Intel Patents

Intel Corporation designs and manufactures microprocessors and chipsets for computing and communications equipment manufacturers. Its products may be found in desktops, servers, tablets, smartphones and other devices.

Intel Patents by Type
  • Intel Patents Granted: Intel patents that have been granted by the United States Patent and Trademark Office (USPTO).
  • Intel Patent Applications: Intel patent applications that are pending before the United States Patent and Trademark Office (USPTO).
  • Publication number: 20240168754
    Abstract: An embodiment of a semiconductor package apparatus may include technology to determine version information for a new firmware component, read dependency information corresponding to the firmware component, and determine if dependency is satisfied between the new firmware component and one or more other firmware components based on the version information and the dependency information of the new firmware component. Other embodiments are disclosed and claimed.
    Type: Application
    Filed: November 29, 2023
    Publication date: May 23, 2024
    Applicant: Intel Corporation
    Inventors: Vincent Zimmer, Jiewen Yao
  • Publication number: 20240168841
    Abstract: An example of an apparatus may include matrix operation hardware and circuitry coupled to the matrix operation hardware to detect a hardware fault in the matrix operation hardware based at least in part on one or more hardware checksums of data in one or more matrices of the matrix operation hardware. Other embodiments are disclosed and claimed.
    Type: Application
    Filed: November 23, 2022
    Publication date: May 23, 2024
    Applicant: Intel Corporation
    Inventors: Srajudheen Makkadayil, Jaijith K Radhakrishnan
  • Publication number: 20240168723
    Abstract: An apparatus to facilitate matrix transposition in matrix multiplication array circuitry is disclosed. The apparatus includes a processor comprising matrix acceleration hardware comprising storage buffers and an array of data processing units (DPUs), wherein the matrix acceleration hardware is to: load data for a source matrix to the storage buffers; generate a transposed matrix corresponding comprising transposed elements of the source matrix; and input the transposed matrix to the array of DPUs for a matrix multiplication operation.
    Type: Application
    Filed: November 18, 2022
    Publication date: May 23, 2024
    Applicant: Intel Corporation
    Inventors: Jorge Eduardo Parra Osorio, Supratim Pal, Jiasheng Chen
  • Publication number: 20240168828
    Abstract: Embodiments described herein are generally directed to improving performance of a transactional API protocol by adaptively optimizing function call performance at runtime. In an example, a command stream is monitored that includes function calls associated with the transactional API to be carried out by an executer on behalf of an application. An amount of data transmitted over an interconnect between the application and the executer is reduced by: (i) identifying a sequence of multiple of the function calls that represents a batch and satisfies a set of one or more criteria; (ii) creating a template of the batch having a symbolic name and including placeholders for a subset of variable arguments of the multiple of the function calls; and (ii) after observing a subsequent occurrence of the sequence within the command stream, transmitting via the interconnect the symbolic name and values for the subset of variable arguments.
    Type: Application
    Filed: November 23, 2022
    Publication date: May 23, 2024
    Applicant: Intel Corporation
    Inventors: Joseph Grecco, Mukesh Gangadhar Bhavani Venkatesan
  • Publication number: 20240169094
    Abstract: Protecting data privacy in a federated learning computing environment includes receiving a model trained by a federated server with public data using global model parameters, getting local shareable data from a local shareable database, training the model with the local shareable data using the global model parameters to generate local model parameters, and obscuring the local model parameters. Protecting data privacy includes sending the local model parameters to the federated server, modifying the model to classify private data, and training the model with the private data using the local model parameters and updating the local model parameters.
    Type: Application
    Filed: November 23, 2022
    Publication date: May 23, 2024
    Applicant: Intel Corporation
    Inventors: Jerome Anand, Anil Kumar Bangalore Rajashekar, Dinkar Dhawale, Sachin P. Kamat, Shidlingeshwar Khatakalle, Mitul Shah
  • Publication number: 20240170351
    Abstract: Architectures and processes for redistribution layers in a dielectric cavity to enable an embedded component in semiconductor packaging. The architectures pattern redistribution layers (RDL) over a thick seed and remove dielectric material from the RDL conductive contacts to create the dielectric cavity. The architectures enable 2-sided connections for embedded components in the dielectric cavity with minimal disruption to existing process infrastructure. Such an approach can be used not only for integration of photonic devices, but also for any semiconductor packaging requiring dual sided connection within a dielectric cavity.
    Type: Application
    Filed: November 22, 2022
    Publication date: May 23, 2024
    Applicant: Intel Corporation
    Inventors: Jeremy D. Ecton, Gang Duan, Brandon Christian Marin, Suddhasattwa Nad, Srinivas V. Pietambaram
  • Publication number: 20240171593
    Abstract: Techniques include an apparatus to retrieve a first parameter for the IDS to monitor a device for a time-synchronized network. The first parameter may represent a number of messages the IDS needs to analyze in order to detect a security attack. The messages may comprise time information to synchronize a clock for a device to a network time for a time-synchronized network. The processor circuitry may retrieve a second parameter for a time sensitive application. The second parameter may represent a defined amount of time error tolerated by the time sensitive application, and determine a third parameter for the IDS based on the first and second parameters. The third parameter may represent a defined frequency to receive a number of messages with time information in order to detect the security attack on the device within a defined time interval. Other embodiments are described and claimed.
    Type: Application
    Filed: November 18, 2022
    Publication date: May 23, 2024
    Applicant: Intel Corporation
    Inventors: Marcio Juliato, Shabbir Ahmed, Christopher Gutierrez, Vuk Lesi, Manoj Sastry
  • Publication number: 20240170581
    Abstract: An integrated circuit structure includes a sub-fin having at least a first portion that is doped with a first type of dopant, and a second portion that is doped with a second type of dopant. A PN junction is between the first and second portions of the sub-fin. The first type of dopant is one of a p-type or an n-type dopant, and the second type of dopant is the other of the p-type or the n-type dopant. A first contact and a second contact comprise conductive material. In an example, the first contact and the second contact are respectively in contact with the first portion and the second portion of the sub-fin. A diode is formed based on the PN junction between the first and second portions, where the first contact is an anode contact of the diode, and the second contact is a cathode contact of the diode.
    Type: Application
    Filed: November 22, 2022
    Publication date: May 23, 2024
    Applicant: Intel Corporation
    Inventors: Cheng-Ying Huang, Ayan Kar, Patrick Morrow, Charles C. Kuo, Nicholas A. Thomson, Benjamin Orr, Kalyan C. Kolluru, Marko Radosavljevic, Jack T. Kavalieros
  • Publication number: 20240170394
    Abstract: Integrated circuitry comprising an interconnect level with multi-height lines contacted by complementary multi-height vias. In some examples, a first line of a taller height is contacted by a first via of a shorter height while a second line of a shorter height is contacted by a second via of a taller height. The first and second vias and first and second lines may be subtractively defined concurrently from a same stack of conductive material layers such that the first via comprises a first conductive material layer, and the first line comprises second and third conductive material layers while the second via comprises the first and second conductive material layers and the second line comprises the third conductive material layer.
    Type: Application
    Filed: November 22, 2022
    Publication date: May 23, 2024
    Applicant: Intel Corporation
    Inventors: Elijah Karpov, June Choi, Manish Chandhok, Miriam Reshotko, Matthew Metz
  • Publication number: 20240171371
    Abstract: Homomorphic encryption (HE) acceleration circuitry includes encode circuitry to encode cleartext data into plaintext data, encrypt circuitry to encrypt the plaintext data into HE ciphertext data according to an HE process, decrypt circuitry to decrypt the HE ciphertext data into the plaintext data according to the HE process, and decode circuitry to decode the plaintext data into the cleartext data.
    Type: Application
    Filed: November 23, 2022
    Publication date: May 23, 2024
    Applicant: Intel Corporation
    Inventors: Jeremy Bottleson, Kylan Race, Ernesto Zamora Ramos, Fillipe Dias Moreira De Souza, Akshaya Jagannadharao, Brad Smith
  • Publication number: 20240171403
    Abstract: A system and method of implementing digitally signed secure quick response (SQR) codes include storing captured content as a hash map, calculating a hash of the captured content, where the hash is a unique key that is stored in the hash map, creating a digital signature for the captured content using a private key such that the captured content is digitally signed, generating a SQR code of the digitally signed captured content, and storing the SQR code including the digitally signed captured content in a secure digital (SD) card.
    Type: Application
    Filed: November 23, 2022
    Publication date: May 23, 2024
    Applicant: Intel Corporartion
    Inventors: Karthika Murthy, Santosh Male, Girisha Dengi
  • Publication number: 20240168787
    Abstract: The technology disclosed herein includes broadcasting, to a plurality of destination computing systems, a request to live migrate at least one trusted execution environment virtual machine (TVM) to at least one of the plurality of destination computing systems, receiving one or more bids from at least one of the plurality of destination computing systems, allocating the at least one TVM to at least one of the plurality of destination computing systems based at least on a bidding price in the one or more bids, automatically live migrating the at least one TVM to the at least one of the plurality of destination computing systems based on the allocating, and storing live migration allocation information of the at least one TVM on a first blockchain.
    Type: Application
    Filed: November 22, 2022
    Publication date: May 23, 2024
    Applicant: Intel Corporation
    Inventors: Vinothini Gunasekaran, Santosh Deshpande, Ajay Kishore
  • Publication number: 20240168764
    Abstract: An apparatus to facilitate supporting and load balancing multiple double precision pipelines in a graphics environment is disclosed. The apparatus includes a processing core having at least one processing resource comprising: a first double precision (DP) pipeline to support double float operations, the first DP pipeline comprising a first set of floating point units (FPUs) configured in a pipelined configuration to enable new instructions to be issued to the first DP pipeline before previous instructions are complete; and a second DP pipeline to support the double float operations, wherein the second DP pipeline comprising a second set of FPUs configured in a pipelined configuration to enable new instructions to be issued to the first DP pipeline before previous instructions are complete.
    Type: Application
    Filed: November 18, 2022
    Publication date: May 23, 2024
    Applicant: Intel Corporation
    Inventors: Supratim Pal, Jiasheng Chen, Vikranth Vemulapalli, Subramaniam Maiyuran
  • Publication number: 20240168807
    Abstract: An apparatus to facilitate cross-thread register sharing for matrix multiplication compute is disclosed. The apparatus includes matrix acceleration hardware comprising a plurality of data processing units, wherein the respective plurality of data processing units are to: receive a decoded instruction for a first thread having a first register space, wherein the decoded instruction is for a matrix multiplication operation and comprises an indication to utilize a second register space of a second thread for an operand of the decoded instruction for the first thread; access the second register space of the second thread to obtain data for the operand of the decoded instruction; and perform the matrix multiplication operation for the first thread using the data for the operand from the second register space of the second thread.
    Type: Application
    Filed: November 18, 2022
    Publication date: May 23, 2024
    Applicant: Intel Corporation
    Inventors: Jorge Eduardo Parra Osorio, Guei-Yuan Lueh, Maxim Kazakov, Fangwen Fu, Supratim Pal, Kaiyu Chen
  • Patent number: 11989573
    Abstract: Techniques for providing adaptive virtual function (VF) drivers capable of operating with physical devices having a plurality of different hardware configurations are described. In one embodiment, for example, an apparatus may include logic to implement a virtual machine (VM), the logic to initialize an adaptive virtual function (VF) driver to facilitate communication between the VM and a physical device to be virtualized, establish communication between the adaptive VF driver and a physical function (PF) driver of the hypervisor for the physical device, activate a standard feature set for the adaptive VF driver to execute on a PF of the physical device, and negotiate activation of an advanced feature set for the adaptive VF driver to execute on the PF, the adaptive VF driver to provide the advanced feature set to the PF, the PF activate each feature of the advanced feature set supported by the PF.
    Type: Grant
    Filed: June 1, 2023
    Date of Patent: May 21, 2024
    Assignee: INTEL CORPORATION
    Inventors: Anjali Singhai Jain, Mitu Aggarwal, Parthasarathy Sarangam, Donald Wood, Jesse Brandeburg, Mitchell A. Williams
  • Patent number: 11990395
    Abstract: Embodiments include semiconductor packages and a method of forming the semiconductor packages. A semiconductor package includes a package substrate with a top surface, a corner portion, and a plurality of solder balls on the top surface of the package substrate. The semiconductor package also includes a pattern on the corner portion of the package substrate. The pattern may have a width substantially equal to a width of the solder balls. The pattern may also include a continuous line having solder materials. The semiconductor package may include a plurality of conductive pads on the package substrate. The conductive pads may be coupled to the pattern. The pattern may have a z-height that is substantially equal to a z-height of the solder balls, and have one or more outer edges, where the outer edges of the pattern are sidewalls. The sidewalls of the pattern may be substantially vertical or tapered sidewalls.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Xiaoying Tang, Zhicheng Ding, Bin Liu, Yong She, Zhijun Xu
  • Patent number: 11990403
    Abstract: Dielectric helmet-based approaches for back end of line (BEOL) interconnect fabrication, and the resulting structures, are described. In an example, a semiconductor structure includes a substrate. A plurality of alternating first and second conductive line types is disposed along a same direction of a back end of line (BEOL) metallization layer disposed in an inter-layer dielectric (ILD) layer disposed above the substrate. A dielectric layer is disposed on an uppermost surface of the first conductive line types but not along sidewalls of the first conductive line types, and is disposed along sidewalls of the second conductive line types but not on an uppermost surface of the second conductive line types.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Kevin L. Lin, Richard E. Schenker, Jeffery D. Bielefeld, Rami Hourani, Manish Chandhok
  • Patent number: 11989587
    Abstract: An apparatus and method for dynamic resource allocation with mile/performance markers.
    Type: Grant
    Filed: June 27, 2020
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Rameshkumar Illikkal, Andrew J. Herdrich, Francesc Guim Bernat, Ravishankar Iyer
  • Patent number: 11989595
    Abstract: An apparatus to facilitate disaggregated computing for a distributed confidential computing environment is disclosed. The apparatus includes one or more processors to: provide a remote GPU middleware layer to act as a proxy for an application stack on a client platform separate from the apparatus; communicate, by the remote GPU middleware layer, with a kernel mode driver of the one or more processors to cause the host memory to be allocated for command buffers and data structures received from the client platform for consumption by a command streamer of a remote GPU of the apparatus; and invoke, by the remote GPU middleware layer, the kernel mode driver to submit a workload generated by the application stack, the workload submitted for processing by the remote GPU using the command buffers and the data structures allocated in the host memory as directed by the command streamer.
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: May 21, 2024
    Assignee: INTEL CORPORATION
    Inventors: Reshma Lal, Pradeep Pappachan, Luis Kida, Soham Jayesh Desai, Sujoy Sen, Selvakumar Panneer, Robert Sharp
  • Patent number: 11990513
    Abstract: Gate-all-around integrated circuit structures having embedded GeSnB source or drain structures, and methods of fabricating gate-all-around integrated circuit structures having embedded GeSnB source or drain structures, are described. For example, an integrated circuit structure includes a vertical arrangement of horizontal nanowires above a fin, the fin including a defect modification layer on a first semiconductor layer, and a second semiconductor layer on the defect modification layer. A gate stack is around the vertical arrangement of horizontal nanowires. A first epitaxial source or drain structure is at a first end of the vertical arrangement of horizontal nanowires, and a second epitaxial source or drain structure is at a second end of the vertical arrangement of horizontal nanowires.
    Type: Grant
    Filed: November 16, 2022
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Cory Bomberger, Anand Murthy, Susmita Ghose, Siddharth Chouksey
  • Patent number: 11989076
    Abstract: In an example, an apparatus comprises logic, at least partially comprising hardware logic, to power on a first set of processing clusters, dispatch a workload to the first set of processing clusters, detect a full operating state of the first set of processing clusters, and in response to the detection of a full operating state of the first set of processing clusters, to power on a second set of processing clusters. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: May 21, 2024
    Assignee: INTEL CORPORATION
    Inventors: Balaji Vembu, Josh B. Mastronarde, Nikos Kaburlasos
  • Patent number: 11989074
    Abstract: An apparatus is provided, where the apparatus includes a plurality of components; a first sensing system to measure first power consumed by first one or more components of the plurality of components; a second sensing system to measure second power consumed by the apparatus; an analog-to-digital converter (ADC) to generate an identification (ID) that is representative of the second power consumed by the apparatus; and a controller to allocate power budget to one or more components of the plurality of components, based on the measurement of the first power and the ID.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Dorit Shapira, Anand Enamandram, Daniel Cartagena, Krishnakanth Sistla, Jorge P. Rodriguez, Efraim Rotem, Nir Rosenzweig
  • Patent number: 11991728
    Abstract: Various embodiments provide techniques for high frequency wireless communication. For example, embodiments include techniques for a transmission scheme for physical downlink control channel (PDCCH) with single carrier waveform; synchronization signal block (SSB) rate matching indication for NR unlicensed operation; beam acquisition for frequency division duplex (FDD) systems; and/or SSB patterns and multiplexing for downlink transmissions. Other embodiments may be described and claimed.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Gang Xiong, Daewon Lee, Yingyang Li, Alexei Davydov, Bishwarup Mondal, Gregory Morozov, Lopamudra Kundu, Yongjun Kwak
  • Patent number: 11989815
    Abstract: Cluster of acceleration engines to accelerate intersections.
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Prasoonkumar Surti, Carsten Benthin, Karthik Vaidyanathan, Philip Laws, Scott Janus, Sven Woop
  • Patent number: 11989817
    Abstract: Apparatus and method for more precise level-of-details transitions. For example one embodiment includes a graphics processor comprising: ray traversal hardware logic to traverse a ray through an acceleration structure to determine intersections between the ray and one or more object instances; and a level of detail selector to: set an instance comparison mask associated with an object instance to a first level of detail (LOD), the instance comparison mask comprising an N-bit value and one or more bits to indicate a type of comparison operation, compare a value from a ray mask with the N-bit value in accordance with the type of comparison operation to generate a comparison result, and determine whether to use the first LOD or a second LOD to render one or more pixels in accordance with the comparison result.
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Holger Gruen, Karthik Vaidyanathan
  • Patent number: 11990408
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a redistribution layer (RDL) having a conductive layer in a first dielectric layer, and a second dielectric layer over the conductive and first dielectric layers. The RDL comprises an extended portion having a first thickness that vertically extends from a bottom surface of the first dielectric layer to a topmost surface of the second dielectric layer. The electronic package comprises a die on the RDL, where the die has sidewall surfaces, a top surface, and a bottom surface that is opposite from the top surface, and an active region on the bottom surface of the die. The first thickness is greater than a second thickness of the RDL that vertically extends from the bottom surface of the first dielectric layer to the bottom surface of the die. The extended portion is over and around the sidewall surfaces.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Thomas Wagner, Jan Proschwitz
  • Patent number: 11990419
    Abstract: Techniques and mechanisms for providing physically unclonable function (PUF) circuitry at a substrate which supports coupling to an integrated circuit (IC) chip. In an embodiment, the substrate comprises an array of electrodes which extend in a level of metallization at a side of the insulator layer. A cap layer, disposed on the array, is in contact with the electrodes and with a portion of the insulator layer which is between the electrodes. A material of the cap layer has a different composition or microstructure than the metallization. Regions of the cap layer variously provide respective impedances each between a corresponding two electrodes. In other embodiments, the substrate includes (or couples to) integrated circuitry that is operable to determine security information based on the detection of one or more such impedances.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Georgios Dogiamis, Feras Eid, Adel Elsherbini, David Johnston, Jyothi Bhaskarr Velamala, Rachael Parker
  • Patent number: 11989861
    Abstract: A mechanism is described for facilitating deep learning-based real-time detection and correction of compromised sensors in autonomous machines according to one embodiment. An apparatus of embodiments, as described herein, includes detection and capturing logic to facilitate one or more sensors to capture one or more images of a scene, where an image of the one or more images is determined to be unclear, where the one or more sensors include one or more cameras. The apparatus further comprises classification and prediction logic to facilitate a deep learning model to identify, in real-time, a sensor associated with the image.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: May 21, 2024
    Assignee: INTEL CORPORATION
    Inventors: Wenlong Yang, Tomer Rider, Xiaopei Zhang
  • Patent number: 11990472
    Abstract: Gate-all-around integrated circuit structures having pre-spacer-deposition cut gates are described. For example, an integrated circuit structure includes a first vertical arrangement of horizontal nanowires and a second vertical arrangement of horizontal nanowires. A first gate stack is over the first vertical arrangement of horizontal nanowires, and a second gate stack is over the second vertical arrangement of horizontal nanowires. An end of the second gate stack is spaced apart from an end of the first gate stack by a gap. The integrated circuit structure also includes a dielectric structure having a first portion forming a gate spacer along sidewalls of the first gate stack, a second portion forming a gate spacer along sidewalls of the second gate stack, and a third portion completely filling the gap, the third portion continuous with the first and second portions.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Leonard P. Guler, Michael K. Harper, William Hsu, Biswajeet Guha, Tahir Ghani, Niels Zussblatt, Jeffrey Miles Tan, Benjamin Kriegel, Mohit K. Haran, Reken Patel, Oleg Golonzka, Mohammad Hasan
  • Patent number: 11990172
    Abstract: A memory device with internal row hammer mitigation couples to a memory controller. The memory controller or host can assist with row hammer mitigation by sending additional refresh cycles or refresh commands. In response to an extra refresh command the memory device can perform refresh for row hammer mitigation instead of refresh for standard data integrity. The memory controller can keep track of the number of activate commands sent to the memory device, and in response to a threshold number of activate commands, the memory controller sends the additional refresh command. With the extra refresh command the memory device can refresh the potential victim rows of a potential aggressor row, instead of simply refreshing a row that has not been accessed for a period of time.
    Type: Grant
    Filed: June 22, 2023
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Bill Nale, Christopher E. Cox
  • Patent number: 11990476
    Abstract: Semiconductor nanowire devices having (111)-plane channel sidewalls and methods of fabricating semiconductor nanowire devices having (111)-plane channel sidewalls are described. For example, an integrated circuit structure includes a first semiconductor device including a plurality of vertically stacked nanowires disposed above a substrate, each of the nanowires comprising a discrete channel region having <111> lateral sidewalls along a <110> carrier transport direction. The integrated circuit structure also includes a second semiconductor device including a semiconductor fin disposed above the substrate, the semiconductor fin having a channel region with a top and side surfaces, the channel region having <111> lateral sidewalls along a <110> carrier transport direction.
    Type: Grant
    Filed: June 16, 2022
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Cory E. Weber, Harold W. Kennel, Willy Rachmady, Gilbert Dewey
  • Patent number: 11991557
    Abstract: Methods, computer readable media, and apparatus for determining a receive (Rx) number of spatial streams (NSS) for different bandwidths (BWs) and modulation and control schemes (MCSs) are disclosed. An apparatus is disclosed comprising processing circuitry configured to decode a supported HE-MCS and a NSS set field, the supported HE-MSC and NSS set field received from an high-efficiency (HE) station. The processing circuitry may be further configured to determine a first maximum value of N receive (Rx) SS for a MCS and a bandwidth (BW), where the first maximum value of N Rx SS is equal to a largest number of Rx SS that supports the MCS for the BW as indicated by the supported HE-MCS and NSS set field; and, determine additional maximum values based on an operating mode (OM) notification frame, and a value of an OM control (OMC) field. Signaling for BW in 6 GHz is disclosed.
    Type: Grant
    Filed: November 18, 2022
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Yaron Alpert, Laurent Cariou, Po-Kai Huang, Xiaogang Chen, Arik Klein, Danny Ben-Ari, Robert J. Stacey
  • Patent number: 11990516
    Abstract: Quantum dot devices with independent gate control are disclosed. An example quantum dot device includes N parallel rows of gate lines provided over a quantum well stack. Each of the N parallel rows of gate lines defines a respective row of a quantum dot formation region in the quantum well stack and includes M parallel gate lines stacked above one another. The quantum dot device may further include, for each of the N×M gate lines, a gate that extends toward the quantum well stack, where, for an individual row of the N parallel rows, gates that extend toward the quantum well stack from the M parallel stacked gate lines are arranged above a respective row of a quantum dot formation region in the quantum well stack. In this manner, each of the N×M gates responsible for formation of different quantum dots may be controlled independently.
    Type: Grant
    Filed: September 21, 2021
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Hubert C. George, Ravi Pillarisetty, Brennen Karl Mueller, James S. Clarke
  • Patent number: 11990899
    Abstract: Described is an apparatus which comprises: a 4-state input magnet; a first spin channel region adjacent to the 4-state input magnet; a 4-state output magnet; a second spin channel region adjacent to the 4-state input and output magnets; and a third spin channel region adjacent to the 4-state output magnet. Described in an apparatus which comprises: a 4-state input magnet; a first filter layer adjacent to the 4-state input magnet; a first spin channel region adjacent to the first filter layer; a 4-state output magnet; a second filter layer adjacent to the 4-state output magnet; a second spin channel region adjacent to the first and second filter layers; and a third spin channel region adjacent to the second filter layer.
    Type: Grant
    Filed: January 19, 2021
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Sasikanth Manipatruni, Ian A. Young, Dmitri E. Nikonov, Uygar E. Avci, Patrick Morrow, Anurag Chaudhry
  • Patent number: 11989818
    Abstract: An apparatus and method for efficiently reconstructing a BVH. For example, one embodiment of a method comprises: constructing an object bounding volume hierarchy (BVH) for each object in a scene, each object BVH including a root node and one or more child nodes based on primitives included in each object; constructing a top-level BVH using the root nodes of the individual object BVHs; performing an analysis of the top-level BVH to determine whether the top-level BVH comprises a sufficiently efficient arrangement of nodes within its hierarchy; and reconstructing at least a portion of the top-level BVH if a more efficient arrangement of nodes exists, wherein reconstructing comprises rebuilding the portion of the top-level BVH until one or more stopping criteria have been met, the stopping criteria defined to prevent an entire rebuilding of the top-level BVH.
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Carsten Benthin, Sven Woop
  • Patent number: 11991265
    Abstract: A wireless communication device for asymmetrical frequency spreading including a processor configured to receive a frequency band message comprising a maximum difference and a minimum difference, wherein the maximum difference is between a maximum frequency of a sub-band and a signal frequency, and wherein the minimum difference is between the minimum frequency of the sub-band and the signal frequency compare the maximum difference and the minimum difference with each other; and generate a frequency shift based on the comparison.
    Type: Grant
    Filed: September 22, 2021
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Elan Banin, Evgeny Shumaker, Ofir Degani, Rotem Banin, Shahar Gross
  • Patent number: 11990364
    Abstract: Disclosed herein are methods for manufacturing IC components using bottom-up fill of openings with a dielectric material. In one aspect, an exemplary method includes, first, depositing a solid dielectric liner on the inner surfaces of the openings using a non-flowable process, and subsequently filling the remaining empty volume of the openings with a fill dielectric using a flowable process. Such a combination method may maximize the individual strengths of the non-flowable and flowable processes due to the synergetic effect achieved by their combined use, while reducing their respective drawbacks. Assemblies and devices manufactured using such methods are disclosed as well.
    Type: Grant
    Filed: December 23, 2022
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Ebony L. Mays, Bruce J. Tufts
  • Patent number: 11990996
    Abstract: Disclosed herein are techniques to provide forward error correction for a high-speed interconnect symbol stream, such as, DisplayPort. The symbol stream may be split into FEC blocks and parity bits generated for each of the FEC blocks. The parity bits may be interleaved, encoded, and transmitted over an interconnect along with the symbol stream to provide forward error correction for the symbol stream.
    Type: Grant
    Filed: October 17, 2022
    Date of Patent: May 21, 2024
    Assignee: INTEL CORPORATION
    Inventors: Nausheen Ansari, Ziv Kabiry, Gal Yedidia
  • Patent number: 11990932
    Abstract: A clock buffer or driver is gated pending reception of verifiable crypto keys. These clock buffer or divers remain gated, thus disabling a processor from any meaningful function, till crypto keys are decoded, verified, and applied to the clock buffer or driver. A low frequency pseudorandom frequency hopping time sequence is generated and used for randomizing spread-spectrum to modulate a reference clock (or output clock) of a frequency synthesizer. This hopping time sequence holds the key to unlocking the crypto keys. The PWM modulated crypto keys are carried by the hopping time sequence. To decode the PWM modulated crypto keys, the hopping time sequence is used. The reference clock which is modulated with crypto keys in the spread-spectrum is sent to a decoder (in a processor) along with the hopping time sequence. The crypto keys are decoded and then used to un-gate the clock buffer.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: May 21, 2024
    Assignee: INTEL CORPORATION
    Inventors: Mohamed A. Abdelmoneum, Nasser Kurd, Thripthi Hegde, Narayan Srinivasa, Peter Sagazio
  • Patent number: 11991021
    Abstract: Embodiments herein relate to recognition of an appliance state based on sensor data and determination of a response based at least in part on the appliance state. In various embodiments, an apparatus to recognize an appliance state may include a sensor data module to identify sensor data in one or more signals relating to data from one or more sensors associated with an appliance, an appliance state recognition module to determine an appliance state of the appliance based at least in part on the sensor data, a response module to determine a response based at least in part on the appliance state, and a transmission module to send the response to at least one of an appliance controller for the appliance or a presentation device. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Rita H. Wouhaybi, Mark D. Yarvis, Bradut Vrabete
  • Patent number: 11990427
    Abstract: Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, the electronic package comprises a mold layer having a first surface and a second surface opposite the first surface, and a plurality of first dies embedded in the mold layer. In an embodiment, each of the plurality of first dies has a surface that is substantially coplanar with the first surface of the mold layer. In an embodiment, the electronic package further comprises a second die embedded in the mold layer. In an embodiment, the second die is positioned between the plurality of first dies and the second surface of the mold layer.
    Type: Grant
    Filed: April 8, 2022
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Srinivas Pietambaram, Gang Duan, Deepak Kulkarni, Rahul Manepalli, Xiaoying Guo
  • Patent number: 11991054
    Abstract: Methods and apparatus for jitter-less distributed Function as a Service (FaaS) using flavor clustering. A set of FaaS functions clustered by flavor chaining is implemented to deploy one or more FaaS flavor clusters on one or more edge nodes, wherein each flavor is defined by a set of resource requirements mapped into a jitter Quality of Service (QoS) and is executed on at least one hardware computing component on the one or more edge nodes. One or more jitter controllers are implemented to control and monitor execution of FaaS functions in the one or more FaaS flavor clusters such that the functions are executed to meet jitter-less QoS requirements. Jitter controllers include platform jitter-less function controllers in edge nodes and a data center FaaS jitter-less controller. A jitter-less Software Defined Wide Area Network (SD-WAN) network controller is also provided to provide network resources used by FaaS flavor clusters and satisfy connectivity requirements between the edge nodes.
    Type: Grant
    Filed: October 6, 2020
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Francesc Guim Bernat, Ned M. Smith, Sunil Cheruvu, Alexander Bachmutsky, James Coleman
  • Patent number: 11990448
    Abstract: Disclosed herein are microelectronic assemblies including direct bonding, as well as related structures and techniques. For example, in some embodiments, a microelectronic assembly may include a first microelectronic component and a second microelectronic component coupled to the first microelectronic component by a direct bonding region, wherein the direct bonding region includes a first subregion and a second subregion, and the first subregion has a greater metal density than the second subregion. In some embodiments, a microelectronic assembly may include a first microelectronic component and a second microelectronic component coupled to the first microelectronic component by a direct bonding region, wherein the direct bonding region includes a first metal contact and a second metal contact, the first metal contact has a larger area than the second metal contact, and the first metal contact is electrically coupled to a power/ground plane of the first microelectronic component.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Feras Eid, Adel A. Elsherbini, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan
  • Patent number: 11990449
    Abstract: Embodiments include a semiconductor package, a package on package system, and a method of forming the semiconductor package. The semiconductor package includes a first redistribution layer, a stack of dies on the first redistribution layer, a second redistribution layer over the stack of dies and the first redistribution layer, and a plurality of interconnects coupled to the stack of dies and the first and second redistribution layers. The interconnects may extend substantially vertical from a top surface of the first redistribution layer to a bottom surface of the second redistribution layer. The semiconductor package may also include a mold layer between the first redistribution layer and the second redistribution layer. The plurality of interconnects may be through mold vertical wire interconnects. The first and second redistribution layers may be dual-sided redistribution layers. The semiconductor package may further include adhesive layers coupled to the stack of dies.
    Type: Grant
    Filed: January 14, 2019
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventor: Hyoung Il Kim
  • Patent number: 11991233
    Abstract: An apparatus and system to provide QoE metrics reporting mechanisms for RTP-based 360-degree video delivery in live immersive streaming and real-time immersive conversational service applications are described for both in-camera and network-based stitching. Initial and desired parameters for viewports used in a teleconference are exchanged, and the teleconference established using 360° media. RTP FoV reports sent during the teleconference each contain viewport orientation information, as well as information for the QoE metrics.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Ozgur Oyman, Gang Shen
  • Patent number: 11991025
    Abstract: Examples described herein include setting an equalizer tap setting and gain setting in a serializer/deserializer (SerDes). In some examples, determining an equalizer setting and gain setting occurs by causing a mean-square error cost scheme tracking to lock to an offset from a minimum of a cost of the mean-square error cost scheme without pausing error cost tracking. In some examples, the mean-square error cost scheme comprises a least mean square (LMS) scheme. In some examples, determining an equalizer setting comprises: applying increases or decreases to an equalizer setting, and an increase to an equalizer setting can be a different amount than an amount of decrease to an equalizer setting.
    Type: Grant
    Filed: December 2, 2020
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Itamar Levin, Tali Warshavsky
  • Patent number: 11989599
    Abstract: Systems, apparatuses and methods may provide for detecting an outbound communication and identifying a context of the outbound communication. Additionally, a completion status of the outbound communication may be tracked relative to the context. In one example, tracking the completion status includes incrementing a sent messages counter associated with the context in response to the outbound communication, detecting an acknowledgement of the outbound communication based on a network response to the outbound communication, incrementing a received acknowledgements counter associated with the context in response to the acknowledgement, comparing the sent messages counter to the received acknowledgements counter, and triggering a per-context memory ordering operation if the sent messages counter and the received acknowledgements counter have matching values.
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Mario Flajslik, James Dinan
  • Patent number: 11990709
    Abstract: Microelectronic assemblies, as well as related structures, devices, and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a microelectronic device having a hexagonal node configuration, wherein the hexagonal node configuration may include a differential signal node pair; a power node; and a plurality of ground nodes; and wherein the differential signal node pair, the power node, and the plurality of ground nodes are arranged in a hexagonal parallelogon pattern, wherein the differential signal node pair includes a first differential signal node adjacent to a second differential signal node, and wherein the power node is adjacent and symmetric to the differential signal node pair; and a microelectronic substrate electrically coupled to the microelectronic device.
    Type: Grant
    Filed: June 16, 2020
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Raul Enriquez Shibayama, Carlos Alberto Lizalde Moreno, Gaudencio Hernandez Sosa, Kai Xiao
  • Patent number: 11991376
    Abstract: Techniques related to immersive video coding are discussed. Such techniques include encoding an immersive video bitstream by applying scalable video coding to some portions of the immersive video and multiple description coding to other portions of the immersive video and decoding and/or rendering the immersive video bitstream using selective scalable video coding and multiple description coding responsive to indicators in the bitstream.
    Type: Grant
    Filed: April 9, 2021
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Jill Boyce, Basel Salahieh
  • Patent number: 11991764
    Abstract: This disclosure describes systems, methods, and devices related to an extreme high throughput (EHT) signaling structure. A device may establish a communication channel with one or more station devices (STAs). The device may generate an extreme high throughput signal field (EHT-SIG) of a header, wherein the EHT-SIG field comprises information associated with resource allocations (RUs). The device may generate a frame comprising the header. The device may assign a first RU to a first station device. The device may assign a second RU to the first station device, wherein the first RU or the second RU is an aggregation of a 26-tome RU and a neighboring RU. The device may cause to send the frame to the first station device.
    Type: Grant
    Filed: October 22, 2020
    Date of Patent: May 21, 2024
    Assignee: Intel Corporation
    Inventors: Po-Kai Huang, Laurent Cariou, Daniel Bravo