Abstract: Ternary tungsten boride nitride (WBN) thin films and related methods of formation are provided. The films are have excellent thermal stability, tunable resistivity and good adhesion to oxides. Methods of forming the films can involve thermal atomic layer deposition (ALD) processes in which boron-containing, nitrogen-containing and tungsten-containing reactants are sequentially pulsed into a reaction chamber to deposit the WBN films. In some embodiments, the processes include multiple cycles of boron-containing, nitrogen-containing and tungsten-containing reactant pulses, with each cycle including multiple boron-containing pulses.

Abstract: The present invention provides a novel method for preventing or reducing color degradation or color change of a substrate over time, and is characterized by arranging at least one positively-charged substance selected from the group consisting of (1) a positive ion; (2) a conductor or dielectric having a positive charge; and (3) a composite formed from a conductor and a dielectric or a semiconductor, on a surface of a substrate, and arranging an insulating organic or inorganic substance on the aforementioned positively-charged substance.

Abstract: A novel method of fabrication of periodic dielectric composites involving a flexible computer design stage, rapid growth of a second dielectric component. Laser stereolithography is used to form the polymer material layer by layer by photopolymerisation of a liquid. Certain materials constructed in this fashion exhibit a complete loss-free barrier to microwave propagation through the material for a desired band of frequencies and are commonly known as photonic band gap crystals. Such materials could provide a novel medium for all-angle wide- and narrow-band blocking filters, narrow-band transmission filters, reflective and loss-free substrates for planar antennas, and novel loss-free media for oscillator cavities and waveguides. In addition a novel crystal structure, particularly suited to the fabrication method mentioned above and consisting of concatenated polyhedrons, is revealed.

Abstract: When the entire amount of conductive metal mixed powder made of copper, manganese, and germanium is 100 parts by weight, the metal mixed powder is formed by mixing 4.0 to 13.0 parts manganese by weight, 0.2 to 1.4 parts germanium by weight, and 85.6 to 95.8 parts copper by weight, and 0 to 10 parts glass powder by weight and 0 to 10 parts copper-oxide powder by weight are mixed relative to the entire amount (100 parts by weight) of these metal components. The obtained resistive paste is then baked, and the resistive composition having the low resistance value and low TCR may be obtained. In addition, a resistor is made by forming the resistive element upon a substrate.