Abstract: A technique capable of shortening process time for plasma cleaning is provided. A method of manufacturing a semiconductor device includes a step of preparing a substrate including a plurality of device regions each including a semiconductor chip electrically connected to a plurality of terminals formed on a main surface by a wire, a step of delivering the substrate while emitting plasma generated in atmospheric pressure to the main surface of the substrate, a step of delivering the substrate while capturing an image of a region of the main surface of the substrate and a step of forming a sealing body by sealing the semiconductor chip and the wire with a resin.

Abstract: For a differentiated treatment of individual motion segments of the spine, a plastic rod (41, 42, 46) for the dynamic stabilization of the spine has different degrees of stiffness in its longitudinal direction. The different rod segments are interconnected along an oblique plane (13).

Abstract: The present invention relates to a piercing apparatus and a piercing method which drive a punch. The piercing apparatus includes a local heating device for heating part of the workpiece in a temperature range less than a melting point of the workpiece and a punch driving device for driving the punch toward the part of the workpiece which was heated by the local heating device. The piercing method includes a local heating step for heating part of the workpiece in a temperature range less than a melting point of the workpiece and a stamping step for driving the punch toward the part of the workpiece which was heated in the local heating step.

Abstract: A bobbin tool is disclosed that includes a top shoulder, a bottom shoulder, and an axial pin that extends between the top and bottom shoulders. The bottom shoulder has an annular shoulder end surface, a back surface opposite the annular shoulder end surface, and a side surface that joins the annular shoulder end surface and the back surface. One or more and radially-extending blades may be disposed on the side surface of the bottom shoulder and/or one or more axially-extending blades may be disposed on the back surface. The one or more blades provide the bobbin tool with an ability to friction stir weld a variable thickness workpiece assembly, axially plunged through the workpiece assembly along an axis of rotation of the bobbin tool, and/or be extracted through the workpiece assembly along an axis of rotation of the bobbin tool.

Abstract: A method for soldering three-dimensional integrated circuits is provided. A three-dimensional integrated circuit is heated to a base temperature, wherein the base temperature is lower than the melting point of a solder, and wherein the three-dimensional integrated circuit includes a plurality of solder bumps. A first on-chip heat source reflows a first portion of the plurality of solder bumps that is within a first local-hot-zone. A second on-chip heat source reflows a second portion of the plurality of solder bumps that is within a second local-hot-zone.

Abstract: A tractor unit mounting mechanism includes a clamping assembly that is configured to engage and disengage a tractor unit to a guide track. The guide track includes a first rail and a second rail. The mounting assembly also includes at least one pivot block set that has a first pivot block and a second pivot block. Each of the first pivot block and the second pivot block includes a first rolling device and a second rolling device. When the tractor unit is in a disengaged position, a first distance between an outer portion of the first rail and an outer portion of the second rail is greater than a second distance between the first rolling devices of the at least one pivot block set, and the first distance is less than a third distance between the second rolling devices of the at least one pivot block set.

Abstract: An apparatus for transferring metal solidified in blind cavities is described incorporating a first flexible tape having blind cavities, a second flexible tape having adhesive regions, rollers for guiding respective tapes and means for moving respective tapes. Also a conveyor belt having blind or through cavities, rollers and a vibration transducer or pressurized gas is described to release solidified metal in the cavities.

Abstract: Methods of manufacture include welding two or more elongate members together to define an elongate weldment, wherein the welding results in a weld region that is in tension and regions adjacent to the weld region that are in compression, and longitudinally stretching the elongate weldment. Tools and systems for manufacturing elongate weldments, as well as apparatuses, such as aircraft, that include elongate weldments, also are disclosed.

Abstract: A process and tools for forming spherical metal balls is described incorporating molds, injection molded solder, a liquid or gaseous environment to reduce or remove metal oxides and an unconstrained reflow of metal in a heated liquid or gas and solidification of molten metal in a cooler liquid or gas.

Abstract: In some examples, an electrode plate K is conveyed to a gap 230 of a pair of stacking drums 210 and 220 with a conveying section 100. In synchronization with conveyance of the electrode plate K, the drums 210 and 220 feed a pair of separators S each formed into a predetermined shape with the separators S adhering to corresponding peripheral surfaces of the pair of drums 210 and 220. While feeding the electrode plate K forward in a generally horizontal manner, the separators S are sequentially stacked on both surfaces of the electrode plate K in synchronized with rotations of the drums 210 and 220, and both edge portions of the separators S are welded.

Abstract: A testing probe card for wafer level testing semiconductor IC packaged devices. The card includes a circuit board including testing circuitry and a testing probe head. The probe head includes a probe array having a plurality of metallic testing probes attached to a substrate including a plurality of conductive vias. In one embodiment, the probes have a relatively rigid construction and have one end that may be electrically coupled to the vias using a flip chip assembly solder reflow process. In one embodiment, the probes may be formed from a monolithic block of conductive material using reverse wire electric discharge machining.

Abstract: A method for bonding a first bond surface of a first solid substrate consisting of a first material to a second bond surface of a second solid substrate consisting of a second material, said method comprising the steps of: working one of the first and/or second bond surfaces with a cutting tool at a speed vs that is below a critical speed vk and at a temperature Ts that exceeds a critical temperature Tk, down to a surface roughness O that is less than 1 ?m; bringing the first solid substrate into contact with the second solid substrate at the bond surfaces, and exposing the solid substrates that are in contact to temperature in order to form a permanent bond that is at least primarily produced by recrystallization at the bond surfaces.

Abstract: An apparatus for producing a tailored sheet metal strip, comprising at least one welding station, by means of which at least two sheet metal strips can be welded to one another along their longitudinal edges, and at least two strip feeding devices for respectively feeding one of the sheet metal strips into the at least one welding station, wherein the at least two strip feeding devices and the at least one welding station define a production line. A further-processing station for further processing is integrated in the production line downstream of the at least one welding station in the strip running direction and is equipped with tools for applying reinforcing material, to local points of at least one of the sheet metal strips which are connected to one another, for punching holes and/or for forming at least one of the sheet metal strips which are connected to one another.

Abstract: [Problem] To provide a hollow component that presents no problem in its strength and working environment and the cost standpoint although it is made of thin sheet metal members, and a method manufacturing such a component. [Means of Solving the Problem] It is characterized in applying a flow drilling process on a sheet metal member 20 of a pair of sheet metal members 20 and 21 having a gap G between them to form a first collar part C1, and applying a flow drilling process on a sheet metal member 21 to form a second collar part C2 as well as to cause an inner tip of the second collar part C2 to fuse with an inner tip of the first collar part C1 so as to form a cylindrical connection member C to strengthen a flat sheet metal members.

Abstract: A process for dressing a solder pad removes excess solder from locations that should be free of solder, such as circuit traces, other solder pads, and components near the solder pad being dressed. A first area of a substrate comprises solder to be removed and is heated to a first temperature. A second area of the substrate is heated to a second temperature. A vacuum nozzle is heated to a third temperature sufficient to melt the solder and is scanned across the area to be dressed, melting and vacuuming away the excess solder. The scanning process is controlled using a computer numerical controlled (CNC) machine.

Abstract: A device and a method for the positionally accurate arrangement of two material ends located opposite each other. The device includes two carriers with always one fixing device for each material end, wherein at least one of the two carriers is slidably guided relative to the second of the carriers, and at least the first carrier has a first adjusting member and a second adjusting member connected to the first adjusting member, wherein the adjusting members form a drive by means of which the first carrier is slidable against the second carrier.

Abstract: Weld stress compensation system and method comprising: 1) a primary tube/rod clamp; 2) a secondary tube/rod clamp for selectively and accurately, angularly positioning the secondary tube relative to the primary tube. The secondary clamp is transferable while a secondary tube/rod is clamped therein to: 3) a saddle cutting fixture to produce a concave, relieved portion in the end of the secondary tube/rod with flanking flanges that fit precisely over the primary tube at the join intersection; 4) a miter-cut fixture for miter cutting of tube/rod ends to fit flat surfaces or conversely-cut tubes/rods for angular joins; and 5) a welding fixture for precise angular positioning of a miter cut tube/rod to a deck, wall, or stair plate. The primary clamp includes an adjustable pressure pad that applies pressure to the side of the primary tube opposite the secondary tube weld join line thereby preventing warping due to weld stresses.

Abstract: Disclosed is an apparatus for electrically interconnecting a plurality of solar cells. The apparatus comprises: i) a roller operative to roll along a solar cell to press an electrical conductor against an electrical contact of the solar cell, the electrical conductor being for electrically interconnecting the solar cell with one or more other solar cells; and ii) a heat-generating device arranged and configured to provide heat for soldering the electrical conductor to the electrical contact of the solar cell while the roller is pressing the electrical conductor against the electrical contact of the solar cell. A method of electrically interconnecting a plurality of solar cells, and a mechanism for laying and soldering an electrical conductor onto a solar cell, are also disclosed.

Abstract: A clamping tool for rework process includes a casing, two clamping members and a thermal expansion member. The casing has a base. The two clamping members are pivotally connected to the casing and located at opposite sides of the base. The thermal expansion member is disposed in the casing and located over the base. The thermal expansion member is capable of expanding by heat so as to push the two clamping members to rotate with respect to each other.

Abstract: A clamping tool for rework process includes a casing, two clamping members and a thermal expansion member. The casing has a base. The two clamping members are pivotally connected to the casing and located at opposite sides of the base. The thermal expansion member is disposed in the casing and located over the base. The thermal expansion member is capable of expanding by heat so as to push the two clamping members to rotate with respect to each other.

Abstract: A method of providing a mould with a conformal cooling passage includes rough machining a mould cavity generally corresponding to a moulded part shape using CAD data. Conformal cooling slots are cut in the mould cavity using the CAD data. The conformal cooling slots are welded shut using the CAD data to provide conformal cooling passages. A class A surface is machined over the conformal cooling passage and corresponds to a finished mould part shape using the CAD data.

Abstract: An apparatus for presoldering electrical components can include a die device having a punch member for punching a solder preform from a sheet of solder, and pressing the solder preform against an electrical component. A heating device can press against the electrical component on a opposite side from the die device for sandwiching the electrical component between the punch member and the heating member, for heating the electrical component and melting the solder preform thereon.

Abstract: A process and system for continuously removing an external weld bead from a moving pipe or tube that has been formed with a longitudinal weld seam extending along a longitudinal axis of the pipe or tube. An at least partially closed ribbon chamber receives scarfed ribbon on one end of the chamber, and a chopping device located adjacent the other end of the chamber chops the ribbon into pieces, before the ribbon pieces can jam or disrupt the continuous system flow.

Abstract: A method of controlling a bump printing apparatus includes securing a board having air holes therein to a printing table by vacuum suction using suction nozzles; bringing a mask into close contact with the board; printing solder bumps by compressing and moving a solder paste across an upper surface of the mask using a squeegee; spraying air through spray nozzles to separate the mask from the board; and terminating air spraying using the spray nozzles and terminating air suction using the suction nozzles to remove the board.

Abstract: Disclosed herein is a strip joining apparatus for pipe mill equipment. The strip joining apparatus cuts a trailing end of a preceding steel strip and a leading end of a following steel strip, and puts the cut surfaces of the two steel strips into contact with each other, and then welds them to each other. Particularly, a cutting blade of a first cutting unit and a cutting blade of a second cutting unit are inclined in the downward direction at predetermined angles relative to each other. Thus, the ends of the two steel strips, which are respectively cut by the cutting blades, define a ‘V’-shape groove. In this state, the cut ends of the two steel strips are put in close contact with each other and are welded to each other, so that the quality of welding of the junction between the thick strips can be enhanced.

Abstract: There is provided a bump printing apparatus and a method of controlling the same that can increase the printability of solder bumps being printed on a board. The bump printing apparatus may include a printing table onto which a board is mounted; a mask making close contact with the board and printing solder bumps on the board by separating the mask from the board after a printing operation; and air nozzles provided within the printing table and providing air suction to bring the board into close contact with the printing table and spraying air to separate the mask from the board.

Abstract: A process for operating a stringer (10) for connecting solar cells in series by solder ribbon cut-offs cut from continuous solder ribbon strip, includes monitoring depletion of the momentarily-employed continuous solder ribbon strip (13a) by a monitoring unit (16) detecting when the end (17) of this strip (13a) approaches, entering a new roll (2) with a new continuous solder ribbon strip (13b), connecting the end (17) of the momentarily-employed strip (13a) to this new strip (13b) thereby forming a composite continuous solder ribbon strip that includes a connection, moving this composite strip to a cutting station (14), cutting this composite strip into solder ribbon cut-offs in cutting station (14), and removing the ribbon cut-off that includes this connection. Also, stringer apparatus for performing such process.

Abstract: In some examples, an electrode plate K is conveyed to a gap 230 of a pair of stacking drums 210 and 220 with a conveying section 100. In synchronization with conveyance of the electrode plate K, the drums 210 and 220 feed a pair of separators S each formed into a predetermined shape with the separators S adhering to corresponding peripheral surfaces of the pair of drums 210 and 220. While feeding the electrode plate K forward in a generally horizontal manner, the separators S are sequentially stacked on both surfaces of the electrode plate K in synchronized with rotations of the drums 210 and 220, and both edge portions of the separators S are welded.

Abstract: A welded component comprising two sheet metal components (51, 53) joined by at least one weld seam (55). A first sheet metal component (51) is disk-shaped and a second sheet metal component (53) is pot-shaped, and at least one of the two sheet metal components (51, 53) has a sheet thickness (s). One (51) of the two sheet metal components (51, 53) has a larger sheet thickness (S>s) in an area of the at least one weld seam (55).

Abstract: A cutting blade for a wire bonding system is provided. The cutting blade comprises a body portion having an end portion. The end portion includes a blade tip configured to penetrate into a conductive material The end portion further includes a stepped portion proximate the blade tip that is configured to limit penetration of the blade tip during use thereof.

Abstract: An external weld bead is removed and processed from a welded pipe traveling in a downstream direction. The weld bead is separated from the pipe, allowed to flow in a downstream direction, and is guided downstream and cut into chips at a location downstream of where the weld bead is separated from the pipe. Also disclosed is weld bead cutting tool including a cutting edge at an upstream end of the tool, a guide feature disposed downstream of the cutting edge and extending toward a downstream end of the tool, wherein the guide feature widens from the upstream end toward the downstream end.

Abstract: Apparatus and methods for removing components soldered to a printed circuit board (PCB). Embodiments presented generally include a contact plate having a component specific platform offset from the contact plate body. The offset platform may be substantially identical in size and shape as the component to be removed. Accordingly, contact between a heated platform and component may allow for conductive heating to occur based on contact with the component. Thus, forced air or convective heating of the component does not occur such that solder joint defects in adjacent components may be prevented. A vacuum retention port may be provided at an interface of the platform and component when in contact. The vacuum retention port may allow the freed component to be removed from the PCB using vacuum to hold the freed component to the platform. Also, apparatus for automation of a process according to the forgoing are presented.

Abstract: A mobile manufacturing platform is provided. The mobile manufacturing platform has a base, a cutting platform, and a welding platform. Additionally the mobile manufacturing platform has a rail system capable of moving the stock material in X, Y, Z coordinates around the platform. Stock material can be manufactured into a final desired piece at a building site by being cut on the cutting platform and then welded on the welding platform. A finishing station for painting and other finishing may also be added. The mobile manufacturing platform can be moved from building site to building site or wherever on-site manufacturing is preferred.

Abstract: A modified ultrasonic bonding machine and process uses a sharpened bonding wedge to perform cutting of short material. The sharpened wedge is controlled by the same position control device control used to position the bonding wedge for bonding. The software is modified to permit selection of bonding or cutting, and the bonding wedge is replaced with a cutting wedge. The modified ultrasonic bonding machine allows the operator to use the automated system of the machine to do the cutting, and the precision gained ensures that no damage to the parts is caused by the cutting process.

Abstract: A three-dimensional interconnect includes a first substrate bonded to a second substrate, the first substrate including a device layer and a bulk semiconductor layer, a metal pad disposed on the second substrate, an electrically insulating layer disposed between the first and second substrates. The structure has a via-hole extending through the device layer, the bulk semi-conductor layer and the electrically insulating layer to the metal pad on the second substrate. The structure has a dielectric coating on a sidewall of the via-hole, and a plasma-treated region of the metal pad disposed on the second substrate. The structure includes a via metal monolithically extending from the plasma-treated region of the metal pad through the via-hole and electrically interconnecting the device layer of the first substrate to the metal pad of the second substrate.

Abstract: A cutting blade for a wire bonding system is provided. The cutting blade comprises a body portion having an end portion. The end portion includes a blade tip configured to penetrate into a conductive material The end portion further includes a stepped portion proximate the blade tip that is configured to limit penetration of the blade tip during use thereof.

Abstract: A wire bonding structure is provided which includes a wire having a first bonding portion and a second bonding portion. The first bonding portion is bonded to an electrode pad of a semiconductor element, whereas the second bonding portion is bonded to a pad portion of a lead. The first bonding portion includes a front bond portion, a rear bond portion, and an intermediate portion sandwiched between these two bond portions. The front bond portion and the rear bond portion are bonded to the electrode pad more strongly than the intermediate portion is. In the longitudinal direction of the wire, the second bonding portion is smaller than the first bonding portion in bonding length.

Abstract: A welding apparatus includes a table on which first, second and third blanks are to be fixed, a first positioning station where the first and second blanks are fixed on the table, a first welding station where the first and second blanks are welded together at their abutting surfaces, a cutting station where the abutting surface of the first or second blank or both is cut into a predetermined shape, a second positioning station where the third blank is fixed on the table, and a second welding station where the third blank and the first or second blank or the first and second blanks are welded together at their abutting surfaces.

Abstract: A repair apparatus is provided which is configured to melt a solder section of an electronic component to remove the electronic component from a printed wiring board. The repair apparatus includes a light source configured to irradiate light, and a heat-transfer cap including a light-receiving section and a heat-transfer section. The heat-transfer section is configured to contact the electronic component, and transfer a heat generated from the light in the light-receiving section to the electronic component.

Abstract: An external weld bead is removed and processed from a welded pipe traveling in a downstream direction. The weld bead is separated from the pipe, allowed to flow in a downstream direction, and is guided downstream and cut into chips at a location downstream of where the weld bead is separated from the pipe. Also disclosed is weld bead cutting tool including a cutting edge at an upstream end of the tool, a guide feature disposed downstream of the cutting edge and extending toward a downstream end of the tool, wherein the guide feature widens from the upstream end toward the downstream end.

Abstract: An external weld bead is removed and processed from a welded pipe traveling in a downstream direction. The weld bead is separated from the pipe, allowed to flow in a downstream direction, and is guided downstream and cut into chips at a location downstream of where the weld bead is separated from the pipe.

Abstract: An endless hot rolling material shear-joining method capable of threading hot rolling materials in a finish rolling process without strip breakage by controlling joining conditions for the hot rolling materials in an endless hot rolling process for high carbon steel, and an endless hot rolling plant therefor are disclosed. The shear-joining method for endless hot rolling materials of high carbon steel includes shear-joining high carbon steel metal bars comprising, in terms of weight %, 0.30% to 1.20% C, inevitable impurities, and balance Fe, or comprising 0.15% to 1.5% C containing at least one of Cr, Ni, Mo, V, Ti, W, B, Nb, and Sb, inevitable impurities, and balance Fe, such that a joined surface of the joined metal bars is formed to be inclined in a thickness direction of the metal bars, in a hot rolling plant by a joiner adapted to join the metal bars after overlapping tail part of a leading one of the metal bar and top part of a trailing metal bar.

Abstract: An apparatus for repairing a semiconductor module including: a heating block comprising a thermal contact surface for contacting a defective semiconductor package mounted on a substrate of the semiconductor module to heat the defective semiconductor package using a conduction method and to melt a solder of the defective semiconductor package, and a vacuum adsorption line for adsorbing the defective semiconductor package and separating the defective semiconductor package from the substrate; and a heater installed in the heating block.

Abstract: The present invention relates to a method for welding at least one foil in a packaging process using a welding assembly, comprising the steps of directing the foil into the welding assembly, holding the foil in at least one holding point of the welding assembly, welding the foil in at least one welding point of the welding assembly, and where a part of the foil is accumulated between the at least one holding point and the at least one welding point prior to welding the foil in the welding point. The present invention further relates to a welding assembly employing this method.

Abstract: A friction stir welding tool having one or more tapered flats for promoting flow of weld material toward the pin terminus and one or more counter-spiraling channels or threads which for promoting flow of the weld material toward the tool shoulder.

Abstract: The invention relates to a device (100) for the connecting of strips to an endless strip with a clamping arrangement (110, 120) with a clamping device (110-r, 120-r) on the inlet side and a clamping device (110-l, 120-l) on the outlet side, a cutting arrangement (155) with an upper cutter (150) and a lower cutter (130) and with a joining arrangement, in which at least the clamping device (110-r, 120-r) on the inlet side and/or the clamping device (110-l, 120-l) on the outlet side is constructed as a premountable unit.

Abstract: A modified ultrasonic bonding machine and process uses a sharpened bonding wedge to perform cutting of short material. The sharpened wedge is controlled by the same position control device control used to position the bonding wedge for bonding. The software is modified to permit selection of bonding or cutting, and the bonding wedge is replaced with a cutting wedge. The modified ultrasonic bonding machine allows the operator to use the automated system of the machine to do the cutting, and the precision gained ensures that no damage to the parts is caused by the cutting process.

Abstract: A method and structure is disclosed for detaching a chip from a substrate that delays the delivery of shear force to the chip until the connectors attaching the chip to the substrate are soft enough that the delivery of shear force will not damage the chip's connectors. More particularly, the shear force is created by a bimetallic disk that, when heat is applied, is transformed into shearing force. The shearing force is delayed by a delaying device until the connectors connecting the chip to the substrate are soft enough that the application of shear force will separate the chip from the substrate without damaging the chip's connectors. The delaying device includes a physical gap that may be adjusted to control when the shear force is applied to the chip.

Abstract: A method and apparatus for bonding integrated circuits uniquely suited to high volume tag production is described, where conductive material of a substrate at the die-attach-area is cut before an IC chip or transponder is placed on the conductive material over the cut and bonded. The apparatus performs the method of placing a first chip on a substrate having a conductive layer, measuring the location of the first chip on the substrate, cutting the conductive layer at a location of an expected subsequently placed chip to form a cut based on the measured location of the first chip, and placing the subsequently placed chip on the substrate over the cut.

Abstract: A substrate manufacturing apparatus manufactures a ball-mounted substrate and has a ball mounting apparatus which includes a ball vacuum chucking apparatus including a vacuum chucking head that carries out a vacuum chucking process to chuck balls at edges of inlets formed in a vacuum chucking surface and which mounts the balls vacuum-chucked by the vacuum chucking head on a substrate, the ball vacuum chucking apparatus further including: a holding vessel that holds the balls; and a vacuum chucking/holding unit that vacuum chucks and holds the balls held in the holding vessel on a front end thereof, and carrying out a supplying process that brings the vacuum chucking/holding unit that holds the balls on the front end thereof and the vacuum chucking surface of the vacuum chucking head relatively close to supply the balls to the vacuum chucking head while air is being drawn through the inlets.