Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.
Type:
Application
Filed:
June 5, 2014
Publication date:
December 11, 2014
Inventors:
Brett W. Degner, Eric R. Prather, David H. Narajowski, Frank F. Liang, Jay S. Nigen, Jesse T. Dybenko, Connor R. Duke, Eugene A. Whang, Christopher J. Stringer, Joshua D. Banko, Caitlin Elizabeth Kalinowski, Jonathan L. Berk, Matthew P. Casebolt, Kevin S. Fetterman, Eric J. Weirshauser
Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.
Type:
Application
Filed:
June 5, 2014
Publication date:
December 11, 2014
Inventors:
Brett W. Degner, Eric R. Prather, David H. Narajowski, Frank F. Liang, Jay S. Nigen, Jesse T. Dybenko, Connor R. Duke, Eugene A. Whang, Christopher J. Stringer, Joshua D. Banko, Caitlin Elizabeth Kalinowski, Jonathan L. Berk, Matthew P. Casebolt, Kevin S. Fetterman, Eric J. Weirshauser
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
Type:
Grant
Filed:
April 6, 2019
Date of Patent:
July 28, 2020
Assignee:
Apple Inc.
Inventors:
Brett W. Degner, Caitlin Elizabeth Kalinowski, Richard D. Kosoglow, Joshua D. Banko, David H. Narajowski, Jonathan L. Berk, Michael E. Leclerc, Michael D. McBroom, Asif Iqbal, Paul S. Michelsen, Mark K. Sin, Paul A. Baker, Harold L. Sontag, Wai Ching Yuen, Matthew P. Casebolt, Kevin S. Fetterman, Alexander C. Calkins, Daniel L. McBroom
Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).
Type:
Application
Filed:
June 5, 2014
Publication date:
December 11, 2014
Inventors:
Brett W. Degner, Caitlin Elizabeth Kalinowski, Richard D. Kosoglow, Joshua D. Banko, David H. Narajowski, Jonathan L. Berk, Michael E. Leclerc, Michael D. McBroom, Asif Iqbal, Paul S. Michelsen, Mark K. Sin, Paul A. Baker, Harold L. Sontag, Wai Ching Yuen, Matthew P. Casebolt, Kevin S. Fetterman, Alexander C. Calkins, Daniel L. McBroom
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