Sequential Electrolytic And Nonelectrolytic, Or Nonelectrolytic And Electrolytic Coating From The Same Bath Patents (Class 205/916)
  • Silver plating in electronics manufacture
    Patent number: 8986434
    Abstract: Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability.
    Type: Grant
    Filed: January 7, 2013
    Date of Patent: March 24, 2015
    Assignee: Enthone Inc.
    Inventors: Yung-Herng Yau, Thomas B. Richardson, Joseph A. Abys, Karl F. Wengenroth, Anthony Fiore, Chen Xu, Chonglun Fan, John Fudala
  • Seed layer deposition
    Patent number: 6824665
    Abstract: Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures.
    Type: Grant
    Filed: October 17, 2001
    Date of Patent: November 30, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: James G. Shelnut, David Merricks, Oleh B. Dutkewych, Charles R. Shipley
  • Electrolytic copper plating using a reducing agent
    Patent number: 5454930
    Abstract: An electrolytic copper plating method using a reducing agent is provided, wherein a catalyzed, electrically nonconductive substrate is dipped in a solution, which contains a copper salt, a copper-reducing agent for the acceleration of copper deposition and a copper-complexing agent and has a pH value of about 6 to 7.5, for electrolysis at a temperature of about 15.degree. C. to 50.degree. C., thereby forming an electrically conductive film of copper on said electrically nonconductive substrate. This method can be used in place of conventional electroless copper plating, dispense with any harmful substance such as formaldehyde, be easily analyzed and controlled, form an electrically conductive film of copper on an electrically nonconductive substrate with improved adhesion thereto, and is effectively applicable to making printed circuit boards in particular.
    Type: Grant
    Filed: July 28, 1994
    Date of Patent: October 3, 1995
    Assignee: Learonal Japan Inc.
    Inventors: Takeshi Miura, Masaru Seita
  • Pseudo-electroless, followed by electroless, metallization of nickel on metallic wires, as for semiconductor chip-to-chip interconnections
    Patent number: 5264107
    Abstract: A nickel plug (31) filling an aperture in an insulating layer (30), such as polyimide, separating two metallization levels of copper wires (28, 25) is formed by an electroless process in a plating bath (solution) containing ions of hypophosphite and of nickel. In preparation for this electroless process, the copper wires (28, 25) are first plated with a nickel layer (29) by a pseudo-electroless process-that is, a process in which the copper wires (28, 25) are located in contact with an underlying extended chromium layer (14) that is placed in electrical contact (including intimate physical contact) with an auxiliary metallic member (41) that contains nickel, while both the copper wires (28, 25), the chromium layer (14), and at least a portion of the external metallic layer (41) are immersed in a plating solution likewise containing ions of hypophosphite and of nickel.
    Type: Grant
    Filed: December 17, 1991
    Date of Patent: November 23, 1993
    Assignee: AT&T Bell Laboratories
    Inventors: Richard S. Bentson, Jerry J. Rubin, Frank Stepniak