portion of the cross-section of the surgical suture at each location. Each of the first and second cutting dies respectively is provided with an opposing cutting die to further restraint the suture. A blade is also provided at each cutting location for cutting the suture at a point adjacent to the respective cutting dies when the suture is restrained between the sets of dies.

Abstract: A method for manufacturing a first valve disc and a second valve disc for use in a compressor having a longitudinal axis and several cylinder chambers surrounding the axis is described. The method includes the steps of: providing a sheet of resilient valve material; stamping a through-hole having several extended openings out of the sheet to produce the first valve disc with several arms; and stamping several arch-shaped openings out of the sheet spaced around the through-hole corresponding to each of the extended openings of the through-hole to produce the second valve disc. Thus, an economical manufacturing method for obtaining a set of suction valve and discharge valve discs from a common surface area of sheet material is described. A small valve disc is obtained by stamping out the central portion of a larger valve disc. The total quantity of sheet material required for making a set of two kinds of valve discs thereby is reduced.

Abstract: A chain of elastic bands (1) includes at least two elastic bands (3), wherein adjacent elastic bands are joined to one another by means of at least one bridging piece (4). The longitudinal direction (A) of the elastic bands preferably extends transversely to the longitudinal direction (C) of the chain of elastic bands (1). The chain of elastic bands may be produced from a flat, sheet-like web of elastic material (9), such as rubber, preferably natural rubber, in which essentially oval elastic bands (3) have been formed. The elastic bands have a constant width (B) all round. Adjacent elastic bands are preferably joined to one another by at least two bridging pieces (4), which are preferably each arranged at a transition between the adjacent longitudinal strips (5) and arc-shaped strips (6). The chain of elastic bands according to the invention can be rolled up into a roll or can be folded up to form a harmonica-like stack.

Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.

Abstract: A reseal is partially perforated by stretching the reseal membrane, establishing contact between one side of the membrane and an anvil, and by effecting partial penetration of the membrane with at least one cutting edge from the other side of the membrane to a predetermined distance from the anvil. Multiple partial perforations may be made with one or more cutting edges.

Abstract: A process and apparatus for cutting up an element used in the construction of a nuclear installation for dismantling. The element is placed on a support and pushed toward a shearing tool having a blade pitch angle of 30.degree.. As the element is pushed, the blade performs a first shearing operation. Then a releasing stop controlled by a jack releases the element from the blade. Operation continues until the element is cut up.

Abstract: The invention concerns a method and an arrangement for handling printed products by making an edge cut with the aid of a cutter. The printed products in this case are supplied to the cutter by grippers that circulate along a first conveying loop, and the edge area to be cut on the printed products positioned in the grippers is stabilized by clamping braces that can be placed against the printed products in the range of the cutter. After the edge cut is made, the printed products with the grippers are disengaged from the clamping braces and discharged.

Abstract: Void fill material is used to cushion and protect packages during transport and delivery. A void fill material is shown, as well as a process for manufacturing same.

Abstract: A method for producing a polymeric foamed material panel including the steps of providing a polymeric foamed material; and cutting (e.g. hot wire cutting) the polymeric foamed material until reaching a preconfiguration cut point. The method further includes cutting subsequently from the preconfiguration cut point a brace-receiving configuration in the polymeric foamed material; and sliding a brace member into the brace-receiving configuration to produce a polymeric foamed material panel. A method for forming a structure comprising engaging together a pair of polymeric foamed material panels produced in accordance with the method for producing a polymeric foamed material panel. A polymeric foamed material panel comprising a panel consisting of a polymeric foamed material, and a brace-receiving-configured slot disposed in the polymeric foamed material of the panel. A brace member is disposed in the brace-receiving-configured slot in the polymeric foamed material of the panel.

Abstract: A method for cutting a vertical incision in a plastic cap for containers. The plastic cap includes a flat top, a casing emanating from the flat top, and a guarantee area provided in an edge zone of the casing. The guarantee area has at least one holding section on a surface of the guarantee area.

Abstract: A table for fixing a workpiece is driven and controlled by a position control means in a CNC unit through servo motors. Approach of a press tool to the workpiece is started by a press operation control means in the CNC unit through a servo motor at the time prior to the time, at which the position control of the table is completed, by predetermined time. Afterward, the press tool is controlled according to operation data stored in a press operation storage means in the CNC unit.

Abstract: A control apparatus and method for progressively fracturing a work piece from a material sheet in a mechanical press in which the separation distance between an upper die and a lower die is varied in discrete steps as an upper platen advances the upper die toward the lower die, each discrete step occurring within the thickness of the material being stamped. Varying the separation distance includes a motion opposite to the relative direction movement of the upper platen at one or more predetermined distances to create a controlled release of stored forces in the dies and press frame. A distance measuring transducer generates an output indicative of the position of the upper die in relation to the lower die.

Abstract: A method and apparatus for cutting sheet material upon an apertured support surface, the apparatus including a pair of spaced apart parallel cutters. The cutters are spaced apart by a distance greater than a dimension of the apertures, but less than an inter aperture distance so that at least one of the cutters remains in cutting contact with the support surface when the remaining cutter passes over an aperture. The method includes selectively overcutting and undercutting the line segments at an intersection to ensure continuity of cut paths of both cutters.

Abstract: A method for producing a polymeric foamed material panel including the steps of providing a polymeric foamed material; and cutting (e.g. hot wire cutting) the polymeric foamed material until reaching a preconfiguration cut point. The method further includes cutting subsequently from the preconfiguration cut point a brace-receiving configuration in the polymeric foamed material; and sliding a brace member into the brace-receiving configuration to produce a polymeric foamed material panel.

Abstract: A method for cutting sheet material allows multiple layups of sheet material to be cut in side-by-side or stacked relationship on the cutting table of a computer controlled cutting machine. A different marker or array of pattern pieces can be cut from each of the stacked layups. Also, for certain layups, whether stacked or not, markers are located with reference to the centerline of the layup to insure that the pattern pieces of the marker are cut symmetrically or in alignment with ornamentation or designs in the material. An origin point is located at a known position with respect to the sides and ends of the marker. The origin point of the marker is then registered relative to the cutting table and the centerline of the layup.

Abstract: An enclosure panel for covering the access opening in an equipment compartment includes a main panel body which is constructed and arranged so as to attach directly to the equipment compartment in such a way as to substantially cover the access opening. The main panel body defines a plurality of oblong slots which are arranged into a plurality of side-by-side columns wherein each column is configured with a substantially uniform herringbone pattern. The herringbone pattern provides a unique and preferred compromise between a uniform pattern of oblong slots arranged in columns and rows and a uniform pattern of circular openings arranged in staggered rows and columns. By use of the uniform herringbone pattern the open area for preferred cooling air flow is achieved while at the same time maintaining the structural strength and integrity of the enclosure panel.

Abstract: A method of making a base for a split jamb for a door frame opening, with the base having a groove for receiving the tongue of a slide of a split jamb, including the steps of providing an elongate panel, making a plurality of parallel cuts in the panel, with the cuts not cutting through the panel, the cuts including a plurality of pairs of slots, with the slots of a pair spaced from each other leaving panel material between the slots of each pair, adhering a stop strip over each pair of slots covering the slots of the pair, and gang sawing the panel into jamb base strips by cutting between the slots of each pair of slots to remove the panel material between the slots providing individual jamb base strips. The method wherein the step of making parallel cuts includes making a plurality of notches spaced from each other by the pairs of slots, and wherein the step of gang sawing includes cutting through the panel at each of the notches.

Abstract: A blank-figure constructing method for sheet metal work, wherein a cutting passage planned to sequentially cut a plurality of desired blanks from a sheet material is determined, utilizing a multiple figure composed of the figures of the plurality of blanks to be obtained, in the multiple figure of which the adjacent line segments of the single blank figures are combined. This method is that if the multiple figure has an even number of, four or more odd vertices at each of which an odd number of internal and external line segments of the multiple figure meet, an auxiliary line is drawn outside the multiple figure, connecting any two of the odd vertices on the outline of the multiple figure to make the total number of odd vertices be two or zero so that the cutting passage, which passes through all the internal, external line segments and auxiliary line of the multiple figure, can be determined.

Abstract: A vibration finishing method and apparatus in which the surface roughness and form of a hole in a compound material such as a printed board can be made excellent and the working accuracy of the hole can be significantly improved and the working cost of the hole can be lowered. In the punch pressing device, a compound material is fixed to a lower metal mold having a lower die hole into which a punching tool can be inserted. While the compound material is held between the lower metal mold and a pressing plate and pressed by pressing members provided with the pressing plate having an upper die hole into which the punching tool can be inserted, a minute-vibration of frequency of several ten hertz is applied onto the punching tool and then, the compound material is punched out. After that, the punching tool is temporarily drawn from the hole to be worked in the compound material.