Abstract: A device to determine a state of an ultrasound welding process, which can be carried out using an ultrasound tool, includes a sensor element and an evaluation unit. The sensor element is configured to detect an electrical control signal from an ultrasound tool. The evaluation unit is configured to determine a signal property of the control signal and to determine the status of the ultrasound welding process based on a reference signal profile and on the determined signal property. An assembly with an ultrasound welding system and a method are also included.

Abstract: A mounting device of the present disclosure is used in a mounting system including multiple mounting devices that perform a mounting process on a mounting target. The mounting device includes a mounting section configured to pick up a component from a supply section holding the component and perform the mounting process for the component on the mounting target, an inspection section configured to perform an inspection process on the component disposed on the mounting target by using reference information, and a control section configured to, when the reference information is updated after an error in the component subjected to a mounting process prior to the mounting device is detected, cause the inspection section to execute the inspection process using the updated reference information on the component subjected to the mounting process prior to the mounting device.

Abstract: Micro solder joint and stencil design. In one embodiment, a stencil for depositing solder on a printed circuit board (PCB) includes a plurality of stencil apertures, a first stencil aperture of the plurality of apertures having an aperture wall defining an aperture perimeter. The aperture wall is configured to not extend beyond an outer edge of a PCB pad provided on the printed circuit board, the aperture wall is also configured to not extend beyond an outer edge of a terminal of a surface mount component, and the first stencil aperture is configured to receive solder paste to form a non-convex solder joint between the PCB pad and the terminal.

Abstract: A sucker rod cleaning system includes an inductive heating device, a feed mechanism, a first support and a second support. An electromagnet of inductive heating device includes a wire coil head that is configured to inductively heat a sucker rod positioned within a heating zone. The feed mechanism is configured to feed a sucker rod through the heating zone in a feed direction. The first support is positioned on an upstream side of the wire coil head, and is configured to support a portion of a sucker rod as it is fed through the heating zone by the teed mechanism. The second support is positioned on a downstream side of the wire coil head, and is configured to support a portion of a sucker rod as it is fed through the heating zone by the feed mechanism.

Abstract: A jig for manufacturing a semiconductor package includes a bottom piece and an upper piece. The bottom piece includes a base, a support plate, and at least one elastic connector. The support plate is located in a central region of the base. The at least one elastic connector is interposed between the support plate and the base. The upper piece includes a cap and outer flanges. The cap overlays the support plate when the upper piece is disposed on the bottom piece. The outer flanges are disposed at edges of the cap, connected with the cap. The outer flanges contact the base of the bottom piece when the upper piece is disposed on the bottom piece. The cap includes an opening which is a through hole. When the upper piece is disposed on the bottom piece, a vertical projection of the opening falls entirely on the support plate.

Abstract: A method for forming a connection between two connection partners includes: forming a pre-connection layer on a first surface of a first connection partner, the pre-connection layer including a certain amount of liquid; performing a pre-connection process, thereby removing liquid from the pre-connection layer; performing photometric measurements while performing the pre-connection process, wherein performing the photometric measurements includes determining at least one photometric parameter of the pre-connection layer, wherein the at least one photometric parameter changes depending on the fluid content of the pre-connection layer; and constantly evaluating the at least one photometric parameter, wherein the pre-connection process is terminated when the at least one photometric parameter is detected to be within a desired range.

Abstract: A wafer supporting mechanism and a method for wafer dicing are provided. The wafer supporting mechanism includes a base portion and a support portion. The base portion includes a first gas channel and a first outlet connected to the first gas channel. The support portion is connected to the base portion and including a second gas channel connected to the first gas channel. An accommodation space is defined by the base portion and the support portion.

Abstract: A method of adjusting a clamping of a semiconductor element against a support structure on a wire bonding machine is provided. The method includes: (a) detecting an indicia of floating of the semiconductor element with respect to the support structure at a plurality of locations of the semiconductor element; and (b) adjusting the clamping of the semiconductor element against the support structure based on the results of step (a).

Abstract: A method of determining a bonding status between wire and at least one bonding location of a semiconductor device is provided. The method includes the steps of: (a) bonding a portion of wire to at least one bonding location of a semiconductor device using a bonding tool of a wire bonding machine; and (b) detecting whether another portion of wire engaged with the bonding tool, and separate from the portion of wire, contacts the portion of wire in a predetermined height range, thereby determining if the portion of wire is bonded to the at least one bonding location.

Abstract: A soldering apparatus includes transfer rails as a first transfer means for transferring a printed circuit board, transfer rails as a second transfer means provided in parallel to a transfer direction of the printed circuit board to be transferred by the transfer rails, a muffle as a first reflow furnace main body for heating the printed circuit board transferred by the transfer rails, a muffle as a second reflow furnace main body for heating a printed circuit board transferred by the transfer rails, and a main frame as a frame for housing the muffle and the muffle. The main frame includes an opening/closing part as a first opening/closing means for opening/closing the muffle, and an opening/closing part as a second opening/closing means for opening/closing the muffle.

Abstract: Provided are a jet solder level confirmation jig and a method of handling the same, which allow the level of the jet wave of the molten solder to be accurately confirmed. A jet solder level confirmation jig is provided with a level confirmation unit for confirming a level of a jet wave of molten solder, a holding unit that holds the level confirmation unit, a notifying unit that notifies the level of the jet wave of the molten solder; and a bridge member having a length so as to be able to form a bridge in an upper part of a jet solder bath housed within a housing, the bridge member supporting the level confirmation unit in the upper part of the jet solder bath. The notifying unit is connected to a power supply unit of a jet soldering device.

Abstract: An electronic component mounter where information indicating completion of component mounting is memorized each time a component is mounted on circuit board by suction nozzle. Then, in a case in which mounting work is interrupted by a stoppage of the electronic component mounter and then restarted, the mounting position of the electronic component is imaged by mark camera according to information memorized immediately before the mounting work was interrupted. Also, with the electronic component mounter, in a case in which mounting work is interrupted by a stoppage of the mounter and then restarted, the mark camera is moved along a path over which the suction nozzle moved until the position of the suction nozzle when mounting work was interrupted. Here, imaging of the circuit board is performed by the mark camera.

Abstract: There is provided a diagnosis device of a joint of sheet metal, including: a detector that irradiates an ultrasonic wave to a diagnosis object including a first medium and a second medium having a joint, and senses a reflection signal reflected from the joint and a reflection signal reflected from the joint and thereafter, reflected toward the joint on an inner surface of the first medium; a delay material positioned between the detector and the diagnosis object to delay the reflection signal; and a diagnoser that calculates and displays a signal ratio by receiving the reflection signals sensed by the detector.

Abstract: A welding torch detector including an imaging unit capturing images of a welding torch and welding wire from a plurality of directions to acquire image signals, an image recognition unit recognizing welding wire images and welding torch images based on the image signals acquired, a setting unit setting a target point corresponding to a target position of the welding wire on the welding wire images recognized, a position detection unit detecting a position of the target point in a three-dimensional space based on the welding wire images recognized, and an inclination detection unit detecting an inclination of the welding torch in the three-dimensional space based on the welding torch images recognized.

Abstract: In a die mounting system in which a die supply device is set on a component mounter and dies supplied from a die supply device are mounted on a circuit board by a mounting head of the component mounter, the position of a die is recognized by processing an image of the die on a dicing sheet captured by a camera, a supply head is moved to a die pickup position by a supply head moving mechanism, the die is picked up, the supply head is vertically inverted and moved to a die transfer position, and the die held by the supply head is picked up by a mounting head of the component mounter at a component transfer position and mounted on the circuit board. The die transfer position is set at a position such that die transfer and die imaging are able to be performed in parallel.

Abstract: A method includes receiving, during a vibration welding process, a set of sensory signals from a collection of sensors positioned with respect to a work piece during formation of a weld on or within the work piece. The method also includes receiving control signals from a welding controller during the process, with the control signals causing the welding horn to vibrate at a calibrated frequency, and processing the received sensory and control signals using a host machine. Additionally, the method includes displaying a predicted weld quality status on a surface of the work piece using a status projector. The method may include identifying and display a quality status of a suspect weld. The laser projector may project a laser beam directly onto or immediately adjacent to the suspect welds, e.g., as a red, green, blue laser or a gas laser having a switched color filter.

Abstract: A wave solder machine includes a pre-heating station, a wave soldering station, and a conveyor to transport substrates through a tunnel passing through the pre-heating station and the wave soldering station. The tunnel has a substantially oxygen-free environment. The pre-heating station includes a pre-heater including a support frame assembly, and a heater assembly supported by the support frame assembly. The heater assembly is slidably coupled to the support frame assembly between an operational position and a non-operational position. The pre-heater further includes a seal disposed between the heater assembly and the support frame assembly. The seal provides a gas-tight seal when the heater assembly is in the operational position to prevent atmosphere from entering the tunnel thereby preserving the substantially oxygen-free environment within the tunnel.

Abstract: A screen printing apparatus is described. The apparatus has a plurality of radial arms each having a printing head associated therewith. A target area is in alignment with at least one of the printing heads wherein a design is applied to a target article at the target area by the printing head. A means for providing relative movement between the target area and the printing head provides multiple passes between a squeegee associated with the printing head and the target area. A means for providing a pressure between the squeegee and the target area is regulated such that a first pressure between the squeegee and the target area on a first stroke is not equal to a second pressure between the squeegee and the target area on a subsequent second stroke.

Abstract: An automatic tin-adding machine for adding a plurality of tin rods to a molten tin tank comprises a base, two transmission shafts, at least one first flexible transmission member, a plurality of tin rod carrying members, a tin stock detector, a drive and a circuit control system. The base has a tin rod adding opening corresponding to the molten tin tank. The two transmission shafts are pivoted on the base side by side. The at least one first flexible transmission member is sleeved on the two transmission shafts. The tin rod carrying members are fixed to the first flexible transmission member and configured to carry the tin rods. The tin stock detector is configured to detect the stock of tin liquid in the molten tin tank. The drive is connected to one of the transmission shafts. The circuit control system comprises a circuit control unit.

Abstract: A printing apparatus includes: a mask formed with a pattern hole for printing; a printing mechanism having a squeegee that comes into contact with a front surface of the mask at a predetermined contact angle, the printing mechanism causing the squeegee to slide on the front surface of the mask with a predetermined printing pressure to move a solder on the front surface of the mask while scraping the solder by the squeegee, thereby printing the solder to a substrate via the pattern hole; a detection device executing detection operation for detecting a physical quantity that changes in accordance with an amount of solder on the front surface of the mask; and a control device adjusting at least one of the contact angle and the printing pressure of the squeegee on the basis of the physical quantity detected by the detection device.

Abstract: According to an embodiment, a welding target position measuring device comprises: a groove wall welding part detection means for detecting a groove wall welding part based on a result of the calculation performed by a groove shape change amount calculation means; a weld bead end detection means for detecting a weld bead end based on a result of the calculation performed by a groove shape difference amount calculation means; and a welding target position selection means for obtaining a welding pass number of a subsequent pass in a welding information stored in a welding information recording means and selecting a welding target position of the subsequent pass which differs depending on welding positions based on results of the detection of the groove wall welding part and the weld bead end.

Abstract: A tool driving section of a friction stir spot welding device is configured to cause each of a pin member and a shoulder member to advance and retract, and is controlled by a tool driving control section. A press-fit reference point setting section sets a position where the pin member or the shoulder member contacts an object to be welded as a press-fit reference point, and the tool driving control section controls the position of the pin member with respect to the shoulder member on the basis of the press-fit reference point, thereby controlling the press-fit depth of a rotating tool press-fitted from the surface of the object to be welded. This achieves the excellent welding quality at suitable precision according to welding conditions especially in a double-acting friction stir spot welding method.

Abstract: A stencil printer for printing viscous material on an electronic substrate includes a stencil having apertures formed therein, and a print head positioned over the stencil and configured to deposit viscous material within the apertures of the stencil. The print head includes a housing defining an elongate chamber, a source port defining a passage having an inlet positioned to allow viscous material to flow into the elongate chamber, a pair of blades defining a slot that provides an outlet from which viscous material can flow out of the elongate chamber, an elongate plunger movable in the elongate chamber to reduce a volume of viscous material within the elongate chamber, and at least one sensor to detect pressure of the viscous material within the elongate chamber.

Abstract: A beam includes at least three web plates that are connected to a bottom flange and top flange.

Abstract: A chip mounting apparatus includes a loading unit, a combining unit and a bonding unit. The loading unit loads a circuit board having contact pads and semiconductor chips having solder balls into the chip mounting apparatus. The combining unit positions the semiconductor chip onto a respective mounting area of the circuit board and combines the solder balls of the semiconductor chip with the contact pads of the circuit board by using flux. The combining unit has a flux coater for coating the solder balls with the flux and a flux controller for automatically supplementing the flux to the flux coater. The bonding unit bonds the solder balls to the respective contact pads by a reflow process.

Abstract: A reflow soldering system wherein a heating oven is provided with a contact heating unit which has a transport rail and a top heat transfer heater, and with a hot gas blowing heating unit, the transport rail and top heat transfer heater are respectively provided with heaters which heat the outer edge part of the printed circuit board, and the transport rail or top heat transfer heater moves in an up-down direction so that the transport rail and top heat transfer heater clamp and heat the outer edge part of the printed circuit board.

Abstract: A method of identifying and selecting welding electrodes and welding output parameters on a welding power source is provided. The method includes identifying electrodes and/or electrode packaging with distinct colors and/or patterns which correspond to properties of the electrode. The method also may include employing distinguishable identifying markings on a power supply which correspond to the electrodes to be used to allow for easy setting of output parameters.

Abstract: A chip mounting apparatus includes a loading unit, a combining unit and a bonding unit. The loading unit loads a circuit board having contact pads and semiconductor chips having solder balls into the chip mounting apparatus. The combining unit positions the semiconductor chip onto a respective mounting area of the circuit board and combines the solder balls of the semiconductor chip with the contact pads of the circuit board by using flux. The combining unit has a flux coater for coating the solder balls with the flux and a flux controller for automatically supplementing the flux to the flux coater. The bonding unit bonds the solder balls to the respective contact pads by a reflow process.

Abstract: This disclosure describes a method and apparatus for controlling the temperature of a welding zone for welding together pipe sections. The temperature is controlled by a flow of inert gas through the pipes. The inert gas flow is cooled and acts as a heat sink to remove heat from the weld zone thereby controlling the weld zone temperature.

Abstract: A welding tractor is described as well as a process for using the tractor in which a predefined angle of inclination or declination is maintained during a circumferential welding process.

Abstract: A soldering machine includes a frame and a fixture held by the frame that supports a substrate and a cable. A guidance system is supported by the frame with a camera viewing the fixture that is movable relative to the fixture. A positioning system is supported by the frame. The positioning system has a camera positioner and a soldering mechanism positioner. A soldering mechanism is coupled to the soldering mechanism positioner and is moved by the soldering mechanism positioner relative to the fixture. The soldering mechanism solders wires to the substrate. A controller communicates with the positioning system and the guidance system to operates the positing system to control positions of the camera and soldering mechanism relative to the fixture based on an image obtained by the camera.

Abstract: A flux dipping apparatus includes a flux plate having a top surface; and a dipping cavity in the flux plate and recessed from the top surface. A flux leveler is disposed over the flux plate and configured to move parallel to the top surface. A piezoelectric actuator is configured to adjust a distance between the flux leveler and the top surface in response to a controlling voltage applied to electrodes of the first piezoelectric actuator.

Abstract: A beam includes at least three web plates that are connected to a bottom flange and top flange.

Abstract: Disclosed herein is a solder bump forming apparatus performing a soldering process on a substrate, the solder bump forming apparatus including: a solder bath receiving a solder therein; an agitator agitating the solder in the solder bath; a driver driving the agitator; and a suction pressure provider providing suction pressure to the substrate.

Abstract: To provide a bonding apparatus capable of bonding at a high speed without performing a height measurement of a bonding point before a searching operation and the bonding. A confocal optical system mounted on a bonding arm pivotable upward and downward and configured to perform detection of a focus of a bonding point located on a surface of a bonded part, a bonding tool configured to be movable integrally with the bonding arm and perform bonding, and position detecting means configured to detect the position of the bonding tool, wherein the bonding tool is configured to move downward by a predetermined distance from a position of the bonding tool detected by the position detecting means by focus detection by the confocal optical system to a preset bonding point (amount of downward movement from a focus) during the downward movement of the bonding tool to the bonding point and stop on the bonding point.

Abstract: Actuator elements are accommodated in openings formed in a conductive plate. These actuator elements are secured to the conductive plate by a resin bonding material. An electrode of each actuator element and the conductive plate are electrically connected to each other by a bridge junction consisting of an conductive paste. A paste application device discharges the conductive paste toward the bridge junction by air. A control unit configured to control the discharge of the conductive paste sets the air pressure according to the elapsed time of use of the conductive paste so that the height of the paste above the resin bonding material is not less than a target height. The target height is maintained by increasing the air pressure with increase of the elapsed time of use of the conductive paste.

Abstract: A device and a method for the positionally accurate arrangement of two material ends located opposite each other. The device includes two carriers with always one fixing device for each material end, wherein at least one of the two carriers is slidably guided relative to the second of the carriers, and at least the first carrier has a first adjusting member and a second adjusting member connected to the first adjusting member, wherein the adjusting members form a drive by means of which the first carrier is slidable against the second carrier.

Abstract: Disclosed is an apparatus for determining an alignment of a bondhead of a die bonder relative to a workchuck. Specifically, the apparatus comprises: i) a sensor configured to measure a distance between the bondhead and the sensor; and ii) a positioning device coupled to the sensor, the positioning device being configured to position the sensor relative to a plurality of locations on the bondhead facing the sensor. In particular, the sensor is operative to measure a set of distances between each of the plurality of locations on the bondhead and the sensor, the set of distances being for determining the alignment of the bondhead. A method of determining an alignment of a bondhead of a die bonder relative to a workchuck is also disclosed.

Abstract: A method by which the amount of nickel contained in an alloy having a composition represented by Sn—X—Ni can be regulated. The method of nickel concentration regulation comprises adding phosphorus to Sn—X—Ni in a molten state (wherein X is one or more elements selected from the group consisting of Ag, Zn, Cu, Bi, Au, Ti, Ge, Ga, Si, and Ce), holding the mixture at 250-400° C., and removing the resultant dross floating on the surface of the liquid phase and containing a P—Ni compound and a P—Sn—Ni compound. An example of X is copper, and the content thereof may be 0.3-5 wt %. The phosphorus may be added in the state of a Sn—P alloy. The upper limit of the amount of the phosphorus to be added may be about half the nickel amount in terms of atomic amount.

Abstract: A reflow method of a solder ball provided to a treatment object may include providing a coil, applying a current to the coil, and moving the treatment object through an internal space surrounded by the coil.

Abstract: An electric soldering iron includes a soldering iron head, a sensor, a control unit, an air suction fan, a filtering unit, and an output unit. The control unit is connected to the sensor, the air suction fan, the filtering unit, and the output unit. The air suction fan is connected to the output unit through the filtering unit. The soldering iron head can be used to melt rosin and solder. When the sensor detects there is smoke near the soldering iron head, the sensor outputs a signal to the control unit. The control unit controls the air suction fan, the filtering unit, and the output unit to operate according to the signal. The air suction fan draws the smoke in and outputs the smoke to the filtering unit. The filtering unit filters harmful ingredients from the smoke. The output unit outputs the filtered smoke.

Abstract: A method of brazing an assembly (202) having at least two aluminum workpieces coupled at a joint includes applying a flame to the joint of the aluminum workpieces; monitoring the flame color; and upon detecting a change in the flame color, maintaining a temperature at the joint.

Abstract: A brazing system has a first gas source, a second gas source, a first enclosure, a second enclosure, a brazing torch, and a control system configured to control a ratio of the first gas source and the second gas source.

Abstract: A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board while the hot melt joining material is in a molten state.

Abstract: A vibration welding system includes a controller, welding horn, an active material element, and anvil assembly. The assembly may include an anvil body connected to a back plate and support member. The element, e.g., a piezoelectric stack or shape memory alloy, is positioned with respect to the assembly. The horn vibrates in a desirable first direction to form a weld on a work piece. The element controls any vibrations in a second direction by applying calibrated response to the anvil body in the second direction. A method for controlling undesirable vibrations in the system includes positioning the element with respect to the anvil assembly, connecting the anvil body to the support member through the back plate, vibrating the horn in a desirable first direction, and transmitting an input signal to the element to control vibration in an undesirable second direction.

Abstract: An apparatus for aligning a bonding tool of a die bonder with respect to a bond stage is disclosed. The apparatus comprises: a connecting member to which the bonding tool is coupleable such that the connecting member is located between the bonding tool and a main body of a die bonder; and a plurality of actuators engaged to the connecting member. In particular, the plurality of actuators are actuable to rotate the connecting member and the bonding tool relative to the main body of the die bonder about a plurality of axes, to align the bonding tool with respect to the bond stage.

Abstract: A linear friction welding system and method in one embodiment includes a first motor configured to rotate a first power shaft, a second motor configured to rotate a second power shaft, a memory including program instructions, and a controller operably connected to the first motor, the second motor, and the memory, and configured to execute the program instructions to identify a first current oscillation amplitude of a ram operably connected to the first power shaft and the second power shaft, determine a second desired oscillation amplitude for the ram, determine a minimum shift in relative angle between the first motor and the second motor to achieve the second desired oscillation amplitude, allocate the minimum shift in relative angle between the first motor and the second motor, and control the first motor and the second motor based upon the allocated minimum shift in relative angle.

Abstract: A novel inert environment enclosure includes an object inlet where production objects enter the enclosure and an object outlet where the production objects exit. At least one of the object inlet and the object outlet includes both a top-side flow obstructer and a bottom-side flow obstructer for preventing air from entering the enclosure. In a particular embodiment, the top-side flow obstructer and the bottom-side flow obstructer each include a curtain constructed from a flexible fabric having a plurality of individual adjacent fingers. In another particular embodiment, the inert environment enclosure is a nitrogen hood that houses a wave soldering machine. A inert gas nozzle is mounted at or near the inlet and/or the outlet. The inert environment enclosure maintains a positive pressure with respect to the surrounding environment when production objects are passed through the enclosure.

Abstract: A method for quantitatively determining flux material residues remaining on a heat exchanger after a preceding soldering process is provided. To this end, a fluid is applied to the heat exchanger, wherein the remaining quantity of flux material on the heat exchanger after the preceding soldering process is derived from the concentration of soldering agent in the fluid.

Abstract: A soldering device and method of soldering are disclosed. The device may include at least one soldering pallet assembly. The pallet assembly may be subjected to a first atmosphere configured within the soldering pallet assembly and a second atmosphere configured external to the pallet assembly, the second atmosphere is an ambient atmosphere. At least one solder element may be positioned within the first atmosphere, and the solder element may be configured to attach an electrical component to an integrated circuit chip that is positioned within the pallet assembly.