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  • Patent number: 9706667
    Abstract: A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material. A layer of catalytic adhesive coats walls within the hole. The patterned metal layer is placed over the catalytic adhesive within the hole.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: July 11, 2017
    Assignee: SIERRA CIRCUITS, INC.
    Inventors: Konstantine Karavakis, Kenneth S. Bahl