Abstract: A heating apparatus for induction heating is disclosed. The heating apparatus may comprise a bearing ring, at least one bearing element disposed in the bearing ring, and a braze material adjacent to the at least one bearing element and the bearing ring. The heating apparatus may additionally comprise an inductor positioned radially adjacent to at least a portion of the bearing ring. A current source may be electrically coupled to the inductor. A bearing orienting member may also abut a surface of the at least one bearing element. The bearing orienting member may orient a surface of the at least one bearing element. A heating method is also disclosed.

Abstract: Aspects of the invention include receiving a printed circuit board (PCB) having one or more of mounting pads thereon, determining a stencil for applying a solder paste to the one or more mounting pads, the stencil having a smallest aperture for a component requiring a standoff, determining a maximum threshold size for standoff particles based on the smallest aperture, determining a first concentration of the standoff particles based on the smallest aperture, determining a minimum threshold size for standoff particles to create the standoff for the component, determining a second concentration of the standoff particles to create a three-standoff seating plane for the component, introducing the standoff particles to the solder paste, the standoff particles in the solder paste having a concentration between the first concentration and the second concentration, and a size between the maximum threshold size and the minimum threshold size.

Abstract: A structure formed from composite material and method of forming a composite structure is disclosed in which one or more metal layers are disposed on a composite structural member.

Abstract: The invention relates to a process for metallizing ferrite ceramics, which comprises the following steps: arrangement of a contact element composed of copper or a copper alloy on a surface of the ferrite ceramic, melting of the contact element at least in the region in which the contact element contacts the surface of the ferrite ceramic, and cooling of the contact element and the ferrite ceramic to below the melting point of copper or the copper alloy.

Abstract: Described is a blade for a high-speed turbine stage of an aircraft gas turbine, in particular of an aircraft engine, the blade including a radially inner blade root, a radially outer shroud, and an airfoil extending between the blade root and the shroud. It is provided that the outer shroud have only a single sealing element, which projects radially from the shroud, in particular only a single sealing fin.

Abstract: A method for producing a member for a semiconductor manufacturing apparatus includes (a) a step of providing an electrostatic chuck, a supporting substrate, and a metal bonding material, the electrostatic chuck being made of a ceramic and having a form of a flat plate, the supporting substrate including a composite material having a difference in linear thermal expansion coefficient at 40 to 570° C. from the ceramic of 0.2×10?6/K or less in absolute value, and (b) a step of interposing the metal bonding material between a concave face of the supporting substrate and a face of the electrostatic chuck opposite to a wafer mounting face, and thermocompression bonding the supporting substrate and the electrostatic chuck at a predetermined temperature to deform the electrostatic chuck to the shape of the concave face.

Abstract: The disclosure describes techniques for joining a first part including a ceramic or a CMC and a second part including a ceramic or a CMC using brazing. A technique may include positioning a filler material in a joint region between the first and second parts and a metal or alloy on a bulk surface of the filler material. The metal or alloy may be locally heated to melt the metal or alloy, which may infiltrate the filler material. A constituent of the molten metal or alloy may react with a constituent of the filler material to join the first and second parts. Another technique may include depositing a powder that includes the filler material and the metal or alloy in the joint region. Substantially simultaneously with depositing the powder, the powder may be locally heated. A constituent of the molten metal or alloy may react with a constituent of the filler material to join the first and second parts.

Abstract: The present invention relates to a copper ceramic substrate incorporating a ceramic carrier, and a copper layer joined to a surface of the ceramic carrier, wherein the copper layer incorporates at least one first layer, which faces the ceramic carrier and has an average first grain size, and a second layer, which is arranged on the face of the copper layer facing away from the ceramic carrier and has an average second grain size, the second grain size being smaller than the first grain size.

Abstract: A blade (10) for a turbomachine is provided. The blade (10) includes an airfoil (16) having at least one thickening (22) on a pressure side (20) of the airfoil (16). The thickening (22) has a region (B) of constant thickness (D). A turbomachine, a compressor and a turbine having stator vanes and/or rotor blades including at least one such blade (10) is also provided.

Abstract: The present invention provides a ceramic metal circuit board including a ceramic substrate and metal plates bonded to both surfaces of the ceramic substrate through respective bonding layers, wherein a metal film is provided on a surface of one metal plate bonded to one surface of the ceramic substrate; and at least a part of another metal plate bonded to another surface of the ceramic substrate is not provided with the metal film. Preferably, a protruding portion is formed as a portion of the bonding layer so as to protrude from a side surface of each of the metal plates. According to the above-described configuration, it is possible to provide a ceramic circuit board which is easy to use according to the parts to be bonded and is excellent in heat-cycle resistance characteristics.

Abstract: Methods and apparatus are presented for retaining a dome lens in a lighting element that provides a projection of light forming a substantially uniform bright light on a surface a known distance from the lighting element. The lighting element includes a dome lens that is removably positioned proximal to a light source, such that the light source is retained at a location within a focal length of a projection lens and at or within a focal length of the dome lens. The dome lens magnifies the light outputted by the light source, such that the projected light is brighter than the light generated by the light source.

Abstract: A technique for joining parts of incompatible metals involves cold spraying a 150-900 micron thick layer of a metal compatible with the second part onto the first part, and friction stir joining the parts by lap welding while keeping a tool of the FSJ tool at least 300 microns away from the first part (less layer) throughout the joining, to avoid damaging the cold spray to first part interface, and formation of intermetallics. Fatigue resistance was tested, with and without a sealant.

Abstract: According to various embodiments, a semiconductor device may include: a contact pad; a metal clip disposed over the contact pad; and a porous metal layer disposed between the metal clip and the contact pad, the porous metal layer connecting the metal clip and the contact pad with each other.

Abstract: It is an objective of the invention to provide a conductive joint article exhibiting electrical joinability comparable to that of solder joining of easy-to-solder joinable metals even when a joined member of the conductive joint article is made of a hard-to-solder joinable metal. There is provided a conductive joint article with conductive joined members electrically joined via a joining layer, at least one of the joined members being made of a hard-to-solder joinable metal. The joining layer comprises an oxide glass phase and a conductive metal phase. The oxide glass phase includes vanadium as a major constituent and at least one of phosphorus, barium and tungsten as an accessory constituent, and has a glass transition point of 390° C. or less. And, connection resistance between the joined members exhibits less than 1×10?5 ?/mm2.

Abstract: The invention relates to a method for producing a metal-ceramic substrate including first and second metallizations and at least one ceramic layer incorporated between the first and second metallizations. Advantageously, first and second metal layers and the at least one ceramic layer are stacked superposed, and in such a way that the free edge sections, of the first and second metal layers respectively, project beyond the edges of the at least one ceramic layer and the first and second metal layers are deformed toward each other in the region of the projecting free edge sections and directly connected to each other in order to form a gas-tight, sealed metal container enclosing a container interior for receiving the at least one ceramic layer.

Abstract: In a step (a), a ceramic substrate, a brazing material including a metal having a large thermal expansion coefficient, a porous body having a smaller thermal expansion coefficient than the brazing material, and a feeding terminal are placed on a joint surface in such a way that a joint surface of the feeding terminal faces a joint surface of the ceramic substrate. In a step (b), the brazing material is fused to allow the brazing material to penetrate into the pores of the porous body. In this manner, a joint layer containing the brazing material and the porous body is formed, and the joint surface of the ceramic substrate and the joint surface of the feeding terminal are joined to each other through the joint layer.

Abstract: Vector signaling codes are synergistically combined with multi-level signaling, the increased alphabet size provided by the multi-level signaling enabling a larger codeword space for a given number of symbols, at the cost of reduced receiver detection margin for each of the multiple signal levels. Vector signaling code construction methods are disclosed in which code construction and selection of multi-level signal levels are coordinated with the design of an associated receive comparator network, wherein modified signal levels encoded and emitted by the transmitter result in increased detection margin at the receive comparators.

Abstract: A method of attachment between a metal collector and a carbon felt of a battery includes the steps of impregnation of the pores of the carbon felt with a mixture of metal powder and of a binder, locally performed in at least one predetermined area of the carbon felt; and spot welding between the metal collector and the carbon felt impregnated with the metal powder, performed at the level of said at least one predetermined area.

Abstract: In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier that are separated from each other, the terminal carrier has spring elements, which are part of a spring plate. The spring plate has a plurality of recesses disposed next to each other for forming a corresponding plurality of receiving pockets for the semi-conductor components, wherein the spring elements are formed from the spring plate in one piece.

Abstract: A rotor blade for a gas turbine configured for use within a row of samely configured rotor blades. The rotor blade may further include: an airfoil defined between pressure and suction faces; and a midspan shroud comprising a pressure wing and a suction wing extending from the airfoil. The pressure wing and the suction wing of the midspan shroud may be configured so to cooperatively form an interface between installed neighboring ones of the rotor blades within the row of samely configured rotor blades. One of the pressure wing and the suction wing may be designated a first wing, and the first wing may include a chamber hollowed through a first surface of the first wing. The first surface of the first wing may include one of: a circumferential face formed at a distal end of the first wing; and a contact face of the first wing.

Abstract: A method for producing an alloy self-brazing strip. In an aspect, a process is used to generate a multi-layer alloy strip made up of at least one base layer of with a least another layer of material, that when both the material and base layer are brazed, form an alloy. In an aspect, the other layer of material can include a metal. The base layer can include titanium or a titanium alloy.

Abstract: A semiconductor device includes a base substrate and a semiconductor chip on the base substrate, the semiconductor chip including a first layer structure and a second layer structure opposite to the first layer structure, at least one of the first and second layer structures including a semiconductor device portion, and a bonding structure between the first layer structure and the second layer structure, the bonding structure including a silver-tin (Ag—Sn) compound and a nickel-tin (Ni—Sn) compound.

Abstract: A rotor blade for a gas turbine configured for use within a row of samely configured rotor blades. The rotor blade may include an airfoil defined between pressure and suction faces and a midspan shroud. The midspan shroud may include pressure and suction wings. The pressure wing and suction wing of the midspan shroud may be configured so to cooperatively form an interface between neighboring ones of the rotor blades within the row of samely configured rotor blades. The interface may include: a pressure wing contact face disposed on the pressure wing that opposes across a gap a suction wing contact face disposed on the suction wing; and a predetermined offset between the pressure wing contact face and suction wing contact face. The predetermined offset may be configured for desirably aligning the contact faces when an expected operating condition closes of the gap.

Abstract: A bicycle brake pad includes a friction member and a first support member. The friction member includes a first intermetallic compound. The friction member and the first support member are, at least partially, chemically coupled to each other.

Abstract: A semiconductor device includes a base substrate and a semiconductor chip on the base substrate, the semiconductor chip including a first layer structure and a second layer structure opposite to the first layer structure, at least one of the first and second layer structures including a semiconductor device portion, and a bonding structure between the first layer structure and the second layer structure, the bonding structure including a silver-tin (Ag—Sn) compound and a nickel-tin (Ni—Sn) compound.

Abstract: Various embodiments of the invention include turbine buckets and systems employing such buckets. Various particular embodiments include a turbine bucket having: an airfoil having: a suction side; a pressure side opposing the suction side; a leading edge spanning between the pressure side and the suction side; and a trailing edge opposing the leading edge and spanning between the pressure side and the suction side; a pair of part-span connectors extending from the airfoil at the suction side and the pressure side, respectively, wherein each of the pair of part-span connectors is located between approximately 40 percent and approximately 70 percent of a radial span measured from the base to a radial tip of the airfoil; and a base connected with a first end of the airfoil along the suction side, pressure side, trailing edge and the leading edge.

Abstract: A method including: submerging a ceramic preform (10) in a layer (12) of powdered superalloy material (14), wherein the preform defines a desired shape of a channel (60, 62, 64, 78) to be formed in a layer (42) of superalloy material; melting the powdered superalloy material around the preform without melting the preform; and cooling and re-solidifying the superalloy material around the preform to form the layer of superalloy material with the preform defining the shape of the channel therein.

Abstract: A rotor blade for a gas turbine that is configured for use within a row of samely configured rotor blades attached to and circumferentially spaced about a rotor disc. The rotor blade may further include: an airfoil defined between pressure and suction faces; and a midspan shroud comprising a pressure wing and a suction wing extending from the airfoil. The pressure wing and the suction wing of the midspan shroud may be configured so to cooperatively form an interface between installed neighboring ones of the rotor blades within the row of samely configured rotor blades. The interface may include a first one of the pressure wing and the suction wing disposed as an upstream wing and a remaining other one of the pressure wing and the suction wing disposed as a downstream wing. The interface may include the upstream wing and the downstream wing configured as a downstream narrowing step.

Abstract: A combination bit and bit holder assembly includes a bit holder having a forward body portion and a shank. The forward body portion includes an upper end and a lower end. An insert is mounted in the bore of the upper end of the body portion. The insert also includes a central bore that receivingly retains a receiving cup. The receiving cup includes a bottom portion and an annular flange that extends from the bottom portion and defines a hollow forward portion. A bit is mounted in the hollow forward portion of the receiving cup which is configured to have a ductility that provides impact absorption to the bit.

Abstract: One aspect generally relates to a composite, having a layer sequence. The layer sequence includes as layers a first layer, including a first ceramic, and first layer surface, a second layer, including a second ceramic, superimposing the first layer surface. The layer sequence includes a hole, connecting through each layer of the layer sequence; and a cermet. The cermet includes a first part and a second part. The first part is included by the hole. The second part is included between the first layer and the second layer. The cermet is in one piece.

Abstract: Top and bottom metal plates of a DMB panel stack are simultaneously direct-bonded to the central ceramic sheet in a single high-temperature step. During this step, the DMB panel rests on an array of very small upwardly projecting ceramic contacts of a ceramic carrier. An amount of unoxidized carbon (e.g., a layer of graphite) is disposed on each contact projection such that an amount of carbon is disposed between the top of the contact projection and the metal oxide skin of the bottom metal plate. The carbon bonds with oxygen from the metal oxide skin, thereby preventing connection or direct-bonding of the ceramic contact projection to the second metal plate. This reduces imperfections in the metal of the bottom plate and reduces the amount of ceramic particles bonded to metal at contact sites. As a result, less post-bonding processing is required to make a high quality DMB substrate.

Abstract: A display device according to an embodiment includes a display panel and a circuit board connected to the display panel. The circuit board is connected to a bonding area of the display panel by an anisotropic conductive film. The display panel includes a cover insulating layer exposing the bonding area. The cover insulating layer includes at least one trench crossing an edge area, which is located outside the bonding area.

Abstract: A hot gas path component includes a substrate having an outer surface and an inner surface. The inner surface of the substrate defines at least one interior space. At least a portion of the outer surface of the substrate includes a recess formed therein. The recess includes a bottom surface and a groove extending at least partially along the bottom surface of the recess. A cover is disposed within the recess and covers at least a portion of the groove. The groove is configured to channel a cooling fluid therethrough to cool the cover.

Abstract: An adjustable camshaft of an internal combustion engine may include an outer shaft and an inner shaft arranged coaxially to the outer shaft and rotatable over a predefined angle. At least one first cam may be connected rotationally fixedly to the inner shaft. A second cam may be arranged beside the first cam and may be connected rotationally fixedly to the outer shaft. The first cam and the second cam may each be operatively associated with a common valve. Rotation of the first cam relative to the second cam may impart an extension of a valve opening time of the valve. The first cam and the second cam may each include an identical circular segment section in an elevated region of valve lift. The circular segment section of the first cam and the second cam may merge without interruptions during rotation about the predefined angle range.

Abstract: An integrated circuit structure includes a substrate and a metal pad over the substrate. A post-passivation interconnect (PPI) line is connected to the metal pad, wherein the PPI line includes at least a portion over the metal pad. A PPI pad is connected to the PPI line. A polymer layer is over the PPI line and the PPI pad, wherein the polymer layer has a thickness greater than about 30 ?m. An under-bump metallurgy (UBM) extends into an opening in the polymer layer and electrically connected to the PPI pad.

Abstract: A device includes a substrate, a metal pad over the substrate, and a metal trace electrically disconnected from the metal pad. The metal pad and the metal trace are level with each other. A passivation layer includes a portion overlapping an edge portion of the metal pad. A metal pillar is overlying the metal pad, and is electrically connected to the metal pad. The metal trace has a portion overlapped by the metal pillar.

Abstract: Wafers and methods of forming solder balls include forming a final redistribution layer over terminal contact pad on a surface of a wafer. The wafer includes multiple bulk redistribution layers. A hole is etched in the final redistribution layer to expose the terminal contact pad. Solder is injected into the hole using an injection nozzle that is in direct contact with the final redistribution layer. The final redistribution layer is etched back. The injected solder is reflowed to form a solder ball.

Abstract: A method of joining a metal-ceramic substrate having metallization on at least one side to a metal body by using metal alloy is disclosed. The metal body has a thickness of less than 1.0 mm and the metal alloy contains aluminum and has a liquidus temperature of greater than 450° C. The resulting metal-ceramic module provides a strong bond between the metal body and the ceramic substrate. The resulting module is useful as a circuit carrier in electronic appliances, with the metal body preferably functioning as a cooling body.

Abstract: A passive heat pipe structure used in a wearable device includes a multilayer stack of graphite sheets, each sheet having a plane high thermal conductivity oriented along a first axis and a plane of lower thermal conductivity along a second axis different from the first axis. The stack has a three-dimensional shape including a length and a width where the length is longer than the width and the first axis aligns parallel to said length, the multilayer stack having a height less than the width. A plurality of bonding layers interspersed between each sheet of the multilayer stack, each bonding layer thermally coupling each sheet to a respective adjacent sheet. The bonding layers may comprise metal layers or adhesive layers.

Abstract: Disclosed herein is an X-ray source having cooling and shielding functions. The X-ray source includes an X-ray generation unit (100) which has one or more insulation columns (160) and emits X-rays in a vacuum; a cooling unit (180) which is provided around a periphery of the X-ray generation unit and removes heat generated from the X-ray generation unit; and a shielding unit (190) which is provided around a periphery of the cooling unit and shields an area exposed to X-rays other than the areas related to the emission of the X-rays.

Abstract: A method for manufacturing a structure implementing temporary bonding a substrate to be handled with a handle substrate, including: providing the substrate to be handled covered with a first metal layer, the first layer having a first grain size; providing the handle substrate covered with a second metal layer, the second layer having same composition as the first metal layer and a second grain size different from the first grain size; assembling the substrate to be handled and the handle substrate by thermocompression assisted direct bonding on the first and second metal layers; possibly treating the substrate to be handled assembled to the handle substrate; disassembling the assembly of the substrate to be handled and the handle substrate to form the structure, including an embrittlement thermal annealing of the assembly resulting in the handle substrate being detached.

Abstract: An abrasive article includes abrasive particles contained within a hybrid bond that may include a metal bond material and an organic bond material, the article having an average thickness of 250 microns or less and the metal bond material including a solid solution phase and an intermetallic phase distinct from the solid solution phase.

Abstract: A method includes disposing ZrH2 nanoparticles on a first metallic material. The method includes performing a diffusion bonding operation to bond the first metallic material to a second metallic material. At least one of the first metallic material or the second metallic material includes a surface oxide layer. During the diffusion bonding operation, the ZrH2 nanoparticles chemically react with the surface oxide layer.

Abstract: A member for semiconductor manufacturing device includes a susceptor which is a ceramic plate formed of AlN and a gas introduction pipe which is joined to the susceptor. An annular pipe joining bank is provided at a position of the susceptor facing a flange of the gas introduction pipe. In addition, a pipe brazed part is formed between the flange and the pipe joining bank. The flange has a width of 3 mm or more and a thickness of from 0.5 to 2 mm. It is preferable that the height of the pipe joining bank be 0.5 mm or more, the edge of the bank facing the outer edge of the flange. be chamfered as designated by C0.3 or more or rounded as designated by R0.3 or more.

Abstract: Embodiments disclosed herein are directed to bearing assemblies that include integrated lubrication, bearing apparatuses including such bearing assemblies, and related methods. For example, a lubricated bearing assembly may include a lubricant that may lubricate the bearing surface thereof during operation of the lubricated bearing assembly and/or bearing apparatus including the lubricated bearing assembly.

Abstract: A system and method for providing a post-passivation and underbump metallization is provided. An embodiment comprises a post-passivation layer that is larger than an overlying underbump metallization. The post-passivation layer extending beyond the underbump metallization shields the underlying layers from stresses generated from mismatches of the materials' coefficient of thermal expansion.

Abstract: A noise suppression cable includes an electrical wire, a first magnetic material including a pair of first surfaces formed along an axis direction of the electrical wire and a convex portion projecting from the first surfaces, and a second magnetic material including a pair of second surfaces disposed on a periphery of the electrical wire, the pair of the second surfaces contacting the pair of the first surfaces such that a tubular shape is formed by the first and second magnetic materials. The first magnetic material and the second magnetic material are configured to generate a compression stress in the convex portion of the first magnetic material by receiving an external force so as to reduce a relative permeability of the convex portion.

Abstract: An adapter has two conductors each with a U-shaped bend forming upper longer legs and lower shorter legs. The conductors face each other with the longer legs linearly aligned with each other and the shorter legs aligned with each other, thereby forming a first gap between the longer legs and a second gap between the shorter legs. The first gap is substantially smaller than the second gap, so that an electrical package can be placed across the first gap to contact the two upper longer legs, while the two shorter legs are spaced further apart to span a larger gap between conductors of a connector. Thus, the adapter enables the electrical package to be connected to conductors having a gap that is larger than the electrical package.

Abstract: An electrode component includes a ceramic substrate, two electrode layers formed on two opposite surfaces of the ceramic substrate, two pins respectively connected to the two electrode layers, and an insulating layer enclosing the ceramic substrate, the electrode layers and a portion of each pin. Each electrode layer is formed of two or more base metal materials or alloys thereof, and the concentrations of the base metal materials progressively vary across the electrode layer. Accordingly, the production cost is lowered, environmental pollution caused by evaporation and thermal dissolution of organic solvent can be prevented, risk of separable electrode interface at high-voltage discharge is mitigated, and the fabrication process of the electrode layer is shortened while maintaining bonding strength between the electrode layers and the ceramic substrate and solderability between the electrode layers and the pins.

Abstract: In a method for brazing a sheet material without use of flux, an inert gas is firstly introduced into an oxygen pump to reduce an oxygen partial pressure in the inert gas to 1×10?10 Pa or less, and the sheet material is heated in a brazing furnace in an atmosphere of the inert gas discharged from the oxygen pump. A core alloy of the sheet material or a brazing filler alloy cladded to a surface of the core alloy contains Mg. Both the core alloy and the brazing filler alloy may contain Mg. Accordingly, brazability of the sheet material is sufficiently improved.