Abstract: An automatic ice cream scooper. A cylinder of ice cream is placed vertically within a refrigerated container on a slicer having a disc shape. The slicer includes an angled slicing blade for removing ice cream. The slicer is rotated by a motor to remove the ice cream. The slicer has an upstanding edge with the screw thread formed thereon for removing the sidewall of the ice cream container.

Abstract: An ice-carving machine comprises a framework, an ice block positioning system, at least one feeding system, and at least one heating mold. The ice block positioning system is fixed on the workbench of the framework for positioning the ice block to be processed. The feeding system drives the heating mold to heat and press the ice block in a mold cavity with a predetermined shape. By the pressure and heat of the heating mold, the ice block is made into the shape identical to the shape of the mold cavity, thus simplifying the process of carving ice blocks, and also saving carving time and cost, being especially suitable for a mass production of ice sculptures.

Abstract: The object of the present invention is to form individual packaged ICs by using a single apparatus to cut wiring boards on which a plurality of IC chips are mounted. The first cutting device 23 cuts the wiring boards 3 into separate parts along one direction, so that the cut wiring boards 3 constitute strip-form cut wiring boards 3a. The cut wiring boards 3a are conveyed to the second cutting device 33, and are fed by the second conveying device 43 along the direction of length and are then cut by the second cutting device 33 with the orientation altered by 90 degrees relative to the first cutting direction. The wiring boards 3b resulting from the cutting performed by the second cutting device 33 constitute the original forms of the IC packages. The wiring boards 3b that have been cut and conveyed from the second cutting device 33 enter a cleaning step.

Abstract: The object of the present invention is to form individual packaged ICs by using a single apparatus to cut wiring boards on which a plurality of IC chips are mounted. The first cutting device 23 cuts the wiring boards 3 into separate parts along one direction, so that the cut wiring boards 3 constitute strip-form cut wiring boards 3a. The cut wiring boards 3a are conveyed to the second cutting device 33, and are fed [into the second cutting device 33] by the second conveying device 43 along the direction of length. [The cut wiring boards 3a] are then cut by the second cutting device 33 with the orientation altered by 90 degrees relative to the first cutting direction. The wiring boards 3b resulting from the cutting performed by the second cutting device 33 constitute the original forms of the IC packages. The wiring boards 3b that have been cut and conveyed from the second cutting device 33 enter a cleaning step.

Abstract: A microtome for producing thin sections, in which the cutting operation is performed by way of a relative movement between a cutting knife and an object. A drive system (14) having a drive motor (17), a control circuit (15), and a handwheel (8) is provided to generate the relative movement. The handwheel (8) is connected to an encoder (16) that delivers corresponding signals to the control circuit (15) upon rotation of the handwheel (8). The drive motor (17) is then activated accordingly by way of said control circuit (15). In the absence of encoder signals, the drive system (14) is locked.